JP4986500B2 - Laminated substrate, electronic device and manufacturing method thereof. - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated substrate wherein an electronic component can firmly be joined to the side surface thereof, and to provide a method of manufacturing the laminated substrate. <P>SOLUTION: The laminated substrate comprises a first insulating layer 1, a pair of conductor layers 4 deposited on one main surface and the other main surface of the first insulating layer 1 in the regions located at the end of the first insulating layer 1 in the plan view respectively, a second insulating layer 2 and a third insulating layer 3 laminated on the one main surface and the other main surface of the first insulating layer 1, respectively. The end of the first insulating layer 1 projects further than the end of the second insulating layer 2 and the end of the third insulating layer 3 in the plan view so that the conductor layers 4 are exposed outside the second insulating layer 2 and the third insulating layer 3 at the end of the first insulating layer 1, respectively. According to this structure, the electronic component 9 can be mounted on the side face of the first insulating layer 1, and the electrodes of the electronic component 9 and the conductor layers 4a and 4b formed on the first insulating layer 1 can be joined together, so that the electronic component 9 and the laminated substrate can firmly be joined together. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a multilayer substrate for mounting electronic components, an electronic device in which electronic components are mounted on the multilayer substrate, and a manufacturing method thereof.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by arranging a wiring conductor made of The wiring board is formed as an electronic device by mounting electronic components on the top surface and sealing with a lid or potting resin.

In recent years, it has been required to mount a large number of electronic components on a wiring board, and in addition, downsizing of electronic devices has been required. Therefore, in order to widen the mounting area of the electronic component on the wiring board, an electrode pad is formed on the side surface of the wiring board, and the electrode of the electronic component is connected to the electrode pad with a conductive adhesive, and the electronic component is connected to the side surface of the wiring board. A method of mounting is proposed. Such a wiring board can be formed by laminating an upper layer and a lower layer each having a pair of electrode pads formed on the side surfaces on the upper surface and the lower surface of the intermediate layer (see Patent Document 1).
Japanese Patent Laid-Open No. 2001-111380

  However, since the wiring substrate is formed by laminating an upper layer and a lower layer having electrode pads formed on the side surfaces on the intermediate layer, a misalignment may occur in each of the intermediate layer, the upper layer, and the lower layer. If the intermediate layer protrudes larger than the upper and lower side surfaces and misalignment occurs, the distance between the electronic components mounted on the side surfaces of the intermediate layer and the electrode pads formed on the upper and lower layers is greatly increased. The component is in a state of being largely floated from the electrode pad, and there is a variation in the bonding strength between the electronic component and the electrode pad bonded by the conductive adhesive, and the electrode pad and the electronic component cannot be firmly bonded. Had a point.

  In addition, when a stacking shift occurs between the upper layer and the lower layer of the wiring board, the position of the pair of electrode pads and the pair of electrodes of the electronic component with respect to the side surface of the wiring board shifts up and down. As the distance varies, the bonding strength between the electronic component and the electrode pad to be bonded by the conductive adhesive varies, and the electronic component is inclined and mounted on the side surface of the wiring board, thereby strengthening the electrode pad and the electronic component. Sometimes it was not possible to join.

  The present invention has been devised in view of the above problems, and an object of the present invention is to provide a multilayer substrate and a method for manufacturing the multilayer substrate that can firmly bond an electronic component to a side surface. Another object of the present invention is to provide a highly reliable electronic device and a method for manufacturing the electronic device.

The multilayer substrate according to the present invention covers the first insulating layer and one of the main surface and the other main surface of the first insulating layer and a region located at the end of the first insulating layer in plan view. a pair of conductor layers that are deposited, the second insulating layer laminated on the one main surface of the first insulating layer, the third insulating laminated on the other main surface of said first insulating layer And end portions of the first insulating layer such that the pair of conductor layers are exposed from the second insulating layer and the third insulating layer at the end portions of the first insulating layer, respectively. However, the end of the second insulating layer and the end of the third insulating layer protrude outward in plan view, and the side surface of the first insulating layer protruding outward is an electronic component mounting portion. And the pair of conductor layers are mounting electrodes for the electronic component .

  Preferably, in the multilayer substrate of the present invention, the side surfaces of the end portions of the pair of conductor layers and the side surfaces of the first insulating layer are in the same position in plan view, or The side surface of the end portion extends outward in plan view from the side surface of the first insulating layer.

  Preferably, in the multilayer substrate of the present invention, the second insulating layer has a fourth insulating layer stacked on a main surface opposite to a main surface on which the first insulating layer is stacked, The third insulating layer has a fifth insulating layer laminated on a main surface opposite to the main surface on which the first insulating layer is laminated, and the fourth insulating layer and the fifth insulating layer. The layer protrudes from the outer surface of the electronic component connected to the pair of conductor layers.

  In the electronic device of the present invention, an electronic component is mounted on the side surface of the first insulating layer of the multilayer substrate of the present invention, and a pair of electrodes of the electronic component are electrically connected to the pair of conductor layers, respectively. It is characterized by that.

  The method for manufacturing a multilayer substrate according to the present invention includes a first insulating layer, one main surface of the first insulating layer, and the other main surface of the first insulating layer, and at the end of the first insulating layer in plan view. A base layer provided with a pair of conductor layers to be applied to a region to be applied, a second insulating layer to be applied to one main surface of the base layer, and a third sheet to be applied to the other main surface of the base layer A first step of preparing each of the insulating layers, and the side surfaces of the pair of conductor layers positioned outside the side surfaces of the second insulating layer and the third insulating layer in a plan view. And a second step of depositing the second and third insulating layers on the base layer.

  Preferably, in the method for manufacturing a laminated substrate according to the present invention, the side surfaces of the pair of conductor layers and the side surfaces of the first insulating layer are in the same position in plan view, or the pair of conductors The side surface of the layer is located outside the side surface of the first insulating layer in plan view.

  The electronic device manufacturing method of the present invention is characterized in that a pair of electrodes of an electronic component are respectively connected to the side surfaces of the pair of conductor layers of the multilayer substrate manufactured by the manufacturing method of the present invention. .

  The multilayer substrate of the present invention is attached to each of the first insulating layer and one of the main surface and the other main surface of the first insulating layer and a region located at the end of the first insulating layer in plan view. A pair of conductor layers, and a second insulating layer and a third insulating layer laminated on one main surface and the other main surface of the first insulating layer, respectively. The end portions of the first insulating layer are more exposed than the end portions of the second insulating layer and the third insulating layer so that the end portions are exposed from the second insulating layer and the third insulating layer, respectively. Since it protrudes in a plan view, the electronic component is mounted on the side surface of the first insulating layer independently of the second insulating layer and the third insulating layer, and the electrode of the electronic component and the first Since the conductor layer formed on the insulating layer can be bonded, variation in bonding strength between the electronic component and the conductor layer can be reduced. In the case where an electronic component is mounted on the side surface of the laminated substrate, can be made less likely to tilt the electronic component, the electronic component and the laminated substrate can be firmly bonded.

  Preferably, in the multilayer substrate of the present invention, the side surfaces of the end portions of the pair of conductor layers and the side surface of the first insulating layer are in the same position in plan view, or the end portions of the conductor layers are Since the side surface extends outward in plan view from the side surface of the first insulating layer, the electronic component and the conductor layer formed on the first insulating layer can be directly brought into contact with each other to be joined. Therefore, the variation in the distance between the side surface of the first insulating layer and the conductor layer can be reduced, the variation in the bonding strength between the electronic component and the conductor layer can be reduced, and the electronic component and the multilayer substrate can be more It can be firmly joined.

  Preferably, in the laminated substrate of the present invention, the fourth insulating layer is laminated on the main surface of the second insulating layer opposite to the main surface on which the first insulating layer is laminated, and the third insulating layer is provided. The fifth insulating layer is laminated on the main surface opposite to the main surface on which the first insulating layer is laminated, and the fourth insulating layer and the fifth insulating layer are formed on the pair of conductor layers. It protrudes from the outer surface of the electronic component to be connected. Accordingly, a concave portion is formed on the side surface of the multilayer substrate, and an electronic component can be accommodated therein, whereby an electronic device having excellent reliability can be obtained.

  In the electronic device of the present invention, an electronic component is mounted on the side surface of the first insulating layer of the multilayer substrate of the present invention, and a pair of electrodes of the electronic component are electrically connected to the pair of conductor layers, respectively. As a result, the electronic component and the conductor layer are firmly bonded, so that an electronic device with excellent reliability is obtained.

  The method for manufacturing a multilayer substrate according to the present invention is located on each of the first insulating layer and one main surface and the other main surface of the first insulating layer, and at the end of the first insulating layer in plan view. A base layer having a pair of conductor layers deposited on the region, a second insulating layer deposited on the top surface of the base layer, and a third sheet insulating layer deposited on the bottom surface of the base layer are prepared. The first step and the base layers of the second and third insulating layers are such that the side surfaces of the pair of conductor layers are located outside the side surfaces of the second insulating layer and the third insulating layer in a plan view. The electronic component is mounted on the side surface of the first insulating layer, and the electrode of the electronic component and the conductor layer formed on the first insulating layer are joined. Therefore, variation in the distance between the side surface of the first insulating layer and the side surface of the end portion of the conductor layer is reduced, and the electronic component and the conductor layer are reduced. It is possible to reduce variations in bonding strength of the electronic component on the side surface of the multilayer substrate can be mounted without any inclination, the electronic component and the laminated substrate can be firmly bonded.

  Preferably, in the method for manufacturing a laminated substrate of the present invention, the side surfaces of the pair of conductor layers and the side surfaces of the first insulating layer are at the same position in plan view, or the side surfaces of the pair of conductor layers. However, since it is located outside in a plan view from the side surface of the first insulating layer, it can be brought into direct contact with and bonded to the electronic component and the conductor layer formed in the first insulating layer, There is no variation in the distance between the side surface of the first insulating layer and the conductor layer, and the variation in the bonding strength between the electronic component and the conductor layer is reduced more favorably, and the electronic component and the multilayer substrate are bonded more firmly. Can do.

  Since the pair of electrodes of the electronic component are connected to the side surfaces of the pair of conductor layers of the multilayer substrate manufactured by the manufacturing method of the present invention, the electronic device manufacturing method of the present invention includes: Are firmly bonded, so that the electronic device is excellent in reliability.

  The ceramic green sheet laminate of the present invention will be described. FIG. 1 is a cross-sectional view showing an example of an embodiment of a ceramic green sheet laminate of the present invention. In FIG. 1, 1 is a first insulating layer, 2 is a second insulating layer, 3 is a third insulating layer, 4a and 4b are conductor layers, and 5 is a wiring conductor, which form a laminated substrate. .

  The laminated substrate according to the present invention includes the first insulating layer 1 and one main surface and the other main surface of the first insulating layer 1 and regions located at the end portions of the first insulating layer 1 in plan view. It consists of a pair of conductor layers 4a and 4b to be deposited, and a second insulating layer 2 and a third insulating layer 3 which are laminated on one main surface and the other main surface of the first insulating layer 1, respectively.

  The first to third insulating layers 1, 2, and 3 are made of ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. It is plate-shaped.

  When the first to third insulating layers 1, 2, and 3 are made of, for example, an aluminum oxide sintered body, organic binders and solvents suitable for raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide, plastic The ceramic slurry obtained by adding and mixing agents, dispersants, etc. is formed into a sheet by using a conventionally known sheet forming method such as a doctor blade method to obtain a ceramic green sheet, and then suitable for the ceramic green sheet It is manufactured by subjecting to a punching process and firing at a high temperature (about 1500 to 1800 ° C.).

  Conductive layers 4a and 4b are deposited in a region located at the end 1a of the first insulating layer 1 in a plan view of the one main surface and the other main surface of the first insulating layer 1. The conductor layers 4a and 4b function as a conductive path for electrically connecting the electronic component 9 mounted on the side surface of the laminated substrate to an external circuit board or the like, and are electrically connected to some of the wiring conductors 5 described later. Is done. The conductor layers 4a and 4b are made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like, and one main surface and the other of the ceramic green sheet for the first insulating layer 1 using printing means such as a screen printing method. A metallized paste for the conductor layer 4 is printed and applied at a predetermined position with respect to the main surface, and baked together with the first insulating layer 1 to form a region located at the end of the first insulating layer 1. . The metallized paste is manufactured by adding an organic binder, an organic solvent, and a dispersant as necessary to a main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, a planetary mixer or the like. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering.

  The conductor layers 4a and 4b are disposed on one main surface and the other main surface of the first insulating layer 1 so as to overlap in plan view. The width and thickness of the conductor layers 4a and 4b are determined depending on the bonding. What is necessary is just to select suitably according to the shape of the electronic component to do. Further, in order to satisfactorily join the electronic component 9 described later, it is preferable that the conductor layer 4a and the conductor layer 4b of the portion to be joined to the electronic component 9 are formed in the same width, length, and thickness.

  Further, the conductor layers 4 a and 4 b may be formed extending to the side surfaces of the second insulating layer 2 and the third insulating layer 3. In this case, the metallized paste for the conductor layers 4a and 4b is printed and applied to the side surfaces of the ceramic green sheet for the second insulating layer 2 and the ceramic green sheet for the third insulating layer 3, respectively. Can be formed.

  A wiring conductor 5 is formed on the laminated substrate. The wiring conductor 5 functions as a conductive path for electrically connecting the electronic component 9 and the second electronic component mounted on the multilayer substrate to the external circuit substrate, and is a metal powder metallization of tungsten, molybdenum, copper, silver, or the like. Using a printing means such as a screen printing method, the metallized paste for the wiring conductor 5 is printed and applied to predetermined positions of the ceramic green sheets of the first to third insulating layers 1, 2, and 3, and the first Or it can form in the predetermined position of a laminated substrate by baking with the ceramic green sheet for 3rd insulating layers 1, 2, and 3. FIG. The metallized paste for the wiring conductor 5 is produced in the same manner as the metallized paste for the conductor layers 4a and 4b, but is prepared to have a viscosity suitable for printing depending on the amount of the organic binder or organic solvent.

  Further, the wiring conductors 5 formed on the upper surface and the lower surface are electrically connected by a through conductor penetrating the laminated substrate. Such a through conductor is formed by punching a ceramic green sheet for the first to third insulating layers 1, 2, 3 using a die or punching prior to printing and applying a metallized paste for forming the wiring conductor 5, or A through hole for a through conductor is formed by a processing method such as a laser processing method, and a metallized paste is filled in the through hole for the through conductor by a printing means such as a screen printing method. It is formed by firing together with the ceramic green sheets for the insulating layers 1, 2, and 3. The metallized paste for the through conductor is prepared in the same manner as the conductor layers 4a and 4b and the wiring conductor 5, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  Note that the conductor layers 4a, 4b and the wiring conductor 5 are prevented from being oxidized and corroded on the exposed surfaces of the conductor layers 4a, 4b and the wiring conductor 5, and the electronic component 9 and the conductor layers 4a, 4b or the wiring conductor 5 are prevented. And a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited in order to strengthen the bonding between the laminated substrate and the external circuit board. Preferably it is.

  The laminated substrate is formed by laminating a second insulating layer 2 and a third insulating layer 3 on one main surface and the other main surface of the first insulating layer 1, respectively. After the ceramic green sheets for the second or third insulating layers 2 and 3 are laminated on one main surface and the other main surface of the ceramic green sheet for use, it is sintered and integrated to form a laminated substrate. Is done.

  The end portions 1a of the first insulating layer 1 are exposed so that the conductor layers 4a and 4b are exposed from the second insulating layer 2 and the third insulating layer 3 at the end portions 1a of the first insulating layer 1, respectively. However, it protrudes from the end 2a of the second insulating layer 2 and the end 3a of the third insulating layer 3 in plan view. With this configuration, the electronic component 9 can be mounted on the side surface of the first insulating layer 1, and the electrodes of the electronic component 9 and the conductor layers 4 a and 4 b formed on the first insulating layer 1 can be joined. The variation in the distance between the side surface of the first insulating layer 1 and the side surfaces of the end portions of the conductor layers 4a and 4b can be reduced, and the variation in the bonding strength between the electronic component 9 and the conductor layers 4a and 4b can be reduced. In addition, the electronic component 9 can be mounted on the side surface of the multilayer substrate without inclination, and the electronic component 9 and the multilayer substrate can be firmly bonded.

  Note that the end 1a of the first insulating layer protrudes from the end 2a of the second insulating layer 2 and the end 3a of the third insulating layer 3 by 0.1 mm or more so that the first to third It is preferable to laminate the insulating layers 1, 2, and 3. When the thickness is less than 0.1 mm, the second insulating layer 2 is caused by a stacking deviation when the second insulating layer 2 and the third insulating layer 3 are stacked on one main surface and the other main surface of the first insulating layer. The third insulating layer 3 may cover the conductor layers 4a and 4b, and the conductor layers 4a and 4b may not be exposed.

  The side surfaces of the end portions of the pair of conductor layers 4a and 4b and the side surface of the first insulating layer 1 are in the same position in plan view, or the side surfaces of the end portions of the conductor layers 4a and 4b are It is preferable to extend outward in a plan view from the side surface of one insulating layer 1. With this configuration, the electronic component 9 and the conductor layers 4a and 4b formed on the first insulating layer 1 can be directly brought into contact with each other and bonded to each other, so that the side surface of the end 1a of the first insulating layer 1 There is no variation in the distance from the side surfaces of the end portions of the conductor layers 4a and 4b, and the variation in bonding strength between the electronic component 9 and the conductor layers 4a and 4b can be reduced more favorably, so that the electronic component 9 and the multilayer substrate are more It can be firmly joined.

  In addition, the side surface of the edge part of a pair of conductor layers 4a and 4b here means the side surface in the edge part of the conductor layers 4a and 4b formed in the 1st insulating layer 1. FIG. That is, the end portions of the pair of conductor layers 4a and 4b and the end portion 1a of the first insulating layer 1 are at the same position in plan view, or the end portions of the conductor layers 4a and 4b are first in plan view. It shows that it protrudes from the edge part 1a of the insulating layer 1.

  As the laminated substrate as described above, the thickness of the first insulating layer 1 and the conductor layers 4a and 4b are matched to the shape of the electronic component 9 so that the electrodes of the electronic component 9 and the side surfaces of the conductor layers 4a and 4b come into contact with each other. And the positions of the side surfaces of the conductor layers 4a and 4b may be set. For example, the electronic component 9 is a rectangular capacitor of 0.6 mm (length) × 0.3 mm (width) × 0.3 mm (thickness) (A pair of electrodes of 0.15 mm (length) × 0.3 mm (width) at one end), the thickness of the first insulating layer 1 is 0.4 mm, the thickness of the second insulating layer 2 is 0.2 mm, The thickness of the insulating layer 3 is 0.2 mm, the thickness of the conductor layers 4a and 4b is 0.02 mm, and the side surface of the first insulating layer 1 and the side surfaces of the conductor layers 4a and 4b are at the same position in plan view. You should arrange it. Then, the pair of electrodes may be mounted on the side surface of the multilayer substrate so as to contact the side surfaces of the conductor layers 4a and 4b, respectively. In the above description, since the electronic component 9 is mounted horizontally on the side surface of the multilayer substrate, the thickness direction of the first to third insulating layers 1, 2, 3 and the conductor layers 4 a, 4 b depends on the electronic component 9. It can be considered that it is in the same direction as the length direction.

  Such conductor layers 4a and 4b can be manufactured as follows. For example, after the metallized paste of the conductor layers 4a and 4b is printed and applied to a predetermined position of the ceramic green sheet for the first insulating layer 1, the ceramic green sheet for the first insulating layer 1 is transferred from one main surface to the other main surface. By cutting along with the metallized paste for the conductor layers 4a and 4b over the surface, the metallized paste for the pair of conductor layers 4a and 4b and the side surface of the ceramic green sheet for the first insulating layer 1 are in the same position in plan view. Since it can be formed, the side surfaces of the pair of conductor layers 4a and 4b and the side surface of the first insulating layer 1 can be placed at the same position in a plan view by firing at a high temperature. Further, after processing the ceramic green sheet for the first insulating layer 1 into a predetermined shape in accordance with the outer edge of the multilayer substrate, the metallized paste of the conductor layers 4a and 4b becomes one of the ceramic green sheets for the first insulating layer 1. After printing by a printing means such as a screen printing method so as to extend from the main surface or the other main surface to the side surface, the side surfaces of the conductor layers 4a and 4b are made to be higher than the side surface of the first insulating layer 1 by baking at a high temperature. It can extend outward in a plan view. In addition, by attaching a metal foil or the like so as to extend beyond the side surface of the first insulating layer 1, the side surfaces of the conductor layers 4 a and 4 b are outside in the plan view from the side surface of the first insulating layer 1. Can be extended.

  Further, as shown in FIG. 2, an insulating film 6 may be coated on a part of the exposed region of the surface of the conductor layers 4 a and 4 b. With this configuration, when the electronic component 9 and the conductor layers 4a and 4b are joined together with a conductive adhesive such as solder, the variation of the conductive adhesive spreading on the surfaces of the conductor layers 4a and 4b is adjusted. , 4b and the electronic component 9 can be made stronger.

  Such an insulating film 6 is formed by printing a metallized paste for the conductor layers 4a and 4b on the ceramic green sheet for the first insulating layer, and then covering a part of the conductor layers 4a and 4b. The ceramic paste for 6 is printed and applied and fired together with the first insulating layer 1 and the conductor layers 4a and 4b. The ceramic paste may be composed of basically the same material as the first insulating layer, such as an organic binder, an organic solvent and, if necessary, a ball mill, a three-roll mill, a planetary mixer, etc. It is manufactured by mixing and kneading in a kneading means. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering. The insulating film 6 is formed by laminating ceramic green sheets for the insulating film 6 formed by the same means as the first insulating layer 1 in a partial region of the conductor layers 4a and 4b, and then the first insulating layer 1 It can also be formed by firing together.

  In addition, as shown in FIG. 3, a notch portion may be formed on the side surface of the multilayer substrate, and a region in which the conductor layers 4 a and 4 b are formed in the notch portion may be disposed. With this configuration, a recess can be formed along the side surface direction (length direction or width direction) of the multilayer substrate, and thus the electronic component 9 can be accommodated in the recess.

  In such a laminated substrate, notches are formed in the regions to be the conductor layers 4 a and 4 b of the first insulating layer 1, and the first and second insulating layers 2 and 3 have a first region in a predetermined region. It can be formed by forming notches in a wider area than the notches formed in the insulating layer 1 and laminating so that these notches overlap in plan view. Further, if the depth in the depth direction of the notch is formed larger than the thickness of the electronic component 9 to be mounted, the outer surface 9a of the electronic component 9 to be mounted is positioned on the inner side of the side surface of the multilayer substrate. As a result, the electronic component 9 can be reliably accommodated in the recess. The outer surface 9a of the electronic component 9 referred to here indicates the side surface (the right side surface in FIG. 3) of the electronic component 9 mounted on the side surface of the multilayer substrate.

  As the laminated substrate as described above, the shape of the notch may be set in accordance with the shape of the electronic component 9 so that the electronic component 9 is accommodated in the recess. A rectangular capacitor of mm (length) x 0.3 mm (width) x 0.3 mm (thickness) (a pair of electrodes of 0.2 mm (length) x 0.3 mm (width) at one end) and first insulation The thickness of the layer 1 is set to 0.3 mm, the thickness of the second insulating layer 2 is set to 0.2 mm, the thickness of the third insulating layer 3 is set to 0.2 mm, and the thickness of the conductor layers 4a and 4b is set to 0.02 mm. The shape of the cutout portion of 1 is 0.5 mm (length in the depth direction) × 0.5 mm (opening width on the side surface), and the shape of the cutout portions of the second and third insulating layers 2 and 3 is 0.6 mm (depth). The concave portion may be formed with a length in the direction) × 0.6 mm (opening width on the side surface). And what is necessary is just to mount in the side surface of a laminated substrate so that the electronic component 9 may be accommodated in a recessed part. In the above description, since the electronic component 9 is mounted horizontally on the side surface of the multilayer substrate, the thickness direction of the first to third insulating layers 1, 2, 3 and the conductor layers 4 a, 4 b depends on the electronic component 9. The length direction in the depth direction of the cutout portion is the same direction as the thickness direction of the electronic component 9, and the opening width of the cutout portion is the same direction as the width direction of the electronic component 9. Think about it.

  In FIG. 1, the laminated substrate is formed by laminating first to third insulating layers 1, 2, 3 each consisting of one layer, but the first to third insulating layers 1, 2 are formed. , 3 may each be composed of a plurality of layers, and may be appropriately selected according to the shape of the electronic component 9 to be mounted, the arrangement of the wiring conductors 5 and the like. When the first insulating layer 1 is composed of a plurality of layers, a plurality of ceramic green sheets are laminated so that the electronic component 9 is satisfactorily mounted on the side surface of the first insulating layer 9. After forming the ceramic green sheet for use, the positions of the side surfaces of the plurality of first insulating layers 1 are made to be the same in plan view by means such as cutting, and the first insulating layer 1 It is preferable that the position accuracy of the side surface is good.

  In addition, as shown in FIG. 4, the second insulating layer 2 has a fourth insulating layer 7 laminated on the main surface opposite to the main surface on which the first insulating layer 1 is laminated. In the third insulating layer 3, the fifth insulating layer 8 may be laminated on the main surface opposite to the main surface on which the first insulating layer 1 is laminated. The wiring conductor 5 is formed on the fourth insulating layer 7 and the fifth insulating layer 8 by the same means as described above. And it is preferable that the 4th insulating layer 7 and the 5th insulating layer 8 protrude rather than the outer surface 9a of the electronic component 9 connected to a pair of conductor layers 4a and 4b. With this configuration, since the concave portion along the thickness direction is formed on the side surface of the multilayer substrate, the electronic component 9 can be accommodated in the concave portion, and an electronic device having excellent reliability can be obtained. .

  Further, since the wiring conductor 5 can be formed in the protruding region of the fourth or fifth insulating layers 7 and 8, more electronic components 9 and second electrons can be formed on one main surface or the other main surface of the multilayer substrate. Parts can be mounted.

  For the multilayer substrate as described above, the protruding lengths of the fourth and fifth insulating layers 7 and 8 can be set according to the shape of the electronic component 9 so that the electronic component 9 is accommodated in the recess. For example, the electronic component 9 may be a rectangular capacitor of 1.0 mm (length) × 0.5 mm (width) × 0.5 mm (thickness) (0.3 mm (length) × 0.5 mm (width) at one end). A pair of electrodes), the thickness of the first insulating layer 1 is 0.3 mm, the thickness of the second insulating layer 2 is 0.4 mm, the thickness of the third insulating layer 3 is 0.4 mm, and the thickness of the fourth insulating layer 7 Is 0.3 mm, the thickness of the fifth insulating layer 8 is 0.3 mm, the thickness of the conductor layers 4 a and 4 b is 0.02 mm, and the end portions of the fourth and fifth insulating layers 7 and 8 are the first insulating layer 1. What is necessary is just to form a recessed part so that it may protrude 0.7 mm in planar view rather than the edge part 1a. And what is necessary is just to mount in the side surface of a laminated substrate so that the electronic component 9 may be accommodated in a recessed part. In the above description, since the electronic component 9 is mounted horizontally on the side surface of the multilayer substrate, the thickness direction of the first to fifth insulating layers 1, 2, 3, 7, 8 and the conductor layers 4a, 4b is The length direction of the electronic component 9 may be the same direction, and the protruding length direction of the fourth and fifth insulating layers 7 and 8 may be considered the same direction as the thickness direction of the electronic component 9.

  Further, when the fourth and fifth insulating layers 7 and 8 are formed and the notch portion as shown in FIG. 3 is formed, a concave portion surrounding the entire circumferential direction is formed on the side surface of the laminated substrate. Therefore, the electronic component 9 can be reliably accommodated in the recess, and an electronic device having excellent reliability can be obtained. In addition, the 4th insulating layer 7 and the 5th insulating layer 8 can be manufactured by the means similar to the above-mentioned 1st thru | or 3rd insulating layers 1,2,3. The fourth and fifth insulating layers 7 and 8 are ceramic green sheets for the fourth and fifth insulating layers 7 and 8, and ceramic green sheets for the first to third insulating layers 1, 2, and 3. It is possible to form a laminated substrate which is sintered and integrated by firing after being laminated.

  In the electronic device of the present invention, the electronic component 9 is mounted on the side surface of the first insulating layer of the above-described laminated substrate, and the pair of electrodes of the electronic component 9 are electrically connected to the pair of conductor layers 4a and 4b, respectively. Yes. Thereby, since a pair of conductor layers 4a and 4b and the electronic component 9 can be joined firmly, it becomes an electronic device excellent in reliability.

  The electronic component 9 is a chip element such as a capacitor, a resistance element, or an inductor. The electronic component 9 is mounted by electrically connecting the electrode of the chip element and the pair of conductor layers 4a and 4b via a conductive adhesive such as solder. Further, the electronic component 9 is sealed as necessary. Sealing is performed by covering the electronic component 9 with a sealing resin such as epoxy resin, or a lid made of resin, metal, ceramics or the like placed so as to cover the electronic component 9 is made of glass, resin, brazing material, etc. It may be performed by attaching to the laminated substrate with an adhesive.

  The second electronic component is mounted on one main surface or the other main surface of the multilayer substrate. The second electronic component is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors. When the second electronic component is a flip-chip type semiconductor element, the second electronic component is mounted on the semiconductor via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). This is done by electrically connecting the electrode of the element and the wiring conductor, and when the second electronic component is a wire bonding type semiconductor element, it is fixed by a bonding material such as glass, resin, brazing material, etc. After that, it is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 5 through the bonding wire. When the second electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 5 are electrically connected by a conductive resin. And a 2nd electronic component is sealed by the same means as the above-mentioned electronic component as needed.

  The electronic component 9 may be mounted on one main surface or the other main surface of the multilayer substrate together with the side surface of the multilayer substrate.

  The present invention can be variously modified without departing from the gist of the present invention. For example, as shown in FIG. 5, you may provide the recessed part for accommodating the 1st electronic component 9 or the 2nd electronic component in the one main surface or the other main surface of a laminated substrate. Further, as shown in FIG. 6, a plurality of pairs of conductor layers 4a and 4b are arranged in the thickness direction of the side surface of the multilayer substrate, or a plurality of pairs of conductor layers 4a, 4b are arranged in the side surface direction (length direction or width direction) of the multilayer substrate. The conductor layers 4a and 4b may be disposed, and a pair of conductor layers 4a and 4b may be disposed not only on one side surface of the multilayer substrate but also on a plurality of side surfaces of the multilayer substrate. With this configuration, an electronic component can be mounted on each of the plurality of conductor layers 4a and 4b. Therefore, a plurality of electronic components can be mounted effectively using the side surface of the multilayer substrate, and the size and reliability are reduced. High electronic device can be formed.

It is sectional drawing which shows an example of embodiment of the laminated substrate of this invention. (A) is a top view which shows an example of embodiment of the laminated substrate of this invention, (b) is sectional drawing in the A-A 'line of (a). (A) is a top view which shows an example of embodiment of the laminated substrate of this invention, (b) is sectional drawing in the B-B 'line | wire of (a). It is sectional drawing which shows an example of embodiment of the laminated substrate of this invention. It is sectional drawing which shows an example of embodiment of the laminated substrate of this invention. It is sectional drawing which shows an example of embodiment of the laminated substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st insulating layer 2 ... 2nd insulating layer 3 ... 3rd insulating layer 4 ... Conductor layer 5 ... Wiring conductor 6 ... Insulating layer 7 ... 1st 4 insulating layer 8... 5th insulating layer 9... Electronic component

Claims (4)

A first insulating layer, and a pair of conductor layers deposited on one main surface and the other main surface of the first insulating layer, and in a region located at an end of the first insulating layer in plan view When the second insulating layer laminated on the one main surface of the first insulating layer consists of a said third insulating layer laminated on the other main surface of the first insulating layer, the pair The end of the first insulating layer is exposed from the second insulating layer and the third insulating layer at the end of the first insulating layer, respectively. The end of the layer and the end of the third insulating layer protrude outward in plan view, and the side surfaces of the first insulating layer protruding outward are mounting parts for the electronic component, and the pair of conductor layers Is a mounting electrode for the electronic component . And the side surfaces of the pair of conductive layers, and the side surface of the first insulating layer, or in the same position in plan view, or the side of the pair of conductor layers of the first insulating layer laminated substrate according to claim 1, characterized in that it extends outwardly in plan view than the side. The second insulating layer has a fourth insulating layer stacked on a main surface opposite to the main surface on which the first insulating layer is stacked, and the third insulating layer has the first insulating layer. the opposite major surface to the main surface layers are laminated, the fifth insulating layer are laminated Tei Rutotomoni, the fourth insulating layer and said fifth insulating layer is connected to the pair of conductor layers the laminated substrate according to claim 1 or claim 2, characterized that you protrude from the outer surface of the electronic component that. Claims 1 to an electronic component is mounted on the side surface of the first insulating layer of a multilayer substrate according to claim 3, a pair of electrodes of the electronic component, the gas collector to the pair of conductor layers Electronic device, characterized in that the electronic device is connected electrically.

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