JP2010056506A - Mounting structure of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic apparatus, which has a high reliability in electric and mechanical connection between the electronic apparatus and an external electric circuit board. <P>SOLUTION: The mounting structure of the electronic apparatus 9 is constituted in such a manner that the electronic apparatus 9 in which an electronic component 2 is stored in a recess 1a provided on one principal surface of an insulating substrate 1 and the recess 1a is closed by a cover 3 is mounted on an external electric circuit board 10 by electrical and mechanical connection. In the mounting structure, a wiring conductor 4 electrically connected to the electronic component 2 is formed on the insulating substrate 1 from the inside of the recess 1a to an outer surface different from the one principal surface of the insulating substrate 1, and the cover 3 faces the external electric circuit board 10 and is mechanically connected to the board through a bonding material 5, and a portion of the wiring conductor 4, which is formed on the outer surface of the insulating substrate 1, is electrically connected to the external electric circuit board 10 through a conductive connection material 6. Since a junction area between the electronic apparatus 9 and the external electric circuit board 10 is relatively wide, the mounting structure has a high reliability in electric and mechanical connection. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic device mounting structure in which an electronic device in which a recess of an insulating base in which an electronic component is accommodated is sealed with a lid is electrically and mechanically connected to an external electric circuit board. It is.

  Electronic parts such as semiconductor elements, piezoelectric elements, and sensor elements are generally housed in recesses of a rectangular parallelepiped insulating base having a recess on one main surface, and a lid bonded to the insulating base so as to close the recess After being sealed with an electronic device, it is mounted on an external electric circuit board. The external electric circuit board is a circuit board constituting electronic equipment such as a dynamic sensor device such as a computer, a mobile phone, a digital camera, or a pressure sensor device.

  In such an electronic device in which an electronic component is sealed in a recess of an insulating substrate, a wiring conductor is conventionally formed from the inner side to the lower surface of the recess disposed on the upper surface as one main surface of the insulating substrate. The external electrical circuit board is electrically and mechanically connected through the wiring conductor and mounted.

In other words, in the conventional electronic device mounting structure, the electronic component is electrically connected to the portion located in the recess of the wiring conductor via the bonding wire or the conductive adhesive, and the portion located on the lower surface of the insulating base is soldered. The electronic component and the external electric circuit board are electrically connected by being joined to a predetermined portion of the external electric circuit board via the. Further, the electronic device is mechanically connected to the external electric circuit board by joining the wiring conductor and the external electric circuit board via the solder.
JP-A-8-148521 JP-A-8-148620

  However, in recent years, instead of conventional tin-lead solder (so-called eutectic solder), tin-silver solder or tin-silver-copper solder is used as a solder for mounting an electronic device on an external electric circuit board. The so-called lead-free solder, such as, has been frequently used. Such lead-free solder has a higher bonding temperature than conventional tin-lead solder and is prone to cracking, so the reliability of the mounting structure for the external electric circuit board of the electronic device should be ensured. However, there was a problem that it was more difficult than before.

  Further, in such a conventional electronic device mounting structure, the bonding area of the wiring conductor to the external electric circuit board tends to be reduced in response to the downsizing of the electronic device, so that reliability can be ensured. It is getting harder.

  The present invention has been devised in view of such conventional problems, and the purpose thereof is, for example, even when the electronic device and the external electric circuit board are joined via lead-free solder. Another object of the present invention is to provide an electronic device mounting structure with high reliability of electrical and mechanical connection between the electronic device and an external electric circuit board.

  According to the electronic device mounting structure of the present invention, an electronic component is housed in a concave portion provided on one main surface of a rectangular parallelepiped insulating base, and the concave portion is sealed by a lid joined to one main surface of the insulating base. An electronic device mounting structure in which the electronic device thus formed is mounted electrically and mechanically connected to an external electric circuit board, and is different from the one main surface of the insulating base on the insulating base from the inside of the recess. A wiring conductor electrically connected to the electronic component is formed over the outer surface, and the lid body is mechanically connected to the external electric circuit board via a bonding material, and the wiring conductor A portion formed on an outer surface different from the one main surface of the insulating base is electrically connected to the external electric circuit board through a conductive connecting material.

  In the electronic device mounting structure of the present invention, in the above configuration, the wiring conductor is formed on an outer peripheral portion of the other main surface opposite to the one main surface of the insulating base, and the wiring conductor is connected to the external electric circuit. It is electrically connected to the substrate through a conductive connection line.

  In the electronic device mounting structure of the present invention, in the above configuration, the surface of the lid body mechanically connected to the external electric circuit board is buried with the bonding material from the center to the outer periphery. A groove is provided.

  Further, in the electronic device mounting structure of the present invention, in the above configuration, a side recess is formed on a side surface of the insulating base, and the side surface where the side recess is formed is partly together with the conductive connection line. The inner surface of the side recess is covered with a resin material applied.

  According to the mounting structure of the electronic device of the present invention, the electronic component is accommodated in the concave portion provided on the one main surface of the rectangular parallelepiped insulating base, and the concave portion is sealed by the lid joined to the one main surface of the insulating base. For the electronic device thus formed, since the lid is mechanically connected to the external electric circuit board via a bonding material, a conventional mounting structure in which a part of the wiring conductor is bonded to the external electric circuit board Compared to the above, it is easy to ensure a wide bonding area between the electronic device and the external electric circuit board. Therefore, the reliability of the mechanical connection between the electronic device and the external electric circuit board can be increased.

  In addition, since the portion of the wiring conductor formed on the outer surface different from the one main surface of the insulating base is electrically connected to the external electric circuit board via the conductive connecting material, the electronic device and the external electric circuit It is also easy to ensure the reliability of electrical connection with the substrate.

  Therefore, according to the mounting structure of the electronic device of the present invention, for example, even when the lid of the electronic device and the external electric circuit board are joined via a joining material made of lead-free solder, It is possible to provide a mounting structure for an electronic device with high reliability of electrical and mechanical connection between the circuit board and the external electric circuit board.

  In the electronic device mounting structure of the present invention, a wiring conductor is formed on the outer peripheral portion of the other main surface opposite to the one main surface of the insulating base, and the wiring conductor is connected to the external electric circuit board and the conductive connection line. When the electronic device is mechanically connected to the external electric circuit board, the electrical connection between the wiring conductor and the conductive connection line is made, for example, for connection of a bonding device or the like. Since it can be performed easily and reliably using equipment, a mounting structure that is easier to manufacture can be obtained.

  Also, in the electronic device mounting structure of the present invention, the surface of the lid that is mechanically connected to face the external electric circuit board is provided with a groove filled with a bonding material from the center to the outer periphery. In this case, the air interposed between the lid and the external electric circuit board can be discharged from the groove to the outside during the bonding with the bonding material. Further, it is effectively prevented that the groove is filled with the bonding material and air remains in the groove. Therefore, it is possible to more effectively prevent the mechanical connection strength from being deteriorated due to air remaining in the bonding material between the lid and the external electric circuit board.

  Further, in the electronic device mounting structure of the present invention, the side surface recess is formed on the side surface of the insulating base, and the side surface where the side surface recess is formed is connected to the inner surface of the side surface recess together with the conductive connection line. When covered with a material, the conductive connecting wire can be prevented from being exposed to the air. In addition, since this resin material adheres to the inner surface of the side recess formed on the side surface of the insulating substrate, the bonding area between the resin material and the insulating substrate is increased to increase the bonding strength of the resin material to the insulating substrate. Can be effectively increased. Therefore, the mounting structure of the electronic device has a high reliability of covering with the resin material of the conductive connection line and higher reliability of the electrical connection between the wiring conductor and the external electric circuit board via the conductive connection line. be able to.

  A mounting structure of an electronic device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a sectional view showing an example of an embodiment of a mounting structure for an electronic device according to the present invention. In FIG. 1, 1 is an insulating substrate, 1a is a recess, 2 is an electronic component, 3 is a lid, 4 is a wiring conductor, and 10 is an external electric circuit board. The electronic component 2 is accommodated in a recess 1a provided on the lower surface, which is one main surface of the insulating substrate 1, and the recess 1a is sealed with a lid 3 bonded to one main surface of the insulating substrate 1, so that the electronic device 9 is provided. It is configured. The electronic device 9 is mechanically connected to the external electric circuit board 10 and the lid 3 is opposed to the external electric circuit board 10 via the bonding material 5, and one of the insulating bases 1 of the wiring conductor 4. The portion formed on the outer surface different from the main surface (the upper surface which is the other main surface in the example shown in FIG. 1) is mounted by being electrically connected via the conductive connecting material 6, and the mounting structure of the electronic device 9 is It is configured.

  The insulating base 1 is made of an insulating material such as a ceramic material such as an aluminum oxide sintered body, a glass ceramic sintered body, a mullite sintered body, or an aluminum nitride sintered body, or a resin material such as an epoxy resin or a polyimide resin. Consists of.

  The insulating base 1 has a recess 1a for accommodating the electronic component 2 on one main surface (usually the lower surface). The electronic component 2 is, for example, a sensor element such as a semiconductor integrated circuit element, a piezoelectric element, or a pressure sensor element, a capacitive element, a resistor, or the like. These electronic components 2 generally have a rectangular parallelepiped shape (square plate shape). In order to accommodate such electronic components 2 efficiently, the concave portion 1a has a rectangular shape in plan view, and the insulating base 1 has a rectangular parallelepiped shape. . The electronic component 2 is bonded to the bottom surface of the recess 1a via, for example, a resin adhesive or a brazing material (not shown) and fixed in the recess 1a, and a wiring conductor using an electrical connection means such as a bonding wire. 4 is connected to a portion formed in the recess 1a.

  If the insulating substrate 1 having such a recess 1a is made of, for example, an aluminum oxide sintered body, a raw material powder such as alumina is formed into a sheet shape together with an organic solvent and a binder to form a plurality of ceramic green sheets. Next, a part of these ceramic green sheets is appropriately punched and formed into a frame shape. Then, the frame-shaped ceramic green sheet is formed on a flat ceramic green sheet that has not been punched. Are finally fired at a predetermined temperature of about 1300 to 1600 ° C.

  The insulating base 1 is manufactured by separately manufacturing a square plate-like substrate portion and a square frame-like frame portion, and then bonding the frame portion to the main surface of the substrate portion using a resin adhesive, glass, or the like. It can also be produced by other methods.

  The concave portion 1 a in which the electronic component 2 is accommodated is closed by a lid 3 joined to one main surface of the insulating base 1, and a container composed of the lid 3 and the concave portion 1 a of the insulating base 1 ( The electronic component 2 is hermetically sealed inside (no symbol).

  The lid 3 is formed of a metal material such as an iron-nickel-cobalt alloy, iron-nickel alloy, or copper, and if it is made of an iron-nickel-cobalt alloy, the cover 3 is punched into a plate material of the alloy material. It can be manufactured by performing processing such as etching or etching into a predetermined shape and size.

  The lid 3 can be joined to the insulating substrate 1 by joining them together by a joining method such as joining or welding via a joining material (no symbol) such as a brazing material, an adhesive, or glass. For example, a frame-shaped metal layer (not shown) is attached to one main surface of the insulating base 1 so as to surround the concave portion 1a, and the concave portion 1a on the one main surface of the insulating base 1 is interposed through this metal layer. The lid 3 is joined to the periphery by a welding method such as seam welding (so-called direct seam method), whereby the lid 3 is joined to the insulating substrate 1 and the recess 1a is sealed. it can. Such a metal layer is made of, for example, a metal material such as tungsten, molybdenum, copper, nickel, or gold, and is applied to one main surface of the insulating substrate 1 by means of a metallizing method or a plating method. Further, a metal frame material (not shown) made of a metal such as iron-nickel-cobalt alloy is joined to the surface of the metal layer via a brazing material (not shown) such as silver brazing. You may make it weld the cover body 3 to a metal frame material.

  The wiring conductor 4 is formed on the insulating substrate 1 from the inside of the recess 1a to the outer surface different from the one main surface, and electrically connects the electronic component 2 sealed in the recess 1a to the external electric circuit board 10. It functions as a conductive path. In the example shown in FIG. 1, in order to make the drawing easier to see, the portion of the wiring conductor 4 that passes through the inside of the insulating base 1 is omitted, and the wiring conductor 4 is formed on the inside and the outer surface of the recess 1 a of the insulating base 1. Only the parts that are present are shown. A portion of the wiring conductor 4 that passes through the inside of the insulating base 1 is formed in an interlayer of an insulating layer (not shown) formed by firing a ceramic green sheet or in a through hole that penetrates the insulating layer in the thickness direction. ing. The through hole can be formed, for example, by subjecting a ceramic green sheet to be the insulating base 1 to mechanical punching.

  The wiring conductor 4 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum, and is attached to the insulating substrate 1 in the form of a metallized layer, a plating layer, a vapor deposition layer, or the like. .

  If the wiring conductor 4 is made of, for example, a tungsten metallized layer, a metal paste prepared by kneading tungsten powder together with an organic solvent and a binder is used for the surface of the ceramic green sheet to be the insulating substrate 1 and the above-described through-holes. It can be formed by printing in the inside by a printing method such as a screen printing method.

  The electrical connection between the electronic component 2 and the wiring conductor 4 is performed by connecting an electrode (not shown) of the electronic component 2 and the wiring conductor 4 via a connecting material having conductivity such as a bonding wire or a conductive adhesive. Is done by connecting. In the example shown in FIG. 1, an electrode provided on the outer peripheral portion of the main surface of the electronic component 2 is connected to a portion formed in the recess 1a of the wiring conductor 4 via a bonding wire (not indicated).

  The electronic device 9 having the above-described configuration is mounted by being electrically and mechanically connected to the external electrical circuit board 10, thereby configuring the mounting structure of the electronic device 9.

  In the mounting structure of the electronic device 9 according to the present invention, the lid 3 is mechanically connected to the external electric circuit board 10 through the bonding material 5 and is different from the main surface of the insulating base 1 of the wiring conductor 4. A portion formed on the surface is electrically connected to the external electric circuit board 10 through the conductive connecting material 6.

  According to the mounting structure of the electronic device 9, since the lid 3 is mechanically connected to the external electric circuit board 10 via the bonding material 5, a part of the wiring conductor is connected to the external electric circuit board. Compared to a conventional mounting structure (not shown) bonded to the substrate, it is easy to ensure a large bonding area by the bonding material 5 between the electronic device 9 and the external electric circuit board 10. Therefore, the reliability of the mechanical connection between the electronic device 9 and the external electric circuit board 10 can be increased.

  In addition, the portion of the wiring conductor 4 formed on the outer surface different from the one main surface of the insulating base 1 is electrically connected to the external electric circuit board 10 through the conductive connecting material 6, so that the electronic device It is also easy to ensure the reliability of electrical connection between 9 and the external electric circuit board 10.

  Therefore, according to the mounting structure of the electronic device 9, for example, even when the lid 3 of the electronic device 9 and the external electric circuit board 10 are joined via the joining material 5 made of lead-free solder. In addition, it is possible to provide a mounting structure of the electronic device 9 with high reliability of electrical and mechanical connection between the electronic device 9 and the external electric circuit board 10.

  Note that the lid 3 of the electronic device 9 is bonded to the external electric circuit board 10 by, for example, a lid 3 made of a metal material such as iron-nickel-cobalt alloy on a metal layer formed in advance on the external electric circuit board 10. Is performed through a bonding material 5 made of solder such as tin-silver solder (lead-free solder or the like).

  Bonding (mechanical connection) between the electronic device 9 and the external electric circuit board 10 via the bonding material 5 is, for example, tin-silver solder as the bonding material 5 between the lid 3 and the external electric circuit board 10. The electronic device 9 can be positioned and placed on the external electric circuit board 10 through the paste, and heated in a reflow furnace or the like while temporarily fixed with a jig or the like.

  For example, the solder paste is applied to the central portion of the lid 3, and after positioning the electronic device 9 with respect to the external electric circuit board 10, the electronic device 9 is pressed against the external electric circuit board 10 side. By applying pressure to the cover 3 and spreading it to the outer peripheral side, the cover 3 and the external electric circuit board 10 can be mechanically connected over a wide area.

  The electrical connection between the wiring conductor 4 and the external electric circuit board 10 is performed by, for example, joining one end of the linear conductive connecting material 6 to the wiring conductor 4 and the other end of the circuit conductor of the external electric circuit board 10. This is performed by bonding to a predetermined conductor portion such as (not shown).

  For example, the electronic device 9 is mounted on the external electric circuit board 10 by, for example, first placing the electronic device 9 between the lid 3 and the predetermined position (the wiring conductor 4 and the wiring conductor 4) via the bonding material 5. The portion exposed to the outer surface of the electronic device 9 of the wiring conductor 4 after mechanically connecting to the portion where the circuit conductor to be connected is not disposed) is connected to the conductive connecting material 6 (example shown in FIG. 1). Then, it can be performed by electrically connecting to a circuit conductor or the like of the external electric circuit board 10 via a bonding wire.

  In such a mounting structure of the electronic device 9, the wiring conductor 4 is formed on the outer peripheral portion of the other main surface opposite to the one main surface of the insulating base 1, and this wiring conductor 4 is electrically connected to the external electric circuit board 10. In particular, when the material 6 is electrically connected via a conductive connection line 6a such as a bonding wire, the conductive material 4 and the conductive material 4 are electrically conductive with the electronic device 9 mechanically connected to the external electric circuit board 10. Since the electrical connection with the connection line 6a can be easily and reliably performed using a connecting device such as a bonding device, for example, the electronic device 9 can be mounted more easily. it can. As the conductive connection line 6a, a bonding ribbon or the like can be used in addition to the bonding wire.

  As a bonding wire, which is a conductive connection line 6a for electrically connecting the wiring conductor 4 of the electronic device 9 to the external electric circuit board 10, a metal material such as aluminum, gold, copper, or the like, silicon or the like may be used. What processed the material which added the additive into the linear form can be used. For example, when a bonding wire made of an aluminum wire is used, a thin wire having a diameter of about 30 to 50 μm or a so-called thick wire having a diameter of about 100 to 300 μm can be used. Appropriate selection may be made according to

  Moreover, as a bonding ribbon which is the conductive connection line 6a, for example, a width made of aluminum having a width of about 0.5 to 1 mm and a thickness of about 0.1 to 0.2 mm can be used.

  In the mounting structure of the electronic device 9, the electrical connection between the electronic device 9 and the external electric circuit board 10 is, for example, as shown in FIG. Alternatively, the wiring conductor 4 may be formed through the conductive base material 6b made of a metal lead terminal joined to the wiring conductor 4 on the side surface of the insulating base 1. FIG. 2 is a cross-sectional view showing another example of the embodiment of the mounting structure of the electronic device 9 of the present invention. In FIG. 2, the same parts as those in FIG.

  In the case of the example shown in FIG. 2, it is necessary to mount the electronic device 9 on the external electric circuit board 10 after the conductive connecting member 6 b made of the lead terminal is once joined to the wiring conductor 4 on the side surface of the insulating base 1. Therefore, there is a possibility that the number of processes for mounting the electronic device 9 increases accordingly.

  The lead terminal as such a conductive connecting material 6b is made of a metal material such as an iron-nickel alloy, iron-nickel-cobalt alloy, copper, or copper alloy, and a predetermined rolling process or cutting process from such a metal material. It is produced by. The joining of the lead terminal to the wiring conductor 4 can be performed by brazing the lead terminal to the wiring conductor 4 via silver-copper brazing (BAg8 or the like).

  Further, in such a mounting structure of the electronic device 9, for example, as shown in FIG. 3, a surface (without reference numeral) that is mechanically connected to the external electric circuit board 10 of the lid 3 from the center portion is provided. In the case where the groove 3a filled with the bonding material 5 is provided over the outer periphery, air interposed between the lid 3 and the external electric circuit board 10 is released from the groove 3a to the outside when the bonding material 5 is bonded. Can be discharged. Further, since the groove 3a is filled with the bonding material 5, air is effectively prevented from remaining in the groove 3a. Therefore, it is possible to more effectively prevent the mechanical connection strength from being deteriorated due to air remaining in the bonding material 5 between the lid 3 and the external electric circuit board 10. 3A is a bottom view of another example of the embodiment of the mounting structure of the electronic device 9 according to the present invention as viewed from the lid 3 side, and FIG. 3B is a diagram of FIG. It is sectional drawing in the AA line. In FIG. 3, the same parts as those in FIG. 3A and 3B, the electronic component 2, the conductive connecting material 6, the external electric circuit board 10, and the like are not shown. Further, in FIG. 3A, the bonding material 5 is not shown in order to make the groove 3a easy to see.

  When such a groove 3a is filled with the bonding material 5, the bonding area of the bonding material 5 to the lid 3 can be increased according to the shape of the groove 3a. It is effective in improving the strength.

  Since such a groove 3 a is for discharging air to the outside from between the lid 3 and the external electric circuit board 10, the end needs to reach the outer edge of the lid 3. Further, it is desirable that the lid 3 and the external electric circuit board 10 are arranged without unevenness at the bonding interface.

  In order to fill the groove 3a with the bonding material 5 and facilitate the discharge of air to the outside, for example, when the outer dimension of the lid 3 is about 7.5 to 17.5 mm, the bonding material 5 is tin- In the case of using silver solder (paste), a plurality of grooves 3a having a width of about 0.5 to 1.0 mm and a depth of about 0.1 to 0.25 mm are radiated from the central portion of the lid 3 to the outer edge, etc. It only has to be provided side by side.

  Such a groove | channel 3a can be provided by performing processes, such as a mechanical grinding process and an etching process, with respect to the cover body 3, for example.

  Further, the groove 3a can be easily discharged to the outside, and is not limited to the linear shape as shown in FIG. It may be a curved shape, a meandering shape, or the like as shown in FIGS. Moreover, you may provide combining a thing of a different shape and length. 4A and 4B are bottom views showing modifications of the mounting structure of the electronic device 9 shown in FIG. 4, parts similar to those in FIG. 3 are denoted by the same reference numerals.

  The cross section (longitudinal cross section) shape orthogonal to the length direction of the groove 3 a may be any shape that can be easily filled with the bonding material 5. Examples of such a vertical cross-sectional shape include a quadrangular shape, a triangular shape, and a bottom having an arc shape as shown in FIGS. In either case, since the opening of the groove 3a is wide, it is easy to fill the bonding material 5 (paste-like material) into the groove 3a. In this case, it is difficult to fill the groove 3a with the bonding material 5 in such a shape that the inner part is wider than the opening part of the groove 3a. FIGS. 5A to 5C are enlarged cross-sectional views of main parts showing modifications of the mounting structure of the electronic device 9 shown in FIG. 5, parts similar to those in FIGS. 1 and 3 are denoted by the same reference numerals.

  Further, in such a mounting structure of the electronic device 9 of the present invention, for example, as shown in FIGS. 6 and 7, a concave step portion 1 b is provided on the outer peripheral portion of the other main surface of the insulating base 1. The wiring conductor 4 may be formed on the step portion 1b. In this case, since the height of the stepped portion 1b is higher than the other main surface of the insulating base 1 with respect to the conductive connecting member 6, the height can be suppressed, which is effective in reducing the height. . 6 is a cross-sectional view showing another example of the embodiment of the mounting structure of the electronic device 9 of the present invention, and FIG. 7 is a perspective view of the mounting structure of the electronic device 9 shown in FIG. In FIGS. 6 and 7, the same parts as those in FIG.

  Such a stepped portion 1b is, for example, a rectangular shape corresponding to the arrangement of the wiring conductor 4 or the entire outer periphery of the outermost portion of the uppermost layer on the other main surface side of the ceramic green sheet serving as the insulating base 1. It can be provided by forming notches such as a frame shape.

  When a plurality of wiring conductors 4 are formed on the other main surface of the insulating base 1, one stepped portion 1b is formed corresponding to each wiring conductor 4, as shown in FIG. Alternatively, a plurality of wiring conductors 4 may be connected so as to be connected to each other.

  In addition, when a bonding wire (for example, an aluminum thin wire having a diameter of about several tens of μm) is used as the conductive connection material 6, the bonding wire is erroneously used during use of the electronic device 9. For example, as shown in FIG. 8, the bonding wire and the connecting portion between the bonding wire and the wiring conductor 4 and the external electric circuit board 10 are connected to a resin material 7 such as a silicone resin or an epoxy resin. You may make it coat | cover with. FIG. 8 is a cross-sectional view showing another example of the embodiment of the mounting structure of the electronic device 9 of the present invention. In FIG. 8, the same parts as those in FIG.

  In this case, the resin material 7 is coated not only on the conductive connecting wire 6a but also on the side surface of the insulating substrate 1 so that the conductive connecting wire 6a such as a bonding wire is covered with the resin material 7 more. It may be certain. Further, for example, as shown in FIGS. 9A and 9B, a portion of the outer surface of the insulating base 1 to which the side resin material 7 is applied (portion close to the conductive connection line 6a) is provided, for example, on the side surface. Side surface recesses 1c such as grooves reaching both ends may be provided to increase the adhesion area of the resin material 7 to the insulating base 1 to increase the bonding strength. 9A is a perspective view showing another example of the embodiment of the mounting structure of the electronic device 9 of the present invention, and FIG. 9B is a perspective view in which the resin material 7 of FIG. 9A is omitted. FIG. 9, parts similar to those in FIGS. 1 and 8 are denoted by the same reference numerals.

  The side recess 1c provided in the portion to which the resin material 7 on the side surface of the insulating substrate 1 is attached extends along the side surface of the insulating substrate 1 as shown in FIG. 9 in a direction parallel to one main surface. For example, as shown in FIG. 10, a groove extending in a direction intersecting or orthogonal to one main surface along the side surface of the insulating substrate 1, or an opening provided on the side surface of the insulating substrate 1 is circular or square. A hole or the like having a shape may be used. FIG. 10 is a side view showing a modified example of the mounting structure of the electronic device 9 shown in FIG. 9 with the resin material 7 omitted. 10, parts similar to those in FIGS. 1 and 9 are given the same reference numerals.

  As described above, in the mounting structure of the electronic device 9, the side surface recess 1c is formed on the side surface of the insulating base 1, and the side surface where the side surface recess 1c is formed together with the conductive connection line 6a and part of the side surface recess 1c. When covered with the resin material 7 bonded to the inner surface, the conductive connecting wire 6a can be prevented from being exposed to the air. In addition, since the resin material 7 is attached to the inner surface of the side recess 1 c formed on the side surface of the insulating base 1, the bonding area between the resin material 7 and the insulating base 1 is increased to increase the resin material 7. Peeling and the like can be prevented more effectively. Therefore, the reliability of the covering of the conductive connection line 6a with the resin material 7 is high, and the electronic device has a higher reliability of electrical connection between the wiring conductor 4 and the external electric circuit board 10 via the conductive connection line 6a. 9 mounting structures can be obtained.

  The groove (side recess) 1c on the side surface of the insulating base 1 as shown in FIG. 5 has, for example, a part of the ceramic green sheet that becomes the insulating base 1 having a smaller outer dimension than the other ones. It can be formed by laminating and firing so that the outer edge of the ceramic green sheet having a small outer dimension enters inside the outer edge of the other ceramic green sheet.

  Further, the side surface recess 1c on the side surface of the insulating base 1 has a conductive connection at least in a side view among the side surfaces of the insulating base 1 in order to more reliably cover the conductive connecting wire 6a with the resin material 7. It is preferable to form so as to include a portion overlapping with the line 6a (a portion closest to the conductive connection line 6a).

  A rectangular parallelepiped insulating base having a recess on one main surface is made of an aluminum oxide sintered body, and a dummy silicon plate is housed in the recess instead of an electronic component, and then a lid made of an iron-nickel-cobalt alloy. The body was bonded to one main surface of the insulating substrate and sealed to produce a test electronic device.

  The insulating substrate has a size of about 3 × 5.5 mm and a height of about 1 mm when viewed in plan, and a depth of the concave portion of about 0.7 mm. On the other hand, a tungsten frame is formed around the concave portion of the main surface. A metal layer having a thickness of about 15 μm was formed from the metallized layer. The lid body has the same dimensions as the insulating base in plan view and a thickness of about 0.3 mm, and is joined to one main surface of the insulating base by welding to the metal layer by direct seam welding. .

  A wiring conductor made of a tungsten metallization layer was formed from the inside of the recess of the insulating base to the outer peripheral portion of the other main surface opposite to the one main surface. Six wiring conductors were arranged in a square shape with a length of one side of about 0.5 mm, with six on each opposing long side of the other main surface of the insulating base.

  Embodiment of the electronic device mounting structure of the present invention by bonding (mechanically connecting) the electronic device to an external electric circuit substrate (a mobile phone substrate in which an electric circuit made of copper is formed on an FR4 substrate). The connection strength of the electronic device in this mounting structure was measured. The electronic device is joined to the external electric circuit board through a tin-silver solder (Sn-3.5Ag solder) between the lid and the electronic device from the external electric circuit board. The magnitude of the force was measured with a tensile tester.

  In addition, as a comparative example, in the mounting structure of the comparative example in which the wiring conductor formed on the other main surface of the insulating base is joined to the external electric circuit board through the same lead-free solder as described above, the electronic device is manufactured in the same manner. The connection strength of was measured. The number of measurements was 50 in both the examples and comparative examples.

  As a result, the mechanical connection strength of the electronic device was about 750 N in the arithmetic average in the example, whereas it was about 135 N in the comparative example in the comparative example.

  In addition, for the mounting structures of the electronic devices of Examples and Comparative Examples prepared in the same manner as described above, after the temperature cycle test (−40 ° C. to + 80 ° C., 1000 cycles), the wiring conductor of the electronic device and the electric circuit board of the external electric circuit board The electrical connection between the circuits was checked using a continuity tester. The number of inspections was 50 in both the examples and comparative examples (300 wiring conductors each). As a result, in the example, there was no electrical connection failure between the wiring conductor and the electric circuit, whereas in the comparative example, the lead-free solder broke between the four wiring conductors and the electric circuit. And disconnection occurred.

  As described above, according to the electronic device mounting structure of the present invention, it was confirmed that the electrical and mechanical connection strength of the electronic device to the external electric circuit board can be effectively increased.

It is sectional drawing which shows an example of embodiment of the mounting structure of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the mounting structure of the electronic device of this invention. (A) is a bottom view which shows the other example of embodiment of the mounting structure of the electronic device of this invention, (b) is sectional drawing in the AA of (a). (A) And (b) is a bottom view which shows the modification of the mounting structure of the electronic device shown in FIG. 3, respectively. (A)-(c) is the principal part expanded sectional view which shows the modification of the mounting structure of the electronic device shown in FIG. 3, respectively. It is sectional drawing which shows the other example of embodiment of the mounting structure of the electronic device of this invention. It is a perspective view which shows the other example of embodiment of the mounting structure of the electronic device of this invention. It is sectional drawing which shows the other example of embodiment of the mounting structure of the electronic device of this invention. (A) is a perspective view which shows the other example of embodiment of the mounting structure of the electronic device of this invention, (b) is the perspective view which abbreviate | omitted the resin material of (a). It is a side view which shows the modification of the mounting structure of the electronic device shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a .... Recessed part 1b .. Step part 1c .... Side surface recessed part 2 ... Electronic component 3 ... Cover body 3a .... Groove 4 of cover body ... Wiring conductor 5 ... Joining Material 6... Conductive connection material 6 a... Conductive connection wire 6 b as a conductive connection material... Conductive connection material 7 consisting of lead terminals... Resin material 9.
10 ... External electric circuit board

Claims (4)

An electronic device in which an electronic component is accommodated in a concave portion provided on one main surface of a rectangular parallelepiped insulating base and the concave portion is sealed with a lid joined to one main surface of the insulating base is provided as an external electric circuit board. A mounting structure for an electronic device mounted electrically and mechanically connected to the insulating base, and electrically connected to the electronic component from the inner side of the recess to an outer surface different from the one main surface of the insulating base. Connected wiring conductors are formed, the lid body is mechanically connected to the external electric circuit board via a bonding material, and is different from the one main surface of the insulating base of the wiring conductor. A mounting structure of an electronic device, wherein a portion formed on a surface is electrically connected to the external electric circuit board via a conductive connecting material. The wiring conductor is formed on the outer peripheral portion of the other main surface opposite to the one main surface of the insulating base, and the wiring conductor is electrically connected to the external electric circuit board via a conductive connection line. The electronic device mounting structure according to claim 1. The groove filled with the bonding material is provided from a central part to an outer periphery on a surface of the lid body that is mechanically connected to face the external electric circuit board. Electronic device mounting structure. Side surface recesses are formed on the side surfaces of the insulating base, and the side surfaces where the side surface recesses are formed are covered with a resin material that is partly joined to the inner surface of the side surface recesses together with the conductive connection lines. The mounting structure for an electronic device according to claim 2.

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