JP7075810B2 - Electronic component storage packages, electronic devices, and electronic modules - Google Patents

Description

The present invention relates to an electronic component storage package, an electronic device, and an electronic module for accommodating electronic components such as a piezoelectric vibration element or a semiconductor element.

Conventionally, a package-shaped wiring board has been devised in which electronic components are housed in a recess and the electronic components in the recess are connected to and mounted on an externally provided electric wiring conductor. By connecting an electronic component to an electronic device via this wiring board, it is possible to facilitate its handling and wiring connection. Further, by sealing the electronic component housed in the concave portion of the wiring board with a lid, the electronic component can be isolated from the external environment and the operation reliability can be improved.

Such a wiring board has a recess for accommodating an electronic component, and penetrates the inside and the outside of the recess in order to electrically connect the electronic component in the recess to an external connecting conductor provided outside. Those provided with wiring conductors are widely used.

Further, a metal material is used for the lid for sealing the recess, and the lid joined to the frame-shaped metallized layer via the side conductor provided on the side wall of the recess is provided on the lower surface of the wiring board. By being connected to a connecting conductor and supplying a ground voltage to the electrode, the structure is such that the influence of noise on the recesses of the wiring board is reduced. (See, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2004-55985

However, in recent years, electronic component storage packages have been increasingly miniaturized. Along with this, the following problems have come to occur. That is, since the width of the side conductor provided on the side wall of the recess is further reduced, there is a possibility that disconnection or deterioration of conductivity may occur.

The electronic component storage package according to one aspect of the present invention has a first main surface and a recess in the first main surface, and is located on the first main surface and a base for mounting the electronic component in the recess. It has a frame-shaped metallized layer and an internal wiring conductor connected to the frame-shaped metallized layer and connected to a relay conductor located at the base . The internal wiring conductor comprises the frame-shaped metallize layer and the relay conductor in a cross section when the protrusion and the base are cut in a plane parallel to the protrusion direction of the protrusion and perpendicular to the first main surface. In between , a strip-shaped conductor having a plurality of curved portions is included. The strip-shaped conductor has a curved portion located on the side wall and a curved portion located on the protruding portion as the plurality of curved portions in the cross section .

The electronic device according to one aspect of the present invention includes the above-mentioned electronic component storage package and electronic components mounted on the electronic component storage package.

The electronic module of one aspect of the present invention has the above-mentioned electronic device and a module substrate to which the electronic device is connected.

According to the electronic component storage package of one aspect of the present invention, the first main surface and the base having recesses in the first main surface and mounting the electronic components in the recesses, and the first main surface. It has a frame-shaped metallized layer located and an internal wiring conductor connected to the frame-shaped metallized layer and connected to a relay conductor located at the base, and the internal wiring conductor includes the frame-shaped metallized layer and the frame-shaped metallized layer. Since the band-shaped conductor having a plurality of curved portions in the vertical cross-sectional view is included between the relay conductor and the relay conductor, thermal stress is generated by the plurality of curved portions between the frame-shaped metallized layer and the relay conductor in the vertical cross-sectional view. It is relaxed and the disconnection of the internal wiring conductor can be suppressed.

According to the electronic device according to one aspect of the present invention, since the electronic component storage package and the electronic component mounted on the electronic component storage package are included, the wiring board can be accurately miniaturized. It is possible, and even if a band-shaped conductor is formed in the side wall of the recess, it is difficult to reduce the strength of the wiring board.

According to the electronic module of one aspect of the present invention, since the electronic device has the above-mentioned electronic device and the module substrate to which the electronic device is connected, by using the above-mentioned electronic device, the module substrate can be used. In addition, electronic components and circuits can be arranged more efficiently, and electronic modules can be made smaller, lighter, and more functional.

It is a top view which shows the electronic component storage package and the like in embodiment of this invention. FIG. 3 is a cross-sectional view taken along the line XX'of the electronic component storage package and the like shown in FIG. 1. It is a perspective view which shows the main part of the electronic component storage package of the embodiment shown in FIG. It is a top view which shows the other example of the electronic component storage package and the like in embodiment of this invention. It is a side perspective view of the electronic component storage package shown in FIG. 4 in the A direction. FIG. 3 is a cross-sectional view taken along the line YY'of the electronic component storage package and the like shown in FIG. FIG. 6 is an enlarged cross-sectional view of a main part of the electronic component storage package and the like shown in FIG. It is a perspective view which shows the main part in the electronic component storage package shown in FIG. It is sectional drawing which shows the other example of the electronic component accommodating package and the like in embodiment of this invention. It is a perspective view which shows the main part of the electronic component storage package shown in FIG.

The electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a top perspective view showing an example of an embodiment of the electronic component storage package of the present invention, and FIG. 1 (b) is a cross-sectional perspective view taken along line XX'of FIG. 1 (a).

In FIG. 1, the electronic component storage package 100 has a base 102. The base 102 includes a first main surface 104 on which the frame-shaped metallized layer 114 is located, a recess 107 on the first main surface 104, a second main surface 105 located on the bottom surface of the recess 107 on which electronic components 116 are mounted, and a module. It has a third main surface 106 that is on the mounting surface side of the board 300. Electronic components 116 such as piezoelectric vibration elements are mounted in the recess 107. The base 102 (insulating substrate 101) has a recess 107 and a side wall 103 (frame portion) of the recess 107. A strip-shaped conductor 113 is located inside the side wall 103 of the recess 107, and the frame-shaped metallized layer 114 and the strip-shaped conductor 113 are electrically connected to each other. Further, the strip-shaped conductor 113 is connected to the relay conductor 110 provided along a part of the side wall 103 of the recess 107 from the second main surface 105 of the base 102 to the inside in a plan view. Further, the relay conductor 110 is connected to the external connecting conductor 115 provided on the lower surface (third main surface 106) of the base 102 by the via conductor 109 provided on the base 102. As a result, the frame-shaped metallized layer 114 has a wiring structure in which the frame-shaped metallized layer 114 is electrically connected to the external connecting conductor 115 via the strip-shaped conductor 113, the relay conductor 110, and the via conductor 109. For the electronic component storage package 100, the lid 118 is joined to the insulating substrate 101 by a brazing material 119 such as silver brazing, and the electronic component 116 is hermetically sealed. In this embodiment, the base 102 has a concave recess 107 in a cross-sectional perspective in the thickness direction as shown in FIG. An electronic component 116 such as a piezoelectric vibration element is hermetically sealed in the electronic component storage package 100 to form an electronic device 200. The lid 118 that seals the recess 107 is seen through in FIG. 1 for easy viewing.

The base 102 has a first main surface 104 and a recess 107 on which the electronic component 116 is mounted on the first main surface 104. In plan view, the side wall 103 of the recess 107 surrounds the recess 107 on the top surface of the base 102. The base 102 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mulite sintered body or a glass-ceramic sintered body. The base 102 has, for example, a rectangular shape having a side length of about 1.2 to 10 mm and a plate shape having a thickness of about 0.2 to 2 mm in a plan view, and has a concave recess 107 on the upper surface thereof. There is. If the base 102 is made of an aluminum oxide sintered body, the base 102 is formed by adding and mixing an appropriate organic binder, solvent, plasticizer, etc. to raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. A ceramic green sheet is obtained by forming the ceramic green sheet into a sheet by a sheet forming method such as a doctor blade method or a roll calendar method, and then the ceramic green sheet is appropriately punched and printed. By pressurizing this ceramic green sheet with a convex portion of a pressurizing jig (not shown) having an uneven portion formed therein, a region of the ceramic green sheet below the base 102 is provided, and further pressurization cure is provided. A part of the ceramic green sheet, the frame-shaped metallized layer 114, by pressurizing the metallized paste which becomes the band-shaped conductor 113 together with the region of the ceramic green sheet which becomes the side wall 103 (frame part) of the recess 107 in the recessed portion of the tool. Further, the metallized paste to be the strip-shaped conductor 113 is moved to the recess of the jig to provide the side wall 103 of the recess 107, and a molded body in which a plurality of wiring board regions to be the wiring board 100 including the base 102 are arranged is formed. By firing this molded body at a high temperature, a mother substrate in which a plurality of wiring boards 100 are integrally formed is manufactured.

The base 102 (insulated substrate 101) is manufactured, for example, as a mother substrate (not shown) in which wiring board regions, each of which is an insulated substrate 101, are arranged, and then divided into individual pieces. There is. The mother substrate has a base 102 including a side wall 103 of the recess 107 in each wiring board region.

The side wall 103 (frame portion) of the recess 107 may have a frame-shaped metallized layer 114 on the upper surface, that is, the first main surface 104, and may have a notch portion (not shown) on the outer surface. Further, in the base 102, a connecting conductor 108, a band-shaped conductor 113, and a relay conductor 110 are provided as conductive paths for electrically connecting the electronic component 116 mounted in the recess 107 and the external electric circuit of the module substrate 301. A via conductor 109, an external connecting conductor 115, and the like are provided. Here, assuming that the electronic component 116 is a piezoelectric vibration element, an example is shown in which a pair of connecting conductors 108 are provided in the recess 107 of the base 102, but depending on the type, shape, size, etc. of the mounted electronic component, The structure may be such that three or more connecting conductors are provided in other places of the recess 107. Further, the base 102 may be provided with notches (not shown) at the four corners. Further, when a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) are mounted in the recess 107, the electronic device is mounted in the recess 107.
In some cases, a recess (not shown) having a stepped side wall on which a plurality of electronic components are mounted may be provided.

The recess 107 has a square shape in a plan view in accordance with, for example, a square frame-shaped electronic component 116. In the example of FIG. 1, a pair of connecting conductors 108 are provided at two adjacent corners of the rectangular recess 107. The connecting conductor 108 functions as a conductor layer for connecting electrodes (not shown) of electronic components 116 such as piezoelectric vibration elements housed in the recess 107. If the electronic component 116 is a piezoelectric vibration element, its outer shape is usually square in a plan view, and a pair of electrodes for connection are provided at the corners of the main surface thereof. The connecting conductor 108 is provided at the corner of the recess 107 so that such electrodes can be easily and reliably connected.

The connection between each electrode (not shown) of the electronic component 116 and the connecting conductor 108 is made via a joining material (not shown) such as a conductive adhesive. That is, as shown in FIG. 1, the electronic component 116 is placed in the recess 107 so that the pair of electrodes provided at the corners of the main surface of the electronic component 116 face the pair of connecting conductors 108 provided on the recess 107. After positioning, the bonding material previously adhered to the pair of connecting conductors 108 is heated and cured, and the electrodes of the electronic component 116 and the connecting conductors 108 are connected.

In the example of this embodiment, since the example in which the piezoelectric vibrating element is used as the electronic component 116 is described, the connecting conductor 108 is provided at the above position, but other electronic components (not shown). In the case of mounting a plurality of other electronic components, the number, position, and shape of the connecting conductor 108 may be changed according to the shape, arrangement, etc. of the electrodes of the electronic components, etc. good. Examples of such other electronic components include piezoelectric elements such as ceramic piezoelectric elements and elastic surface wave elements, semiconductor elements, capacitive elements, resistance elements, and the like.

The electronic component storage package 100 of the present invention has a recess 107 in the first main surface 104 and the first main surface 104, and is located at a base 102 for mounting the electronic component 116 in the recess 107 and a first main surface 104. It has a frame-shaped metallized layer 114 and an internal wiring conductor 112 connected to the frame-shaped metallized layer 114 and connected to a relay conductor 110 located at the base 102, and the internal wiring conductor 112 has a frame-shaped metallized layer 114. A strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view is included between the conductor 110 and the relay conductor 110.

With such a configuration, in the vertical cross-sectional view, the thermal stress is relaxed by the plurality of curved portions 113a between the frame-shaped metallized layer 114 and the relay conductor 110, and the disconnection of the internal wiring conductor 112 can be suppressed. That is, when the lid 118 is joined to the frame-shaped metallized layer 114, when a high temperature higher than the melting point of the brazing material is applied to the joint in order to melt the brazing material or the like adhered to the lid 118, this heats up. As stress, it is transmitted to the base 102 (insulated substrate 101), and this thermal stress may cause disconnection of the internal wiring conductor 112 at the connection portion between the frame-shaped metallized layer 114 and the internal wiring conductor 112. Can be suppressed.

Specifically, when a high temperature higher than the melting point of the brazing material is applied to the joint portion between the lid 118 and the frame-shaped metallized layer 114, the heat is transferred from the frame-shaped metallized layer 114 to the internal wiring conductor 112. However, since the internal wiring conductor 112 includes the strip-shaped conductor 113 having a plurality of curved portions 113a in the vertical cross-sectional view between the frame-shaped metallized layer 114 and the relay conductor 110, the internal wiring conductor 112 is heated to the internal wiring conductor 112 even if it is heat-treated. Even if the above is transmitted, the expansion of the internal wiring conductor 112 due to the difference in thermal expansion between the ceramic base 102 (insulating substrate 101) and the metal internal wiring conductor 112 can be caused by these plurality of curved portions 113a.
The strip-shaped conductor 113 having the above makes it easier to relax around the strip-shaped conductor 113 inside the side wall 103 of the recess 107.

Further, in the process of cooling the brazing material at the joint portion, the internal wiring conductor 112 expands in the direction in which the internal wiring conductor 112 is separated from the frame-shaped metallize 114 side in the thickness direction of the side wall 103 of the recess 107, so that the internal wiring conductor 112 contracts. There was a possibility that the internal wiring conductor 112 would be disconnected at the connection portion between the metallized layer 114 and the internal wiring conductor 112. However, since the strip-shaped conductor 113 having the plurality of curved portions 113a facilitates the thermal stress to be relaxed around the strip-shaped conductor 113 inside the side wall 103 of the recess 107, the inside of the side wall 103 of the recess 107 in the thickness direction. The shrinkage of the wiring conductor 112 can be further suppressed. Therefore, the possibility of disconnection of the internal wiring conductor 112 including the connection portion between the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be reduced.

An example of manufacturing the electronic component storage package 100 of the present invention will be specifically described below. As described above, the electronic component storage package 100 in which the internal wiring conductor 112 includes the strip-shaped conductor 113 having the plurality of curved portions 113a in the vertical cross-sectional view is manufactured between the frame-shaped metallized layer 114 and the relay conductor 110. For this purpose, for example, a plurality of through holes to be the via conductor 109 and the strip-shaped conductor 113 are provided by punching in each wiring board region of one ceramic green sheet to be the base 102 (insulating substrate 101). Next, a metallized paste is provided at a predetermined position inside these through holes by a suction method or the like. Then, in the region of each wiring board region of the ceramic green sheet that becomes the recess 107, the metallize paste that becomes the connection conductor 108 and the relay conductor 110 is applied, and in the region that becomes the side wall 103 of the recess 107, the metallize paste that becomes the frame-shaped metallize layer 114. Is provided at a predetermined position by the screen printing method.

Further, when the region of the ceramic green sheet to be the second main surface 105 of the base 102 is pressed by the convex portion of the pressurizing jig (not shown) in which the uneven portion is formed, the metallized paste serving as the connecting conductor 108 is used. The entire surface is further pressurized with respect to the region provided with the via conductor 109 in the metallized paste serving as the relay conductor 110, and the strip-shaped conductor 113 together with the region of the ceramic green sheet serving as the side wall 103 of the recess 107 at the recess of the pressurizing jig. By pressurizing the metallized paste that becomes
A part of the ceramic green sheet, the frame-shaped metallizing layer 114, and the metallizing paste that becomes the band-shaped conductor 113 move to the recesses of the jig, and as shown in FIGS. 1 to 3, the internal wiring conductor 112 is frame-shaped metallizing. Between the layer 114 and the relay conductor 110, it is possible to manufacture an electronic component storage package 100 including a strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view. By this pressurizing step, the through hole in which the metallized paste to be the strip-shaped conductor 113 is embedded is bent, and a plurality of curved portions 113a are provided.

The depth of the uneven portion of the pressurizing jig is constant, and the depth of the recess 107 after the pressurization process, that is, the depth of the recess 107 in which the electronic component 116 is housed can also be constant, as in the conventional case. Compared with the case where the recess 107 is provided depending on the thickness of the ceramic green sheet to be the frame portion, the dimensional accuracy at the depth of the recess 107 can be improved by using the pressure jig with high dimensional accuracy. .. Then, in the plurality of bases 102 provided with the recess 107, the internal wiring conductor 112 includes a strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view between the frame-shaped metallized layer 114 and the relay conductor 110. It is possible to manufacture a mother board in which a plurality of wiring board areas to be the electronic component storage package 100 are arranged.

In the above, one ceramic green sheet is deformed by a pressure jig to manufacture a mother board in which a plurality of wiring board areas to be a package 100 for storing electronic components are arranged, but the base 102 and the frame are shown. The electronic component storage package 100 may be manufactured by separately manufacturing the parts 103 and laminating and integrating a plurality of ceramic green sheets to be the base 102 and the frame part 103.

Further, the electronic component storage package 100 of the present invention has a protrusion 111 on the side wall 103 of the recess 107, and the strip-shaped conductor 113 is located at the protrusion 111 in the side perspective. With such a configuration, it is possible to prevent the strength of the side wall 103 of the recess 107 from being lowered by providing the internal wiring conductor 112 on the side wall 103 of the recess 107.

In other words, due to the recent miniaturization of electronic devices, the electronic component storage package 100 is also becoming smaller, so the external dimensions of the base 102 on which the electronic component 116 is mounted also become smaller, and the recess for accommodating the electronic component 116. The width of the side wall 103 of the recess 107 surrounding the 107 is also becoming smaller. As a result, the internal wiring conductor 112 that connects the frame-shaped metallized layer 114 and the external connecting conductor 115 formed on the lower surface (third main surface 106) of the insulating substrate 101 can be provided inside the side wall 103 of the recess 107. It's getting harder. However, as shown in FIGS. 4 to 5, the protrusion 111 is provided on the side wall 103 of the recess 107, and the strip-shaped conductor 113 is seen in the side view of the electronic component storage package 100 shown in FIG. 4 in the A direction. Since the configuration is located at the protrusion 111, it is difficult for the internal wiring conductor 112 including the strip-shaped conductor 113 to reduce the strength of the side wall 103 of the recess 107. Further, the structure may be such that the protrusion 111 supplements the strength of the side wall 103 of the recess 107 in the region where the internal wiring conductor 112 including the band-shaped conductor 113 is provided.

An example of manufacturing the electronic component storage package 100 of the present invention will be specifically described below. As described above, in order to manufacture the electronic component storage package 100 having the protrusion 111 on the inner side surface of the recess 107 and the strip-shaped conductor 113 located on the protrusion 111 in the side view, for example, As described above, one ceramic green sheet to be the base 102 (insulating substrate 101) is subjected to predetermined through-hole processing, printing processing, etc., and then the ceramic green sheet is added with a pressure jig having uneven portions. By pressing, it is possible to manufacture a mother board in which a plurality of wiring board regions to be the electronic component storage package 100 are arranged. During this pressurization step, the ceramic green sheet is formed by providing a counterbore portion (not shown) in a plan view at the portion corresponding to the projecting portion 111 among the convex portions of the pressurizing jig that pressurizes the concave portion 107. When pressure is applied, a part of the ceramic green sheet, the frame-shaped metallized layer 114, and the metallized paste that becomes the strip-shaped conductor 113 move to the counterbore portion of the pressure jig. As a result, it is possible to manufacture the electronic component storage package 100 in which the side wall 103 of the recess 107 has the protrusion 111 and the strip-shaped conductor 113 is located in the protrusion 111 in the side view. If the metallized paste serving as the internal wiring conductor 112 including the strip-shaped conductor 113 contains a resin that is easily deformed by heat, it can withstand the deformation caused by the pressurizing step performed by heating the ceramic green sheet.

The lid 118 bonded to the frame-shaped metallized layer 114 has a shape and dimensions such that the outer peripheral portion of the lower surface thereof is attached to the upper surface of the base 102 (insulating substrate 101), and is iron-nickel-cobalt alloy, iron. -It is made of a metal material such as nickel alloy. Further, for example, in the case of the iron-nickel-cobalt alloy, the lid 118 is formed by subjecting an iron-nickel-cobalt alloy plate material to appropriate metal processing such as rolling, punching, and etching to obtain a predetermined shape and shape. Manufactured by molding to dimensions. For joining the recess 107 to the upper surface of the side wall 103, for example, a frame-shaped metallized layer 114 is provided on the upper surface of the insulating substrate 101, and the lower outer peripheral portion of the lid 118 is made of gold on the frame-shaped metallized layer 114. -It is performed by joining means such as brazing method using brazing material such as tin, resistance welding method, electron beam welding method, and electron beam welding method.

The side wall 103 (frame portion) of the recess 107 has a protrusion 111 protruding from the side wall 103 of the recess 107 over the entire length in the thickness direction, and the internal wiring conductor 112 including the protrusion 111 penetrates in the thickness direction of the base 102. Is provided. The internal wiring conductor 112 includes a strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view, and is externally connected to the third main surface 106 for grounding via a relay conductor 110 located at the base portion 102. It is electrically connected to the conductor 115. As a result, it is possible to effectively suppress the electronic component 116 housed in the recess 107 from receiving noise (electromagnetic waves, etc.) from the outside. For example, if the electronic component 116 is a semiconductor element (semiconductor integrated circuit element) that handles high-frequency signals, such noise shielding is highly effective in suppressing malfunction and delay of the electronic component 116.

Further, in the electronic component storage package 100 of the present invention, the strip-shaped conductor 113 has a recess 107 in a vertical cross-sectional view.
It is located on the side wall and protrusion 111 of the. With such a configuration, it is possible to suppress a decrease in the strength of the side wall 103 of the recess 107 due to the provision of the internal wiring conductor 112 on the side wall 103 of the recess 107, and the thermal stress is relaxed by the plurality of curved portions 113a. It is possible to suppress disconnection of the internal wiring conductor 112.

That is, even if a high temperature higher than the melting point of the brazing filler metal is applied to the joint portion between the lid 118 and the frame-shaped metallized layer 114 and the heat is transferred from the frame-shaped metallized layer 114 to the internal wiring conductor 112, FIGS. As shown in 7, the internal wiring conductor 112 is placed between the frame-shaped metallized layer 114 and the relay conductor 110.
Since it contains a strip-shaped conductor 113 having a plurality of curved portions 113a located at the side wall 103 of the recess 107 and the protrusion 111 in a vertical cross-sectional view, the base 102 (insulating substrate 101) which is ceramic and the internal wiring which is metal are included. The expansion of the internal wiring conductor 112 due to the difference in thermal expansion from the conductor 112 is caused by these plurality of curved portions 113a.
The strip-shaped conductor 113 having the above makes it easier to relax around the strip-shaped conductor 113 inside the side wall 103 and the protrusion 111 of the recess 107. In the above case, in the plurality of curved portions 113a, each curved portion 113a may be located on the side wall or the protruding portion 111 of the recess 107, and the thermal stress is relaxed at a position separated from each other by the respective curved portions 113a. Therefore, it is possible to further suppress the disconnection of the internal wiring conductor 112.

If the strip-shaped conductor 113 is positioned so as to alternately straddle the boundary between the side wall 103 of the recess 107 and the protrusion 111 between the frame-shaped metallized layer 114 and the relay conductor 110 in a vertical cross-sectional view,
The expansion of the internal wiring conductor 112 due to the difference in thermal expansion between the base 102 (insulated substrate 101) and the metal internal wiring conductor 112 is more effective around the strip conductor 113 inside the side wall 103 and the protrusion 111 of the recess 107. It is easy to disperse and relax.

Further, in the process of cooling the brazing material at the joint between the lid 118 and the frame-shaped metallized layer 114, the internal wiring conductor 112 is the second main surface 105 in the thickness direction of the side wall 103 of the recess 107 from the frame-shaped metallized 114 side. Even if the internal wiring conductor 112 that expands to the side contracts, a plurality of curved portions 113 due to such a configuration
Since the strip-shaped conductor 113 having a makes it easy for the thermal stress inside the side wall 103 of the recess 107 and the protrusion 111 to relieve the thermal stress even when the brazing filler metal is cooled around the strip-shaped conductor 113, the side wall 103 of the recess 107 It is possible to further suppress the shrinkage of the internal wiring conductor 112 in the thickness direction of. Therefore, the possibility of disconnection of the internal wiring conductor 112 including the connection portion between the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be reduced.

Further, in the electronic component storage package 100 of the present invention, the angle θ1 formed by the band-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 is an acute angle in the vertical cross-sectional view. With such a configuration, the connection between the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be improved. That is, as shown in FIG. 7, in the vertical cross-sectional view, the frame-shaped metallized layer 114
Since the internal wiring conductor 112 (belt-shaped conductor 113) is diagonally connected at an acute angle θ1, the joint area between the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be increased even if the thickness of the internal wiring conductor 112 is small. ..

In this way, in order to make the angle θ1 formed by the band-shaped conductor 113 and the frame-shaped metallized layer 114 inside the concave portion 107 an acute angle, for example, a pressurizing jig having an uneven portion formed as described above is used. When the ceramic green sheet is pressed, a penetrating metallized paste that becomes a strip-shaped conductor 113 may be provided on the side wall of the recess 107 on the recess 107 side in each wiring board region. As a result, when the metallized paste that becomes the band-shaped conductor 113 is pressed together with the region of the ceramic green sheet that becomes the side wall 103 of the recess 107 in the base 102 in the recess of the pressurizing jig, the recess 107 side in the side wall of the recess 107 is pressed. The metallized paste that becomes the band-shaped conductor 113 is easily pressed together with the ceramic green sheet in the pressurizing jig, and the angle θ1 formed by the band-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 becomes an acute angle. Further, a part of the ceramic green sheet and the metallized paste to be the band-shaped conductor 113 move to the recess of the jig, and the internal wiring conductor 112 is placed between the frame-shaped metallized layer 114 and the relay conductor 110.
An electronic component that includes a strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view, and is configured such that the angle θ1 formed by the strip-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107 is an acute angle. A storage package 100 can be manufactured.

The angle θ1 formed by the strip-shaped conductor 113 and the frame-shaped metallized layer 114 tends to decrease as the pushing amount by the pressurizing jig, that is, the depth of the recess 107 increases, and the side wall 103 of the recess 107 in the base 102 tends to become smaller. The larger the thickness, the smaller the angle θ1 formed by the band-shaped conductor 113 and the frame-shaped metallized layer 114 inside the recess 107. Therefore, in the electronic component storage package 100 having a large recess 107, the joint area between the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be increased, and the frame-shaped metallized layer 114 and the internal wiring conductor 112 can be connected to each other. It can be better.

Further, in the electronic component storage package 100 of the present invention, the side wall of the concave portion 107 has a square frame shape in a plan view, and the protruding portion 111 is located on a side portion excluding a corner portion. With such a configuration, when the lid 118 is joined to the frame-shaped metallized layer 114, the start portion and the end portion of the beam irradiation are positioned at the projecting portion 111, whereby the reliability of the airtight seal is increased. Can be improved. That is, an electron beam that irradiates a beam along the outer periphery of the lid 118, irradiates this beam to melt the brazing material 119, and joins the lid 118 to the frame-shaped metallized layer 114 directly below the brazing material 119. When a joining means such as a welding method or an electron beam welding method is used, the region of the lid 118 directly above the frame-shaped metallized layer 114 in which the protruding portion 111 is located is set as the starting portion at the time of joining, and the lid is formed from this starting portion. A beam is emitted along the outer circumference of the body 118, and the region of the lid 118 directly above the frame-shaped metallized layer 114 in which the protrusion 111 is located around the outer circumference of the lid 118 is used as the end portion at the time of joining. By doing so, the brazing filler metal 119 in the region irradiated with the beam along the sealing line is melted and fused to the frame-shaped metallized layer 114 directly below the brazing material 119, and the start portion and the end portion at the time of joining are continuous in a frame shape. The sealing region is formed, and the sealing of the recess 107 by the lid 118 is completed.

At the time of this joining, the region that becomes the start part and the end part at the time of joining is located at the side part, that is, the side of the side wall 103 of the recess 107, and starts when the beam is irradiated along the outer periphery of the lid 118. It is easy to match the sealing position at the time with the sealing position at the end. Therefore, the package for storing electronic components 100
However, the lid 118 can be more reliably joined to the frame-shaped metallized layer 114 even if the size is reduced.

In addition, the region that becomes the start part and the end part of the joint is accompanied by two thermal histories due to the irradiation of the beam, but as shown in FIGS. 4 and 8, in the plan view, the side wall of the recess 107 is Since it has a square frame shape and the protruding portion 111 is located on the side portion excluding the corner portion, the influence of heat on the region that becomes the start portion and the end portion at the time of joining is affected by the side wall of the recess 107. Since the protrusion 111 located at 103 can be relaxed, the occurrence of remelting of the brazing filler metal 119 can be suppressed. As a result, the brazing filler metal 119 is remelted, resulting in a short circuit with the electronic component 116 due to the outflow to the recess 107, and the insulating substrate 101.
It is possible to reduce the possibility of sealing failure due to the outflow to the outer wall.

In the example of this embodiment, a metal layer such as a nickel-plated layer or a gold-plated layer is formed on the surface of an exposed conductor such as a frame-shaped metallized layer 114, a connecting conductor 108, and an external connecting conductor 115 (not shown).
Are sequentially adhered. Then, for example, the nickel plating layer is formed to be about 1.0 to 20 μm, and the gold plating layer is formed to be about 0.1 to 1.0 μm. Since the surface of each exposed wiring conductor is covered with a metal layer by these plating layers, the wiring conductor has excellent corrosion resistance and good wettability of solder and brazing material.

Further, in the electronic component storage package 100 of the present invention, the relay conductor 110 is located inside the base 102. Since the relay conductor 110 is not exposed to the recess 107 due to such a configuration, the electronic component 116 can be operated stably without causing an unintended short circuit or the like. That is, when the plated layer is adhered to the exposed surface of each wiring conductor, the lid 118 is attached to the frame-shaped metallized layer 114 with a brazing material 119 such as silver brazing material in order to airtightly seal the electronic component 116. When joining onto the base 102, the brazing filler metal 119 tends to spread through the plating layer. However, since the relay conductor 110 is located inside the base 102, for example, as shown in FIGS. 9 and 10, the relay conductor 110 is covered with the insulating film 117, so that the brazing material 119 is formed in the recess 107. Even when the brazing material 119 enters the recess 107 side through the side wall 103, the brazing material 119 does not wet and spread on the insulating film 117, so that the brazing material 119 can be prevented from spreading to the electronic component 116 side. Therefore, it is possible to realize the electronic component storage package 100 in which contact with the adjacent electronic component 116 due to the expansion of the brazing material 119 into the recess 107 and short circuit are suppressed.

In this way, in order to manufacture the electronic component storage package 100 in which the relay conductor 110 is not exposed in the recess 107, for example, in each wiring board region of one ceramic green sheet serving as the base 102 (insulation substrate 101). A plurality of through holes to be the via conductor 109 and the strip-shaped conductor 113 are provided by punching. Next, a metallized paste is provided at a predetermined position inside these through holes by a suction method or the like. Then, in the region of each wiring board region of the ceramic green sheet that becomes the recess 107, the metallize paste that becomes the connection conductor 108 and the relay conductor 110 is applied, and in the region that becomes the side wall 103 of the recess 107, the metallize paste that becomes the frame-shaped metallize layer 114. Is provided at a predetermined position by the screen printing method. At this time, the ceramic paste to be the insulating film 117 may be provided at a predetermined position by the screen printing method so as to cover the metallized paste to be the relay conductor 110. Further, the entire surface of the metallized paste that becomes the connecting conductor 108 at the convex portion of the pressurizing jig (not shown) in which the uneven portion is formed, and the region where the via conductor 109 is provided are included, and the metallized paste becomes the relay conductor 110. By pressurizing the ceramic paste that becomes the insulating film 117 that covers the above, and by pressing the metallized paste that becomes the strip-shaped conductor 113 together with the region of the ceramic green sheet that becomes the side wall 103 of the recess 107 in the base 102 at the recess of the pressurizing jig. ,
A part of the ceramic green sheet, the frame-shaped metallizing layer 114, and the metallizing paste to be the strip-shaped conductor 113 are moved to the recesses of the jig, and the internal wiring conductor 112 is placed between the frame-shaped metallizing layer 114 and the relay conductor 110. It is possible to manufacture a package 100 for storing electronic parts, which includes a strip-shaped conductor 113 having a plurality of curved portions 113a in a vertical cross-sectional view and in which the relay conductor 110 is not exposed to the recess 107. By this pressurizing step, the through hole in which the metallized paste to be the strip-shaped conductor 113 is embedded is bent, and a plurality of curved portions 113a are provided.

The electronic device 200 of the present invention includes the electronic component storage package 100 described in any of the above, and the electronic component 116 mounted on the electronic component storage package 100. With such a configuration, the wiring board can be miniaturized with high accuracy, and even if the strip-shaped conductor 113 is formed in the side wall 103 of the recess 107, the strength of the insulating substrate 101 is unlikely to be lowered. That is, in the vertical cross-sectional view, the electronic component storage package 100 is used in which the thermal stress is relaxed by the plurality of curved portions 113a between the frame-shaped metallized layer 114 and the relay conductor 110 and the disconnection of the internal wiring conductor 112 is suppressed. This makes it possible to provide an electronic device 200 that can be efficiently and accurately miniaturized according to the size of the electronic component 116.

Further, if the electronic component storage package 100 has a protruding portion 111 on the side wall 103 of the recess 107 and the strip-shaped conductor 113 is located at the protruding portion 111 in the side view, the internal wiring including the strip-shaped conductor 113 is included. The protrusion 111 compensates for the strength of the side wall 103 of the recess 107 in the region where the conductor 112 is provided, and the internal wiring conductor 112 including the band-shaped conductor 113 does not reduce the strength of the side wall 103 of the recess 107. Therefore, it is suppressed that the strength of the side wall 103 of the recess 107 is lowered by providing the internal wiring conductor 112 on the side wall 103 of the recess 107, and the recess is caused by the thermal stress when the lid 118 is joined to the frame-shaped metallized layer 114. Since cracks and the like are suppressed from being generated on the side wall 103 of the 107, it is possible to realize an electronic device 200 having improved reliability of airtight sealing of the electronic component 116 housed in the recess 107.

Further, as shown in FIG. 4, the protruding portion 111 of the electronic component storage package 100 is the electronic component 116.
If it is located on a part of the long side of the connecting conductor 108 to which the electronic component 116 is connected, the electronic component 116 is electrically connected to the connecting conductor 108 via an electrical connecting means such as a bonding wire or solder. The protrusion 111 does not interfere with the connection to the electronic component 116, and an unintended short circuit between the electronic component 116 and the connecting conductor 108 does not occur. Therefore, it is possible to provide an electronic device 200 having excellent reliability of airtight sealing and excellent mountability and connectivity of the electronic component 116 to the recess 107.

The electronic module 300 of the present invention has the electronic device 200 described above and a module substrate 301 to which the electronic device 200 is connected. With such a configuration, by using the above-mentioned electronic device 200, electronic components 116 and circuits can be arranged more efficiently on the module board 301, and the electronic module 300 can be made smaller and lighter. It is possible to improve the functionality and functionality. That is, since it has the electronic component 116 mounted on the above-mentioned electronic component storage package 100, it is not easily affected by the formation of the wiring conductor, and is effectively and accurately stored according to the size of the electronic component 116. The package 100 can be miniaturized, and even if the strip-shaped conductor 113 is formed inside the side wall 103 of the recess 107, the strength of the electronic component storage package 100 does not easily decrease. The designed electronic module 300 can be realized.

As shown in FIGS. 2, 6, and 9, the electronic module 300 has a structure in which the above-mentioned electronic device 200 is mounted on a module substrate 301 provided with a connection pad 302 by a joining material 303 such as solder. Includes. Examples of the electronic component 116 include a crystal oscillator and a surface acoustic wave element (S).
AW filter) and the like, but are not limited to these. Various electronic components such as piezoelectric elements, capacitive elements, and resistance elements for other purposes can be used. Further, if necessary, a plurality of electronic components 116 and other electronic components (not shown) may be provided in one recess 107.

The present invention is not limited to the above embodiment, and various modifications can be made. For example, an example is shown in which the internal wiring conductor 112 is formed only at one position on the long side side of the side wall 103 of the recess 107 in the base 102, but the types, applications, and characteristics of the electronic device 200 and the electronic component 116 are improved. In addition, a plurality of may be provided in other places of the side wall 103 of the recess 107 in the base 102.

Further, the shape of the base 102 does not have to be a rectangular parallelepiped. It may be a polygon other than a quadrangle in a plan view, or it may be a quadrilateral that is not a rectangular parallelepiped. Further, the side surface of the recess 107 formed by the side wall 103 of the recess 107 and the bottom surface of the recess 107 formed by the base 102 may be a curved surface instead of a flat surface. again,
The side wall 103 of the recess 107 may have a tapered shape, or a step portion may be provided in the middle.

Further, the number, arrangement, and positional relationship of the connecting conductor 108, the external connecting conductor 115, and the wiring connecting them may be appropriately changed according to the electronic component 116 accommodated in the recess 107. Further, the shape of the connecting conductor 108 may be changed to other than the rectangular shape.

Further, in the above embodiment, the electronic component storage package 100 or the like having one recess 107 provided on a single surface has been described as an example, but a plurality of recesses are provided on a single surface. Alternatively, recesses may be provided on the upper and lower surfaces of the base 102, respectively.

Further, in the above embodiment, the electronic component storage package 100 or the like in which the lid 118 is joined to the frame-shaped metallized layer 114 by the brazing material 119 is shown as an example, but a metal frame (not shown) is shown on the frame-shaped metallized layer 114. It may be a package for storing electronic components in which the bodies are joined and the lid 118 is joined on the metal frame. With such a configuration, the thermal stress at the time of joining the lid 118 can be relaxed by the metal frame as compared with the case where there is no metal frame, so that there are a plurality of layers between the frame-shaped metallized layer 114 and the relay conductor 110. In addition to the effect of relaxing the thermal stress by the curved portion, it is possible to more effectively suppress the occurrence of disconnection and cracks in the internal wiring conductor.

In addition, specific details such as the specific configuration, shape, arrangement, and positional relationship shown in the above embodiment can be appropriately changed without departing from the spirit of the present invention.

100 ・ ・ ・ Package for storing electronic components (wiring board)
101 ・ ・ ・ Insulation board
102 ... base
103 ... (concave) side wall
104 ... 1st main surface
105 ・ ・ ・ 2nd main surface
106 ・ ・ ・ Third main surface
107 ・ ・ ・ Recess
108 ・ ・ ・ Connecting conductor
109 ・ ・ ・ Via conductor
110 ・ ・ ・ Relay conductor
111 ・ ・ ・ Protruding part
112 ・ ・ ・ Internal wiring conductor
113 ・ ・ ・ Strip conductor
113a ...
114 ・ ・ ・ Frame-shaped metallize layer
115 ・ ・ ・ External connecting conductor
116 ・ ・ ・ Electronic components
117 ・ ・ ・ Insulation film
118 ・ ・ ・ Closure
119 ・ ・ ・ Wax material
200 ・ ・ ・ Electronic device
300 ・ ・ ・ Electronic module
301 ・ ・ ・ Module board
302 ・ ・ ・ Connection pad
303 ・ ・ ・ Joining material

Claims (5)

A base having a recess on the first main surface and the first main surface on which electronic components are mounted, and
The frame-shaped metallized layer located on the first main surface and
It has an internal wiring conductor connected to the frame-shaped metallized layer and connected to a relay conductor located at the base.
The base has a protrusion on the side wall of the recess.
The internal wiring conductor comprises the frame-shaped metallize layer and the relay conductor in a cross section when the protrusion and the base are cut in a plane parallel to the protrusion direction of the protrusion and perpendicular to the first main surface. Includes a strip conductor with multiple bends in between ,
The strip-shaped conductor is a package for storing electronic components, characterized in that, in the cross section, the plurality of curved portions include a curved portion located on the side wall and a curved portion located on the protruding portion . The electronic component storage package according to claim 1 , wherein in the cross section, the angle formed by the band-shaped conductor and the frame-shaped metallized layer inside the recess is an acute angle. In a plan view, the side wall of the recess has a square frame shape.
The electronic component storage package according to claim 1 or 2 , wherein the protruding portion is located on a side portion excluding a corner portion. The electronic component storage package according to any one of claims 1 to 3 .
An electronic device comprising an electronic component mounted on the electronic component storage package. An electronic module comprising the electronic device according to claim 4 and a module board to which the electronic device is connected.

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