JP3940659B2 - Multilayer circuit board manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer circuit board used for semiconductor devices, composite electronic components, and the like.
[0002]
[Prior art]
Multilayer circuit boards are widely used in semiconductor devices and composite electronic devices.
As such a conventional multilayer circuit board, for example, as shown in FIG. 3, a circuit pattern (not shown) is formed inside a rectangular laminate 51 formed by laminating a plurality of dielectric layers, and a rectangular laminate There is known a structure in which a predetermined recess 52 is formed in the center of the upper surface of the body 51 and an electronic component element 53 is mounted in the recess 52 or on the upper surface of the rectangular laminate 51.
[0003]
The recess 52 accommodates a relatively thick electronic component element 53, thereby preventing the entire multilayer circuit board from becoming thick.
[0004]
The conventional multilayer circuit board described above is manufactured by the following manufacturing method.
That is, first, a large laminate having a plurality of substrate regions corresponding to the rectangular laminate 51 is formed by a conventionally known ceramic green sheet laminating method, and each substrate region is formed in each substrate region of the large laminate. A plurality of rectangular laminates by forming a predetermined recess 52 at the center of the substrate, then firing the large laminate integrally, and then cutting the large laminate along the boundary between adjacent substrate regions. 51, and finally, an electronic component element 53 is mounted in the concave portion 52 or the upper surface of the obtained rectangular laminate 51 to complete a multilayer circuit board as a product (see, for example, Patent Document 1). .
[0005]
In such a conventional manufacturing method, the circuit pattern provided in the rectangular laminated body 51 has a conductive paste printed on the main surface of each ceramic green sheet in a predetermined pattern before the ceramic green sheets are laminated. The recess 52 is formed by punching out the ceramic green sheet located in the uppermost layer of the ceramic green sheets to be laminated or in the vicinity thereof with a punch die or the like to form through holes.
[0006]
[Patent Document 1]
JP 2001-217334 A (FIGS. 2 to 5)
[0007]
[Problems to be solved by the invention]
However, according to the above-described conventional manufacturing method, a plurality of rectangular laminates are obtained from one large laminate, and the same number of times as the number of substrate regions is formed to form the recesses 52 in each substrate region. Only need to punch the ceramic green sheet. For this reason, the perforating process of the ceramic green sheet takes a long time, and there is a disadvantage that it is impossible to improve productivity.
[0008]
Therefore, in order to eliminate the inconvenience described above, a plurality of through-holes corresponding to the recesses 52 are formed in a lump by simultaneously punching out ceramic green sheets used for forming a large laminate with a plurality of punch dies. It is possible to do.
[0009]
However, when a ceramic green sheet is simultaneously punched with a plurality of punch dies, it is necessary to arrange punch dies having sizes corresponding to the individual recesses in accordance with the pitches of the recesses. Therefore, if the area of each substrate region is reduced in order to reduce the size of the multilayer circuit board, individual punch dies must be formed finely, and these punch dies are matched to the arrangement pitch of the substrate regions. It is necessary to arrange them at a high density, which causes a disadvantage that the structure of the punching device to which the punch mold is attached becomes complicated.
[0010]
The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide a method for manufacturing a multilayer circuit board capable of efficiently manufacturing the multilayer circuit board with simple manufacturing equipment.
[0011]
[Means for Solving the Problems]
In the method for manufacturing a multilayer circuit board according to the present invention, a circuit pattern is formed inside a rectangular laminate formed by laminating a plurality of dielectric layers, and a part of the rectangular laminate is formed on the upper surface of the rectangular laminate. A multilayer formed by forming a notch portion opened at one end face of the laminate, and mounting an electronic component element electrically connected to the circuit pattern on the surface of the dielectric layer exposed in the formation region of the notch portion In the circuit board, the rectangular laminate forms a large laminate having a plurality of substrate regions corresponding to the rectangular laminate, and the notch portion is formed in each substrate region of the large laminate. A step 1 for continuously forming the recess corresponding to the adjacent substrate regions, and a plurality of rectangular laminates by cutting the large laminate along the boundary between the adjacent substrate regions Formed through the step 2 of cutting It is characterized in.
[0012]
In the method for manufacturing a multilayer wiring board according to the present invention, the plurality of substrate regions are arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more), and the recess has four substrate regions. It is formed in the site | part which the corner | angular parts contact | connect.
[0013]
According to the present invention, a concave portion corresponding to a notch is continuously formed in each substrate region of the large laminate so as to straddle between adjacent substrate regions, and the large laminate is adjacent to the substrate region. A plurality of rectangular laminated bodies are cut out by cutting along the boundary between them. Accordingly, it becomes possible to simultaneously form the concave portions corresponding to the cutout portions in each substrate region by punching out the ceramic green sheet with a single punch die for a plurality of adjacent substrate regions. It is possible to improve the productivity of the multilayer circuit board by shortening the time required for perforating.
[0014]
Further, according to the present invention, the concave portion corresponding to the cutout portion of the multilayer circuit board is continuously formed so as to straddle between the substrate regions adjacent to each substrate region of the large-sized laminate, so that the formation of the large-sized laminate is performed. Even when a plurality of punch dies are used to punch out ceramic green sheets or the like used in the process, a single punch die is arranged for a plurality of adjacent substrate regions. In addition, it is only necessary to arrange the punch-type arrangement pitch at a wide pitch corresponding to twice the arrangement pitch of the substrate region, and the area of each substrate region is reduced in order to reduce the size of the multilayer circuit board. However, the size of the individual punch dies can be increased and the arrangement pitch can be set wide. Therefore, the structure of a manufacturing facility such as a punching device to which the punch mold is attached is maintained in a simple manner, and this can also be used to improve the productivity of the multilayer circuit board.
[0015]
Furthermore, according to the present invention, a plurality of substrate regions provided in the large laminate are arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more), and the recesses are formed by four substrate regions. By forming the corner portions in contact with each other, the concave portions corresponding to the cutout portions can be simultaneously formed in the four substrate regions with one punch mold. By adopting such a configuration, the above-described effects are obtained. Becomes more effective.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an external perspective view of a multilayer circuit board manufactured by the manufacturing method of the present invention. The multilayer circuit board shown in FIG. 1 is the interior or surface of a rectangular laminate 1 formed by laminating a plurality of dielectric layers. In addition, a predetermined circuit pattern is formed on the upper surface of the rectangular laminate 1, and a notch 2 having a part opened at one end surface of the rectangular laminate 1 is provided on the upper surface of the rectangular laminate 1. The electronic component element 3 that is electrically connected to the circuit pattern is mounted on the surface of the exposed dielectric layer.
[0017]
The thickness of each dielectric layer forming the rectangular laminate 1 is set to 20 μm to 300 μm, for example, and the material thereof is, for example, a glass-ceramic material that can be fired at a relatively low temperature of 800 ° C. to 1200 ° C. Etc. are preferably used.
Examples of the ceramic component of the glass-ceramic material include insulating ceramic materials such as cristobalite, quartz, corundum (α alumina), mullite, and cordierite, and dielectric ceramic materials such as MgTiO ₃ , CaTiO ₃ , BaTiO ₃ , and TiO _2. Magnetic ceramic materials such as Ni-Zn ferrite and Mn-Zn ferrite are used, for example, those having an average particle size of 0.5 to 6.0 μm, preferably 0.5 to 2.0 μm. The Two or more ceramic materials may be mixed and used.
On the other hand, as a glass component of the glass-ceramic material forming the dielectric layer, by performing a firing treatment, crystals or spinel of cordierite, mullite, anorthite, serdian, spinel, garnite, willemite, dolomite, petalite and substituted derivatives thereof Any glass may be used as long as it precipitates the crystalline phase of the structure. For example, B ₂ O ₃ , SiO ₂ , Al ₂ O ₃ , ZnO, glass frit containing alkaline earth oxide, etc. are used. It is done. These glass frits have a wide vitrification range, and the yield point is set to, for example, 600 to 800 ° C.
[0018]
Further, the circuit pattern provided on the surface or inside of the rectangular laminate 1 includes a conductor layer interposed between the dielectric layers, via-hole conductors embedded in the dielectric layer, and electrons on the surface of the rectangular laminate 1. The circuit pattern material is selected in consideration of the compatibility with the dielectric material forming the dielectric layer. Such a circuit pattern is formed of, for example, a conductive material mainly composed of an Ag alloy such as Ag, Ag-Pd, or Ag-Pt, or a Cu-based, W-based, Mo-based, or Pd-based conductive material. For example, it is set to 5 to 25 μm. The diameter of the via hole conductor is appropriately set according to the thickness of the dielectric layer and the like. When the thickness of the dielectric layer in which the via hole conductor is embedded is 20 μm to 300 μm, the diameter of the via hole conductor is, for example, 50 μm. It is set to ˜300 μm.
[0019]
In the present embodiment, the cutout portion 2 provided on the upper surface of the rectangular laminated body 1 is formed such that a part thereof is opened at two adjacent end faces of the rectangular laminated body 1.
A plurality of connection pads constituting a part of the circuit pattern are arranged on the surface of the dielectric layer facing the notch 2, and these connection pads are electrons arranged in the notch 2. The component element 3 is electrically connected to a terminal electrode of a chip-type electronic component such as a capacitor, an inductor, and a SAW element, or a semiconductor element via a conductive adhesive such as solder. When a SAW element or a semiconductor element is used as the electronic component element 3, the electronic component element 3 is hermetically sealed by covering the periphery with a resin material, a metal case, or the like.
[0020]
Next, a method for manufacturing the above-described rectangular laminate 1 of the multilayer circuit board will be described with reference to FIG.
(Step 1) First, a large laminate 20 having a plurality of substrate regions corresponding to the rectangular laminate 1 is prepared, and a recess 6 corresponding to the notch 2 is formed in each substrate region of the large laminate 20. Then, it is continuously formed so as to straddle between adjacent substrate regions.
In the present embodiment, the plurality of substrate regions provided in one large laminate 20 is a matrix of m columns × n rows (n and m are natural numbers of 2 or more) when the large laminate 20 is viewed in plan. The concave portions 6 are formed at portions where the corner portions of the four substrate regions are in contact with each other.
[0021]
Such a large laminate 20 is obtained by adding a suitable organic binder or the like to the ceramic raw material powder forming the dielectric layer of the rectangular laminate 1 as shown in FIGS. The ceramic green sheets 1a and 1b are stacked by a predetermined number, and before the ceramic green sheets 1a and 1b are stacked, the uppermost layer or several layers of the ceramic green sheets that are continuous downward from the uppermost layer are formed. A predetermined portion of 1a is punched out with a punch die or the like, and a through hole 4 is formed in the ceramic green sheet 1a to form a recess 6.
[0022]
In addition, the circuit pattern provided on the surface or inside of the rectangular laminate 1 may be obtained by applying a predetermined conductive paste to the surface of each ceramic green sheet 1a, 1b in advance by screen printing or the like, or ceramic green sheets 1a, 1b. Is formed by embedding a conductive paste in the interior of the large-sized laminate 20, and the main surface of the large laminate 20 is cut at the boundary 5 between the substrate regions by, for example, a cutter blade or the like, as shown in FIG. Are formed.
[0023]
In this step 1, since the concave portion 6 of the large laminate 20 is continuously formed so as to straddle between adjacent substrate regions, the ceramic green sheet is formed with one punch type for a plurality of adjacent substrate regions. By simply punching 1a, recesses 6 corresponding to the notches 2 can be simultaneously formed in each substrate region, reducing the time required for drilling the ceramic green sheet 1a and improving the productivity of the multilayer circuit board. It becomes possible.
[0024]
In addition, since the concave portion 6 is continuously formed so as to straddle between adjacent substrate regions, the ceramic green sheet 1a is simultaneously punched out with a plurality of punch dies to form the through holes 4. In addition, it is only necessary to arrange one punch die for a plurality of adjacent substrate regions, and it is sufficient to arrange the arrangement pitch of the punch dies at a wide pitch corresponding to twice the arrangement pitch of the substrate regions. Even if the area of each substrate region is reduced in order to reduce the size of the multilayer circuit board, the size of each punch die can be increased and the arrangement pitch can be set wide. Therefore, the structure of a manufacturing facility such as a punching device to which the punch mold is attached is maintained in a simple manner, and this can also be used to improve the productivity of the multilayer circuit board.
[0025]
Further, the plurality of substrate regions 5 provided in the large laminate 20 are arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more), and the recesses 6 are formed at the corners of the four substrate regions. Since the portions are formed in contact with each other, the concave portions 6 corresponding to the cutout portions 2 can be simultaneously formed in the four substrate regions 5 with one punch mold. By adopting such a configuration, The above-described effects can be exhibited more effectively.
[0026]
In this step 1, a plasticizer may be added in order to easily form the through holes 4 in the ceramic green sheet 1a.
[0027]
(Step 2) Next, the large laminate 20 obtained in the previous step 1 is fired at a high temperature, and then the large laminate 20 is moved along the boundary 5 between the substrate regions as shown in FIG. A plurality of rectangular laminates 1 are cut out by cutting.
[0028]
The large laminate 20 is cut, for example, by applying pressure from the upper and lower surfaces of the large laminate 20 and dividing the large laminate 20 starting from a groove formed at the boundary 5 between the substrate regions (so-called chocolate break). In this way, a plurality of rectangular laminates 1 are manufactured simultaneously.
[0029]
By manufacturing a multilayer circuit board through the above manufacturing processes, it becomes possible to efficiently manufacture a multilayer circuit board with simple manufacturing equipment.
[0030]
In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible in the range which does not deviate from the summary of this invention.
[0031]
For example, in the above-described embodiment, when the large laminate 20 is cut out along the substrate region 5, the grooves 6 are formed in advance on the surface of the large laminate 20, and the large laminate 20 is divided along the grooves. However, instead of this, instead of this, a plurality of rectangular laminates 1 are cut out by dicing the large laminate 20 along the boundary 5 of the substrate region. It doesn't matter.
[0032]
Moreover, in the above-mentioned embodiment, although the rectangular laminated body 1 was formed with the ceramic type material, instead of this, the rectangular laminated body 1 is made of an organic material such as an epoxy resin or an organic material and an inorganic material. You may make it form with this composite material.
[0033]
Furthermore, in the above-described embodiment, the concave portion 6 of the large laminate 20 is formed in a portion where the corners of the four substrate regions are in contact with each other, but instead, the concave portion 6 of the large laminate 20 is formed. You may make it form in the site | part which the edge | sides of two board | substrate area | regions contact | connect.
[0034]
【The invention's effect】
According to the present invention, a concave portion corresponding to a notch is continuously formed in each substrate region of the large laminate so as to straddle between adjacent substrate regions, and the large laminate is adjacent to the substrate region. A plurality of rectangular laminated bodies are cut out by cutting along the boundary between them. Accordingly, it becomes possible to simultaneously form the concave portions corresponding to the cutout portions in each substrate region by punching out the ceramic green sheet with a single punch die for a plurality of adjacent substrate regions. It is possible to improve the productivity of the multilayer circuit board by shortening the time required for perforating.
[0035]
Further, according to the present invention, the concave portion corresponding to the cutout portion of the multilayer circuit board is continuously formed so as to straddle between the substrate regions adjacent to each substrate region of the large-sized laminate, so that the formation of the large-sized laminate Even when a plurality of punch dies are used to punch out ceramic green sheets or the like used in the process, a single punch die is arranged for a plurality of adjacent substrate regions. In addition, it is only necessary to arrange the punch-type arrangement pitch at a wide pitch corresponding to twice the arrangement pitch of the substrate region, and the area of each substrate region is reduced in order to reduce the size of the multilayer circuit board. However, the size of each punch die can be increased, and the arrangement pitch can be set wide. Therefore, the structure of a manufacturing facility such as a punching device to which the punch mold is attached is maintained in a simple manner, and this can also be used to improve the productivity of the multilayer circuit board.
[0036]
Furthermore, according to the present invention, a plurality of substrate regions provided in the large laminate are arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more), and the recesses are formed by four substrate regions. By forming the corner portions in contact with each other, the concave portions corresponding to the cutout portions can be simultaneously formed in the four substrate regions with one punch mold. By adopting such a configuration, the above-described effects are obtained. Becomes more effective.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a multilayer circuit board manufactured by a manufacturing method of the present invention.
2A to 2C are external perspective views for each step for explaining a manufacturing method according to an embodiment of the present invention.
FIG. 3 is an external perspective view of a multilayer circuit board manufactured by a conventional manufacturing method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Rectangular laminated body 1a, 1b ... Ceramic green sheet 2 ... Notch part 3 ... Electronic component element 4 ... Through-hole 5 ... Boundary 6 between adjacent board | substrate regions ..Recess 10 ... multilayer circuit board 20 ... large laminate

Claims (2)

A circuit pattern is formed inside a rectangular laminate formed by laminating a plurality of dielectric layers, and a cutout portion is formed on the upper surface of the rectangular laminate, and a part of the cutout is opened at one end surface of the rectangular laminate. A multilayer circuit board on which an electronic component element electrically connected to the circuit pattern is mounted on the surface of the dielectric layer exposed in the formation region of the notch,
The method for manufacturing a multilayer wiring board, wherein the rectangular laminate is formed through the following steps 1 and 2.
Step 1: A large laminate having a plurality of substrate regions corresponding to the rectangular laminate is formed, and a concave portion corresponding to the notch is provided in each substrate region of the large laminate. The process of forming continuously so as to straddle the gap.
Step 2: a step of cutting a plurality of rectangular laminates by cutting the large laminate along a boundary between adjacent substrate regions. The plurality of substrate regions are arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more), and the recesses are formed at the portions where the corners of the four substrate regions are in contact with each other. The method of manufacturing a multilayer circuit board according to claim 1.

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