JP4458933B2 - Multiple wiring board - Google Patents

Description

  The present invention relates to a multi-cavity wiring board formed by arranging a large number of wiring board regions each serving as a wiring board for mounting electronic components such as semiconductor elements and crystal resonators in a large-area mother board. It is.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators have a high melting point metal powder such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metallization.

  And while mounting an electronic component on a wiring board, each electrode of this electronic component is electrically connected to a wiring conductor through electrical connection means such as solder or bonding wire, and then, on this wiring board. A lid made of metal or ceramics or a potting resin is joined so as to cover the electronic component, whereby the electronic component is hermetically sealed, and an electronic device as a product is manufactured.

  By the way, such a wiring board has become extremely small with a size of about several mm square in accordance with the recent demand for miniaturization of electronic devices.

  Therefore, in order to facilitate the handling of such a small-sized wiring board and to efficiently manufacture the wiring board and an electronic device using the wiring board, a so-called multi-cavity wiring board is used. Made in form.

  Such a multi-piece wiring board is formed by arranging a large number of wiring board regions each having wiring conductors in a single large-area mother board vertically and horizontally, and in which electronic components are arranged in each wiring board region. After mounting and sealing, the mother board is divided into each wiring board region, so that a large number of electronic devices can be obtained simultaneously and collectively.

  In addition, the wiring conductor formed in each wiring board region of the multi-cavity wiring board prevents the wiring conductor from being oxidatively corroded and has good electrical connectivity between the wiring conductor and each electrode of the electronic component. Therefore, a plating metal layer made of nickel, gold, or the like is applied to the exposed surface by, for example, an electrolytic plating method.

  Here, an example of such a multi-piece wiring board is shown in a plan view in FIG. As shown in FIG. 5, in the multi-cavity wiring board, for example, a large number of wiring board regions 12 each serving as a wiring board are integrally formed vertically and horizontally at the center of a rectangular mother board 11. A margin area 13 is formed on the outer periphery of 11 so as to surround the wiring board areas 12 arranged in the vertical and horizontal directions.

  In each wiring board region 12, for example, a wiring conductor 15 is formed. The wiring conductors 15 in each wiring board region 12 are arranged in a plurality of columns, and are electrically connected to each other via the plating conduction wiring 14. The plating conduction wiring 14 is led out on two opposite sides of the mother board 11, and terminal portions are formed on the two sides of the mother board 11, and the terminal parts are connected to a power source for plating, thereby enabling plating conduction. A voltage for electrolytic plating is applied to all the wiring conductors 15 in each column via the wiring 14.

Further, such a multi-piece wiring board is electrically connected to the wiring conductor 15, and a conductor layer is attached to the inner peripheral surface of the through hole 16 formed across the wiring board regions 12. while others have a through conductor 17 consisting Te, the plating conductive wire 14, the interior or the main surface of the mother substrate 11, adjacent with electrically connecting the through conductors 17 what happened that adjacent through conductor 17 It is formed so as to cross the boundary line 18 therebetween.

  In this multi-cavity wiring board, all the wiring conductors are obtained by immersing the mother board 11 in an electrolytic plating bath for nickel plating or gold plating and connecting the plating conduction wiring 14 to a plating power source. A plated metal layer by electroplating is deposited on the exposed surfaces of 15 and through conductors 17.

Each wiring board can be obtained by dividing the multi-cavity wiring board into each wiring board region 12. As a method of dividing each wiring board region 12, each wiring board is formed by forming a dividing groove at the boundary of each wiring board region 12 of a multi-piece wiring board and dividing along each of these wiring boards, or a slicing method. There are methods for cutting each region 12, etc., and by these methods, individual wiring boards can be obtained, and the plating conduction wiring 14 formed so as to cross the boundary line 18 between the adjacent through conductors 17. since the cut in cutting each wiring substrate region 12 each, so that the electrical connection of adjacent through conductor 17 the worker is blocked.

  However, in the conventional multi-cavity wiring board, the plating conduction wiring 14 is formed so as to cross the boundary line 18 between the through conductors 17, and the adjacent through conductors 17 in the wiring board region 12 are plated with each other. Even if a short circuit occurs through the common wiring 14, the through conductors 17 arranged in the same row are all electrically connected continuously by the plating conduction wiring 14. Then, it was not possible to confirm whether or not a short circuit occurred between the through conductors 17 in the wiring board region 12. For this reason, it is necessary to divide each wiring board region 12 and cut the plating conduction conductor 14 at the boundary line 18 between adjacent through conductors 17 in the wiring board region 12 of the multi-piece wiring board. There was a problem that the presence or absence of occurrence of a short circuit could not be confirmed.

  In addition, when mounting an electronic component or the like on a multi-piece wiring board or sealing an electronic component with potting resin and then dividing each wiring board region 12, wiring is performed in the state of the multi-piece wiring board. Since it is not possible to determine the quality of the electronic device due to a short circuit between adjacent through conductors 17 in the substrate, the electronic component is wasted, or the loss of the process spent for mounting the electronic component or sealing with potting resin occurs. Had a point.

  The present invention has been completed in view of the above-mentioned problems of the prior art, and its purpose is a short circuit in a wiring board region in a multi-piece wiring board in which a plating layer is deposited on a wiring conductor or a through conductor. It is an object of the present invention to provide a multi-cavity wiring board that can easily detect the occurrence of the occurrence of the occurrence of the occurrence of the occurrence in the state of the multi-cavity wiring board.

The multi-cavity wiring board of the present invention has a boundary line between a mother board in which a plurality of insulating layers are stacked and a plurality of rectangular wiring board areas are arranged vertically and horizontally on the main surface, and the wiring board area. And a through conductor formed by depositing a conductor layer on the inner surface of the through hole formed across the substrate, and the inner or main surface of the mother board is formed so as to cross the boundary line between the adjacent through conductors. the plating layer a multi-piece wiring substrate, which comprises a plating conductive wire for depositing the conductive layer of the through conductor by an electrolytic plating method, the plating conducting wire is electrically from each other The first and second plating conduction wirings are independent of each other in a plan view between different layers of the plurality of insulating layers, and The penetration between the different layers Are formed so as to be connected to the conductor, the through conductor, for the first and second plating conduction between between the wiring substrate areas with which a plurality formed along a side of the wiring substrate area It is characterized by being alternately connected to the wiring.

According to a multi-piece wiring substrate of the present invention, plating conductive wiring has electrically independent first and second plating conducting wires from each other, the first and second plating conducting wire Each of the plurality of insulating layers is formed so as not to overlap in a plan view and connected to the through conductor between the different layers, and the plurality of through conductors are formed along the side of the wiring board region. Since the first and second plating conduction wirings are alternately connected between the wiring board regions, the first plating connected to one of the through conductors in the adjacent through conductor is formed. When the conduction wiring is short-circuited with the other penetration conductor adjacent to one of the penetration conductors in the wiring board region, the other penetration conductor is connected to the second plating conduction wiring. Me Can conducting wire and the second plating conductive wiring becomes possible to conduct, the occurrence of short circuit between adjacent conductors in the form of multiple patterning wiring board can be easily confirmed. Therefore, since it is possible to mount electronic components etc. after judging the quality in the state of the multi-piece wiring board, the electronic components are wasted or the process of mounting the electronic components and sealing with potting resin Loss does not occur and it is excellent in mass productivity.

In the multi-cavity wiring board of the present invention , the first and second plating conduction wirings are formed between different layers of the plurality of insulating layers, respectively. By reducing the number of wiring conductors in each layer in which the plating is formed, it is possible to simplify the routing and routing of the plating conduction wiring, reduce the occurrence of short circuits, and reduce the first and second The wiring length of the plating conduction wiring 2 can be shortened, and the plating thickness variation in the multi-cavity wiring board region can be reduced. In addition, the first and second plating conduction wirings are formed so as not to overlap each other in different layers of the plurality of insulating layers in plan view and to be connected to the through conductors in each different layer. It is possible to suppress the occurrence of deformation or the like in the mother substrate due to the overlap of the first and second plating conduction wires and the increase in thickness of the portion compared to other portions.

  The multi-piece wiring board of the present invention will be described in detail below. FIG. 1 is a plan view showing an insulating layer formed with first and second plating conduction wirings in a multi-piece wiring board of the present invention. In FIG. 1, 1 is a mother board, 2 is a wiring board region, Reference numeral 3 denotes a disposal margin area, 4a denotes a first plating conduction wiring, and 4b denotes a second plating conduction wiring.

  The multi-cavity wiring board according to the present invention includes a plurality of insulating layers stacked and a main board 1 in which a plurality of rectangular wiring board areas 2 are arranged vertically and horizontally on the main surface, and the wiring board area 2 between A through conductor 7 formed by depositing a conductor layer on the inner surface of the through hole 6 formed across the boundary line, and the inside or main surface of the mother board 1 so as to cross the boundary line between the adjacent through conductors 7 And a plating conduction wiring for depositing a plating layer on the conductive layer of the through conductor 7 by an electrolytic plating method, wherein the plating conduction wirings are electrically independent from each other. A plurality of through conductors 7 are formed along the sides of the wiring board region 2 and the first and second wirings are provided between the wiring board regions 2. Connected alternately to the second plating conduction wires 4a and 4b .

  The mother substrate 1 of the present invention is made of ceramics, resin, or the like, and when made of ceramics, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, silicon carbide. This is a rectangular flat plate made of an electrically insulating material such as a sintered material and glass ceramics. A large number of wiring board regions 2 are integrally formed vertically and horizontally at the center, and a square frame is formed at the outer periphery. A shaped margin area 3 is formed.

  When such a mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, calcium oxide, magnesium oxide and the like. This is formed into a sheet by using a conventionally known doctor blade method to obtain a plurality of ceramic green sheets, and thereafter, these ceramic green sheets are appropriately punched and moved up and down. A plurality of layers are laminated, and finally, this laminated body is manufactured by firing at a temperature of about 1600 ° C. in a reducing atmosphere.

  A wiring conductor 5 is deposited on each wiring board region 2 formed in the central portion of the mother board 1, and the wiring conductor 5 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver. Each electrode of an electronic component (not shown) made of a metal such as (Ag) is connected via an electrical connection means such as a solder bump, or a metal member is attached to the wiring board with a brazing material or the like. In order to join, it is used as a joint part.

  The through hole 6 is formed so as to straddle the boundary line 8 between each wiring board region 2, and a through conductor 7 is formed by attaching a conductor layer to the inner surface of the through hole 6. The through conductor 7 is made of a metal such as tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag), etc., and is electrically connected to the wiring conductor 5 and is connected to the wiring conductor of the external circuit board. It is used as a connecting part.

  The exposed surfaces of the wiring conductor 5 and the through conductor 7 prevent the wiring conductor 5 and the through conductor 7 from being oxidatively corroded, and the electrical connection between the wiring conductor 5 and each electrode of the electronic component is good. In order to improve the electrical connection between the through conductor 7 and the wiring conductor of the external circuit board, a plating layer made of nickel, gold or the like is applied to the exposed surface.

  A plating conduction wiring for depositing a plating layer on the exposed surfaces of the wiring conductor 5 and the through conductor 7 by an electrolytic plating method is provided between the adjacent through conductors 7 inside or on the main surface of the mother board 1. It is formed so as to cross the boundary line 8.

  According to the multi-cavity wiring board of the present invention, the plating conduction wiring has the first and second plating conduction wirings 4a and 4b that are electrically independent from each other, and the through conductor 7 A plurality of wirings are formed along the side of the substrate region 2 and are alternately connected to the first and second plating conduction wires 4 a and 4 b between the wiring substrate regions 2. Thereby, in the adjacent through conductor 7, the first plating conduction wiring 4 a connected to one of the through conductors 7 and the other through conductor 7 adjacent to the one through conductor 7 are within the wiring board region 2. In the case of a short circuit, the other through conductor 7 is connected to the second plating conduction wiring 4b, so that the first plating conduction wiring 4a and the second plating conduction wiring 4b become conductive. It is possible to easily confirm the occurrence of a short circuit between adjacent conductors in the state of the individual wiring board. Therefore, since it is possible to mount electronic components etc. after judging the quality in the state of the multi-piece wiring board, the electronic components are wasted or the process of mounting the electronic components and sealing with potting resin Loss does not occur and the mass productivity is excellent.

  These first and second plating conduction wirings 4a and 4b are, for example, printed and applied in a predetermined pattern so as to be alternately connected to the through conductors 7 with a W paste or the like on a ceramic green sheet to be the mother substrate 1, By firing together with the ceramic green sheet laminate to be the mother substrate 1, it is deposited on a predetermined position of the mother substrate 1.

  The first and second plating conduction wirings 4a and 4b are led out to two opposite sides of the mother board 1, and are connected to a plating power source formed on the outer side of the mother board 1. Each terminal is connected.

  Then, by immersing the mother substrate 1 in the electrolytic plating bath and connecting the terminal portions to which the first and second plating conduction wires 4a and 4b are connected to the plating power source, respectively, the wiring conductor 5 and the through-hole A plating layer is deposited on the exposed surface of the conductor 7.

  Further, as shown in FIG. 1, a plurality of first plating conduction wirings 4 a may be connected by a plating common portion 4 c formed on the outer peripheral portion of the mother substrate 1 that becomes the disposal allowance region 3. Good. Similarly, a plurality of second plating conduction wires 4b may be connected by a common plating portion 4c formed on the outer peripheral portion of the mother board 1 serving as the disposal margin region 3. Thereby, it is possible to effectively prevent the potential difference between the plurality of first plating conduction wirings 4a and the plurality of second plating conduction wirings 4b formed on the mother board 1 from being increased, It becomes possible to deposit plating with a uniform thickness on the entire through conductors 7 and wiring conductors 5 formed on the mother board 1.

  In FIG. 1, the first and second plating conduction wires 4a and 4b are connected to the plating common part 4c, which are electrically independent from each other. As shown in FIG. Two plating conduction wires 4a and 4b are connected to the same plating common portion 4c, and a plating layer is applied to the wiring conductor 5 and the through conductor 7 via the first and second plating conduction wires 4a and 4b. After that, the plating common part 4c may be separated from the mother board 1. In this case, the same plating can be formed with a uniform thickness on the through conductor 7 and the wiring conductor 5 connected to the first and second plating conduction wires 4a and 4b. Then, after the plating is formed, the plating common portion 4c is separated from the mother substrate 1, whereby the first plating conduction wiring 4a and the second plating conduction wiring 4b are electrically disconnected, and a large number The presence or absence of occurrence of a short circuit between adjacent conductors in the state of the wiring board can be easily confirmed.

  Moreover, in order to make it easy to confirm a short circuit or the like of the first and second plating conduction wires 4a and 4b, a short-circuit confirmation terminal electrically connected to the first and second plating conduction wires 4a and 4b. May be formed on the main surface of the mother substrate 1.

The first and second plating conducting wire 4a, 4b is that are formed in different layers of their respective plurality of insulating layers. Accordingly, the first and second plating conduction wires 4a and 4b are routed by reducing the number of wiring conductors in the respective layers where the first and second plating conduction wires 4a and 4b are formed. And the path can be simplified, the risk of short-circuiting can be reduced, and the lengths of the first and second plating conduction wires 4a and 4b can be shortened. Variation in the thickness of the plating layer deposited on the wiring conductor 5 and the through conductor 7 in the wiring board region 2 can be reduced. As such a multi-piece wiring board, for example, FIG. 3A shows a plan view of the insulating layer 1b on which the second plating conduction wiring 4b is formed, and FIG. 3B shows the first plating conduction wiring. Examples include a plan view of the insulating layer 1a on which 4a is formed and an enlarged view of a main part in the cross section indicated by the AA 'line in FIG. 4A. In these drawings, the first plating conduction wiring 4a and the second plating conduction wiring 4b are formed so as to be connected to the through conductor 7 in different layers.

The first and second plating conducting wire 4a, 4b are formed so as not to overlap each in plan view. As a result , it is possible to prevent the first and second plating conduction wires 4a and 4b from overlapping each other so that the portion becomes thicker than the other portions and the mother substrate 1 is not deformed.

  A plurality of wiring boards can be obtained by dividing the multi-cavity wiring board of the present invention into each wiring board region 2 along the boundary line 8.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in FIG. 1, the first and second plating conduction wirings 4a and 4b are formed linearly in the multi-piece wiring board. In order to electrically connect a plurality of through conductors 7 and to deposit a plating layer, the linear portion and the orthogonally extending on the opposite side formed in a bowl shape at both ends so as to straddle each wiring board region 2 A portion such as a portion or an S-shape may be formed.

It is a top view of an example of an embodiment of a multi-piece wiring board of the present invention. It is a top view of other examples of an embodiment of a multi-piece wiring board of the present invention. (A) is a plan view of an insulating layer on which a first plating conduction wiring is formed in the multi-cavity wiring board of the present invention, and (b) is a second plating conduction wiring in the multi-cavity wiring board of the present invention. It is a top view of the insulating layer in which was formed. FIG. 4 is an enlarged cross-sectional view of a main part taken along line A-A ′ of the multi-cavity wiring board of FIG. It is a top view of the conventional multi-piece wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board | substrate 2 ... Wiring board area | region 4a ... 1st plating conduction | electrical_connection wiring 4b ... 2nd plating conduction | electrical_connection wiring 6 ... Through-hole 7 ... Through-conductor 8 ... ·border

Claims (1)

A mother board in which a plurality of rectangular wiring board regions are arranged vertically and horizontally on the main surface, and an inner surface of a through-hole formed across a boundary line between the wiring board regions. And a through conductor formed by depositing a conductor layer on the inner surface or the main surface of the mother board, the conductor layer of the through conductor formed so as to cross the boundary line between the adjacent through conductors. the plating layer a multi-piece wiring substrate, which comprises a plating conductive wire for depositing by plating, the plating conducting wires are each electrically independent first and second plating Conductive wiring is provided , and the first and second plating conductive wirings are connected to the through conductors in different layers so as not to overlap each other in different layers of the plurality of insulating layers in plan view. It is formed so as to A plurality of the through conductors are formed along the side of the wiring board region and are alternately connected to the first and second plating conduction wirings between the wiring board regions. A multi-piece wiring board characterized by

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