JP6495701B2 - Electronic component storage package and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component storage package for hermetically storing electronic components such as piezoelectric vibrators and semiconductor elements, and a method for manufacturing the electronic component storage package.

  Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibrator or a semiconductor element, there is generally a mounting portion in which the electronic component is stored in an insulating substrate such as a rectangular plate made of a ceramic sintered body or the like. The provided one is used. A lid is bonded to the upper surface of the insulating substrate so as to close the mounting portion. Such an electronic component storage package includes a flat lower insulating layer having an electronic component mounting portion on the upper surface, and a frame-shaped upper insulating layer laminated around the mounting portion on the upper surface of the lower insulating layer. It is basically composed of an insulating substrate having a wiring conductor formed from the mounting portion to the lower surface of the lower insulating layer and the like. A portion of the wiring conductor provided on the lower surface of the lower insulating layer (lower surface of the insulating substrate) functions as an external connection conductor (external connection conductor).

  Then, after the electronic component is mounted on the mounting portion and each electrode of the electronic component is electrically connected to the wiring conductor, the mounting portion is sealed with a lid or the like to manufacture the electronic device.

  Side conductors are formed in the vertical direction at each corner on the side of the lower insulating layer of the insulating substrate. For example, the side conductor is formed so as to cover the inner side surface of the groove formed in each corner portion, and electrically connects the portion formed in the mounting portion of the wiring conductor and the external connection conductor to each other. It acts as a conduction path. Thereby, for example, an electronic component is electrically connected to the external circuit board.

Japanese Patent Laid-Open No. 2003-133454

  However, in recent years, electronic component storage packages have been increasingly miniaturized. As a result, the connection range (connection region) between the side conductors and the external connection conductors has become narrower. For example, the side conductors and the external connection conductors are caused by positional deviation of the grooves in which the side conductors are arranged. The problem that the connection reliability is likely to decrease is becoming more prominent.

An electronic component storage package according to one aspect of the present invention includes a lower insulating layer having a mounting portion on which an electronic component is mounted on an upper surface, and a frame-like shape laminated on the lower insulating layer so as to surround the mounting portion. The upper insulating layer and an external connection conductor provided on the outer periphery of the lower surface of the lower insulating layer are provided, and an upper groove is formed on the outer surface of the upper insulating layer from the lower end to the upper end of the side surface. A lower groove having a diameter larger than that of the upper groove is formed on a side surface of the lower insulating layer from a lower end to an upper end of the side surface at a position overlapping the upper groove in a plan view. together provided upward from the lower end, further comprising a buried conductor lower end is connected to the external connection conductor, and have a slope portion in which the buried conductors are inclined to the upper insulating layer side, The embedded conductor is Serial provided toward the upper end from the lower end of the lower groove, and the side to expose the buried conductor and the inner surface of the upper groove that is located on the same plane.

According to one aspect of the present invention, there is provided a method for manufacturing an electronic component storage package, the steps of preparing first and second ceramic green sheets, and forming first through holes penetrating in the thickness direction in the first ceramic green sheets. A step of filling the inner surface of the first through hole with a metal paste, a step of forming a second through hole penetrating in the thickness direction in the second ceramic green sheet, the first ceramic green sheet and the second A step of laminating a ceramic green sheet so that the first through hole and the second through hole are vertically continuous, and a laminate, and the metal paste in the first through hole in a plan view. A step of punching a part in the thickness direction of the first ceramic green sheet; and a main surface of the laminate on the first ceramic green sheet side, the end portion of which is the first ceramic green sheet A step of applying a metal paste to connect to the metal paste in the through hole, the first ceramic green sheet side of the main surface of the laminate, increases the depth toward the inside of the first through hole Forming a dividing groove so as to have a region to be formed in the metal paste, and dividing the laminated body in the thickness direction of the laminated body so as to pass through the first through hole and the second through hole. doing.

According to an electronic component storage package of one aspect of the present invention, a lower insulating layer having a mounting portion on which an electronic component is mounted on an upper surface, and a frame-like shape laminated on the lower insulating layer so as to surround the mounting portion. It comprises an upper insulating layer and an external connection conductor provided on the outer peripheral portion of the lower surface of the lower insulating layer, and an upper groove is formed on the outer surface of the upper insulating layer from the lower end to the upper end of the outer surface, On the side surface of the lower insulating layer, a lower groove having a diameter larger than that of the upper groove is formed from the lower end to the upper end of the side surface at a position overlapping the upper groove in plan view, and is provided upward from the lower end of the inner side surface of the lower groove. together and further comprises a buried conductor lower ends are connected to the external connection conductor, and have a slope portion which buried conductors is inclined upper insulating layer side, toward the upper end embedded conductors from the lower end of the lower groove Provided And side to expose the inner surface and the buried conductors of the upper grooves that are located on the same plane. As a result, the embedded conductor as the side conductor that electrically connects the wiring conductor and the external connection conductor is connected to the external connection conductor in a wider range not only on the lower surface of the lower insulating layer but also in the thickness direction of the lower insulating layer. can do. Therefore, even if the electronic component storage package is downsized, a sufficient connection region between the side conductor (exposed portion on the side surface of the embedded conductor) and the external connection conductor can be secured, and the connection reliability between the two can be improved.

According to the method for manufacturing an electronic component storage package of one aspect of the present invention, since the above-described steps are included, the electrical conductivity between the side conductor and the external connection conductor is reduced due to the downsizing of the electronic component storage package. In addition to suppressing grounding and disconnection, the stability and shielding performance of the ground for the electronic component can be improved, and an electronic component storage package having excellent adhesion of the plating layer to each wiring board by electroplating can be manufactured.

(A) is a top view which shows the electronic component storage package of embodiment of this invention, (b) is sectional drawing in the X-X 'line | wire of (a), (c) is a bottom view. It is a perspective view of the lower surface side of the principal part in the corner part which shows the multi-piece wiring board at the time of manufacturing the electronic component storage package of embodiment of this invention. It is a perspective view of the lower surface side of the principal part in the corner part which shows the multi-piece wiring board at the time of manufacturing the other electronic component storage package of embodiment of this invention. It is a perspective view of the lower surface side of the principal part in the edge part which shows the multi-cavity wiring board at the time of manufacturing the other electronic component storage package of embodiment of this invention. It is a perspective view of the lower surface side of the principal part in the corner part which shows the multi-piece wiring board at the time of manufacturing the other electronic component storage package of embodiment of this invention. (A)-(e) is sectional drawing which shows the manufacturing method of the electronic component storage package of embodiment of this invention in order of a process. (A) And (b) is sectional drawing following FIG. 6 which shows the manufacturing method of the electronic component storage package of embodiment of this invention in order of a process.

  An electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view showing an example of an embodiment of an electronic component storage package according to the present invention, FIG. 1B is a cross-sectional view taken along the line XX ′ of FIG. (C) is a bottom view.

In FIG. 1, a mounting portion 102 is provided on an insulating substrate 101. The mounting part 102 has an electronic component 103.
Is installed. The insulating substrate 101 includes an upper insulating layer 104 and a lower insulating layer 105 that are stacked on each other. On the side surface of the insulating substrate 101, an upper groove 106 and a lower groove 107 are provided. A buried conductor 108 is disposed in the lower groove 107. An external connection conductor 109 directly connected to the embedded conductor 108 is provided on the lower surface of the insulating substrate 101. Further, the wiring board of this example includes the auxiliary conductor 110 whose end face is exposed on the side surface of the insulating substrate 101, the frame-shaped metallized layer 111 provided on the upper surface of the insulating substrate 101, and the wiring conductor 112 positioned in the mounting portion 102. In addition. In this electronic component storage package, the lid 113 is bonded onto the insulating substrate 101 by the bonding material 114, and the electronic component 103 is hermetically sealed.

In this embodiment, the insulating substrate 101 has a concave mounting portion 102 in a sectional view in the thickness direction. In this electronic component storage package, an electronic component 103 such as a piezoelectric vibration element is hermetically sealed to form an electronic device (no reference). The lid 113 that seals the mounting portion 102 is seen through in FIG. 1 for easy viewing.

The insulating substrate 101 is formed by laminating an upper insulating layer 104 serving as a frame portion on a lower insulating layer 105 serving as a flat base. In the following description, a frame portion and a base portion may be used instead of the upper insulating layer 104 and the lower insulating layer 105. In a plan view, the frame portion surrounds the mounting portion 102 on the upper surface of the base portion. A concave mounting portion 102 for accommodating the electronic component 103 is formed by the inner side surface of the frame portion and the base portion exposed inside the mounting portion 102.

  The base and the frame are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The insulating substrate 101 is, for example, a rectangular shape having a one-side length of about 1.6 to 10 mm and a thickness of about 0.3 to 2 mm in plan view, and has a concave mounting portion as described above on the upper surface. 102.

Insulating substrate 101 is a case where the base and the frame are made of an aluminum oxide sintered body,
Add appropriate organic binder, solvent, plasticizer, etc. to raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to make a slurry, and for example, this is a sheet such as doctor blade method or roll calender method A plurality of ceramic green sheets are obtained by forming into a sheet shape by a forming method, and then a part of the ceramic green sheets are subjected to appropriate punching to form into a frame shape, and a flat plate not formed into a frame shape It can be manufactured by stacking up and down so that the frame-shaped ceramic green sheets are respectively positioned on the upper surface of the shaped ceramic green sheets and firing the laminate at a high temperature.

The insulating substrate 101 is manufactured, for example, by being formed as a mother substrate (not shown) in which substrate regions each serving as an individual insulating substrate 101 are arranged and then divided into individual pieces. The mother substrate is a flat insulating layer (not shown) having a plurality of regions that are stacked on each other to be the lower insulating layer 105.
And an insulating layer (not shown) having a plurality of regions (a plurality of openings are arranged) each serving as the upper insulating layer 104 including a frame portion. Details of the embodiment as a multi-chip substrate will be described later.

The upper insulating layer 104 has a frame-like metallized layer 111 on its upper surface and an upper groove 106 on its outer surface. The lower insulating layer 105 has a wiring conductor 112, a buried conductor 108 and an external conductor as a conductive path for electrically connecting the electronic component 103 mounted on the mounting portion 102 and an external electric circuit (not shown). A connecting conductor 109 is provided. In this example, an upper groove 106 and a lower groove 107 are provided in the corner portion of the insulating substrate 101, and an auxiliary conductor 110 is formed along the embedded conductor 108 at the upper end portion of the lower groove 107.

Here, when the electronic device is such that a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) are accommodated in the mounting portion 102, a plurality of electronic devices In order to form a mounting portion (not shown) having a stepped inner surface on which a component is mounted, the upper insulating layer 104 may be composed of two or more insulating layers.

The mounting portion 102 has a quadrangular shape in plan view in accordance with, for example, a square plate-shaped electronic component 103. In the example of FIG. 1, a pair of wiring conductors 112 are formed at two corner portions adjacent to each other of the rectangular mounting portion 102. The wiring conductor 112 functions as a connection conductor for connecting an electrode (not shown) of the electronic component 103 such as a crystal resonator element mounted on the mounting portion 102. If the electronic component 103 is a crystal resonator element, its outer shape is generally quadrangular in plan view, and a pair of electrodes (not shown) for connection are formed at the corners of its main surface. The wiring conductor 112 is formed at the corner portion of the mounting portion 102 so that such electrodes can be connected easily and reliably.

Each electrode of the electronic component 103 and the wiring conductor 112 are connected via a bonding material 114 such as a conductive adhesive. That is, as shown in FIG. 1A, the electronic component 103 is formed such that the pair of electrodes formed at the corners of the main surface of the electronic component 103 faces the pair of wiring conductors 112 formed on the mounting portion 102. Is positioned on the mounting portion 102, and the bonding material 114 previously attached to the wiring conductor 112 is heated and cured, the electrode of the electronic component 103 and the wiring conductor 112 are connected.

Note that the wiring conductor 112 is described in the example of this embodiment in which a crystal resonator element is used as the electronic component 103, and thus the wiring conductor 112 is formed at the above position. When mounting a component (not shown) or mounting a plurality of other electronic components, the position and shape may be changed according to the arrangement of the electrodes of the electronic component. Examples of such other electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, and resistive elements.

For example, the wiring conductor 112 is provided so as to be electrically led out from the mounting portion 102 or its periphery to the outer surface of the insulating substrate 101. As described above, the wiring conductor 112 functions as a part of a conductive path for electrically connecting each electrode of the electronic component 103 mounted on the mounting portion 102 to an external electric circuit. In the example shown in FIGS. 1A to 1C, the wiring conductor 112 is formed on the lower surface of the insulating substrate 101 (lower insulating layer 105) through the embedded conductor 108 formed in the lower insulating layer 105 from the mounting portion 102. Electrically derived and electrically connected to an external connection conductor 109 formed on the lower surface.

Further, a frame-like metallized layer 111 is deposited on the upper surface of the insulating substrate 101 (upper insulating layer 104). The frame-shaped metallized layer 111 surrounds the mounting portion 102, and a lid 113 and a metal frame (not shown) are joined to the frame-shaped metallized layer 111. Then, the electronic component 103 is accommodated and mounted on the mounting portion 102, and the electrode of the electronic component 103 is connected to the wiring conductor 112 with a bonding material 114 such as a conductive adhesive, and then a lid is formed on the upper surface of the frame-like metallized layer 111. By joining 113, the electronic component 103 is hermetically sealed in a container formed of the lid body 113 and the insulating substrate 101 to form an electronic device (a crystal oscillator or the like). Further, after the metal frame is brazed to the frame-shaped metallized layer 111 in advance, the lid 113 may be joined on the metal frame. In this embodiment, the lid 113 is bonded to the upper insulating layer 104 through the brazing material. However, the lid 113 is bonded by a sealing material such as glass or resin. Also good.

The frame-like metallized layer 111 functions as a metal member for joining the lid 113 to the insulating substrate 101 by a method such as seam welding or electron beam welding. The lid 113 is, for example, a square plate,
It is made of a metal material such as a nickel alloy or iron-nickel-cobalt alloy or a ceramic material, and the outer peripheral portion of the lower surface is formed into a frame-like metallized layer 111 by a brazing method or a welding method (for example, seam welding or electron beam welding). Be joined. When the lid 113 is made of a ceramic material, a method such as a metallization method or a plating method is applied to the region to be a joint surface of the lid 113 so that the lid 113 can be joined to the frame-like metallization layer 111 by a brazing method or a welding method. As a result, a metal layer (not shown) for bonding is formed.

The frame-like metallized layer 111 is, for example, a part (for example, the electronic component 103) of the wiring conductor 112 (such as a part extending from the mounting part 102 as described above) serving as a conduction path via the embedded conductor 108 or the like.
To which the grounding electrode is connected) may be electrically connected. In this case, for example, the conductor area for grounding can be increased, and the ground potential of the electronic component 103 can be further stabilized.

The frame-like metallized layer 111 may be further electrically connected to the external connection conductor 109. The electrical connection between the frame-shaped metallized layer 111 and the external connection conductor 109 is performed not only through the embedded conductor 108 formed by filling the inside of the lower groove 107 but also through an auxiliary conductor 110 described later.

The conductor portions such as the wiring conductor 112, the frame-like metallized layer 111, and the external connection conductor 109 are made of a metallized layer such as tungsten, molybdenum, manganese, copper, or silver. Such a metal material paste (metal paste) used as a metallized layer is formed by printing in a predetermined pattern on a ceramic green sheet used as a base substrate and simultaneously firing the ceramic green sheets.

The wiring conductor 112, the frame-like metallized layer 111, and the external connection conductor 109 prevent oxidative corrosion and connect the wiring conductor 112 and the electrode of the electronic component 103 or the external connection conductor 109.
A nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm on the exposed surfaces, in order to make connection between the circuit board and an external electric circuit easier or stronger. May be sequentially applied.

The embedded conductor 108 is also formed by a method such as filling with a metal paste similar to the above. Details of the method of forming the buried conductor 108 will be described later.

For example, as described above, the electronic component storage package may be manufactured in the form of a multi-piece board (multi-piece wiring board). FIG. 2 shows an example of a multi-piece wiring board for manufacturing an electronic component storage package. FIG. 2 is a perspective view of the main part (corner part) of the multi-piece wiring board as seen from the lower surface. In FIG. 2, the same reference numerals are given to the same parts as in FIG. As described above, the multi-cavity wiring board has a mother board in which a plurality of board regions to be the insulating board 101 of the individual electronic component storage package are arranged vertically and horizontally.

  Also for the multi-piece wiring board, the same parts as those of the individual electronic component storage package are denoted by the same reference numerals with the same reference numerals. For example, the lower insulating layer and the upper insulating layer forming the mother substrate of the multi-piece wiring board are also referred to as the lower insulating layer 105 and the upper insulating layer 104 as in the case of the individual pieces.

In this case, the upper groove 106 in the individual electronic component storage package is, for example, the upper groove so as to straddle the boundary 115 of each substrate region of the ceramic green sheet serving as the upper insulating layer 104 of the mother substrate of the multi-piece wiring substrate. It can be formed by providing a through-hole penetrating the insulating layer 104 in the thickness direction.

Similarly, the lower groove 107 has a through hole penetrating the lower insulating layer 105 in the thickness direction so as to straddle the boundary 115 of each wiring board region of the ceramic green sheet that becomes the lower insulating layer 105 of the mother board. It can be formed by providing. Then, the through hole to be the upper groove 106 and the through hole to be the lower groove 107 are arranged so as to overlap with each other in plan view, and become the ceramic green sheet to be the upper insulating layer 104 of the mother substrate and the lower insulating layer 105, respectively. A ceramic green sheet is laminated and fired. As described above, a mother substrate having through holes to be the upper groove 106 and the lower groove 107 is manufactured. If this mother substrate is divided at the boundary 115 of each substrate region, the through holes to be the upper groove 106 and the lower groove 107 are divided in the vertical direction, and the side surfaces of the individual insulating substrate 101 (example of FIG. 2) In this case, a groove portion in which the upper groove 106 and the lower groove 107 communicate with each other is formed in the corner portion. The firing may be performed after being divided into individual electronic component storage packages.

The manufactured individual electronic component storage package has the upper groove 106 and the lower groove 107 on the side surface of the insulating substrate 101 as described above. The upper groove 106 and the lower groove 107 are vertically connected to each other to form one groove (so-called castellation). Further, the lower groove 107 has a larger diameter than the upper groove 106. The diameters of the upper groove 106 and the lower groove 107 are the dimensions of the upper groove 106 and the lower groove 107 in plan view (when the electronic component storage package is viewed from above). It is an opening dimension at the end of the groove 107. For example, if the upper groove 106 and the lower groove 107 are formed in the sides of the insulating substrate 101 and are each semicircular in plan view, the diameter is the diameter of the opening. Further, if the upper groove 106 and the lower groove 107 are formed at the corners of the insulating substrate 101 and each have a quadrant shape in plan view, the opening diameter is √2 times the radius thereof. The groove can be regarded as having a stepped portion corresponding to the difference in diameter between the upper groove 106 and the lower groove 107 in the middle of the length direction.

In addition, the electronic component storage package of the embodiment further includes an embedded conductor 108 whose lower end is connected to the external connection conductor 109. In other words, the embedded conductor 108 is provided on the inner surface of the lower groove 107 having a relatively large diameter so as to fill the step, for example. The embedded conductor 108 is directly connected to the external connection conductor 109 to form a part of the conductive path for electrically connecting the electronic component 103 and an external electric circuit (not shown). In this conductive path, not only the lower surface of the lower insulating layer 105 but also the direction along the inner surface of the lower groove 107 (the length direction of the lower groove 107), the embedded conductor 108 and the external connection conductor 109 are connected to each other over a wide range. ing.

That is, for example, as shown in FIG. 2, the width of the buried conductor that is a conduction path formed in the lower groove 107 (the distance between the inner circumference and the outer circumference of the buried conductor 108 in plan view) is larger than that of a conventional side conductor. large. For this reason, a wide area on the outer peripheral side of the embedded conductor 108 is connected to the external connection conductor 109, and the embedded conductor 108 as a side conductor is connected to the external connection even if the electronic component storage package (insulating substrate 101) is downsized. A sufficient connection area with the conductor 109 can be secured, and the connection reliability between the two can be improved.

  The external connection conductor 109 only needs to be connected to the outer peripheral portion of the embedded conductor 108, but various methods can be selected for a method of forming the connection structure. For example, depending on the forming method (metal paste printing method, etc.) of the conductor parts such as the embedded conductor 108 and the external connection conductor 109 in the raw processing process (process of processing the ceramic green sheet and applying the metal paste described above) The embedded conductor 108 may be formed after the external connection conductor 109 is formed, or the external connection conductor 109 may be formed so as to cover the embedded conductor 108 after the embedded conductor 108 is formed.

In the mother substrate on which the substrate regions to be the insulating substrate 101 are arranged, dividing grooves 116 are formed on the main surface in order to divide each substrate region into pieces. In recent years, individual electronic component storage packages have become small, and for example, an insulating substrate 101 having a vertical and horizontal dimension of 1.6 × 1.2 mm or less in plan view is manufactured. With the downsizing of this electronic component storage package, the width of the frame has become very small, and the part (the thickness of the frame, metal frame, etc.) that separates the mounting part 102 from the external environment It is getting smaller. Therefore, in order to form the dividing groove 116 with high positional accuracy, a technique for forming the dividing groove 116 by laser processing has been proposed.

As described above, when the dividing grooves 116 are formed on the mother board by laser processing, when the dividing grooves 116 are formed at the boundary 115 of each substrate region of the mother board, a conventional electronic component storage package is manufactured. Therefore, the following problems may occur in the case of the multi-cavity wiring board. That is, the side conductor (not shown) of the conventional electronic component storage package is thinner than the embedded conductor 108 of the electronic component storage package of the embodiment. If such a package for storing electronic components is manufactured in the form of a multi-piece wiring board, its lower groove 107
There is a possibility that a part of the inner side conductor is cut. In this case, when a part of the side conductor is cut, the conduction resistance of the conductive path for electrically connecting the electronic component 103 and the external electric circuit is increased,
Or a malfunction such as disconnection occurs. When such a problem occurs, such as the wiring conductor 112,
When conducting electroplating on a conductor (not shown) that is to be electrically connected to the side conductor, there is a problem that the plating layer is not deposited on the conductor in at least a part of the plurality of wiring board regions. There was a possibility.

On the other hand, when the embedded conductor 108 including the side conductor is provided in the lower groove 107 as in the electronic component storage package of the embodiment, as shown in FIG. And the distance between the upper end and the lower end) is relatively large, and the possibility that a part of the conductor portion is cut in the thickness direction is reduced. Here, a precondition for not cutting the embedded conductor 108 is that the formation depth of the division grooves 116 other than the grooves by laser processing is smaller than the thickness of the lower insulating layer 105. For example, the depth of the dividing groove 116 is formed to be about 30 to 70% with respect to the thickness of the lower insulating layer 105.

Further, for example, as shown in FIG. 2, the structure in which the region where the depth of the dividing groove 116 does not change widely stays inside the buried conductor 108, so that the effect of suppressing increase in conduction resistance and disconnection of the buried conductor 108 can be obtained. It works more effectively.

Further, the embedded conductor 108 may be provided from the lower end to the upper end of the lower groove 107, and the inner side surface of the upper groove 106 and the exposed side surface of the embedded conductor 108 may be located on the same surface. In other words, a stepped portion corresponding to the difference in diameter between the lower groove 107 and the upper groove 106 may be filled with the buried conductor 108. In the case of such a structure, for example, in the state of a multi-piece wiring board, when depositing a nickel plating layer, a gold plating layer, etc. on the surface of the embedded conductor 108 etc. exposed in each board region, the upper groove The circulation of the plating solution in the through holes serving as 106 and the lower groove 107 becomes better. Therefore, it is possible to satisfactorily deposit the plating layer on the exposed surface of the embedded conductor 108 formed on the inner surface of the portion of the through hole that becomes the lower groove 107.

That is, as the electronic component storage package is downsized, the width of the frame portion has become smaller, and accordingly, the width of the upper groove 106 and the lower groove 107 has also decreased. And when the width of these grooves becomes narrow, the circulation of the plating solution in the through-holes that become the grooves tends to deteriorate. On the other hand, the surface of the embedded conductor 108 formed on the inner surface of the through hole serving as the lower groove 107 and the surface of the upper groove 106 (surface on which no conductor is attached) are located on the same surface. And
No step is formed from the upper groove 106 to the lower groove 107. Therefore, the circulation of the plating solution in the through hole becomes extremely good, and the plating layer is satisfactorily applied to the exposed surface of the embedded conductor 108.

The plating layer is deposited on the exposed surfaces of the conductors such as the wiring conductor 112, the embedded conductor 108, and the external connection conductor 109 in each wiring board region, for example, by employing an electroplating method as described above. The mother board provided with the conductor is immersed in a nickel plating bath or a gold plating bath, and an external power source is connected to a common wiring layer (not shown) formed on the mother board, for example. The common wiring layer is collectively connected to the conductors in a plurality of substrate regions. A predetermined electric field is applied to the conductors electrically connected in common via lead wires (not shown) connected to the common wiring layer, and nickel or gold is deposited on the exposed conductor surface. . Electroplating is performed as described above. In this case, since each of the conductors is commonly connected to the common wiring layer through the lead wire, all the wiring board regions are exposed by connecting an external power source for electroplating to the common wiring layer. An electric field for plating can be commonly applied to the conductors. Therefore, the workability of electroplating becomes easy.

As described above, in order to form the surface of the embedded conductor 108 formed on the inner surface of the through hole to be the lower groove 107 and the surface of the upper groove 106 on the same surface, for example, lower insulation A through hole to be the lower groove 107 is provided so as to straddle the boundary 115 of each wiring board region of the ceramic green sheet to be the layer 105, and a metal paste (being an embedded conductor 108 in the through hole to be the lower groove 107 ( Fill (not shown). Further, the ceramic green sheet to be the lower insulating layer 105 and the ceramic green sheet to be the upper insulating layer 104 so that the through hole to be the lower groove 107 and the formation position of the through hole to be the upper groove 106 overlap in plan view Are positioned and laminated, and then the formation position of the through hole to be the upper groove 106 and the embedded conductor 108 embedded in the through hole of the lower groove 107 may be punched together. This punched surface becomes the surface (inner surface) of the embedded conductor 108 on the inner surface of the upper groove 106 and the inner surface of the lower groove 107. As a result, a mother substrate in which the inner side surface of the upper groove 106 and the exposed side surface of the buried conductor 108 are located on the same surface can be manufactured.

  Further, the exposed side surface of the buried conductor 108 is located outside the inner side surface of the upper groove 106, and a part of the lower surface of the upper insulating layer 104 is exposed along the exposed side surface of the buried conductor 108. Good. In other words, the diameter of the upper groove 106 is reduced to the extent that the lower surface of the upper insulating layer 104 is exposed inside the buried conductor 108. Alternatively, the diameter of the lower groove 107 is relatively large. Alternatively, the width of the embedded conductor 108 (the distance between the inner periphery and the outer periphery of the embedded conductor 108 in plan view) is reduced. FIG. 3 shows an example in which a large number of electronic component storage packages of this example are manufactured in the form of a wiring board. FIG. 3 is a perspective view of the main part of the multi-piece wiring board when the electronic component storage package according to another embodiment is viewed from the lower surface. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. In the multi-cavity wiring board, the diameter is relatively large below the through holes that form the upper groove 106 and the lower groove 107, and the diameter is relatively small on the upper side.

In such a structure, for example, since the diameter of the upper groove 106 is relatively small, the opening width of the lower groove 107 of the lower insulating layer 105 is increased while increasing the width of the upper insulating layer 104 as a frame portion. it can. That is, it is easy to obtain a structure in which the width of the frame portion of the upper insulating layer 104 is large and the mounting portion 102 is excellent in hermetic sealing. At the same time, the opening of the lower groove 107 (lower part of the through hole) formed in the lower insulating layer 105 can be enlarged. Therefore, for example, when plating the embedded conductor 108 in the lower groove 107 in the state of a multi-piece wiring board, the circulation of the plating solution in the through hole becomes much better, and the plating layer is formed of the embedded conductor 108. Good deposition on the exposed surface.

Further, since it is easy to increase the outer diameter of the embedded conductor 108 (the region in contact with the lower groove 107), the width of the connection with the external connection conductor 109 can be reduced even if the thickness of the embedded conductor 108 is relatively small. It is easier to widen. Therefore, embedded conductor 108 (including side conductors)
And the external connection conductor 109 can be more sufficiently secured, and the connection reliability between them can be further effectively improved.

Further, when the dividing groove 116 is formed on the mother substrate by laser processing, the exposed region of the lower surface of the upper insulating layer 104 acts as a shielding portion, so that the possibility that a part of the side conductor is cut is reduced. . That is, as shown in FIG. 3, when the dividing groove 116 a is formed from the main surface side of the upper insulating layer 104 by laser processing, the embedded conductor 108 is shielded by the exposed region on the lower surface of the upper insulating layer 104. Thereby, the possibility that the embedded conductor 108 is cut is reduced.

  Further, when the dividing groove 116b is formed from the main surface side of the lower insulating layer 105 by laser processing, the embedded conductor 108 has a thickness, and the possibility that the embedded conductor 108 is cut is reduced. As shown in FIG. 3, when the region where the depth of the dividing groove 116 changes is present inside the buried conductor 108, the formed auxiliary conductor 110 acts more effectively as a conduction path. The effect of suppressing an increase in the conduction resistance of 108 and disconnection is further enhanced.

Further, as shown in FIG. 3, an auxiliary conductor 110 may be formed along the embedded conductor 108. The auxiliary conductor 110 is connected to, for example, the upper end portion of the embedded conductor 108, and the embedded conductor 108 and the auxiliary conductor 110 are combined into one conductor. In other words, the auxiliary conductor 110 is a portion having a function of substantially expanding the diameter of the end portion of the embedded conductor 108 outward. In this case, the auxiliary conductor 110 has a structure in which the embedded conductor 108 is electrically connected over the entire circumference, and even if the thickness of the embedded conductor 108 is relatively small, the embedded conductor 108 (the above-mentioned integrated conductor 110 including the auxiliary conductor 110 is combined). The possibility that the conductor is turned off is reduced more effectively.

The electronic component storage package (multi-piece wiring board) having such a structure can be manufactured as follows, for example. A through-hole serving as the upper groove 106 is provided so as to straddle the boundary 115 between the substrate regions of the ceramic green sheet serving as the upper insulating layer 104. Furthermore, a through-hole serving as a lower groove 107 having a diameter larger than that of the through-hole serving as the upper groove 106 is provided so as to straddle the boundary 115 of each substrate region of the ceramic green sheet serving as the lower insulating layer 105. A metal paste (not shown) that becomes the embedded conductor 108 is filled in the through hole that becomes the groove 107. Further, a metal paste that becomes a buried conductor 108 is formed around the lower groove 107 so as to have a smaller diameter than the through hole that becomes the lower groove 107 and a larger diameter than the through hole that becomes the upper groove 106. Next, the center of the through hole that becomes a side conductor (not shown) is punched out.

Here, the embedded conductor 108 is formed by the filling method, but the filling method is not limited to the filling method, and may be formed by a suction method in which the coating thickness is adjusted by the viscosity of the metal paste. Then, the ceramic green sheet serving as the lower insulating layer 105 and the ceramic green sheet serving as the upper insulating layer 104 so that the center of the through hole serving as the lower groove 107 and the center of the through hole serving as the upper groove 106 overlap in plan view. Can be formed by positioning and stacking. Thus, a mother substrate in which the lower surface of the upper insulating layer 104 is exposed along the exposed side surface of the buried conductor 108 can be manufactured.

In addition, the electronic component storage package of each of the above embodiments is disposed between the upper insulating layer 104 and the lower insulating layer 105 so as to be along the outer periphery of the embedded conductor 108 when viewed from below, and the embedded conductor is interposed between the layers. An auxiliary conductor 110 connected to 108 may be further provided.

  In the case of such a structure, for example, when manufacturing a package for storing electronic components in the form of a multi-piece wiring board, the auxiliary conductor 110 is made of laser when forming the dividing groove 116 by laser processing on the mother board. Since it is formed between the upper insulating layer 104 and the lower insulating layer 105 that do not reach, the entire conductor including the embedded conductor 108 and the auxiliary conductor 110 may be cut more effectively in the thickness direction, etc. Reduced.

That is, the vicinity of the surface of the through-hole that becomes the embedded conductor 108 in the mother board is irradiated to the entire thickness direction of the embedded conductor 108 when the laser moves through the through-hole depending on the laser processing conditions, and the embedded conductor 108 is mistakenly irradiated. Could be cut off. However, even in such a case, in the case of this embodiment, since the laser is difficult to be irradiated up to the auxiliary conductor 110, the possibility that the embedded conductor 108 is cut is more effectively reduced.

The effect of suppressing breakage of the auxiliary conductor 110 during laser processing is not limited to the case where side conductors are formed at the corners of each substrate region as shown in FIG. The same effect is obtained when the buried conductor 108 is formed on the side. FIG. 4 is a perspective view of the main part of the multi-piece wiring board when the electronic component storage package according to another embodiment is manufactured as viewed from the lower surface. Here, the precondition that the embedded conductor 108 is not cut in both the corner portion and the side portion is that the formation depth of the division groove 116 other than the groove by laser processing is laser processing from the main surface of the upper insulating layer 104. In this case, the thickness is smaller than the thickness of the upper insulating layer 104, and when the laser processing is performed from the main surface of the lower insulating layer 105, the thickness becomes smaller than the thickness of the lower insulating layer 105.

For example, when the electronic component storage package is manufactured in the form of a multi-piece wiring board, if the auxiliary conductor 110 is formed on the boundary 115 of the board region, there is an effect of suppressing disconnection of the embedded conductor 108. Therefore, when the embedded conductor 108 is formed in the corner portion of the substrate region, for example, a structure in which the auxiliary conductor 110 is formed in a cross shape at a position overlapping the boundary 115 in a plan view may be used. Further, when the embedded conductor 108 is formed on the side portion, for example, a structure in which the auxiliary conductor 110 is formed in a single letter shape at a position overlapping the boundary 115 in plan view may be employed.

In the case where a part of the lower surface of the upper insulating layer 104 is exposed along the exposed side surface of the buried conductor 108 as in the example of FIG. 3 described above, the main surface of the upper insulating layer 104 is shielded. The effect of suppressing disconnection when laser processing is increased. Although not shown, this shielding effect is also effective when the embedded conductor 108 is formed in the side portion of each wiring board region. The auxiliary conductor 110 is formed between the upper insulating layer 104 and the lower insulating layer 105, and is further connected to the wiring conductor 112 and the like formed on the mounting portion 102.

In addition, the embedded conductor 108 and the auxiliary conductor 110 are those in which the metal paste is densely sintered including glass and is excellent in airtightness like the ceramic part. 102 may be exposed. Therefore, for example, as shown in FIG. 5, when the embedded conductor 108 is formed so as to extend to the external connection conductor 109 side (a direction away from the lower groove 107 to the center side of the insulating substrate 101 in a plan view). Can secure a wider connection area between the embedded conductor 108 and the external connection conductor 109, and can improve the connection reliability between them. FIG. 5 is a perspective view of the main part of the multi-piece wiring board when the electronic component storage package according to another embodiment is viewed from the lower surface. Although not shown, if the structure extends to the mounting portion 102 so that a part of the embedded conductor 108 is exposed to the mounting portion 102, the extended embedded conductor 108 is connected to a part of the conductive path described above. Can also be used. Further, in this case, it is possible to act as a conduction path having a large cross-sectional area in a direction orthogonal to the current transmission direction in the conduction path, and the wiring conductor 112 and the external connection conductor 109 are lower through the embedded conductor 108. It is also possible to connect well so as to achieve electrical resistance.

A method for manufacturing an electronic component storage package according to an embodiment of the present invention will be described with reference to FIGS. This manufacturing method includes the following steps. That is, a step of preparing the first and second ceramic green sheets 201a and 201b. Forming a first through-hole 203 penetrating in the thickness direction in the first ceramic green sheet 201a and filling the inner surface of the first through-hole 203 with a buried conductive metal paste 202; Forming a second through hole 205 penetrating in the thickness direction in the second ceramic green sheet 201b; A step of producing a laminated body by laminating the first ceramic green sheet 201a and the second ceramic green sheet 201b so that the first through hole 203 and the second through hole 205 are continuous vertically. A part of the embedded conductor metal paste 202 in the first through hole 203 in plan view is punched in the thickness direction of the first ceramic green sheet 201a, and the main surface of the laminate on the first ceramic green sheet 201a side is First part
A step of applying an external connection conductor metal paste 206 so as to be connected to the embedded conductor metal paste 202 in the through hole 203. And the process of dividing | segmenting a laminated body in the thickness direction of a laminated body so that the 1st through-hole 203 and the 2nd through-hole 205 may be passed is included.

  According to such a manufacturing method, since the above steps are included, the side conductor (exposed portion on the side surface of the embedded conductor 108) and the external connection conductor 109 due to the downsizing of the electronic component storage package (insulating substrate 101). It is possible to suppress a decrease in electrical conductivity and disconnection. Therefore, the stability of the ground for the electronic component 103 and the shielding property can be improved, and an electronic component storage package excellent in the adhesion of the plating layer to each wiring board by electroplating can be manufactured.

  As described above, a multi-piece wiring board is obtained by arranging a plurality of electronic component storage packages of a plurality of embodiments on a plane. The manufacturing method of the above embodiment is a manufacturing method of an electronic component storage package in the form of the multi-piece wiring board. That is, a multi-piece substrate is divided into individual pieces to produce a plurality of electronic component storage packages.

  Such steps will be described in detail in the order of steps with reference to FIGS. 6A to 6E and FIGS. 7A and 7B.

First, as shown in FIG. 6A, a flat first ceramic green sheet 201a is prepared.

Next, as shown in FIG. 6 (b), the first through-hole 203 serving as the lower groove 107 is formed at a predetermined position of the first ceramic green sheet 201a by punching (mechanical processing using a mold) or the like. Formed by processing.

Next, as shown in FIG. 6C, the first through-hole 203 is filled with a metal paste to be the embedded conductor 108 (embedded conductor metal paste 202). More specifically, for example, as follows. First, an embedding jig (not shown) is placed on the first ceramic green sheet 201a. The embedding jig is made of a metal plate, for example, and has a plurality of holes for locally sucking the embedded conductor metal paste 202. Thereafter, the embedded conductor metal paste 202 is filled into the first through holes 203 by, for example, screen printing. Here, the filling method is not limited to the screen printing method, and a suction method, a press-fitting method, or the like may be employed.

  Next, as shown in FIG. 6 (d), the above-mentioned auxiliary conductor is covered with a first ceramic green sheet 201a filled with the embedded conductor metal paste 202 in the first through hole 203 so as to cover the first through hole 203. A metal paste (auxiliary conductor metal paste 204) to be 110 is formed by a method such as printing or coating.

At this time, if the auxiliary conductor metal paste 204 is formed on the boundary 115 of the substrate region (no symbol), the effect of more reliably suppressing disconnection of the embedded conductor 108 (cutting of the embedded conductor metal paste 202) is obtained. is there. Therefore, when the embedded conductor 108 is formed in the corner portion of each substrate region, for example, the auxiliary conductor 110 is formed in a cross shape at a position overlapping the boundary 115 in plan view in the multi-piece wiring substrate. Alternatively, the auxiliary conductor metal paste 204 may be formed. Further, when the embedded conductor 108 is formed in the side portion of the board region, for example, the auxiliary conductor 110 is formed in a single letter shape at a position overlapping the boundary 115 in plan view on the multi-piece wiring board. Further, the auxiliary conductor metal paste 204 may be formed.

Next, as shown in FIG. 6E, after the second ceramic green sheet 201b is prepared, an opening (not shown) serving as a frame surrounding the mounting portion 102 is formed in the second ceramic green sheet 201b. The center of the first through hole 203 to be the lower groove 107 and the upper groove 106 in the next step
The first ceramic green sheet 201a and the second ceramic green sheet 201b are positioned and laminated so that the center of the planned position where the second through hole 205 to be formed overlaps in plan view.

Next, as shown in FIG. 7A, a metal paste that becomes the frame-like metallized layer 111 is formed on the upper surface of the second ceramic green sheet 201b by a method such as printing or coating, and an external connection that becomes the external connection conductor 109. The conductor metal paste 206 is formed by a method such as printing or coating. In this formation, the external connection conductor metal paste 206 is formed so as to be connected to the embedded conductor metal paste 202.

Thereafter, in the laminated body composed of the laminated first ceramic green sheet 201a and second ceramic green sheet 201b, the formation position of the second through hole 205 to be the upper groove 106 and the first through hole 203 of the lower groove 107 are formed. The embedded conductive metal paste 202 is embedded and punched. This punched surface becomes the surface (inner surface) of the embedded conductor 108 on the inner surface of the upper groove 106 and the inner surface of the lower groove 107. As a result, it is possible to manufacture a multilayer body that becomes a multi-piece wiring substrate in which the inner side surface of the upper groove 106 and the exposed side surface of the embedded conductor 108 are located on the same surface.

Next, as shown in FIG. 7B, a dividing groove 116 is formed on the main surface of the stacked body in which the substrate regions to be the insulating substrate 101 are arranged in order to divide each substrate region into pieces. The dividing groove 116 is formed by machining such as a mold or a cutter blade, laser processing, or the like. As described above, when the dividing groove 116 is formed by laser processing and the embedded conductor 108 including the side conductor (such as the embedded conductor metal paste 202) is provided in the lower groove 107, a conductor portion (metal) such as the embedded conductor 108 is provided. Since the thickness of the paste portion) is relatively large, the possibility that a part of the conductor portion is cut in the thickness direction can be reduced.

When the auxiliary conductor 110 (auxiliary conductor metal paste 204) is formed along the embedded conductor 108, the auxiliary conductor 110 is electrically connected to the embedded conductor 108 across the boundary 115 between the substrate regions in the laminate. Connected structure. Therefore, even if the thickness of the embedded conductor 108 is relatively small, there is a possibility that the embedded conductor 108 (the metal paste) may be accidentally cut due to laser light irradiation or the like when forming the division grooves by laser processing. Effectively reduced.

Such a laminated body becomes a multi-piece wiring substrate in which substrate regions are arranged by baking at a high temperature. Along the dividing grooves 116 formed on the main surface of the multi-cavity wiring board, the first through holes 203 (portions that become the lower grooves 107) and the second through holes 205 (portions that become the upper grooves 106) pass. As described above, by dividing the multi-piece wiring board (mother board) in the thickness direction, a plurality of electronic component storage packages having high connection reliability between the side conductors and the external connection conductors 109 can be manufactured simultaneously. That is, according to the manufacturing method of the present embodiment, the electronic component storage package of the above embodiment can be manufactured with high productivity.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, the shape of the insulating substrate 101 is a rectangular shape having different long sides and short sides, but may be a square shape. Further, although the insulating substrate 101 is composed of two insulating layers (lower and upper insulating layers 105 and 104), it may be composed of three or more insulating layers in accordance with the accommodation form of the electronic component 103. Further, although the external connection conductor 109 is formed at the four corners of the bottom surface of the insulating substrate 101, the electronic component 103
Depending on the application and the number of terminals, it may be formed at other positions other than four locations. Further, in order to join the lid 113 to the upper surface of the frame-like metallized layer 111 by seam welding, a metal frame (not shown) made of iron-nickel-cobalt alloy metal having a square frame shape is joined with a brazing material. It is good.

101 ・ ・ ・ Insulating substrate
102 ・ ・ ・ Mounting part
103 ... Electronic components
104 ... Upper insulating layer
105 ... Lower insulation layer
106 ・ ・ ・ Upper groove
107 ... Lower groove
108 ... Built-in conductor
109 ・ ・ ・ External connection conductor
110 ... Auxiliary conductor
111 ・ ・ ・ Frame metallization layer
112 ・ ・ ・ Wiring conductor
113 ・ ・ ・ Cover
114 ・ ・ ・ Bonding material
201a ... 1st ceramic green sheet
201b 2nd ceramic green sheet
202 ・ ・ ・ Metal paste for embedded conductor
203 ... 1st through hole
204 ・ ・ ・ Metal paste for auxiliary conductor
205 ... Second through hole
206 ・ ・ ・ Metal paste for external connection conductor

Claims (3)

A lower insulating layer having a mounting portion on which an electronic component is mounted on the upper surface, a frame-shaped upper insulating layer laminated on the lower insulating layer so as to surround the mounting portion, and an outer peripheral portion of the lower surface of the lower insulating layer And an external connection conductor provided in
An upper groove is formed on the outer surface of the upper insulating layer from the lower end to the upper end of the outer surface, and on the side surface of the lower insulating layer from the lower end to the upper end of the side surface at a position overlapping the upper groove in plan view. A lower groove having a larger diameter than the upper groove is formed,
The lower groove further includes a buried conductor that is provided upward from the lower end of the inner surface of the lower groove, and the lower end portion is connected to the external connection conductor,
The buried conductor has to have a slope portion inclined in the upper insulating layer side,
Said buried conductor is provided toward the upper end from the lower end of said lower groove, the electronic component housing in which the sides to expose the buried conductor and the inner surface of the upper groove is characterized that you have located on the same plane package. It is disposed between the upper insulating layer and the lower insulating layer so as to follow the outer periphery of the embedded conductor in a bottom perspective, and further includes an auxiliary conductor connected to the embedded conductor between the layers. The electronic component storage package according to claim 1, wherein: Preparing first and second ceramic green sheets;
Forming a first through hole penetrating in a thickness direction in the first ceramic green sheet, and filling an inner surface of the first through hole with a metal paste;
Forming a second through-hole penetrating in the thickness direction in the second ceramic green sheet; the first ceramic green sheet and the second ceramic green sheet; the first through-hole and the second through-hole; Are stacked so that are vertically continuous, and a laminate is manufactured,
Punching a part of the metal paste in the first through hole in a plan view in the thickness direction of the first ceramic green sheet;
Applying a metal paste to the main surface of the laminate on the first ceramic green sheet side so that an end thereof is connected to the metal paste in the first through hole;
Forming a dividing groove on the main surface of the laminate on the first ceramic green sheet side so that the metal paste has a region where the depth gradually increases toward the inside of the first through hole;
And a step of dividing the laminated body in the thickness direction of the laminated body so as to pass through the first through hole and the second through hole.

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