JP4303539B2 - Multiple wiring board - Google Patents

Description

  The present invention relates to a multi-cavity wiring board formed by arranging a large number of wiring board regions each serving as a wiring board for mounting electronic components such as semiconductor elements and crystal resonators in a large-area mother board. It is.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators have a high melting point metal powder such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metallization.

  And while mounting an electronic component on a wiring board, each electrode of this electronic component is electrically connected to a wiring conductor through electrical connection means such as solder or bonding wire, and then, on this wiring board. A lid made of metal or ceramics or a potting resin is joined so as to cover the electronic component, whereby the electronic component is hermetically sealed, and an electronic device as a product is manufactured.

  By the way, such a wiring board has become extremely small with a size of about several mm square in accordance with the recent demand for miniaturization of electronic devices.

  Therefore, in order to facilitate the handling of such a small-sized wiring board and to efficiently manufacture the wiring board and an electronic device using the wiring board, a so-called multi-cavity wiring board is used. Made in form.

  Such a multi-piece wiring board is formed by arranging a large number of wiring board regions each having wiring conductors in a single large-area mother board vertically and horizontally, and in which electronic components are arranged in each wiring board region. After mounting and sealing, the mother board is divided into each wiring board region, so that a large number of electronic devices can be obtained simultaneously and collectively.

  In addition, the wiring conductor formed in each wiring board region of the multi-cavity wiring board prevents the wiring conductor from being oxidatively corroded and has good electrical connectivity between the wiring conductor and each electrode of the electronic component. Therefore, a plating metal layer made of nickel, gold or the like is applied to the exposed surface by, for example, an electrolytic plating method.

  Here, an example of such a multi-piece wiring board is shown in a plan view in FIG. As shown in FIG. 5, the multi-cavity wiring board has, for example, a large number of wiring board regions 12, each of which is a wiring board, arranged in a central portion of a substantially rectangular mother board 11. 11 is formed with a margin area 13 so as to surround the wiring board areas 12 arranged vertically and horizontally.

  For example, wiring conductors 15 a and 15 b are formed in each wiring board region 12. The wiring conductors 15a and the wiring conductors 15b in each wiring board region 12 are arranged in a plurality of columns, and are electrically connected to each column via a pattern 14 for plating conduction. This pattern 14 is led out on two opposite sides of the mother board 11, and terminal portions 14a are formed on the two sides of the mother board 11, and the terminal parts 14a are connected to a plating power source, thereby enabling plating conduction. A voltage for electrolytic plating is applied to all the wiring conductors 15a and 15b in each column via the pattern 14.

  In this multi-cavity wiring board, all the wiring is achieved by immersing the mother board 11 in an electrolytic plating bath for nickel plating or gold plating, and by connecting the pattern 14 for plating conduction to a power source for plating. A plated metal layer by electrolytic plating is deposited on the conductors 15a and 15b.

Each wiring board can be obtained by dividing the multi-piece wiring board into each wiring board region 12. As a method for dividing each wiring board region 12, each wiring board region is formed by forming a dividing groove for each wiring board region 12 of the multi-piece wiring board and dividing along each of the wiring board regions 12, or by a slicing method or the like. There is a method of cutting every 12 or the like, and by these methods, individual wiring boards can be obtained.
JP 2000-165003 A

  However, in the conventional multi-cavity wiring board, since the wiring conductors 15a and 15b are all electrically connected to the single plating conduction pattern 14, the wiring conductors 15a and 15b are plated by the electrolytic plating method. When depositing a layer, only the same thickness and the same type of plating layer could be deposited at the site where the plating layer was deposited. For this reason, when the thickness of the plating layer to be applied to the wiring conductors 15a and 15b is different, or when different types of plating layers are to be applied, the wiring conductors 15a and 15b are masked with a film or the like. In addition, it is necessary to prevent the plating layer from being deposited on the wiring conductors 15a and 15b, which is very troublesome. Also, if the wiring board is very small or has irregularities on the surface of the wiring board, there is a problem that it is difficult to perform masking etc. accurately and quickly. .

  The present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to easily and efficiently deposit plating layers of different thicknesses and types deposited on the wiring conductor of the wiring board. An object of the present invention is to provide a multi-piece wiring board capable of achieving the above.

The multi-cavity wiring board of the present invention is formed by laminating a plurality of insulating layers, a plurality of wiring board regions are arranged vertically and horizontally on the main surface, and the exposed surface of the wiring conductor formed in the wiring board region A square multi-cavity wiring board in which a plating conduction pattern for depositing a plating layer by an electrolytic plating method is formed, wherein the pattern is formed on a plurality of different insulating layers . has first and second inner layer pattern, said first and second inner layer pattern is formed to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view by connecting the wiring conductor column by column, respectively ends with and is connected to the frame-like portion formed so as to surround the wiring board region on an outer peripheral portion of the wiring substrate region, one of deriving unit from the frame-shaped portion is opposed the quadrangular Wherein the of the diagonal positions of the different ends of each side edge being respectively derived.

The multi-cavity wiring board of the present invention is formed by laminating a plurality of insulating layers, a plurality of wiring board regions are arranged vertically and horizontally on the main surface, and the exposed surface of the wiring conductor formed in the wiring board region A square multi-cavity wiring board in which a plating conduction pattern for depositing a plating layer by an electrolytic plating method is formed, wherein the pattern is formed on a plurality of different insulating layers . has first and second inner layer pattern, said first and second inner layer pattern is formed to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view by connecting the wiring conductor column by column, respectively ends with and is connected to the frame-like portion formed so as to surround the wiring board region on an outer peripheral portion of the wiring substrate region, one of deriving unit from the frame-shaped portion is opposed the quadrangular Characterized in that the different said pair of sides to each other at the sides are respectively derived.

Multiple patterning wiring board of the present invention, the pattern for plating conductive has a plurality of first and second inner layer patterns formed on different insulating layers, respectively, first and second inner layer patterns respectively the frame-like portion formed so as to surround the wiring board region on the outer peripheral portion of both ends wiring substrate region with connecting wiring conductors column by column is formed so as to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view The connection conductors and the lead-out portions from the frame-like portions are respectively led to the diagonal positions of the different ends of each of the pair of opposing sides of the quadrangular shape, so that the wiring conductor in the multi-cavity wiring board The plating layer can be satisfactorily applied to the portion of the exposed surface of the substrate and the portion electrically connected to the first inner layer pattern and the portion electrically connected to the second inner layer pattern. The plurality of first and second inner layer patterns, since they are formed respectively interconnect conductors in a direction perpendicular to the vertical and horizontal to each other in plan view connected column by column, a plurality of first and second inner layer pattern Are not formed in one direction, and as a result, warpage and deformation of the wiring board can be suppressed. Further, both ends of the plurality of first and second inner layer patterns are connected to a frame-shaped portion formed so as to surround the wiring substrate region at the outer peripheral portion of the wiring substrate region, and a lead-out portion from the frame-shaped portion has a square shape The wiring formed in each wiring board area is reduced by reducing the difference in wiring length in each wiring board area because it is derived to the diagonal position of the different end of each side of the pair of opposing sides. Variation in the thickness of the plating layer of the conductor can be reduced.

Further, the multi-cavity wiring board of the present invention has a plurality of first and second inner layer patterns formed in different insulating layers, and the first and second inner layer patterns. frame shape is formed so as to surround the wiring board region on the outer peripheral portion of both ends wiring substrate region with is formed so as to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view to connect each wiring conductor by one column Since the lead-out portion from the frame-like portion is led to a pair of sides that are different from each other by a pair of opposite sides of the quadrangular shape, the wiring conductor in the multi-piece wiring board is exposed. The plating layer can be easily and satisfactorily applied to the portion of the surface that is electrically connected to the first inner layer pattern and the portion that is electrically connected to the second inner layer pattern. The plurality of first and second inner layer patterns, since they are formed respectively interconnect conductors in a direction perpendicular to the vertical and horizontal to each other in plan view connected column by column, a plurality of first and second inner layer pattern Are not formed in one direction, and as a result, warpage and deformation of the wiring board can be suppressed.

The multi-piece wiring board of the present invention will be described in detail below. FIG. 1A is a plan view of a multi-piece wiring board of the present invention, FIG. 1B is an internal plan view in which a first inner layer pattern for plating conduction is formed, and FIG. 2 is an internal plan view in which an inner layer pattern 2 is formed, FIG. 2D is a plan view after a plating layer is deposited on the wiring conductor, and FIG. 2 is a cross-sectional view of the multi-cavity wiring board of FIG. In these figures, 1 is a mother board, 2 is a wiring board area, 3 is a margin area, 4 is a first inner layer pattern for plating conduction, and 5 is a second inner layer pattern for plating conduction.

  The multi-cavity wiring board of the present invention is formed by laminating a plurality of insulating layers, and a plurality of wiring board regions 2 are arranged vertically and horizontally on the main surface, and electroplating is performed on the wiring conductor formed in the wiring substrate region 2. A rectangular multi-cavity wiring board in which a plating conduction pattern for depositing a plating layer by a method is formed, wherein the patterns are formed on different insulating layers, respectively. It has inner layer patterns 4, 5, and the first and second inner layer patterns 4, 5 are formed so as to extend in directions orthogonal to each other in plan view, and each side of a pair of opposing sides in a square shape Are respectively derived at different ends.

  The mother substrate 1 of the present invention is made of ceramics, resin, or the like, and when made of ceramics, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, silicon carbide. This is a rectangular flat plate made of an electrically insulating material such as a sintered material and glass ceramics. A large number of wiring board regions 2 are integrally formed vertically and horizontally at the center, and a square frame is formed at the outer periphery. A shaped margin area 3 is formed.

  When such a mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, calcium oxide, magnesium oxide and the like. This is formed into a sheet by using a conventionally known doctor blade method to obtain a plurality of ceramic green sheets, and thereafter, these ceramic green sheets are appropriately punched and moved up and down. A plurality of layers are laminated, and finally, this laminated body is manufactured by firing at a temperature of about 1600 ° C. in a reducing atmosphere.

Wiring conductors 6a, 6b, 6c are deposited on each wiring board region 2 formed in the center of the mother board 1, and the wiring conductors 6a-6c are made of tungsten (W), molybdenum (Mo), Each electrode of an electronic component (not shown) made of a metal such as copper (Cu) or silver (Ag) is connected to the wiring board via an electrical connection means such as a solder bump or formed on the wiring board. Formed on the side wall of the recess or used as a joint between the wiring board and the metal member, etc. And according to the multi-cavity wiring board of the present invention, the first and second formed on different insulating layers, respectively. The first and second inner layer patterns 4 and 5 are formed so as to extend in directions orthogonal to each other in plan view, and each of a pair of opposing sides in a square shape Each on a different edge It has been derived. In the mother board 1, the first inner layer pattern 4 is electrically connected to the wiring conductors 6a and 6b, and the second inner layer pattern 5 is electrically connected to the wiring conductor 6c.

  Then, the first inner layer pattern 4 and the second inner layer pattern 5 are led out to two opposite sides of the mother substrate 1, respectively, and terminal portions 4a for connecting to the plating power source on the outer side of the mother substrate 1; 5a is formed.

  Further, the first inner layer pattern 4 and the second inner layer pattern 5 may be formed in a frame shape so as to surround each wiring board region 2 on the outer peripheral portion of the mother substrate 1 that becomes the discard margin region 3. .

These first inner layer pattern 4 and second inner layer pattern 5 are, for example, predetermined so as to be connected to the wiring conductors 6 a, 6 b, 6 c by a W paste or the like on a ceramic green sheet serving as the mother substrate 1. The pattern is printed and applied, and fired together with the ceramic green sheet laminate to be the mother substrate 1, thereby being deposited on a predetermined position of the mother substrate 1.

Then, the mother substrate 1 is immersed in the electrolytic plating bath, and the terminal portions 4a of the first inner layer pattern 4 and the terminal portions 5a of the second inner layer pattern 5 are respectively connected to the power source for plating, thereby providing the wiring conductor 6a. , 6b, the first plating layer 7 and the second plating layer 8 is deposited on the exposed surfaces of 6c. For example, when a silver plating layer is applied to the exposed surface of the wiring conductor 6a and a gold plating layer is applied to the exposed surfaces of the wiring conductors 6b and 6c, the mother substrate 1 is placed in an electrolytic silver plating bath. The terminal part 4a of the first inner layer pattern 4 is connected to a power source for plating, and the mother substrate 1 is immersed in an electrolytic gold plating bath, and the terminal part 5a of the second inner layer pattern 5 is used as a power source for plating. Connect. As a result, the silver plating layer as the first plating layer 7 is deposited on the exposed surface of the wiring conductor 6a, and the gold plating layer as the second plating layer 8 is deposited on the exposed surface of the wiring conductor 6. can do.

  The silver plating layer and the gold plating layer are examples, and may be other different plating layers or plating layers of the same material having different thicknesses.

  Further, when it is desired to deposit the same plating layer on the exposed surfaces of the wiring conductors 6a to 6c, the mother substrate 1 is immersed in an electrolytic plating bath, and the terminal portions 4a and the second inner layer pattern 4 are secondly connected. By connecting the terminal portion 5a of the inner layer pattern to a power source for plating, the plating layer can be applied to the exposed region of the wiring conductor 6. For example, in the case of having two or more plating layers, the inner plating layer has the same thickness and type, and the outer plating layer has a different thickness and type. It can also be used for plating layers having different numbers of single layers and plural layers. As a result, the portions of the wiring conductors 6a to 6c in the multi-piece wiring board that are electrically connected to the first inner layer pattern 4 and the portions that are electrically connected to the second inner layer pattern 5 are: Each can satisfactorily deposit the plating layer. Further, the first and second inner layer patterns 4 and 5 are formed in directions orthogonal to each other, and the first and second electrolytic inner layer patterns 4 and 5 are not formed so as to be biased in one direction. It is possible to suppress the warpage and deformation of the substrate.

In the example of FIG. 1, the plurality of first and second inner layer patterns 4, 5 are connected to a frame-like portion formed at both ends so as to surround the wiring substrate region 2 at the outer peripheral portion of the wiring substrate region 2, Derived portions from the frame-shaped portion are respectively led to different end portions of a pair of opposing sides having a quadrangular shape, and two derived portions of the first inner layer pattern 4 are a pair of opposing quadrangular shapes. near diagonal positions with each present in the respective sides of the side is, the same applies to the second internal layer patterns 5. In this case, there is an advantage that the difference in the wiring length for each wiring board region 2 can be reduced and the thickness variation of the plating layer of the wiring conductors 6a to 6c formed for each wiring board region 2 can be reduced.

Further, the multi-piece wiring board of the present invention is formed by laminating a plurality of insulating layers, and a plurality of wiring board regions 2 are arranged vertically and horizontally on the main surface, and a wiring conductor 6a formed in the wiring substrate region 2 is formed. A square multi-cavity wiring board in which a plating conduction pattern for depositing a plating layer by an electrolytic plating method is formed on the exposed surface of -6c , and the patterns are formed on different insulating layers. A plurality of first and second inner layer patterns 4 and 5 are formed, and the first and second inner layer patterns 4 and 5 connect the wiring conductors 6a to 6c one column at a time in a plan view. is connected to the frame-shaped portion with both ends formed so as to surround the wiring substrate region 2 to the outer peripheral portion of the wiring substrate region 2 with is formed so as to extend in a direction perpendicular to the vertical and horizontal to each other, from the frame-shaped portion deriving unit a four A pair of opposing sides of the shape are led to different pair of sides to each other.

FIG. 3 shows a multi-cavity wiring board having the above-described configuration. FIG. 3A is a plan view of the multi-cavity wiring board of the present invention, and FIG. 3B is a first inner layer pattern 4 for plating conduction. (C) is an internal plan view in which the second inner layer pattern 5 for plating conduction is formed, and (d) is a plan view after the plating layer is deposited on the wiring conductors 6a to 6c. Is shown.

The pattern for plating conduction has a plurality of first and second inner layer patterns 4 and 5 formed in different insulating layers, and the first and second inner layer patterns 4 and 5 are respectively wiring conductors 6a. together they are formed to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view by connecting ~6c column by column, formed to both ends surround the wiring substrate region 2 to the outer peripheral portion of the wiring substrate region 2 a frame Since the lead-out part from the frame-like part is led out to a pair of sides different from each other by a pair of opposing sides of the quadrangular shape, the wiring conductors 6a to 6 in the multi-piece wiring board are connected A plating layer is satisfactorily applied to the portion of the exposed surface of 6c that is electrically connected to the first inner layer pattern 4 and the portion that is electrically connected to the second inner layer pattern 5. Can do. Further, since the plurality of first and second inner layer patterns 4, 5 are formed respectively interconnect conductors 6a~6c in a direction perpendicular to the vertical and horizontal to each other in plan view connected column by column, plural first Further, the second inner layer patterns 4 and 5 are not formed so as to be biased in one direction, and as a result, it is possible to prevent the wiring board from being warped or deformed.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in FIG. 1, the first and second inner layer patterns 4 and 5 are linearly formed in the multi-piece substrate, but may not be a strict straight line. For example, the plating shown in FIG. The principal part expansion internal plan view of the insulating layer in which the first inner layer pattern 4 for conduction is formed, and the principal part enlarged internal plan view of the insulation layer in which the second inner layer pattern 5 for plating conduction is formed in (b). When a plurality of wiring conductors 6a to 6e are formed in the wiring board and a plurality of different wiring conductors are connected to the first and second inner layer patterns 4 and 5, as shown in FIG. In order to electrically connect a plurality of wiring conductors 6 and to deposit a plating layer, the linear part and the orthogonally extending on the opposite side formed in a bowl shape at both ends so as to straddle each wiring board region 2 A portion such as a portion or an S-shape may be formed. Also, the first and second inner layer patterns 4 and 5 can be formed on the main surface of the wiring board.

1 shows an example of an embodiment of a multi-cavity wiring board according to the present invention, where (a) is a plan view of the multi-cavity board, and (b) is a large number of insulating layers on which a first inner layer pattern for plating conduction is formed. internal plan view of patterning wiring board, (c) the internal plan view of a multi-piece wiring substrate of the second inner layer pattern is formed an insulating layer for plating conductive, a plating layer (d) of the wiring conductors to be It is a top view of the multi-piece wiring board after wearing. It is a principal part expanded sectional view of an example of embodiment of the multi-piece wiring board of this invention. Shows another example of embodiment of the multi-piece wiring substrate of the present invention, (a) is a plan view of a multi-chip substrate, (b) a first insulating layer lining pattern is formed for plating conductive internal plan view of a multi-piece wiring substrate, (c) the internal plan view of a multi-piece wiring substrate of the second inner layer pattern for plating conductive is formed an insulating layer, (d) plating layer wiring conductor It is a top view of the multi-cavity wiring board after depositing. The other example of embodiment of the multi-piece wiring board of this invention is shown, (a) is a principal part expansion internal top view of the insulating layer in which the 1st inner layer pattern for plating conduction was formed, (b) is It is a principal part expansion internal top view of the insulating layer in which the 2nd inner layer pattern for plating conduction | electrical_connection was formed. It is a top view of the conventional multi-piece wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area | region 3 ... Discard allowance area | region 4 ... 1st inner layer pattern 5 ... 2nd inner layer pattern 6a, 6b, 6c ... Wiring conductor 7 * ..First plating layer 8 ... second plating layer

Claims (2)

A plurality of insulating layers are stacked and a plurality of wiring board regions are arranged vertically and horizontally on the main surface, and a plating layer is deposited on the exposed surface of the wiring conductor formed in the wiring board region by an electrolytic plating method. And a plurality of first and second inner layer patterns formed on different insulating layers. to which, at both ends with said first and second inner layer pattern is formed so as to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view by connecting the wiring conductor column by column, each of the wiring substrate region It is connected to a frame-like part formed on the outer periphery so as to surround the wiring board region, and the lead-out part from the frame-like part is a pair of different end parts of each side of the pair of opposite sides of the square shape . Corner Multiple patterning wiring board, characterized by being derived respectively location. A plurality of insulating layers are stacked and a plurality of wiring board regions are arranged vertically and horizontally on the main surface, and a plating layer is deposited on the exposed surface of the wiring conductor formed in the wiring board region by an electrolytic plating method. And a plurality of first and second inner layer patterns formed on different insulating layers. to which, at both ends with said first and second inner layer pattern is formed so as to extend in a direction perpendicular to the vertical and horizontal to each other in a plan view by connecting the wiring conductor column by column, each of the wiring substrate region is connected to the frame-like portion formed so as to surround the wiring board region on the outer peripheral portion, outlet portion from the frame-shaped portion is the rectangular opposing pair sides at different pair of mutually Multi-piece wiring substrate, characterized in that it is derived, respectively.

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