JP4912118B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package for mounting an electronic component and an electronic device in which the electronic component is mounted on the electronic component storage package.

  Conventionally, an electronic component storage package for mounting electronic components such as a semiconductor element, a crystal resonator, a capacitor, and a resistance element is, for example, on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. A wiring conductor made of metal powder metallization such as tungsten or molybdenum is provided.

In such an electronic component storage package, a recess for mounting the electronic component is usually formed, and a plurality of wiring conductors acting as electrodes of the electronic component storage package are formed on the bottom surface of the recess. ing. In order to manufacture an electronic device by mounting an electronic component in the electronic component storage package, the electronic component is accommodated in the recess, and each electrode of the electronic component is connected via an electrical connection means such as solder or a bonding wire. Are electrically connected to the corresponding wiring conductors, and the electronic components are sealed by covering them with a lid made of metal, ceramics, glass or the like or potting resin (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 2004-120481

  However, when a small electronic component such as a capacitor or a resistance element is accommodated in the recess and each electrode of the electronic component is bonded to each wiring conductor of the electronic component storage package by a bonding member such as solder, it is applied to each wiring conductor. Due to the variation in the amount of the joined member, the deviation of the melting timing of the joined member, etc., one electrode of the electronic component with the electrode joined to one wiring conductor (one of the electrodes of the electronic component storage package) as a fulcrum A phenomenon may occur in which an end portion rises in an arc and an electronic component stands on one wiring conductor, a so-called Manhattan phenomenon. When such a Manhattan phenomenon occurs, there has been a problem that it is impossible to realize good bonding between the electrode of the electronic component and the electrode of the electronic component storage package.

  The present invention has been devised in view of the above-described problems of the prior art, and its purpose is to improve the electronic component while realizing good bonding between the electrode of the electronic component and the electrode of the electronic component storage package. An object of the present invention is to provide an electronic component storage package that can be stored, and to provide a highly reliable electronic device having such an electronic component storage package.

The electronic component storage package of the present invention includes a recess for storing the first and second electronic components on at least one main surface of the insulating base, and the first electronic component is electrically connected to the inner side surface of the recess. and the first electrode is provided to be connected, the recess, the under the receiving region of the first electronic component has the accommodating region of the second electronic component, an inner side surface of said recess Includes a second electrode that is electrically connected to the second electronic component.

Preferably, the first electrode and the second electrode are misaligned in plan view.

Preferably, a step portion is provided on an inner side surface of the recess, the first electrode is provided on an upper side surface of the step portion, and the second electrode is provided below the step portion. It is provided in the side surface of the side.

Preferably, the concave portion has a polygonal shape in a plan view, and the first electrode and the second electrode are formed on different sides of the polygonal shape, respectively. .

Electronic device of the present invention, which is characterized by comprising an electronic component storing package of the present invention, the first electronic component and the second electronic component housed in the concave portion of the electronic component storing package is there.

  The electronic component storage package of the present invention includes a recess for storing the electronic component on at least one main surface of the insulating base, and an electrode to which the electronic component is electrically connected is provided on the inner side surface of the recess. When joining the electronic component to the electrode formed in the recess, the joining member is positioned in the side surface direction of the electronic component. As a result, the thickness of the bonding member applied to the electrode affects the direction perpendicular to the side surface of the electronic component, and the force of the molten bonding member is large in the direction perpendicular to the side surface of the electronic component, Smaller in the vertical direction. Therefore, even if there is a variation in the amount of the bonding member or the timing of melting the bonding member in the electrode in the recess, the possibility of the so-called Manhattan phenomenon can be reduced, and the electronic component can be reduced to the electrode in the recess. Can be satisfactorily bonded to each other.

In the electronic component storage package of the present invention, the recess has a second electronic component storage area below the first electronic component storage area. Since the second electrode electrically connected to the component is provided, each of the first electronic component and the second electronic component is formed into the first electrode and the second electrode formed in the recess. When joining, a joining member will be located in the side surface direction of a 1st electronic component and a 2nd electronic component. As a result, the
The thickness of the bonding member applied to the first electrode and the second electrode affects the direction perpendicular to the side surfaces of the first electronic component and the second electronic component . Large in the direction perpendicular to the side surfaces of the electronic component and the second electronic component, and small in the direction perpendicular to the lower surfaces of the first electronic component and the second electronic component. Therefore, even if there is a variation in the amount of the bonding member between the first electrode and the second electrode in the recess and the timing of melting the bonding member, the possibility of the so-called Manhattan phenomenon can be reduced. The first electronic component and the second electronic component can be satisfactorily bonded to the first electrode and the second electrode in the recess.

Further, since the first electronic component and the second electronic component are accommodated in the depth direction of the recess, it is necessary to form a plurality of recesses for accommodating the first electronic component and the second electronic component, or to form a wide width. The electronic device can be made small.

Also, preferably, in plan view, since it is misaligned with the first electrode and the second electrode, and the junction region between the first electrode and the first electronic component, a second electrode first Since the position of the bonding area with the electronic component 2 is shifted, the possibility that the first electronic component and the second electronic component housed in the recess are electrically short-circuited can be reduced, and the reliability can be reduced. An excellent electronic device can be formed.

Preferably, a step portion is provided on the inner side surface of the recess, the first electrode is provided on the upper side surface of the step portion, and the second electrode is provided on the lower side surface of the step portion. since being, it shifted the position of the first electrode and the second electrode by the stepped portion, and the junction region between the first electrode and the first electronic component, the second electrode and the second electronic component Since the position of the first electronic component and the second electronic component is electrically short-circuited can be reduced more reliably, the electron with excellent reliability A device can be formed.

Also, preferably, the recess forms a polygonal shape in plan view, the first electrode and the second electrode, since they are formed respectively on different sides of the polygonal shape, the first electrode and the second electrode are formed in different positions, the bonding region between the first electrode and the first electronic component, since the position of the junction region between the second electrode and the second electronic component is shifted, the first electronic component The possibility that the second electronic component and the second electronic component are electrically short-circuited can be reduced more reliably, and an electronic device having excellent reliability can be formed.

The electronic device of the present invention includes the electronic component storage package of the present invention, and the first electronic component and the second electronic component stored in the recess of the electronic component storage package . and the electronic component and the second electronic component are well accommodated in the recess of the first electronic component and the second first and the good, the second electrode and the electronic component storing package electrodes of the electronic component The connected electronic device is excellent in reliability.

  Embodiments of an electronic component storage package according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1A is a cross-sectional view showing an embodiment of an electronic component storage package according to the present invention, and FIG. 1B shows a recess of the electronic component storage package shown in FIG. It is a principal part expanded sectional view in the periphery (it shows with the dotted line A). FIG. 2 is an enlarged cross-sectional view of the main part around the recess when the electronic component is accommodated in the recess. In these drawings, 1 is an insulating substrate, 2 is a recess, 3 is an electrode, 4 is an electronic component, 5 is a joining member, and 6 is a wiring conductor.

  As shown in FIGS. 1 and 2, the electronic component storage package according to the present embodiment includes a concave portion 2 that accommodates an electronic component 4 on one main surface of an insulating base 1, and an electronic component on the inner side surface of the concave portion 2. An electrode 3 to which the component 4 is electrically connected is provided. This electrode is electrically connected to the electrode of the electronic component 4 via a bonding member 5 such as solder. Further, a recess 8 capable of accommodating another electronic component is formed on the same main surface where the recess 2 is formed, and a wiring conductor 6 is formed on the bottom surface of the recess 8 and on the surface and inside of the insulating base 1. Each is provided.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body, for example, an aluminum oxide sintered body. For example, alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), and other raw material powders are mixed with a suitable organic solvent and solvent to obtain a mud-like shape. A ceramic green sheet (ceramic raw sheet) is obtained by forming a sheet by adopting a well-known doctor blade method, calendar roll method, etc., and then performing a suitable punching process on the ceramic raw sheet and laminating a plurality of sheets, It is manufactured by firing at a high temperature (about 1500 to 1800 ° C.).

  In this case, the recesses 2 and 8 are formed by punching a through hole for the recess 2 and a through hole for the recess 8 into one or more ceramic green sheets according to the depth of the recesses 2 and 8 by a die or punching or laser. It is formed by a processing method such as processing and then laminated with another ceramic green sheet.

  The electrode 3 is electrically connected to a wiring conductor 6 described later, and functions as a conductive path for electrically connecting the electronic component 4 accommodated in the recess 2 to an external electric circuit board or the like. The electrode 3 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and a metallized paste for the electrode 3 is applied to a predetermined region on the inner side surface of the through hole for the recess 2 to be used for the insulating substrate 1. By firing together with the ceramic green sheet, it can be formed on the inner side surface of the recess 2. As a method of applying the metallized paste for the electrode 3 to a predetermined region on the inner side surface of the through hole for the concave portion 2, for example, the electrode is formed on the inner side surface of the through hole of the ceramic green sheet in which the through hole for the concave portion 2 is formed. The ceramic green sheet is previously applied so that the metallized paste for electrode 3 is printed and applied by screen printing or the like, and the metallized paste for electrode 3 is exposed on the inner surface of the through hole when the through hole for recess 2 is formed. There is a method of embedding a metallized paste for the electrode 3. Specifically, in the latter method, before the through hole for the recess 2 is formed, the through hole is formed in a predetermined region of the ceramic green sheet on which the through hole for the recess 2 is formed. When the metallized paste for the electrode 3 is filled in the through hole by printing or the like, or the metallized paste for the electrode 3 is printed on the inner peripheral surface of the through hole to form the through hole for the recess 2, the electrode The metallized paste 3 is formed so as to be exposed on the inner surface of the through hole for the recess 2. The metallized paste for the electrode 3 is mixed and kneaded by kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc. with an organic binder, an organic solvent, and a dispersant as required added to the main component metal powder. Produced. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering.

  Further, the wiring conductor 6 functions as a conductive path for electrically connecting the electronic component 4 accommodated in the recess 2 and the electronic component accommodated in the recess 8 to the external electric circuit board. The wiring conductor 6 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and a metallized paste for the wiring conductor 6 is printed and applied to a ceramic green sheet for the insulating substrate 1 by a screen printing method or the like. By baking together with the ceramic green sheet for the insulating substrate 1, it is deposited on a predetermined region. The metallized paste for the wiring conductor 6 can be produced by the same method as the metallized paste for the electrode 3, and the metallized paste is produced in the same manner as the metallized paste for the electrode 3, but with an organic binder or an organic solvent. A viscosity suitable for printing is prepared depending on the amount.

  Further, the wiring conductor 6 formed inside the insulating base 1 may have a through conductor that penetrates at least one of the plurality of insulator layers constituting the insulating base 1. Such a through conductor is used for the through conductor by a punching method by a die or punching or a processing method such as laser processing on a ceramic green sheet for the insulating substrate 1 prior to printing and application of the metallized paste for forming the wiring conductor 6. The through hole for the through conductor is filled with the metallized paste for the through conductor by printing means such as a screen printing method, and this is fired together with the ceramic green sheet for the insulating substrate 1. Formed in each region. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring conductor 6 provided on the insulator layer, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  In addition, the recesses 2 and 8 of the electrode 3 and the wiring conductor 6 and the portions exposed to the outer surface of the insulating base 1 are coated with a metal having excellent corrosion resistance such as nickel (Ni) and gold (Au). The electrode 3 and the wiring conductor 6 can be effectively prevented from being oxidized and corroded, the electrode 3 and the electronic component 4 are joined, the wiring conductor 6 is electrically connected to an Au wire, a solder bump, and the like, and the wiring conductor 6 and the outside are connected to the outside. The bonding with the circuit board can be made strong. Therefore, a portion of the electrode 3 and the wiring conductor 6 exposed on the recesses 2 and 8 and the outer surface of the insulating substrate 1 is a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating having a thickness of about 0.1 to 3 μm. The layers are sequentially deposited by electrolytic plating or electroless plating.

  In the electronic component storage package according to the present embodiment, the electrode 3 to which the electronic component 4 is electrically connected via the bonding member 5 is provided on the inner side surface of the recess 2. With this configuration, when the electrode of the electronic component 4 is bonded to the electrode 3 formed on the inner side surface of the recess 2, the bonding member 5 is positioned in the side surface direction of the electronic component 4. Thereby, the thickness of the bonding member 5 applied to the electrode 3 affects the direction perpendicular to the side surface of the electronic component 4, and the force of the molten bonding member 5 is large in the direction perpendicular to the side surface of the electronic component 4. It becomes smaller in the direction perpendicular to the lower surface of the electronic component 4. Therefore, even if there is a variation in the amount of the bonding member 5 between the electrodes 3 or a deviation in the melting timing of the bonding member 5, the possibility of the so-called Manhattan phenomenon can be reduced, and the electronic component 4 is connected to the electrode 3. Can be satisfactorily bonded to each other.

  As shown in FIG. 3, the electrode 3 is preferably separated from the bottom surface of the recess 2. With this configuration, the weight of the electronic component 4 is light, and the thickness of the electronic component 4 is compared with the length from the bottom surface of the recess 2 to the opening end of the electrode 3 (the upper end of the electrode 3 in FIG. 3). In this case, the electronic component 4 can be separated from the bottom surface of the recess 2 by the surface tension of the bonding member 5, so that the electronic component 4 can be stored after the electronic component 4 is stored in the recess 2. When the package is immersed in a cleaning liquid or the like, the cleaning liquid or the like is easily circulated in a region where the lower surface of the electronic component 4 and the bottom surface of the recess are separated, and the electronic component 4 and the electronic component storage package can be cleaned well. become able to.

  As shown in FIG. 4, the electrode 3 is preferably separated from the opening of the recess 2. With this configuration, the thickness of the electronic component 4 accommodated in the recess 2 is less than the length from the bottom surface of the recess to the opening end of the electrode on the opening side (the upper end of the electrode 3 in FIG. 4). In such a case, when the electronic component 4 is joined to the electrode 3 formed on the inner side surface of the recess 2, the electronic component 4 moves from the opening of the recess 2 toward the electrode 3 in the recess 2 due to the surface tension of the joining member 5. Since it is pulled, it is possible to suppress the electronic component 4 from protruding from the opening of the recess 2, and the electronic component 4 can be satisfactorily accommodated in the recess 2.

  Further, as shown in FIG. 5, the insulating base 1 is preferably composed of a first insulating layer 1a and a second insulating layer 1b having a through hole 2a laminated on the first insulating layer 1a. . FIG. 5A is an exploded view of the first insulating layer 1a and the second insulating layer 1b, and FIG. 5B shows the first insulating layer 1a and the second insulating layer. The state which laminated | stacked 1b is shown. With this configuration, even if a stacking shift occurs between the first insulating layer 1a and the second insulating layer 1b when the first insulating layer 1a and the second insulating layer 1b are stacked, the first insulating layer 1a and the second insulating layer 1b Compared with the case where the electrode 3 is formed on the layer 1a (the electrode 3 is formed on the bottom surface of the concave portion 2), the electrode 3 formed on the inner surface of the through hole of the second insulating layer 1b to be the concave portion 2 is not misaligned. Since it is not affected and the area does not change, the electrode 3 is favorably formed in a predetermined shape on the inner side surface of the recess 2. Therefore, when the electrode of the electronic component 4 is bonded to the electrode 3 after the predetermined amount of the bonding member 5 is attached to the electrode 3, the amount of the bonding member per unit area of the electrode 3 does not vary. The electrode of the electronic component 4 and the electrode 3 can be bonded satisfactorily.

  The insulating base 1 is composed of a first insulating layer and a plurality of second insulating layers 1b each having a through hole stacked on the first insulating layer, and each through hole 2a extends in the stacking direction. Connected to each other, an electrode 3 is provided on the inner surface of at least one layer of each through hole 2a, and the inner surface of the through hole 2a provided with the electrode 3 is formed between the through hole 2a provided with the electrode 3 and the recess. It is preferable that the inner surface of the through hole 2a located between the opening and the inner surface of the recess 2 protrudes from the inner surface of the through hole 2a. With this configuration, even when a stacking shift occurs between the plurality of second insulating layers 1b when the plurality of second insulating layers 1b are stacked, the second positioned closer to the opening side than the electrode 3 is provided. The inner surface of the through hole 2a of the insulating layer 1b is formed at a position that is always wider than the electrode 3 in plan view, and a region (width and length) for accommodating the electronic component 4 is secured. Therefore, when the electronic component 4 is accommodated in the recess 2, the electronic component 4 is not caught by the wall portion of the recess 2, and the electronic component 4 can be satisfactorily accommodated in the recess 2.

  In order for the inner surface of the through hole 2a of the electrode 3 to protrude, the electrode 3 is formed when the through hole 2a is formed in each of the plurality of second insulating layers 1b by a punching method or the like. The opening diameter of the through hole 2a formed in the ceramic green sheet for the second insulating layer 1b is smaller than the opening diameter of the through hole 2a formed in the ceramic green sheet for the other second insulating layer 1b. These may be formed and laminated. In consideration of misalignment and the like, the opening diameter of the through hole 2a formed in the ceramic green sheet for the second insulating layer 1b on which the electrode 3 is formed is the same as the ceramic green sheet for the other second insulating layer 1b. It is preferable that the opening diameter of the through hole 2a to be formed is smaller by about 0.1 to 0.2 mm.

  Moreover, as shown in FIGS. 6-8, it is preferable to provide the support part 7 which supports the electronic component 4 in predetermined | prescribed height in the bottom face of the recessed part 2. As shown in FIG. For example, as shown in FIG. 6, one support portion 7 can be provided at the center of the bottom surface of the recess 2. Moreover, you may provide the some support part 7 in the bottom face of the recessed part 2, and make those support parts 7 contact the corner | angular part comprised from the bottom face and side surface of the recessed part 2, as FIG. 7 shows. It may be provided, or may be provided apart from the corner as shown in FIG. With these configurations, when the electronic component 4 is accommodated in the recess 2, the electronic component 4 is mounted on the support portion 7, and the lower surface of the electronic component 4 can be separated from the bottom surface of the recess 2. When the electronic component storage package in which the electronic component storage package is stored in the recess 2 is immersed in a cleaning solution or the like, the cleaning solution can be easily circulated in a region where the lower surface of the electronic component 4 and the bottom surface of the recess 2 are separated from each other. The storage package can be cleaned well.

  For example, such a support portion 7 is formed by laminating a ceramic green sheet for the support portion 7 on a ceramic green sheet for the bottom surface of the recess 2 in a region to be the support portion 7, and then a ceramic green sheet for the insulating substrate 1. At the same time, it can be formed by baking at a high temperature. For example, a method of laminating the ceramic green sheet for the support portion 7 formed in a predetermined shape on the ceramic green sheet for the bottom surface of the recess 2 or the same penetration as the through hole for the recess 2 leaving the region to be the support portion 7 What is necessary is just to use the method of laminating | stacking the ceramic green sheet for the support parts 7 in which the hole was formed between the ceramic green sheet which comprises the side surface for the recessed part 2, and the ceramic green sheet for the bottom face of the recessed part 2. Further, using a printing means such as a screen printing method, a ceramic paste containing substantially the same components as the insulating base 1 is printed on the ceramic green sheet for the bottom surface of the recess 2, and the ceramic paste is used for the insulating base 1. You may form by baking with this ceramic green sheet. Such a ceramic paste is prepared by adding an organic binder, an organic solvent and, if necessary, a dispersing agent to the ceramic powder of the main component and mixing and kneading by a kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc. Is done. Further, the support portion 7 is not limited to ceramic paste, and metallized paste may be printed and applied.

  The electronic device of the present invention includes the electronic component storage package as described above and the electronic component 4 received in the recess 2 of the electronic component storage package. Thus, the electronic component 4 is well accommodated in the recess 2, and the electronic device is excellently connected to the electrode 3 and excellent in reliability.

  The electronic component 4 is a chip element such as a capacitor, a resistance element, or an inductor. The electronic component 4 is mounted by electrically connecting the electrode 3 and the electrode of the chip element via a conductive bonding member 5 such as solder. Moreover, the electronic component 4 is sealed as needed. Sealing is performed by covering the electronic component 4 with a sealing resin such as epoxy resin, or a lid made of resin, metal, ceramics, glass or the like placed so as to cover the electronic component 4 is made of glass, resin, brazing. It may be performed by attaching to an insulating substrate with an adhesive such as a material.

  Further, an electronic component different from the electronic component 4 may be accommodated and mounted in the recess 8 formed on the one main surface or the other main surface. Electronic components mounted in the recess 8 are semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal oscillators and piezoelectric vibrators, and various sensors. When the electronic component is a flip chip type semiconductor element, the electrodes and wiring of the semiconductor element are connected via solder bumps, gold bumps, or conductive resin (anisotropic conductive resin, etc.). If the electronic component is a wire-bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc. and then bonded via a bonding wire. This is done by electrically connecting the electrode of the semiconductor element and the wiring conductor 6. When the other electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrodes of the piezoelectric element and the wiring conductor 6 are electrically connected by a conductive resin. And the electronic component accommodated in the recessed part 8 is sealed by the same means as the electronic component accommodated in the recessed part 2 as needed. In addition, another electronic component is not restricted to what is accommodated in the recessed part 8, and may be mounted on one main surface and the other main surface of the insulating base 1.

  The electronic component 4 is preferably electrically connected to the electrode 3 provided on the inner side surface of the recess 2, and at least a part of the lower surface is preferably provided apart from the bottom surface of the recess 2. With this configuration, when the electronic device is immersed in the cleaning liquid, the cleaning liquid easily circulates in a region where the lower surface of the electronic component 4 and the bottom surface of the recess 2 are separated from each other, so that the electronic component 4 and the electronic component storage package can be cleaned well. Therefore, an electronic device having excellent reliability can be obtained.

  Next, another embodiment of the electronic component storage package of the present invention will be described. FIG. 11A is a cross-sectional view showing an embodiment of an electronic component storage package according to the present invention, and FIG. 11B is a recess 2 of the electronic component storage package shown in FIG. FIG. FIG. 12 is an enlarged cross-sectional view of the main part around the recess 2 when the electronic component 4 and the second electronic component 10 are accommodated in the recess 2. In these drawings, 1 is an insulating substrate, 2 is a recess, 3 is an electrode, 4 is an electronic component, 5 is a joining member, 6 is a wiring conductor, 9 is a second electrode, and 10 is a second electronic component. As shown in FIG. 11 and FIG. 12, when the electronic component 4 and the second electronic component 10 are accommodated in the recess 2, the recess 2 is located below the accommodation area of the electronic component 4. You may have ten accommodation areas. That is, the concave portion 2 may be one in which a plurality of electronic components of the electronic component 4 and the second electronic component 10 are accommodated. In the case of FIG. 11 and FIG. Bonded to the electrode 3 formed on the side surface, the second electronic component 10 is bonded to the second electrode 9 formed on the bottom surface of the recess 2. As a result, even if the second electrode 9 in the recess 2 has a variation in the amount of the bonding member 5 or a deviation in the timing of melting of the bonding member 5, the bonding between the electronic component 4 and the electrode 3, If the electronic component 10 and the second electrode 9 are joined at the same time, the electronic component 4 positioned above the second electronic component 10 suppresses the rising of the second electronic component 10 due to the Manhattan phenomenon.

  Further, since the electronic component 4 and the second electronic component 10 are accommodated side by side above and below the recess 2, it is necessary to form a plurality of recesses 2 that accommodate the electronic component 4 and the second electronic component 10, or to have a wider width. In addition, the electronic device can be made small.

  The second electrode 9 is electrically connected to a wiring conductor 6 described later, and is a conductive material for electrically connecting the second electronic component 10 accommodated in the recess 2 to an external electric circuit board or the like. Functions as a road. The second electrode 9 is produced in the same manner as the electrode 3.

  Further, the portions exposed to the recess 2 of the second electrode 9 and the outer surface of the insulating substrate 1 are excellent in corrosion resistance such as nickel (Ni), gold (Au), etc., as in the case of the electrode 3 and the wiring conductor 6 described above. If the metal is deposited, the second electrode 9 can be effectively prevented from being oxidatively corroded, and the bonding between the second electrode 9 and the second electronic component 10 can be strengthened. . Accordingly, the Ni electrode layer having a thickness of about 1 to 10 μm and the gold (Au) plating layer having a thickness of about 0.1 to 3 μm are formed on the portion where the second electrode 9 is exposed on the outer surface of the recess 2 or the insulating substrate 1. It is sequentially deposited by electrolytic plating or electroless plating.

  Further, as shown in FIGS. 13 and 14, it is preferable that a second electrode 9 electrically connected to the second electronic component 10 is provided on the inner side surface of the recess 2. FIG. 13A is a cross-sectional view showing an embodiment of an electronic component storage package according to the present invention, and FIG. 13B is a recess 2 of the electronic component storage package shown in FIG. FIG. FIG. 14 is an enlarged cross-sectional view of the main part around the recess 2 when the electronic component 10 and the second electronic component 10 are accommodated in the recess 2. 13 and 14, the electronic component 4 is joined to the electrode 3 formed on the inner side surface of the recess 2, and the second electronic component 10 is the second electrode 9 formed on the inner side surface of the recess 2. To be joined. With the above configuration, the thickness of the bonding member 5 applied to the electrode 3 and the second electrode 9 affects the direction perpendicular to the side surfaces of the electronic component 4 and the second electronic component 10, and the molten bonding member 5 The force is large in the direction perpendicular to the side surfaces of the electronic component 4 and the second electronic component 10 and is small in the direction perpendicular to the bottom surfaces of the electronic component 4 and the second electronic component 10. Therefore, even if the electrode 3 and the second electrode 9 in the recess 2 have a variation in the amount of the bonding member 5 or a deviation in the timing of melting the bonding member 5, the possibility of the so-called Manhattan phenomenon is reduced. Thus, the electronic component 4 and the second electronic component 10 can be satisfactorily bonded to the electrode 3 and the second electrode 9 in the recess 2.

  As shown in FIGS. 13 and 14, when the second electrode 9 is formed on the inner side surface of the recess 2, the same technique as that used when the electrode 3 is formed on the inner side surface of the recess 2 is used. Can be formed.

  Moreover, it is preferable that the position of the electrode 3 and the 2nd electrode 9 has shifted | deviated in planar view. With the above configuration, the positions of the bonding region between the electrode 3 and the electronic component 4 and the bonding region between the second electrode 9 and the second electronic component 10 are shifted, so the electronic component 4 accommodated in the recess 3 and the second The possibility of an electrical short circuit with the second electronic component 10 can be reduced, and an electronic device with excellent reliability can be formed.

  As a specific example, as shown in FIGS. 15 and 16, a step portion 11 is provided on the inner side surface of the recess 2, and the electrode 3 is provided on the upper side surface of the step portion 11. 9 is preferably provided on the lower side surface of the step portion 11. 15A is an enlarged cross-sectional view of the main part of the electronic component storage package showing a configuration example of the recess 2, and FIG. 15B is an electronic component 4 and a second electronic component in the recess 2. FIG. 4 is an enlarged cross-sectional view of a main part when a component 10 is mounted. 16A is an enlarged cross-sectional view of the main part of the electronic component storage package showing a configuration example of the recess 2, and FIG. 16B is an electronic component 4 and a second electronic component in the recess 2. FIG. 4 is an enlarged cross-sectional view of a main part when a component 10 is mounted. With the above-described configuration, the position of the electrode 4 and the second electronic component 10 is shifted by the step portion 11, the bonding region between the electrode 3 and the electronic component 4, and the bonding between the second electrode 9 and the second electronic component. Therefore, the possibility that the electronic component 4 and the second electronic component 10 are electrically short-circuited can be more reliably reduced, and an electronic device with excellent reliability can be formed. it can. In the present invention, the positions of the electrode 3 and the second electrode 9 are shifted from each other. The second electrode 9 has a portion protruding from a region immediately below the electrode 3, and the electrode 3 is It means having a portion that protrudes from the region directly above the second electrode 9. In this case, as a most preferable example, it is preferable that the second electrode 9 protrudes entirely from the region immediately below the electrode 3.

  Further, as shown in FIG. 16B, when the step portion 11 is formed so as to protrude inward from the bonding region between the electrode 3 and the electronic component 4, the electronic component 4 is mounted on the step portion 11. In addition, the step portion 11 can reduce the possibility that the joining member 5 between the electrode 3 and the electronic component 4 flows out to the second electrode 9 side. The possibility that the electronic component 10 is electrically short-circuited can be more reliably reduced.

  As another specific example, as shown in FIGS. 17 and 18, the recess 2 has a polygonal shape in plan view, and the electrode 3 and the second electrode 9 are respectively formed on side surfaces having different polygonal shapes. It is preferable. 17 (a) is a plan view showing another embodiment of the electronic component storage package of the present invention, and FIG. 17 (b) is an electronic component storage package shown in FIG. 17 (a). It is a principal part enlarged plan view in the periphery (indicated by the dotted line D) of the recess of the package. 18, FIG. 18 (a) is an enlarged cross-sectional view of a main part taken along line EE ′ of the electronic component storage package shown in FIG. 17 (b), and FIG. It is a principal part expanded sectional view in the FF 'line | wire of the electronic component storage package shown by b). In FIGS. 17 and 18, the recess 2 has a rectangular shape, the electrode 3 is formed to face the inner side surface of the recess 2, and the second electrode 9 is an inner side surface orthogonal to the above-described inner side surface. It is formed to face. With the above configuration, the electrode 3 and the second electrode 9 are formed at different positions, the bonding region between the electrode 3 and the electronic component 4, and the bonding region between the second electrode 9 and the second electronic component 10 Therefore, the possibility that the electronic component 4 and the second electronic component 10 are electrically short-circuited can be more reliably reduced, and an electronic device having excellent reliability can be formed.

  In the above description, the recess 2 accommodates two electronic components 4 and 2 in the depth direction of the recess 2, but three or more in the depth direction of the recess 2. The electronic component 4 or the second electronic component 10 may be arranged and accommodated. In this case, an electrode such as the electrode 3 and the second electrode 9 is formed on the inner side surface of the recess 2 in accordance with each electronic component such as the electronic component 4 or the second electronic component 10. You should do it.

  As shown in FIG. 19, two or more second electronic components 10 overlap one electronic component 4 in accordance with the shape and size of the electronic component 4 or the second electronic component 10. Alternatively, two or more electronic components 4 may overlap each other with respect to one second electronic component 10. FIG. 19A is an enlarged plan view of the main part in the periphery of the recess 2 of the electronic component storage package, and FIG. 19B is an essential part when the electronic component 4 is mounted in FIG. FIG. 19C is an enlarged plan view of a main part when the second electronic component 10 is mounted in FIG. 19A. Thereby, an electronic device can be made small by mounting more electronic components.

  The electronic device of the present invention includes the electronic component storage package as described above, and the electronic component 4 and the second electronic component 10 received in the recess 2 of the electronic component storage package. Therefore, the electronic component 4 and the second electronic component 10 are satisfactorily accommodated in the recess 2, and the electrodes of the electronic component 4 and the second electronic component 10 and the electrodes of the electronic component storage package (the electrode 3 and the second electronic component 10). The electrode 9) is well connected to the electronic device with excellent reliability.

  The electronic component 4 and the second electronic component 10 are chip elements such as capacitors, resistance elements, and inductors. When the electronic component 4 and the second electronic component 10 are mounted, the electrode 3 and the electrode of the chip element and the electrode of the second electrode 9 and the chip element are electrically connected via a conductive bonding member 5 such as solder. This is done by connecting to Further, the electronic component 4 and the second electronic component 10 are sealed as necessary. Sealing is performed by covering the electronic component 4 and the second electronic component 10 with a sealing resin such as an epoxy resin, or a resin or metal placed so as to cover the electronic component 4 and the second electronic component 10, What is necessary is just to carry out by attaching the cover body which consists of ceramics, glass, etc. to an insulation base | substrate with adhesive agents, such as glass, resin, and a brazing material.

  Further, as described above, when mounting electronic components such as three or more electronic components 4 or second electronic components 10 in the recess 2, it is limited to two types of electronic components 4 or second electronic components 10. It may not be a thing, but what was accommodated in the recessed part 2 as electronic components, such as a chip element of a different magnitude | size and kind. For example, in the case shown in FIG. 19, the two second electronic components 10 may both be capacitors, or may be capacitors and resistance elements.

  Further, an electronic component different from the electronic component 4 and the second electronic component 10 may be accommodated and mounted in the recess 8 formed on the one main surface or the other main surface. Electronic components mounted in the recess 8 are semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal oscillators and piezoelectric vibrators, and various sensors. When the electronic component is a flip chip type semiconductor element, the electrodes and wiring of the semiconductor element are connected via solder bumps, gold bumps, or conductive resin (anisotropic conductive resin, etc.). If the electronic component is a wire-bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc. and then bonded via a bonding wire. This is done by electrically connecting the electrode of the semiconductor element and the wiring conductor 6. When the other electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrodes of the piezoelectric element and the wiring conductor 6 are electrically connected by a conductive resin. And the electronic component accommodated in the recessed part 8 is sealed by the means similar to the electronic component 4 accommodated in the recessed part 2, and the 2nd electronic component 10 as needed. In addition, another electronic component is not restricted to what is accommodated in the recessed part 8, and may be mounted on one main surface and the other main surface of the insulating base 1.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, when a plurality of electronic components 4 are mounted on an electronic component storage package, a plurality of recesses 2 may be formed on at least one main surface of the insulating base 1 as shown in FIG. In the case where the electronic components 4 are arranged in the same direction, as shown in FIG. 10, a plurality of electrodes 3 are formed on the inner side surface of the recess 2, that is, the plurality of recesses 2 are connected. A plurality of electronic components 4 may be accommodated in 2.

(A) is sectional drawing which shows embodiment of the electronic component storage package of this invention, (b) is a principal part expanded cross section in the periphery of the recessed part of the electronic component storage package shown to (a). FIG. It is a principal part expanded sectional view at the time of mounting an electronic component in the recessed part shown by FIG.1 (b). It is a principal part expanded sectional view of the electronic component storage package which shows the example of the electrode position in a recessed part. It is a principal part expanded sectional view of the electronic component storage package which shows the other example of the electrode position in a recessed part. (A) is a principal part expansion exploded view of the electronic component storage package which shows the structural example of a recessed part, (b) is a principal part expanded sectional view of the electronic component storage package which shows the structural example of a recessed part. It is a principal part expanded sectional view of the electronic component storage package which shows the structural example of the recessed part which provided the support part. It is a principal part expanded sectional view of the electronic component storage package which shows the other structural example of the recessed part which provided the support part. It is a principal part expanded sectional view of the electronic component storage package which shows the other structural example of the recessed part which provided the support part. It is a top view which shows other embodiment of the electronic component storage package of this invention. It is a top view which shows other embodiment of the electronic component storage package of this invention. (A) is sectional drawing which shows embodiment of the electronic component storage package of this invention, (b) is a principal part expanded cross section in the periphery of the recessed part of the electronic component storage package shown to (a). FIG. It is a principal part expanded sectional view at the time of mounting an electronic component and a 2nd electronic component in the recessed part shown by FIG.11 (b). (A) is sectional drawing which shows embodiment of the electronic component storage package of this invention, (b) is a principal part expanded cross section in the periphery of the recessed part of the electronic component storage package shown to (a). FIG. It is a principal part expanded sectional view at the time of mounting an electronic component and a 2nd electronic component in the recessed part shown by FIG.13 (b). (A) is a principal part expanded sectional view of the electronic component storage package which shows the structural example of a recessed part, (b) is a principal part expanded sectional view when an electronic component and a 2nd electronic component are mounted in a recessed part. It is. (A) is a principal part expanded sectional view of the electronic component storage package which shows the structural example of a recessed part, (b) is a principal part expanded sectional view when an electronic component and a 2nd electronic component are mounted in a recessed part. It is. (A) It is a top view which shows other embodiment of the electronic component storage package of this invention, (b) is a principal part expansion plane in the periphery of the recessed part of the electronic component storage package shown by (a). FIG. (A) is the principal part expanded sectional view in the EE 'line of the electronic component storage package shown by FIG.17 (b), (b) is the electronic component shown by FIG.17 (b). It is a principal part expanded sectional view in the FF 'line of the storage package. (A) is the principal part enlarged plan view in the periphery of the recessed part of the package for electronic component accommodation, (b) is a principal part enlarged plan view at the time of mounting an electronic component in (a), (c) These are the principal part enlarged plan views at the time of mounting the 2nd electronic component in (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating base | substrate 1a ... 1st insulating layer 1b ... 2nd insulating layer 2, 8 ... Recess 2a ... Through-hole 3 ... Electrode 4 ... Electronic component 5 ··· Joining member 6 ··· Wiring conductor 7 ··· Supporting portion 9 ··· Second electrode 10 · · · Second electronic component 11 ··· Step portion

Claims (5)

With a recess for accommodating the first and second electronic components on at least one major surface of the insulating substrate, and the first electrode of the first electronic component is electrically connected is provided on the inner side surface of the recess cage, the recess, the under the receiving region of the first electronic component has the accommodating region of the second electronic component, on the inside side surface of the recess, electrical said second electronic component A package for storing electronic parts, wherein a second electrode to be connected is provided. In plan view, the first electrode and the electronic component storing package according to claim 1 Symbol mounting, characterized in that is misaligned with the second electrode. A step portion is provided on the inner side surface of the recess, the first electrode is provided on the upper side surface of the step portion, and the second electrode is provided on the lower side surface of the step portion. 3. The electronic component storage package according to claim 1, wherein the electronic component storage package is provided. 3. The electron according to claim 1, wherein the concave portion has a polygonal shape in plan view, and the first electrode and the second electrode are respectively formed on different side surfaces of the polygonal shape. Parts storage package. An electronic device comprising: the electronic component storage package according to any one of claims 1 to 4 ; and a first electronic component and a second electronic component received in a recess of the electronic component storage package.

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