JP6193753B2 - Imaging device mounting substrate and imaging device - Google Patents

Description

The present invention relates to an imaging element mounting substrate and an imaging apparatus on which an imaging element such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type is mounted.

  2. Description of the Related Art Conventionally, an imaging apparatus in which an image sensor such as a CCD type or a CMOS type is mounted on an image sensor mounting substrate is known. The imaging device mounting substrate includes an insulating base having an opening and a metal flat plate attached to an edge around the opening. An imaging element is mounted inside the opening, and the opening is sealed with an optical filter or the like. The metal flat plate has an outer region located outside the outer edge of the insulating base when viewed in plan. A plurality of through holes are provided in the outer region. A screw or the like is passed through the through hole, and the imaging element mounting substrate is fixed to the housing side having the lens (see, for example, Patent Document 1).

  Some image pickup devices are provided with a light receiving unit that receives light and a signal processing unit (including a signal transfer unit, an amplification circuit unit, and the like) that performs signal processing of electricity converted by the light receiving unit. The signal processing unit can be a heat generating unit that generates heat when the image sensor is operated.

JP 2008-026563 A

  As described above, the image sensor is mounted inside the opening of the insulating base of Patent Document 1. Here, in the conventional image sensor, the heat generating part is located on both sides in a plane perspective, but in recent years, an image sensor in which the heat generating part is biased to one end in a plane perspective has come out, Such an image sensor has an uneven temperature distribution inside. This causes a difference in the extension of the image between the high temperature region and the low temperature region, and there is a concern that the quality of the captured image is deteriorated.

  An object of the present invention is to provide an image pickup device mounting substrate and an image pickup apparatus for efficiently suppressing an uneven temperature distribution inside the image pickup device and outputting a high-quality image.

An imaging element mounting substrate according to an aspect of the present invention includes an imaging element mounting portion, and an insulating substrate having a first side and a second side facing each other across the imaging element mounting portion when viewed from above. And a metal flat plate provided on the main surface of the insulating base and having an outer region located outside the outer edge of the insulating base when viewed from above, and an imaging element having a heat generating portion includes the heat generating element. It is mounted on the image sensor mounting portion so that the portion is located on either one side of the first region or the second region, and at least one joint surface of the insulating base and the metal flat plate is on the opposite side The outer region has a first region on the first side and a second region on the second side, and the first region and The second regions have different areas.

  An imaging apparatus according to an aspect of the present invention includes the above-described imaging element mounting substrate, the imaging element mounted on the imaging element mounting portion, and a transparent lid disposed at a position overlapping the imaging element in a plan view. And having.

According to said structure, an outer side area | region has the 1st area | region in the 1st edge | side side, and the 2nd area | region in the 2nd edge | side side. Since they are different, the amount of heat released from the imaging element mounting substrate to the outside through the metal flat plate can be made different, so that it is possible to efficiently suppress the deviation of the temperature distribution. Therefore, a high quality image can be output.

(A) is a top view which shows the external appearance of the imaging device which concerns on the 1st Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 2nd Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the image pick-up element mounting board | substrate which concerns on the 3rd Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 4th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 5th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 6th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 7th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 8th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a). (A) is a top view which shows the external appearance of the imaging device which concerns on the 9th Embodiment of this invention, (b) is sectional drawing corresponding to the XX line of (a).

  Hereinafter, an imaging element mounting substrate and an imaging apparatus according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  In the description of each embodiment and the like, components that are the same as or similar to those already described may be denoted by the same reference numerals and description thereof may be omitted.

(First embodiment)
Note that the image sensor mounting substrate 1 may have either direction upward or downward, but for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is defined as the upper surface. Or use the word on the bottom.

  With reference to FIG. 1, an imaging element mounting substrate 1 and an imaging apparatus according to a first embodiment of the present invention will be described. The imaging element mounting substrate 1 in the present embodiment has an insulating base 2 and a metal flat plate 4. In the example shown in FIG. 1, the metal flat plate 4 has an opening in the center. The opening overlaps with the recess 8 in a top view. In addition, the imaging apparatus according to the present embodiment includes an imaging element mounting substrate 1 and an imaging element 10.

  As shown in FIG. 1A, the insulating base 2 has an image sensor mounting portion 13, and when viewed from above, the first side 2A and the second side 2B that are opposed to each other with the image sensor mounting portion 13 interposed therebetween. Have The insulating base 2 has a third side 2C and a fourth side 2D adjacent to the first side 2A and the second side 2B. The image sensor 10 is mounted on the image sensor mounting portion 13.

The insulating base 2 is made of, for example, an electrical insulator such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. A plurality of substantially rectangular insulating layers made of plastics such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, or fluororesin such as tetrafluoroethylene resin. Is formed.

  As shown in FIG. 1B, the insulating base 2 has a frame portion 2a and a base portion 2b provided on the lower surface of the frame portion 2a. In this example, the frame portion 2a is an insulator layer having an opening in the center, and the base portion 2b is an insulator layer having no opening, and the opening inner peripheral surface of the frame portion 2a and the upper surface of the base portion 2b. A recess 8 is provided.

  The insulator layer forming the frame 2a may be two layers as shown in FIG. 1, or may be a single layer or three or more layers. In the example shown in FIG. 1, there are two insulator layers forming the frame portion 2a. By making the area of the edge of the lower layer larger than that of the upper layer, a step is provided between the upper surface of the lower layer and the inner peripheral surface of the upper layer. It has been. An image sensor connection pad 3 is provided on the upper surface of the lower layer constituting the step. In the frame 2a, the area of the lower edge may be the same as the area of the upper edge.

  In FIG.1 (b), the insulator layer which forms the base 2b has the image pick-up element mounting part 13 inside the frame part 2a on the upper surface. The insulator layer forming the base portion 2b may be two or more layers like the frame portion 2a. The image sensor 10 is mounted on the image sensor mounting portion 13. In the example shown in FIG. 1, an external terminal 9 is provided on the lower surface of the base 2b. A wiring conductor may be provided inside the insulating base 2, and the external terminal 9 and the imaging element connection pad 3 may be electrically connected by the wiring conductor. The external terminal 9 may be provided on the side surface or the upper surface of the insulating base 2.

  In the example shown in FIG. 1, the imaging element connection pad 3 is provided on the upper surface of the lower layer constituting the step of the frame portion 2a, but may be provided on the upper surface of the base portion 2b. A plurality of imaging element connection pads 3 may be provided at the step. Further, the plurality of imaging element connection pads 3 may be provided at one step, or may be provided at a plurality of steps.

  The external terminal 9 and the image sensor connecting pad 3 are made of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu) when the insulating base 2 is made of electrically insulating ceramics. It consists of metallization. The external terminal 9 and the image sensor connecting pad 3 are made of copper (Cu), gold (Au), aluminum (Al), nickel (Ni), chromium (Cr), when the insulating base 2 is made of resin. It consists of metal materials such as molybdenum (Mo) or titanium (Ti) and alloys thereof.

The image sensor connection pad 3 and the external terminal 9 are protected to prevent oxidation, and the image sensor connection pad 3 and the external terminal 9 are exposed to improve electrical connection with the image sensor 10 and the external circuit board. Alternatively, a Ni plating layer having a thickness of 0.5 to 10 μm may be deposited on the surface to be coated, or this Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be sequentially deposited.

  The metal flat plate 4 is provided on the main surface of the insulating base 2 and has an outer region 5 positioned outside the outer edge of the insulating base 2 when viewed from above. The outer region 5 has a first region 5a on the first side 2A side and a second region 5b on the second side 2B side. The first region 5a and the second region 5b have different areas. The area here refers to the surface area of the metal flat plate 4.

In the example shown in FIG. 1, the main surface of the insulating substrate 2 is the upper surface of the frame portion 2a. The first region 5a is the first side 2A side from the center line YY that bisects the third side 2C and the fourth side 2D adjacent to the first side 2A and the second side 2B. The region of the metal flat plate 4 existing in Similarly, the second region 5b is the second side from the center line YY that bisects the third side 2C and the fourth side 2D adjacent to the first side 2A and the second side 2B. It means the region of the metal flat plate 4 existing on the 2B side.

  In the metal flat plate 4, the areas of the first region 5a and the second region 5b of the outer region 5 are different from each other. As described above, when the areas of the first region 5a and the second region 5b are made different from each other, when the heat generated when the imaging device 10 operates is radiated through the insulating base 2 and the metal flat plate 4, The heat dissipation can be made different from each other. Therefore, it is possible to suppress the deviation of the heat distribution inside the image sensor, and to reduce the occurrence of defects in the received image. Here, the areas of the first region 5a and the second region 5b are desirably determined in consideration of the heat generation amount of the heat generating portion T.

When the insulating base 2 is made of an electrically insulating ceramic, the metal flat plate 4 is made of a metal such as stainless steel (SUS), Fe—Ni—Co alloy, 42 alloy, copper (Cu), or copper alloy. In particular, it is preferable that the metal flat plate 4 is made of a material having high thermal conductivity such as copper because heat dissipation becomes high. Here, the case of using the thermal expansion rate of about 5~10 (× 10 ^-6 / ℃) sintered aluminum oxide as the insulating substrate 2, the metal flat plate 4, the thermal expansion coefficient of about 10 (× 10 ^{- 6} / ° C.) stainless steel (SUS410) or the like, the thermal expansion difference between the insulating base 2 and the metal flat plate 4 is reduced during use, so that the distortion of the image pickup device mounting substrate 1 is small, so that good imaging can be performed. it can.

  The metal flat plate 4 and the insulating base 2 are joined by a joining member (not shown). If a bonding member that does not change depending on the temperature at which the image pickup device 10 is mounted or the temperature at which the image pickup device 10 is operated is used, the insulating base 2 and the metal flat plate 4 are attached when the image pickup device 10 is mounted or at the time of operation. Peeling can be reduced.

  The metal flat plate 4 preferably has a through hole 6 or a notch 7 in the outer region. Thereby, for example, when the size of the first region 5a and the second region 5b is approximately the same, by providing the metal plate 4 with the through hole 6 and the notch 7, the first region 5a. Since the surface areas of the second region 5b and the second region 5b can be made different, the heat radiation property of the outer peripheral region 5 can be made different without changing the size of the outer region 5. Further, the through holes 6 and the notches 7 provided in the first region 5a and the second region 5b are positioning holes or imaging when mounting the imaging device 10 or the lens housing on the imaging device mounting substrate 1. It can also be used as a hole for fixing the element mounting substrate 1 and the lens housing.

  At least one of the through holes 6 is preferably circular. This is because it is preferable in terms of convenience that the shape of the through hole 6 matches the cross-sectional shape of the screw or the like when the metal flat plate 4 is mounted on the lens housing through the screw or the like in the through hole 6.

  At least one of the through holes 6 has an elliptical shape or an oval shape having parallel sides, and at least one of the notches 7 has an elliptical shape or a shape obtained by cutting an oval shape having parallel sides. Alternatively, if it is U-shaped, it can also be used as a hole for adjusting a jig, a screw or the like when positioning.

  It is preferable that at least one of the bonding surfaces of the insulating base 2 and the metal flat plate 4 has a larger surface roughness than the opposite surface. Thereby, the surface area of the joining surface between the insulating base 2 and the metal flat plate 4 can be increased, and the joining strength between the insulating base 2 and the metal flat plate 4 can be increased. In addition, since the surface area of the joint surface between the insulating base 2 and the metal flat plate 4 can be increased, the heat transfer from the insulating base 2 to the metal flat plate 4 can be enhanced.

An image sensor 10 is mounted on the image sensor mounting portion 13 of the image sensor mounting substrate 1. The image sensor 10 is, for example, a CCD image sensor or a CMOS image sensor. In the example shown in FIG. 1, each electrode of the image sensor 10 is electrically connected to the image sensor connection pad 3 by a connecting member 12 (bonding wire). As the connection member 12, a gold bump or solder is used in addition to the bonding wire.

  In FIG. 1, the image sensor 10 has a heat generating portion T. Further, the image pickup device 10 having the heat generating portion T may be mounted on the image pickup device mounting portion 13 so that the heat generating portion T is located on one side of the first region 5a or the second region 5b. In the example shown in FIG. 1, the heat generating portion T is located on the first region 5a side. In FIG. 1, the heat generation point t is also present on the second region 5 b side, but the side having the maximum overall heat generation amount is referred to as a “heat generation portion T” as the main heat generation portion. The case where the total heat generation amount is maximum is, for example, the case where the number of heat generation points t is maximum, or the case where the surface area of the heat generation point t is maximum even if the number is the same. The heat generating part T (heat generating point t) is a signal processing part (including a signal transfer part, an amplifier circuit part, etc.) that performs signal processing on electricity converted by a light receiving part (not shown) of the image sensor 10.

  As in the example shown in FIG. 1, it is preferable that the heat generating portion T is located on the first region 5a side and the area of the first region 5a is larger than the area of the second region 5b. In this case, most of the heat generated in the heat generating portion T can be released to the outside from the first region 5a having a larger area than the second region 5b. On the other hand, since the area of the second region 5b is smaller than that of the first region 5a, more heat is not released outside as much as the first region 5a. Therefore, in the imaging element 10, heat is efficiently radiated on the first region 5a side where the heat generating portion T is present and heat is likely to be high, and on the second region 5b side where heat is originally not as high as the heat generating portion T is on the first region 5a side. Since the heat is not so radiated, the temperature inside the image pickup device 10 can be brought close to a uniform state as a whole.

  Next, the manufacturing method of the image pick-up element mounting substrate 1 of this embodiment is demonstrated.

(1) First, a ceramic green sheet that forms the frame 2a and the base 2b constituting the insulating base 2 is formed. For example, in the case of obtaining an insulating base 2 that is an aluminum oxide (Al ₂ O ₃ ) -based sintered body, silica (SiO ₂ ), magnesia (MgO), or calcia (as a sintering aid) is added to Al ₂ O ₃ powder. A powder such as CaO) is added, an appropriate binder, a solvent and a plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

  When the insulating substrate 2 is made of, for example, a resin, the insulating substrate 2 can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. . The insulating substrate 2 may be a substrate made of glass fiber impregnated with resin, such as glass epoxy resin. In this case, the insulating substrate 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermosetting the epoxy resin precursor at a predetermined temperature.

  (2) A metal paste is applied and filled into the ceramic green sheet obtained by screen printing or the like on the portions to be the imaging device connection pads 3, the internal wiring conductors, and the external terminals 9. This metal paste is fired at the same time as the ceramic green sheet to be the insulating base 2, so that the imaging element connecting pad 3 provided at the step, the external terminal 9 provided on the lower surface or inside the insulating base 2, or the internal Wiring conductors including wiring and through conductors are formed. This metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and a binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading. The metal paste may contain glass or ceramics in order to increase the bonding strength with the insulating substrate 2.

  (3) A ceramic green sheet laminate is produced by laminating and pressing the ceramic green sheets to be the respective insulating layers.

  (4) The ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece substrate in which a plurality of insulating substrates 2 including a frame portion 2a and a base portion 2b are arranged. By this step, the above-described metal paste becomes the image sensor connection pad 3, the external terminal 9, or the wiring conductor.

  (5) The multi-piece substrate obtained by firing is divided into a plurality of insulating bases 2. In this division, a dividing groove is formed in a multi-piece substrate along a portion serving as an outer edge of the insulating substrate 2, and the insulating substrate 2 is divided by a method of breaking and dividing along the dividing groove or a slicing method. The method etc. which cut | disconnect along the location used as the outer edge of can be used. The dividing groove can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-piece substrate after firing, but the cutter blade can be pressed against the ceramic green sheet laminate for the multi-piece substrate, or the slicing device May be formed by cutting smaller than the thickness of the ceramic green sheet laminate.

  (6) A metal flat plate 4 to be bonded to the main surface of the insulating base 2 is prepared. The metal flat plate 4 is produced by forming a central opening or an outer peripheral through-hole 6 or a notch 7 on a metal plate material by punching or etching using a conventionally known stamping mold. Is done. Thereafter, when the metal flat plate 4 is made of a metal such as Fe—Ni—Co alloy, 42 alloy, Cu, or copper alloy, a nickel plating layer and a gold plating layer may be deposited on the surface thereof. Thereby, the oxidative corrosion of the surface of the metal flat plate 4 can be effectively prevented.

(7) A step of bonding the metal flat plate 4 to the insulating base 2 via the bonding member. In this step, a paste-like thermosetting resin is applied to one of the joint surfaces of the insulating substrate 2 or the metal flat plate 4 by a screen printing method, a dispensing method, or the like, and dried in a tunnel type atmosphere furnace or oven. Then, the insulating substrate 2 and the metal flat plate 4 are overlapped and passed through a tunnel-type atmosphere furnace or oven, and heated at about 150 ° C. for about 90 minutes to completely thermoset the joining member, and the insulating substrate 2 And the metal flat plate 4 are firmly bonded.

  At this time, for example, by using the through hole 6 provided in the metal flat plate 4 and the frame portion 2a of the insulating base 2 as a reference, alignment at the time of joining can be facilitated. In addition, when mounting the imaging element 10 on the imaging element mounting substrate 1 or when mounting a lens housing or the like on the imaging device, the same through hole 6 is used as an alignment hole so that the insulating base 2 and the metal flat plate are used. 4. Insulating substrate 2 and image sensor 10, metal flat plate 4 and lens housing, image sensor 10 and lens housing can be easily aligned, and the optical axis of image sensor 10 can be easily aligned. Similarly to the through hole 6, for example, the notch 7 provided in the metal flat plate 4 and the frame portion 2 a of the imaging element mounting substrate 1 can be used as a reference.

  The joining member is, for example, a main agent made of bisphenol A type liquid epoxy resin, bisphenol F type liquid epoxy resin, phenol novolac type liquid resin, etc., a filler made of spherical silicon oxide or the like, or an acid anhydride such as tetrahydromethylphthalic anhydride. It is obtained by adding a carbon powder or the like as a curing agent mainly composed of, etc., and mixing and kneading using a centrifugal stirrer or the like to obtain a paste.

In addition, as the joining member, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative Uses epoxy resins such as epoxy resins and bisphenol skeleton type epoxy resins with curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide, etc. can do.

Moreover, low melting glass can be used for a joining member besides resin. The low-melting glass is composed of, for example, zirconium oxide silica as a filler in a glass component containing 56 to 66% by mass of lead oxide, 4 to 14% by mass of boron oxide, 1 to 6% by mass of silicon oxide, and 1 to 11% by mass of zinc oxide. What added 4-15 mass% of compounds is used. A glass paste is obtained by adding and mixing an appropriate organic solvent and solvent to the glass powder having these compositions. The above-mentioned insulating substrate is obtained by laminating and printing this glass paste to a predetermined thickness on the joining surface of either the insulating base 2 or the metal flat plate 4 by a well-known screen printing method and firing it at a temperature of about 430 ° C. The joining member is fixed to the surface of 2 or the metal flat plate 4. Thereafter, the metal plate 4 and the insulating substrate 2 are overlapped with each other and passed through a tunnel-type atmosphere furnace or oven and heated to about 470 ° C. to melt and fix the bonding member. The image sensor mounting substrate 1 is manufactured by firmly joining the flat plate 4.

  Through the steps (1) to (7), the image sensor mounting substrate 1 is obtained.

  An imaging element 10 is mounted on the imaging element mounting portion 13 of the imaging element mounting board 1 formed in this manner, and the imaging element mounting board 1 on which the imaging element 10 is mounted is an external circuit board (not shown). As a result, the image sensor 10 is electrically connected to the external circuit board via the image sensor connection pad 3, the external terminal 9, and the like.

(Second Embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a second embodiment of the present invention will be described with reference to FIG.

  The imaging apparatus according to the present embodiment is different from the imaging apparatus according to the first embodiment described above in that a through hole 6 and a notch 7 are provided in the second region 5b as in the example shown in FIG. In other words, the through hole 6 and the notch 7 are provided only in the first region 5a. Since the first region 5a has a larger area than the second region 5b and the heat generating portion T is located on the first region 5a side, the heat radiation amount from the first region 5a is the heat radiation amount from the second region 5b. The image sensor 10 is soaked in temperature. Therefore, since the expansion of the image can suppress the bias of the heat distribution in the entire image sensor 10, a high-quality image can be output.

(Third embodiment)
Next, an image sensor mounting substrate 1 according to a third embodiment of the present invention will be described with reference to FIG.

  The imaging device according to the present embodiment is different from the imaging device according to the first embodiment described above in the shape of the metal flat plate 4 and the joint location between the insulating base 2 and the metal flat plate 4.

As in the example shown in FIG. 3, the insulating base 2 does not have the frame portion 2a but has only the base portion 2b, and the metal flat plate 4 is provided on the upper surface of the base portion 2b. A recess 8 that houses the image sensor 10 is formed by the base 2b and the metal flat plate 4 having an opening. In the third embodiment, the area of the first region 5a is larger than the area of the second region 5b. By adopting such a configuration, the frame portion 2a can be omitted from the heat transfer path from the image pickup element 10 to the metal flat plate 4, so that the heat transfer path from the image pickup element 10 to the metal flat plate 4 is shortened. Therefore, it is possible to further improve the heat dissipation of the image sensor 10. Therefore, it is possible to reduce an increase in the overall temperature while suppressing unevenness of the heat distribution inside the image pickup device 10, and it is possible to reduce the occurrence of defects in the received image.

  Further, as in the example shown in FIG. 3, when the metal flat plate 4 has corner portions 41, 42, 43, 44 and the insulating substrate 2 has corner portions 21, 22, 23, 24. The corners 41 and 43 of the metal flat plate 4 are located on the extension lines of the corners 21 and 23 of the insulating base 2, and the corners 42 and 44 of the metal flat plate 4 are the corners 22 and 24 of the insulating base 2. It is preferable that it is located on the extended line of the diagonal line which connects. This facilitates alignment when mounting the image sensor 10 or when mounting the lens housing, and can reduce misalignment and the like.

(Fourth embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a fourth embodiment of the present invention will be described with reference to FIG.

  In the imaging device of the example shown in FIG. 4 in the present embodiment, the difference from the imaging device of the first embodiment described above is that the insulating base 2 does not have the base portion 2b but has only the frame portion 2a. The imaging element connection pad 3 is provided on the main surface of the insulating base 2 opposite to the main surface bonded to the metal flat plate 4. In the fourth embodiment, the area of the first region 5a is smaller than the area of the second region 5b. In the present embodiment, the lid 11 is not shown. By adopting such a configuration, the heat is transmitted from the image sensor 10 to the insulating base 2 from the image sensor 10 because the image sensor connection pad 3 and the connection member 12 are connected to the frame 2a. Therefore, it is easy to dissipate the heat generated from the heat generating portion T of the image sensor 10 into the image sensor 10, and the image sensor 10 tends to have a uniform temperature as a whole. Therefore, it is possible to suppress the deviation of the heat distribution inside the image sensor 10, and to reduce the occurrence of defects in the received image.

  Further, as in the example shown in FIG. 4, if the heat generating portion T is located on the first region 5a side and the area of the first region 5a is smaller than the area of the second region 5b, the heat generated in the heat generating portion T is generated. Since the heat radiation from the first region 5a can be suppressed, the heat generated in the heat generating portion T is moved toward the second region 5b having a larger area than the first region 5a, so that the entire image pickup device 10 is uniformly distributed. Heated. Therefore, it is possible to reduce the deviation of the heat distribution inside the image sensor 10, and to reduce the occurrence of defects in the received image.

(Fifth embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a fifth embodiment of the present invention will be described with reference to FIG.

  In the imaging apparatus according to the present embodiment, the difference from the imaging element mounting substrate 1 according to the first embodiment described above is that the auxiliary through-hole 6a is provided and the joining position between the insulating base 2 and the metal flat plate 4 is different. In the present embodiment, the lid 11 is not shown. In the example shown in FIG. 5, the metal flat plate 4 is bonded to the lower surface of the base portion 2 b of the insulating base 2, so that the overall heat radiation effect of the image pickup device mounting substrate 1 can be improved as compared with the case of bonding to the upper surface of the frame portion 2 a. It becomes possible to enlarge. From this, it is possible to reduce the increase in temperature of the entire image pickup device mounting substrate 1 while suppressing unevenness of the heat distribution inside the image pickup device 10, and to reduce the occurrence of defects in the received image. Is possible.

Further, when the metal flat plate 4 has the auxiliary through holes 6 a along the outer periphery of the insulating base 2, the deformation of the metal flat plate 4 caused by the expansion of the metal flat plate 4 due to the heat from the imaging element 10 is penetrated. It can be absorbed by the holes 6a. Therefore, it is possible to reduce deformation of the size and shape of the through hole 6a and the notch 7 outside the auxiliary through hole 6a. Therefore, it is possible to reduce the occurrence of a displacement between the lens housing and the optical axis of the image sensor 10 due to the deformation of the metal flat plate 4 due to the heat generated during the operation of the image sensor 10. At this time, as shown in FIG. 5, it is preferable that the auxiliary through-hole 6a provided in the metal flat plate 4 has an elliptical shape or an elliptical shape having parallel sides. This is because deformation due to thermal contraction of the metal flat plate 4 around the insulating base 2 is less likely to propagate outward than the auxiliary through-hole 6a, compared to the circular auxiliary through-hole 6a.

(Sixth embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a sixth embodiment of the present invention will be described with reference to FIG.

  In the imaging apparatus according to the present embodiment, the difference from the imaging element mounting substrate 1 according to the first embodiment described above is in the joining portion of the insulating base 2 and the metal flat plate 4, the shape of the metal flat plate 4, and the position of the through hole 6. is there. In the present embodiment, the lid 11 is not shown. As in the example shown in FIG. 6, the imaging device mounting substrate 1 has the insulating base 2 having only the frame portion 2 a without the base portion 2 b bonded to the upper surface of the metal flat plate 4 to form the recess 8. Yes. By adopting such a configuration, the image pickup device 10 is directly mounted on the upper surface of the metal flat plate 4 that is the bottom surface of the recess 8, so that it is easy to control heat dissipation, and while suppressing the bias of the heat distribution inside the image pickup device 10, It is possible to further reduce the increase in the overall temperature, and it is possible to reduce the occurrence of defects in the received image.

  Further, when mounting the imaging element 10 on the metal flat plate 4, it is preferable to use a mounting member such as silver epoxy having a high thermal conductivity. This is because heat dissipation can be further improved by using a mounting member having a high thermal conductivity.

  Moreover, when the notch 7 is continuously provided along the outer side of the metal flat plate 4 as in the example shown in FIG. 6, this increases the surface area of the outer region 5 and further improves the heat dissipation. Because it can.

  In the sixth embodiment, the image sensor mounting portion 13 is an internal space of the insulating base 2 that houses the image sensor 10.

(Seventh embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a seventh embodiment of the present invention will be described with reference to FIG.

  The imaging apparatus according to the present embodiment is different from the imaging element mounting substrate 1 of the sixth embodiment described above in that the metal flat plate 4 does not have the outer region 5 on the positive side and the negative side in the y direction. It is.

  In the example shown in FIG. 7, the outer region 5 of the metal flat plate 4 has a first region 5a and a second region 5b on the positive side and the negative side in the x direction. Further, since the heat generating portion T is located on the first region 5a side and the area of the first region 5a is larger than the area of the second region 2b, the heat radiation is more efficient on the first region 5a side than on the second region 2b side. The temperature distribution of the image sensor 10 can be suppressed.

  Further, as in the example shown in FIG. 7, the metal flat plate 4 does not have the outer region 5 on the positive side and the negative side in the y direction, so that the size and weight can be reduced.

(Eighth embodiment)
Next, the imaging device mounting substrate 1 and the imaging apparatus according to the eighth embodiment of the present invention will be described.
This will be described with reference to FIG.

  The imaging apparatus according to the present embodiment is different from the imaging element mounting substrate 1 of the sixth embodiment described above in that the metal flat plate 4 has an outer region 5 on the negative side in the y direction and the positive side in the x direction. It is a point not to do. This configuration can reduce the size.

  Also in the example shown in FIG. 8, the heat generating portion T is located on the first region 5a side, and the area of the first region 5a is larger than the area of the second region 2b. Therefore, the second region 2b on the first region 5a side. Efficient heat dissipation can be performed from the side, and deviation of the temperature distribution of the image sensor 10 can be suppressed.

  In addition, as in the imaging device according to the present embodiment, by providing the outer region 5 so as to surround the heat generating portion T, heat can be efficiently radiated, and a portion that does not have the heat generating portion T (insulated in the drawing). Since the outer region 5 is not provided in the point symmetric with respect to the center of the base body 2, heat radiation from the part that does not have the heat generating portion T is prevented, so that the temperature of the imaging device can be satisfactorily improved. Is possible.

(Ninth embodiment)
Next, an imaging element mounting substrate 1 and an imaging apparatus according to a ninth embodiment of the present invention will be described with reference to FIG.

  In the imaging apparatus according to the present embodiment, the difference from the imaging element mounting substrate 1 according to the seventh embodiment described above is that the metal flat plate 4 has outer regions 5 on the positive side and the negative side in the y direction, and The external terminal 9 is provided on the upper surface of the insulating base 2 on the first side 2A side. When an external flexible board or the like is connected to the external terminal 9, heat generated from the heat generating portion T is dissipated by being transmitted not only from the first region 5a but also to the external flexible board and the like.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, A various deformation | transformation is possible.

  Further, for example, the shape of the opening of the frame portion of the insulating base 2 may be a circular shape or other polygonal shape instead of a rectangular shape.

  In addition, the arrangement, number, shape, and the like of the image sensor connection pad 3 and the external terminal 9 in the present embodiment are not specified.

  In addition, the shape, arrangement, area, number, and the like of the outer region 5 of the metal flat plate 4 in this embodiment are not specified.

DESCRIPTION OF SYMBOLS 1 ... Image pick-up element mounting substrate 2 ... Insulation base 2a ... Frame part 2b ... Base 2A ... First side 2B ... Second side 2C... 3rd side 2D... 4th side 3... Image sensor connecting pad 4. 1st area | region 5b ... 2nd area | region 6 ... through-hole 6a ...... auxiliary through-hole 7 ... notch 8 ... recessed part 9 ... external terminal 10... Image sensor 11... Lid 12... Connection member 13.

Claims (7)

An insulating substrate having an image sensor mounting portion and having a first side and a second side facing each other across the image sensor mounting portion when viewed from above;
A metal flat plate provided on the main surface of the insulating base and having an outer region located outside the outer edge of the insulating base when viewed from above;
The outer region has a first region on the first side and a second region on the second side,
An image pickup device having a heat generating portion is mounted on the image pickup device mounting portion such that the heat generating portion is located on one side of the first region or the second region, and the insulating base and the metal flat plate The surface roughness of at least one of the joint surfaces is larger than that of the opposite surface,
The first region and the second region have different areas from each other. The imaging element mounting substrate according to claim 1 , wherein the heat generating portion is located on the first region side, and an area of the first region is larger than an area of the second region. The imaging element mounting substrate according to claim 1, wherein the metal flat plate has a through hole or a notch in the outer region. The imaging device mounting substrate according to claim 3, wherein at least one of the through holes is circular. At least one of the through holes is
It is oval or oval with parallel sides,
At least one of the notches is
The imaging element mounting substrate according to claim 3, wherein the imaging element mounting substrate is an elliptical shape, a shape obtained by cutting an oval shape having parallel sides, or a U shape. The imaging according to any one of claims 1 to 5, wherein the metal flat plate has an opening at a center portion and is joined to a main surface of the insulating base on the imaging element mounting portion side. Device mounting board. The imaging device mounting substrate according to any one of claims 1 to 6,
An image sensor mounted on the image sensor mounting portion;
A transparent lid disposed in a position that overlaps the imaging element in a plan view,
An imaging apparatus.

Images