JP5791258B2 - Electronic component storage package and mounting structure - Google Patents

Description

  The present invention relates to an electronic component storage package capable of mounting an electronic component and a mounting structure on which the electronic component is mounted.

  In recent years, along with miniaturization of devices, small electronic component housing packages capable of mounting electronic components such as ICs, light emitting diodes, piezoelectric elements, and crystal resonators have been developed.

  In addition, there has been proposed an electronic component housing package for an optical semiconductor capable of mounting an optical semiconductor element such as a laser diode or a photodiode (for example, see Patent Document 1).

  The electronic component storage package proposed in Patent Document 1 includes a metal substrate on which electronic components are mounted, and a ceramic terminal member having terminals capable of electrically connecting the inside and outside of the package. Has been. In addition, this ceramic terminal member is a two-layer structure of the lower layer member which can form a terminal, and the upper layer member formed on a lower layer member, Comprising: The lower layer member is formed in the rectangular shape.

Japanese Patent Laid-Open No. 11-145317

  Incidentally, in the electronic component storage package proposed in Patent Document 1, the lower layer member has a rectangular shape, and thermal stress is easily applied by heat generated by the electronic component mounted inside the package. Therefore, when the lower layer member is made of ceramics, cracks are generated when thermal stress is applied, and the airtightness of the package may be impaired.

  An object of the present invention is to provide an electronic component storage package and a mounting structure excellent in airtightness.

An electronic component storage package according to an embodiment of the present invention is provided in a frame shape on a substrate having a first electronic component mounting region on an upper surface and on the substrate along an outer periphery of the first electronic component mounting region. The base having a mounting portion in part and the lower layer, the intermediate layer, and the upper layer are laminated to be provided at a distance from the upper surface of the substrate, and the upper portion overlaps the substrate in plan view. A second electronic component mounting region that extends from the region to a region that does not overlap with the substrate and that protrudes from an end surface in the region that overlaps the lower substrate; and vertically extending across the second electronic component mounting region an insulator having a pair of grooves in the even on insulator provided over the region which does not overlap with the substrate from a region overlapping with the substrate, the electronic component and the being mounted on the first mounting area Second electronic component And a line conductor connected to the electronic components and electrically mounting the instrumentation area.

  A mounting structure according to an embodiment of the present invention includes an electronic component storage package, a first electronic component mounted in the first electronic component mounting region of the electronic component storage package, and the electronic component storage package. And a second electronic component mounted in the second electronic component mounting region.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component storage package and mounting structure excellent in airtightness can be provided.

1 is a front perspective view of an electronic component storage package according to an embodiment of the present invention. 1 is a rear perspective view of an electronic component storage package according to an embodiment of the present invention. It is a disassembled perspective view of the electronic component storage package which concerns on one Embodiment of this invention. It is a back perspective view of the insulator of the electronic component storage package concerning one embodiment of the present invention. It is a top view of the insulator of the electronic component storage package which concerns on one Embodiment of this invention. It is the top view which removed the upper layer of the insulator of the electronic component storage package which concerns on one Embodiment of this invention. It is the top view which removed the upper layer and intermediate | middle layer of the insulator of the electronic component storage package which concerns on one Embodiment of this invention. It is a top view of the electronic component storage package which concerns on one Embodiment of this invention. It is sectional drawing of the electronic component storage package which concerns on one Embodiment of this invention. It is a top view of the mounting structure concerning one embodiment of the present invention. It is sectional drawing of the mounting structure which concerns on one Embodiment of this invention. It is a top view of the insulator concerning one modification.

  Hereinafter, an electronic component storage package and a mounting structure according to an embodiment of the present invention will be described with reference to the drawings.

<Configuration of electronic component storage package and mounting structure>
FIG. 1 is a front perspective view showing an electronic component storage package according to an embodiment of the present invention, and is a perspective view of an insulator as viewed from the front. FIG. 2 is a rear perspective view of the electronic component storage package shown in FIG. 1 and shows the insulator from the rear. FIG. 3 is an exploded perspective view of the electronic component storage package shown in FIG. 1 and shows a substrate, a base, an insulator, and a frame. FIG. 4 is a rear perspective view of the insulator, as viewed from the rear.
FIG. 5 is a plan view of the insulator and shows a state in which the lower layer, the intermediate layer, and the upper layer are overlapped. FIG. 6 is a plan view of an insulator and shows a state in which a lower layer and an intermediate layer are overlaid. FIG. 7 is a plan view of an insulator and shows a lower layer. FIG. 8 is a plan view of the electronic component storage package shown in FIG. FIG. 9 is a cross-sectional view of the electronic component storage package taken along the virtual cutting line XX ′ shown in FIG. FIG. 10 is a plan view of the mounting structure corresponding to FIG. FIG. 11 is a cross-sectional view of the mounting structure corresponding to FIG.

  The electronic component storage package 1 is provided on the upper surface of the substrate 2 having the first electronic component mounting region R1 and on the substrate 2 along the outer periphery of the first electronic component mounting region R1. The base | substrate 3 which has these is included. The electronic component storage package 1 includes an insulator 4 that is provided in the attachment portion M and that extends from a region that overlaps the substrate 2 to a region that does not overlap the substrate 2 when viewed from above. Further, the electronic component storage package 1 is provided on the insulator 4, provided on the insulator 4 and the base 3, the line conductor 5 provided from the region overlapping the substrate 2 to the region not overlapping the substrate 2, The frame 6 surrounding the first electronic component mounting region R1 as viewed is included. The insulator 4 further includes a second electronic component mounting region R2 in a region surrounded by the frame body 6 in plan view, and a pair of grooves D on the end surface in the region surrounded by the frame body 6 in plan view. Have.

  The mounting structure 1X includes an electronic component storage package 1, a first electronic component 7 mounted in the first electronic component mounting region R1 of the electronic component storage package 1, and a second electronic component mounting of the electronic component storage package 1. And a second electronic component 8 mounted in the region R2. In addition, the 1st electronic component 7 or the 2nd electronic component 8 may be comprised from the some electronic component.

  The electronic component storage package 1 is, for example, an active component such as a semiconductor element, an optical semiconductor element, a transistor, a diode, or a thyristor, or a resistor, a capacitor, a solar cell, a piezoelectric element, a crystal resonator, a ceramic oscillator, or a Peltier element. 1st electronic component 7 and 2nd electronic component 8 which consist of a passive component of this, or printed circuit boards, such as a rigid board | substrate, a flexible board | substrate, or a rigid flexible board | substrate, are mounted.

  Further, the electronic component storage package 1 of the present embodiment corresponds to high withstand voltage, high current, high speed and high frequency, and the first electronic component mounting region R1 is cooled by, for example, a Peltier element. A first electronic component composed of a portion 7a, a substrate portion 7b made of, for example, a flexible substrate mounted on the cooling portion 7a, and a light emitting portion 7c made of, for example, an optical semiconductor element, is mounted on the substrate portion 7b. Yes. In addition, in the second electronic component mounting region R2, for example, the second electronic component 8 made of a wiring board capable of inputting and outputting a high frequency signal is mounted, and the wiring pattern of the second electronic component 8 and the line conductor 5 are connected by a bonding wire or the like. Connect electrically. The substrate part 7b of the first electronic component 7 and the second electronic component 8 are electrically connected by a bonding wire or the like.

  The substrate 2 is a member formed in a square shape when viewed in plan. The substrate 2 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The substrate 2 has a function of improving heat conductivity and efficiently dissipating heat generated from the first electronic component 7 mounted in the first electronic component mounting region R1 to the outside through the substrate 2. The thermal conductivity of the substrate 2 is set to, for example, 15 W / (m · K) or more and 450 W / (m · K) or less.

  The substrate 2 is manufactured in a predetermined shape by using a conventionally known metal processing method such as rolling or punching for an ingot obtained by casting and solidifying a molten metal material into a mold. For example, the length of one side of the substrate 2 is set to 3 mm or more and 50 mm or less. The thickness in the vertical direction of the substrate 2 is set to, for example, 0.3 mm or more and 5 mm or less.

  In addition, the surface of the substrate 2 is formed of nickel or electroless plating by electroplating or electroless plating in order to prevent oxidative corrosion or mount the cooling part 7a of the first electronic component 7 in the first electronic component mounting region R1. A plating layer such as gold is formed. The first electronic component mounting region R1 of the substrate 2 is a region that is not connected to the substrate 3 when the substrate 3 is connected to the upper surface of the substrate 2. In the present embodiment, the shape of the substrate 2 is a square shape, but the shape is not limited to a square shape as long as the cooling unit 7a, the substrate unit 7b, and the light emitting unit 7c of the first electronic component 7 can be mounted. Further, it may be a polygonal shape other than a rectangular shape or an elliptical shape.

  The base 3 is a member that is connected along the outer periphery of the first electronic component mounting region R1 of the substrate 2 and protects the first electronic component 7 mounted on the first electronic component mounting region R1 from the outside. The base body 3 has a shape in which a part of a frame shape formed in a quadrangular shape is cut out in plan view. Further, the base body 3 is provided with a through hole H at a location facing the location where the attachment portion M is provided. The substrate 3 is brazed to the substrate 2 via a brazing material. The brazing material is made of, for example, silver, copper, gold, aluminum, or magnesium, and may contain an additive such as nickel, cadmium, or phosphorus.

  The base 3 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. In the state where the first electronic component 7 is mounted in the first electronic component mounting region R1, the base 3 efficiently transfers heat generated from the substrate portion 7b and the light emitting portion 7c of the first electronic component 7 to the outside of the base 3 Has a function to diverge. The thermal conductivity of the substrate 3 is set to, for example, 15 W / (m · K) or more and 450 W / (m · K) or less.

  Moreover, the base | substrate 3 is a magnitude | size accommodated in the board | substrate 2 when planarly viewed, and the length of one side is set to 3 mm or more and 50 mm or less, for example. Moreover, the upper and lower thickness of the location where the attachment part M of the base 3 is provided is set to, for example, 0.1 mm or more and 20 mm or less. Moreover, the thickness of the up-down direction of the location in which the attachment part M of the base | substrate 3 is not provided is set to 1 mm or more and 30 mm or less, for example. Moreover, the thickness of the width | variety of the frame when the base | substrate 3 is planarly viewed is set to 0.1 mm or more and 3 mm or less, for example.

  The insulator 4 is provided at a location where the attachment portion M of the base 3 is formed. Further, it is provided at a portion where the through hole H of the base 3 is formed in order to pass light transmitted from the optical fiber F provided outside to the inside of the base 3. The through hole H is provided with a holding member 10 into which a light transmissive member 9 such as sapphire, plastic or glass can be fitted. Note that the light emitting portion 7 c of the first electronic component 7 is set on the optical axis of the light transmissive member 9. An optical signal is input / output between the light emitting portion 7 c and the light transmissive member 9.

  The insulator 4 is a member provided at the attachment portion M of the base 3. The insulator 4 is provided with a line conductor 5 for electrically connecting the inside and outside of the package in a state of being provided at the attachment portion M.

  The insulator 4 is provided at a location where the attachment portion M of the base 3 is formed, and is provided at a distance from the substrate 2. If the insulator 4 and the substrate 2 are directly connected, most of the heat generated from the first electronic component 7 mounted in the first electronic component mounting region R1 of the substrate 2 is insulated via the substrate 2. It is transmitted to the body 4. When a large amount of heat is transmitted to the insulator 4, thermal stress caused by the difference in thermal expansion coefficient between the insulator 4 and the second electronic component 8 mounted in the second electronic component mounting region R <b> 2 is insulated from the second electronic component 8. Concentrating on the joint portion with the body 4, cracks and peeling at the joint portion may occur, and the line conductor 5 formed on the insulator 4 may be damaged by the influence of heat. In the present embodiment, the insulator 4 is provided on the substrate 2 via the base 3 so as to be separated from the substrate 2, so that heat is radiated on the surface of the base 3 reaching the insulator 4, and the insulator 4 is reduced, and based on the heat transmitted to the substrate 2, it is possible to suppress cracks and peeling at the joint between the insulator 4 and the second electronic component 8 mounted in the second electronic component mounting region R2. In addition, the line conductor 5 on the insulator 4 can be prevented from being damaged.

  The insulator 4 has a three-layer structure of a lower layer 4a, an intermediate layer 4b, and an upper layer 4c. The intermediate layer 4b is laminated on the lower layer 4a, and the upper layer 4c is laminated on the intermediate layer 4b. The line conductor 5 is formed on the upper surface of the intermediate layer 4b and is provided from one end to the other end of the intermediate layer 4b.

  The lower layer 4a of the insulator 4 has a shape in which a pair of notches are provided on one side of a rectangular plate. And it is the shape which provided the groove | channel in each of the notch. In addition, the upper surface between a pair of notches becomes 2nd electronic component mounting area | region R2.

The intermediate layer 4b of the insulator 4 has a shape in which one cutout is provided on one side of a rectangular plate so as to include a pair of cutouts in the lower layer 4a when overlapped with the lower layer 4a. And it is the shape which provided a pair of groove | channel in the notch of the intermediate | middle layer 4b. The groove of the lower layer 4a of the insulator 4 and the groove of the intermediate layer 4b of the insulator 4 overlap each other when the lower layer 4a and the intermediate layer 4b are overlapped with each other.
Configured as

  The upper layer 4c of the insulator 4 is provided with a rectangular cutout so that the groove D and the second electronic component mounting region R2 are exposed when they are superimposed on the lower layer 4a and the intermediate layer 4b in plan view. Shape.

The lower layer 4a, the intermediate layer 4b and the upper layer 4c of the insulator 4 are insulating materials, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, It consists of ceramics, such as a silicon nitride sintered body or glass ceramic. The thermal expansion coefficient of the insulator 4 is set to, for example, 2 × 10 ⁻⁶ / K or more and 10 × 10 ⁻⁶ / K or less.

  The length of one side of the lower layer 4a, the intermediate layer 4b, and the upper layer 4c of the insulator 4 when viewed in plan is set to, for example, 2 mm or more and 50 mm or less, for example, assuming that notches and grooves are not present. Moreover, the thickness of the up-down direction of the lower layer 4a, the intermediate | middle layer 4b, and the upper layer 4c is set to 0.2 mm or more and 5 mm or less, for example. The lower layer 4a, the intermediate layer 4b, and the upper layer 4c may not have the same length and thickness on one side.

  Here, a method for manufacturing the insulator 4 will be described. As the insulator 4, green sheets corresponding to the lower layer 4a, the intermediate layer 4b, and the upper layer 4c are prepared. And the lower layer 4a, the intermediate | middle layer 4b, and the upper layer 4c before baking are obtained using tools, such as a laser, a punch, or a cutter, so that each green sheet may become a defined shape. Next, a plurality of uncured lower layer 4a, intermediate layer 4b, and upper layer 4c before firing are formed on the upper surface of intermediate layer 4b by using a thin film forming technique such as vapor deposition, screen printing, or sputtering. A line conductor 5 is formed. Further, in order to improve the electrical characteristics of the line conductor 5 with respect to the lower layer 4a, the intermediate layer 4b, and the upper layer 4c, the metallized layer 11 is formed on a part of each side surface. Thereafter, the lower layer 4a, the intermediate layer 4b, and the upper layer 4c of the insulator 4 are pressure-bonded and simultaneously fired in a laminated state. In this way, the insulator 4 can be manufactured. The line conductor 5 and the metallized layer 11 are made of a refractory metal material such as tungsten, molybdenum, or manganese.

  In the insulator 4 after firing, the lower layer 4a, the intermediate layer 4b, and the upper layer 4c are integrated. When the insulator 4 is viewed in plan, the line conductor 5 appears to be divided into two by the upper layer 4c, but the line conductor 5 is continuous immediately below the upper layer 4c. Therefore, when the insulator 4 is viewed in plan, the line conductor 5 extending to the inside and outside surrounded by the frame body 6 is provided. As a result, the inside and outside of the electronic component storage package 1 can be electrically connected via the line conductor 5.

  The insulator 4 is provided with a pair of notches in the lower layer 4a, and further provided with a notch having a size including the pair of notches in the lower layer 4a in the intermediate layer 4b, so that the second electronic component mounting region is provided in the lower layer 4a. R2 can be provided. If there is no notch in the insulator 4, the second electronic component 8 cannot be mounted on the insulator 4 because the second electronic component mounting region R <b> 2 does not exist.

The second electronic component mounting region R2 is a part of the upper surface of the lower layer 4a and is an exposed portion that is not covered with the intermediate layer 4b and the upper layer 4c. Therefore, the height position of the second electronic component mounting region R2 for mounting the second electronic component 8 is set to be lower than the height position of the upper surface of the intermediate layer 4b or the upper layer 4c of the insulator 4. By providing the second electronic component mounting region R2 in the insulator 4, the second electronic component 8 can be mounted at a location having a height position different from that of the first electronic component mounting region R1. As a result, the height position where the first electronic component 7 and the second electronic component 8 are mounted can be made different, and heat from both components can be prevented from concentrating on a specific location, and the airtightness of the package Can be reduced. Further, by providing a step portion between the second electronic component mounting region R2 and the intermediate layer 4b, the height position of the electrode part of the electronic component mounted on the second electronic component mounting region R2 or the wiring pattern of the wiring board And the height position with the line conductor 5 can be adjusted, the characteristic impedance in a transmission line can be matched, and a high frequency signal can be input / output smoothly.

  The grooves D of the insulator 4 are formed by forming grooves corresponding to the grooves D in the lower layer 4a and the intermediate layer 4b of the insulator 4 and arranging the upper layer 4c so as not to overlap the lower layer 4a and the intermediate layer 4b. Can be provided. Further, when manufacturing the electronic component storage package, heat for melting the brazing material provided at the junction of the substrate 2, the base body 3, the insulator 4 and the frame body 6 is applied to the electronic component storage package. However, the thermal stress caused by the difference in thermal expansion coefficient between the substrate 2, the base body 3, the frame body 6 and the insulator 4 is relieved by the groove D, and the insulator 4, the second electronic component mounting region R 2, the substrate 2, the base body 3, cracks and cracks at the joint between the insulator 4 and the frame 6 can be suppressed. Further, the first electronic component 7 and the second electronic component 8 generate heat inside the package, and the temperature may be higher than normal temperature. However, the groove D is formed inside the insulator 4 located inside the package. Even if the thermal stress caused by the difference in thermal expansion coefficient between the substrate 2, the base body 3, the frame body 6 and the insulator 4 is applied to the insulator 4, the stress is relieved in the groove D of the insulator 4. be able to. As a result, the insulator 4 may be destroyed, the second electronic component 8 mounted in the second electronic component mounting region R2 may be destroyed, and further, the substrate 2, the base 3, the insulator 4, and the frame 6 It is possible to reduce the possibility of cracks at the joint, and to improve the hermeticity of the package.

  A part of the line conductor 5 is provided up to the end of the intermediate layer 4b where the groove D is provided. By providing the line conductor 5 in the vicinity of the groove D, the line conductor 5 and the board portion 7b of the first electronic component 7 mounted in the first electronic component mounting region R1 can be electrically connected via the wire 12. it can. A part of the wire 12 is provided so as to overlap with the groove D in plan view. Furthermore, a part of the wire 12 is positioned in the groove D. Since the wire 12 electrically connects the upper surface of the intermediate layer 4b and the first electronic component 7 located below the upper surface of the intermediate layer 4b, if the groove D does not exist, a part of the wire 12 is partly connected to the intermediate layer 4b. However, it is possible to prevent a part of the wire 12 from being positioned in the groove D and electrically connect the line conductors 5 to each other. An excellent package can be provided.

  The insulator 4 is joined to the mounting portion M of the base 3 via a brazing material. In the state in which the insulator 4 is bonded to the attachment portion M, the insulator 4 is aligned such that the height of the upper surface of the upper layer 4c of the insulator 4 and the upper surface of the portion where the attachment portion M of the base 3 is not provided. Is set to The insulator 4 is joined so as to protrude outside the base body 3 and the frame body 6. Thereby, a meniscus by the brazing material is formed at the joint portion between the insulator 4 and the base body 3 and the frame body 6. As a result, even if thermal stress due to the difference in thermal expansion coefficient between the substrate 2, the base body 3, the frame body 6, and the insulator 4 is generated, it is possible that It is possible to reduce the possibility that the second electronic component mounting region R2 and the second electronic component mounting region R2 mounted on the second electronic component mounting region R2 are broken by the groove D of the insulator 4 while reducing the possibility of the occurrence of cracks. And the hermeticity of the package can be improved.

  The frame body 6 is a frame-shaped member that is connected to the upper surface of the upper layer 4 c of the insulator 4 and the upper surface of the portion where the attachment portion M of the base body 3 is not provided.

  The frame 6 is provided on the insulator 4 and the base 3 and is set to a size that surrounds the first electronic component mounting region R1 and the second electronic component mounting region R2 in plan view. The frame body 6 is connected to the insulator 4 and the base body 3 through a brazing material. And the insulator 4 is located between the base | substrate 3 and the frame 6 in the up-down direction, and is clamped between both. The frame 6 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.

  The length of one side when the frame 6 is viewed in plan is set to, for example, 3 mm or more and 50 mm or less. The thickness of the frame body 6 in the vertical direction is set to, for example, 0.1 mm or more and 3 mm or less. The thickness of the width of the frame when the frame body 6 is viewed in plan is set to, for example, 0.1 mm or more and 3 mm or less.

  The terminal 13 is a member for electrically connecting an external electronic device or the like to the element 2. The terminal 13 is connected to the line conductor 5 via a brazing material. The line conductor 5 and the terminal 13 are electrically connected. Moreover, the adjacent line conductors 5 are electrically insulated from each other by providing the line conductors 5 adjacent to each other. And by providing each terminal 13 in each line conductor 5, adjacent terminals 13 are electrically insulated.

  The mounting structure 1X can be manufactured by mounting the electronic component 7 in the first electronic component mounting region R1 of the electronic component storage package 1 and mounting the electronic component 8 in the second electronic component mounting region R2.

  As in the case of the electronic component storage package 1 and the mounting structure 1X according to the present embodiment, particularly when the second electronic component 8 is directly mounted on the insulator 4, the heat generated in the second electronic component 8 is insulated. It tries to be transmitted to the body 4 a lot. In such a case, the thermal stress applied to the insulator 4 is large, and in particular, there is a high possibility that the insulator 4 is broken. In the electronic component storage package 1 and the mounting structure 1X according to the present embodiment, the groove D is provided on the inner end surface of the insulator 4 which is a part of the inner wall portion of the package, whereby the inside of the package becomes high temperature and is insulated. Even if thermal stress is applied to the body 4, the stress can be relaxed in the groove D, and the possibility that the insulator 4 is destroyed can be reduced. As a result, the stress concentration of the insulator 4 can be reduced, the occurrence of cracks in the insulator 4 can be suppressed, and the airtightness of the package can be maintained well.

<Method for manufacturing electronic component storage package>
Here, a method for manufacturing the electronic component storage package shown in FIG. 1 or 2 will be described.

  First, the substrate 2, the base 3, the insulator 4 and the frame 6 are prepared.

  Each of the substrate 2, the base 3, and the frame 6 is manufactured in a predetermined shape by using a metal processing method on a solidified ingot obtained by casting a molten metal material into a mold.

  The insulator 4 prepares a lower layer 4a, an intermediate layer 4b, and an upper layer 4c. The insulator 4 can be prepared by the method for manufacturing the insulator 4 in the above-described embodiment. The insulator 4 is prepared with molds corresponding to the lower layer 4a, the intermediate layer 4b, and the upper layer 4c, and each frame is filled with, for example, an aluminum oxide material, and the lower layer before sintering. You may take out 4a, the intermediate | middle layer 4b, and the upper layer 4c.

  Next, the intermediate layer 4 and the upper layer 4c of the precursor are put on the lower layer 4a of the precursor and are pressed, so that they are brought into close contact with each other. And the insulator 4 can be produced by sintering.

  Further, the holding member 10 on which the light transmissive member 9 is mounted is fitted and connected to the prepared through hole H of the base 3 via a brazing material.

Next, each of the prepared substrate 2, base body 3, insulator 4 and frame body 6 is connected via a brazing material. Specifically, the base 3 is connected along the outer periphery of the substrate 2 via a brazing material. And the insulator 4 is connected to the location in which the attachment part M of the base | substrate 3 is provided through the brazing material. Then, the frame body 6 is connected to the upper surfaces of the insulator 4 and the base body 3 via a brazing material. In this way, the electronic component storage package 1 can be manufactured.

  Next, the mounting structure 1X can be manufactured by mounting the first electronic component 7 and the second electronic component 8 on the manufactured electronic component storage package 1 via solder.

<Modification>
The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention. FIG. 12 is a plan view of the insulator 4 of the electronic component storage package 1 according to a modification.

  As shown in FIG. 5, the electronic component storage package 1 according to the above embodiment has a pair of second electronic component mounting regions R2 exposed from the intermediate layer 4b of the lower layer 4a between the pair of grooves D. Although the edge of the intermediate layer 4b located at the location sandwiched by the grooves D is straight, it is not limited to this. As shown in FIG. 12, the area of the second electronic component mounting region R <b> 2 is increased, and the edge of the intermediate layer 4 b located at a position sandwiched between the pair of grooves D is recessed toward the region where the terminals 13 are mounted. It may be.

  By providing the recess in the intermediate layer 4b of the insulator 4, the thermal stress applied to the insulator 4 can be further relaxed, and the occurrence of cracks in the insulator 4 can be reduced. Further, the second electronic component mounting region R2 can be increased, and the selectivity of the second electronic component 8 can be improved.

DESCRIPTION OF SYMBOLS 1 Electronic component storage package 1X Mounting structure 2 Board | substrate 3 Base | substrate 4 Insulator 5 Line conductor 6 Frame 7 1st electronic component 8 2nd electronic component 9 Light transmissive member 10 Holding member 11 Metallization layer 12 Wire 13 Terminal R1 1st 1 Electronic component mounting region R2 Second electronic component mounting region M Mounting portion D Groove H Through hole F Optical fiber

Claims (4)

A substrate having a first electronic component mounting region on an upper surface;
A base body provided on the substrate and in a frame shape along the outer periphery of the first electronic component mounting region, and having a mounting portion in part;
A lower layer, an intermediate layer, and an upper layer are stacked and provided at a distance from the upper surface of the substrate at the mounting portion, and extends from a region overlapping the substrate to a region not overlapping the substrate in plan view. And an insulator having a second electronic component mounting region protruding from an end face in a region overlapping the substrate of the lower layer, and having a pair of grooves in the vertical direction across the second electronic component mounting region ;
Electronic components mounted on the first electronic component mounting region and electronic components mounted on the first electronic component mounting region, which are provided on the insulator from a region overlapping the substrate to a region not overlapping the substrate. A line conductor electrically connected to,
A package for storing electronic parts, comprising: The electronic component storage package according to claim 1 ,
The line conductor is partially provided up to the end where the groove is provided, and the line conductor and the electronic component mounted in the first electronic component mounting region are electrically connected via a wire. Electronic component storage package characterized by being connected. The electronic component storage package according to claim 1 or 2 ,
The electronic component storage package, wherein the insulator is set such that a height position of an upper surface of the second electronic component mounting region is lower than a height position of the line conductor. An electronic component storage package according to any one of claims 1 to 3, a first electronic component mounted in the first electronic component mounting region of the electronic component storage package, and the electronic component storage package. A mounting structure comprising: a second electronic component mounted in the second electronic component mounting region.

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