JP6622583B2 - Wiring board and electronic device - Google Patents

Description

  The present invention relates to a wiring board and an electronic device having electrode pads and the like to which electronic components are electrically connected.

  As a wiring board on which electronic components such as a semiconductor element, a sensor element or a capacitor element are mounted, an insulating substrate having a concave portion in which the electronic component is accommodated on the upper surface of the insulating substrate, and from the concave portion of the insulating substrate to the outer surface such as the lower surface What has the wiring conductor provided is used. An electronic device is manufactured by mounting electronic components on the bottom surface of the recess. In the manufactured electronic device, the electronic component and the external electric circuit are electrically connected to each other through the wiring conductor.

  In recent years, an insulating substrate provided with a wiring conductor from the inside of a recess to the upper surface surrounding the recess has been used. Of the wiring conductors, the one located in the recess of the insulating substrate is electrically connected to the electronic component, and the one located on the upper surface surrounding the recess is connected to the external electric circuit. The electronic device in this case is mounted on the external electric circuit by being turned upside down so that the upper surface of the insulating substrate faces the external electric circuit.

JP 2009-200138 A JP 2013-4984

  In the above prior art, both the part connected to the electronic component and the part electrically connected to the external electric circuit in the wiring conductor are arranged on the upper surface side of the wiring board. In addition, a portion provided with a wiring conductor connected to the electronic component and a portion provided with a wiring conductor connected externally are provided side by side in a plan view. Therefore, it is difficult to miniaturize the wiring board and the electronic device in plan view.

A wiring board according to one aspect of the present invention has a main surface including a rectangular recess in plan view, and an insulating substrate in which an electronic component is accommodated in the recess, and a pair of sides facing each other of the recess A plurality of electrode pads arranged in the recess of the insulating substrate along the outer periphery of the insulating substrate, and the outer periphery of the other pair of sides facing each other of the recess. A plurality of connection pads arrayed on a surface, and the plurality of electrode pads and the plurality of connection pads include the pair of side sides and the other pair of side sides of the rectangular recess. Divided into
It is.

  An electronic device according to an aspect of the present invention includes the wiring board having the above-described configuration and an electronic component that is housed in the recess and is electrically connected to the plurality of electrode pads.

  According to the wiring board of one aspect of the present invention, the plurality of electrode pads and the plurality of connection pads arranged respectively are divided into a pair of sides and a pair of other sides of the rectangular recess. Has been placed. For this reason, for example, compared to a case where electrode pads and connection pads are arranged on each of the four sides, the area in plan view of the region where the electrode pads and connection pads are arranged can be reduced. Easy. Therefore, it is possible to provide a wiring board that can be easily downsized in plan view.

  According to the electronic device of one aspect of the present invention, the electronic component is housed in the wiring board having the above-described configuration, and the electronic component is electrically connected to the electrode pad. An electronic device can be provided.

(A) is a top view which shows the wiring board and electronic device of embodiment of this invention, (b) is sectional drawing in the AA of (a), (c) is B- of (a). It is sectional drawing in a B line. It is a top view which shows the modification of the wiring board and electronic device which are shown in FIG. It is a perspective view which shows the state at the time of mounting of the electronic device shown in FIG. It is sectional drawing which shows the other modification of the wiring board shown in FIG. 1, and an electronic device.

  A wiring board and an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a plan view showing a wiring board and an electronic device according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG. ) Is a cross-sectional view taken along line BB in FIG.

  A plurality of insulating layers 2 are laminated to form an insulating substrate 1. The insulating substrate 1 has a main surface 1a (upper surface in FIG. 1) including a recess 3 in which an electronic component is accommodated. A plurality of electrode pads 4 are arranged in the recess 3 of the insulating substrate 1, and a plurality of connection pads 5 are arranged on the main surface 1a. A wiring substrate 10 is basically constituted by the insulating substrate 1, the electrode pads 4 and the connection pads 5. In the wiring board 10, a portion in the recess 3 is a portion in which the electronic component 21 is accommodated. Moreover, the frame-shaped part of the main surface 1a surrounding the recessed part 3 is a part mounted facing an external electric circuit (not shown in FIG. 1).

  An electronic component 21 is accommodated in the recess 3 of the wiring board 10 to basically constitute the electronic device 20 of the embodiment. The electronic device 20 is mounted on the external electric circuit so that the main surface 1a faces the external electric circuit, that is, upside down.

  The insulating substrate 1 is a base portion for mounting and fixing the electronic component 21. The insulating substrate 1 has a rectangular shape (rectangular shape as a whole) such as a rectangular shape in plan view, and has the main surface 1a (upper surface) as described above. The main surface 1 a of the insulating substrate 1 is provided with a recess 3 for accommodating the electronic component 21. The electronic component 21 has a rectangular shape such as a square shape in plan view, and has a flat plate shape as a whole.

  The recess 3 has a rectangular shape in plan view, and is slightly larger than the electronic component 21 that is also rectangular, for example. Therefore, the rectangular electronic component 21 can be efficiently accommodated in the recess 3 while keeping the area of the recess 3 and the insulating substrate 1 in plan view as small as possible.

  The insulating substrate 1 is formed by laminating a plurality of insulating layers 2 in the thickness direction (up and down) as described above. The insulating layer 2 has a function of ensuring a space for providing conductor portions such as the plurality of electrode pads 4 and the plurality of connection pads 5. The conductor portion includes, for example, a wiring conductor 6 for electrically connecting the electrode pad 4 and the connection pad 5 to each other.

In the wiring board 10 of the embodiment (example shown in FIG. 1), the wiring conductor 6 includes a through conductor (no sign as a through conductor) that penetrates the insulating layer 2 in the thickness direction. That is, the wiring conductor 6 may include a through conductor (so-called via conductor). In this example, a part of the wiring conductor 6 provided between the insulating layers 2 is directly connected to the end portion of the electrode pad 4. In other words, the portion of the wiring conductor 6 of the conductive path including the continuous electrode pad 4 and wiring conductor 6 extends between the insulating layers 2, that is, inside the insulating substrate 1. As a result, the wiring conductor 6 as a conductive path that electrically connects the electrode pad 4 and the connection pad 5 to each other is efficiently disposed inside the insulating substrate 1.

  The wiring conductors 6 are provided on the plurality of insulating layers 2, and these insulating layers 2 are stacked on each other, so that a space for forming the wiring conductors 6 is sufficiently ensured inside and on the surface of the insulating substrate 1.

  The electrode pad 4 is disposed in the recess 3 along the outer periphery P1 on the side of the pair of sides facing each other of the rectangular recess 3. The individual electrode pads 4 in the wiring board 10 of the embodiment have a rectangular shape, and are arranged side by side so that their long sides are adjacent to each other. An electronic component 21 accommodated in the recess 3 is electrically connected to the electrode pad 4 via a conductive connecting material such as a bonding wire 22.

  The plurality of connection pads 5 are arranged in a frame-like portion surrounding the recess 3 in the main surface 1 a of the insulating substrate 1. Specifically, the plurality of connection pads 5 are arranged on the main surface 1 a of the insulating substrate 1 along the outer periphery of the other pair of sides of the rectangular recess 3 facing each other. These connection pads 5 are electrically connected to an external electric circuit via a conductive connection material (not shown in FIG. 1) such as solder.

  The electrode pad 4 and the connection pad 5 are electrically connected to each other through the wiring conductor 6 to form a conductive path that electrically connects the electronic component 21 housed in the recess 3 and the external electric circuit. Yes.

  The insulating substrate 1 is formed of a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, or a mullite sintered body. If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. That is, first, raw material powders such as aluminum oxide and silicon oxide are formed into a sheet shape together with an appropriate organic binder and an organic solvent to produce a square sheet-like ceramic green sheet. Thereafter, a plurality of the ceramic green sheets cut and molded to an appropriate size are stacked, and the stacked substrates are fired at a temperature of 1300 to 1600 ° C., whereby the insulating substrate 1 can be manufactured. The plurality of fired ceramic green sheets become the insulating layers 2 of the insulating substrate 1 respectively.

  The electrode pad 4, the connection pad 5 and the wiring conductor 6 are made of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt, or an alloy material containing these metal materials. Is formed. Such a metal material or the like is provided on the surface of the insulating layer 2 as a metal layer such as a metallized layer or a plating layer.

  When the electrode pad 4, the connection pad 5 and the wiring conductor 6 are, for example, a tungsten metallized layer, a metal paste prepared by mixing tungsten powder with an organic solvent and an organic binder is used as the insulating layer 2 of the insulating substrate 1. It can be formed by a method of printing and firing by a method such as a screen printing method on the surface of the ceramic green sheet to be formed or in a through-hole provided in advance. This metallized layer is formed by further depositing a plating layer such as nickel or gold by a plating method such as an electrolytic plating method or an electroless plating method in a portion exposed on the outer surface such as the main surface 1a of the insulating substrate 1. There may be.

In addition, the through conductor portion of the wiring conductor 6 is also filled with the above metal paste in the through hole of the ceramic green as described above by a method such as a screen printing method using vacuum suction, and is simultaneously fired. Can be formed.

  Examples of the electronic component 21 include a semiconductor integrated circuit element such as an IC or LSI, an optical semiconductor element such as an LED (light emitting diode), PD (photodiode), or CCD (charge coupled device), a current sensor element, or a magnetic sensor element. And various electronic elements such as a micromachine (so-called MEMS element) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Further, the electronic component 21 may be a piezoelectric element, a capacitive element, a resistor, or the like, and may include a plurality of types.

  For example, if the electronic component 21 is a current sensor element, it is possible to detect the magnitude of a current flowing through another conductor (not shown) disposed close to the electronic device 20. In this case, it is possible to detect (so-called monitoring or the like) the electrical state of another electronic component or electronic device (for example, a battery, a generator, a motor, or an inverter) that is electrically connected to another conductor. . Further, if the electronic component 21 is a magnetic sensor element, it is possible to detect fluctuations in the current flowing through other conductors (electromagnetic numerical fluctuations accompanying fluctuations) and the like. In this case, the electromagnetic state of an external electronic component (for example, a transmitter or an antenna) that is electrically connected to another conductor can be detected.

  The electronic component 21 is accommodated in the wiring board 10 and the electronic device 20 is manufactured, for example, as follows. That is, first, the electronic component 21 is bonded to the bottom surface of the recess 3 with a bonding material such as an adhesive or a low melting point brazing material. Next, the electronic component 21 and the wiring conductor 6 are electrically connected by a conductive connecting material such as a bonding wire 22. Thereafter, if necessary, the recess 3 is sealed with a lid or a sealing material such as a sealing resin (not shown in FIG. 1), and the electronic component 21 is hermetically sealed in the recess 3. Thus, the electronic device 20 can be manufactured. The electronic component 21 may be sealed by means other than those described above depending on the type, and may not be sealed.

  In the wiring board 10 and the electronic device 20 according to the embodiment, a plurality of electrode pads 4 are arranged in the recess 3 of the insulating substrate 1 along the outer periphery P1 of the pair of sides facing each other of the recess 3. A plurality of connection pads 5 are arranged on the main surface 1a of the insulating substrate 1 along the outer periphery P2 on the other pair of sides of the recess 3 facing each other.

  According to the wiring board 10 of this embodiment, the plurality of electrode pads 4 and the plurality of connection pads 5 arranged respectively are divided into a pair of sides of the rectangular recess 3 and another pair of sides. Are arranged. Therefore, for example, as compared with a case where electrode pads and connection pads are arranged on each of the four sides (not shown), a plan view of a region where each of the electrode pads 4 and connection pads 5 is arranged The area at is kept small. Therefore, it is possible to provide the wiring board 10 that can be easily reduced in size in plan view.

  Further, according to the electronic device 20 of this embodiment, the electronic component 21 is housed in the wiring board 10 having the above-described configuration, and the electronic component 21 is electrically connected to the electrode pad 4. It is possible to provide the electronic device 20 that can be easily miniaturized.

  Since the connection pad 5 is directly connected to the external electric circuit, a difference in thermal expansion coefficient such as a linear expansion coefficient between the wiring board 10 (particularly the insulating substrate 1) and the external board on which the external electric circuit is provided. The thermal stress due to the concentration is likely to act. Therefore, it is desirable that the connection pad 5 can increase the amount of the bonding material when connected to the external electric circuit 32. In order to secure the amount of the bonding material, the area of the connection pad 5 is larger than that of the electrode pad 4, for example.

  In order to make the area of the connection pad 5 relatively large, it is necessary to increase the area of the main surface 1a of the insulating substrate 1 on which the plurality of connection pads 5 are arranged. In order to secure the area, the length of the outer periphery P2 on the other pair of sides of the recess 3 may be made longer than the length of the outer periphery P1 on the other side of the pair of recesses 3.

  In this case, as in the example shown in FIG. 1, if the electronic component 21 has a square shape in plan view, the length of the outer periphery P <b> 1 on the pair of sides of the recess 3 and the outer periphery P <b> 2 on the other pair of sides Depending on the difference (P2−P1), the length of the region where the electrode pads 4 are arranged in the recess 3 (that is, the length of the electrode pads 4) may be adjusted. For example, the difference in length (P2−P1) and the length of each electrode pad 4 may be set to the same degree. The length of the electrode pad 4 means the distance from the outer peripheral position of the recess 3 to the tip position of the electrode pad 4 in the recess 3 in plan view.

  In addition, the wiring board 10 and the electronic device 20 of the embodiment have a rectangular shape in which the recess 3 has a long side and a short side in plan view. Among these, a plurality of electrode pads 4 are arranged in the recess 3 along the outer periphery on the short side. A plurality of connection pads 5 are arranged on the main surface 1 a of the insulating substrate 1 along the outer periphery on the long side. That is, in the example shown in FIG. 1, the outer periphery on the pair of sides of the recess 3 described above is the outer periphery on the short side, and the outer periphery on the other pair of sides of the recess 3 is the outer periphery on the long side.

  In this case, the connection pads 5 having a larger area than the electrode pads 4 are arranged on the long side, which is advantageous in increasing the area of each connection pad 5. Therefore, it is possible to provide the wiring board 10 that can be easily reduced in size in plan view. In this example, when the electronic component 21 described above has a square shape in plan view, the length of the outer periphery P2 on the other pair of sides of the recess 3 is longer than the length of the outer periphery P1 on the side of the pair of recesses 3. This is an example in the case where the length is made longer.

  In addition, the wiring board 10 and the electronic device 20 according to the embodiment have a rectangular shape in which the concave portion 3 has a long side and a short side in plan view, and a portion surrounding the concave portion 3 of the main surface 1a (hereinafter referred to as a frame-like portion). Is larger in the portion along the outer periphery on the long side of the recess 3 than in the portion along the outer periphery on the short side of the recess 3. In other words, the frame-like portion has a width W2 on the long side larger than a width W1 on the short side.

  Since the connection pads 5 are arranged in the portion where the width of the frame-like portion is relatively large, it is easy to make the area of each connection pad 5 relatively large. When the electronic device 20 is mounted on an external electric circuit, thermal stress due to the difference in thermal expansion coefficient between the electronic device 20 and the external electric circuit (external substrate or the like) acts on the connection pad 5 portion. On the other hand, if the area of the connection pad 5 is relatively large as described above, the connection pad 5 and the external electric circuit can be bonded with a more sufficient amount of bonding material. Therefore, mechanical and electrical breakdown of the connection between the connection pad 5 and the external electric circuit due to thermal stress is effectively suppressed.

  In addition, when the areas of the plurality of connection pads 5 are approximately equal to each other, the length of the main surface 1a of the insulating substrate 1 along the outer periphery P2 on the other pair of sides can be kept relatively short. Easy. Therefore, for example, the possibility that the wiring board 10 and the electronic device 20 are too long is reduced.

  FIG. 2 is a plan view showing a modification of the wiring board 10 and the electronic device 20 shown in FIG. In FIG. 2, the same parts as those in FIG. In the example shown in FIG. 2, the electronic component 21 is rectangular in plan view, and the recess 3 is square in plan view.

The concave portion 3 is formed along the outer periphery P1 of the pair of sides facing each other of the square-shaped concave portion 3 in plan view.
A plurality of electrode pads 4 are arranged inside. In addition, a plurality of connection pads 5 are arranged on the main surface 1a along the other pair of sides P 2 of the square-shaped recesses 3 facing each other in plan view.

  Also in this case, the plurality of electrode pads 4 and the plurality of connection pads 5 arranged respectively are divided into a pair of sides (P1) and another pair of sides (P2) of the rectangular recess 3. Are arranged. Accordingly, it is possible to provide the wiring board 10 in which the area in plan view of the region where the electrode pads 4 and the connection pads 5 are arranged can be kept small, and the size can be easily reduced in plan view.

  In addition, since the electronic device 20 of this embodiment includes the wiring board 10 having the above-described configuration, it is possible to provide the electronic device 20 that can be easily reduced in size in plan view.

  In the example shown in FIG. 2, a plurality of electrode pads 4 are arranged along the short side of the rectangular electronic component 21 in plan view, and a plurality of connection pads are arranged along the short side and long side of the electronic component 21. 5 are arranged. Further, the width of the portion surrounding the recess 3 of the main surface 1a is larger in the portion along the outer periphery P2 on the other pair of sides of the recess 3 than the portion along the outer periphery P1 on the other side of the recess 3 Is big. Also in this case, it is easy to reduce the size of the insulating substrate 1 while ensuring a sufficiently large area of the connection pad 5. That is, it is effective for reducing the size of the wiring board 10 in plan view.

  FIG. 3 is a perspective view showing a state when the electronic device 20 shown in FIG. 1 is mounted. In FIG. 3, the same parts as those in FIG.

  As in the example illustrated in FIG. 3, the electronic device 20 is used by being electrically connected to an external electric circuit 32 included in the external substrate 31. In the example shown in FIG. 3, the connection pad 5 and the external electric circuit 32 of the external substrate 31 face each other, and are electrically connected to each other via a connection material (not shown in FIG. 3) such as solder or conductive adhesive. Connected. In the example shown in FIG. 3, as schematically shown by an arrow C, the electronic device 20 is turned upside down and mounted (mounted) on the external substrate 31. The external substrate 31 (external electrical circuit 32 or the like) has functions such as analysis of signals transmitted from the electronic component 21 accommodated in the electronic device 20, for example. The external substrate 31 may be mounted with other electronic components or electronic devices (not shown) for the analysis.

In addition, after the electronic device 20 is mounted on the external substrate 31, the main surface (the lower surface in FIG. 3) opposite to the main surface 1a of the insulating substrate 1 included in the electronic device 20 (not shown) (not shown) or in the vicinity thereof is shown in FIG. The external circuit conductor 41 may be arranged in the form indicated by the arrow D. The external circuit conductor 41 is, for example, a bus bar. In this case, the electronic device 20 is electrically connected to another electronic component or an electronic device (not shown) through the external circuit conductor 41 to form an electronic module (no symbol). Such an electronic module constitutes a part of a power module such as an inverter including an IGBT (Insulated Gate Bipolar Transistor) or an ECU (Engine Control Unit).

  The external circuit conductor 41 does not have to be directly electrically connected to the electronic device 20. For example, the external circuit conductor 41 may be disposed at a position where the external circuit conductor 41 and the wiring conductor 6 can be electromagnetically coupled. This electromagnetic coupling enables, for example, monitoring of the external circuit conductor 41 and other electronic components or electronic devices electrically connected thereto.

When the external circuit conductor 41 is disposed on or near the main surface opposite to the main surface 1a of the insulating substrate 1 (hereinafter simply referred to as the opposite main surface), It is desirable that the wiring conductor 6 is not disposed on the insulating layer 2 (2A) closest to the opposite main surface. Thereby, the electrical insulation between the wiring conductor 6 and the external circuit conductor 41 can be improved. Therefore, the electronic device 20 with higher reliability can be provided. In addition, it is possible to provide the wiring board 10 in which the electronic device 20 can be easily manufactured.

  That is, since the wiring conductor 6 is not disposed in the insulating layer 2 (2A) closest to the external circuit conductor 41, the wiring conductor 6 and the external electric circuit 32 are at least as much as the thickness of the insulating layer 2 (2A). By increasing the distance between them, the electrical insulation between them can be improved. In this case, even if a gap is generated in both the insulating layer 2 (2A) closest to the opposite main surface and the other insulating layer 2 in contact with the insulating layer 2 (2A), the positions of these gaps are the same position in plan view. The possibility of becoming is very small. Therefore, the possibility that the electrical insulation between the wiring conductor 6 and the outside is lowered due to these gaps connecting with each other vertically is very small.

  FIG. 4 is a sectional view showing another modification of the wiring board 10 and the electronic device 20 shown in FIG. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. The connection pad 5 of the electronic device 20 and the external electric circuit 32 of the external substrate 31 are electrically and mechanically connected to each other via a conductive connection material 33 such as solder. In the example shown in FIG. 4, the inner peripheral portion and the outer peripheral portion of the frame-shaped portion surrounding the recess 3 in the main surface 1 a (lower surface in FIG. 4) of the insulating substrate 1 are inclined surfaces.

  In the example shown in FIG. 4, a lid body 23 that closes the recess 3 is joined to the inclined surface (without reference numeral) of the insulating substrate 1 on the inner periphery of the recess 3. An electronic component 21 is hermetically sealed in a hollow state in a space (not indicated) formed between the lid 23 and the recess 3.

  When the lid 23 and the insulating substrate 1 are joined by a joining material (not shown) containing a low-melting-point brazing material such as a gold-tin brazing material, the joining material is used as the inclined surface and the lid 23. Can be effectively accumulated during Therefore, it is easy to bond the lid body 23 and the insulating substrate 1 to each other through a sufficient amount of bonding material.

  In addition, a part of the connection pad 5 extends on the inclined surface (without reference numeral) of the insulating substrate 1 on the outer periphery of the recess 3. In this case, the amount of the conductive connection material 33 connected to the connection pad 5 can be increased without increasing the area of the connection pad 5 in plan view. Therefore, it is possible to provide the electronic device 20 that is effective for downsizing and also effective for improving the connection reliability with respect to the external electric circuit 32. Further, it is possible to provide the wiring board 10 in which the electronic device 20 can be easily manufactured.

  The wiring substrate 10 in which the inner peripheral portion and the outer peripheral portion of the frame-shaped portion surrounding the concave portion 3 on the main surface 1a (lower surface in FIG. 4) of the insulating substrate 1 are inclined surfaces is, for example, the concave portion 3 of the insulating substrate 1. A method of forming an inclined surface by subjecting the inner peripheral portion and the outer peripheral portion of the portion surrounding the surface to mechanical polishing or the like can be used. Further, a predetermined portion of the ceramic green sheet that becomes the insulating substrate 1 may be subjected to mechanical grinding to form an inclined surface.

  Only one of the inner peripheral portion and the outer peripheral portion of the frame-shaped portion surrounding the recess 3 in the main surface 1a of the insulating substrate 1 may be an inclined surface. In this case, the effect of improving the bonding property between the lid 23 and the insulating substrate 1 or improving the connection reliability to the external electric circuit 32 can be obtained at the inner peripheral portion or the outer peripheral portion.

  Further, for example, the inclination angle at the inner peripheral portion of the frame-shaped portion surrounding the recess 3 in the main surface 1a of the insulating substrate 1 may be different from the inclination angle at the outer peripheral portion. For example, the lid 23 may be easily joined by increasing the angle of inclination in the inner peripheral portion (by bringing it closer to the horizontal).

  The wiring board and electronic device of the present invention are not limited to the above embodiments, and various modifications are possible within the scope of the gist of the present invention. For example, a mark (not shown) for alignment with the external substrate 31 may be provided on the outer surface of the insulating substrate 1. As the alignment mark, for example, a pattern made of the same metal material as that of the wiring conductor 6, and a concave portion or a convex portion, etc., which can be fitted to a convex portion or a concave portion (not shown) of the external substrate. The part etc. are mentioned.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Main surface 2 (2A) ... Insulating layer 3 ... Recess 4 ... Electrode pad 5 ... Connection pad 6 ... Wiring conductor
10 ... wiring board
20 ... Electronic device
21 ... Electronic components
22: Bonding wire
31 ... External board
32 ... External electric circuit
41 ... External circuit conductor

Claims (4)

An insulating substrate having a main surface including a rectangular recess in plan view, in which an electronic component is accommodated in the recess;
A plurality of electrode pads arranged in the recess of the insulating substrate along the outer periphery of a pair of sides facing each other of the recess,
A plurality of connection pads arranged on the main surface of the insulating substrate along the outer periphery of the other pair of sides facing each other of the recess ,
The wiring board , wherein the plurality of electrode pads and the plurality of connection pads are separately arranged on the pair of side sides and the other pair of side sides of the rectangular recess . In the plan view, the concave portion has a rectangular shape having a long side and a short side, the outer periphery on the pair of sides is the outer periphery on the short side, and the outer periphery on the other pair of sides is on the long side The wiring board according to claim 1, wherein the wiring board is an outer periphery. The width of the portion surrounding the concave portion of the main surface is larger in the portion along the outer periphery on the long side of the concave portion than in the portion along the outer periphery on the short side of the concave portion. Wiring board as described in. The wiring board according to any one of claims 1 to 3,
An electronic device comprising: an electronic component housed in the recess and electrically connected to the plurality of electrode pads.

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