JP4854469B2 - Electronic component storage package, electronic device, and electronic device mounted device - Google Patents

Description

  The present invention relates to an electronic component storage package for storing electronic components such as piezoelectric vibrators and semiconductor elements in an insulating base, an electronic device, and an electronic device mounting device.

  2. Description of the Related Art Conventionally, electronic component storage packages have been used to store electronic components such as piezoelectric vibrators such as quartz and semiconductor elements.

  2A is a plan view of a conventional electronic component storage package, FIG. 2B is a bottom view, and FIG. 2C is a cross-sectional view taken along line YY ′ of FIG. Such an electronic component storage package includes a wiring base 201, which is arranged on a flat base 202 and an upper surface of the base 202, and a lid mounting area of the lid 211 on the top. The base portion 202 and the frame-shaped portion 203 form a concave portion 204 that houses an electronic component (semiconductor element 207 or piezoelectric vibrator 208).

  Further, the frame-like portion 203 includes a step portion 205 on at least one side on the concave portion 204 side, and a plurality of electrode pads 206 for connecting electronic components (semiconductor element 207 and piezoelectric vibrator 208) are formed on the upper surface. . Furthermore, a through hole 209 that reaches from the upper surface to the lower surface is formed in the base 202. Such a through hole 209 is used as a discharge port for discharging gas from the recess 204 in order to place the piezoelectric vibrator 208 and the semiconductor element 207 housed in the recess 204 in a vacuum state. Then, after the gas is discharged, the through hole 209 is closed with the filler 212.

For this reason, the through-hole 209 has a diameter of the opening on the lower surface side larger than the diameter of the opening on the upper surface side. Accordingly, the filler 212 that closes the through hole 209 is held in the through hole 209 without entering the recess 204 more than necessary. In the example of the drawing, in the two-layer laminate constituting the base portion 202, the diameter of the upper through hole 209 is made smaller than the diameter of the lower through hole 209, and the positions of the through holes 209 are aligned. One through hole 209 communicating with each other is formed.
JP 2004-120073 A

  However, in the electronic component storage package described above, in order to form a through hole in which the diameter of the opening on the lower surface side of the base portion is larger than the diameter of the opening on the upper surface side of the base portion, a certain amount or more is formed in the base portion. Thickness is necessary. In particular, as described above, in order to make the diameter of the upper through hole smaller than the diameter of the lower through hole, the insulating layer forming the base must have a two-layer structure. Thinning was difficult.

  The present invention has been devised in view of such concerns, and an object thereof is to reduce the thickness of an electronic component storage package having a through hole.

The electronic component storage package of the present invention includes a flat base portion and a frame-like portion disposed on the upper surface of the base portion and having a lid mounting area on the upper portion, and the electronic component is placed by the base portion and the frame-like portion. An electronic component housing package in which a recessed portion to be housed is formed, wherein the frame-shaped portion includes a step portion on at least one side on the recessed portion side, and the base portion is provided on the step portion and the base portion from the upper surface of the step portion. the lower surface a through-hole reaching is formed to, through-hole, rather than the diameter of the opening in the step portion, Ri Oh forms diameter of the aperture is greater in the base, the base, the base portion provided with a groove leading from the opening of the through hole at the lower surface side to the outer peripheral edge of said base portion and said Rukoto.

  In the electronic component storage package according to the present invention, preferably, the opening on the stepped portion side of the through hole is located on an electrode pad formed on an upper surface of the stepped portion.

  In the electronic component storage package according to the present invention, preferably, the through hole also serves as a through conductor, and the through conductor is electrically connected to an external circuit held at a ground potential. .

  The electronic device according to the present invention includes the electronic component storage package described above, the electronic component stored in the recess, a lid mounted in the lid mounting region of the frame-shaped portion, and a filler that closes the through hole. And.

  In the electronic device of the present invention, preferably, the electronic component housed in the recess is a piezoelectric vibrator, and the through hole is formed at a position that does not overlap the piezoelectric vibrator in plan view. It is characterized by.

  In the electronic device of the present invention, it is preferable that the electronic component housed in the recess is a piezoelectric vibrator, and the opening of the through hole in the upper surface of the stepped portion is positioned lower than the upper surface of the piezoelectric vibrator. It is characterized by being.

  An electronic device-equipped device according to the present invention includes the above-described electronic device, an external wiring board having an external circuit connected to the connection terminal of the electronic device, and a brazing material that connects the connection terminal and the external circuit. The brazing material has a lower melting point than the filler that closes the through hole.

  The electronic component storage package according to the present invention has a size of the opening diameter on the lower surface side and the opening diameter on the upper surface side even if the thickness of the base portion is reduced compared to the case where the opening of the through hole is formed on the upper surface of the base portion. A thickness sufficient to make a difference can be secured by the step portions of the base portion and the frame-like portion.

  Moreover, the electronic component storage package of the present invention can reduce the ratio of the area occupied by the plurality of electrode pads and the through holes to the area in the recess of the electronic component storage package.

  In addition, the electronic component storage package of the present invention can be used as a through conductor for connecting the through hole to the ground potential.

  Further, when the connection terminal formed on the lower surface of the electronic component storage package is connected to the external circuit via the brazing material, the gas generated from the brazing material such as molten solder can be released through the groove.

  The electronic device of the present invention can form a through-hole having an opening diameter on the lower surface side larger than the opening diameter on the upper surface side without increasing the thickness of the entire electronic device, and has a small, thin and highly reliable sealing structure. An electronic device can be realized.

  In addition, the electronic device according to the present invention can prevent the filler for closing the through hole from being erroneously attached to the piezoelectric vibrator housed in the recess and causing oscillation failure.

  Furthermore, the electronic device according to the present invention can secure a wide gap above the opening of the through-hole, and can efficiently evacuate the gas in the recess through the gap after the electronic component is stored.

  The electronic device-equipped device of the present invention can prevent the sealing material from being melted due to the heat treatment when the electronic device is connected to the external circuit of the external wiring board, resulting in a poor sealing.

  Next, an electronic component storage package and an electronic device according to the present invention will be described with reference to the accompanying drawings. 1A, 1B, and 1C are a plan view, a bottom view, and an XX in FIG. 1A showing an example of an embodiment of an electronic component storage package and an electronic device according to the present invention. It is sectional drawing in '. FIG. 1C is a cross-sectional perspective view that clearly shows that four insulating layers are stacked to form the electronic component storage package of FIG.

  In the figure, 101 is an insulating substrate, 102 is a base, 103 is a frame-shaped portion, 104 is a recess, 105 is a stepped portion, 106 is an electrode pad, 109 is a through hole, and 110 is a connection terminal. The insulating base 101 mainly includes a base 102 and a frame-like portion 103, an electrode pad 106, a through hole 109, and a connection terminal 110.

  The insulating base 101 is made of a ceramic or a resin such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, and has a side length of about 3 to 20 mm. It has a rectangular parallelepiped shape with a thickness of about 1 to 5 mm.

The insulating base 101 has a recess 104 at the center, and the depth of the recess 104 takes into account the state of arrangement of electronic components (in this example, the semiconductor element 107 and the piezoelectric vibrator 108) to be stored. Thus, the depth is such that the electronic components do not interfere with each other.

  If such an insulating substrate 101 is made of an aluminum oxide sintered body, it is manufactured as follows. First, a suitable organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mud, which is conventionally known as a doctor blade method or calendar roll method. Etc. to form a plurality of ceramic green sheets. Thereafter, the ceramic green sheet is appropriately punched to form and laminate a flat base portion 102 and a square frame portion 103 to obtain a base substrate that is the base of the insulating base 101. Specifically, a frame-like portion 103 formed by punching to form the recess 104 in which the semiconductor element 107 is accommodated is laminated on the upper surface of the flat base portion 102, and further, a piezoelectric element is formed on the upper surface. In order to form the concave portion 104 in which the vibrator 108 is accommodated, the frame-like portion 103 having a larger opening area than the lower frame-like portion 103 is laminated, and the laminated body is fired at a high temperature (about 1600 ° C.). It is produced by this. As described above, the opening of the lower frame-shaped portion and the upper frame-shaped portion is shifted so that the frame-shaped portion 103 includes a stepped portion 105 having at least one step on at least one side on the concave portion 104 side. It becomes.

  A plurality of electrode pads 106 to which the electrodes of the semiconductor element 107 and the piezoelectric vibrator 108 are connected are formed on the upper surface of the concave portion 104 and the upper surface of the stepped portion 105. In the example shown in FIG. 1C, these electrode pads 106 are conductors for electrically connecting the semiconductor element 107 housed in the recess 104 and the piezoelectric vibrator 108 housed above the semiconductor element 107. Functions as a passage.

  In addition, the wiring conductor formed from the inner surface of the recess 104 to the outer surface such as the lower surface and the side surface of the insulating base 101 is electrically connected to the semiconductor element 107 and the piezoelectric vibrator 108 and is led out to be connected to an external electric circuit. It functions as a conductive path for this purpose.

  In this electronic component storage package, the semiconductor element 107 is mounted on the bottom surface of the recess 104, and the piezoelectric vibrator 108 is mounted on the electrode pad 106x formed on the upper surface of the step portion 105x for mounting the piezoelectric vibrator 108. After the lid mounting area 114 formed on the outer peripheral upper surface of the 104 is closed with the lid 111, the inside of the recess 104 is placed in a vacuum state in order to place the semiconductor element 107 and the recess 104 containing the piezoelectric vibrator 108 in a vacuum state. The semiconductor element 107 and the piezoelectric vibrator 108 housed in the recess 104 are hermetically sealed in the recess 104 by discharging the gas through the through hole 109 and closing the through hole 109 with the filler 112. .

  The semiconductor element 107 is, for example, an IC chip or the like having an arithmetic element or a memory. The semiconductor element 107 is generally a flat plate whose outer shape is a substantially square shape, and an electrode (not shown) is formed on the upper surface side. In this case, when an electrode is formed on the upper surface of the semiconductor element 107, for example, a plurality of connection pads formed on the upper surface of the step portion 105y for forming the electrode pad 106y for connection to the semiconductor element 107 by wire bonding or the like. 106.

  In addition to the above-described step portion 105x for mounting the piezoelectric vibrator 108 and the step portion 105y for forming the electrode pad 106y for connection to the semiconductor element 107, step portions may be formed, or all steps The part 106 may be formed with an electrode pad for other purposes.

  The piezoelectric vibrator 108 is, for example, a quartz crystal vibrator or a surface acoustic wave element. The outer shape of the piezoelectric vibrator 108 is usually a rectangular flat plate, and an electrode (not shown) is formed at the end thereof. Yes. Further, in order to vibrate accurately without hindering vibration, the space between the lower surface of the lid body 111 after storage and the lower surface of the piezoelectric vibrator 108 and between the upper surface of the semiconductor element 107 and the lower surface of the piezoelectric vibrator 108 are It is good to mount in the recessed part 104 with a clearance gap of about 20-50 micrometers.

And in such an electronic component storage package of the present invention, as shown in FIG.
The frame-like portion 103 is provided with a step portion 105y for forming an electrode pad 106y for connection to the semiconductor element 107 on at least one side on the concave portion 104 side, and the step portion 105y and the base portion 102 are provided from the upper surface of the step portion 105y. A through hole 109 reaching the lower surface of the base 102 is formed. The through hole 109 is characterized in that the diameter of the opening in the base 102 is larger than the diameter of the opening in the stepped portion 105y.

  With this structure, even if the thickness of the base portion 102 is reduced compared to the case where the opening of the through hole 109 is formed on the upper surface of the base portion 102, that is, the bottom surface of the concave portion 104, the filler 112 that closes the through hole 109 The base 102 and the frame-shaped portion have a thickness sufficient to make a difference between the opening diameter on the lower surface side and the opening diameter on the upper surface side. This can be ensured by the 103 stepped portion 105y. Therefore, it is not necessary to increase the thickness of the base portion 102 in order to form the through hole 109 by forming the base portion 102 with two or more insulating layers as in the prior art.

  Note that the filler 112 can be adjusted to a desired height in the through-hole 109 by variously changing the difference between the opening diameter on the lower surface side and the opening diameter on the upper surface side of the through-hole 109 and the size of the filler 112. Can be held.

  For example, if the diameter of the base portion 102 of the through hole 109 is 150 μm and the diameter of the stepped portion 105 is 100 μm, the filler material 112 is put into the through hole 109 by setting the diameter of the filler material 112 to about 120 to 130 μm. Can be easily inserted and positioned. In this case, in order to insert the filler 112 into the through-hole 109, it may be inserted from the lower surface side of the base 102 using a solder ball mounting machine, a transfer jig, or the like. Further, the through hole 109 may be gradually narrowed from the bottom to the top, or may be narrowed in stages.

  And as the filler 112 used for this invention, the Au-Sn solder type | system | group or Pb-Sn solder type | system | group material etc. which are mentioned later are used suitably, for example.

  In the electronic component housing package of the present invention, preferably, the opening on the stepped portion 105 side of the through hole 109 is located on the electrode pad 106 formed on the upper surface of the stepped portion 105.

  With this structure, the ratio of the area occupied by the plurality of electrode pads 106 and the through holes 109 to the area in the recess 104 of the electronic component storage package can be reduced. As such a structure, for example, as shown in FIG. 1A, a plurality of electrode pads 106 for connecting the electrodes of the semiconductor element 107 to the upper surface of the stepped portion 105 formed on one side of the concave portion 104 are provided. One of the electrode pads 106y (in this example, the electrode pad 106y for connecting the semiconductor element 107 having the largest area in the upper right) may be formed so that the through hole 109 is exposed. As a result, the electrode pad 106 and the through hole 109 formed on the upper surface of the stepped portion 105 can be formed so as to overlap on the same plane, and the plurality of electrode pads 106 and the through holes with respect to the area in the recess 104 can be formed. The ratio of the area occupied by 109 can be reduced.

  In the electronic component storage package according to the present invention, preferably, the through hole 109 also serves as a through conductor, and the through conductor is electrically connected to an external circuit held at a ground potential. .

  With this structure, the through hole 109 can be used as a through conductor that leads out of the recess 104 to the outside of the insulating base 101. As such a structure, for example, as shown in FIG. 1A, a plurality of electrode pads 106y for connecting the electrodes of the semiconductor element 107 are formed on the upper surface of the step portion 105 formed on one side of the recess 104 side. One of the electrode pads 106 y (in this example, the electrode pad 106 y for connecting the semiconductor element 107 having the largest area in the upper right) is formed so that the through hole 109 is exposed. The inner surface may be covered with a metallized layer so that the electrode pad 106y formed on the upper surface of the stepped portion 105 and the connection terminal 110 formed on the lower surface of the insulating base 101 are electrically connected. . As a result, the connection terminal 110 formed on the lower surface of the insulating base 101 is made conductive as a ground potential from the electrode of the semiconductor element 107 through the electrode pad 106y and the metallized layer formed on the inner surface of the through hole 109. The Further, when the filler 112 is formed of a conductor, the filler 112 can bear one blade of electrical conduction, and the electrical resistance can be reduced.

  In the electronic component storage package of the present invention, preferably, the base portion 102 is provided with a groove 113 communicating from the opening of the through hole 109 on the lower surface side of the base portion 102 to the outer peripheral end of the base portion 102.

  With this structure, when the connection terminal 110 formed on the lower surface of the electronic component is connected to the external circuit via the brazing material, the gas generated from the brazing material such as solder melted by heating can be released through the groove 113. it can. Here, the filler 112 closing the through hole 109 is held deeper than the lower surface of the insulating base 101, and a gap is formed below the through hole 109. The brazing material such as solder is melted by heat treatment in reflow and gas is generated from the flux in the solder, and may accumulate in the gap of the through hole 109. However, the groove 113 extends from the opening of the through hole 109 to the outer peripheral end of the base 102. Since this is formed, this gas can be released to the outside.

  In addition, as a method of forming the groove 113, the groove 113 is formed by passing from the opening of the through hole 109 to the outer peripheral end of the base portion 102 through the insulating layer to be the base portion 102 (in the case of ceramics, before firing). Thus, it can be formed by pressing a convex punch or inserting a cutter blade. The groove 113 only needs to have a width and a depth sufficient to allow gas generated from the solder material such as molten solder to escape. The width is about 30 to 100 μm, and further, the depth is about 20 to 50 μm. Is more preferable. In addition, you may form a groove | channel by laser, a water jet method, etc. after baking.

  Next, the electronic device of the present invention will be described. The electronic device of the present invention is mounted on the electronic component storage package described above, the electronic components (semiconductor element 107 and piezoelectric vibrator 108) stored in the recess 104, and the lid mounting region 114 of the frame-shaped portion 103. A lid 111 and a filler 112 that closes the through hole 109 are provided.

  With this structure, the through hole 109 having an opening diameter on the lower surface side larger than the opening diameter on the upper surface side can be formed without increasing the thickness of the entire electronic device, and it is smaller, thinner and more reliable than conventional products. An electronic device having a structure can be realized. At this time, even if the conductive adhesive for supporting and fixing the piezoelectric vibrator 108 is completely cured and the inside of the recess 104 is not hermetically sealed by the lid 111 and the filler 112, the conductive adhesive is generated from the conductive adhesive. The gas can be discharged to the outside through the through-hole 109 to further ensure the long-term reliability of the electronic device.

  In such an electronic component storage package, a through hole 109 is provided from the upper surface of the stepped portion 105 formed on one side of the concave portion 104 to the back surface of the insulating base 101, and the semiconductor element 107 and the piezoelectric vibrator 108 are formed in the concave portion. It is housed and connected in 104.

  As the brazing material for attaching the lid 111 to the lid mounting area 114 on the upper surface of the recess 104, for example, silver brazing can be used, and a plate body in which the brazing material is integrally formed on the lower surface of the lid 111 is rolled. The clad type brazing material is positioned in the lid mounting area 114, and a large current is applied to the upper surface of the lid 111 by a pair of roller electrodes to perform seam welding, so that the lid 111 is in the lid mounting area. 114 is welded.

  Then, after the lid 111 is mounted, in order to make the inside of the concave portion 104 from the through hole 109 into a vacuum state, the surroundings of the electronic device are placed in a vacuum atmosphere using a vacuum vessel, and the gas in the concave portion 104 from the through hole 109 is placed. Evacuate. Thereafter, the inside of the recess 104 can be sealed in a vacuum by heating and closing the filler 112 in the through hole 109. Here, as the filler 112, for example, a spherical filler 112 made of Au—Sn solder or Pb—Sn solder can be used. The filler 112 is placed in the through hole 109 shown in FIG. 1C, and the through hole 109 is closed using a hermetic vacuum sealing device, a laser device, or the like.

  Then, a metallized layer may be formed on the surface of the through hole 109 so that the filler 112 and the inner surface of the through hole 109 are firmly welded, and a nickel or gold plating layer is deposited like other wiring conductors. It is desirable that When this metallized layer is formed on the entire inner surface in the vertical direction of the through-hole 109, the filler 112 can be filled over the entire area in the vertical direction inside the through-hole 109, and the filler 112 can be electrically or thermally charged. When used as a conduction means, it is possible to reduce electrical resistance and improve heat transfer efficiency.

  Further, the metallized layer may be formed only in the lower region among the upper region and the lower region in the vertical direction of the through hole 109. In this case, since the filler 112 easily stays in the wettable region where the metallized layer is formed, the filler 112 can be prevented from entering the recess 104.

  Furthermore, when the through hole 109 is divided into an upper region, a central region, and a lower region in the vertical direction, a metallized layer may be formed only in the central region. In this case, it is easy to allow the filler 112 to stay in the central region of the through hole 109 and to separate the filler 112 from both the upper and lower openings.

  Alternatively, as shown in FIG. 1C, when a stepped portion having a stepped cross section is formed in the through hole 109, it is desirable to form a metallized layer at a flat portion of the stepped portion of the through hole 109. . Thereby, the filler 112 tends to stay at a flat portion of the staircase portion, and the filler 112 can be prevented from entering the recess 104.

  In the electronic device of the present invention, the electronic component housed in the recess 104 is preferably the piezoelectric vibrator 108, and the through hole 109 is formed at a position that does not overlap the piezoelectric vibrator 108 in plan view. It is characterized by that.

  With this structure, it is possible to prevent the filler 112 for closing the through-hole 109 from erroneously adhering to the piezoelectric vibrator 108 housed in the recess 104 and causing oscillation failure.

  In the electronic device of the present invention, preferably, the electronic component housed in the recess 104 is the piezoelectric vibrator 108, and the opening of the through hole 109 on the upper surface of the stepped portion 105 is lower than the upper surface of the piezoelectric vibrator 108. It is in position.

  With this structure, since a wide gap can be formed around the opening in the recess 104, the gas in the recess 104 can be efficiently evacuated through the gap after the electronic component is stored.

  According to the electronic device-equipped device of the present invention, the electronic device described above, an external wiring board having an external circuit connected to the connection terminal of the electronic device, and a brazing material that connects the connection terminal and the external circuit. The brazing material has a lower melting point than the filler 112 that closes the through hole 109.

  With such a structure, it is possible to prevent the filler 112 closing the through-hole 109 from being remelted and causing a sealing failure due to heat treatment when the electronic device is connected to the external circuit of the external wiring board.

  Specifically, a low melting point Pb—Sn solder system or a conductive adhesive can be used as the brazing material, and an Au—Sn solder system or a high melting point Pb—Sn solder can be used as the filler. It is.

  Then, as a brazing material for connecting the connection terminal and the external circuit, for example, when using a low melting point Pb-Sn solder system in which Sn: Pb is 6: 4, in order to melt the brazing material, By setting the maximum temperature to about 260 ° C. and the keeping time to about 10 to 20 seconds, the solder paste applied to the external circuit is melted and the connection terminal 110 and the external circuit (not shown) are joined. On the other hand, when using, for example, an Au—Sn solder system in which Au: Sn is 8: 2 as the filler 112, the maximum temperature is set to 300 ° C. by a hermetic vacuum sealing device in order to melt the filler 112. The filler 112 is melted in the through hole 109 by being irradiated with a laser using a laser device or the like, and then fixed in the through hole 109.

  In order to prevent sealing failure due to remelting of the filler 112 more reliably, the filler 112 can be prevented from coming into direct contact with the filler 112 by separating the filler 112 from the brazing filler metal. It is possible to prevent the melting point of the filler 112 from being lowered due to mutual diffusion between the solder and the brazing material. This can be achieved by forming a metallized layer only in the central region and the upper region in the vertical direction of the through hole 109 described above.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, A various deformation | transformation is possible. For example, according to the electronic component storage package according to another embodiment of the present invention, the connection terminal 110 formed on the lower surface of the insulating base 101 has a rectangular shape, and four are formed on the long side. Although the electronic component storage package is described, a plurality of connection terminals 110 may be formed by making the shape of the front end of the connection terminal 110 on the lower surface of the insulating base 101 into a semicircular shape.

  Further, although the step portion 105y is provided on the opposite long side in the recess 104 and the through hole 109 is provided in the corner of the recess 104, the opposite long side in the recess 104 and the end of the piezoelectric vibrator 108 are provided. Alternatively, the through hole 109 may be formed near the center of the short side. In this case, by forming one of the connection terminals 110 formed on the lower surface of the insulating base 101 long, the through hole 109 may be formed on the center side of the lower surface of the insulating base 101 in plan view.

  Furthermore, in the example of the above-described embodiment, the groove 113 is formed in a rectangular shape in plan view so as to extend from the opening of the through hole 109 on the lower surface side of the base 102 to the outer peripheral end of the base 102. For example, it may be formed in a trapezoidal shape so as to spread toward the outer peripheral end of the base 102 in plan view so that the gas in the through hole 109 can be discharged more efficiently.

(A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is a bottom view, (c) is sectional sectional drawing in the XX 'line of (a). is there. (A) is a top view which shows an example of embodiment of the conventional electronic component storage package, (b) is a bottom view, (c) is a cross-sectional perspective view in the YY 'line of (a). .

Explanation of symbols

101... Insulating substrate 102... Base 103... Frame-shaped portion 104. Pad 107 Semiconductor element 108 Piezoelectric vibrator 109 Through hole 110 Connection terminal 111 Lid 112 Filler 113... Groove 114... Lid mounting area

Claims (7)

An electronic component comprising a flat base portion and a frame-like portion disposed on the upper surface of the base portion and having a lid mounting area on the upper portion, and a recess for housing the electronic component is formed by the base portion and the frame-like portion. A containment package,
The frame-shaped portion includes a step portion on at least one side on the concave portion side, and the step portion and the base portion are formed with through holes that reach from the upper surface of the step portion to the lower surface of the base portion. groove, than the diameter of the opening in the step portion, Ri Oh forms diameter of the aperture is greater in the base, the base, which leads from the opening of the through hole at the lower surface of the base portion to the outer edge of the base electronic component housing package, wherein Rukoto equipped with.   2. The electronic component storage package according to claim 1, wherein the opening on the side of the step portion of the through hole is located on an electrode pad formed on an upper surface of the step portion.   3. The electronic component storage package according to claim 1, wherein the through hole serves as a through conductor, and the through conductor is electrically connected to an external circuit held at a ground potential. The electronic component storage package according to any one of claims 1 to 3 , an electronic component stored in the recess, a lid mounted in a lid mounting region of the frame-shaped portion, and the through hole being blocked. And an electronic device. The electronic device according to claim 4 , wherein the electronic component housed in the recess is a piezoelectric vibrator, and the through hole is formed at a position that does not overlap the piezoelectric vibrator in a plan view. . The electronic component housed in the recess is a piezoelectric vibrator, and the opening of the through hole on the upper surface of the stepped portion is at a position lower than the upper surface of the piezoelectric vibrator. Item 5. The electronic device according to Item 4 . Comprising an electronic device according to any one of claims 4 to 6, and the external circuit board having an external circuit connected to the connection terminals of the electronic device, and a brazing material connecting the said connection terminal and said external circuit The brazing material has a melting point lower than that of the filler that closes the through hole.

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