JP2016103520A - Electronic component mounting package and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting package capable of preventing convergence of stress to an electronic component, and to provide an electronic device.SOLUTION: An electronic component mounting package 1 includes: a base body 2 which has a principal plane and a recess 2d formed in the principal plane; and an electronic component mounting part 11 mounted with a curved electronic component 10 formed on a bottom plane 4 of the recess 2d and an opening 2c of the recess 2d. The electronic component mounting package 1 has an arced part 2e or an inclination part 2f between the principal plane and an inner wall of the recess 2d in the electronic component mounting part 11 of the opening 2c.SELECTED DRAWING: Figure 1

Description

The present invention relates to a curved electronic component such as a CCD (Charge Coupled Device) type or CMO.
The present invention relates to an electronic component mounting package and an electronic apparatus on which electronic components such as an S (Complementary Metal Oxide Semiconductor) type imaging element and a light emitting element such as an LED (Light Emitting Diode) are mounted.

  Conventionally curved curved electronic components are known. As an electronic component mounting package for mounting curved electronic components, an insulating substrate having a mounting portion and a curved electronic component connected on the upper surface of the insulating substrate are connected. And a pad. Some mounting portions of the electronic component mounting package have through holes, and an electronic device is obtained by mounting the curved electronic component on the electronic component mounting package.

JP 2004-356175 A

  In general, in the step of wire bonding mounting a curved electronic component on an electronic component mounting package, stress is applied to the curved electronic component during wire bonding to the curved electronic component or when the curved electronic component is fixed. Therefore, in the process of mounting a curved electronic component, when the stress described above is applied to the curved electronic component, the corner contacts between the main surface of the electronic component mounting package and the inner wall of the through hole in the curved electronic component. There is a possibility that stress concentrates on the part to be done. There is a concern that distortion or cracking may occur in the curved electronic component due to the concentration of stress in the process of mounting the curved electronic component. In addition, there is a concern that the corner portion between the main surface of the electronic component mounting package and the inner wall of the through hole is cracked or broken, and the curved electronic component is not fixed well.

  An electronic component mounting package according to one aspect of the present invention includes a main surface, a base body having a recess provided in the main surface, and a curved curved shape provided in the bottom surface of the recess and the opening of the recess. And an arcuate portion or an inclined portion between the main surface and the inner wall of the recess in the electronic component mounting portion of the opening.

  An electronic device according to an aspect of the present invention includes the electronic component mounting package described above and the curved electronic component mounted on the electronic component mounting package.

The electronic component mounting package of the present invention is an electronic component on which a main surface, a base having a recess provided on the main surface, and a curved curved electronic component provided on the bottom of the recess and the opening of the recess are mounted. And an arcuate portion or an inclined portion between the main surface and the inner wall of the recess in the electronic component mounting portion of the opening. As a result, in the process of mounting the curved electronic component, stress at the time of wire bonding to the curved electronic component or fixing of the curved electronic component is caused between the main surface of the electronic component mounting package and the inner wall of the recess. It is possible to reduce the concentration of stress on the portion of the curved electronic component that contacts between the main surface of the electronic component mounting package and the inner wall of the concave portion. . Therefore, distortion to the curved electronic component,
Or generation | occurrence | production of a crack can be reduced. Further, it is possible to reduce the concentration of stress between the main surface of the electronic component mounting package and the inner wall of the recess. Therefore, it is possible to reduce the occurrence of cracks or cracks between the main surface of the electronic component mounting package and the inner wall of the recess, and the curved electronic component can be fixed favorably.

  Since the electronic device according to one aspect of the present invention includes the above-described electronic component mounting package, a crack or a crack is generated between the main surface of the curved electronic component or the electronic component mounting package and the inner wall of the recess. This can be reduced.

(A) is a top view which shows the external appearance of the electronic component mounting package and electronic device which concern on the 1st Embodiment of this invention, (b) is a longitudinal section corresponding to the AA line of (a) FIG. (A) is a top view which shows the external appearance of the electronic component mounting package which concerns on the other aspect of the 1st Embodiment of this invention, and an electronic device, (b) is the AA line of (a). It is a longitudinal cross-sectional view corresponding to. (A) is a top view which shows the external appearance of the electronic module which concerns on the 2nd Embodiment of this invention, (b) is a longitudinal cross-sectional view corresponding to the AA line of (a). It is a longitudinal cross-sectional view of the electronic component mounting package and electronic device which concern on the 3rd Embodiment of this invention. It is the longitudinal cross-sectional view of the electronic component mounting package which concerns on the other aspect of the 3rd Embodiment of this invention, and an electronic device. (A) is a top view which shows the external appearance of the electronic component mounting package and electronic device which concern on the 4th Embodiment of this invention, (b) is the other aspect of the 4th Embodiment of this invention. It is a top view which shows the external appearance of the electronic component mounting package which concerns on, and an electronic device.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an electronic component mounting package having a plurality of electronic component mounting portions is referred to as an electronic component mounting package. Further, a configuration in which a curved electronic component is mounted on an electronic component mounting package is an electronic device. The electronic component mounting package and the electronic device may be either upward or downward, but for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is defined as the upper surface. Or use the word on the bottom.

(First embodiment)
The electronic device 21 and the electronic component mounting package 1 according to the first embodiment of the present invention will be described with reference to FIGS. The electronic device 21 in this embodiment includes an electronic component mounting package 1 and a curved electronic component 10.

  In the example shown in FIG. 1, an electronic component mounting package 1 is provided on a main surface, a base 2 having a recess 2d provided on the main surface, a bottom surface 4 of the recess 2d, and an opening 2c of the recess 2d. An electronic component mounting portion 11 on which the curved curved electronic component 10 is mounted, and the arcuate portion 2e or the inner surface of the recess 2d between the main surface in the electronic component mounting portion 11 of the opening 2c. It has an inclined portion 2f.

  In the example shown in FIGS. 1-2, the base | substrate 2 has the main surface and the recessed part 2d provided in the main surface. Moreover, in the example shown in FIGS. 1-2, it has the pad 3 for a curved electronic component connection in the main surface of the base | substrate 2. As shown in FIG.

  The base 2 is formed by forming a wiring conductor described later on an insulating base. As the material of the insulating base, for example, electrically insulating ceramics or resin is used.

  Examples of the electrically insulating ceramic used as the material of the insulating substrate of the substrate 2 include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Examples include a sintered body or a glass ceramic sintered body.

  Examples of the resin used as the material of the insulating base of the base 2 include an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, or a fluorine resin. Examples of the fluorine-based resin include a polyester resin and a tetrafluoroethylene resin.

  As in the example shown in FIGS. 1 and 2, the base 2 is formed by laminating a plurality of insulating layers made of the above-described materials.

  The substrate 2 may be formed of four insulating layers as in the examples shown in FIGS. 1 and 2, or may be formed of a single layer to three layers or five or more insulating layers. In the example shown in FIGS. 1 and 2, the substrate 2 is formed of four insulating layers.

  The substrate 2 may be provided with an external circuit connection electrode on the upper surface, side surface, or lower surface. The external circuit connection electrode is provided, for example, to electrically connect the electronic device 21 to the external device or the like.

  Inside the base 2 may be provided a wiring conductor composed of a through conductor and internal wiring for conducting each insulating layer, or the base 2 may have a wiring conductor exposed on the surface. Further, the external circuit connection electrode and the curved electronic component connection pad 3 may be electrically connected by the wiring conductor. Moreover, each wiring conductor provided in each frame 2a forming the base 2 may be electrically connected by a wiring conductor exposed on the surface of each frame 2a.

  When the substrate 2 is made of an electrically insulating ceramic, the bent electronic component connecting pad 3, the external circuit connecting electrode, and the wiring conductor are tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag). ) Or copper (Cu), or an alloy containing at least one metal material selected from these. Further, the curved electronic component connecting pad 3, the external circuit connecting electrode, and the wiring conductor are copper (Cu), gold (Au), aluminum (Al), nickel (Ni) when the base 2 is made of resin. , Chromium (Cr), molybdenum (Mo), titanium (Ti), or an alloy containing at least one metal material selected from these.

  It is preferable that a plating layer is provided on the exposed surfaces of the curved electronic component connecting pad 3, the external circuit connecting electrode, and the wiring conductor. According to this configuration, the bent electronic component connecting pad 3, the external circuit connecting electrode, and the exposed surface of the wiring conductor can be protected to prevent oxidation. Moreover, according to this structure, the electrical connection through the wire bonding etc. of the curved electronic component connection pad 3 and the curved electronic component 10 can be made favorable. As the plating layer, for example, a Ni plating layer having a thickness of 0.5 to 10 μm is deposited. Alternatively, a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be deposited on the Ni plating layer.

  As in the example shown in FIGS. 1 to 2, the electronic component mounting package 1 is an electronic component on which a curved curved electronic component 10 provided on the bottom surface 4 of the recess 2 d and the opening 2 c of the recess 2 d is mounted. A mounting unit 11 is provided.

  The electronic component mounting unit 11 is a region where the curved electronic component 10 is mounted. In the example shown in FIGS. 1 to 2, the electronic component mounting portion 11 is inside the curved electronic component connecting pad 3 and overlaps with the outer edge portion of the curved electronic component 10 in a plan view, or the curved electronic component. An area outside the outer edge of the component 10 is shown. Further, the electronic component mounting portion 11 may be a region including the curved electronic component connecting pad 3.

  In the example shown in FIG. 1, an arcuate portion 2 e is provided between the main surface and the inner wall of the recess 2 d in the electronic component mounting portion 11 of the opening 2 c of the electronic component mounting package 1.

  In the example shown in FIG. 2, an inclined portion 2 f is provided between the main surface and the inner wall of the recess 2 d in the electronic component mounting portion 11 of the opening 2 c of the electronic component mounting package 1.

  The step of mounting the curved electronic component 10 by having the arcuate portion 2e or the inclined portion 2f between the main surface of the base 2 and the inner wall of the recess 2d as in the example shown in FIGS. The stress at the time of wire bonding to the curved electronic component 10 or when the curved electronic component 10 is fixed is caused by the arc-shaped portion 2e or the inclined portion between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. It is possible to reduce the concentration of stress on the portion of the curved electronic component 10 that contacts between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. Therefore, generation | occurrence | production of a distortion or a crack in the curved electronic component 10 can be reduced. Further, it is possible to reduce the concentration of stress between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d, and between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. It is possible to reduce the occurrence of cracks or cracks. Therefore, the curved electronic component 10 can be fixed satisfactorily.

  Further, as shown in FIG. 2, since the electronic component mounting package 1 has the inclined portion 2f, the shape of the lower surface of the curved electronic component 10 and the shape of the inclined portion 2f can be partially approximated. 10 can be fixed better.

  The arc-shaped portion 2e provided between the main surface of the base 2 and the inner wall of the recess 2d has a radius R of 0.05 mm or more, so that the space between the main surface of the base 2 and the inner wall of the recess 2d is between Thus, the arc-shaped portion 2e can be provided with certainty, and the stress applied to the portion in contact with the curved electronic component 10 can be more reliably reduced.

  Further, when the angle θ formed by the inclined portion 2f and the concave portion 2d is θ ≧ 110 °, the lower surface of the curved electronic component 10 is easily along the inclined portion 2f. Therefore, mounting becomes easy in the process of mounting the curved electronic component 10, and the curved electronic component 10 can be mounted stably. Further, when the angle θ formed between the inclined portion 2f and the side wall of the recess 2d is θ <110 °, the frame body 2a can be lowered. Moreover, since the radius r of the curved electronic component 10 can be increased, the stress applied to the curved electronic component 10 can be reduced.

  Further, the inclined portion 2 f may have a concave curved surface along the lower surface of the curved electronic component 10. Accordingly, the curved electronic component 10 can be mounted more stably in the process of mounting.

  Further, as in the example shown in FIGS. 1 and 2, the curved electronic component 10 is in contact with the bottom surface 4 of the recess 2d. Thereby, the position of the curved electronic component 10 can be fixed favorably. In the process of mounting the curved electronic component 10, since the curved electronic component 10 is in contact with the bottom surface 4, various stresses during mounting can be released to the bottom surface 4, and as a result, the packaging of the electronic component mounting package 1 can be performed. It is possible to reduce the concentration of stress on the contact portion between the main surface and the inner wall of the recess 2d and the curved electronic component 10.

  In the example shown in FIGS. 1 and 2, the base 2 is made of one kind of material. As will be described later, the base 2 of the electronic component mounting package 1 may be composed of a frame 2a and a flat plate 2b provided on the lower surface thereof. At this time, the material used for the frame 2a is, for example, an electrically insulating ceramic or resin, and the material used for the flat plate 2b is, for example, an electrically insulating ceramic, resin, or metal. Further, the frame body 2a and the flat plate 2b may be provided with wiring conductors composed of through conductors and internal wirings for conducting each insulating layer, or may have wiring conductors exposed on the surface. At this time, the frame 2a and the flat plate 2b may be electrically connected.

  Next, the electronic device 21 will be described with reference to FIGS. 1 and 2. In the example shown in FIGS. 1 and 2, the electronic device 21 includes an electronic component mounting package 1 and a curved electronic component 10 mounted on the electronic component mounting portion 11.

  The curved electronic component 10 is, for example, an image sensor such as a CCD type or a CMOS type, a light emitting element such as an LED, or a semiconductor circuit element. In the example shown in FIGS. 1 and 2, each electrode of the curved electronic component 10 is electrically connected to the curved electronic component connecting pad 3 by a connecting member 13 (bonding wire).

  The electronic device 21 according to the present invention includes the electronic component mounting package 1 having the above-described configuration and the curved electronic component 10 mounted on the electronic component mounting portion 11. It becomes possible to reduce generation | occurrence | production of a crack or a crack in the opening part 2c of the part 11. FIG.

  Next, an example of a method for manufacturing the electronic component mounting package 1 of the present embodiment will be described.

  In addition, an example of the manufacturing method shown below is a manufacturing method using a multi-piece wiring board.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, when obtaining the base body 2 which is an aluminum oxide (Al ₂ O ₃ ) sintered body, silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) as a sintering aid is added to the Al ₂ O ₃ powder. ) And the like, and further an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

  When the substrate 2 is made of, for example, a resin, the substrate 2 can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined shape.

  Moreover, the base | substrate 2 may be what impregnated resin to the base material which consists of glass fiber like glass epoxy resin, for example. In this case, the substrate 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

  (2) Next, the wiring including the curved electronic component connection pad 3, the external circuit connection electrode, the through conductor and the internal wiring on the ceramic green sheet obtained in the step (1) by screen printing or the like. A metal paste is applied or filled into a portion to be a conductor.

This metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the metal powder made of the above-described metal material and kneading. The metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2.

  (3) Next, a ceramic green sheet to be the base 2 having the recess 2d is prepared. In order to create the substrate 2 having the recess 2d, there is a method of creating a ceramic green sheet to be a frame 2a and a flat plate 2b, for example, and integrating them by a process of laminating and pressing described later. The ceramic green sheet to be the frame body 2a can be manufactured by punching out the portion to be the opening 2c using, for example, a mold or laser processing. Alternatively, a plurality of ceramic green sheets may be laminated and pressed to form a ceramic green sheet laminate, and a portion that becomes the opening 2c may be punched out.

  When the opening 2c has the arcuate portion 2e, it can be created in the step of creating the opening 2c. For example, after forming a ceramic green sheet to be the frame body 2a in the step of creating the opening 2c with a normal mold, it may be formed by pressing with a mold having an arcuate portion. For example, when the opening 2c is formed using a mold, the opening 2c and the arc-shaped part 2e are formed in a single process by providing an arc-shaped part at the base of the convex mold and punching and pressing. can do.

  When the opening 2c has the inclined portion 2f, it can be created in the step of creating the opening 2c. For example, when using a metal mold | die, it can produce by punching using a metal mold | die with a convex metal mold | die and a concave larger than the convex magnitude | size.

  Also, the ceramic green sheet to be the frame body 2a punched with the above-described mold and the ceramic green sheet to be the frame body 2a punched with a normal mold may be integrated in a step of laminating and pressing described later. good.

  For example, after forming a ceramic green sheet to be the frame body 2a in the step of creating the opening 2c with a normal mold, it may be formed by pressing with a mold having an inclined portion. For example, when the opening 2c is formed using a mold, the opening 2c and the inclined portion 2f are formed in one step by providing an inclined portion at the base of the convex mold and punching and pressing. be able to.

  (4) Next, the ceramic green sheets used as each insulating layer are laminated | stacked and it pressurizes, The ceramic green sheet laminated body used as the base | substrate 2 is produced. At this time, the ceramic green sheet laminated body used as the base | substrate 2 integrated by laminating | stacking and pressing the ceramic green sheet used as the frame 2a mentioned above and the ceramic green sheet used as the flat plate 2b can be produced.

  Further, in the step of laminating and pressing the ceramic green sheet to be the frame 2a and the ceramic green sheet to be the flat plate 2b, the arcuate portion is pressed by using a mold having a curved surface or an inclined portion at the position of the opening 2c. The ceramic green sheet laminated body used as the base | substrate 2 can be formed, forming 2e or the inclination part 2f.

  (5) Next, this ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece wiring board in which a plurality of substrates 2 are arranged. In this step, the above-described metal paste is fired simultaneously with the ceramic green sheet serving as the substrate 2 to become the curved electronic component connecting pad 3, the external circuit connecting electrode, or the wiring conductor.

(6) Next, the multi-piece wiring board obtained by firing is divided into a plurality of bases 2. In this division, a dividing groove is formed in a multi-piece wiring substrate along the outer edge of the substrate 2, and the substrate 2 is divided by a method of breaking along the dividing groove and dividing, or a slicing method. The method etc. which cut | disconnect along the location used as an outer edge can be used. In addition, the dividing groove can be formed by cutting less than the thickness of the multi-piece wiring board with a slicing device after firing, but the cutter blade is pressed against the ceramic green sheet laminate for the multi-piece wiring board, You may form by cutting smaller than the thickness of a ceramic green sheet laminated body with a slicing apparatus.

  Through the steps (1) to (6), the electronic component mounting package 1 is obtained. In addition, the process order of said (1)-(6) is not designated.

  By mounting the curved electronic component 10 on the electronic component mounting portion 11 of the electronic component mounting package 1 formed as described above, the electronic device 21 can be manufactured.

(Second Embodiment)
Next, an electronic component mounting package 1 and an electronic device 21 according to a second embodiment of the present invention will be described with reference to FIG.

  The electronic device 21 according to the present embodiment is different from the electronic device 21 according to the first embodiment in that the base 2 includes a frame body 2a and a flat plate 2b made of a material different from the frame body 2a.

  In the example shown in FIG. 3, the base 2 is composed of a frame 2a and a flat plate 2b provided on the lower surface of the frame 2a, and the flat plate 2b is composed of a metal material.

  Generally, the temperature of the curved electronic component 10 increases due to the heat generated when the curved electronic component 10 operates or the heat generated in the process of mounting the curved electronic component 10. At this time, when the operation of the curved electronic component ends, or when the mounting process of the curved electronic component 10 ends, the curved electronic component 10 is thermally contracted. The contraction causes the curved electronic component 10 and the main surface of the electronic component mounting package 1 to rub against each other between the inner wall of the concave portion 2d, and the curved electronic component 10 is distorted, cracked, or the main surface of the base 2 and the concave portion 2d. It was concerned that it was one of the causes of cracks between the inner walls of the walls. As in the example shown in FIG. 3, the flat plate 2b is made of a metal material, so that the heat generated when the curved electronic component 10 operates or in the process of mounting the curved electronic component 10 is efficiently radiated. It becomes possible, and it can reduce that the temperature of the curved electronic component 10 rises. Therefore, the magnitude of the thermal contraction of the curved electronic component 10 can be reduced, the distortion or crack of the curved electronic component 10 and the occurrence of a crack between the main surface of the base 2 and the inner wall of the recess 2d. Can be reduced.

Here, when the flat plate 2b is made of a metal material, the flat plate 2b is made of, for example, stainless steel (SUS), Fe—Ni—Co alloy, 42 alloy, copper (Cu), or copper alloy. The material used for the frame 2a is, for example, electrically insulating ceramics or resin. For example, when the main component of the frame 2a is an aluminum oxide sintered body having a thermal expansion coefficient of about 5 × 10 ⁻⁶ / ° C. to 10 × 10 ⁻⁶ / ° C., the flat plate 2b is about 10 × 10 ⁻ Stainless steel (SUS410) having a thermal expansion coefficient of ⁶ / ° C. is preferable. In this case, the thermal stress difference between the frame body 2a and the flat plate 2b is reduced when the electronic device 21 is operated, so that the thermal stress applied to the bonding material for joining the frame body 2a and the flat plate 2b is reduced. It is possible to relax, and the dissociation between the frame 2a and the flat plate 2b can be reduced.

As a method of joining the frame 2a and the flat plate 2b, for example, a paste-like thermosetting resin (adhesive member) is applied to either the joint surface of the frame 2a or the flat plate 2b by a screen printing method, a dispensing method or the like After drying in a type atmosphere furnace or oven, etc., the frame 2a and the flat plate 2b are stacked and passed through a tunnel type atmosphere furnace or oven and heated at about 150 ° C. for about 90 minutes. The material is completely thermoset to firmly bond the frame body 2a and the flat plate 2b.

  The flat plate 2b is joined to the frame 2a by a joining material made of brazing material, thermosetting resin, low melting point glass, or the like. The bonding material may be a conductive material such as an anisotropic conductive film (ACF). As the thermosetting resin, for example, bisphenol A type liquid epoxy resin or the like is used. It is preferable that the frame 2a and the flat plate 2b are peeled off at the time of mounting or operation of the curved electronic component 10 by using a material that is not denatured by heat during mounting or operation of the curved electronic component 10 as the bonding material. It is preferable because it can be suppressed.

  The bonding material is, for example, a main agent made of bisphenol A type liquid epoxy resin, bisphenol F type liquid epoxy resin, phenol novolac type liquid resin, etc., a filler made of spherical silicon oxide or the like, or an acid anhydride such as tetrahydromethylphthalic anhydride. It is obtained by adding a carbon powder or the like as a curing agent mainly composed of, etc., and mixing and kneading using a centrifugal stirrer or the like to obtain a paste.

  In addition, as the bonding material, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative Uses epoxy resins such as epoxy resins and bisphenol skeleton type epoxy resins with curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide, etc. can do.

(Third embodiment)
Next, an electronic component mounting package 1 and an electronic device 21 according to a third embodiment of the present invention will be described with reference to FIGS.

  The electronic device 21 in the present embodiment is different from the electronic device 21 in the second embodiment in that the bottom surface 4 of the recess 2d is concave or convex in the thickness direction in a cross-sectional view, and the curved electronic component 10 The adhesive 19 is provided between the bottom surface 4 and the bottom surface 4.

  In the example shown in FIG. 4, the bottom surface 4 of the recess 2 d is concave in the thickness direction of the base 2 in a longitudinal sectional view. That is, the bottom surface 4 of the recess 2d of the electronic component mounting package 1 has the lowest point 4b in the thickness direction. Further, in the example shown in FIG. 4, the concave lowest point 4 c of the bottom surface 4 of the concave portion 2 d overlaps the center of the electronic component mounting portion 11 in plan view.

  As the example shown in FIG. 4, the electronic component mounting package 1 has the lowest point 4 b on the bottom surface 4, so that it becomes easy to mount the curved electronic component 10 at a predetermined position. Further, since the lowest point 4b overlaps with the center of the electronic component mounting portion 11 in a plan view, the curved electronic component 10 can be easily mounted at the center of the electronic component mounting portion 11 and the mountability can be improved. It becomes.

  In the example shown in FIG. 5, the bottom surface 4 of the recess 2 d is convex in the thickness direction of the base 2 in a longitudinal sectional view. That is, the bottom surface 4 of the recess 2d of the electronic component mounting package 1 has the highest point 4a in the thickness direction. In the example shown in FIG. 5, the convex highest point 4 a of the bottom surface 4 of the concave portion 2 d overlaps the center of the electronic component mounting portion 11 in plan view.

As in the example shown in FIG. 5, the electronic component mounting package 1 has the highest point 4 a on the bottom surface 4, whereby the distance from the opening 2 c of the base 2 to the bottom surface 4 can be reduced. Therefore, since it becomes possible to mount the curved electronic component 10 without reducing the radius r, the stress applied to the curved electronic component 10 can be reduced. In addition, since the highest point 4a overlaps the center of the electronic component mounting portion 11 in plan view, when the curved electronic component 10 is mounted, the most protruding portion of the curved electronic component 10 and the highest point 4a can be easily contacted. Thus, the mountability of the curved electronic component 10 can be improved.

  In the example shown in FIGS. 4 and 5, an adhesive 19 is provided between the curved electronic component 10 and the bottom surface 4. Accordingly, since the curved electronic component 10 can be securely fixed, the possibility that the opening 2c of the electronic component mounting package 1 and the curved electronic component 10 are rubbed due to the movement of the curved electronic component 10 can be reduced. It is possible to reduce the possibility that the bent electronic component 10 is distorted or cracked, the possibility that the opening 2c of the bent electronic component 10 is broken, and the like. In particular, as shown in FIG. 5, when the bottom surface 4 has the highest point 4a, the shape of the fillet of the adhesive 19 is a concave shape. This makes it possible to increase the stress with which the adhesive 19 pulls the curved electronic component 10 toward the bottom surface 4. Therefore, the curved electronic component 10 can be more firmly bonded to the bottom surface 4, and the electronic component mounting package 1 and the curved electronic component 10 can be bonded more firmly.

  As a method of providing the highest point 4a or the lowest point 4b on the bottom surface, when the substrate 2 or the flat plate 2b is made of an electrically insulating ceramic, in the step of laminating and pressing a plurality of ceramic green sheets, It is possible to form the highest point 4a or the lowest point 4b on the bottom surface 4 by pressing the portion to be 4 from the top surface or the bottom surface. Further, the highest point 4a and the lowest point 4b can be formed on the bottom surface 4 by sucking the portion to be the bottom surface 4 from the upper surface or the lower surface. When the flat plate 2b is made of a metal plate, the highest point 4a or the lowest point 4b can be formed on the plate made of metal by press working or etching using a conventionally known mold. Thereafter, when the flat plate 2b is made of a metal such as Fe-Ni-Co alloy, 42 alloy, Cu, or copper alloy, a nickel plating layer and a gold plating layer may be deposited on the surface thereof. Thereby, the oxidative corrosion of the surface of the flat plate 2b can be effectively prevented.

(Fourth embodiment)
Next, an electronic component mounting package 1 and an electronic device 21 according to a fourth embodiment of the present invention will be described with reference to FIG.

  The electronic device 21 in the present embodiment is different from the electronic device 21 in the first embodiment in that the shape of the opening 2c is different in plan view.

  In the example shown in FIG. 6A, the opening 2c of the recess 2d has a rectangular shape, and at least one pair of opposite sides of the rectangular opening 2c has a notch 2g. In FIG. 5A, a total of four notches 2g are provided on two opposing sides.

  In general, when the curved electronic component 10 is mounted in the rectangular opening 2c, the curved electronic component 10 is supported by one point on each side, that is, four points and five points in contact with the bottom surface 4. Become. By having the notch 2g, the curved electronic component 10 is supported at the point where the notch 2g and the opening 2c intersect. Therefore, as in the example shown in FIG. 5A, the notch 2g is provided in total on the two sets of opposing sides so that the curved electronic component 10 has eight points in contact with the opening 2c and the bottom surface. It is possible to support a total of nine points, one point in contact with 4, and the curved electronic component 10 can be more stably mounted.

  In the example shown in FIG. 5B, the opening 2c of the recess 2d has a circular shape.

Since the opening 2c is circular, the curved electronic component 10 is not supported at each point but is supported by a line. Therefore, it becomes possible to mount the curved electronic component 10 more stably.

  As a method of providing such a circular opening 2c and a notch 2g, for example, a ceramic green sheet serving as the frame 2a is formed by using a die having a circular shape or a predetermined notch 2g, or laser processing. It can produce by punching out the part used as the opening part 2c.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, Various modifications, such as a numerical value, are possible.

  Further, for example, in the example shown in FIGS. 1 to 6, the shape of the curved electronic component connecting pad 3 is a rectangular shape, but it may be a circular shape or other polygonal shapes.

  Further, the arrangement, number, shape, etc. of the curved electronic component connection pads 3 in this embodiment are not specified.

  Further, various combinations of the characteristic portions in the present embodiment are not limited to the above-described embodiments.

DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting package 2 ... Base 2a ... Frame 2b ... Flat plate 2c ... Opening 2d ... Recess 2e ... Arc-shaped part 2f ... Inclined part 2 g: Notch 3... Curved electronic component connection pad 4... Bottom surface 4 a. Component mounting part 13 ... connecting member 19 ... adhesive 21 ... electronic device

Claims (7)

A main surface, and a base body having a recess provided in the main surface;
An electronic component mounting portion on which the curved curved electronic component is mounted, which is provided at the bottom surface of the concave portion and the opening of the concave portion;
An electronic component mounting package comprising an arcuate portion or an inclined portion between the main surface and the inner wall of the recess in the electronic component mounting portion of the opening. The base consists of a frame and a flat plate provided on the lower surface of the frame,
2. The electronic component mounting package according to claim 1, wherein the flat plate is made of a metal material.   3. The electronic component mounting package according to claim 1, wherein a bottom surface of the recess is convex or concave in a thickness direction of the base body in a longitudinal sectional view. The opening of the recess is rectangular.
4. The electronic component mounting package according to claim 1, wherein at least one pair of opposing sides of the rectangular opening has a notch. 5.   The electronic component mounting package according to any one of claims 1 to 3, wherein the opening of the recess has a circular shape.   4. The electronic component mounting package according to claim 3, wherein the convex or concave center of the bottom surface of the concave portion overlaps with the center of the electronic component mounting portion in plan view. An electronic component mounting package according to any one of claims 1 to 6,
An electronic device comprising: the curved electronic component mounted on the electronic component mounting package.

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