JP3801935B2 - Electronic component mounting board - Google Patents

Electronic component mounting board Download PDF

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Publication number
JP3801935B2
JP3801935B2 JP2002076236A JP2002076236A JP3801935B2 JP 3801935 B2 JP3801935 B2 JP 3801935B2 JP 2002076236 A JP2002076236 A JP 2002076236A JP 2002076236 A JP2002076236 A JP 2002076236A JP 3801935 B2 JP3801935 B2 JP 3801935B2
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JP
Japan
Prior art keywords
electronic component
ceramic
metallized
mounting
wiring conductor
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JP2002076236A
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Japanese (ja)
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JP2003273290A (en
Inventor
雄一 古本
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Kyocera Corp
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Kyocera Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、半導体素子や圧電振動子等の電子部品を搭載するための電子部品搭載用基板に関するものである。
【0002】
【従来の技術】
半導体素子等の電子部品を搭載するための電子部品搭載用基板は、例えば、上面中央部に電子部品が搭載される搭載領域を有する略四角平板状のセラミック基体と、このセラミック基体の搭載領域から外周縁にかけて被着された複数のメタライズ配線導体と、このセラミック基体の側面から下面にかけて前記メタライズ配線導体と電気的に接続されるようにして被着された外部接続メタライズ端子とから構成されている。そして、この電子部品搭載用基板は、セラミック基体の搭載部に電子部品をその電極がメタライズ配線導体に導電性接合部材を介して電気的に接続されるようにして搭載し、しかる後、セラミック基体および電子部品の上に、例えばエポキシ樹脂等の熱硬化性樹脂から成る封止樹脂を電子部品を封止するように固着させることによって製品としての電子装置となり、セラミック基体の側面から下面にかけて被着させた外部接続メタライズ端子を外部電気回路基板の配線導体に半田等の導電性接合部材を介して接合することにより搭載する電子部品が外部電気回路に電気的に接続される。
【0003】
ところで、このような電子部品搭載用基板は、近時における電子装置の小型化、薄型化の要求に伴い、その大きさが0.5〜10mm角程度、厚みが0.1〜0.25mm程度の極めて小さく薄いものとなってきている。
【0004】
また、このような電子部品搭載用基板は、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等のセラミック原料粉末に適当な有機バインダーおよび溶剤、可塑剤、分散剤等を添加混合して得たセラミックスラリーを従来周知のドクターブレード法を採用してシート状に成形することによりセラミック基体用のセラミックグリーンシートを得、しかる後、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、メタライズ配線導体および外部接続メタライズ端子用の金属ペーストをスクリーン印刷法等の厚膜手法を採用して所定のパターンに印刷塗布することで生セラミック成形体を得、しかる後、この生セラミック成形体を還元雰囲気中で約1600℃の温度で焼成することによって製作されている。
【0005】
【発明が解決しようとする課題】
しかしながら、電子部品搭載用基板の厚みを0.1〜0.25mm程度と薄いものにした場合、これを製作する際に、セラミック基体用のセラミックグリーンシートとメタライズ配線導体用の金属ペーストとの焼成収縮率の相違に起因してセラミック基体上面の搭載領域に例えば20μmを超える大きな反りが発生しやすくなり、そのような大きな反りが発生すると、セラミック基体上面の搭載領域に電子部品をその各電極がメタライズ配線導体に導電性接合部材を介して電気的に接続されるようにして搭載する際に、電子部品の各電極をそれぞれに対応するメタライズ配線導体に正確、かつ強固に接続することができないという問題点を有していた。
【0006】
本発明は、かかる従来の問題点に鑑み案出されたものであり、その目的は、セラミック基体の搭載領域に大きな反りが発生することがなく、電子部品の各電極をそれぞれに対応するメタライズ配線導体に正確、かつ強固に接続させることが可能な電子部品搭載用基板を提供することにある。
【0007】
【課題を解決するための手段】
本発明の電子部品搭載用基板は、上面に電子部品が搭載される搭載領域を有するセラミック基体と、前記セラミック基体の上面の前記搭載領域から外周縁にかけて被着された複数のメタライズ配線導体と、前記セラミック基体の側面から下面にかけて前記メタライズ配線導体と電気的に接続されるようにして被着された外部接続メタライズ端子とを具備して成る電子部品搭載用基板であって、前記セラミック基体は2層のセラミック層を積層して成り、前記2層のセラミック層の間の前記搭載領域に対応する領域の全面に、前記メタライズ配線導体から電気的に独立したダミーのメタライズ層が被着されていることを特徴とするものである。
【0008】
本発明の電子部品搭載用基板によれば、前記セラミック基体は2層のセラミック層を積層して成り、前記2層のセラミック層の間の前記搭載領域に対応する領域の全面に、前記メタライズ配線導体から電気的に独立したダミーのメタライズ層が被着されていることから、これを製作する際に、セラミック基体用のセラミックグリーンシートとメタライズ配線導体用の金属ペーストとの焼成収縮率の相違により反りが発生しようとしても、その反りはダミーのメタライズ層により抑制され、その結果、セラミック基体の搭載領域に電子部品を搭載する際に電子部品の各電極をそれぞれに対応するメタライズ配線導体に正確、かつ強固に接続することができる。
【0009】
【発明の実施の形態】
次に、本発明を添付の図面に基づき詳細に説明する。
【0010】
図1は、本発明の電子部品搭載用基板の実施形態の一例を示す断面図であり、1はセラミック基体、2は電子部品、3はメタライズ配線導体、4は外部接続メタライズ端子、5はダミーのメタライズ層である。
【0011】
セラミック基体1は、例えば酸化アルミニウム質燒結体や窒化アルミニウム質燒結体、ムライト質燒結体、窒化珪素質燒結体、ガラス−セラミックス等のセラミックス材料から成る2層のセラミック層1a、1bを積層して成る略四角平板であり、その上面の中央部には電子部品2が搭載される搭載領域1cを有している。そして、この搭載領域1c上に電子部品2がその電極を下にして搭載される。
【0012】
このようなセラミック基体1は、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤を添加混合して泥漿状のセラミックスラリーとなすとともにこれを従来周知のドクターブレード法を採用することによってシート状となすことによりセラミック層1a、1b用のセラミックグリーンシートを得、これのセラミックグリーンシートに適当な打ち抜き加工を施すとともにそれらを上下に積層してセラミック基体1用の生セラミック成形体と成し、最後にこの生セラミック成形体を還元雰囲気中、約1600℃の温度で焼成することによって製作される。
【0013】
また、セラミック基体1の上面には電子部品2が搭載される搭載領域1cからその外周縁にかけて複数のメタライズ配線導体3が被着されているとともに、セラミック基体1の側面から下面にかけては、メタライズ配線導体3に電気的に接続された複数の外部接続メタライズ端子4が被着されている。
【0014】
メタライズ配線導体3はセラミック基体1上面の搭載領域1cに搭載される電子部品2の各電極を外部接続メタライズ端子4に電気的に接続するための導電路として機能し、その搭載領域1c部位には電子部品2の電極が半田等の導電性接合部材を介して接続される。また、外部接続メタライズ端子4は、搭載領域1cに搭載された電子部品2の各電極を外部電気回路基板の配線導体に接続するための接続端子として機能し、外部電気回路基板の配線導体に半田等の導電性接合部材を介して接続されることにより搭載部1cに搭載された電子部品2の各電極が外部電気回路に電気的に接続されることとなる。
【0015】
このようなメタライズ配線導体3および外部接続メタライズ端子4は、いずれもタングステンやモリブデン、銅、銀等の金属粉末メタライズから成り、例えばタングステンメタライズから成る場合であれば、タングステン粉末に適当な有機バインダー、溶剤を添加混合して得た金属ペーストをセラミック層1a用のセラミックグリーンシートの上面およびセラミック層1b用のセラミックグリーンシートの下面、ならびにセラミック基体1用の生セラミック成型体の側面に従来周知のスクリーン印刷法を採用して所定のパターンに印刷塗布し、これをセラミック基体1用の生セラミック成型体とともに焼成することによって、セラミック基体1の上面の搭載領域1cから外周縁にかけておよびセラミック基体1の側面から下面にかけて所定のパターンに被着形成される。
【0016】
なお、これらのメタライズ配線導体3および外部接続メタライズ端子4の露出表面には、これらのメタライズ配線導体3や外部接続メタライズ端子4が酸化腐食するのを防止するとともに、メタライズ配線導体3および外部接続メタライズ端子4と半田等の導電性接合部材との接続を良好なものとするために、通常であれば、1〜10μm程度の厚みのニッケルめっき層および0.1〜3μm程度の金めっき層が順次被着されている。
【0017】
さらに、本発明の電子部品搭載用基板においては、セラミック層1aと1bとの間で搭載領域1cに対応する領域の全面にメタライズ配線導体3から電気的に独立したダミーのメタライズ層5が被着されている。このダミーのメタライズ層5は、タングステンやモリブデン、銅、銀等の金属粉末メタライズから成り、セラミック基体1の搭載領域1cに大きな反りが発生するのを防止する作用を為し、セラミック層1a用のセラミックグリーンシートの下面またはセラミック層1b用のセラミックグリーンシートの上面にダミーのメタライズ層5用の金属ペーストを印刷塗布しておき、それをセラミック基体1用の生セラミック成型体とともに焼成することによってセラミック層1aと1bとの間で搭載領域1cに対応する領域の全面にメタライズ配線導体3から電気的に独立した状態で被着形成される。このとき、セラミック層1a用のセラミックグリーンシートとメタライズ配線導体用の金属ペーストとの焼成収縮率の相違によりセラミック基体1の搭載部1cに大きな反りが発生しようとしても、その反りはセラミック層1a用のセラミックグリーンシートとセラミック層1b用のセラミックグリーンシートとの間に印刷塗布されたダミーのメタライズ層5用の金属ペーストの焼成収縮により抑制され、その結果、セラミック基体1の厚みが0.1〜0.25mmと薄い場合であってもセラミック基体1の搭載部1cの反りを20μm以下の小さいものとすることができる。したがって本発明の電子部品搭載用基板によれば、電子部品2の各電極をそれぞれに対応するメタライズ配線導体3に正確、かつ強固に接続することができる。また、ダミーのメタライズ層5は、メタライズ配線導体3から電気的に独立していることから、メタライズ配線導体3同士の間にダミーのメタライズ層5に起因する不要な静電容量が形成されることがなく、搭載する電子部品2を正常に作動させることができる。
【0018】
かくして、上述の電子部品搭載用基板によれば、セラミック基体1の搭載領域1c上に電子部品2をその各電極が各メタライズ配線導体3に導電性接合部材を介して電気的に接続されるようにして搭載させ、しかる後、セラミック基体1および電子部品2の上に、例えばエポキシ樹脂等の熱硬化性樹脂から成る封止樹脂を電子部品2を封止するように固着させることによって製品としての電子装置となり、セラミック基体1の側面から下面にかけて被着させた外部接続メタライズ端子4を外部電気回路基板の配線導体に半田等の導電性接合部材を介して接合することにより搭載する電子部品2が外部電気回路に電気的に接続されることとなる。
【0019】
なお、本発明は、上述の実施の形態例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば、種々の変更は可能である。
【0020】
【発明の効果】
本発明の電子部品搭載用基板によれば、上面に電子部品が搭載される搭載領域を有するセラミック基体と、前記セラミック基体の上面の前記搭載領域から外周縁にかけて被着された複数のメタライズ配線導体と、前記セラミック基体の側面から下面にかけて前記メタライズ配線導体と電気的に接続されるようにして被着された外部接続メタライズ端子とを具備して成る電子部品搭載用基板であって、前記セラミック基体は2層のセラミック層を積層して成り、前記2層のセラミック層の間の前記搭載領域に対応する領域の全面に、前記メタライズ配線導体から電気的に独立したダミーのメタライズ層が被着されていることから、これを製作する際に、セラミック基体用のセラミックグリーンシートとメタライズ配線導体用の金属ペーストとの焼成収縮率の相違により搭載領域に反りが発生しようとしても、その反りはダミーのメタライズ層により抑制され、その結果、セラミック基体の搭載領域に電子部品を搭載する際に電子部品の各電極をそれぞれに対応するメタライズ配線導体に正確、かつ強固に接続することが可能な電子部品搭載用基板を提供することができる。
【図面の簡単な説明】
【図1】 本発明の電子部品搭載用基板の実施の形態の一例を示す断面図である。
【符号の説明】
1・・・セラミック基体
2・・・電子部品
2a・・・搭載領域
3・・・メタライズ配線導体
4・・・外部接続メタライズ端子
5・・・ダミーのメタライズ層
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting substrate for mounting electronic components such as semiconductor elements and piezoelectric vibrators.
[0002]
[Prior art]
An electronic component mounting board for mounting an electronic component such as a semiconductor element includes, for example, a substantially square plate-shaped ceramic base having a mounting region in which the electronic component is mounted at the center of the upper surface, and a mounting region of the ceramic base. It is composed of a plurality of metallized wiring conductors deposited over the outer peripheral edge and external connection metallized terminals deposited so as to be electrically connected to the metallized wiring conductor from the side surface to the bottom surface of the ceramic substrate. . The electronic component mounting board mounts the electronic component on the ceramic base mounting portion so that the electrode is electrically connected to the metallized wiring conductor via the conductive bonding member, and then the ceramic base. In addition, an electronic device as a product is obtained by fixing a sealing resin made of a thermosetting resin such as an epoxy resin on the electronic component so as to seal the electronic component, and is applied from the side surface to the lower surface of the ceramic substrate. An electronic component to be mounted is electrically connected to the external electric circuit by bonding the external connection metallized terminal thus formed to the wiring conductor of the external electric circuit board via a conductive bonding member such as solder.
[0003]
By the way, such an electronic component mounting board has a size of about 0.5 to 10 mm square and a thickness of about 0.1 to 0.25 mm in accordance with recent demands for downsizing and thinning electronic devices. It has become extremely small and thin.
[0004]
In addition, when such an electronic component mounting substrate is made of, for example, an aluminum oxide sintered body, an organic binder and solvent suitable for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide, A ceramic green sheet for a ceramic substrate is obtained by forming a ceramic slurry obtained by adding and mixing a plasticizer, a dispersing agent and the like into a sheet shape by employing a conventionally known doctor blade method, and then the ceramic green sheet. In addition to performing a suitable punching process, a metal paste for metallized wiring conductors and external connection metallized terminals is obtained by applying a thick film technique such as screen printing to a predetermined pattern to obtain a green ceramic molded body, Thereafter, the green ceramic molded body was about 1600 in a reducing atmosphere. It is made by firing at the temperature.
[0005]
[Problems to be solved by the invention]
However, when the thickness of the electronic component mounting substrate is made as thin as about 0.1 to 0.25 mm, the ceramic green sheet for the ceramic substrate and the metal paste for the metallized wiring conductor are fired when the substrate is manufactured. Due to the difference in shrinkage rate, a large warpage exceeding, for example, 20 μm is likely to occur in the mounting area on the upper surface of the ceramic substrate. When such a large warpage occurs, electronic components are placed on the mounting area on the upper surface of the ceramic substrate. When mounting so that it is electrically connected to the metallized wiring conductor via a conductive bonding member, it is impossible to accurately and firmly connect each electrode of the electronic component to the corresponding metallized wiring conductor. Had problems.
[0006]
The present invention has been devised in view of such conventional problems, and an object thereof is to provide a metallized wiring corresponding to each electrode of an electronic component without causing a large warp in a ceramic substrate mounting region. An object of the present invention is to provide an electronic component mounting board that can be accurately and firmly connected to a conductor.
[0007]
[Means for Solving the Problems]
The electronic component mounting board of the present invention includes a ceramic base having a mounting area on which an electronic component is mounted on the upper surface, and a plurality of metallized wiring conductors deposited from the mounting area to the outer periphery of the upper surface of the ceramic base; An electronic component mounting board comprising an external connection metallized terminal attached so as to be electrically connected to the metallized wiring conductor from a side surface to a lower surface of the ceramic substrate, wherein the ceramic substrate is 2 A dummy metallized layer that is electrically independent from the metallized wiring conductor is deposited on the entire surface of the region corresponding to the mounting region between the two ceramic layers. It is characterized by this.
[0008]
According to the electronic component mounting substrate of the present invention, the ceramic base is formed by laminating two ceramic layers, and the metallized wiring is formed on the entire surface of the region corresponding to the mounting region between the two ceramic layers. Since a dummy metallized layer that is electrically independent from the conductor is applied, when manufacturing this, due to the difference in firing shrinkage between the ceramic green sheet for the ceramic substrate and the metal paste for the metallized wiring conductor Even if warpage is about to occur, the warpage is suppressed by the dummy metallization layer.As a result, when mounting the electronic component on the ceramic substrate mounting area, each electrode of the electronic component is accurately applied to the corresponding metallized wiring conductor, And it can connect firmly.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail with reference to the accompanying drawings.
[0010]
FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component mounting board according to the present invention, wherein 1 is a ceramic substrate, 2 is an electronic component, 3 is a metallized wiring conductor, 4 is an external connection metallized terminal, and 5 is a dummy. It is a metallized layer.
[0011]
The ceramic substrate 1 is formed by laminating two ceramic layers 1a and 1b made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, or a glass-ceramic. It has a mounting area 1c on which the electronic component 2 is mounted at the center of the upper surface. Then, the electronic component 2 is mounted on the mounting area 1c with the electrode facing down.
[0012]
If such a ceramic substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. A ceramic green sheet for the ceramic layers 1a and 1b is obtained by adopting a conventionally known doctor blade method and a ceramic green sheet for the ceramic layers 1b, and an appropriate punching process is performed on the ceramic green sheet. These are formed into a green ceramic molded body for the ceramic substrate 1 and finally fired at a temperature of about 1600 ° C. in a reducing atmosphere.
[0013]
A plurality of metallized wiring conductors 3 are deposited on the upper surface of the ceramic substrate 1 from the mounting region 1c on which the electronic component 2 is mounted to the outer peripheral edge thereof, and metallized wiring is formed from the side surface to the lower surface of the ceramic substrate 1. A plurality of external connection metallized terminals 4 electrically connected to the conductor 3 are attached.
[0014]
The metallized wiring conductor 3 functions as a conductive path for electrically connecting each electrode of the electronic component 2 mounted on the mounting region 1c on the upper surface of the ceramic substrate 1 to the external connection metallized terminal 4. The electrodes of the electronic component 2 are connected via a conductive bonding member such as solder. The external connection metallized terminal 4 functions as a connection terminal for connecting each electrode of the electronic component 2 mounted in the mounting region 1c to the wiring conductor of the external electric circuit board, and is soldered to the wiring conductor of the external electric circuit board. Each electrode of the electronic component 2 mounted on the mounting portion 1c is electrically connected to an external electric circuit by being connected via a conductive bonding member such as.
[0015]
Such metallized wiring conductor 3 and external connection metallized terminal 4 are all made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc. For example, when made of tungsten metallize, an organic binder suitable for tungsten powder, Conventionally known screens are obtained by adding a metal paste obtained by adding a solvent to the upper surface of the ceramic green sheet for the ceramic layer 1a, the lower surface of the ceramic green sheet for the ceramic layer 1b, and the side of the green ceramic molded body for the ceramic substrate 1. By adopting a printing method, a predetermined pattern is printed and applied, and this is fired together with a green ceramic molded body for the ceramic substrate 1, so that the mounting surface 1 c on the upper surface of the ceramic substrate 1 extends to the outer peripheral edge and the side surface of the ceramic substrate 1. To the bottom It is deposited formed in turn.
[0016]
The exposed surfaces of the metallized wiring conductor 3 and the external connection metallized terminal 4 prevent the metallized wiring conductor 3 and the external connection metallized terminal 4 from being oxidized and corroded, and the metallized wiring conductor 3 and the external connection metallized terminal 4. In order to improve the connection between the terminal 4 and a conductive joining member such as solder, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are usually sequentially formed. It is attached.
[0017]
Furthermore, in the electronic component mounting substrate of the present invention, the dummy metallized layer 5 electrically isolated from the metallized wiring conductor 3 is deposited on the entire surface of the region corresponding to the mounting region 1c between the ceramic layers 1a and 1b. Has been. This dummy metallization layer 5 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and serves to prevent a large warp from occurring in the mounting region 1c of the ceramic substrate 1, and is used for the ceramic layer 1a. The metal paste for the dummy metallized layer 5 is printed on the lower surface of the ceramic green sheet or the upper surface of the ceramic green sheet for the ceramic layer 1b, and the ceramic paste is fired together with the green ceramic molded body for the ceramic substrate 1. Between the layers 1a and 1b, it is deposited on the entire surface of the region corresponding to the mounting region 1c while being electrically independent from the metallized wiring conductor 3. At this time, even if a large warp occurs in the mounting portion 1c of the ceramic substrate 1 due to the difference in firing shrinkage between the ceramic green sheet for the ceramic layer 1a and the metal paste for the metallized wiring conductor, the warp is for the ceramic layer 1a. Is suppressed by firing shrinkage of the metal paste for the dummy metallized layer 5 printed and applied between the ceramic green sheet and the ceramic green sheet for the ceramic layer 1b. Even when the thickness is as small as 0.25 mm, the warp of the mounting portion 1c of the ceramic substrate 1 can be as small as 20 μm or less. Therefore, according to the electronic component mounting substrate of the present invention, each electrode of the electronic component 2 can be accurately and firmly connected to the corresponding metallized wiring conductor 3. Further, since the dummy metallized layer 5 is electrically independent from the metallized wiring conductor 3, an unnecessary capacitance caused by the dummy metallized layer 5 is formed between the metallized wiring conductors 3. The mounted electronic component 2 can be operated normally.
[0018]
Thus, according to the electronic component mounting substrate described above, the electronic component 2 and the electrodes thereof are electrically connected to the metallized wiring conductors 3 via the conductive bonding members on the mounting region 1c of the ceramic substrate 1. After that, a sealing resin made of a thermosetting resin such as an epoxy resin is fixed on the ceramic substrate 1 and the electronic component 2 so as to seal the electronic component 2 as a product. An electronic component 2 to be mounted by joining an external connection metallized terminal 4 attached from the side surface to the lower surface of the ceramic substrate 1 to a wiring conductor of an external electric circuit board via a conductive bonding member such as solder, becomes an electronic device. It is electrically connected to an external electric circuit.
[0019]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
[0020]
【The invention's effect】
According to the electronic component mounting substrate of the present invention, a ceramic base having a mounting region on which an electronic component is mounted on the upper surface, and a plurality of metallized wiring conductors deposited from the mounting region to the outer periphery of the upper surface of the ceramic base. And an external connection metallized terminal attached so as to be electrically connected to the metallized wiring conductor from the side surface to the lower surface of the ceramic substrate, wherein the ceramic substrate Is formed by laminating two ceramic layers, and a dummy metallized layer electrically isolated from the metallized wiring conductor is deposited on the entire surface of the region corresponding to the mounting region between the two ceramic layers. Therefore, when manufacturing this, the ceramic green sheet for the ceramic substrate and the metal paste for the metallized wiring conductor Even if the warpage of the mounting area due to the difference in growth / shrinkage rate occurs, the warpage is suppressed by the dummy metallization layer. As a result, when mounting the electronic component on the mounting area of the ceramic substrate, It is possible to provide an electronic component mounting board that can be accurately and firmly connected to a metallized wiring conductor corresponding to the above.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component mounting board according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic base | substrate 2 ... Electronic component 2a ... Mounting area 3 ... Metallized wiring conductor 4 ... External connection metallized terminal 5 ... Dummy metallized layer

Claims (1)

上面に電子部品が搭載される搭載領域を有するセラミック基体と、前記セラミック基体の上面の前記搭載領域から外周縁にかけて被着された複数のメタライズ配線導体と、前記セラミック基体の側面から下面にかけて前記メタライズ配線導体と電気的に接続されるようにして被着された外部接続メタライズ端子とを具備して成る電子部品搭載用基板であって、前記セラミック基体は2層のセラミック層を積層して成り、前記2層のセラミック層の間の前記搭載領域に対応する領域の全面に、前記メタライズ配線導体から電気的に独立したダミーのメタライズ層が被着されていることを特徴とする電子部品搭載用基板。A ceramic base having a mounting area on which an electronic component is mounted on the upper surface, a plurality of metallized wiring conductors deposited from the mounting area to the outer periphery of the upper surface of the ceramic base, and the metallization from the side to the lower surface of the ceramic base An electronic component mounting board comprising an external connection metallized terminal deposited so as to be electrically connected to a wiring conductor, wherein the ceramic base is formed by laminating two ceramic layers, An electronic component mounting board, wherein a dummy metallized layer electrically independent from the metallized wiring conductor is deposited on the entire surface of the region corresponding to the mounting region between the two ceramic layers. .
JP2002076236A 2002-03-19 2002-03-19 Electronic component mounting board Expired - Fee Related JP3801935B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104124213A (en) * 2013-04-28 2014-10-29 无锡华润安盛科技有限公司 Method for balancing stress on DBC (Direct Bonding Copper) board and DBC board package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104124213A (en) * 2013-04-28 2014-10-29 无锡华润安盛科技有限公司 Method for balancing stress on DBC (Direct Bonding Copper) board and DBC board package structure

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