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JP2005072421A - Package for housing electronic component and electronic device - Google Patents

Package for housing electronic component and electronic device

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JP2005072421A
JP2005072421A JP2003302419A JP2003302419A JP2005072421A JP 2005072421 A JP2005072421 A JP 2005072421A JP 2003302419 A JP2003302419 A JP 2003302419A JP 2003302419 A JP2003302419 A JP 2003302419A JP 2005072421 A JP2005072421 A JP 2005072421A
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body
frame
metallic
electronic
housing
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Koichi Hirayama
浩一 平山
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Kyocera Corp
京セラ株式会社
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Abstract

PROBLEM TO BE SOLVED: To solve the problem that, when a metallic frame body is brazed to a wiring board composed of a ceramic material, the whole body of a package for housing electronic component warps after being brazed due to the coefficient of thermal expansion of the frame body larger than that of the wiring board and it becomes difficult to attach a lid body to the top surface of the frame body.
SOLUTION: Since the package 7 for housing electronic component is provided with a second metallic frame body 3 joined to the bottom surface of an insulating substrate 1 so that the body 2 may overlap a first metallic frame body 2 in the top view, it can be prevented effectively by the second metallic frame body 3 that the insulating substrate 1 is pulled by the first metallic frame body 2 and warps due to the difference in thermal expansion between the substrate 1 and frame body 2. As a result, the lid body 4 can be joined surely to the top surface of the first metallic frame body 2 provided on the insulating substrate 1 and the airtightness reliability of the package 7 housing an electronic component 8 can be improved. Consequently, the package 7 for housing electronic component which is excellent in airtightness reliability can be obtained.
COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体素子や水晶発振子等の電子部品を収容するための電子部品収納用パッケージに関し、特に内側に電子部品が収納される金属枠体を有し、金属枠体の上面の平坦性が良好で、その上面に蓋体を気密性を良好として接合することが可能な気密封止性に優れた電子部品収納用パッケージに関するものである。 The present invention relates to an electronic component storing package for housing an electronic component such as a semiconductor element or a crystal oscillator, in particular has a metal frame body on which the electronic components are housed inside, the flatness of the upper surface of the metal frame is good, an electronic component storing package and excellent hermeticity possible joining the lid to the upper surface of the air-tightness as well.

従来、半導体集積回路素子等の半導体素子や水晶発振子等の電子部品を収納するための電子部品収納用パッケージは、上面に電子部品の搭載部を有する酸化アルミニウム質焼結体,ムライト質焼結体,窒化アルミニウム質焼結体,ガラスセラミックス焼結体等の電気絶縁材料からなり、上面に電子部品の搭載部が形成された絶縁基板と、鉄−ニッケル−コバルト合金や鉄−ニッケル合金等の金属材料からなり、搭載部を取り囲むようにして絶縁基板の上面に接合された金属枠体と、絶縁基板の上面の搭載部の周囲から外周部にかけて導出された配線導体とを具備した構造である。 Conventionally, an electronic component storing package for housing electronic components such as semiconductor devices and crystal oscillator such as a semiconductor integrated circuit device, an aluminum oxide sintered body having a mounting portion of the electronic component on the upper surface, mullite sintered body, aluminum sintered body nitride, made of an electrically insulating material of the glass ceramic sintered body or the like, and the insulating substrate mounting portion of the electronic component is formed on the upper surface, an iron - nickel - cobalt alloy, iron - such as a nickel alloy a metal material, a metal frame body joined so as to surround the mounting portion on the upper surface of the insulating substrate, is a structure in which and a wiring conductor which is derived to the outer portion from the periphery of the mounting portion of the upper surface of the insulating substrate .

通常、電子部品を搭載部に搭載するとともにろう材,有機樹脂等の接着剤を介して接着固定し、電子部品の電極を配線導体にボンディングワイヤ等を介して電気的に接続することにより電子部品が電子部品収納用パッケージに実装される。 Usually, a brazing material with mounting the electronic component on the mounting portion, the electronic component by using an adhesive such as an organic resin bonded, electrically connected via the electronic components of the bonding electrodes to the wiring conductor wire or the like There is mounted on an electronic component storing package. その後、金属枠体の上面に蓋体をガラス,樹脂,ろう材等から成る封止材を介して取着させ、絶縁基体と金属枠体と蓋体とから成る容器内部に電子部品を気密に収納することによって電子装置となる。 Thereafter, the lid on the upper surface of the metal frame glasses, resins, is attached through a sealing material made of brazing material or the like, the electronic component hermetically container inside made of an insulating substrate and the metal frame and the lid the electronic device by storing.

なお、このような電子部品収納用パッケージの絶縁基板は、例えば、まず複数枚のセラミックグリーンシートを準備し、次に打ち抜き加工を施し、次にこれらのセラミックグリーンシート(以下、単にグリーンシートともいう)を積層するとともに加圧して各グリーンシートを密着させて板状の積層体とし、最後に、この積層体を焼成することにより製作される。 The insulating substrate of the electronic component storing package, for example, by first preparing a plurality of ceramic green sheets, then subjected to a stamping, then these ceramic green sheets (hereinafter, simply referred to as green sheet ) pressurized by close contact with the green sheets with laminating a plate-like laminate, finally, it is manufactured by firing the laminate.

また、絶縁基板と金属枠体との接合は、例えば、絶縁基板の上面のうち金属枠体が接合される部位にろう付け用のメタライズ層を設けておき、このメタライズ層に金属枠体を銀ろう等のろう材を介して、加熱ろう付けすることにより行なわれる。 The joining between the insulating substrate and the metal frame is, for example, leave the metallized layer for the brazing provided at a portion where the metal frame is bonded of the top surface of the insulating substrate, a silver metal frame body to the metallization layer via a brazing material of the brazing or the like, it is performed by attaching heat brazing.
特開2000−277647号公報 JP 2000-277647 JP 特開2002−198451号公報 JP 2002-198451 JP 特開2003−17604号公報 JP 2003-17604 JP

しかしながら、従来の電子部品収納用パッケージは、鉄−ニッケル−コバルト合金等の金属材料からなる金属枠体と、酸化アルミニウム質焼結体等からなる絶縁基板との熱膨張係数の差が大きいため、金属枠体をろう付けする際に、その熱膨張係数の差に起因して大きな熱応力が生じ、この熱応力により金属枠体や電子部品収納用パッケージ全体が、熱膨張係数が大きくかつろう付け時の変形量の大きな金属枠体の側に凹となるような形態で反ってしまい、蓋体を金属枠体の上面に良好に密着させて接合することができないという問題点があった。 However, the conventional electronic component storing package, iron - nickel - for the metal frame body made of a metal material such as cobalt alloy, the difference in thermal expansion coefficient between the insulating substrate made of sintered aluminum oxide or the like is large, when brazing the metal frame, that due to the difference in the thermal expansion coefficients cause a large thermal stress, the whole metal frame and packages for electronic components housed by the thermal stress, thermal expansion coefficient is large Katsuro with It warps in a form such that concave side of the large metal frame deformation amount of time, there is a problem that can not be joined by a lid which is highly adhered to the upper surface of the metal frame. 蓋体を金属枠体に接合する際にロウ材等の封止材が隙間なく濡れ広がらないため、蓋体を金属枠体の上面に隙間なく密着させて接合することが非常に困難となり、半導体素子を気密に収納する容器の気密性が損なわれ、電子装置の信頼性を低下させてしまう。 Since the sealing material of the brazing material or the like when joining the lid to the metal frame is not wet and spread without gaps, it becomes very difficult to joining the lid is brought into close contact without a gap on the upper surface of the metal frame, the semiconductor airtight container for housing the element hermetically is impaired, resulting in lowering the reliability of the electronic device.

特に、近年の電子装置に対する多機能化の要求にともない、電子部品収納用パッケージに多くの半導体素子や水晶発振子等の電子部品を収納するようなことも要求されており、これに対応して搭載部を広くする必要があるため、金属枠体が大型になってきている。 In particular, with the demand for multifunctionality for recent electronic devices, things like housing electronic components such as a number of semiconductor elements and crystal oscillator in the electronic component storing package and be required and, correspondingly it is necessary to widen the mounting portion, the metal frame has become large. そして、金属枠体が大きくなると、金属枠体と電子部品収納用パッケージの熱膨張差に起因する熱応力も大きくなるため、電子部品収納用パッケージの反り等の問題点がより顕著なものとなってきている。 When the metal frame increases, the thermal stress caused by the difference in thermal expansion between the metal frame and the electronic component storing package also increases, problems such warpage of the electronic component storing package becomes more remarkable it has been.

本発明は、上記従来技術の問題点に鑑み完成されたものであり、その目的は、電子部品収納用パッケージを構成する金属枠体の上面が平坦で、蓋体を電子部品収納用パッケージを成す金属枠体に隙間なく確実に接合することができる、気密信頼性に優れた電子部品収納用パッケージを提供することにある。 The present invention has been completed in view of the problems of the prior art, its object is a flat top surface of the metal frame constituting the electronic component storing package, forms an electronic component storing package lid can be reliably joined without gaps in metal frame, it is to provide an electronic component storing package having excellent airtightness reliability.

本発明の電子部品収納用パッケージは、上面に半導体素子の搭載部が形成された絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を取り囲むように接合された第1の金属枠体と、前記絶縁基板の上面の前記搭載部の周囲から外周部にかけて導出された配線導体と、前記絶縁基板の下面に平面視で前記第1の金属枠体と重なるようにして接合された第2の金属枠体とを具備していることを特徴とするものである。 Electronic component storing package of the present invention, the first metal frame, which is joined to surround the insulating substrate mounting portion is formed of a semiconductor element on the upper surface, the mounting portion on the outer peripheral portion of the upper surface of the insulating substrate When the wiring conductor derived to the outer portion from the periphery of the mounting portion of the upper surface of the insulating substrate, a second of said joined so as to overlap with the first metal frame in a plan view on the lower surface of the insulating substrate and it is characterized in that it comprises a metal frame body.

また本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された電子部品と、前記第1の金属枠体の上面に接合された蓋体とを具備していることを特徴とするものである。 The electronic device of the present invention, an electronic component storing package having the above structure, an electronic component electrodes while being mounted is electrically connected to the wiring conductor on the mounting portion, the first metal frame and it is characterized in that it comprises a bonded lid on the top surface.

本発明の電子部品収納用パッケージは、絶縁基板の下面に平面視で第1の金属枠体と重なるようにして第2の金属枠体が接合されていることから、この第2の金属枠体により、絶縁基板の上面側および下面側の両方で同じような大きさ,方向の熱応力を生じさせて相殺することができ、これにより、金属枠体と絶縁基板との熱膨張差により絶縁基板が金属枠体1に引っ張られて反ってしまうことを効果的に防止することができる。 Electronic component storing package of the present invention, since the second metal frame so as to overlap the first metal frame in a plan view on the lower surface of the insulating substrate is joined, the second metal frame , the upper surface side and lower surface side both in a similar size of the insulating substrate, can be canceled out causing the direction of the thermal stress, thereby, the insulating substrate by a thermal expansion difference between the insulating substrate metal frame There it warps is pulled metal frame 1 can be effectively prevented.

その結果、絶縁基板が上面側等の一方向に反ってしまうことが効果的に防止され、絶縁基板上の第1の金属枠体の上面に蓋体を確実に接合することができ、気密封止の信頼性に優れた電子部品収納用パッケージを提供することができる。 As a result, the insulating substrate warps in one direction on the upper surface side or the like can be effectively prevented, it is possible to reliably bond the lid to the upper surface of the first metal frame on the insulating substrate, hermetically it is possible to provide an electronic component storing package having excellent reliability of the seal.

また、本発明の電子装置は、上記構成の電子部品収納用パッケージに電子部品の搭載部に電子部品を搭載するとともに、蓋体を第1の金属枠体の上面に接合することにより構成されることから、気密封止の信頼性に優れたものとなる。 The electronic device of the present invention is constructed by joining together to mount the electronic component on the mounting portion of the electronic component in the electronic component storing package having the above structure, the lid on the upper surface of the first metal frame from it, and excellent reliability of hermetic sealing.

本発明を添付図面に基づき詳細に説明する。 It will be described in detail with reference to the present invention in the accompanying drawings. 図1は、本発明の電子部品収納用パッケージ(以下、パッケージともいう)および電子装置の実施の形態の一例を示す断面図である。 1, an electronic component storing package of the present invention is a cross-sectional view showing an example of an embodiment of (hereinafter, the package also referred) and electronic devices. 図1において、1は絶縁基板、2は第1の金属枠体、3は第2の金属枠体、4は蓋体、5は配線導体である。 In Figure 1, 1 denotes an insulating substrate, two first metal frame, 3 the second metal frame, 4 lid 5 is a wiring conductor. これらの絶縁基板1,第1の金属枠体2,第2の金属枠体3,配線導体5とで半導体集積回路素子等の半導体素子や水晶発振子等の電子部品を収納するパッケージ7が構成される。 These insulating substrate 1, a first metal frame 2, a second metal frame 3, the package 7 for housing electronic components such as semiconductor devices and crystal oscillator such as a semiconductor integrated circuit device with the wiring conductor 5 configuration It is. このパッケージ7に電子部品8を搭載し、蓋体4で気密封止することにより電子装置が形成される。 The package 7 is mounted an electronic component 8, the electronic device is formed by hermetically sealing with a lid member 4.

絶縁基板1は、ガラスセラミックス焼結体,酸化アルミニウム質焼結体,ムライト質焼結体,窒化珪素質焼結体,窒化アルミニウム質焼結体等から成り、上面に電子部品の搭載部6が形成されている。 Insulating substrate 1, a glass ceramic sintered body, an aluminum sintered body oxide, mullite sintered body, siliceous nitride sintered body made of aluminum nitride sintered body and the like, it is mounted portion 6 of the electronic component on the upper surface It is formed. この搭載部6に、電子部品8が搭載され、ろう材,有機樹脂,ガラス等の接着剤を介して接着固定される。 This mounting portion 6 are mounted electronic components 8, a brazing material, an organic resin, are bonded via an adhesive such as glass.

絶縁基板1は、酸化アルミニウム質焼結体,ムライト質焼結体,窒化アルミニウム質焼結体,ガラスセラミックス焼結体等の電気絶縁材料からなり、例えば、ガラスセラミックス焼結体から成る場合であれば、ホウ珪酸ガラス等のガラス粉末と酸化アルミニウム等のセラミック粉末とから成る原料粉末に適当な有機バインダ,溶剤等を添加混合して泥漿物を作り、この泥漿物をドクターブレード法やカレンダーロール法によってグリーンシート(生シート)と成し、これらグリーンシートに適当な打ち抜き加工を施して、これらのグリーンシートを上下に積層するとともに加圧して各グリーンシート間を密着させ、最後に、約900〜1000℃で焼成することにより製作される。 Insulating substrate 1, an aluminum sintered body oxide, mullite sintered body, an aluminum sintered body nitride, made of an electrically insulating material of the glass ceramic sintered body or the like, for example, there if made of a glass ceramic sintered body if, made of glass powder as a raw material powder in a suitable organic binder consisting of a ceramic powder such as aluminum oxide, was added and mixed solvents such as mud 漿物 such borosilicate glass, a doctor blade method or calendar roll method the mud 漿物form a green sheet (green sheet) by, subjected to appropriate punching these green sheets, pressed in close contact between the green sheets while laminating the green sheets vertically, finally, about 900 It is manufactured by firing at 1000 ° C..

絶縁基板1の上面には、搭載部6を取り囲むようにして第1の金属枠体2が接合されている。 On the upper surface of the insulating substrate 1, a first metal frame so as to surround the mounting portion 6 2 is bonded. 第1の金属枠体2は、鉄を主成分とする鉄−ニッケル合金,鉄−ニッケル−コバルト合金等の金属から成り、上面に蓋体4がロウ付け等の手段により取着される。 The first metal frame 2, iron containing iron as a main component - nickel alloy, an iron - nickel - made of a metal such as cobalt alloy, the cover 4 on the upper surface is attached by means of brazing or the like. この第1の金属枠体2は、例えば、絶縁基板1の上面の外周部に予め枠状のメタライズ層を被着しておき、この枠状のメタライズ層に第1の金属枠体2を銀ロウ等のロウ材を介して接合する方法等により絶縁基板1の上面に接合される。 The first metal frame 2, for example, a pre-frame-shaped metallized layer on the outer periphery of the upper surface of the insulating substrate 1 in advance by adhering the silver a first metal frame 2 in the frame-like metallization layer It is joined to the upper surface of the insulating substrate 1 by a method such as bonding via a brazing material such as wax.

絶縁基板1には、搭載部6の周囲(第1の金属枠体2の内側)から外周部にかけて、配線導体5が導出されている。 The insulating substrate 1, to the outer portion from the periphery (first inner metal frame 2) of the mounting portion 6, the wiring conductors 5 is derived. この配線導体5は、電子部品8の電極が接続され、これを外部に導出する導電路として機能し、配線導体5のうち、搭載部6の周囲の部位(第1の金属枠体の内側)には電子部品8の電極がボンディングワイヤ等の導電性接続部材を介して接続され、絶縁基板1の外周部(金属枠体2の外側)に導出された部位は、リード端子や半田等のろう材等を介して外部電気回路基板の回路配線等に電気的,機械的に接続される。 The wiring conductor 5 is connected to the electrode of the electronic component 8, functions as a conductive path for deriving it to the outside, of the wiring conductors 5, sites around the mounting portion 6 (the first inner metal frame) the electrodes of the electronic component 8 is connected through a conductive connecting member such as a bonding wire, a portion derived on the outer peripheral portion of the insulating substrate 1 (outer metal frame 2), the lead terminals and waxes such as solder electrical circuit wiring, etc. of the external electric circuit board through the wood and the like, are mechanically connected.

配線導体5は、銅,銀,金,パラジウム,タングステン,モリブデン,マンガン等の金属材料から成り、例えば、絶縁基板1がガラスセラミックス焼結体から成る場合であれば、銅,銀,パラジウム等が好適に使用される。 Wiring conductors 5 of copper, silver, gold, palladium, tungsten, molybdenum, made of a metal material such as manganese, for example, in the case where the insulating substrate 1 is made of glass ceramic sintered body, copper, silver, palladium and the like It is preferably used. このような配線導体5は、例えば、銅粉末に有機溶媒,バインダを添加してなる金属ペーストを絶縁基板となるグリーンシートの表面にスクリーン印刷法等で所定パターンに印刷塗布することにより形成される。 Such wiring conductor 5, for example, is formed by printing applied to a predetermined pattern the organic solvent on the copper powder, a metal paste obtained by adding a binder to the surface of the green sheets for the insulating substrate by screen printing or the like .

さらに、配線導体5の露出表面には、ニッケルや金等の耐食性に優れワイヤボンディング性やろう材の濡れ性に優れる金属層を、1〜20μmの厚みでめっき法により被着させておくのが良く、この場合、配線導体5の露出した表面の酸化腐蝕を有効に防止することができるとともに、配線導体5に半田等のろう材を強固に接合することができ、また同時にパッケージ7の外部電気回路基板に対するろう材を介しての接合をより一層確実なものとすることができる。 Further, the exposed surface of the wiring conductor 5, a metal layer having excellent wettability of excellent corrosion resistance such as nickel or gold wire bonding property bastard material, that allowed to deposited by a plating method to a thickness of 1~20μm good, in this case, it is possible to effectively prevent oxidation corrosion of the exposed surface of the wiring conductor 5, it can be firmly joined a brazing material such as solder wire conductor 5, and at the same time external electrical package 7 it can be a bond via a brazing material to the circuit board with more reliable ones.

このように、絶縁基板1の搭載部6に電子部品8を搭載するとともに、その電極をボンディングワイヤ等を介して配線導体5に電気的に接続し、その後、第1の金属枠体2の上面に金属製等の蓋体4を接合することにより、絶縁基板1と第1の金属枠体2と蓋体4とからなる容器の内側に電子部品8が気密に収納され、電子装置となる。 Thus, the mounting portion 6 of the insulating substrate 1 with mounting electronic components 8, the electrodes via a bonding wire or the like electrically connected to the wiring conductor 5, then the upper surface of the first metal frame 2 by joining the lid 4 made of metal such as an insulating substrate 1 and the electronic component 8 on the inside of the container made of the first metal frame 2 and the lid 4 which is housed in an airtight, and electronic devices.

蓋体4は、鉄−ニッケル−コバルト合金,鉄−ニッケル合金等の金属材料や、酸化アルミニウム質焼結体等のセラミック材料から成り、例えば、鉄−ニッケル−コバルト合金から成る場合であれば、鉄−ニッケル−コバルト合金のインゴット(塊)に圧延加工や打ち抜き加工等の周知の金属加工を施し、所定の形状および寸法の板状に加工することにより製作される。 The lid member 4, an iron - nickel - cobalt alloy, an iron - or a metal material such as nickel alloy, a ceramic material such as sintered aluminum oxide, for example, iron - in the case made of a cobalt alloy, - nickel iron - nickel - known metalworking rolling and punching or the like ingots cobalt alloy (ingot) alms is fabricated by processing a plate shape having a predetermined shape and size.

第1の金属枠体2の上面への蓋体4の接合は、ろう材,ガラス,有機樹脂等の接合材を介して行なうことができる。 Bonded lid 4 to the upper surface of the first metal frame 2 can be brazing material, glass, via a bonding material such as an organic resin is performed.

本発明のパッケージおよび電子装置は、絶縁基板1の下面に、平面視で第1の金属枠体2と重なるようにして第2の金属枠体3が接合されている。 Package and an electronic apparatus of the present invention, the lower surface of the insulating substrate 1, a second metal frame 3 so as to overlap the first metal frame 2 in a plan view are bonded. この構成により、第2の金属枠体3によって、絶縁基板1の上面側および下面側の両方で同じような大きさ,方向の熱応力を生じさせて相殺することができ、これにより、第1の金属枠体2のみがある場合に第1の金属枠体2と絶縁基板1との熱膨張差により絶縁基板1が第1の金属枠体2に引っ張られて反ってしまうことを効果的に防止することができる。 With this configuration, the second metal frame 3, the upper side and lower side both with similar size of the insulating substrate 1, can be canceled out causing the direction of the thermal stress, thereby, the first the if there is only a metal frame 2 1 of the difference in thermal expansion between the metal frame 2 and the insulating substrate 1 to the insulating substrate 1 is warped by being pulled in a first metal frame 2 effectively it is possible to prevent. その結果、絶縁基板1が上面側等の一方向に反ってしまうことは効果的に防止され、絶縁基板1上の第1の金属枠体2の上面に蓋体4を確実に接合することができ、気密封止の信頼性に優れたパッケージおよび電子装置を提供することができる。 As a result, the insulating substrate 1 is warped in one direction on the upper surface side or the like is effectively prevented, it is possible to reliably bond the lid 4 to the upper surface of the first metal frame 2 on the insulating substrate 1 can, it is possible to provide an excellent package and electronics reliability of hermetic sealing.

第2の金属枠体3は、第1の金属枠体2と同様に、鉄を主成分とする鉄−ニッケル合金,鉄−ニッケル−コバルト合金等の金属から成る。 The second metal frame 3, like the first metal frame 2, an iron containing iron as a main component - nickel alloy, an iron - made of a metal such as cobalt alloy - nickel. この第2の金属枠体3の絶縁基板1に対する接合は、第1の金属枠体2と同様に、絶縁基板1の下面の外周部に予め枠状のメタライズ層を被着しておき、この枠状のメタライズ層に第2の金属枠体3を銀ロウ等のロウ材を介して接合する方法等により絶縁基板1の下面に接合される。 The second bonding to the insulating substrate 1 of the metal frame 3, like the first metal frame 2, a metallization layer previously frame-like on an outer peripheral portion of the lower surface of the insulating substrate 1 in advance by adhering, the the method in which the second metal frame 3 is joined via a brazing material such as silver brazing the frame-shaped metallized layer is bonded to the lower surface of the insulating substrate 1.

第2の金属枠体3は、上記のように第1の金属枠体2と絶縁基板1との間で生じる熱応力を相殺するためには、第1の金属枠体2と同じ材料からなることが好ましい。 The second metal frame 3, in order to offset the thermal stress occurring between the first metal frame 2 and the insulating substrate 1 as described above, consists of a first same material as the metal frame 2 it is preferable.

なお、第2の金属枠体3を、平面視で第1の金属枠体2と重ならせる際、完全に一致している必要はなく、多少部分的にずれていてもよい。 Incidentally, the second metal frame 3, when causing overlap the first metal frame 2 in a plan view, not completely necessary to match, it may be slightly partially displaced. ずれる程度は、平面視で、第2の金属枠体3の幅方向の中心が、第1の金属枠体の幅方向の中心から内側方向または外側方向へ、第1金属枠体2の幅の1/2以内に位置する程度であることが好ましい。 The degree of shift is a plan view, the center in the width direction of the second metal frame 3, from the center in the width direction of the first metal frame inward or outward direction, the first width of the metal frame 2 a is preferably an extent which is located within ½.

また、このようにずれる部分の長さは、第1の金属枠体2および第2の金属枠体3の全周長の1/2以下であることが好ましい。 Further, the length of the so displaced portion is preferably at the first half of the total circumferential length of the frame 2 and the second metal frame 3 below. ずれの生じている部分の長さが、第1の金属枠体2および第2の金属枠体3の全周長の1/2を超えると、絶縁基板1の上面側と下面側とで熱応力に違いが生じ、これに応じて、熱応力の大きな側に絶縁基板1および第1の金属枠体2が反ってしまう。 Heat the length of the portion that occurs in the deviation exceeds a half of the entire periphery length of the first metal frame 2 and the second metal frame 3, the upper surface and the lower surface side of the insulating substrate 1 stresses resulting differences, in response to this, the insulating substrate 1 and the first metal frame 2 on the large side of the thermal stress warps.

また、第1の金属枠体2の高さおよび第2の金属枠体3の高さについては、第2の金属枠体3の高さが第1の金属枠体2の高さよりも低い方がよく、この場合、第2の金属枠体3の強度が第1の金属枠体2よりも大きくなり、第1の金属枠体2、電子部品8および蓋体4の熱膨張係数の差の影響を大きく受けて変形し易い絶縁基板1の上面側の変形を相殺して、絶縁基板1の上下面に加わる応力をバランスさせることができる。 Also, the height of the first height and the second metal frame 3 of the metal frame 2, the height of the second metal frame 3 is lower than the height of the first metal frame 2 C., in this case, the strength of the second metal frame 3 is larger than the first metal frame 2, a first metal frame 2, the difference in thermal expansion coefficient of the electronic component 8 and the lid 4 effect offset the greatly received by the upper surface of the side deformation of easily deformable insulating substrate 1, it is possible to balance the stress applied to the upper and lower surfaces of the insulating substrate 1.

なお、本発明は上述の実施の形態の一例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。 The present invention is not limited to the exemplary embodiment described above, various modifications as long as it does not depart from the gist of the present invention are possible.

本発明の電子部品収納用パッケージの実施の形態の一例を示す断面図である。 Is a sectional view showing an example of an embodiment of an electronic component storing package of the present invention.

符号の説明 DESCRIPTION OF SYMBOLS

1・・・絶縁基板2・・・第1の金属枠体3・・・第2の金属枠体4・・・蓋体5・・・配線導体6・・・搭載部7・・・電子部品収納用パッケージ8・・・電子部品 1 ... insulating substrate 2 ... first the metal frame 3 ... second metal frame 4 ... lid 5 ... conductor 6 ... mounting portion 7 ... electronic component package for storage 8 ... electronic components

Claims (2)

  1. 上面に半導体素子の搭載部が形成された絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を取り囲むように接合された第1の金属枠体と、前記絶縁基板の上面の前記搭載部の周囲から外周部にかけて導出された配線導体と、前記絶縁基板の下面に平面視で前記第1の金属枠体と重なるようにして接合された第2の金属枠体とを具備していることを特徴とする電子部品収納用パッケージ。 An insulating substrate mounted portion is formed of a semiconductor element on an upper surface, a first metal frame body that is joined to surround the mounting portion on the outer peripheral portion of the upper surface of the insulating substrate, the mounting of the upper surface of the insulating substrate and includes a wiring conductor which is derived to the outer portion, and a second metal frame member the joined so as to overlap with the first metal frame in a plan view on the lower surface of the insulating substrate from the surrounding parts electronic component storing package, characterized in that.
  2. 請求項1記載の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された電子部品と、前記第1の金属枠体の上面に接合された蓋体とを具備していることを特徴とする電子装置。 An electronic component storing package according to claim 1, wherein the electronic component electrode is electrically connected to the wiring conductor while being mounted on the mounting portion, the first lid is joined to the upper surface of the metal frame electronic apparatus characterized in that it comprises a body.
JP2003302419A 2003-08-27 2003-08-27 Package for housing electronic component and electronic device Pending JP2005072421A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053261A (en) * 2005-08-18 2007-03-01 Matsushita Electric Ind Co Ltd Package for electronic component and its manufacturing method
CN102064137A (en) * 2010-12-06 2011-05-18 日月光半导体制造股份有限公司 Semiconductor structure with metal frame
WO2012135406A2 (en) 2011-04-01 2012-10-04 Schlumberger Canada Limited High density microelectronics packaging
JP2014107490A (en) * 2012-11-29 2014-06-09 Kyocera Corp Package for storing electronic element and electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053261A (en) * 2005-08-18 2007-03-01 Matsushita Electric Ind Co Ltd Package for electronic component and its manufacturing method
CN102064137A (en) * 2010-12-06 2011-05-18 日月光半导体制造股份有限公司 Semiconductor structure with metal frame
WO2012135406A2 (en) 2011-04-01 2012-10-04 Schlumberger Canada Limited High density microelectronics packaging
WO2012135406A3 (en) * 2011-04-01 2013-04-25 Schlumberger Canada Limited High density microelectronics packaging
EP2695188A2 (en) * 2011-04-01 2014-02-12 Services Petroliers Schlumberger High density microelectronics packaging
EP2695188A4 (en) * 2011-04-01 2014-10-15 Services Pétroliers Schlumberger High density microelectronics packaging
US9431375B2 (en) 2011-04-01 2016-08-30 Schlumberger Technology Corporation High density microelectronics packaging
JP2014107490A (en) * 2012-11-29 2014-06-09 Kyocera Corp Package for storing electronic element and electronic device

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