JP4711823B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package and an electronic device for storing electronic components such as semiconductor elements and crystal oscillators.

  As an electronic component storage package for storing electronic components such as semiconductor elements and crystal oscillators, a rectangular insulating substrate having an electronic component mounting portion at the center of the upper surface, and an outer periphery of the insulating substrate from the periphery of the mounting portion And a plurality of external lead terminals for external connection arranged and attached to at least one of the upper surface and the lower surface of the insulating base so as to be electrically connected to the wiring conductor. is there. In such an electronic component storage package, the lead terminal is attached to the insulating base by forming connection pads on the upper and lower surfaces of the insulating base, and one end of the lead terminal is connected to the connection pad by a brazing material such as silver solder. It is performed by joining via.

  The electronic component storage package mounts the electronic component on the mounting portion, electrically connects the electrode of the electronic component to the wiring conductor, and seals the electronic component with a lid or a sealing resin as necessary. This completes the electronic device.

  In recent years, there has been a demand for light and thin electronic devices. Therefore, in order to realize a lighter, thinner and smaller electronic device, it is conceivable to form a connection pad on the side surface of the insulating base and to join one end of the lead terminal to the surface of the connection pad. As a result, the area of the connection pad is eliminated on the upper surface or the lower surface of the insulating base, and the lead terminal and the brazing material are reduced in thickness, so that the electronic device can be reduced in size and thickness.

As such a connection pad formed on the side surface of the insulating substrate, a connection pad formed on the side surface of the insulating substrate by printing and applying a metallized paste by a screen printing method or the like is known (see Patent Document 1). . Also, as a connection pad formed on the side surface of the insulating base, it is formed to be exposed on the side surface of the insulating base by cutting through conductors formed in the thickness direction inside the insulating base in the thickness direction. An external terminal is conceivable (see Patent Document 2). Then, by joining one end portion of the lead terminal to the surface of these connection pads and external terminals via a brazing material, an electronic component storage package in which the lead terminal is joined to the side surface of the insulating base can be formed. It is possible to mount an electronic component on the mounting part, electrically connect the electrode of the electronic component to the wiring conductor, and seal the electronic component with a lid or a sealing resin as necessary to complete the electronic device. To do.
JP 2003-168754 A JP 2002-198460 A

  However, recent electronic devices are required to be highly integrated in addition to being light and thin, and it is required that the connection pads and the lead terminals be arranged at high density. When connecting pads are formed by printing and applying metallized paste to the side of the insulating substrate, the insulating substrate is easy to rattle because the area on the side of the insulating substrate is thin and narrow, and the metalized paste is printed and applied to the side of the insulating substrate. Therefore, it is difficult to form the connection pads on the side surface of the insulating base with high accuracy and high density. Therefore, it has been difficult to form an electronic component storage package in which the lead terminals are accurately and densely arranged on the side surface of the insulating base.

  In addition, when the connection pad is formed by printing and applying metallized paste on the side surface of the insulating substrate, the connection pad is formed to protrude from the side surface of the insulating substrate. Since the material spreads the surface of the connection pad and covers the upper and side surfaces of the connection pad, the distance between the adjacent connection pads is reduced by the thickness of the brazing material, and the adjacent connection pads are electrically connected to each other. Therefore, it is difficult to reduce the distance between the plurality of lead terminals on the side surface of the insulating base.

  In addition, when connecting pads are formed by printing and applying metallized paste on the side surfaces of the insulating substrate by screen printing or the like, or when connecting pads are formed by cutting through conductors and exposing the side surfaces of the insulating substrate, insulation The area of the side surface of the substrate is smaller than the area of the upper and lower surfaces of the insulating substrate, and the connection pad cannot be formed in a wide area on the side surface of the insulating substrate, so the bonding area between the connection pad and the insulating substrate is reduced. It was. For this reason, when the lead terminal is joined to the connection pad via the brazing material, there is a problem that the connection pad is easily peeled off from the insulating base due to the stress of the brazing material.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to arrange lead terminals at a high density on the side surface of the insulating base and to firmly bond the connection pads to the insulating base. An electronic component storage package and an electronic device are provided.

The electronic component storage package of the present invention includes a plurality of insulating layers, and is formed between an insulating base having a mounting portion for the electronic components and the plurality of insulating layers, and is electrically connected to the electrodes of the electronic components. The wiring conductor to be connected is provided so as to penetrate and fill at least one of the plurality of insulating layers, and is electrically connected to the wiring conductor, and a part of the surface of the insulating base is is exposed on the side surfaces, it joined and it is wider conductor width of the portion which is buried in the insulating base than the width of the site that was issued said exposure, at a site the exposed on the side surface of the insulating substrate of the conductor it is characterized in that a lead terminal.

  In the electronic component storage package of the present invention, a plurality of the wiring conductors are formed between different layers of the plurality of insulating layers, and upper ends and lower ends of the conductors are connected to the plurality of wiring conductors. It is a feature.

  The electronic component storage package of the present invention is characterized in that an end portion of the conductor is embedded in at least one of the upper and lower insulating layers.

  An electronic device according to the present invention includes the electronic component storage package of the present invention and an electronic component mounted on the insulating base of the electronic component storage package.

  In the electronic component storage package according to the present invention, the conductor is placed inside the insulating base because the width of the portion embedded in the insulating base is wider than the width of the portion exposed on the side surface of the insulating base. Since it can be buried and easily caught inside the insulating substrate, the bonding strength between the conductor and the insulating substrate can be improved, and when the lead terminal is bonded to the conductor via the bonding member, the conductor due to the stress of the bonding member Can be prevented from peeling off from the insulating substrate.

  In addition, the conductor is formed as a surface on the side surface of the insulating base, and the area exposed on the side surface of the insulating base can be reduced, so that the conductor can be arranged on the side surface of the insulating base with high density and lead terminals. When joining a conductor to a conductor via a joining member, even if the joining member spreads over the surface of the conductor, it does not spread beyond the width of the conductor, and it is easy to reduce the possibility of adjacent conductors being electrically short-circuited. The conductors can be arranged on the side surface of the insulating base with high density.

  Therefore, it is possible to provide an electronic component storage package in which the lead terminals are arranged at high density on the side surface of the insulating base and the conductor is firmly bonded to the insulating base.

  Preferably, a plurality of wiring conductors are formed between different layers of the plurality of insulating layers, and the upper end and the lower end of the conductor are connected to the plurality of wiring conductors, whereby the wiring connected to the upper end and the lower end is connected. Since the conductor can be firmly bonded to the inside of the insulating base by holding the conductor from the top and bottom directions, when the lead terminal is joined to the conductor via the joining member, the conductor is insulated by the stress of the joining member. It can suppress more favorably that it peels from.

  Preferably, the end of the conductor is embedded in the upper insulating layer or the lower insulating layer of the insulating layer on which the conductor is formed, so that the conductor is embedded in the upper or lower insulating layer. Since it becomes easy to get caught by the upper layer or the lower insulating layer, it is possible to better suppress the conductor from peeling off from the insulating base due to the stress of the bonding member when the lead terminal is bonded to the conductor via the bonding member.

  The electronic device according to the present invention includes the electronic component storage package and the electronic components mounted on the insulating base of the electronic component storage package, so that the lead terminals are arranged on the side surface of the insulating base with high density. It becomes an electronic device with high reliability.

  An electronic component storage package and an electronic device according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package according to the present invention. In FIG. 1, 1 is an insulating substrate, 2 is a wiring conductor, 3 is a conductor, 4 is a lead terminal, and 5 is an electronic component.

  The electronic component storage package of the present invention includes a plurality of insulating layers, and is formed between the insulating base 1 having the mounting portion 1a of the electronic component 5 and the plurality of insulating layers, and the electrodes of the electronic component 5 are electrically connected. Wiring conductor 2 and at least one of the plurality of insulating layers are penetrated, and are electrically connected to wiring conductor 2 and a part of the surface is exposed on the side surface of insulating substrate 1. The conductor 3 and the lead terminal 4 joined to the site | part exposed to the side surface of the insulated base 1 of a conductor are provided.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body, for example, an aluminum oxide sintered body. For example, alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), and other raw material powders are mixed with a suitable organic solvent and solvent to obtain a mud-like shape. A ceramic green sheet (ceramic raw sheet) is obtained by forming a sheet by adopting a well-known doctor blade method, calendar roll method, etc., and then performing a suitable punching process on the ceramic raw sheet, It is manufactured by firing at about 1600 ° C.

  The wiring conductor 2 is made of a sintered body of a refractory metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), and a glass component or ceramic component powder is added to the refractory metal powder as necessary. A metal paste obtained by adding and mixing an appropriate organic solvent and solvent into the paste is printed in a predetermined pattern on a ceramic raw sheet to be an insulating substrate 1 by using a conventionally known thick film forming method such as a screen printing method. It is coated and formed so as to be led out from the periphery of the mounting portion of the insulating base 1 to the outside of the container by sintering by simultaneous firing with the ceramic raw sheet. When the wiring conductor 2 penetrates the insulating substrate 1 in the laminating direction, a through hole is formed in the ceramic raw sheet by a punching die or a punching machine before the above-described printing application, and a metal paste is screen-printed in this through hole. It can be formed by filling with a filling means.

  The portion exposed to the outer surface of the insulating base 1 of the wiring conductor 2 is made by depositing a metal having excellent corrosion resistance such as nickel (Ni) to a thickness of about 1.0 to 20.0 μm as a base metal layer. The wiring conductor 2 can be effectively prevented from being oxidized and corroded, and the electronic component 5 can be firmly fixed to the insulating substrate 1 and the wiring conductor 2 can be firmly joined to an electrical connection means such as an Au wire or a solder bump. be able to. Therefore, an Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 2 by an electrolytic plating method or an electroless plating method. ing.

  The conductor 3 is made of a sintered body of a refractory metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn) or the like, and a glass component or ceramic component powder is added to the refractory metal powder as necessary. A conductive paste obtained by adding and mixing an appropriate organic solvent and solvent is used to embed means such as a well-known screen printing method, and is punched into a ceramic raw sheet to be an insulating substrate 1 by a punching die or a punching machine. The formed through-holes are filled in advance, sintered by co-firing with the ceramic raw sheet, and exposed to the side surface of the insulating substrate 1. The conductor 3 is formed along the outer edge of the insulating base 1 inside the substrate formed wider than the insulating base 1, and when the outer edge of the insulating base 1 is formed by cutting the substrate by a slicing method, the conductor 3 is insulated. It can be formed by being exposed on the side surface of the substrate 1.

  The conductor 3 is formed inside the substrate formed wider than the insulating base 1 along the outer edge of the insulating base 1, and is exposed on the side of the insulating base 1 by polishing the side of the substrate. Alternatively, a dividing groove is formed at the outer edge of the insulating substrate 1 and the position of the conductor 3, and the substrate is bent along the dividing groove so as to be exposed on the side surface of the insulating substrate 1. You can also The conductor 3 is formed by exposing the conductive paste to the side surface of the ceramic raw sheet to be the insulating base 1 by cutting and then sintering it by simultaneous firing with the ceramic raw sheet to expose the side surface of the insulating base 1. You can also

  Further, the portion of the conductor 3 exposed on the side surface of the insulating base 1 is made by depositing a metal having excellent corrosion resistance such as nickel (Ni) to a thickness of about 1.0 to 20.0 μm as a base metal layer. The conductor 3 can be effectively prevented from being oxidized and corroded, and the conductor 3 and the lead terminal 4 can be firmly joined. Therefore, a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the conductor 3 by an electrolytic plating method or an electroless plating method. Yes.

  The lead terminal 4 is formed of a metal material such as an iron-based alloy such as iron-nickel alloy or iron-nickel-cobalt alloy, copper, or an alloy mainly composed of copper. Then, it is connected to the conductor 3 through a joining member 6 such as silver solder.

  Further, the exposed portion of the lead terminal 4 is oxidized when a metal having excellent corrosion resistance such as nickel (Ni) is deposited as a base metal layer to a thickness of about 1.0 to 20.0 μm. Corrosion can be effectively prevented, and the bonding between the lead terminal 4 and the wiring conductor of the external circuit board can be strengthened. Therefore, an Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the lead terminal 4 by an electrolytic plating method or an electroless plating method. ing.

  In the present invention, as shown in FIGS. 2 (a) to 2 (d), the conductor 3 is embedded in the insulating base 1 from the width W 1 of the portion exposed on the side surface of the insulating base 1. The part W2 is wider. As a result, the conductor 3 can be embedded in the insulating base 1 and can be easily caught inside the insulating base 1, so that the bonding strength between the conductor 3 and the insulating base 1 can be improved, and the lead terminal 4 can be When the conductor 3 is joined via the joining member 6, the conductor 3 can be prevented from being peeled off from the insulating base 1 due to the stress of the joining member 6.

  In addition, the conductor 3 is formed as a surface on the side surface of the insulating base 1, and the area exposed on the side surface of the insulating base 1 can be reduced. Therefore, the conductor 3 can be arranged on the side surface of the insulating base 1 with high density. In addition, when the external lead 4 is joined to the conductor 3 via the joining member 6, even if the joining member 6 spreads, it does not spread beyond the width of the conductor 3, and adjacent conductors 3 can be electrically short-circuited. Therefore, the conductor 3 can be disposed on the side surface of the insulating base 1 with high density.

  Therefore, it is possible to provide an electronic component storage package in which the lead terminals 4 are arranged on the side surface of the insulating base 1 with high density and the conductor 3 is firmly bonded to the insulating base 1.

  When such a conductor 3 is exposed on the side surface of the insulating base 1, it is cut so that the width W2 of the portion disposed inside the insulating base 1 is larger than the width W1 exposed on the side of the insulating base 1. It can be formed by performing processing such as polishing and bending along the dividing grooves. The conductor 3 may be formed by exposing a substrate formed wider than the insulating base 1 by cutting or the like along the outer edge of the insulating base 1, or performing the cutting or the like. After the conductive paste is exposed on the side surface of the ceramic raw sheet to be the insulating substrate 1, it may be formed so as to be exposed on the side surface of the insulating substrate 1 by co-firing with the ceramic raw sheet to be the insulating substrate 1. .

  In addition, as shown in FIGS. 2 (a) to 2 (d), such a conductor 3 has a circular shape, a square shape, a triangular shape, or a shape obtained by partially cutting a polygonal shape in a plan view. The width W2 of the portion embedded in the insulating substrate 1 may be wider than the width W1 of the portion exposed on the side surface of the insulating substrate 1, such as a convex shape that makes the side surface of 1 narrow. In addition, in order to make the filling property of the conductor 3 into the insulating base 1 good and to make the bonding strength between the conductor 3 and the insulating base 1 good, the conductor 3 has a circular shape as shown in FIG. It is preferable that a part of is cut.

  Further, as shown in FIG. 3, the conductor 3 may be formed across a plurality of insulating layers and exposed on the side surface of the insulating substrate 1. Thereby, the area exposed on the side surface of the conductor 3 can be formed in a wide region in the thickness direction of the insulating base 1, and the bonding strength between the conductor 3 and the lead terminal 4 can be strengthened. Further, as shown in FIG. 4, a plurality of conductors 3 may be formed in insulating layers having different thickness directions of the insulating base 1, and lead terminals 4 are connected to each of the plurality of conductors 3. It may be. Thereby, since the several lead terminal 4 can be arrange | positioned in the thickness direction of the side surface of the insulation base | substrate 1, it can be set as a smaller and high-density electronic component accommodation package. Further, as shown in FIG. 5, the lead terminal 4 may be formed with a wide portion on the conductor 3 side. Thereby, the joining area of the conductor 3 and the lead terminal 4 can be formed in a wide area | region, and the joining strength of the conductor 3 and the lead terminal 4 can be strengthened. Further, the lead terminal 4 may be formed with a dent or a groove on the surface of the portion to be joined to the conductor 3. Thereby, the joining area of the conductor 3 and the lead terminal 4 can be made into a wide area | region, and the joining strength of the conductor 3 and the lead terminal 4 can be made stronger.

  In addition, as shown in FIG. 6, it is preferable that a plurality of wiring conductors 2 are formed between different layers of a plurality of insulating layers, and the upper ends and lower ends of the conductors 3 are connected to the plurality of wiring conductors 2. As a result, the conductor 3 can be held firmly in the direction of the upper end and the lower end by the wiring conductor 2 connected to the upper end and the lower end, and the conductor 3 can be firmly joined to the inside of the insulating base 1, so that the lead terminal 4 can be joined to the joining member. When the conductor 3 is joined to the conductor 3 via 6, it is possible to better suppress the conductor 3 from being peeled off from the insulating substrate 1 due to the stress of the joining member 6.

  Such a conductor 3 can be formed as follows. For example, after filling a through hole of a ceramic raw sheet with a conductor paste, a metal paste to be a wiring conductor 2 is coated on the upper surface of the ceramic raw sheet so as to cover at least a part of the conductor paste by a thick film forming method such as a screen printing method. Then, the upper and lower ends of the conductive paste are connected to the metal paste by printing and coating on the lower surface and laminating with other ceramic raw sheets. And the upper end and lower end of the conductor 3 will be connected to the some wiring conductor 2 by simultaneous baking with the ceramic raw sheet used as the insulation base | substrate 1. FIG. Also, the metal paste is printed on the lower surface of the ceramic raw sheet that is the upper layer of the ceramic raw sheet that is filled with the conductive paste and the upper surface of the ceramic raw sheet that is the lower layer, and the ceramic raw sheet and the conductive paste are filled. When the ceramic raw sheets are laminated, the metal paste and the conductor paste may be connected. In addition, the metal paste is applied to either the upper surface or the lower surface of the ceramic raw sheet filled with the conductor paste, and the other is printed and applied to another ceramic green sheet. May be connected. Further, the respective wiring conductors 2 connected to the upper end and the lower end of the conductor 3 are directly connected by the wiring conductors 2 formed penetrating in the thickness direction of the insulating base 1 as shown in FIG. Each wiring conductor 2 may be independently connected to the upper end or the lower end of the conductor 3.

  Moreover, as shown in FIGS. 7 and 8, it is preferable that the end portion of the conductor 3 is embedded in the upper insulating layer or the lower insulating layer on which the conductor 3 is formed. Thereby, since the conductor 3 is embedded in the upper or lower insulating layer, and easily caught by the upper or lower insulating layer of the conductor 3, the bonding strength between the conductor 3 and the insulating base 1 can be improved. When the lead terminal 4 is joined to the conductor 3 via the joining member 6, the conductor 3 can be better suppressed from being peeled off from the insulating base 1 due to the stress of the joining member 6.

  Such a conductor 3 can be formed as follows. For example, when the conductive paste is filled in the through holes of the ceramic raw sheet, the conductive paste is formed so as to protrude from at least one of the upper surface or the lower surface of the ceramic raw sheet, and thus laminated with other ceramic raw sheets. At this time, the conductor paste is embedded in at least one of the ceramic raw sheets to be the insulating base 1. And the end part of the conductor 3 is embed | buried under the insulating layer of the upper layer of the insulating layer in which the conductor 3 was formed, or the lower insulating layer by simultaneous baking with the ceramic raw sheet used as the insulating base | substrate 1. FIG.

  Further, the conductive paste filled in the through holes of the ceramic raw sheet by an embedding means such as a screen printing method may be formed so as to protrude from the upper surface or the lower surface of the ceramic raw sheet. After the first conductor paste is filled in the through holes of the ceramic raw sheet by means, the surface of the first conductor paste is printed and applied with the second conductor paste by printing means such as a screen printing method. May protrude from the upper or lower surface of the ceramic raw sheet.

  When the second conductor paste is printed and applied to the surface of the first conductor paste, the second conductor paste is not applied in the same shape as the through hole, but is applied to a narrower area or a wider area than the area of the through hole. Alternatively, the first conductive paste filled in the through holes of the ceramic raw sheet may be printed and applied using a conductive paste having a different component such as content. As a result, when the ceramic raw sheet filled with the conductive paste in the through holes and the other ceramic raw sheet are laminated, the conductive paste is embedded in at least one of the ceramic raw sheets serving as the insulating base 1. The end portion is embedded in the upper insulating layer or the lower insulating layer in which the conductor 3 is formed.

  More preferably, the end portion of the conductor 3 is embedded in both the upper insulating layer and the lower insulating layer where the conductor 3 is formed. As a result, the end portion of the conductor 3 is widely embedded in both the upper insulating layer and the lower insulating layer, and is easily caught by the insulating base 1, so that the bonding strength between the conductor 3 and the insulating base 1 is improved. Can be improved.

  In the electronic device of the present invention, the electronic component 5 such as a semiconductor element or a crystal resonator is mounted on the mounting portion of the electronic component storage package as described above. With this configuration, a highly reliable electronic device in which the lead terminals 4 are arranged on the side surface of the insulating substrate 1 with high density is obtained.

  The electronic component 5 is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, or various sensors. When the electronic component 5 is a flip chip type semiconductor element, the electrode of the semiconductor element and the wiring layer 2 are electrically connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). Connected to. When the electronic component 5 is a wire bonding type semiconductor element, the substrate surface (back surface) of the semiconductor element and the substrate 1 are bonded via glass, resin, brazing material, and the semiconductor element is bonded via a bonding wire. These electrodes and the wiring conductor 2 are electrically connected. When the electronic component 5 is a piezoelectric element, the electrode of the piezoelectric element and the wiring conductor 2 are electrically connected via a conductive resin.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described example, the mounting portion 1 a on which the electronic component 5 is mounted is formed on the upper surface of the insulating base 1, but the mounting portion 1 a is not on the upper surface of the insulating base 1 such as the lower surface of the insulating base 1. It may be formed. In the above-described example, the lead terminal 4 is joined to the conductor 3 formed on one side surface of the insulating base 1, but a plurality of the insulating base body 1 such as the two side surfaces and the four side surfaces of the insulating base 1 are used. The conductor 3 may be formed on the side surface, and the lead terminal 4 may be bonded to the conductor 3. The mounting portion 1a on which the electronic component 5 is mounted may be formed on the bottom surface of the recess formed on the upper surface or the lower surface of the insulating substrate 1, or the upper surface or the lower surface of the flat insulating substrate 1. It may be formed.

It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. (A)-(d) is an enlarged plan view which shows an example of embodiment in the connection part of a connection pad and lead terminal of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. FIG. 8 is an enlarged sectional view of a main part of the electronic component storage package in FIG.

Explanation of symbols

1 .... Insulating substrate 2 .... Wiring conductor 3 .... Connecting pad 4 .... Lead terminal 5 .... Electronic component 6 .... ..Joint members

Claims (4)

An insulating base comprising a plurality of insulating layers and having an electronic component mounting portion; a wiring conductor formed between the plurality of insulating layers and electrically connected to the electrodes of the electronic components; site is provided to fill through at least one insulating layer, which together are electrically connected to the wiring conductor, a part of the surface is exposed to the side surface of the insulating substrate, issued said exposure and a wide conductor towards the width than the width the portion that is embedded in the insulating base, and further comprising a lead terminal joined at a site exposed to the side surface of the insulating base of the conductor Electronic component storage package. 2. The electronic component according to claim 1, wherein a plurality of the wiring conductors are formed between different layers of the plurality of insulating layers, and upper ends and lower ends of the conductors are connected to the plurality of wiring conductors. Storage package. 2. The electronic component storing package according to claim 1, wherein an end portion of the conductor is embedded in an upper insulating layer or a lower insulating layer of the insulating layer on which the conductor is formed. An electronic device comprising: the electronic component storage package according to any one of claims 1 to 3; and an electronic component mounted on the insulating base of the electronic component storage package.

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