JP2014049563A - Package for housing electronic component and mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an electronic compound which can be connected stably for such a member as an external printed circuit board, and to provide a mounting structure.SOLUTION: A package 2 for housing an electronic component includes a box type housing 4 having an aperture H opening to the lower surface, a mounting area R of an electronic component 3 arranged on the ceiling surface in the aperture H, and notches C arranged, respectively, at the lower parts of sidewalls facing each other, a ceramic substrate 6 provided in each notch C, and having an outer side face on which a conductive layer 5 for electrically connecting the inside and outside of the housing 4 is formed, and lead terminals 7 connected with the conductive layer 5, and extending from the upper part to the lower part of the ceramic substrate 6, before being bent from lower part of the ceramic substrate 6 toward the outside of the housing 4.

Description

  The present invention relates to an electronic component storage package capable of mounting an electronic component, and a mounting structure on which the electronic component is mounted.

  A structure has been proposed in which the IC chip body is separated from the printed circuit board so that heat is not easily trapped in the IC chip (see, for example, Patent Documents 1 and 2). In these structures, protrusions such as lead pins are provided on the surface mounted on the printed circuit board.

JP 7-307419 A Japanese Utility Model Publication No. 5-67047

  In Patent Documents 1 and 2 described above, since the protrusion is provided on the side in contact with the printed circuit board, it is difficult to stably position and mount on the printed circuit board when mounted on the printed circuit board. There is a risk of being destroyed.

  An object of the present invention is to provide an electronic component storage package and a mounting structure that can be stably connected to a member such as an external printed board.

  An electronic component storage package according to an embodiment of the present invention is a box type, each of an opening portion opened on a lower surface, a mounting region of electronic components disposed on a ceiling surface in the opening portion, and opposing side walls. A casing having a notch disposed at the lower part of the casing and a conductive layer for electrically connecting the inside of the casing and the outside of the casing are formed on each of the notches, respectively. And a lead terminal connected to the conductive layer and extending from an upper part to a lower part of the ceramic base and bent from the lower part of the ceramic base toward the outside of the housing.

  A mounting structure according to an embodiment of the present invention includes the electronic component storage package and an electronic component mounted in the mounting region of the electronic component storage package.

  The present invention can provide an electronic component storage package and a mounting structure that can be stably connected to a member such as an external printed circuit board.

It is the general-view perspective view which showed the lower surface of the mounting structure which concerns on one Embodiment of this invention. It is a disassembled general perspective view which decomposed | disassembled the mounting structure which concerns on one Embodiment of this invention. It is the enlarged view to which the A section of FIG. 2 was expanded. It is the top view which showed the ceiling surface inside the mounting structure which concerns on one Embodiment of this invention. It is the side view which showed the state which connected the mounting structure which concerns on one Embodiment of this invention to the external member. It is the enlarged view to which the B section of FIG. 4 was expanded.

  Hereinafter, an electronic component storage package and a mounting structure according to an embodiment of the present invention will be described with reference to the drawings.

<Configuration of mounting structure>
FIG. 1 is a schematic perspective view of a mounting structure according to an embodiment of the present invention, and shows a lower part of the mounting structure connected to an external member. FIG. 2 is an exploded perspective view of the mounting structure according to the embodiment of the present invention, and shows a state in which the electronic component and the bottom plate are removed from the mounting structure of FIG. FIG. 3 is an enlarged view of a portion A in FIG. 2 and shows a state in which lead terminals are attached to the outer surface of the ceramic substrate. FIG. 4 is a plan view showing the ceiling surface inside the mounting structure according to the embodiment of the present invention, as viewed from the bottom plate side toward the ceiling surface side after removing the bottom plate from the mounting structure. It is. FIG. 5 is a side view of a mounting structure according to an embodiment of the present invention, showing a state where it is connected to an external member. FIG. 6 is an enlarged view of a portion B of FIG. 4 and shows a state in which the outer surface of the ceramic base is viewed from the side.

  The mounting structure 1 includes an electronic component storage package 2 and an electronic component 3 mounted in a mounting region R of the electronic component storage package 2. The electronic component storage package 2 includes, for example, an active element such as a semiconductor element, a transistor, a laser diode, a photodiode, or a thyristor, or a passive element such as a resistor, a capacitor, a solar cell, a piezoelectric element, a crystal oscillator, or a ceramic oscillator. The electronic component 3 is used for mounting. The electronic component 3 is mounted on the ceiling surface in the electronic component storage package 2. The electronic component 3 mounted on an insulating member may be connected to the ceiling surface of the electronic component storage package 2 via a bonding member.

  The electronic component storage package 2 is suitable for mounting and functioning an electronic component 3 corresponding to high withstand voltage, large current, high power, high speed and high frequency. A semiconductor element is mounted. The electronic component storage package 2 has a box shape, and includes an opening H opened on the lower surface, a mounting region R of the electronic component 3 disposed on the ceiling surface in the opening H, and the opposing side walls. A conductive layer 5 provided in each of the casing 4 having the notch portion C disposed in the lower portion and the notch portion C for electrically connecting the inside of the casing 4 and the outside of the casing 4 to the outer surface. And a lead terminal 7 connected to the conductive layer 5 and extending from the upper part to the lower part of the ceramic base 6 and bent from the lower part of the ceramic base 6 toward the outside of the housing 4. It has.

The housing | casing 4 is a box-shaped member, Comprising: The electronic component 3 is mounted in an internal ceiling surface. The housing 4 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The thermal conductivity of the housing 4 is set to, for example, 15 W / (m · K) or more and 450 W / (m · K) or less. The thermal expansion coefficient of the housing 4 is set, for example, to 3 × 10 ⁻⁶ / K or more and 28 × 10 ⁻⁶ / K or less.

  The housing 4 has an opening H formed on the lower surface, and a notch C in which a lower portion of the side wall is cut is formed in each of the opposing portions of the side wall surrounding the opening H. The housing 4 has a rectangular parallelepiped shape, and a recess is formed in a surface corresponding to the lower surface, and the recess becomes an opening H.

The casing 4 is manufactured in a predetermined shape by using a conventionally known metal processing method such as rolling or punching with respect to an ingot obtained by casting and solidifying a molten metal material into a mold. Note that the length of one side of the housing 4 in a plan view is set to, for example, 10 mm or more and 50 mm or less. Moreover, the thickness of the up-down direction of the housing | casing 4 is set to 5 mm or more and 20 mm or less, for example. In addition, the thickness of the up-down direction of the location in which the notch part C of the housing | casing 4 is formed is set to 1 mm or more and 10 mm or less, for example. The size of the opening H is set such that the length of one side in a plan view is, for example, 8 mm or more and 48 mm or less, and the length in the vertical direction is, for example, 3 mm or more and 15 mm or less.

  The notch C is formed on the long side of the rectangular parallelepiped casing 4. Further, the cutout portion C is formed at the central portion of the long side on the long side of the housing 4 in plan view. And it can provide so that the stress which generate | occur | produces in the housing | casing 4 can be adjusted with sufficient balance with respect to the center of the housing | casing 4 when planarly viewed. In addition, although the housing | casing 4 which concerns on this embodiment is a rectangular parallelepiped shape, if the opening part H can be formed, elliptical shape and polygonal shape may be sufficient as planar view. In addition, the cutout portion C of the housing 4 according to the present embodiment is provided on the long side of the rectangular parallelepiped when viewed in plan, but may be provided on the short side of the rectangular parallelepiped when viewed in plan.

  In addition, a metal layer such as nickel or gold is formed on the surface of the housing 4 by using an electroplating method or an electroless plating method in order to prevent oxidative corrosion. The thickness of the metal layer is set to, for example, 0.5 μm or more and 9 μm or less.

  A ceramic base 6 is provided in the notch C. The ceramic substrate 6 is joined to the notch C by a brazing material such as gold tin or silver copper. The ceramic base 6 is provided at the edge of the notch C of the housing 4 and can electrically connect the inside of the housing 4 and the outside of the housing 4. The ceramic base 6 has a rectangular parallelepiped shape, and the conductive layer 5 is formed on the outer surface in a state where the ceramic base 6 is attached to the notch C.

The ceramic substrate 6 is an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic. Made of ceramic material. The thermal expansion coefficient of the ceramic substrate 6 is set to 3 × 10 ⁻⁶ / K or more and 8 × 10 ⁻⁶ / K or less, for example.

  In addition, the ceramic base 6 is provided with a stepped portion 6 a that is notched from the outer surface to the lower surface of the ceramic base 6 in a state of being attached to the notch C. The ceramic base 6 is continuously provided from the upper part to the lower part of the inner surface in a state of being attached to the notch C, protrudes into the housing 4 and continues along the upper part of the inner surface. And a convex portion 6 b protruding toward the inside of the housing 4 is formed. The vertical length of the ceramic substrate 6 is, for example, 4 mm or more and 19 mm or less, and is set to coincide with the vertical length of the notch C. Further, the length of the ceramic substrate 6 in the planar direction is, for example, 3 mm or more and 48 mm or less, and is set to coincide with the length of the notch C in the planar direction.

  The step portion 6a is, for example, 1 mm or more and 10 mm or less upward from the lower surface of the ceramic substrate 6, and has a size of, for example, 1 mm or more and 5 mm or less from the outer surface of the ceramic substrate 6 to the inner surface of the ceramic substrate 6. Notched into. The convex portion 6b has a vertical length of, for example, 1.5 mm or more and 18.5 mm or less, and a length along the upper portion of the inner surface of the ceramic base 6 is, for example, 1 mm or more and 10 mm or less. For example, the size is 1 mm or more and 5 mm or less from the inner surface of the ceramic base 6 toward the inside of the housing 4.

By providing the stepped portion 6 a below the outer surface of the ceramic substrate 6, the lower portion of the lead terminal 7 connected to the outer surface of the ceramic substrate 6 can be spaced from the outer surface of the ceramic substrate 6. Assuming that the lower portion of the lead terminal 7 is in contact with the outer surface of the ceramic substrate 6, a bonding material for electrically connecting the lead terminal 7 and the external circuit board when the mounting structure 1 is mounted on the external circuit board. When the lead terminal 7 undergoes thermal expansion due to heat applied to the lead, the stress is applied between the lead terminal 7 close to the bonding material side and the outer surface of the ceramic base 6 so that the lead terminal 7 is outside the ceramic base 6. The possibility of peeling from the side surface increases. Therefore, an air gap is provided between the lower portion of the lead terminal 7 and the outer surface of the ceramic base 6, and even if the lead terminal 7 undergoes thermal expansion, it can be made difficult to peel off from the outer surface of the ceramic base 6. The electrical reliability of the package 2 can be maintained satisfactorily. Further, when the mounting structure 1 is mounted on an external circuit board such as a printed circuit board, it is transmitted from the bonding material that electrically connects the lead terminal 7 and the external circuit board to the ceramic base 6 via the lead terminal 7. Heat is suppressed by the step portion 6a, and stress generated between the lead terminal 7 and the ceramic base 6 can be reduced. Furthermore, when the mounting structure 1 is stored in the storage tray or mounted on the external circuit board, the lead terminal 7 located in the stepped portion 6a is moderate even if a force due to an external factor is applied to the lead terminal 7. By deforming the lead terminal 7, the lead terminal 7 can be made difficult to peel off from the conductive layer 5.

  By providing the convex portion 6b continuously at the center of the inner surface of the ceramic base 6 along the vertical direction, the vertical rigidity of the ceramic base 6 can be improved. Further, by providing the convex portion 6 b continuously along the upper portion of the inner side surface of the ceramic substrate 6, the rigidity in the direction along the upper portion of the ceramic substrate 6 can be improved. Furthermore, a part of the conductive layer 5 is exposed on the lower surface of the portion along the upper portion of the inner surface of the ceramic base 6 of the convex portion 6b. And the electronic component 3 mounted in the ceiling surface of the housing | casing 4 and the conductive layer 5 of the inner surface of the ceramic base | substrate 6 can be electrically connected through a bonding wire. Thus, by providing the convex part 6b on the upper part of the inner surface of the ceramic substrate 6, the distance from the electronic component 3 mounted on the ceiling surface of the housing 4 can be shortened, and the electronic component 3 and the conductive layer can be shortened. Therefore, the length of the bonding wire connecting to the electronic component 5 can be shortened, and current loss between the electronic component 3 and the conductive layer 5 can be suppressed.

  The ceramic substrate 6 can be formed by laminating a plurality of layers. Here, a method for producing the ceramic substrate 6 will be described. If the ceramic substrate 6 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, or calcium oxide. And a green sheet formed into a sheet shape.

  Further, a high melting point metal powder such as tungsten or molybdenum, which is a raw material of the conductive layer 5, is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, the unfired green sheet is extracted into a predetermined shape, and a metal paste is printed at a predetermined location. Then, a plurality of green sheets on which a metal paste is printed are stacked and fired simultaneously at a predetermined temperature to obtain an integrally formed ceramic substrate 6.

  The conductive layer 5 is provided on the ceramic base 6 and electrically connects the inside of the housing 4 and the outside of the housing 4. The conductive layer 5 is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The conductive layer 5 is formed from the outer surface of the ceramic substrate 6 through the ceramic substrate 6 to the inner surface of the ceramic substrate 6. The inside of the housing 4 and the outside of the housing 4 can be electrically connected by the conductive layer 5 formed inside the ceramic base 6 and the conductive layer 5 formed outside the ceramic base 6. Further, the electronic component 3 and the conductive layer 5 in the ceramic base 6 are electrically connected, and the lead terminal 7 and the conductive layer 5 outside the ceramic base 6 are electrically connected, whereby the electronic component 3 and the lead are connected. The terminal 7 is electrically connected.

In the conductive layer 5, a narrow constricted portion 5 a is formed between the upper portion of the ceramic substrate 6 and the lower portion of the ceramic substrate 6 on the outer surface of the ceramic substrate 6. As shown in FIGS. 3 and 6, the conductive layer 5 formed on the outer surface of the ceramic substrate 6 has a shape in which two rectangular portions are connected vertically. And the narrow part 5a respond | corresponds to the location which connected the rectangular-shaped site | parts. Since the constricted portion 5 a is provided in the conductive layer 5, when the lead terminal 7 and the conductive layer 5 are joined, the brazing material joining the lead terminal 7 and the conductive layer 5 is wetted on the upper side of the ceramic base 6. Spreading is suppressed, and a desired amount of brazing material can be provided around the lead terminals 7. Furthermore, when the mounting structure 1 is mounted on an external circuit board such as a printed circuit board, heat applied to the bonding material for electrically connecting the lead terminals 7 to the external circuit board is transferred from the lead terminals 7 to the lead terminals 7. It is possible to suppress the transmission to the entire ceramic base 6 through the brazing material connecting the conductive layer 5 and the conductive layer 5. That is, the heat transfer path from the lead terminal 7 to the upper side of the ceramic base 6 through the brazing material and the conductive layer 5 is reduced by the constricted portion 5a, and the heat transferred from the lead terminal 7 to the ceramic base 6 through the brazing material. Can be suppressed.

  As shown in FIG. 6, the conductive layer 5 has a rectangular portion connected vertically, and the length in the vertical direction is, for example, 1.5 mm or more and 8 mm or less, and the length in the planar direction. However, it is set to 1 mm or more and 5 mm or less, for example. Further, the size of the constricted portion 5a of the conductive layer 5 is set such that the length in the vertical direction is, for example, 0.5 mm or more and 5 mm or less, and the length in the plane direction is, for example, 0.5 mm or more and 4 mm or less. Yes. The length in the planar direction of the constricted portion 5a is set to be shorter than the length in the planar direction of the rectangular portion connected vertically.

  The lead terminal 7 is a member for electrically connecting an external electronic device or the like and the electronic component 3. The lead terminal 7 is connected to the conductive layer 5 formed on the outer surface of the ceramic substrate 6 through a brazing material such as gold tin or silver copper. Then, the conductive layer 5 and the lead terminal 7 are electrically connected. The conductive layer 5 is provided at a plurality of locations on the ceramic substrate 6. The plurality of conductive layers 5 are provided with a space therebetween, and the adjacent conductive layers 5 are electrically insulated from each other. And by providing each lead terminal 7 in each conductive layer 5, adjacent lead terminals 7 are electrically insulated from each other. The lead terminal 7 is made of a conductive material, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, or an alloy containing these metal materials.

  The lead terminal 7 is connected to a portion located below the constricted portion 5a of the conductive layer 5 formed on the outer surface of the ceramic base 6 via a brazing material. Since the lead terminal 7 is connected to a part of the conductive layer 5 located below the constricted portion 5a, when the mounting structure 1 is mounted on an external circuit board such as a printed board, the lead terminal 7 and the external The heat transmitted from the bonding material that electrically connects the circuit board to the lead terminal 7 is less likely to be transmitted to the conductive layer 5 positioned above the constricted portion 5a, and therefore is positioned above the conductive layer 5. The thermal stress resulting from the difference in thermal expansion coefficient that occurs at the joint between the ceramic base 6 and the housing 4 can be reduced. As a result, cracks to the ceramic substrate 6 and peeling of the bonding material can be suppressed.

  The lead terminal 7 has a portion 7a extending in the vertical direction and a portion 7b bent and extending in the plane direction. The bent portion of the lead terminal 7 is located below the height position of the lower surface of the housing 4. As shown in FIG. 6, the lead terminal 7 is bent so that the height position of the lower surface of the lead terminal 7 is located below the height position of the lower surface of the housing 4. And the lead terminal 7 can be mounted flat with respect to an external member, without the housing | casing 4 contacting an external member. The electronic component storage package 2 can be connected so as not to be inclined with respect to the external member while increasing the area to be fixed to the external member. As a result, the electronic component storage package 2 can be stably and firmly connected to an external member.

The seal ring 8 is continuously provided along the lower edge of the housing 4 including the lower surface of the ceramic base 6 provided in the notch C. The seal ring 8 is connected to the lower surface of the ceramic base 6 and the lower end edge of the housing 4 via a brazing material. The seal ring 8 is connected to the bottom plate 9 when the bottom plate 9 is provided so as to close the opening H of the housing 4. The seal ring 8 is made of a metal such as copper, tungsten, iron, nickel, or cobalt having excellent seam weldability with the bottom plate 9, or an alloy containing a plurality of these metals. The thermal expansion coefficient of the seal ring 8 is set to, for example, 4 × 10 ⁻⁶ / K or more and 16 × 10 ⁻⁶ / K or less. The thickness of the seal ring 8 in the vertical direction of the seal ring 8 is set to, for example, 0.5 mm or more and 2 mm or less.

  The bottom plate 9 is connected to the seal ring 8 so as to cover the electronic component 3 in the housing 4. The bottom plate 9 hermetically seals a region surrounded by the housing 4. The bottom plate 9 is made of, for example, a metal such as copper, tungsten, iron, nickel, or cobalt, or an alloy containing a plurality of these metals, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, It consists of ceramics, such as an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics. Further, the bottom plate 9 is joined to the seal ring 8 by seam welding, for example, via a joining member such as solder or brazing material. The bottom plate 9 has a thickness in the vertical direction of the bottom plate 9 set to, for example, 0.5 mm or more and 3 mm or less.

  The region surrounded by the casing 4 is filled with a vacuum state or nitrogen gas, and the bottom plate 9 is provided on the seal ring 8 so that the region surrounded by the casing 4 is hermetically sealed. be able to. The bottom plate 9 is placed on the seal ring 8 in a predetermined atmosphere, and is attached on the seal ring 8 by performing seam welding. Further, the bottom plate 9 can be attached via a bonding member such as a brazing material, a glass bonding material or a resin bonding material.

  The length of the lead terminal 7 that protrudes downward from the lower surface position of the housing 4 is set to, for example, 1 mm or more and 6 mm or less. The length from the lower surface of the housing 4 to the lower surface of the bottom plate 9 is set to be shorter than the protruding length of the lead terminal 7, for example, 1 mm or more and 5 mm or less. That is, the length obtained by adding the vertical length of the seal ring 8 and the vertical length of the bottom plate 9 is shorter than the length protruding downward from the lower surface position of the housing 4 of the lead terminal 7. Is set to As a result, when the mounting structure 1 is mounted on an external member, the bottom plate 9 can be made difficult to contact the external member, and the external member and the lead terminal 7 can be easily connected. .

  The mounting structure 1 and the electronic component storage package 2 according to the present embodiment include a housing 4 that mounts electronic components on the ceiling surface of the opening H, and a ceramic base 6 that is provided in the notch C of the housing 4. And the lead terminal 7 which is provided on the outer surface of the ceramic substrate 6 and is bent toward the outside of the housing 4 to stably connect the lead terminal 7 to a member such as an external printed board. Can do. At this time, the electronic component 3 is provided on the ceiling surface of the housing 4 from the upper surface of the external member through the space in the housing 4, so that the electronic component 3 is impacted by the external member. Can hardly be transmitted, and further, it is difficult to receive the influence of heat from an external member. As a result, the mounting structure 1 and the electronic component storage package 2 can continue to maintain good electrical reliability over a long period of time.

  Further, the mounting structure 1 and the electronic component storage package 2 according to the present embodiment are such that the bent portion of the lead terminal 7 is located below the height position of the lower surface of the housing 4, It is possible to easily connect the lead terminal 7 directly to the member. Further, the bent portion of the lead terminal 7 serves to relieve stress when contacting the external member, and the lead terminal 7 can be prevented from being peeled off from the conductive layer 5 of the ceramic base 6.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention.

<Method for manufacturing mounting structure>
Here, a manufacturing method of the mounting structure 1 shown in FIG. 1 or FIG. 2 will be described. First, the electronic component storage package 2 and the electronic component 3 are prepared. The casing 4, the lead terminal 7, the seal ring 8, and the bottom plate 9 use a conventionally known metal processing method such as rolling or punching for an ingot obtained by casting a molten metal material into a mold and solidifying it. Thus, it is manufactured in a predetermined shape. Further, the ceramic substrate 6 is manufactured by the manufacturing method described above.

  Then, the lead terminal 7 is connected to the conductive layer 5 exposed on the outer surface of the ceramic base 6 via a brazing material. Furthermore, the ceramic base 6 is connected to the notch C of the housing 4 via a brazing material. In this way, the electronic component storage package 2 can be manufactured. Next, the electronic component 3 is mounted in the mounting region R on the ceiling surface at the opening H of the housing 4. Furthermore, the electronic component 3 is electrically connected to the conductive layer 5 exposed on the inner wall surface of the ceramic substrate 6 via a bonding wire. Further, the mounting structure 1 can be manufactured by attaching the bottom plate 9 to the lower surface of the housing 4 via the seal ring 8.

DESCRIPTION OF SYMBOLS 1 Mounting structure 2 Electronic component storage package 3 Electronic component 4 Housing 5 Conductive layer 5a Constricted portion 6 Ceramic base 6a Stepped portion 6b Protruding portion 7 Lead terminal 8 Seal ring 9 Bottom plate R Mounting region H Opening portion C Notch

Claims (5)

A box-shaped opening having an opening on the lower surface, a mounting region for an electronic component disposed on a ceiling surface in the opening, and a housing having a notch disposed at a lower portion of each opposing side wall; A ceramic substrate provided in each of the notches, and having a conductive layer formed on the outer surface for electrically connecting the inside of the housing and the outside of the housing;
A lead terminal connected to the conductive layer, extending from an upper part to a lower part of the ceramic base and bent from the lower part of the ceramic base toward the outside of the housing;
Electronic component storage package with The electronic component storage package according to claim 1,
The electronic component storage package, wherein the bent portion of the lead terminal is located below the lower surface of the housing. The electronic component storage package according to claim 1 or 2,
The package for storing an electronic component, wherein the conductive layer is formed from the outer surface of the ceramic substrate to the inner surface of the ceramic substrate through the inside of the ceramic substrate. The electronic component storage package according to any one of claims 1 to 3,
The package for storing electronic parts, wherein the conductive layer has a constricted portion formed between an upper portion of the ceramic substrate and a lower portion of the ceramic substrate on an outer surface of the ceramic substrate. The electronic component storage package according to any one of claims 1 to 4,
A mounting structure comprising: an electronic component mounted in the mounting region of the electronic component storage package.

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