JP2007266039A - Multi-pattern substrate, and electronic part mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-pattern substrate wherein a frame in an insulating substrate area is prevented from inclining to the concave side, and to provide an electronic component mounting substrate. <P>SOLUTION: The multi-pattern substrate is provided with a plurality of insulation substrate areas 101 arranged on its main surface, a concave 102 to house electronic components 108 formed respectively in the insulation substrate areas 101, frames 104 surrounding the concave 102, and a splitting groove 106 which is formed along the boundary of the insulation substrate area 101 by pressing the frames 104 of each of the insulation substrate areas 101 to the concave 102 side. In addition, shape holding members 109 are provided inside the frames 104 formed in the respective insulation substrate areas 101. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multi-chip substrate in which a plurality of insulating substrate regions are arranged in order to create a large number of electronic component mounting substrates for mounting electronic components such as semiconductor elements and piezoelectric vibrators.

  2. Description of the Related Art Conventionally, an electronic component mounting board for mounting electronic components such as semiconductor elements and piezoelectric vibrators is formed on an insulating substrate in which a plurality of insulating layers made of a ceramic material such as an aluminum oxide sintered body are stacked. A recess is provided for storing components.

  An electronic component is housed in the recess, and the recess is closed with a lid, and the electronic component is hermetically sealed inside a container made of an insulating substrate and a lid, thereby forming an electronic device.

  Such an electronic component mounting substrate has a plurality of insulating substrates, each of which becomes an insulating substrate, for example, as shown in FIG. 2 in order to ensure good productivity and workability when mounting electronic components. The region 201 is produced in the form of a multi-piece substrate in which a region 201 is arranged on a mother substrate (not shown). By dividing the mother substrate along the boundary of the insulating substrate region 201, an individual insulating substrate (an electronic component mounting substrate including the insulating substrate, not shown) is formed.

  2A is a plan view of an essential part showing an example of a conventional multi-chip substrate, and FIG. 2B is a cross-sectional view taken along line Y-Y ′ in FIG.

  In the multiple substrate, a dividing groove 206 is formed along the boundary of the insulating substrate region 201. A bending stress is applied along the dividing groove 206, and the division is performed by causing a fracture.

  A wiring conductor 203 is formed in the wiring substrate region 201 or on an exposed surface, and a cylindrical castellation conductor 205 is formed at the boundary of the insulating substrate region 201 so as to straddle the boundary line. The wiring conductor 203 and the castellation conductor 205 are electrically connected to the electronic component 208 and lead out the electronic component 208 to the outside of the recess 202.

  Each insulating substrate region 201 of the multiple substrate is formed by laminating a plurality of insulating layers such as ceramic layers, and is produced by, for example, a known ceramic green sheet laminating method. That is, a flat ceramic green sheet (not shown) provided with a plurality of insulating substrate regions 201 and a ceramic green sheet (not shown) in which openings (becomes concave portions 202) are formed by punching in each insulating substrate region 201. Are sequentially laminated to form a laminated body (not shown) and fired.

In addition, a cutting edge 207 such as a die or a cutter blade is pressed upward or downward (in a direction entering the inside from the main surface) to the frame-like portion 204 surrounding the concave portion 202 (opening) of the main surface of the laminate. Thus, the dividing groove 206 is formed. As the blade edge 207 enters, the frame portion 204 is pressed and cut open on both sides of the blade edge 207. As a result, the frame portion 204 is pressed toward the concave portion 202 (from the outside to the inside of each insulating substrate region 201 in plan view). Thus, a groove is formed. Here, the blade edge 207 such as a mold or a cutter blade is normally set to a blade angle (blade edge) of about 20 to 50 ° in order to open the upper side of the dividing groove 206 in a V shape while allowing smooth insertion into the laminate. 207, an angle between both side surfaces sandwiching the tip).
JP 2003-51564 A

  However, such a multi-chip substrate has increased the number of insulating layers due to the recent multi-functionalization of electronic devices, which increases the depth of the recesses for mounting electronic components and increases the thickness of the frame-shaped portion. It is getting thicker. In order to easily divide a plurality of substrates having a thick frame-like portion while suppressing defects such as burrs, it is necessary to increase the depth of the dividing groove.

  Then, in order to obtain a small insulating substrate region (insulating substrate) to be an electronic component mounting substrate, a laminated body to be a plurality of substrates is provided with a mold, a cutter blade, or the like along the boundary of the small insulating substrate region. When pressing the blade edge, it is necessary to make the blade edge penetrate deeply in the thickness direction of the laminate, so as the blade edge enters the laminate, the frame portion of the ceramic green sheet is moved to the left and right by the blade thickness. Since the stress that acts to spread out (stress from the outer frame-shaped portion to the inner concave portion) has increased, the frame-shaped portion of the insulating substrate region moves toward the concave portion due to the penetration of the blade edge. The problem of tilting excessively has arisen.

  If the frame-shaped portion is excessively inclined toward the concave portion, the opening area of the concave portion is narrowed in a plan view, and it becomes difficult to accommodate the electronic component in the concave portion, and the mounting ratio of the electronic component may be reduced.

  On the other hand, a means of reducing the blade angle can be considered.

  That is, when the number of insulating layers is increased and the thickness of the frame portion is increased, the thickness of the insulating substrate region is also increased. Therefore, the dividing groove is formed deeply in the mother substrate in which such insulating substrate regions are arranged. In this case, it is desirable to reduce the blade angle in order to press as smoothly as possible. However, when the blade angle is reduced, the width of the dividing groove is narrowed. Therefore, the dividing groove after formation is closed, and both sides of the dividing groove are adhered after the laminate is fired. There was an effect.

  The present invention has been devised in view of such conventional problems, and an object of the present invention is to provide a plurality of substrates and an electronic component mounting substrate in which the frame-shaped portion of the insulating substrate region is prevented from being inclined toward the concave portion. It is to provide.

  The multiple substrate according to the present invention has a plurality of insulating substrate regions arranged on a main surface, a recess for accommodating electronic components formed in each of the insulating substrate regions, and a frame shape surrounding the recess. Each of the insulating substrates, wherein the insulating substrate includes a plurality of portions and a dividing groove formed by pressing a frame-shaped portion of each insulating substrate region toward the concave portion along a boundary of the insulating substrate region. A shape holding member is provided inside the frame-like portion formed in each of the regions.

  In addition, the multiple substrate according to the present invention is preferably characterized in that the shape holding member is a metallized layer.

  Further, in the multi-cavity substrate of the present invention, preferably, the frame-shaped portion is formed with a plurality of the metallized layers, and the metallized layer located on the upper side is compared with the metallized layer located on the lower side, The area is narrowed in a plan view.

  In the multiple substrate according to the present invention, it is preferable that the metallized layer is buried in the frame-shaped portion.

  In the multiple substrate according to the present invention, preferably, a bonding metal layer is formed on an upper surface of the frame-shaped portion, and the metallized layer is separated from the bonding metal layer. It is what.

  The electronic component mounting board according to the present invention is an electronic component mounting structure including an insulating substrate having a concave portion for housing an electronic component and a frame-shaped portion surrounding the concave portion. And a shape holding member.

  Since the multi-cavity substrate of the present invention includes a shape holding member inside the frame-shaped portion formed in each of the insulating substrate regions, the multi-layer substrate serving as the multi-cavity substrate has a boundary between the insulating substrate regions. Accordingly, even if the cutting edge such as a mold or a cutter blade is pressed in the vertical direction, the rigidity of the frame-shaped portion can be increased so as to withstand the stress that the cutting edge excessively pushes the dividing groove left and right. Therefore, it is possible to secure an opening for mounting the electronic component while suppressing the frame-shaped portion of the insulating substrate region from being excessively inclined toward the concave portion due to the penetration of the blade edge.

  Further, in the multiple substrate according to the present invention, preferably, since the shape holding member is a metallized layer, the frame-shaped part is recessed in a plan view by a metallized layer having a larger shrinkage during firing than the ceramic of the frame-shaped part. The contraction of the frame-like portion can be controlled so as to contract toward the side. That is, when the metallized layer contracts more than the frame-shaped portion during firing, stress in the direction toward the concave portion (the direction opposite to closing the dividing groove) can be applied to the frame-shaped portion. Therefore, the risk of adhesion of the split grooves due to the shrinkage of the frame-shaped portion in the direction of closing the split grooves during firing after the split grooves are formed in the laminated body to be the mother substrate can be reduced.

  In the multiple substrate according to the present invention, preferably, a plurality of metallized layers are formed in the frame-shaped portion, and the metallized layer located on the upper side is compared with the metallized layer located on the lower side in plan view. Therefore, the metallization layer that shrinks more than the ceramic part of the frame-like part contracts to the center side of the frame-like part as the lower side of the frame-like part (the part where the interval between the dividing grooves is narrow). Can be held. Therefore, after forming the division grooves in the laminate as the mother substrate, the risk of the division grooves adhering during firing can be further effectively reduced.

  In the multiple substrate according to the present invention, preferably, since the metallized layer is buried inside the frame-shaped portion, the inner peripheral side and the outer peripheral side of the insulating layer forming the frame-shaped portion are exposed. In the region adjacent to each side surface, the insulating layers (ceramic green sheets) can be directly and firmly adhered to each other without using the metallized layer. Therefore, it is possible to provide a multiple wiring substrate capable of manufacturing an insulating substrate excellent in the hermetic sealing performance of the electronic component mounted in the recess by preventing the occurrence of delamination and leakage failure.

  Further, in the multiple substrate according to the present invention, preferably, a metal layer for bonding is formed on the upper surface of the frame-shaped portion, and the metallized layer is separated from the metal layer for bonding. When the lid is welded to the joining metal layer formed on the upper surface by, for example, seam welding, it is possible to prevent the heat during welding from being directly transferred from the joining metal layer to the metallized layer. Therefore, a plurality of electronic component mounting boards that can suppress the rapid conduction of heat to the frame-like part and reduce the risk of cracks in the frame-like part due to thermal shock during welding can be manufactured. A wiring board can be provided.

  Further, the electronic component mounting board of the present invention is an electronic component mounting structure including an insulating substrate having a concave portion that houses the electronic component and a frame-shaped portion that surrounds the concave portion. Since the shape holding member is provided, it is possible to provide an electronic component mounting board that can secure an opening for mounting an electronic component by suppressing the frame-shaped portion from being tilted toward the concave portion.

  The multiple substrate according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1A is a plan view of a main part showing a part of an example of an embodiment of a multi-chip substrate of the present invention, and FIG. 1B is an XX of FIG. It is sectional drawing in a line.

  The multi-chip substrate has a plurality of insulating substrate regions 101 (corresponding to individual insulating substrates) arranged on the main surface, and a recess for accommodating the electronic components 108 formed in each of the insulating substrate regions 101. 102 and a frame-shaped portion 104 surrounding the recess 102, and a dividing groove 106 formed by pressing the frame-shaped portion 104 of each insulating substrate region 101 toward the recess 102 along the boundary of the insulating substrate region 101. I have.

  In the present embodiment, the wiring conductor 103 is formed on the plurality of insulating substrate regions 101, and the castellation conductor 105 is provided on the boundary between the insulating substrate regions 101. The castellation conductor 105 becomes a side conductor (not shown) after the insulating substrate region 101 is divided into pieces. A part of the wiring conductor 103 is exposed on the surface such as the main surface in each wiring board region 101 of the mother board. The wiring conductor 103, together with the castellation conductor 105, functions as a conductive path for electrically connecting the electrode of the electronic component 108 to an external electric circuit. Here, the electronic component 108 is, for example, a piezoelectric vibrator or a semiconductor element.

  Each insulating substrate region 101 constituting the multi-layer wiring board is made of an insulating material, for example, a ceramic such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. It is formed by laminating a plurality of insulating layers (ceramic layers, not shown) made of materials.

  Each insulating substrate region 101 has a concave portion 102 for accommodating the electronic component 108 and a frame-shaped portion 104 surrounding the concave portion 102 in a part of the exposed surface such as the main surface (the upper surface center in this embodiment). . The electronic component 108 is accommodated in the recess 102. The electronic component 108 is attached and fixed to each insulating substrate region 101 by being bonded to the bottom surface of the recess 102 via a bonding material such as brazing material, glass, resin, or the like.

  The plurality of insulating substrate regions 101 arranged are regions that are divided into individual pieces to become insulating substrates (not shown) of the electronic component mounting substrate, and are for supporting the electronic component 108. Functions as a support. Such an insulating substrate region 101 is produced as follows if, for example, each insulating layer is made of an aluminum oxide sintered body.

  First, raw powders such as aluminum oxide, silicon oxide, and calcium oxide are formed into a sheet shape together with an organic solvent, a binder, and the like to obtain a plurality of ceramic green sheets each having a plurality of insulating substrate regions 101. Then, an opening to be a recess 102 is formed in a necessary part of the ceramic green sheet by punching or the like in a portion to be each insulating substrate region 101 so that the ceramic green sheet having the opening is positioned on the surface layer. A plurality of ceramic green sheets are sequentially laminated. And it produces by baking the laminated body of this ceramic green sheet.

  In addition, a division groove 106 is formed along the boundary of each insulating substrate region 101 on the main surface of the mother substrate (the upper surface of the frame-shaped portion 104).

  For example, when each insulating substrate region 101 has a rectangular shape such as a rectangular shape in plan view, the dividing grooves 106 are formed vertically and horizontally (lattice shape or the like) along the boundary of the insulating substrate region 101. In addition, the dividing groove 106 has a substantially V-shaped cross section, and varies depending on the thickness and material of the mother substrate, but the depth is about 0.05 mm to 1.5 mm, and the opening width is 0.01 to. It is about 0.3 mm.

  And after mounting the electronic component 108 on the recessed part 102 of each insulating board | substrate area | region 101, many electronic devices are manufactured intensively simultaneously by dividing a multiple picking board | substrate along the division | segmentation groove | channel 106. FIG. The mounting of the electronic component 108 may be performed after a plurality of substrates are divided into pieces. The dividing groove 106 is a cutting edge such as a die or a cutter blade on the main surface (upper and lower surfaces) of the laminated body along the boundary of the insulating substrate region 101 with respect to the laminated body of ceramic green sheets to be a plurality of insulating substrate regions 101. By pressing 107, it can be formed by means for forming a groove-shaped cut.

  In this case, the boundary between the insulating substrate regions 101 is a border region between the insulating substrate regions 101 and a dummy region such as a frame surrounding the insulating substrate regions 101 outside the array of the insulating substrate regions 101 (see FIG. In addition, the boundary between the insulating substrate region 101 and the dummy region is also included. A plurality of dummy areas are provided to facilitate handling of the wiring board.

  The multiple substrate according to the present invention includes a shape holding member 109 inside a frame-like portion 104 formed in each insulating substrate region 101.

  Due to such a structure, a cutting edge 107 such as a mold or a cutter blade was pressed to the concave portion 102 side (up and down direction) along the boundary of the small insulating substrate 101 region on the laminate as a plurality of substrates. Even so, the rigidity of the frame-shaped portion 104 can be increased so as to withstand the stress that pushes the dividing groove 106 left and right by the thickness of the blade as the blade edge 107 enters the laminated body. Therefore, it is possible to prevent the frame-like portion 104 of the insulating substrate region 101 from being inclined toward the center side (horizontal direction) of the recess 102 due to the intrusion of the blade edge 107 and to secure a predetermined area of the opening portion on which the electronic component 108 is mounted. be able to.

  Here, the shape holding member 109 is formed of a material that has higher rigidity than the ceramic green sheet to be the frame-like portion 104 and is difficult to deform. The shape holding member 109 is formed inside the frame-shaped portion 104 by being disposed in layers between a plurality of insulating layers forming the frame-shaped portion 104. Therefore, it is desirable that the material be capable of co-firing with a ceramic green sheet serving as an insulating layer that forms the frame-like portion 104 (insulating substrate region 101).

  Examples of the material for such a shape-retaining member include a metallized layer (metalized paste), a ceramic layer (ceramic paste) having a higher density than the frame-shaped portion 104, and the like. Examples of the metal material for forming the metallized layer include tungsten, molybdenum, manganese, copper, silver, palladium, gold, and platinum. Further, as the ceramic material for forming the ceramic layer, the same ceramic material as that for forming the insulating substrate region 101 is preferable. In this case, the amount of the binder contained is reduced or the glass transition point of the added binder is lowered to normal temperature. A ceramic layer in which the metallized layer after formation is hard in the vicinity can be used.

  In order to suppress the inclination of the frame-shaped portion 104, it is preferable that the shape holding member 109 is disposed without being significantly unevenly distributed on the entire circumference of the frame-shaped portion 104. For example, if the frame-shaped portion 104 is an annular shape or an elliptical shape in plan view, the shape holding member 109 is preferably formed in a circular shape or an elliptic shape on the entire circumference of the frame-shaped portion 104. Moreover, when the frame-shaped part 104 is a square frame shape by planar view, it is preferable to arrange | position so that it may extend over each full length at each side. In addition, the shape holding member may have an L shape, a U shape, or a U shape that extends in one direction and the other direction intersecting the shape in a plan view. When one side of the frame-shaped part is pressed from the dividing groove side to the concave part side in plan view, if a part of the shape holding member extends in a direction intersecting with one side of the frame-shaped part, the frame Compared to the shape holding member extending only in the direction along one side of the shape portion, the function of holding the shape is increased.

  In the multiple substrate according to the present invention, the shape holding member 109 is preferably composed of a metallized layer.

  Due to such a structure, the frame-shaped portion 104 is contracted so that the frame-shaped portion 104 contracts to the center side in the width direction in a plan view by the metallized layer having a larger shrinkage during firing than the ceramic portion of the frame-shaped portion 104. Can control the shrinkage. In other words, when firing, the metallized layer contracts more than the frame-shaped portion 104, thereby applying a stress in the direction toward the center (the direction opposite to closing the dividing groove 106) to the frame-shaped portion 104. Can do. Therefore, after the division grooves 106 are formed in the laminated body to be the mother substrate, the risk that the division grooves 106 adhere to each other due to the frame-like portion 104 contracting in the direction of closing the division grooves 106 during firing can be reduced. it can.

  As a method for forming the metallized layer to be the shape holding member 109 in the frame-shaped portion 104, for example, a plurality of ceramic green sheets to be the frame-shaped portion 104, through holes (not shown) that are to be caster conductors 105 and concave portions 102 is formed by punching using a mold or the like, and then a metallized layer (metallized paste) that becomes the shape holding member 109 is formed so as to surround the opening that becomes the recess 102, and the plurality of ceramic greens are formed. A plurality of metallized layers can be formed inside the frame-shaped portion 104 by sequentially laminating the sheets on a ceramic green sheet serving as the bottom surface of the recess 102. In addition, the metallized paste used as a metallized layer can be produced, for example, by adding and kneading an organic solvent, a binder or the like to a powder of a metal material such as tungsten. This metallized paste is printed on the ceramic green sheet by a printing means such as a screen printing method using a screen plate (plate surface) provided with a pattern of a predetermined shape holding member 109.

  In this case, the metallized layer is formed in a region around the recess 102 by printing a metallized paste such as tungsten or molybdenum from a printing mask on which a pattern to be the frame-shaped shape holding member 109 is formed. Can do.

  Further, by using a metallized paste that reduces the amount of binder contained or lowers the glass transition point of the binder to be added so that the metallized layer after formation is hardened at around room temperature, a frame before forming the dividing grooves 106 is obtained. The rigidity of the shape portion 104 can be increased more effectively.

  Further, in the multi-chip substrate of the present invention, preferably, a plurality of metallized layers are formed on the frame-shaped portion 104, and the metallized layer located on the upper side is flat compared to the metallized layer located on the lower side. It is formed so as to narrow its area visually. The plurality of metallized layers are formed above and below, for example, between the plurality of insulating layers forming the frame-like portion 104.

  Because of this structure, the lower side of the frame-like portion 104 (the portion where the interval between the dividing grooves 106 is narrower) is closer to the center side of the frame-like portion 104 by the metallized layer that is more contracted than the ceramic portion of the frame-like portion 104. Can be held to contract. Therefore, after forming the dividing groove 106 in the laminated body serving as the mother substrate, it is possible to further effectively reduce the risk that the dividing groove 106 adheres during firing.

  Further, since the metallized layer formed inside the frame-shaped portion 104 has a lower area in plan view than the metallized layer located on the upper side compared to the metallized layer located on the lower side, It is easy to form each metallized layer so that the outer edge portions of the metallized layers positioned do not overlap each other. For example, when the metallized layer having a small area is included inside the metallized layer having a large area in plan view, overlapping of the outer edge portions can be easily avoided. Therefore, there is also an effect of suppressing delamination generated on the laminated surface (boundary surface of the insulating layer located above and below) by suppressing the step when the metallized layers are laminated above and below.

  In order to form the metallized layer having such a structure, in addition to the above-described method for forming the metallized layer, the ceramic green sheet located on the upper side is formed with a metallized layer so that the area is narrowed, and further on the lower side By forming a metallized layer on the ceramic green sheet located in the layer so that the area gradually increases for each layer, the metallized layer located on the upper side has a larger area in plan view than the metallized layer located on the lower side. It can be formed by forming so as to be narrow. The area of the metallized layer is adjusted by, for example, the pattern area of the printing plate used when printing the metallized paste.

  In the multiple substrate according to the present invention, the metallized layer is preferably formed so as to be buried in the frame-shaped portion 104.

  Because of such a structure, the insulating layer forming the frame-like portion 104 is not provided with a metallized layer in the region adjacent to the exposed side surfaces on the inner peripheral side and the outer peripheral side. ) Can be directly and firmly adhered to each other.

  That is, the concave portion 102 that accommodates the electronic component 108 is formed by laminating a plurality of layers of ceramic green sheets, and a metallized layer is formed so as to be exposed on the inner side surface or the outer side surface with respect to the width direction of the frame-like portion 104. Since there is a risk of causing delamination (adhesion failure) due to a difference in porcelain shrinkage between the ceramic layer and the metallized layer, it is formed so as to be buried in the frame portion 104. Accordingly, the ceramic green sheets that are the inner side surface and the outer side surface of the frame-like portion 104 are easily adhered to each other, and a ceramic layer is formed on the inner side surface and the outer side surface with the metallized layer sandwiched in the width direction of the frame-like portion 104. Therefore, delamination can be prevented. When delamination occurs, for example, even if the recess 102 is hermetically sealed with a lid or the like as will be described later, the hermetic sealing in the recess 102 becomes incomplete via the delamination portion. (So-called leak failure) may occur.

  Accordingly, it is possible to provide a multi-wiring substrate that can prevent the occurrence of delamination and leakage failure and can manufacture an insulating substrate that is excellent in hermetic sealing of the electronic component 108 mounted in the recess 102.

  Further, in the multi-chip substrate of the present invention, preferably, the bonding metal layer 110 is formed on the upper surface of the frame-shaped portion 104, and the metallized layer is formed so as to be separated from the bonding metal layer 110. Has been.

  Due to such a structure, when a lid (not shown) is welded to the joining metal layer 110 formed on the upper surface of the insulating substrate, for example, by seam welding, the heat at the time of welding is the joining metal. Propagation from the layer 110 directly to the metallized layer through the metal layer can be prevented. Therefore, it is possible to manufacture an electronic component mounting board capable of suppressing the rapid conduction of heat to the frame-shaped portion 104 and reducing the risk of cracks occurring in the frame-shaped portion 104 due to thermal shock during welding. A plurality of wiring boards can be provided.

  The bonding metal layer 110 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum, and is formed by simultaneous firing with the frame-like portion 104 (insulating substrate region 101). For example, when the bonding metal layer 110 is made of tungsten, a metallized paste prepared by adding an organic solvent, a binder, or the like to tungsten powder is kneaded with the upper surface of the frame-shaped portion 104 of the ceramic green sheet. It can form by printing in the site | part which becomes.

  The lid is for closing the recess 102 and hermetically sealing the electronic component 108. The lid is bonded to the upper surface of the frame-shaped portion 104 via the bonding metal layer 110, and the concave portion 102 is closed with the lid, so that the container constituted by the concave portion 102 of the insulating substrate region 101 and the lid is formed. The electronic component 108 is housed in an airtight manner.

  The lid is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and is formed in a shape such as a flat plate. Depending on the shape and characteristics of the electronic component 108 to be mounted, the electronic component 108 may have a partially bent portion or a bent portion. The lid is formed into a predetermined shape by, for example, subjecting a plate material of iron-nickel-cobalt alloy to cutting, punching, bending, etching, or the like.

  Here, a nickel plating layer of about 1 to 20 μm and a gold plating layer of about 0.1 to 3 μm are deposited on the bonding metal layer 110. This is because when a lid made of metal is joined to the joining metal layer 110 via a brazing material such as nickel, the wettability of the brazing material is ensured, and the joining metal layer 110 changes in the environment of temperature and humidity. This is to prevent corrosion.

  Also, as a method of seam welding the lid to the bonding metal layer 110, the electronic component 108 is connected to the wiring conductor 103 by using an electrical connection means such as solder or bonding wire, and then an iron-nickel-cobalt alloy or the like. And a lid having a brazing material such as silver brazing formed on the back surface is placed on a bonding metal layer 110 or a metal frame (not shown) formed on the top surface of the insulating substrate. A pair of roller electrodes of a seam welder is rolled while contacting the outer peripheral edge, and a large current for welding is passed between the roller electrodes to form a metal frame and lid directly or on the back of the lid A method is employed in which the brazing material thus obtained is melted and seam-welded to the joining metal layer 110.

  In addition, the electronic component mounting board of the present invention is formed, for example, by dividing the plurality of warped substrates of the present invention described above into pieces, and surrounds the recess 102 and the recess 102 for accommodating the electronic component 108. In the electronic component mounting substrate including the insulating substrate having the frame-shaped portion 104, the frame-shaped portion 104 includes a shape holding member 109 therein. The individual electronic component mounting substrate is not particularly shown, and will be described with reference to FIG.

With such a structure, it is possible to secure an opening for mounting the electronic component 108 by suppressing the frame-shaped portion 104 from being inclined to the concave portion 102 side by deformation. Therefore,
It is possible to provide an electronic component mounting board in which the possibility that the mounting rate of the electronic component 108 is lowered when the electronic component 108 is accommodated in the recess 102 is reduced. In order to mount the electronic component 108 on the wiring conductor 103 formed on the bottom surface of the recess 102, for example, using a one-by-one mounter, the electronic accommodated in the transport tray by the mounting suction nozzle The electronic component 108 is mounted at the position where the recess 102 is mounted while adsorbing the component 108 and correcting the position and angle thereof. At this time, if the electronic device is small, the outer peripheral portion of the suction nozzle is not necessarily smaller than the outer peripheral portion of the electronic component 108 (the thickness of the suction nozzle tube is large). Therefore, the risk of contact with the suction nozzle of the mounter can be reduced by preventing the frame-like portion 104 from tilting and making the opening of the insulating substrate wider.

  Such an electronic component mounting substrate can be manufactured, for example, by manufacturing a plurality of substrates as shown in FIG. 1 and then dividing the substrate along the dividing grooves 106. The division is performed by applying a bending stress to the plurality of substrates along the division grooves 106 and breaking the plurality of substrates at a portion along the division grooves 106.

  The multiple substrate and the electronic component mounting board of the present invention are not limited to the above embodiments, and various modifications may be made without departing from the spirit of the present invention. Absent. For example, in this example, the shape holding member 109 formed on the inner side of the frame-like portion 104 has a three-layer structure, but may be formed of an insulating substrate formed of other numbers of layers.

  Alternatively, the recess 102 may be sealed by means other than joining the lid to the frame-like portion 104 via the joining metal layer 110. For example, when the electronic component 108 to be accommodated is an optical semiconductor element having a function of receiving and emitting light, and the lid is formed of glass, the lid is attached to the frame-shaped portion 104 via glass, resin, or the like. It may be directly joined (not via the joining metal layer 110).

(A) is a principal part top view which shows the structure of the multiple picking board | substrate and electronic component mounting board | substrate of this invention, (b) is sectional drawing in X-X 'of Fig.2 (a). (A) is a principal part top view which shows the structure of the conventional multiple picking board | substrate and the board | substrate for electronic component mounting, (b) is sectional drawing in Y-Y 'of Fig.2 (a).

Explanation of symbols

101... Insulated substrate region 102... Recessed portion 103... Wiring conductor 104... Frame-shaped portion 105. 107... Cutting Edge 108... Electronic Component 109... Shape Holding Member 110... Metal Layer for Joining

Claims (6)

A plurality of insulating substrate regions are arranged on the main surface, a recess for accommodating an electronic component formed in each of the insulating substrate regions, a frame-like portion surrounding the recess, and a boundary between the insulating substrate regions And a plurality of divided substrates formed by pressing the frame-shaped portion of each insulating substrate region toward the concave portion,
A plurality of pick-up substrates comprising a shape holding member inside a frame-like portion formed in each of the insulating substrate regions. The multi-piece substrate according to claim 1, wherein the shape holding member is a metallized layer. A plurality of the metallized layers are formed in the frame-shaped portion, and the area of the metallized layer located on the upper side is narrower in plan view than the metallized layer located on the lower side. The multiple-taking substrate according to claim 2. 4. The multi-piece substrate according to claim 2, wherein the metallized layer is buried inside the frame-shaped portion. 5. 5. The bonding metal layer is formed on the upper surface of the frame-shaped portion, and the metallized layer is separated from the bonding metal layer. 6. Multiple substrate capture. An electronic component mounting board comprising a recess for accommodating an electronic component and an insulating substrate having a frame-shaped portion surrounding the recess, wherein the frame-shaped portion includes a shape holding member therein. Component mounting board.

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