JP6698301B2 - Wiring board, electronic device and electronic module - Google Patents

Wiring board, electronic device and electronic module Download PDF

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JP6698301B2
JP6698301B2 JP2015186947A JP2015186947A JP6698301B2 JP 6698301 B2 JP6698301 B2 JP 6698301B2 JP 2015186947 A JP2015186947 A JP 2015186947A JP 2015186947 A JP2015186947 A JP 2015186947A JP 6698301 B2 JP6698301 B2 JP 6698301B2
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wiring board
cutout portion
insulating base
wiring conductor
wiring
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JP2017063093A (en
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芳弘 中田
芳弘 中田
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Die Bonding (AREA)

Description

本発明は、配線基板、電子装置および電子モジュールに関するものである。   The present invention relates to a wiring board, an electronic device and an electronic module.

従来、配線基板は、複数の絶縁層からなる絶縁基体の内部または表面に配線導体が、また絶縁基体の側面から下面にかけて切欠き部およびその内面に配線導体に接続される内面電極が設けられたものがある。電子部品およびこのような配線基板を含む電子装置を半田等の接合材によって例えばモジュール用基板に接合する場合には、この内面電極が半田等の接合材を介してモジュール用基板に接合される。   Conventionally, a wiring board is provided with a wiring conductor inside or on the surface of an insulating base composed of a plurality of insulating layers, and a notch portion from the side surface to the lower surface of the insulating base and an inner surface electrode connected to the wiring conductor on the inner surface thereof. There is something. When an electronic component and an electronic device including such a wiring board are bonded to a module substrate, for example, by a bonding material such as solder, the inner surface electrodes are bonded to the module substrate through the bonding material such as solder.

特開2002−158509号公報JP 2002-158509 JP

近年、電子装置の小型化および薄型化が求められている。このような配線基板において、複数の絶縁層の厚みが小さくなり、配線導体が、絶縁基体の厚み方向において絶縁基体の上面と切欠き部との間に設けられ、平面透視で配線導体の端部を跨ぐように切欠き部と重なっていると、複数の絶縁層を積層する場合に、積層時の応力が配線導体、特に配線導体の端部および配線導体の端部の外側の部分に伝わりにくく、絶縁基体の上面と切欠き部との間における配線導体の端部の周辺に空隙が形成され、配線導体における電気的導通が不十分なものとなり、配線基板の電気的特性を低下させてしまうことが懸念される。   In recent years, electronic devices have been required to be smaller and thinner. In such a wiring board, the thickness of the plurality of insulating layers is reduced, the wiring conductor is provided between the upper surface of the insulating base and the notch in the thickness direction of the insulating base, and the end portion of the wiring conductor is seen through in plan view. If the insulating layer overlaps with the cutout, it is difficult for stress to be transmitted to the wiring conductor, especially to the end of the wiring conductor and the portion outside the end of the wiring conductor when stacking multiple insulating layers. , A void is formed around the end portion of the wiring conductor between the upper surface of the insulating base and the cutout portion, resulting in insufficient electrical continuity in the wiring conductor, resulting in deterioration of electrical characteristics of the wiring board. Is concerned.

本発明の一つの態様によれば、配線基板は、一方主面および側面に開口する切欠き部を有している絶縁基体と、前記切欠き部の内面に設けられた内面電極と、前記絶縁基体の厚み方向において前記絶縁基体の他方主面と前記切欠き部との間に位置しており、平面透視で前記切欠き部と重ならない箇所に配置され、平面透視で前記切欠き部との間が離れて前記切欠き部に沿って設けられた配線導体とを有しており、該配線導体は、前記絶縁基体の厚み方向に複数の箇所で設けられており、前記切欠き部側の外縁が平面透視で互いに重ならない箇所に配置されている。
According to one aspect of the present invention, a wiring board includes an insulating substrate having a notch portion that is open to one main surface and a side surface, an inner surface electrode provided on an inner surface of the notch portion, and the insulating member. It is located between the other main surface of the insulating substrate and the cutout portion in the thickness direction of the base body, and is arranged at a position that does not overlap with the cutout portion when seen in a plan view. And a wiring conductor provided along the cutout portion at a distance from each other, and the wiring conductor is provided at a plurality of locations in the thickness direction of the insulating base, and the wiring conductor on the cutout portion side. The outer edges are arranged so that they do not overlap each other when seen in a plan view .

本発明の一つの態様によれば、電子装置は、上記構成の配線基板と、該配線基板に搭載され、前記内面電極に電気的に接続された電子部品とを有している。   According to one aspect of the invention, an electronic device includes a wiring board having the above-described configuration, and an electronic component mounted on the wiring board and electrically connected to the inner surface electrode.

本発明の一つの態様によれば、電子モジュールは、接続パッドを有するモジュール用基板と、前記接続パッドにはんだを介して接続された上記構成の電子装置とを有している。   According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device having the above configuration connected to the connection pad via solder.

本発明の一つの態様による配線基板において、一方主面および側面に開口する切欠き部を有している絶縁基体と、切欠き部の内面に設けられた内面電極と、絶縁基体の厚み方向において絶縁基体の他方主面と切欠き部との間に位置しており、平面透視で切欠き部と重ならない箇所に配置され、平面透視で切欠き部との間が離れて切欠き部に沿って設けられた配線導体とを有しており、配線導体は、絶縁基体の厚み方向に複数の箇所で設けられており、切欠き部側の外縁が平面透視で互いに重ならない箇所に配置されている。このような構成により、複数の絶縁層を積層する場合に、積層時の応力が配線導体に良好に伝わり、配線導体の端部の周辺に空隙が形成されるのを抑制し、配線導体における電気的導通が良好なものとなって、配線基板の電気的特性が低下することを抑制することができる。 In a wiring board according to one aspect of the present invention, an insulating base having a notch opening on one main surface and a side surface, an inner surface electrode provided on an inner surface of the notch, and a thickness direction of the insulating base. It is located between the other main surface of the insulating base body and the notch, and is arranged at a position that does not overlap with the notch when seen in a plan view, and is separated from the notch when seen in a plan view along the notch. The wiring conductor is provided at a plurality of locations in the thickness direction of the insulating substrate, and the outer edges of the cutout portions are arranged at locations where they do not overlap with each other in plan view. There is. With such a configuration, when a plurality of insulating layers are stacked, the stress at the time of stacking is satisfactorily transmitted to the wiring conductor, and it is possible to suppress the formation of voids around the ends of the wiring conductor, and to reduce the electrical conductivity of the wiring conductor. It is possible to suppress deterioration of electrical characteristics of the wiring board due to good electrical continuity.

本発明の一つの態様による電子装置は、上記構成の配線基板と、配線基板に搭載され、内面電極に電気的に接続された電子部品とを有していることによって、長期信頼性に優れ
た電子装置とすることができる。 An electronic device according to one aspect of the present invention has excellent long-term reliability because it has a wiring board having the above-described configuration and electronic components mounted on the wiring board and electrically connected to inner surface electrodes. It can be an electronic device.

本発明の一つの態様による電子モジュールは、接続パッドを有するモジュール用基板と、接続パッドにはんだを介して接続された上記構成の電子装置とを有していることによって、長期信頼性に優れたものとできる。   An electronic module according to one aspect of the present invention has excellent long-term reliability by including a module substrate having a connection pad and the electronic device having the above configuration connected to the connection pad via solder. Can be something.

（ａ）は本発明の第１の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view showing the electronic device in the first embodiment of the present invention, and (b) is a bottom view of (a). （ａ）は図１に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。(A) is an internal top view of a wiring board of the electronic device shown in FIG. 1, and (b) is an enlarged internal top view of a main part of a B portion of (a). （ａ）は図１（ａ）に示した電子装置のＡ−Ａ線における断面図であり、（ｂ）は（ａ）のＣ部における要部拡大断面図である。1A is a cross-sectional view taken along the line AA of the electronic device shown in FIG. 1A, and FIG. 1B is an enlarged cross-sectional view of a main part of a C portion of FIG. 図１における電子装置をモジュール用基板に実装した電子モジュールを示す縦断面図である。FIG. 2 is a vertical sectional view showing an electronic module in which the electronic device in FIG. 1 is mounted on a module substrate. （ａ）は本発明の第２の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view showing an electronic device according to a second embodiment of the present invention, and (b) is a bottom view of (a). （ａ）は図５に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。FIG. 6A is an internal top view of the wiring board of the electronic device shown in FIG. 5, and FIG. （ａ）は図５に示した電子装置の配線基板における他の絶縁層における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。5A is an internal top view of another insulating layer in the wiring board of the electronic device shown in FIG. 5, and FIG. 6B is an enlarged internal top view of a main part of a B portion of FIG. 図５（ａ）に示した電子装置のＡ−Ａ線における断面図である。FIG. 6 is a cross-sectional view taken along the line AA of the electronic device shown in FIG. （ａ）は、本発明の第３の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). （ａ）は、図９に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。FIG. 9A is an internal top view of the wiring board of the electronic device shown in FIG. 9, and FIG. 図９（ａ）に示した電子装置のＡ−Ａ線における断面図である。It is sectional drawing in the AA line of the electronic device shown to FIG. 9 (a).

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Some exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における電子装置は、図１〜図４に示すように、配線基板１と、配線基板１の上面に設けられた電子部品２とを含んでいる。電子装置は、図４に示すように、例えば電子モジュールを構成するモジュール用基板５上に接合材６を用いて接続される。 (First embodiment)
As shown in FIGS. 1 to 4, the electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 provided on the upper surface of the wiring board 1. As shown in FIG. 4, the electronic device is connected, for example, by using a bonding material 6 on a module substrate 5 that constitutes an electronic module.

本実施形態における配線基板１は、一方主面および側面に開口する切欠き部12を有している絶縁基体11と、切欠き部12の内面に設けられた内面電極13と、絶縁基体11の表面および内部に設けられた配線導体14とを有している。配線導体14は、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置されている。図１〜図３において、配線基板１および電子装置は仮想のｘｙｚ空間におけるｘｙ平面に実装されている。図１〜図３において、上方向とは、仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に配線基板１等が使用される際の上下を限定するものではない。   The wiring board 1 according to the present embodiment has an insulating base 11 having a cutout portion 12 that is open on one main surface and a side surface, an inner surface electrode 13 provided on the inner surface of the cutout portion 12, and an insulating base 11. The wiring conductor (14) is provided on the surface and inside. The wiring conductor 14 is located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, and is arranged at a position that does not overlap the notch 12 when seen in a plan view. 1 to 3, the wiring board 1 and the electronic device are mounted on an xy plane in a virtual xyz space. 1 to 3, the upward direction means the positive direction of the virtual z axis. The distinction between upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the wiring board 1 or the like is actually used.

絶縁基体11は、一方主面（図１〜図３では下面）および他方主面（図１〜図３では上面）と、側面とを有している。絶縁基体11は、複数の絶縁層11ａからなり、電子部品２の搭載領域を含む上面を有しており、平面視すなわち主面に垂直な方向から見ると矩形の板状の形状を有している。絶縁基体11は電子部品２を支持するための支持体として機能し、上
面中央部の搭載領域上に、電子部品２が低融点ろう材または導電性樹脂等の接合部材を介して接着されて固定される。 The insulating base 11 has one main surface (lower surface in FIGS. 1 to 3), the other main surface (upper surface in FIGS. 1 to 3), and side surfaces. The insulating base 11 is composed of a plurality of insulating layers 11a, has an upper surface including a mounting region of the electronic component 2, and has a rectangular plate shape when seen in a plan view, that is, a direction perpendicular to the main surface. There is. The insulating base 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is fixed to the mounting area at the center of the upper surface by bonding with a bonding member such as a low melting point brazing material or a conductive resin. To be done.

絶縁基体11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，窒化珪素質焼結体、ムライト質焼結体またはガラスセラミックス焼結体等のセラミックスを用いることができる。絶縁基体11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基体11が製作される。 As the insulating base 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body is used. it can. If the insulating base 11 is, for example, an aluminum oxide sintered body, raw material powder of aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), or the like. A suitable organic binder, a solvent and the like are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming the sludge into a sheet shape by employing a conventionally known doctor blade method, calendar roll method, or the like. Next, the ceramic green sheet is appropriately punched, a plurality of ceramic green sheets are laminated to form a green body, and the green body is fired at a high temperature (about 1600° C.). It is produced.

切欠き部12は、絶縁基体11の一方主面および側面に開口している。切欠き部12は、図１〜図３において、絶縁基体11の下側主面（下面）と側面とに開口しており、上側主面側（上面側）には開口しておらず、閉塞している。切欠き部12は、図１〜図３に示す例においては、平面視にて角部が円弧状の矩形状（四角形状）に形成されており、絶縁基体11の外辺に沿って長く形成されている。なお、切欠き部12は、平面視において、半円形状、半楕円形状または半長円形状、あるいは切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっていても構わない。このような切欠き部12は、絶縁基体11用のセラミックグリーンシートのいくつかに、レーザー加工または金型による打抜き加工等により、切欠き部12となる貫通孔を形成しておくことによって形成される。   The notch 12 is open on the one main surface and the side surface of the insulating base 11. 1 to 3, the notch 12 is open on the lower main surface (lower surface) and the side surface of the insulating base 11, and is not opened on the upper main surface side (upper surface side) and is closed. is doing. In the example shown in FIGS. 1 to 3, the notch 12 is formed in a rectangular shape (quadrangular shape) whose corners are arcuate in plan view, and is formed long along the outer edge of the insulating base 11. Has been done. The cutout portion 12 is opened through a cutout having a semicircular shape, a semielliptical shape, a semielliptical shape, or a width larger than the width of the cutout portion 12, that is, a plurality of sizes in a plan view. It doesn't matter if the notches are overlapped. The notch 12 is formed by forming through holes to be the notch 12 in some of the ceramic green sheets for the insulating substrate 11 by laser processing or punching with a die. It

内面電極13は、切欠き部12の内面に設けられている。配線導体14は、絶縁基体11の表面および内部に設けられている。主面電極15は、絶縁基体11の一方主面（図１〜図３では下面）に設けられている。なお、内面電極13と主面電極15とを含む構成で外部電極となっている。内面電極13と主面電極15とを含む外部電極は、モジュール用基板５に接合するためのものである。内面電極13、配線導体14および主面電極15は、配線基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するためのものである。配線導体14は、絶縁基体11の表面または内部に設けられた配線導体14と、絶縁基体11を構成する絶縁層11ａを貫通して上下に位置する配線導体同士を電気的に接続する貫通導体とを含んでいる。
The inner surface electrode 13 is provided on the inner surface of the cutout portion 12. The wiring conductor 14 is provided on the surface and inside of the insulating base 11. The principal surface electrode 15 is provided on one principal surface (lower surface in FIGS. 1 to 3) of the insulating substrate 11. The structure including the inner surface electrode 13 and the main surface electrode 15 is an outer electrode. External electrodes including an inner surface electrode 13 and the main surface electrode 15 is used for bonding the module substrate 5. The inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 are for electrically connecting the electronic component 2 mounted on the wiring board 1 and the module substrate 5. The wiring conductor 14 is a wiring conductor 14 provided on the surface or inside of the insulating base 11, and a through conductor that penetrates the insulating layer 11a forming the insulating base 11 and electrically connects the wiring conductors located above and below. Is included.

内面電極13、配線導体14、主面電極15の材料は、例えばタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等を主成分とする金属粉末
メタライズである。例えば、絶縁基体11が酸化アルミニウム質焼結体から成る場合であれば、Ｗ，ＭｏまたはＭｎ等の高融点金属粉末に適当な有機バインダーおよび溶媒等を添加混合して得たメタライズペーストを、絶縁基体11用のセラミックグリーンシートに予めスクリーン印刷法によって所定のパターンに印刷塗布して、絶縁基体11用のセラミックグリーンシートと同時に焼成することによって、絶縁基体11の所定位置に被着形成される。内面電極13は、例えば、切欠き部12となる貫通孔の内側面となる領域に内面電極13用のメタライズペーストを印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。主面電極15は、絶縁基体11となるセラミックグリーンシートに主面電極15となるメタライズペーストを印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。配線導体14は、例えば、絶縁基体11用のセラミックグリーンシートに配線導体14用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。また、配線導体14が貫通導体である場合は、例えば、絶縁基体11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基体11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。 The material of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 is, for example, metal powder metallization containing tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu) as a main component. Is. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallizing paste obtained by adding and mixing an appropriate organic binder and a solvent to a high melting point metal powder such as W, Mo or Mn is used as an insulating material. The ceramic green sheet for the base 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired at the same time as the ceramic green sheet for the insulating base 11 to be formed on the insulating base 11 at a predetermined position. The inner surface electrode 13 is formed, for example, by print-coating a metallizing paste for the inner surface electrode 13 on a region serving as an inner surface of the through hole serving as the cutout portion 12 and firing the metallizing paste together with the ceramic green sheet for the insulating substrate 11. . The principal surface electrode 15 is formed by printing and applying a metallizing paste to be the principal surface electrode 15 on the ceramic green sheet to be the insulating substrate 11, and firing the metallizing paste together with the ceramic green sheet for the insulating substrate 11. The wiring conductor 14 is formed, for example, by applying a metallizing paste for the wiring conductor 14 to a ceramic green sheet for the insulating base 11 by printing by a printing means such as a screen printing method, and firing it together with the ceramic green sheet for the insulating base 11. To be done. When the wiring conductor 14 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a processing method such as punching by punching or laser processing in a die, The through-holes are formed by filling the through-holes with a metallizing paste for through-hole conductors by the printing means and firing the ceramic green sheets for the insulating substrate 11. The metallizing paste is prepared by adding an appropriate solvent and a binder to the above-mentioned metal powder and kneading the mixture to adjust the viscosity to an appropriate level. It should be noted that glass powder and ceramic powder may be included in order to increase the bonding strength with the insulating base 11.

配線導体14は、図２および図３に示すように、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置されている。このような構成とすることによって、複数の絶縁層11ａを積層する場合に、積層時の応力が配線導体14に良好に伝わり、配線導体14の端部の周辺に空隙が形成されるのを抑制し、配線導体14における電気的導通が良好なものとなって、配線基板１の電気的特性が低下することを抑制することができる。すなわち、絶縁基体11用のセラミックグリーンシート同士を積層する際に、配線導体14用のメタライズペーストが平面透視で切欠き部12に重ならないように配置されているので、配線導体14用のメタライズペーストの周囲のセラミックグリーンシート同士の密着を良好なものとし、配線導体14の端部の周辺に空隙が形成されるのを抑制することができる。   As shown in FIGS. 2 and 3, the wiring conductor 14 is located between the other main surface of the insulating base 11 and the cutout 12 in the thickness direction of the insulating base 11, and the cutout 12 is seen in a plan view. It is located where it does not overlap with. With such a configuration, when a plurality of insulating layers 11a are stacked, it is possible to prevent stress during stacking from being favorably transmitted to the wiring conductor 14 and forming a void around the end of the wiring conductor 14. However, the electrical continuity of the wiring conductor 14 is improved, and the electrical characteristics of the wiring board 1 can be prevented from being degraded. That is, when the ceramic green sheets for the insulating substrate 11 are laminated, the metallizing paste for the wiring conductor 14 is arranged so as not to overlap the cutout portion 12 when seen in a plan view. It is possible to improve the adhesion between the ceramic green sheets in the periphery of the above, and to suppress the formation of voids around the ends of the wiring conductor 14.

なお、配線導体14が絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置するとは、配線導体14が絶縁基体11の他方主面と切欠き12が設けられた絶縁層11ａとに挟まれた部分、すなわち切欠き部12が設けられていない絶縁層11ａ（絶縁基体11）の内部に設けられていることを示しており、他方主面に設けられた配線導体14については、平面透視で切欠き部12と重なる箇所に配置されていても構わない。絶縁基体11ａは、絶縁基体11の他方主面と切欠き部12との間に少なくとも２つの絶縁層11ａを有している。また、切欠き部12が設けられた絶縁層11ａ、あるいはこの絶縁層11ａに積層する絶縁層11ａに配線導体14が設けられた場合において、配線導体14は、内面電極13と接続するために平面透視で切欠き部12と重なる位置に設けられていても構わない。   The wiring conductor 14 is located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11 when the wiring conductor 14 is provided with the other main surface of the insulating base 11 and the notch 12. It is shown that it is provided inside the insulating layer 11a (insulating substrate 11) where the cutout portion 12 is not provided, that is, the portion sandwiched between the insulating layer 11a and the other main surface. The wiring conductor 14 may be arranged at a position overlapping the cutout portion 12 when seen through in a plan view. The insulating base 11a has at least two insulating layers 11a between the other main surface of the insulating base 11 and the cutout portion 12. Further, when the wiring conductor 14 is provided on the insulating layer 11a provided with the notch 12 or on the insulating layer 11a laminated on the insulating layer 11a, the wiring conductor 14 is flat to connect with the inner surface electrode 13. It may be provided at a position that overlaps with the cutout portion 12 when seen through.

また、配線導体14は、図２に示すように、平面透視で切欠き部12に沿った形状を有していると、配線導体14用のメタライズペーストと切欠き部12との間の配線導体14用のメタライズペーストの周囲のセラミックグリーンシート同士の密着を良好なものとし、絶縁基体11の他方主面と切欠き部12との間における配線導体14の端部の周辺に空隙が形成されるのを良好に抑制することができる。なお、平面透視で切欠き部12に沿った形状とは、平面透視において、切欠き部12の内壁と配線導体14の外縁とが平行に配置されていることを示している。なお、配線導体14が、図２に示すように、平面透視で切欠き部12の一部を取り囲む形状を有していると、配線導体14を配置する領域がより大きいものとなり、配線基板１
の電気的特性が向上しやすいものとなり好ましい。 Further, as shown in FIG. 2, when the wiring conductor 14 has a shape along the cutout portion 12 in a plan view, the wiring conductor between the metallization paste for the wiring conductor 14 and the cutout portion 12 is formed. The ceramic green sheets around the metallizing paste for 14 are well adhered to each other, and a gap is formed around the end of the wiring conductor 14 between the other main surface of the insulating base 11 and the cutout 12. Can be well suppressed. It should be noted that the shape along the cutout portion 12 when seen through in a plan view means that the inner wall of the cutout portion 12 and the outer edge of the wiring conductor 14 are arranged in parallel when seen in a plan view. As shown in FIG. 2, if the wiring conductor 14 has a shape that surrounds a part of the cutout portion 12 in a plan view, the area where the wiring conductor 14 is arranged becomes larger and the wiring board 1
It is preferable because the electric characteristics of (3) are easily improved.

なお、配線導体14と切欠き部12との間隔Ｗは、Ｗ≧50μｍとしておくと、配線導体14の端部の周辺に空隙が形成されるのをより良好に抑制することができる。なお、切欠き部12と配線導体14との間の絶縁層の厚みが150μｍ以下の場合に、良好に空隙が発生すること
を抑制することができる。 If the distance W between the wiring conductor 14 and the notch 12 is W≧50 μm, it is possible to better suppress the formation of voids around the end of the wiring conductor 14. It should be noted that when the thickness of the insulating layer between the cutout portion 12 and the wiring conductor 14 is 150 μm or less, generation of voids can be favorably suppressed.

内面電極13、配線導体14、主面電極15の絶縁基体11から露出する表面には、電気めっき法または無電解めっき法によって金属めっき層が被着される。金属めっき層は、ニッケル，銅，金または銀等の耐食性および接続部材との接続性に優れる金属から成るものであり、例えば厚さ0.5〜５μｍ程度のニッケルめっき層と0.1〜３μｍ程度の金めっき層とが、あるいは厚さ１〜10μｍ程度のニッケルめっき層と0.1〜１μｍ程度の銀めっき層とが、
順次被着される。これによって、内面電極13および配線導体14、主面電極15が腐食することを効果的に抑制できるとともに、配線導体14と電子部品２との固着および配線導体14とボンディングワイヤ等の接続部材３との接合、ならびに内面電極13および主面電極15とモジュール用基板５に形成された接続用の接続パッド51との接合を強固にできる。 A metal plating layer is deposited on the surfaces of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal such as nickel, copper, gold, or silver, which has excellent corrosion resistance and connectivity with the connecting member. Or a nickel plating layer having a thickness of about 1 to 10 μm and a silver plating layer having a thickness of about 0.1 to 1 μm,
It is applied one after another. As a result, corrosion of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 can be effectively suppressed, the wiring conductor 14 and the electronic component 2 are fixed to each other, and the wiring conductor 14 and the connecting member 3 such as a bonding wire are formed. And the inner surface electrode 13 and the main surface electrode 15 and the connection connection pad 51 formed on the module substrate 5 can be firmly bonded.

また、金属めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／金めっき層／銀めっき層、あるいはニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他の金属めっき層であっても構わない。   Further, the metal plating layer is not limited to the nickel plating layer/gold plating layer, but may be a nickel plating layer/gold plating layer/silver plating layer or a nickel plating layer/palladium plating layer/gold plating layer. It may be a metal plating layer.

また、電子部品２が搭載される配線導体14上では、例えば上述のニッケルめっき層と金めっき層の下地層に、例えば、厚さ10〜80μｍ程度の銅めっき層を金属めっき層として被着させておくことにより、電子部品２の熱を銅めっき層を介して配線基板１側に良好に放熱させやすくしてもよい。   Further, on the wiring conductor 14 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of about 10 to 80 μm is deposited as a metal plating layer on the underlayer of the above nickel plating layer and gold plating layer. The heat of the electronic component 2 may be easily dissipated to the wiring board 1 side through the copper plating layer.

配線基板１の上面に電子部品２を搭載することによって、電子装置を作製できる。配線基板１に搭載される電子部品２は、ＩＣチップまたはＬＳＩチップ等の半導体素子，発光素子，水晶振動子または圧電振動子等の圧電素子および各種センサ等である。例えば、電子部品２がワイヤボンディング型の半導体素子である場合には、半導体素子は、低融点ろう材または導電性樹脂等の接合部材によって、配線導体14上に固定された後、ボンディングワイヤ等の接続部材３を介して半導体素子の電極と配線導体14とが電気的に接続されることによって配線基板１に搭載される。これにより、電子部品２は内面電極13に電気的に接続される。また、例えば電子部品２がフリップチップ型の半導体素子である場合には、半導体素子は、はんだバンプ、金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して、半導体素子の電極と配線導体14とが電気的および機械的に接続されることによって配線基板１に搭載される。また、配線基板１には、複数の電子部品２を搭載してもよいし、必要に応じて、抵抗素子または容量素子等の小型の電子部品を搭載してもよい。また、電子部品２は必要に応じて、樹脂またはガラス等からなる封止材４を用いて、樹脂、ガラス、セラミックスまたは金属等からなる蓋体等により封止される。   An electronic device can be manufactured by mounting the electronic component 2 on the upper surface of the wiring board 1. The electronic components 2 mounted on the wiring board 1 are semiconductor elements such as IC chips or LSI chips, light emitting elements, piezoelectric elements such as crystal oscillators or piezoelectric oscillators, and various sensors. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the wiring conductor 14 by a joining member such as a low melting point brazing material or a conductive resin, and then a bonding wire or the like. The electrodes of the semiconductor element and the wiring conductors 14 are electrically connected to each other via the connecting members 3 to be mounted on the wiring board 1. As a result, the electronic component 2 is electrically connected to the inner electrode 13. Further, for example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is a semiconductor element via a connecting member 3 such as a solder bump, a gold bump or a conductive resin (anisotropic conductive resin). The electrodes of the element and the wiring conductor 14 are mounted electrically and mechanically on the wiring board 1. Moreover, a plurality of electronic components 2 may be mounted on the wiring board 1, or small electronic components such as a resistance element or a capacitance element may be mounted as necessary. In addition, the electronic component 2 is sealed with a lid or the like made of resin, glass, ceramics, metal, or the like, using a sealing material 4 made of resin, glass, or the like, if necessary.

本実施形態の電子装置の内面電極13を含む外部電極が、図４に示すように、モジュール用基板５の接続パッド51に半田等の接合材６を介して接続されて、電子モジュールとなる。接合材６は、切欠き部12内にて内面電極13に、また、絶縁基体11の下面にて主面電極15に接合されていることから、外部からの応力が加わった場合に、外部電極または接合材６にかかる応力を分散することが可能となる。また、接合材６は内面電極13の切欠き部12の内側の端部から接続パッド51の外側の端部にかけて広がるように傾斜している。このような構成とすることにより、取り扱い時の外力等によって電子装置に応力が発生しても、広がるように傾斜している接合材６によって応力が分散されるものとなり、電子装置がモジュール用基板５に強固に接続されるものとなって、接続信頼性が向上した電子モジュール
とすることができる。この場合に、平面透視すなわち他方主面に垂直な方向から透視すると、接続パッド51の外側の端部は内面電極13の切欠き部12の内側の端部よりも外側に位置している。また、接続パッド51の内側の端部は主面電極15の内側の端部と同等の箇所に位置している。 External electrodes including the inner surface electrodes 13 of the electronic device according to the present embodiment are connected to the connection pads 51 of the module substrate 5 via the bonding material 6 such as solder to form an electronic module, as shown in FIG. Since the bonding material 6 is bonded to the inner surface electrode 13 in the cutout portion 12 and to the main surface electrode 15 on the lower surface of the insulating substrate 11, when the external stress is applied, the outer electrode Alternatively, the stress applied to the bonding material 6 can be dispersed. Further, the bonding material 6 is inclined so as to spread from the inner end of the notch 12 of the inner surface electrode 13 to the outer end of the connection pad 51. With such a configuration, even if stress is generated in the electronic device due to external force during handling, the stress is dispersed by the joining material 6 that is inclined so as to spread, and the electronic device is used as a module substrate. 5 is firmly connected to the electronic module 5 and the connection reliability can be improved. In this case, the outer end of the connection pad 51 is located outside the inner end of the notch 12 of the inner surface electrode 13 when seen through in a plan view, that is, in a direction perpendicular to the other main surface. The inner end of the connection pad 51 is located at the same position as the inner end of the principal surface electrode 15.

本実施形態の配線基板１によれば、一方主面および側面に開口する切欠き部12を有している絶縁基体11と、切欠き部12の内面に設けられ、内面電極13と、絶縁基体11の厚み方向において、絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置された配線導体14とを有している。このような構成により、複数の絶縁層11ａを積層する場合に、積層時の応力が配線導体14に良好に伝わり、配線導体14の端部の周辺に空隙が形成されるのを抑制し、配線導体14における電気的導通が良好なものとなって、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring board 1 of the present embodiment, the insulating base 11 having the notch 12 opening to the one main surface and the side surface, the inner surface electrode 13 provided on the inner surface of the notch 12, and the insulating base. In the thickness direction of 11, the wiring conductor 14 is located between the other main surface of the insulating substrate 11 and the cutout portion 12, and is arranged in a position not overlapping the cutout portion 12 in plan perspective. There is. With such a configuration, when a plurality of insulating layers 11a are stacked, the stress at the time of stacking is satisfactorily transmitted to the wiring conductor 14 and the formation of voids around the ends of the wiring conductor 14 is suppressed, It is possible to suppress deterioration of electrical characteristics of the wiring board 1 due to good electrical conduction in the conductor 14.

本実施形態における配線基板１は、小型で高出力の電子装置において好適に使用することができ、配線基板１における電気的接続を良好に図ることができる。例えば、電子部品２として、高発光の発光素子を搭載する発光素子搭載用の小型の配線基板１として好適に用いることができる。   The wiring board 1 in the present embodiment can be suitably used in a small-sized and high-power electronic device, and good electrical connection can be achieved in the wiring board 1. For example, the electronic component 2 can be suitably used as a small-sized wiring board 1 for mounting a light-emitting element that has a high-emission light-emitting element.

（第２の実施形態）
次に、本発明の第２の実施形態による電子装置について、図５〜図８を参照しつつ説明する。 (Second embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

本発明の第２の実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる点は、配線導体14は、絶縁基体11の厚み方向に複数の箇所で設けられており、これらの配線導体14は、切欠き部12側の外縁が平面透視で互いに重ならない箇所に配置されている点である。なお、本発明の第２の実施形態における配線基板１では、図６に示した絶縁層11ａは、図７に示した絶縁層11ａよりも絶縁基体11の上面側に設けられている。   The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the wiring conductor 14 is provided at a plurality of positions in the thickness direction of the insulating base 11. The wiring conductor 14 is located at a position where the outer edges of the cutout portion 12 side do not overlap each other in plan view. In the wiring board 1 according to the second embodiment of the present invention, the insulating layer 11a shown in FIG. 6 is provided on the upper surface side of the insulating base 11 with respect to the insulating layer 11a shown in FIG.

本発明の第２の実施形態における配線基板１によれば、第１の実施形態の配線基板１と同様に、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring board 1 of the second embodiment of the present invention, it is possible to suppress the formation of voids around the ends of the wiring conductors 14 as in the wiring board 1 of the first embodiment. Therefore, it is possible to suppress the deterioration of the electrical characteristics of the wiring board 1.

なお、これらの配線導体14において、切欠き部12側の外縁が平面透視で互いに重ならない箇所に配置されているとは、それぞれの配線導体14の切欠き部12側の外縁が平面透視で重ならないようにずれて配置されているものであり、切欠き部12に沿って設けられているとより好ましい。配線導体14は、図６では、平面透視において、切欠き部12の長辺側の内壁に沿って設けている。   In addition, in these wiring conductors 14, the outer edges of the cutout portion 12 side are arranged at positions where they do not overlap each other in plan view, that is, the outer edges of the respective cutout portions 12 side of the respective wiring conductors 14 overlap in plan view perspective. It is arranged such that it does not become staggered, and it is more preferable that it is provided along the notch 12. In FIG. 6, the wiring conductor 14 is provided along the inner wall on the long side of the cutout portion 12 when seen in a plan view.

第２の実施形態の配線基板１において、切欠き部12は、図５に示すように、切欠き部12が切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっている。このような場合においても、配線導体14は、絶縁基体11の厚み方向において絶縁基体11の一方主面と切欠き部12との間に位置しており、平面透視で切欠き部12を含む切欠きと重ならない箇所に配置されている。   In the wiring board 1 of the second embodiment, as shown in FIG. 5, the notch 12 is opened through the notch having a width larger than the width of the notch 12, that is, Notches of multiple sizes overlap. Even in such a case, the wiring conductor 14 is located between the one main surface of the insulating base 11 and the cutout 12 in the thickness direction of the insulating base 11, and the cutout 12 including the cutout 12 is seen in a plan view. It is placed where it does not overlap the cutout.

また、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、絶縁基体11の厚み方向に複数の箇所で設けられている配線導体14のうち、絶縁基体11の厚み方向において切欠き部12に近い側の配線導体14は、切欠き部12側から離れている側の配線導体14よりも、平面透視にて切欠き部12との間隔が離れて切欠き部12に沿って設けられていると、配線導体14が絶縁基体11の厚み方向に複数の箇所で設けられている場合においても、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、
配線基板１の電気的特性が低下することを抑制することができる。 Further, among the wiring conductors 14 that are located between the other main surface of the insulating base 11 and the notches 12 in the thickness direction of the insulating base 11, and are provided at a plurality of locations in the thickness direction of the insulating base 11. The wiring conductor 14 on the side closer to the notch 12 in the thickness direction of the insulating substrate 11 is closer to the notch 12 in plan view than the wiring conductor 14 on the side farther from the notch 12 side. If the wiring conductors 14 are provided apart from each other along the cutout portion 12, a void is formed around the end portion of the wiring conductor 14 even when the wiring conductor 14 is provided at a plurality of locations in the thickness direction of the insulating base 11. Can be suppressed,
It is possible to suppress the deterioration of the electrical characteristics of the wiring board 1.

第２の実施形態の配線基板１は、上述の第１の実施形態の配線基板１と同様の製造方法を用いて製作することができる。   The wiring board 1 of the second embodiment can be manufactured by using the same manufacturing method as that of the wiring board 1 of the first embodiment described above.

（第３の実施形態）
次に、本発明の第３の実施形態による電子装置について、図９〜図11を参照しつつ説明する。 (Third Embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

本発明の第３の実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる点は、電子部品２の搭載面と同じ他方主面（以下、上面ともいう）と側面とに開口している切欠き部12（12ａ）と配線基板１の一方主面（以下、下面）と側面とに開口している切欠き部12（12ｂ）を有している点である。第３の実施形態の配線基板１において、絶縁基体11の内部に設けられた配線導体14は、平面透視で切欠き部12と重ならない箇所に設けられている。   The electronic device according to the third embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the other main surface (hereinafter also referred to as the upper surface) and the side surface that are the same as the mounting surface of the electronic component 2 are different. This is that the notch 12 (12a) that is open and the notch 12 (12b) that is open to one main surface (hereinafter, lower surface) and side surface of the wiring board 1 are provided. In the wiring board 1 of the third embodiment, the wiring conductor 14 provided inside the insulating base 11 is provided at a position that does not overlap the cutout portion 12 when seen in a plan view.

本発明の第３の実施形態における配線基板１によれば、第１の実施形態の配線基板１と同様に、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring board 1 of the third embodiment of the present invention, it is possible to suppress the formation of voids around the ends of the wiring conductors 14 as in the wiring board 1 of the first embodiment. Therefore, it is possible to suppress the deterioration of the electrical characteristics of the wiring board 1.

第３の実施形態の配線基板１において、絶縁基体11の上面側に設けられた切欠き部12ａと下面側に設けられた切欠き部12ｂは、平面視において同じ大きさおよび同じ形状であっても良いし、図９〜図11に示すように、平面視において、大きさを異ならせても良い。また、平面視において切欠き部12ａの形状と切欠き部12ｂの形状とを異ならせても良い。例えば、一方の切欠き部12を、平面視にて角部が円弧状の矩形状（四角形状）に形成し、他方の切欠き部12を、切欠き部12が切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっている形状に形成してもよい。なお、一方の切欠き部12が、平面視において、他方の切欠き部12よりも大きくなるようにしておき、互いの切欠き部12の内壁同士が重ならないようにしておくことが好ましい。例えば、図９および図10に示した例では、絶縁基体11の下面側の切欠き部12ｂが、絶縁基体11の上面側の切欠き部12ａよりも大きくなっている。 第３の実施形態の配線基板１のように、絶縁基体11の上面側および下面側とに切欠き部12が設けられている場合、絶縁基体11内部に設けられている配線導体14は、平面透視にて大きい形状の切欠き部12に沿って設けられることが好ましい。   In the wiring board 1 of the third embodiment, the cutout portion 12a provided on the upper surface side of the insulating base 11 and the cutout portion 12b provided on the lower surface side have the same size and the same shape in plan view. Alternatively, as shown in FIGS. 9 to 11, the sizes may be different in plan view. Further, the shape of the cutout portion 12a and the shape of the cutout portion 12b may be different in a plan view. For example, one notch 12 is formed in a rectangular shape (quadrangular shape) whose corners are arcuate in plan view, and the other notch 12 is wider than the width of the notch 12 The opening may be formed through a notch having a large width, that is, the notches having a plurality of sizes may overlap each other. It is preferable that one notch 12 be larger than the other notch 12 in plan view so that the inner walls of the notches 12 do not overlap each other. For example, in the example shown in FIGS. 9 and 10, the cutout portion 12b on the lower surface side of the insulating base 11 is larger than the cutout portion 12a on the upper surface side of the insulating base 11. When the notch 12 is provided on the upper surface side and the lower surface side of the insulating base 11 as in the wiring board 1 of the third embodiment, the wiring conductor 14 provided inside the insulating base 11 is flat. It is preferably provided along the notch 12 having a large shape as seen through.

また、図９〜図11に示した例では、絶縁基体11の上面側に設けられた切欠き部12ａと絶縁基体11の下面側に設けられた切欠き部12ｂのそれぞれに内面電極13を設けているが、絶縁基体11の上面側の切欠き部12のみまたは絶縁基体11の下面側の切欠き部12のみに内面電極13を設けた配線基板１であっても構わない。   Further, in the example shown in FIGS. 9 to 11, the inner surface electrode 13 is provided in each of the notch 12a provided on the upper surface side of the insulating base 11 and the notch 12b provided on the lower surface side of the insulating base 11. However, the wiring board 1 may be one in which the inner surface electrode 13 is provided only in the notch 12 on the upper surface side of the insulating substrate 11 or only the notch 12 on the lower surface side of the insulating substrate 11.

第３の実施形態の配線基板１は、第１の実施形態と同様に、小型で高出力の電子装置において好適に使用することができ、配線基板１における電気的接続を良好に図ることができる。例えば、電子部品２として、高発光の発光素子を搭載する発光素子搭載用の小型の配線基板１として好適に用いることができる。   Like the first embodiment, the wiring board 1 of the third embodiment can be suitably used in a small-sized and high-power electronic device, and good electrical connection can be achieved in the wiring board 1. . For example, the electronic component 2 can be preferably used as a small-sized wiring board 1 for mounting a light-emitting element that mounts a high-emission light-emitting element.

第３の実施形態の配線基板１は、上述の第１の製造方法または第２の製造方法と同様の製造方法を用いて製作することができる。   The wiring board 1 of the third embodiment can be manufactured by using the same manufacturing method as the above-described first manufacturing method or second manufacturing method.

本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。上述の例では、切欠き部12および内面電極13は、絶縁基体11の対向する２側面にそれぞ
れ１つずつ設けた例を示しているが、切欠き部12および内面電極13を絶縁基体11の４側面全てに設けた配線基板１、あるいは複数の切欠き部12および内面電極13をそれぞれの辺に設けた配線基板１であってもよい。また、図１〜図11に示す例では、絶縁基体11は、３層または４層の絶縁層11ａから形成しているが、５層以上の絶縁層11ａからなるものであっても構わない。 The present invention is not limited to the above-described example of the embodiment, and various modifications are possible. In the above-mentioned example, the notch 12 and the inner surface electrode 13 are provided on the opposite two side surfaces of the insulating base 11 one by one, but the notch 12 and the inner surface electrode 13 are provided on the insulating base 11. The wiring board 1 may be provided on all four side surfaces, or the wiring board 1 may be provided with a plurality of notches 12 and inner surface electrodes 13 on each side. Further, in the example shown in FIGS. 1 to 11, the insulating base 11 is formed of three or four insulating layers 11a, but it may be formed of five or more insulating layers 11a.

また、図９および図10に示すように、配線基板１は、配線導体14に挟まれるように設けられた金属層16、電子部品搭載層17および中央端子層18等の配線以外の導体を有していても構わない。例えば、これらの導体は、上述の内面電極13、配線電極14および主面電極15と同様の材料および方法によって製作することができ、露出する表面には、内面電極13、配線導体14および主面電極15と同様の金属めっき層が被着されている。電子部品搭載層17は、例えば電子部品２の搭載用に用いられ、中央端子層18は、例えば内面電極13および主面電極15と同様に、モジュール用基板５との接合に用いられる。また、図９に示すように、中央端子層18についても、切欠き部12の内面に設けられた内面電極13に接続させていても構わない。   Further, as shown in FIGS. 9 and 10, the wiring board 1 has conductors other than wiring, such as the metal layer 16, the electronic component mounting layer 17, and the central terminal layer 18, which are provided so as to be sandwiched by the wiring conductors 14. It doesn't matter. For example, these conductors can be manufactured by the same material and method as the above-mentioned inner surface electrode 13, wiring electrode 14 and main surface electrode 15, and the exposed surface has the inner surface electrode 13, the wiring conductor 14 and the main surface electrode. A metal plating layer similar to the electrode 15 is deposited. The electronic component mounting layer 17 is used for mounting the electronic component 2, for example, and the central terminal layer 18 is used for bonding to the module substrate 5, like the inner surface electrode 13 and the main surface electrode 15, for example. Further, as shown in FIG. 9, the central terminal layer 18 may also be connected to the inner surface electrode 13 provided on the inner surface of the cutout portion 12.

また、絶縁基体11の他方主面と切欠き部12との間に、絶縁基体11の厚み方向において配線導体14が設けられた絶縁層11ａ間とは異なる絶縁層11ａ間に、配線導体14と同様な方法により製作された金属層が設けられている場合、金属層は、配線導体14と同様に、平面透視で切欠き部12と重ならない箇所に配置されていることが好ましい。また、第２の実施形態の配線基板１のように、配線導体14の切欠き部12側の外縁と金属層の切欠き部12側の外縁とが平面透視で重ならないようにずれて配置されていると好ましい。なお、この場合においても、絶縁基体11の厚み方向において、配線導体14または金属層のうち、切欠き部12に近く設けられている導体が、平面透視にて切欠き部12との間隔が離れて切欠き部12に沿って設けられていると好ましい。   Further, between the other main surface of the insulating base 11 and the cutout portion 12, between the insulating layer 11a different from the insulating layer 11a in which the wiring conductor 14 is provided in the thickness direction of the insulating base 11, the wiring conductor 14 is provided. When a metal layer manufactured by a similar method is provided, the metal layer is preferably arranged at a position which does not overlap the cutout portion 12 when seen in a plan view, like the wiring conductor 14. Further, as in the wiring board 1 of the second embodiment, the outer edge of the wiring conductor 14 on the side of the cutout portion 12 and the outer edge of the metal layer on the side of the cutout portion 12 are arranged so as not to overlap with each other in plan view. Is preferred. Even in this case, in the thickness direction of the insulating substrate 11, the conductor provided in the wiring conductor 14 or the metal layer near the cutout 12 is separated from the cutout 12 in plan view. Preferably, it is provided along the notch portion 12.

また、第２の実施形態の配線基板１においては、配線導体14は、絶縁層11ａを貫通する貫通導体により主面電極15に直接接続されている。このような構成が、第１、第３の実施形態の配線基板１に適用されている。
Further, in the wiring board 1 of the second embodiment, the wiring conductor 14 is directly connected to the principal surface electrode 15 by a penetrating conductor penetrating the insulating layer 11a. Such a configuration is applied to the wiring boards 1 of the first and third embodiments.

また、第１〜第３の実施形態における配線基板１は、それぞれ平板状の配線基板１であっても構わないし、主面に電子部品２が収容されるキャビティを有する配線基板１であっても構わない。また、第１、第３の実施形態における配線基板１においては、第２の実施形態における配線基板１のように、切欠き部12を複数の大きさの切欠き部12が重なった形状としても構わないし、金属層16、電子部品搭載層17および中央端子層18を備えていても構わない。   Further, the wiring board 1 in the first to third embodiments may be the flat wiring board 1 or the wiring board 1 having a cavity for accommodating the electronic component 2 in the main surface. I do not care. Further, in the wiring board 1 according to the first and third embodiments, the cutout portion 12 may have a shape in which the cutout portions 12 having a plurality of sizes are overlapped, like the wiring board 1 according to the second embodiment. The metal layer 16, the electronic component mounting layer 17, and the central terminal layer 18 may be provided.

また、上述の例では、配線基板１には、１つの電子部品２が搭載されているが、複数の電子部品２、例えば、複数の発光素子が搭載される発光素子搭載用の配線基板１であっても構わない。   Further, in the above-described example, one electronic component 2 is mounted on the wiring board 1, but a plurality of electronic components 2, for example, a wiring board 1 for mounting a light emitting element on which a plurality of light emitting elements are mounted is used. It doesn't matter.

また、配線基板１は多数個取り配線基板の形態で製作されていてもよい。   The wiring board 1 may be manufactured in the form of a multi-piece wiring board.

１・・・・配線基板
11・・・・絶縁基体
11ａ・・・絶縁層
12・・・・切欠き部
13・・・・内面電極
14・・・・配線導体
15・・・・主面電極
16・・・・金属層
17・・・・電子部品搭載層
18・・・・中央端子層
２・・・・電子部品
３・・・・接続部材
４・・・・封止材
５・・・・モジュール用基板
51・・・・接続パッド
６・・・・接合材 1...Wiring board
11... Insulating substrate
11a... Insulating layer
12... Cutout
13....Inner electrode
14---Wiring conductor
15...Main surface electrode
16... Metal layer
17...Electronic component mounting layer
18... Central terminal layer 2... Electronic component 3... Connection member 4... Encapsulation material 5... Module substrate
51・・・・Connecting pad 6・・・・・・Joining material

Claims (4)

一方主面および側面に開口する切欠き部を有している絶縁基体と、
前記切欠き部の内面に設けられた内面電極と、
前記絶縁基体の厚み方向において前記絶縁基体の他方主面と前記切欠き部との間に位置しており、平面透視で前記切欠き部と重ならない箇所に配置され、平面透視で前記切欠き部との間が離れて前記切欠き部に沿って設けられた配線導体とを有しており、
該配線導体は、前記絶縁基体の厚み方向に複数の箇所で設けられており、前記切欠き部側の外縁が平面透視で互いに重ならない箇所に配置されていることを特徴とする配線基板。 On the other hand, an insulating base body having a notch opening on the main surface and the side surface,
An inner surface electrode provided on the inner surface of the cutout portion,
It is located between the other main surface of the insulating base body and the cutout portion in the thickness direction of the insulating base body, and is arranged at a position that does not overlap the cutout portion in plan view, and the cutout portion in plan view. And a wiring conductor provided along the cutout portion apart from each other,
The wiring board is provided at a plurality of locations in the thickness direction of the insulating substrate, and is arranged at locations where the outer edges of the cutout portion do not overlap each other when seen in a plan view . 前記配線導体は、平面透視で前記切欠き部に沿った形状を有していることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the wiring conductor has a shape along the cutout portion when seen in a plan view. 請求項１または請求項２に記載の配線基板と、
該配線基板に搭載され、前記内面電極に電気的に接続された電子部品とを有することを特徴とする電子装置。 A wiring board according to claim 1 or 2 ;
An electronic device, comprising: an electronic component mounted on the wiring board and electrically connected to the inner surface electrode. 接続パッドを有するモジュール用基板と、
前記接続パッドにはんだを介して接続された請求項３に記載の電子装置とを有することを特徴とする電子モジュール。 A module substrate having a connection pad,
The electronic module according to claim 3 , which is connected to the connection pad via solder.
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