JP6506132B2 - Multi-cavity wiring board and wiring board - Google Patents

Description

  The present invention relates to a multi-cavity wiring board and a wiring board in which a large number of wiring board areas, which become small wiring boards for mounting electronic components such as semiconductor elements and quartz oscillators, are arranged in vertical and horizontal alignment. .

  Conventionally, for example, a wiring substrate used to manufacture an electronic device by mounting an electronic component such as a semiconductor element or a quartz oscillator, has a plurality of square flat ceramic insulating layers made of ceramics such as an aluminum oxide sintered body. It is the structure which laminated | stacked and provided the wiring conductor electrically connected with an electronic component on the surface of the laminated body.

  With the recent miniaturization of electronic devices, such wiring boards have become extremely small in size, about several mm square in plan view. Then, in order to efficiently manufacture such a small wiring substrate and electronic device, a wiring substrate in the form of a so-called multi-cavity wiring substrate in which a large number of wiring substrates are obtained from a mother substrate made of a ceramic material or the like. And electronic devices are being manufactured.

  In this multi-cavity wiring board, a plurality of wiring board areas are arranged in a matrix in the mother board, and a recess for housing an electronic component (not shown) is formed on the upper surface of each wiring board area. Wiring conductors are formed from the inside of the recess to the lower surface of each wiring substrate region. The wiring conductor is made of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold or the like, and a metal paste consisting of fine particles of a metal such as tungsten and a binder is After printing on a green sheet to be a layer, it is fired at a high temperature to form a conductive metal film.

  Then, the electronic component is mounted and fixed to the bottom of the recess and the electrode of the electronic component is electrically connected to the wiring conductor in the recess through a conductive connecting material such as a bonding wire or solder, and thereafter the wiring substrate region By sealing the concave portion on the upper surface with a material (not shown) such as a lid or a sealing resin, a large number of regions to be electronic devices are manufactured on the mother substrate.

  In addition, in order to prevent oxidation corrosion in the wiring conductor and to improve the electrical connectivity between the wiring conductor and each electrode of the electronic component, plating of nickel, gold or the like on the exposed surface is performed. A metal layer is deposited by electroplating.

  In addition, dividing grooves are formed on the boundary of the wiring substrate area on the main surface (upper surface and lower surface) of the mother substrate, and the mother substrate is divided in the dividing grooves. That is, stress is applied to bend the mother substrate along the dividing groove, and the dividing groove on the lower surface side (or the dividing groove on the upper surface side facing from the tip of the dividing groove on the upper surface side (or the dividing groove on the lower surface side) The mother substrate is divided by causing the crack to advance in the thickness direction of the mother substrate and breaking it to the front end of the mother substrate).

JP, 2001-68577, A

However, in the wiring board manufactured from such a multi-piece wiring board, further miniaturization has been required in recent years. Then, in order to improve the solderability to the external circuit and the plating adhesion to the inner conductor formed on the inner surface of the reduced diameter hole (the hole to be a notch), for example, the mother substrate is the upper insulating layer A so-called stepped castellation structure in which small-diameter holes are formed in the upper-layer insulating layer and large-diameter holes are formed in the lower-layer insulating layer, and each is continuously connected It is adopted.

  With such a configuration, when viewed from the lower surface side (lower insulating layer side) of the wiring substrate region in the mother substrate, the bottom (the portion where the upper insulating layer is exposed around the small diameter hole) in the large diameter hole. Is formed, and the dividing groove from the lower insulating layer side may not be formed at the bottom, and in this hole, the mother substrate is divided by the dividing groove on only one side, and burrs and chips are likely to occur. . Also, even if the dividing groove from the lower insulating layer side is formed at the bottom, while the dividing property of the mother substrate can be improved, the wiring for plating is formed between the upper insulating layer and the lower insulating layer. In some cases, there is a problem that the groove is cut by the dividing groove and the conduction path can not be secured.

  In the multi-cavity wiring board according to one aspect of the present invention, a plurality of wiring board areas are formed vertically and horizontally, and a mother board on which a dummy area is formed surrounding the wiring board area, and the plurality of wiring boards Wiring conductors formed in each of the regions and a first divided groove formed at the boundary between the wiring substrate regions on one main surface side and formed in the vertical direction of the wiring substrate region, and a width of the wiring substrate region Second split grooves formed in the first direction, first holes formed in each corner of the wiring board area, and each corner of the wiring board area along the lateral direction of the wiring board area, A long hole-like second hole formed so as to be continuously connected to the first hole and opened on the one main surface side of the mother substrate, and a side conductor formed on the side surface of the second hole And the first dividing groove is formed by the second hole portion. Is formed halfway in the depth direction, the second dividing groove extends through said second hole portion, characterized in that it is formed halfway in the depth direction of the first hole portion.

  The wiring substrate according to one aspect of the present invention has a rectangular shape in a plan view, a first notch opened on the side surface, and a second notch larger in width than the first notch and opened on one main surface and side surface And a wiring conductor provided on the substrate, and an inner conductor provided on the inner surface of the second notch. The first side surface of the substrate in which the side surface has a fractured surface separated from the one main surface, and the end on the one principal surface side of the fractured surface is in contact with the second notch; The end face on the one main surface side and the second side face of the substrate separated from the second notch may be provided.

  According to the multi-cavity wiring board of the present invention, the plurality of wiring board areas are formed in the vertical and horizontal directions, and the mother board on which the dummy area is formed surrounding the wiring board area and the plurality of wiring board areas A first divided groove formed in the longitudinal direction of the wiring substrate region, formed on the boundary between the formed wiring conductor and the wiring substrate region on one main surface side, and a second formed in the horizontal direction of the wiring substrate region Consecutively connecting with the first hole to each corner of the wiring substrate region along the lateral direction of the dividing groove, the first hole formed at each corner of the wiring substrate region, and the wiring substrate region A second hole portion in the form of an elongated hole formed on one main surface side of the mother substrate, and a side conductor formed on the side surface of the second hole portion, and the first divided groove The second divided groove penetrates the second hole, which is formed halfway to the depth direction of the two holes. It is formed halfway in the depth direction of the first hole.

With such a configuration, the second divided groove is formed at the bottom of the second hole (the portion where the upper insulating layer is exposed around the first hole). Therefore, the multi-cavity wiring board including the mother board can be favorably divided in the lateral direction. Also, for example, in the case where the mother substrate has the upper insulating layer and the lower insulating layer and the plating wiring is formed between the upper insulating layer and the lower insulating layer, the first division groove cuts the plating wiring. However, it is possible to secure the conduction path of the wiring for plating between the adjacent wiring substrate areas, and improve the plating adhesion to the exposed wiring conductor of each wiring substrate area.

  In addition, since the depth of the first divided groove is smaller than the depth of the second divided groove, unintended cracking of the multi-cavity wiring substrate is suppressed when an external force is applied to the multi-cavity wiring substrate including the mother substrate .

  Further, according to the wiring board of the present invention, the first notch having a rectangular shape in a plan view and having an opening on the side surface, and the second notch having a width larger than the first notch and having an opening on one main surface and the side surface And the wiring conductor provided on the substrate, and the inner conductor provided on the inner surface of the second notch, and the side surface of the substrate is one side of the substrate. A first side surface of a substrate having a fractured surface separated from the principal surface and in which an end on the principal surface side of the fractured surface is in contact with the second notch, an edge on the one principal surface side of the fractured surface and the first side And a second side surface of the substrate separated from the two notches. With such a configuration, burrs and chips can be suppressed even in the case where portions having different notches have different widths, and a wiring board with excellent dimensional accuracy can be obtained.

It is a top view which shows a part in the other main surface of the multi-cavity wiring board of this invention. It is a top view which shows a part in one main surface of the multi-cavity wiring board of this invention. It is a perspective view in the corner part by the side of one main surface of the wiring board of the present invention. It is a plane transparent view of a wiring board of the present invention.

Next, the multi-piece wiring board of the present invention will be described in detail with reference to the attached drawings. FIG. 1 is a plan view showing a part of the other main surface showing an example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 2 is a plan view showing a part of the one main surface . Moreover, FIG. 3 is a perspective view in the corner part by the side of one main surface of the wiring board manufactured from the multi-cavity wiring board of this invention. In FIG. 1 and FIG. 2, in order to make each main part easy to see, mother substrate 101
Is shown as an enlarged view of a part of the multi-piece wiring board including the FIG. Also in FIG. 3, a part of the wiring board is shown as an enlarged view in order to make it easier to see the main parts.

In these figures, 101 is a mother substrate, 102 is a wiring substrate area, 103 is a dummy area, 104 is an upper insulating layer, 105 is a lower insulating layer, 106 is a wiring conductor, 107 is a boundary, 108 is a first divided groove, 109 Is a second divided groove, 110 is a first hole, 111 is a second hole, 112 is a side conductor, 113 is a third divided groove, 114 is a fourth divided groove, and 115 is a substrate.

The mother substrate 101 is formed, for example, by laminating a plurality of ceramic insulating layers (without reference numerals) made of ceramic materials such as aluminum oxide sintered body, aluminum nitride sintered body, mullite sintered body, and glass ceramic. There is. Further, on the mother substrate 101, wiring substrate areas 102, each of which is a single piece substrate (not shown), are arranged in a matrix of vertical and horizontal directions. In the example shown in FIG. 1, a mounting portion 117 for housing the electronic component 121 is formed on the upper surface of the wiring substrate area 102.

For example, when each ceramic insulating layer is made of an aluminum oxide sintered body, the mother substrate 101 is formed into a sheet shape by using raw material powders of aluminum oxide, silicon oxide, calcium oxide, etc. with an organic solvent, a binder, etc. A plurality of ceramic green sheets (green sheets) are obtained, and punching processing is performed on the predetermined positions of the green sheets to form the mounting portion 117. Thereafter, the green sheets subjected to punching processing are stacked one on top of the other. Made by baking. Each of the stacked green sheets becomes a ceramic insulating layer of the mother substrate 101 after firing.

The thickness of the ceramic insulating layer constituting the mother substrate 101 obtained by firing the green sheet is, for example, 50 to 300 μm in the case of an aluminum oxide sintered body or glass ceramic.
It is about m.

  In the mother substrate 101, wiring substrate regions 102, each of which is a single piece substrate, are arranged in a matrix in the vertical and horizontal directions. Further, in the example shown in FIG. 1, a frame-shaped dummy area 103 surrounding the wiring board area 102 is provided at the outer peripheral portion of the mother substrate 101. The dummy region 103 is provided, for example, to facilitate handling of the multi-cavity wiring board.

Wiring conductors 106 are formed on the surface of each wiring substrate area 102. The wiring conductor 106 is formed so as to electrically lead from the inside of the mounting portion 117 which is a part of the upper surface of the wiring substrate region 102 to the lower surface of the wiring substrate region 102, and is formed inside the mounting portion 117. The electronic component 121 is electrically connected to the aforementioned portion through a conductive connecting material (not shown) such as a bonding material or a solder.

A portion of the wiring conductor 106 formed on the upper surface of the wiring substrate region 102 and a portion formed on the lower surface are ceramic-insulated as a part of the wiring conductor 106 in order to electrically connect the two. A through conductor (not shown) or the like which penetrates the layer in the thickness direction is arranged.

The wiring conductor 106 is electrically connected to the electronic component 121 accommodated in the mounting portion 117 on the substrate of the individual piece, and as a conductive path electrically connecting the electronic component 121 to an external electric circuit (not shown). Function. For the electrical connection of the wiring conductor 106 to the external electrical circuit, for example, a portion of the wiring conductor 106 electrically connected to the electronic component 121 formed on the lower surface of the substrate 115 is tin-lead to the external electrical circuit. It is carried out by bonding through a solder such as a base solder or a tin-silver solder.

A plated metal layer of nickel, gold, palladium, copper or the like (not shown) is provided on the exposed surface of the wiring conductor 106 in order to prevent oxidation corrosion, improve bonding wire bonding properties, solder wettability etc. ) Is applied. The deposition of the plated metal layer is carried out by electroplating because it is easy to stabilize the characteristics of the plated metal layer and that productivity and economy are good.

Such a plated metal layer is, for example, a nickel plated layer having a thickness of about 2 to 20 μm, which is sequentially deposited when the wiring conductor 106 is made of tungsten, molybdenum, manganese or copper, and the thickness It is comprised by about 0.1-2 micrometers gold plating layer.

In addition, the multi-piece wiring board has the plating wiring 120 which connects the wiring conductors 106 to each other across the boundary 107 of the wiring substrate area 102. Furthermore, a through hole (not shown) is formed at a corner portion of the wiring substrate area 102, and a side surface conductor is formed on the inner side surface of the through hole. The plating wirings 120 and the side conductors electrically connect the wiring conductors 106 of the plurality of wiring substrate areas 102 to each other, and collectively connect the wiring conductors 106 of the plurality of wiring substrate areas 102. It is for depositing a plated metal layer by electroplating.

That is, since the wiring conductors 106 are electrically connected to each other between the plurality of wiring board regions 102 via the plating wires 120 and the side surface conductors, for example, a large number of parts of the plating wires 120 are removed. By drawing out to the outer peripheral portion (dummy region 103) etc. of the wiring board and supplying current to the drawn out portion from an external power source through a plating jig (so-called rack etc.) Current can be supplied to the wiring conductors 106 collectively. The wiring conductor 106 and the plating wiring 120 are made of a metal material such as tungsten, molybdenum, copper, silver or the like, and for example, a plurality of through holes at predetermined positions in each wiring substrate region 102 of the green sheet to be the mother substrate 101 in advance. Are formed by printing or filling a metal paste such as tungsten in the surface of the green sheet and in the through holes by screen printing or the like.

  The metal paste is produced by kneading a mixture of fine particles of metal (for example, tungsten) and a binder. The metal paste is applied to a green sheet to be a ceramic insulating layer by printing or filling, and then fired at a high temperature to form the wiring conductor 106 and the wiring 120 for plating. The metal fine particles have, for example, a spherical shape, a flake shape, a protrusion shape, etc., and an average particle diameter of about several μm.

In addition, mother substrate 101 is divided into first to fourth dividing grooves 108 to 114 along boundaries 107 between wiring board regions 102 (between wiring board regions 102 and between wiring board region 102 and dummy region 103). A dividing groove is formed, and by dividing the multi-cavity wiring board including the mother substrate 101 along the dividing groove, each wiring board area 102 is a wiring board for individual pieces (or for storing electronic parts) Package).

In the multi-cavity wiring board of the present invention, a plurality of wiring board areas 102 are formed vertically and horizontally, and a mother board 101 on which a dummy area 103 is formed surrounding the wiring board area 102, and a plurality of wiring board areas 102. And the first division grooves 108 formed in the longitudinal direction of the wiring substrate region 102, and the wiring substrate region 102. Of the wiring substrate region 102 along the lateral direction of the second divided groove 109 formed in the lateral direction, the first hole 110 formed in each corner of the wiring substrate region 102, and the lateral direction of the wiring substrate region 102. It is formed in the corner portion so as to be continuously connected to the first hole portion 110, and is formed in the side surface of the second hole portion 111 and the second hole portion 111 having a long hole shape opening on the one main surface side of the mother substrate 101. And the first dividing groove 108 is formed to the middle of the second hole 111 in the depth direction. Are, second dividing grooves 109, the second hole portion 111 penetrates, is formed halfway in the depth direction of the first hole 110.

With such a configuration, when viewed from the one main surface (the lower insulating layer 105 side), the second division is performed on the bottom of the second hole 111 (the portion where the upper insulating layer 104 is exposed around the first hole 110). The groove 109 is formed. Therefore, the multi-cavity wiring board including the mother board 101 in the lateral direction can be favorably divided.

Further, since the depth of the first dividing groove 108 is small in the vertical direction, unintended cracking of the multi-cavity wiring substrate is suppressed when an external force is applied to the multi-cavity wiring substrate including the mother substrate 101. . Furthermore, in the vertical direction, the adhesion surface of the upper insulating layer 104 and the lower insulating layer 105 is not cut by the first dividing groove 108, so that the plating wiring 120 serving as a conduction path between the adjacent wiring substrate regions 102 can be secured. The plating adhesion to the exposed wiring conductor 106 of each wiring substrate area 102 can be improved.

  As shown in FIG. 2, the first holes 110 and the second holes 111 formed at the corners of the wiring substrate region 102 are formed so as to be connected continuously, and the second division grooves 109 are formed in the lateral direction. And penetrates the second hole 111 and is also formed at the bottom of the second hole 111. In addition, the first divided groove 108 is formed in the vertical direction, and it is formed so as not to penetrate the second hole 111 until the middle of the second hole 111 in the depth direction.

Further, as shown in FIG. 2, if the wiring substrate area 102 is rectangular and the longitudinal direction is the short side and the lateral direction is the long side, division is performed on the long side having a large side length. Although this tends to be difficult, since the second dividing groove 109 is formed deep in the bottom of the second hole portion 111 in this manner, the division of the multi-cavity wiring board in the lateral direction can be made favorable. can do. Furthermore, since the long hole-like second holes 111 are formed at each corner on the long side of the wiring substrate area 102, the area of the substantially broken surface in the lower insulating layer 105 of the wiring substrate area 102. Can be made smaller. Therefore, the division of the multi-cavity wiring board in the lateral direction can be further improved.

The multi-cavity wiring board of the present invention is formed on the other main surface side of the mother substrate 101 at the boundary 107 between the wiring board areas 102 and is formed in the third divided groove 113 in the lateral direction of the wiring board area 102. And the fourth divided groove 114 formed in the longitudinal direction of the wiring substrate region 102, and the third divided groove 113
The depth is smaller than that of the dividing groove 114.

With such a configuration, it is possible to appropriately leave the non-formation region of the dividing groove in the vertical and horizontal directions. That is, while forming the dividing grooves not only on one main surface side but also on the other main surface side, the fourth dividing groove 114 which is deep and opposed to the shallow first dividing groove 108 is also formed on the other main surface side. Since the shallow third division grooves 113 are formed to face the deep second division grooves 109, it is possible to appropriately leave non-formation regions of division grooves in the vertical and horizontal directions, and a multi-cavity wiring substrate including the mother substrate 101 When an external force is applied, the division in the longitudinal direction and the lateral direction can be made favorable while suppressing unintended cracking of the multi-cavity wiring board.

As shown in FIGS. 1 and 2, the first division groove 108 and the fourth division groove 114 are on the upper and lower surfaces of the mother substrate 101 so as to be at the same position in the vertical direction in plan view (opposite at the top and bottom) The formation (breaking) in the longitudinal direction of the portion of the mother substrate 101 where the division grooves are formed is made easier. In addition, as shown in FIGS. 1 and 2, the second division groove 109 and the third division groove 113 face each other in the horizontal direction in plan view on the upper and lower surfaces of the mother substrate 101 (up and down Is formed to make lateral division (rupture) in the portion where the division groove of the mother substrate 101 is formed easier.

FIG. 3 is a perspective view of a corner portion on one main surface side of a wiring substrate manufactured from the multi-cavity wiring substrate of the present invention, showing the relationship between the first division groove 108 and the fourth division groove 114 in the vertical direction, The relationship between the second division groove 109 and the third division groove 113 in the lateral direction is illustrated in a simplified manner. Then, it is possible to appropriately leave non-formation areas (areas to be fracture surfaces) of division grooves in the vertical and horizontal directions in the mother substrate 101, and when an external force is applied to the multi-cavity wiring substrate including the mother substrate 101 The division in the longitudinal direction and the lateral direction can be made favorable while suppressing unintended cracking of the wiring board.

These dividing grooves have a V-shaped longitudinal cross-sectional shape in order to effectively concentrate stress for dividing the mother substrate 101 on its tip to facilitate generation of cracks. Such dividing grooves are formed on the upper and lower surfaces of the green sheet laminate to be the mother substrate 101 and the boundary 107 of the wiring substrate area 102.
The vertical cross-sectional shape is formed by cutting a V-shaped cutter blade or the like. In this case, the depth of the dividing groove can be adjusted by the cutting depth of the cutter blade. In addition, the angle of the tip (bottom) of the dividing groove can be adjusted by the angle of the tip of the cutter blade (the angle between the side surfaces of the cutter blade).

The positioning of these dividing grooves may be performed, for example, with reference to the mark 119 formed in the dummy area 103 on the extension of the boundary 107 as shown in FIGS. 1 and 2. As a method of forming the mark 119, metal paste may be printed on a green sheet to be a ceramic insulating layer by a screen printing method or the like as in the wiring conductor 106 and the like. Thus, the dividing grooves can be formed on the upper and lower surfaces of the mother substrate 101 with high positional accuracy so as to be at the same position in the vertical direction in plan view (oppositely in the vertical direction).

Further, in the multi-layered wiring board of the present invention, the wiring conductor 106 is separated from the first divided groove 108 and the second divided groove 109 in the wiring substrate region 102, and is connected to the side conductor 112. With such a configuration, the wiring conductor 106 formed on one of the main surfaces is completely separated from the boundary 107 of the wiring substrate area 102 (the area where the division grooves are formed).

  That is, the wiring conductors 106 are not in contact with each other between the adjacent wiring substrate regions 102, and the division of the multi-cavity wiring substrate including the mother substrate 101 can be further improved.

As shown in FIG. 2, in each of the plurality of second holes 111 formed in the mother substrate 101, the wiring conductor 106 is apart from the first division groove 108 and the second division groove 109, and It has a connected structure. The wiring conductor 106 is separated from the first divided groove 108 in the vertical direction, and is separated from the second divided groove 109 by the elongated second hole 111 in the horizontal direction. When the laminated body (not shown) of the resulting ceramic green sheets is fired, the cuts serving as the dividing grooves are closed due to the elasticity of the laminated body, and as a result, the wiring conductor 106
When the metallized layers that are to be in contact with each other make division of the mother substrate 101 along the division grooves difficult to divide, generation of burrs and chips in the obtained wiring board is suppressed.

As shown in FIG. 3, when viewed from the one main surface side (the lower insulating layer 105 side) of the wiring substrate region 102, the bottom of the second hole portion 111 (upper layer along the long side in the wiring substrate region 102) If the wiring conductor is not formed on the exposed portion of the insulating layer 104, there is no metallized layer to be a wiring conductor, and the metallized layers are not in contact with each other. Therefore, the occurrence of burrs and chips can be suppressed more effectively.

Further, even if the second hole portion 111 has a long hole shape and the wiring conductor 106 is separated from the boundary 107 of the wiring substrate region 102, the connection region between the wiring conductor 106 and the side surface conductor 112 of the second hole portion 111 is A wide range can be secured, and an increase in conduction resistance can be suppressed.

That is, when the hole (not shown) is formed only with a circular shape other than the long hole-like second hole 111, the width of the connection region between the hole and the wiring conductor 106 is the size of the circular hole In this way, it is easy to secure a wide connection area by connecting the wiring conductor 106 and the side surface conductor 112 of the second hole 111 such that the second hole 111 is a long hole. As a result, the increase in the conduction resistance can be suppressed.

Furthermore, FIG. 3 shows a structure in which the wiring conductor 106 and the side conductor 112 of the second hole portion 111 are connected only by the straight portion along the long side of the wiring substrate region 102 in the outer peripheral portion of the second hole portion 111. But the second
If the wiring conductor 106 and the side conductor 112 of the second hole portion 111 are connected at a position separated from the second divided groove 109 from the straight portion in the outer peripheral portion of the hole portion 111 to the curved portion, the connection region is more It is easy to ensure a wide range, and it is possible to suppress the increase in the conduction resistance more effectively.

The wiring board according to the present invention has a rectangular shape in a plan view, and the first notch 123 opened on the side surface, and the second notch 124 wider in width than the first notch 123 and opened on one main surface and side surface A substrate 115 provided so as to connect continuously in the thickness direction, and a wiring conductor 106 provided on the substrate 115;
And an inner conductor 125 provided on the inner surface of the second notch 124, and the side surface of the substrate 115 has a fractured surface separated from the one principal surface, and the end on the one principal surface side of the fractured surface and the first 2 has a first side surface 126 of the substrate 115 in contact with the notch 124, and a second side surface 127 of the substrate 115 where the end on the one main surface side of the fracture surface and the second notch 124 are separated ing. With such a configuration, even if the notch has portions with different widths, it is possible to obtain a wiring board in which burrs and chips are suppressed.

FIG. 3 shows a perspective view of a corner portion on one main surface side of a wiring substrate manufactured from the multi-cavity wiring substrate of the present invention, wherein the fracture surface of the first side surface 126 of the substrate 115 and the second side surface 127
The broken surface of is illustrated. Further, FIG. 4 is a plan perspective view of the wiring board.

When dividing the wiring substrate into multiple pieces from the multi-piece wiring substrate including the mother substrate 101 and dividing it into pieces, the substrate 115 in which the second notch 124 is separated from the end on the one main surface side of the fracture surface in the lateral direction. The second divided groove 109 is also formed in the bottom in the second notch 124 (the portion where the upper insulating layer 104 is exposed around the first notch 123). Therefore, division of the multi-cavity wiring board including the mother board 101 in the lateral direction is favorably performed, burrs and chips are suppressed in the lateral direction, and a wiring board excellent in outer dimension accuracy can be realized.

Furthermore, since the first side surface 126 of the substrate 115 in which the end on the one principal surface side of the fracture surface is in contact with the second notch 124 in the longitudinal direction, the inner side surface of the second notch 124 And the inner side surface of the first notch 123 overlap in plan view, so that the formation of a crack during division is not prevented, so division of the multi-cavity wiring substrate including the mother substrate 101 in the vertical direction is good As a result, burrs and chips are suppressed in the vertical direction, and a wiring board with excellent dimensional accuracy can be realized. Therefore, burrs and chips are suppressed by the multi-cavity wiring board including the mother substrate 101 having good division in the vertical and horizontal directions, and a wiring board (package for storing electronic parts) excellent in outer dimension accuracy can be realized.

Further, in the wiring substrate of the present invention, the fracture surface is separated from the other main surface of the substrate 115, and the end of the fracture surface on the other main surface side of the substrate 115 in the second side surface 127 and the other main surface The distance L1 is smaller than the distance L2 between the end of the fracture surface of the first side surface 126 and the other main surface of the substrate 115 on the other main surface side. This is shown as a perspective view of the main part in FIG.

With such a configuration, the frame portion 116 in the lateral direction (corresponding to the long side in FIGS. 1 and 2) on the other main surface side of the substrate 115 may be deformed by the stress when forming the dividing grooves. Be suppressed.
On the other hand, since the frame portion 116 in the longitudinal direction (corresponding to the short side in FIGS. 1 and 2) has relatively high rigidity and is hardly deformed by the stress when forming the dividing groove, the flatness of the sealing surface is It is possible to realize an electronic component storage package having a good airtightness.

The division grooves formed in the mother substrate 101 for manufacturing the wiring substrate including the substrate 115 have a V-shaped vertical cross-sectional shape, and the wiring substrate is formed on the upper and lower surfaces of the green sheet laminate to be the mother substrate 101. It can be formed by cutting a V-shaped cutter blade along the boundary 107 of the region 102 or the like. Under the present circumstances, since the frame part 116 becomes difficult to deform | transform by the stress at the time of forming a dividing groove, so that a dividing groove is shallow, such a structure is effective in ensuring the flatness of a sealing surface. In this case, the depth of the dividing groove can be adjusted by the cutting depth of the cutter blade.

Further, as the angle of the tip of the dividing groove is smaller, the frame portion 116 is less likely to be deformed by the stress at the time of forming the dividing groove. Therefore, the division grooves may be formed on the mother substrate 101 while considering the balance between the depth and the angle of the division grooves. In addition, the angle of the front-end | tip part of a division | segmentation groove can be adjusted with the angle of the front-end | tip part of a cutter blade (the angle which the both-sides of a cutter blade makes).

A metallized layer, for example, is formed on the upper surface of the sealing surface of the substrate 115, and a metal frame (not shown) is joined with a bonding material such as a brazing material, and then the lid 122 made of metal is a metal frame The electronic component 121 joined to the upper surface of the mounting portion 117 by seam welding or the like and accommodated in the mounting portion 117 is hermetically sealed. At this time, the flatness of the frame portion 116 is important. If the flatness is poor, a gap where the brazing material is not joined is formed between the metallized layer and the metal frame, and the mounting portion 117 and the external environment are connected by this gap, resulting in an airtight failure. However, the deformation of the frame portion 116 is suppressed as described above, and a wiring board (package for housing electronic parts) excellent in airtight sealability with good flatness of the sealing surface can be realized.

In the wiring board of the present invention, the wiring conductor 106 is provided on one main surface, and between the end on the one main surface side of the fracture surface and the one main surface in the first side surface 126 and the second side surface 127 And is connected to the inner surface conductor 125. With this configuration, the external circuit board (
When the substrate 115 is mounted on the substrate (not shown), a short circuit of the wiring conductor 106 due to creeping up of solder or splash (splash of solder due to expansion of flux in the solder) or the like is suppressed.

That is, in order to deposit a plating layer on the surface of the exposed wiring conductor of the substrate, the so-called plating wiring 120 for electrically connecting the wiring substrate regions 102 adjacent to each other on the mother substrate 101 for manufacturing the substrate 115 This plating is because a part of the plating wiring 120 is exposed on the side surface of the wiring substrate manufactured by dividing the multiple-piece wiring substrate including the mother substrate 101 into pieces. There is a possibility that the wiring 120 and the wiring conductor 106 having different potentials may be short-circuited due to rising of solder or the like. However, since the wiring conductor 106 is not drawn out between the end on the one main surface side of the fracture surface on the first side surface 126 and the second side surface 127 and the one main surface, the possibility of the short circuit as described above Is reduced.

As shown in FIG. 3, when the wiring conductor 106 is connected to the inner surface conductor 125 and the wiring board is mounted on the external circuit board (not shown), the solder is formed on the one main surface, Also, the wiring conductor 106 and a part of the inner surface conductor 125 connected at the outer peripheral portion of the second notch 124 are crawled up and connected. Furthermore, on the second side surface 127 side (side surface in the long side direction) of the substrate 115, for example, the plating wiring 120 is not led out between the end on the one main surface side of the fracture surface and the one main surface, In the case where the plating wiring 120 is not formed close to the one main surface side of the substrate 115 to be the mounting surface, the plating wiring 120 and the wiring conductor 106 having different potentials do not short.

On the other hand, on the first side surface 126 side (side surface in the short side direction) of the substrate 115, for example, the plating wiring 120 is exposed in part in the fracture surface (layer between the upper insulating layer 104 and the lower insulating layer 105). become. However, on the first side surface 126 side, since the wiring conductor 106 and the second side surface 127 are formed to be separated at one main surface, the plating wiring 120 and the wiring conductor 106 having different potentials are shorted. It becomes difficult. Therefore, it is possible to realize a wiring board (package for storing electronic parts) in which a short circuit due to creeping up of solder or the like or splash is suppressed.

Further, the second notch 124 has a shape obtained by dividing the long hole into four, and even if the wiring conductor 106 is separated from the second side surface 127, the inner surface conductor formed on the side surface of the wiring conductor 106 and the second notch 124 A wide connection area with 125 can be secured. Therefore, it can suppress that the conduction resistance of the wiring conductor 106 and the inner surface conductor 125 becomes large.

That is, if the second notch has a shape obtained by dividing the circular hole into four, the width of the connection region between the second notch and the wiring conductor 106 is determined by the size of the circular hole. As described above, since the second notch 124 has a shape obtained by dividing the elongated hole into four, it is easy to secure a wide connection region, and as a result, the increase in the conduction resistance is suppressed. .

Furthermore, in FIG. 3, the configuration in which the wiring conductor 106 and the inner conductor 125 formed on the side surface of the second notch 124 are connected only by the straight portion along the long side of the substrate 115 in the outer peripheral portion of the second notch 124 Although shown, the wiring conductor 106 and the inner surface conductor 125 of the second notch 124 are connected at a position away from the second side surface 127 from the straight portion to the curved portion in the outer peripheral portion of the second notch 124. For example, it is easy to secure a wide connection region, and it is possible to suppress the increase in conduction resistance more effectively.

The present invention is not limited to the examples of the embodiments described above, and various modifications are possible. For example, although the multi-piece wiring board has been described by way of an example having the concave mounting portion 117 in each wiring substrate region 102 as an example, it may be a flat plate without such a mounting portion 117 Alternatively, a multi-cavity wiring board may be used in which the insulating layer is formed of three or more layers.

Also, although a metallized layer is formed on the frame portion 116 of the wiring substrate (package for storing electronic components) and a metal frame is joined on the metallized layer, a metallized layer is formed on the frame portion 116 and the metallized layer is formed. Alternatively, the lid 122 made of metal may be joined directly to the above. Furthermore, the metallized layer may not be formed in the frame portion 116, and the non-metallic lid 122 may be bonded with glass or resin.

101 ... Mother board
102 ··· Wiring board area
103 ... dummy area
104 ・ ・ ・ upper insulating layer
105 ・ ・ ・ Lower insulating layer
106 ··· Wiring conductor
107 ... boundary
108 ··· First dividing groove
109 ··· Second split groove
110: First hole
111 ... second hole
112 ・ ・ ・ Side conductor
113 ··· Third dividing groove
114 ··· Fourth dividing groove
115: Substrate
116 ... frame part
117 ・ ・ ・ Mounting part
119 ... mark
120 ... Wiring for plating
121 ... electronic parts
122 ... Lid
123 ... 1st notch
124 ・ ・ ・ 2nd notch
125 ・ ・ ・ Inner conductor
126 ... 1st side
127 ... second side

Claims (6)

A mother substrate on which a plurality of wiring board areas are formed in the vertical and horizontal directions and a dummy area is formed surrounding the wiring board area;
Wiring conductors formed in each of the plurality of wiring board regions;
A first divided groove formed in the boundary between the wiring substrate regions on one main surface side and formed in the vertical direction of the wiring substrate region, and a second divided groove formed in the lateral direction of the wiring substrate region;
First holes formed at each corner of the wiring substrate area;
A long hole is formed in each corner portion of the wiring substrate region along the lateral direction of the wiring substrate region so as to be continuously connected to the first hole portion, and is open on the one main surface side of the mother substrate The second hole in the shape of
And side conductors formed on side surfaces of the second hole portion,
The first divided groove is formed halfway to the depth direction of the second hole, and the second divided groove penetrates the second hole and extends in the depth direction of the first hole. A multi-piece wiring board characterized by being formed halfway. A third division groove formed on the other main surface side of the mother substrate at the boundary between the wiring substrate regions and formed in the lateral direction of the wiring substrate region and the vertical direction of the wiring substrate region It has four division grooves,
The multi-cavity wiring board according to claim 1, wherein the third divided groove is formed to have a smaller depth than the fourth divided groove. The wiring conductor according to claim 1, wherein the wiring conductor is separated from the first dividing groove and the second dividing groove in the wiring substrate region and connected to the side conductor. Custom-made wiring board. In a planar view, the first notch opened in the side face and the second notch opened in the one main surface and the side face are continuously connected in the thickness direction. A provided substrate,
A wiring conductor provided on the substrate;
And an inner conductor provided on an inner surface of the second notch,
The side surface of the substrate has a fractured surface separated from the one main surface;
A first side surface of the substrate in which an end on the one main surface side of the broken surface is in contact with the second notch;
A wiring board comprising: an end of the fracture surface on the side of the one main surface; and a second side surface of the substrate at which the second notch is separated. The fracture surface is separated from the other main surface of the substrate,
The distance between the end on the other main surface side of the broken surface in the second side surface and the other main surface is the end on the other main surface side of the broken surface in the first side surface, and The wiring board according to claim 4, wherein the wiring board is smaller than the distance to the other main surface. The wiring conductor is provided on the one main surface, and is drawn between an end on the one main surface side of the broken surface and the one main surface in the first side surface and the second side surface. The wiring substrate according to claim 4 or 5, wherein the wiring substrate is connected to the inner surface conductor.

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