JP2019192825A - Package for storing electronic component, electronic apparatus, and electronic module - Google Patents

Abstract

To provide a package for storing an electronic component that prevents disconnection of an internal wiring conductor, an electronic apparatus, and an electronic module.SOLUTION: A package 100 for storing an electronic component comprises: a base 102 that has a first principal surface 104 and a concave part 107 in the first principal surface 104, and has an electronic component 116 mounted in the concave part 107; a frame-like metallized layer 114 that is located on the first principal surface 104; and an internal wiring conductor 112 that is connected to the frame-like metallized layer 114 and connected to a relay conductor 110 located in the base 102. The internal wiring conductor 112 includes a belt-like conductor 113 having a plurality of curved parts 113a in vertical sectional view between the frame-like metallized layer 114 and the relay conductor 110.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component storage package for storing an electronic component such as a piezoelectric vibration element or a semiconductor element, an electronic device, and an electronic module.

  2. Description of the Related Art Conventionally, a package-like wiring board has been devised in which an electronic component is accommodated in a recess, and the electronic component in the recess is connected to an electrical wiring conductor provided outside. By connecting the electronic component to the electronic device via this wiring board, the handling and wiring connection can be facilitated. Further, by sealing the electronic component housed in the concave portion of the wiring board with the lid, the electronic component is isolated from the external environment, and the operation reliability can be improved.

  Such a wiring board has a recess for accommodating an electronic component, and penetrates the inside and the outside of the recess in order to electrically connect the electronic component in the recess to an external connection conductor provided outside. Those provided with wiring conductors are widely used.

  In addition, a metal material is used for a lid for sealing the recess, and a lid joined to the frame-like metallization layer via a side conductor provided on the side wall of the recess is provided on the lower surface of the wiring board. By connecting to the connection conductor and supplying a ground voltage to the electrode, the influence of noise on the concave portion of the wiring board is reduced. (For example, refer to Patent Document 1).

JP 2004-55985 A

  However, in recent years, electronic component storage packages have been increasingly miniaturized. As a result, the following problems have arisen. That is, since the width of the side conductor provided on the side wall of the recess is further reduced, there is a possibility that disconnection or a decrease in conductivity may occur.

  An electronic component storage package according to one aspect of the present invention has a first main surface, a recess portion on the first main surface, a base portion on which the electronic component is mounted in the recess portion, and the first main surface. A frame-shaped metallized layer; and an internal wiring conductor connected to the frame-shaped metallized layer and connected to the relay conductor located at the base, wherein the internal wiring conductor includes the frame-shaped metallized layer and the relay conductor. , And includes a belt-like conductor having a plurality of curved portions in a longitudinal sectional view.

  An electronic device according to one aspect of the present invention includes the above-described electronic component storage package and an electronic component mounted on the electronic component storage package.

  An electronic module according to an aspect of the present invention includes the electronic device described above and a module substrate to which the electronic device is connected.

According to the electronic component storage package of one aspect of the present invention, a first main surface, a base portion having a recess in the first main surface, and mounting the electronic component in the recess, and the first main surface A frame-shaped metallization layer positioned; and an internal wiring conductor connected to the frame-shaped metallization layer and connected to the relay conductor positioned at the base, the internal wiring conductor comprising the frame-shaped metallization layer and the Since a strip-shaped conductor having a plurality of curved portions in a longitudinal sectional view is included between the relay conductors, thermal stress is caused by the plurality of curved portions between the frame-shaped metallized layer and the relay conductor in the longitudinal sectional view. It is relaxed and the disconnection of the internal wiring conductor can be suppressed.

  According to the electronic device of one aspect of the present invention, since the electronic component storage package and the electronic component mounted on the electronic component storage package are included, the wiring board can be miniaturized with high accuracy. It is possible to reduce the strength of the wiring board even if a strip conductor is formed in the side wall of the recess.

  According to the electronic module of one aspect of the present invention, since the electronic device includes the electronic device and the module substrate to which the electronic device is connected, the electronic device can be used on the module substrate. In addition, electronic components and circuits can be arranged more efficiently, and the electronic module can be reduced in size, weight, and functionality.

It is a top view which shows the electronic component storage package etc. in embodiment of this invention. FIG. 2 is a cross-sectional view taken along line X-X ′ of the electronic component storage package shown in FIG. 1. It is a perspective view which shows the principal part of the electronic component storage package of embodiment shown in FIG. It is a top view which shows other examples, such as a package for electronic component accommodation in embodiment of this invention. FIG. 5 is a side perspective view of the electronic component storage package shown in FIG. 4 in the A direction. FIG. 5 is a cross-sectional view taken along line Y-Y ′ of the electronic component storage package or the like illustrated in FIG. 4. FIG. 7 is an enlarged cross-sectional view of a main part of the electronic component storage package or the like shown in FIG. 6. It is a perspective view which shows the principal part in the electronic component storage package shown in FIG. It is sectional drawing which shows other examples, such as an electronic component storage package in embodiment of this invention. It is a perspective view which shows the principal part of the electronic component storage package shown in FIG.

  An electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a top perspective view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a cross-sectional perspective view taken along line X-X ′ of FIG.

In FIG. 1, an electronic component storage package 100 has a base 102. The base 102 includes a first main surface 104 on which the frame-like metallized layer 114 is located, a recess 107 on the first main surface 104, a second main surface 105 located on the bottom surface of the recess 107 on which the electronic component 116 is mounted, and a module. It has a third main surface 106 on the mounting surface side to the circuit board 300. An electronic component 116 such as a piezoelectric vibration element is mounted in the recess 107. The base 102 (insulating substrate 101) has a recess 107 and a side wall 103 (frame portion) of the recess 107. A strip-shaped conductor 113 is located inside the side wall 103 of the recess 107, and the frame-shaped metallized layer 114 and the strip-shaped conductor 113 are electrically connected. Further, the strip-shaped conductor 113 is connected to the relay conductor 110 provided along a part of the side wall 103 of the recess 107 in a plan view from the second main surface 105 of the base 102 to the inside. Further, the relay conductor 110 is connected to an external connection conductor 115 provided on the lower surface (third main surface 106) of the base 102 by a via conductor 109 provided in the base 102. Thus, a wiring structure is obtained in which the frame-shaped metallized layer 114 is electrically connected to the external connection conductor 115 via the strip-shaped conductor 113, the relay conductor 110, and the via conductor 109. In the electronic component storage package 100, the lid 118 is joined onto the insulating substrate 101 by a brazing material 119 such as silver brazing, and the electronic component 116 is hermetically sealed. In this embodiment, as shown in FIG. 2, the base portion 102 has a concave portion 107 that is concave in a sectional view in the thickness direction. An electronic device 200 is formed by hermetically sealing an electronic component 116 such as a piezoelectric vibration element in the electronic component storage package 100. The lid 118 that seals the recess 107 is seen through in FIG. 1 for easy viewing.

The base 102 has a first main surface 104 and a recess 107 for mounting the electronic component 116 on the first main surface 104. In plan view, the side wall 103 of the recess 107 surrounds the recess 107 on the upper surface of the base 102. The base 102 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The base 102 has, for example, a rectangular shape with a one side length of about 1.2 to 10 mm in a plan view, a plate shape with a thickness of about 0.2 to 2 mm, and a concave portion 107 on the upper surface thereof. Yes. If the base 102 is made of an aluminum oxide sintered body, a suitable organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to form a slurry. In addition, a ceramic green sheet is obtained by making it into a sheet shape by a sheet molding method such as a doctor blade method or a roll calender method, and then the ceramic green sheet is appropriately punched and printed. The ceramic green sheet is pressed by a convex portion of a pressure jig (not shown) having a concavo-convex portion to provide a ceramic green sheet region on the lower side of the base 102. The strip conductor 1 together with the ceramic green sheet region that becomes the side wall 103 (frame portion) of the recess 107 in the base 102 at the recess of the tool By pressurizing the metallized paste to be 13, the metallized paste to be a part of the ceramic green sheet, the frame-shaped metallized layer 114, and the strip-shaped conductor 113 is moved to the concave part of the jig, and the side wall 103 of the concave part 107 is provided, A molded body in which a plurality of wiring board regions to be the wiring board 100 including the base 102 are arranged is formed. By firing this molded body at a high temperature, a mother board on which a plurality of wiring boards 100 are integrally formed is manufactured.

For example, the base 102 (insulating substrate 101) is manufactured as a mother substrate (not shown) in which wiring substrate regions each serving as an individual insulating substrate 101 are arranged and then divided into individual pieces. Yes. The mother board has a base 102 including the side wall 103 of the recess 107 in each wiring board region.

The side wall 103 (frame portion) of the recess 107 may have a frame-like metallized layer 114 on the upper surface, that is, the first main surface 104, and may have a notch not shown on the outer surface. Further, the base 102 has a connection conductor 108, a strip conductor 113, a relay conductor 110, as a conductive path for electrically connecting the electronic component 116 mounted in the recess 107 and an external electric circuit of the module substrate 301. A via conductor 109, an external connection conductor 115, and the like are provided. Here, the example in which the electronic component 116 is a piezoelectric vibration element and the pair of connection conductors 108 is provided in the concave portion 107 of the base 102 is shown, but depending on the type, shape, size, and the like of the electronic component to be mounted, A structure in which three or more connection conductors are provided at other locations of the recess 107 may be employed. Alternatively, the base 102 may be provided with notches (not shown) at the four corners. When a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) is mounted in the recess 107,
A recess (not shown) having a stepped side wall on which a plurality of electronic components are mounted may be provided.

The concave portion 107 has, for example, a quadrangular shape in plan view in accordance with the electronic component 116 having a square frame shape. In the example of FIG. 1, an example is shown in which a pair of connection conductors 108 are provided at two corners adjacent to each other of the rectangular recess 107. The connection conductor 108 functions as a conductor layer for connecting an electrode (not shown) of an electronic component 116 such as a piezoelectric vibration element housed in the recess 107. If the electronic component 116 is a piezoelectric vibration element, the outer shape thereof is usually a quadrangular shape in plan view, and a pair of electrodes for connection are provided at corner portions of the main surface. In order to facilitate and surely connect such electrodes, the connection conductor 108 is provided at the corner portion of the recess 107.

Each electrode (not shown) of the electronic component 116 and the connection conductor 108 are connected via a bonding material (not shown) such as a conductive adhesive. That is, as shown in FIG. 1, the electronic component 116 is placed in the recess 107 so that the pair of electrodes provided at the corners of the main surface of the electronic component 116 face the pair of connection conductors 108 provided on the recess 107. After positioning, the bonding material previously applied to the pair of connection conductors 108 is heated and cured, and the electrodes of the electronic component 116 and the connection conductors 108 are connected.

In the example of the present embodiment, an example in which a piezoelectric vibration element is used as the electronic component 116 is described. Therefore, the connection conductor 108 is provided at the position as described above, but other electronic components (not shown) are provided. When mounting a plurality of other electronic components, the number, position, and shape of the connection conductors 108 may be changed according to the shape, arrangement, etc. of the electrodes of the electronic components. Good. Examples of such other electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, and resistance elements.

  The electronic component storage package 100 of the present invention has a first main surface 104, a concave portion 107 on the first main surface 104, a base portion 102 on which the electronic component 116 is mounted in the concave portion 107, and a position on the first main surface 104. The frame-shaped metallized layer 114 and an internal wiring conductor 112 connected to the frame-shaped metallized layer 114 and connected to the relay conductor 110 located at the base 102 are provided. And the relay conductor 110 include a strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view.

With such a configuration, the thermal stress is relaxed by the plurality of curved portions 113a between the frame-like metallized layer 114 and the relay conductor 110 in the longitudinal sectional view, and disconnection of the internal wiring conductor 112 can be suppressed. That is, when the lid body 118 is joined to the frame-like metallized layer 114, if a high temperature equal to or higher than the melting point of the brazing material is applied to the joint portion in order to melt the brazing material or the like attached to the lid body 118, this heat The stress is transmitted to the base 102 (insulating substrate 101), and this thermal stress may cause disconnection of the internal wiring conductor 112 at the connection portion between the frame-like metallized layer 114 and the internal wiring conductor 112. Can be suppressed.

Specifically, when a high temperature equal to or higher than the melting point of the brazing material is applied to the joint between the lid 118 and the frame-like metallized layer 114, the heat is transferred from the frame-like metallized layer 114 to the internal wiring conductor 112. However, since the internal wiring conductor 112 includes the strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view between the frame-like metallized layer 114 and the relay conductor 110, for example, the internal wiring conductor 112 is heated. However, the expansion of the internal wiring conductor 112 due to the difference in thermal expansion between the base portion 102 (insulating substrate 101) made of ceramic and the internal wiring conductor 112 made of metal causes the plurality of curved portions 113a to expand.
It becomes easy to relax around the strip-shaped conductor 113 inside the side wall 103 of the recess 107 by the strip-shaped conductor 113 having.

Further, in the process of cooling the brazing material at the joint portion, the internal wiring conductor 112 that has expanded in the direction away from the frame-shaped metallized 114 side in the thickness direction of the side wall 103 of the recess 107 contracts. There is a possibility that the internal wiring conductor 112 may be disconnected at the connection portion between the metallized layer 114 and the internal wiring conductor 112. However, since the strip-shaped conductor 113 having the plurality of curved portions 113a makes it easy to relieve the thermal stress around the strip-shaped conductor 113 in the side wall 103 of the recess 107, the inner side in the thickness direction of the side wall 103 of the recess 107 Shrinkage of the wiring conductor 112 can be further suppressed. Therefore, it is possible to reduce the possibility of disconnection of the internal wiring conductor 112 including the connection portion between the frame-like metallized layer 114 and the internal wiring conductor 112.

Hereinafter, an example of manufacturing the electronic component storage package 100 of the present invention will be specifically described. In this way, the electronic component housing package 100 is manufactured in which the internal wiring conductor 112 includes the strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view between the frame-shaped metallized layer 114 and the relay conductor 110. For this purpose, for example, a plurality of through holes to be via conductors 109 and strip-like conductors 113 are provided by punching in each wiring board region of one ceramic green sheet to be the base 102 (insulating substrate 101). Next, a metallized paste is provided in a predetermined position inside these through holes by a suction method or the like. Then, the metallized paste that becomes the connection conductor 108 and the relay conductor 110 in the region that becomes the recess 107 in each wiring board region of the ceramic green sheet, and the metallization paste that becomes the frame-like metallization layer 114 in the region that becomes the side wall 103 of the recess 107 Are provided at predetermined positions by screen printing.

Further, when pressing the region of the ceramic green sheet that becomes the second main surface 105 of the base 102 with the convex portion of the pressing jig (not shown) in which the concave and convex portions are formed, the metallized paste that becomes the connection conductor 108 The entire surface is further pressurized in the metallized paste that becomes the relay conductor 110, and the region in which the via conductor 109 is provided, and the strip-shaped conductor 113 together with the ceramic green sheet region that becomes the side wall 103 of the recess 107 in the recess of the pressurizing jig. By pressurizing the metallized paste to become
A part of the ceramic green sheet, the frame-shaped metallized layer 114, and the metallized paste that becomes the strip-shaped conductor 113 move to the concave portion of the jig, and as shown in FIGS. Between the layer 114 and the relay conductor 110, the electronic component housing package 100 including the strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view can be manufactured. In addition, the through-hole in which the metallized paste used as the strip | belt-shaped conductor 113 was embedded by this pressurization process is bent, and the some curved part 113a is provided.

The depth of the concavo-convex portion of the pressing jig is constant, and the depth of the concave portion 107 after pressure processing, that is, the depth of the concave portion 107 in which the electronic component 116 is accommodated can also be constant. Compared with the case where the concave portion 107 is provided depending on the thickness of the ceramic green sheet serving as the frame portion, the dimensional accuracy in the depth of the concave portion 107 can be increased by using a pressurizing jig having a high dimensional accuracy. . The internal wiring conductor 112 includes a strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view between the frame-like metallized layer 114 and the relay conductor 110 in the plurality of base portions 102 provided with the recesses 107. A mother board on which a plurality of wiring board regions to be the electronic component storage package 100 are arranged can be manufactured.

In the above description, an example is shown in which a single substrate is formed by deforming one ceramic green sheet with a pressing jig to form a mother substrate in which a plurality of wiring substrate regions serving as the electronic component storage package 100 are arranged. The part 103 may be manufactured separately, and the electronic component storage package 100 may be manufactured by stacking and integrating a plurality of ceramic green sheets serving as the base part 102 and the frame part 103.

  Further, the electronic component storage package 100 of the present invention has the protruding portion 111 on the side wall 103 of the concave portion 107, and the strip-shaped conductor 113 is positioned on the protruding portion 111 when seen from the side. With such a configuration, it is possible to suppress the strength of the side wall 103 of the concave portion 107 from being lowered due to the provision of the internal wiring conductor 112 on the side wall 103 of the concave portion 107.

In other words, since the electronic component storage package 100 has been downsized due to the recent miniaturization of the electronic device, the outer dimensions of the base 102 on which the electronic component 116 is mounted are also reduced, and the recess for accommodating the electronic component 116 is reduced. The width of the side wall 103 of the recess 107 surrounding the 107 is also decreasing. Thus, the internal wiring conductor 112 that connects the frame-like metallized layer 114 and the external connection conductor 115 formed on the lower surface (third main surface 106) of the insulating substrate 101 can be provided inside the side wall 103 of the recess 107. It's getting harder. However, as shown in FIGS. 4 to 5, the protruding portion 111 is provided on the side wall 103 of the concave portion 107, and the band-like conductor 113 is seen through the side surface in the A direction of the electronic component storage package 100 shown in FIG. 4. By adopting a configuration in which the protrusion 111 is located, the internal wiring conductor 112 including the strip conductor 113 is unlikely to reduce the strength of the side wall 103 of the recess 107. Further, the protrusion 111 can make up the strength of the side wall 103 of the recess 107 in the region where the internal wiring conductor 112 including the strip-shaped conductor 113 is provided.

Hereinafter, an example of manufacturing the electronic component storage package 100 of the present invention will be specifically described. Thus, in order to produce the electronic component storage package 100 having the protruding portion 111 on the inner side surface of the concave portion 107, and the band-like conductor 113 is located in the protruding portion 111 in the side perspective, for example, As described above, after performing predetermined through-hole processing, printing processing, etc. on one ceramic green sheet to be the base 102 (insulating substrate 101), the ceramic green sheet is added with a pressure jig in which uneven portions are formed. By pressing, a mother board in which a plurality of wiring board regions to be the electronic component storage package 100 are arranged can be manufactured. During this pressing step, a ceramic green sheet is formed by providing a counterbore part (not shown) in a plan view at a part corresponding to the protruding part 111 of the convex part of the pressurizing jig that pressurizes the concave part 107. When pressed, a part of the ceramic green sheet, the frame-shaped metallized layer 114, and the metallized paste that becomes the strip-shaped conductor 113 move to the counterbore part of the pressure jig. As a result, the protruding part 111 is provided on the side wall 103 of the concave part 107, and the electronic component housing package 100 in which the belt-like conductor 113 is located on the protruding part 111 can be manufactured. In addition, if the metallized paste used as the internal wiring conductor 112 including the strip conductor 113 includes a resin that is easily thermally deformed, the metallized paste can withstand deformation due to a pressurizing process performed by heating the ceramic green sheet.

The lid body 118 joined to the frame-shaped metallized layer 114 has a shape and dimensions such that the outer peripheral portion of its lower surface is attached to the upper surface of the base portion 102 (insulating substrate 101), and an iron-nickel-cobalt alloy, iron -It is made of a metal material such as a nickel alloy. Further, if the lid 118 is made of, for example, an iron-nickel-cobalt alloy, the iron-nickel-cobalt alloy plate material is subjected to appropriate metal processing such as rolling, punching, etching, etc. to have a predetermined shape and Manufactured by molding into dimensions. For joining the upper surface of the side wall 103 of the recess 107 to the lid 118, for example, a frame-like metallized layer 114 is provided on the upper surface of the insulating substrate 101, and the outer peripheral portion of the lower surface of the lid 118 is attached to the frame-like metallized layer 114. -It is performed by joining means such as a brazing method using a brazing material such as tin, a resistance welding method, an electron beam welding method, and an electron beam welding method.

The side wall 103 (frame portion) of the concave portion 107 has a protruding portion 111 protruding from the side wall 103 of the concave portion 107 over the entire length in the thickness direction, and includes the protruding portion 111 and penetrates in the thickness direction of the base portion 102. Is provided. The internal wiring conductor 112 includes a strip-like conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view, and an external connection for grounding the third main surface 106 via a relay conductor 110 located on the base portion 102. It is electrically connected to the conductor 115. Thereby, it is possible to effectively suppress the electronic component 116 accommodated in the recess 107 from receiving external noise (such as electromagnetic waves). For example, if the electronic component 116 is a semiconductor element (semiconductor integrated circuit element) that handles high-frequency signals, such noise shielding has a great effect on suppressing malfunction and delay of the electronic component 116.

Further, in the electronic component storage package 100 of the present invention, the strip-shaped conductor 113 has a recess 107 in a longitudinal sectional view.
Is located on the side wall and the protrusion 111 of the. With this configuration, it is possible to suppress the strength of the side wall 103 of the recess 107 from being reduced by providing the internal wiring conductor 112 on the side wall 103 of the recess 107, and thermal stress is alleviated by the plurality of curved portions 113a. The disconnection of the internal wiring conductor 112 can be suppressed.

That is, even when a high temperature equal to or higher than the melting point of the brazing material is applied to the joint between the lid 118 and the frame-like metallized layer 114 and the heat is transferred from the frame-like metallized layer 114 to the internal wiring conductor 112, FIG. As shown in FIG. 7, the internal wiring conductor 112 is between the frame-shaped metallized layer 114 and the relay conductor 110.
Since it includes a strip-like conductor 113 having a plurality of curved portions 113a located on the side wall 103 and the protruding portion 111 of the concave portion 107 in a longitudinal sectional view, the base portion 102 (insulating substrate 101) made of ceramic and the internal wiring made of metal The expansion of the internal wiring conductor 112 due to the difference in thermal expansion from the conductor 112 is caused by the plurality of curved portions 113a.
Due to the strip-shaped conductor 113 having the above, it becomes easy to relax around the strip-shaped conductor 113 inside the side wall 103 and the protrusion 111 of the recess 107. In the above-described case, in the plurality of curved portions 113a, each curved portion 113a may be located on the side wall of the concave portion 107 or the protruding portion 111, and the thermal stress is relaxed at a position separated from each other by the respective curved portions 113a. Thus, disconnection of the internal wiring conductor 112 can be further suppressed.

And, if the strip-shaped conductor 113 is a structure that is positioned so as to alternately cross the boundary between the side wall 103 of the recess 107 and the protruding portion 111 between the frame-shaped metallized layer 114 and the relay conductor 110 in a longitudinal sectional view,
Expansion of the internal wiring conductor 112 due to the difference in thermal expansion between the base 102 (insulating substrate 101) and the internal wiring conductor 112, which is a metal, is more effective around the strip-shaped conductor 113 inside the side wall 103 of the recess 107 and the protrusion 111. It becomes easy to disperse | distribute and to ease.

Further, in the step of cooling the brazing material at the joint portion between the lid 118 and the frame-shaped metallized layer 114, the internal wiring conductor 112 has the second main surface 105 in the thickness direction of the side wall 103 of the recess 107 from the frame-shaped metallized 114 side. Even if the inner wiring conductor 112 expanded to the side contracts, a plurality of bent portions 113 are formed by such a configuration.
The strip-shaped conductor 113 having a makes it easy to relieve the thermal stress around the strip-shaped conductor 113 even when the brazing material is cooled around the sidewall 103 and the protrusion 111 of the recess 107. The shrinkage of the internal wiring conductor 112 in the thickness direction can be further suppressed. Therefore, it is possible to reduce the possibility of disconnection of the internal wiring conductor 112 including the connection portion between the frame-like metallized layer 114 and the internal wiring conductor 112.

Further, in the electronic component storage package 100 of the present invention, the angle θ1 formed by the strip-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 is an acute angle in a longitudinal sectional view. With such a configuration, the connection between the frame-like metallized layer 114 and the internal wiring conductor 112 can be improved. That is, as shown in FIG. 7, the frame-like metallized layer 114 in a longitudinal sectional view.
Since the internal wiring conductor 112 (band-shaped conductor 113) is obliquely connected at an acute angle θ1, the bonding area between the frame-like metallized layer 114 and the internal wiring conductor 112 can be increased even if the thickness of the internal wiring conductor 112 is small. .

As described above, in order to make the angle θ1 formed between the strip-shaped conductor 113 and the frame-shaped metallized layer 114 inside the concave portion 107 become an acute angle, for example, with a pressurizing jig in which the concave and convex portions are formed as described above. When the ceramic green sheet is pressed, a metallized paste that penetrates to form the strip-like conductor 113 may be provided on the side of the recess 107 on the side wall of the recess 107 in each wiring board region. Thus, when the metallized paste that becomes the strip-shaped conductor 113 is pressed together with the ceramic green sheet region that becomes the side wall 103 of the recess 107 in the base 102 at the recess of the pressurizing jig, on the side of the recess 107 on the side wall of the recess 107 The metallized paste that becomes the band-shaped conductor 113 together with the ceramic green sheet is easily pressed in the pressing jig, and the angle θ1 formed by the band-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 becomes an acute angle. Furthermore, a part of the ceramic green sheet and the metallized paste that becomes the strip-shaped conductor 113 move to the concave portion of the jig, and the internal wiring conductor 112 is between the frame-shaped metallized layer 114 and the relay conductor 110,
An electronic component including a strip-like conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view, and an angle θ1 formed between the strip-like conductor 113 and the frame-like metallized layer 114 inside the recess 107 is an acute angle. A storage package 100 can be manufactured.

The angle θ1 formed by the strip conductor 113 and the frame metallization layer 114 tends to decrease as the amount of pressing by the pressing jig, that is, the depth of the recess 107 increases, and the angle of the side wall 103 of the recess 107 in the base 102 increases. As the thickness increases, the angle θ1 formed by the strip-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 can be reduced. Therefore, in the electronic component housing package 100 in which the recess 107 has a large depth, the bonding area between the frame-like metallized layer 114 and the internal wiring conductor 112 can be increased, and the connection between the frame-like metallized layer 114 and the internal wiring conductor 112 can be made. It can be made better.

Further, in the electronic component storage package 100 of the present invention, in a plan view, the side wall of the concave portion 107 has a rectangular frame shape, and the protruding portion 111 is located on the side portion excluding the corner portion. With this configuration, when the lid 118 is bonded to the frame-like metallized layer 114, the start and end of beam irradiation are positioned on the protruding portion 111, thereby improving the reliability of hermetic sealing. Can be improved. That is, an electron beam that irradiates a beam along the outer periphery of the lid 118, melts the brazing material 119 by irradiating this beam, and joins the lid 118 to the frame-shaped metallized layer 114 directly below the brazing material 119. When using a joining method such as a welding method or an electron beam welding method, the region of the lid body 118 that is directly above the frame-like metallized layer 114 where the projecting portion 111 is located is used as a starting portion at the time of joining. The beam 118 is irradiated along the outer periphery of the body 118, and the region of the lid body 118 that goes around the outer periphery of the lid body 118 and is directly above the frame-like metallized layer 114 where the projecting portion 111 is located By doing so, the brazing material 119 in the region irradiated with the beam along the sealing line is melted and fused to the frame-like metallized layer 114 immediately below, and the start and end parts at the time of joining are continuous in a frame shape. Thus, the sealing of the recess 107 by the lid 118 is completed.

At the time of joining, the region that becomes the start and end of joining is located on the side, that is, the side of the side wall 103 of the recess 107, and starts when the beam is irradiated along the outer periphery of the lid 118. It is easy to match the sealing position at the time with the sealing position at the end. Therefore, the electronic component storage package 100
Even if the size is reduced, the lid 118 can be more reliably bonded to the frame-like metallized layer 114.

In addition, the region that becomes the start portion and the end portion of the bonding is accompanied by two thermal histories due to the irradiation of the beam. However, as shown in FIGS. Since it has a rectangular frame shape and the projecting portion 111 is located on the side except for the corner, the influence of heat on the region that becomes the start and end portions during joining is affected by the side wall of the recess 107. Since the protrusion 111 located at 103 can be relaxed, the occurrence of remelting of the brazing material 119 can be suppressed. As a result, the remelting of the brazing material 119 occurs, the short circuit with the electronic component 116 due to the outflow into the recess 107, and the insulating substrate 101.
It is possible to reduce the possibility of a sealing failure or the like due to the flow to the outer wall.

In the example of this embodiment, a metal layer (not shown) such as a nickel plating layer or a gold plating layer is formed on the surface of an exposed conductor such as the frame-shaped metallized layer 114, the connection conductor 108, and the external connection conductor 115.
Are sequentially deposited. For example, the nickel plating layer is formed with a thickness of about 1.0 to 20 μm, and the gold plating layer is formed with a thickness of about 0.1 to 1.0 μm. These plated layers cover the exposed surface of each wiring conductor with a metal layer, so that the wiring conductor has excellent corrosion resistance and good wettability such as solder and brazing material.

In the electronic component storage package 100 of the present invention, the relay conductor 110 is located inside the base portion 102. With such a configuration, the relay conductor 110 is not exposed to the recess 107, so that the electronic component 116 can be stably operated without causing an unintended short circuit. That is, when a plating layer is deposited on the exposed surface of each wiring conductor, the lid 118 is attached to the frame-shaped metallized layer 114 by a brazing material 119 such as silver brazing in order to hermetically seal the electronic component 116. When joining on the base 102, the brazing material 119 tends to spread through the plating layer. However, since the relay conductor 110 is located inside the base portion 102, for example, as shown in FIGS. 9 and 10, the relay conductor 110 is covered with the insulating film 117. Even when entering the concave portion 107 side through the side wall 103, the brazing material 119 does not spread out on the insulating film 117, so that the brazing material 119 can be prevented from spreading to the electronic component 116 side. Therefore, it is possible to realize the electronic component storage package 100 in which contact with the adjacent electronic component 116 due to the expansion of the brazing material 119 into the recess 107 and a short circuit are suppressed.

Thus, in order to manufacture the electronic component storage package 100 in which the relay conductor 110 is not exposed in the recess 107, for example, in each wiring board region of one ceramic green sheet that becomes the base 102 (insulating substrate 101), A plurality of through holes to be via conductors 109 and strip-like conductors 113 are provided by punching. Next, a metallized paste is provided in a predetermined position inside these through holes by a suction method or the like. Then, the metallized paste that becomes the connection conductor 108 and the relay conductor 110 in the region that becomes the recess 107 in each wiring board region of the ceramic green sheet, and the metallization paste that becomes the frame-like metallization layer 114 in the region that becomes the side wall 103 of the recess 107 Are provided at predetermined positions by screen printing. At this time, it is only necessary to cover the metallized paste to be the relay conductor 110 and provide the ceramic paste to be the insulating film 117 at a predetermined position by a screen printing method. Further, the metallized paste that becomes the relay conductor 110 including the entire surface of the metallized paste that becomes the connection conductor 108 at the convex part of the pressing jig (not shown) in which the uneven part is formed, and the region where the via conductor 109 is provided. And pressurizing the metallized paste that becomes the strip conductor 113 together with the area of the ceramic green sheet that becomes the side wall 103 of the recess 107 in the base 102 at the recess of the pressurizing jig. ,
A part of the ceramic green sheet, the frame-shaped metallized layer 114, and the metallized paste that becomes the strip-shaped conductor 113 move to the concave portion of the jig, and the internal wiring conductor 112 is between the frame-shaped metallized layer 114 and the relay conductor 110. It is possible to manufacture the electronic component housing package 100 that includes the strip-shaped conductor 113 having a plurality of curved portions 113a in a longitudinal sectional view and in which the relay conductor 110 is not exposed to the recess 107. In addition, the through-hole in which the metallized paste used as the strip | belt-shaped conductor 113 was embedded by this pressurization process is bent, and the some curved part 113a is provided.

The electronic device 200 of the present invention includes the electronic component storage package 100 described above and the electronic component 116 mounted on the electronic component storage package 100. With such a configuration, the wiring board can be miniaturized with high accuracy, and even if the strip-like conductor 113 is formed in the side wall 103 of the recess 107, it is difficult to reduce the strength of the insulating substrate 101. That is, the electronic component housing package 100 in which thermal stress is relaxed by the plurality of curved portions 113a between the frame-shaped metallized layer 114 and the relay conductor 110 in a longitudinal sectional view and the disconnection of the internal wiring conductor 112 is suppressed is used. Thus, it is possible to provide the electronic device 200 that can be efficiently and accurately miniaturized according to the size of the electronic component 116.

Further, if the electronic component storage package 100 has the protruding portion 111 on the side wall 103 of the concave portion 107 and the band-shaped conductor 113 is positioned on the protruding portion 111 in a side perspective, the internal wiring including the band-shaped conductor 113 is provided. The protruding portion 111 supplements the strength of the side wall 103 of the recess 107 in the region where the conductor 112 is provided, and the internal wiring conductor 112 including the strip-shaped conductor 113 does not decrease the strength of the side wall 103 of the recess 107. Therefore, the strength of the side wall 103 of the recess 107 due to the provision of the internal wiring conductor 112 on the side wall 103 of the recess 107 is suppressed, and the recess is caused by thermal stress when the lid 118 is joined to the frame-shaped metallized layer 114. Since the occurrence of cracks and the like on the side wall 103 of 107 is suppressed, the electronic device 200 with improved reliability of hermetic sealing of the electronic component 116 accommodated in the recess 107 can be realized.

Further, as shown in FIG. 4, the protruding portion 111 of the electronic component storage package 100 has the electronic component 116.
If the electronic component 116 is electrically connected to the connection conductor 108 via an electrical connection means such as a bonding wire or solder. When the connection is made, the projecting portion 111 does not obstruct the electronic component 116 and the connection conductor 108 from unintentionally short-circuiting. Therefore, it is possible to provide the electronic device 200 that is excellent in the reliability of hermetic sealing and excellent in mountability and connectivity to the recess 107 of the electronic component 116.

The electronic module 300 of the present invention includes the electronic device 200 described above and a module substrate 301 to which the electronic device 200 is connected. With such a configuration, by using the electronic device 200 described above, the electronic component 116 and the circuit can be more efficiently arranged on the module substrate 301, and the electronic module 300 can be reduced in size and weight. And higher functionality can be achieved. That is, since it has the electronic component 116 mounted on the electronic component storage package 100 described above, it is hardly affected by the formation of the wiring conductor and effectively and accurately stores the electronic component according to the size of the electronic component 116. The package 100 can be reduced in size, and even if the strip-like conductor 113 is formed inside the side wall 103 of the recess 107, the strength of the electronic component storage package 100 is difficult to decrease. The illustrated electronic module 300 can be realized.

The electronic module 300 has a structure in which the electronic device 200 described above is mounted on a module substrate 301 provided with connection pads 302 by a bonding material 303 such as solder, as shown in FIGS. Is included. Examples of the electronic component 116 include a crystal oscillator and a surface acoustic wave element (S
AW filter) and the like, but are not limited thereto. Various electronic components such as piezoelectric elements, capacitive elements, and resistive elements for other applications can be used. Further, a plurality of electronic components 116 and other electronic components (not shown) may be provided in one recess 107 as necessary.

  The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, although the example in which the internal wiring conductor 112 is formed at only one place on the long side of the side wall 103 of the recess 107 in the base 102 has been shown, it corresponds to improvement in the types, applications, and characteristics of the electronic device 200 and the electronic component 116. In addition, a plurality of portions may be provided at other locations on the side wall 103 of the recess 107 in the base 102.

Further, the shape of the base 102 may not be a rectangular parallelepiped. It may be a polygon other than a rectangle in plan view, or may be a quadrilateral that is not a rectangular parallelepiped. Further, the side surface of the recess 107 formed by the side wall 103 of the recess 107 and the bottom surface of the recess 107 formed by the base 102 may be curved surfaces instead of flat surfaces. Also,
The side wall 103 of the recess 107 may have a tapered shape, or a step portion may be provided in the middle.

  Further, the number, arrangement, and positional relationship of the connection conductor 108, the external connection conductor 115, and the wiring that connects them may be changed as appropriate in accordance with the electronic component 116 accommodated in the recess 107. Furthermore, the shape of the connection conductor 108 may be changed to other than a rectangular shape.

In the above embodiment, the electronic component storage package 100 having one recess 107 provided on a single surface has been described as an example, but a plurality of recesses are provided on a single surface. In addition, the concave portions may be provided on the upper and lower surfaces of the base portion 102, respectively.

In the above embodiment, the electronic component storage package 100 or the like in which the lid body 118 is joined to the frame-shaped metallized layer 114 by the brazing material 119 has been described as an example. It may be an electronic component storage package in which the body is joined and the lid 118 is joined on the metal frame. Such a configuration can relieve thermal stress at the time of joining the lid body 118 with the metal frame compared to the case without the metal frame, so that a plurality of frames between the frame-like metallized layer 114 and the relay conductor 110 can be provided. In addition to the effect of relaxing the thermal stress by the curved portion, it is possible to more effectively suppress the disconnection and cracking of the internal wiring conductor.

  In addition, specific details such as the specific configuration, the shape, the arrangement, and the positional relationship shown in the above embodiment can be changed as appropriate without departing from the spirit of the present invention.

100 ・ ・ ・ Package for storing electronic components (wiring board)
101 ・ ・ ・ Insulating substrate
102 ... Base
103 ... (concave) side wall
104 ... 1st main surface
105 ... 2nd main surface
106 ... 3rd main surface
107 ・ ・ ・ Recess
108 ・ ・ ・ Connection conductor
109 ・ ・ ・ via conductor
110 ・ ・ ・ Relay conductor
111 ... Projection
112 ・ ・ ・ Internal wiring conductor
113 ・ ・ ・ Strip conductor
113a ...
114 ・ ・ ・ Frame metallization layer
115 ... External connection conductor
116 ・ ・ ・ Electronic parts
117 ・ ・ ・ Insulating film
118 ・ ・ ・ lid
119 ... brazing filler metal
200 ・ ・ ・ Electronic device
300 ・ ・ ・ Electronic module
301 ・ ・ ・ Substrate for module
302 ・ ・ ・ Connection pad
303 ・ ・ ・ Joint material

Claims (8)

A first main surface, and a base portion having a recess in the first main surface and mounting an electronic component in the recess;
A frame-like metallization layer located on the first main surface;
An internal wiring conductor connected to the frame-shaped metallized layer and connected to a relay conductor located at the base,
The internal wiring conductor includes a strip-shaped conductor having a plurality of curved portions in a longitudinal sectional view between the frame-like metallized layer and the relay conductor. A protrusion on the side wall of the recess,
2. The electronic component storing package according to claim 1, wherein the band-like conductor is positioned in the projecting portion in a side perspective view. The electronic component storage package according to claim 2, wherein the belt-like conductor is located on a side wall of the recess and the protrusion in a longitudinal sectional view. 4. The electronic component storage package according to claim 1, wherein an angle formed between the strip-shaped conductor and the frame-shaped metallized layer inside the concave portion is an acute angle in a longitudinal sectional view. 5. . In a plan view, the side wall of the recess has a rectangular frame shape,
5. The electronic component storage package according to claim 2, wherein the protruding portion is located on a side portion excluding a corner portion. 6. 6. The electronic component storage package according to claim 1, wherein the relay conductor is located inside the base portion. An electronic component storage package according to any one of claims 1 to 6,
An electronic device comprising: an electronic component mounted on the electronic component storage package. An electronic module comprising the electronic device according to claim 7 and a module substrate to which the electronic device is connected.

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