JP7145037B2 - Electronic device mounting board, electronic device, and electronic module - Google Patents

Description

The present invention relates to an electronic element mounting substrate, an electronic device, and an electronic module on which an electronic element or the like is mounted.

2. Description of the Related Art An electronic device mounting substrate having a substrate including an insulating layer and a wiring layer is known. Also, such a board for mounting an electronic device is known to have a structure in which it is joined to a frame containing a metal material on the upper surface thereof. (See Patent Document 1).

JP 2015-029244 A

In recent years, there has been a demand for miniaturization of electronic devices, and substrates for mounting electronic elements have also been miniaturized. However, as the electronic element mounting substrate is miniaturized, the bonding area between the substrate and the frame becomes smaller. As a result, when vibration or stress is applied to the electronic device from the outside, the frame and the substrate may separate. was feared to cause

An electronic device mounting substrate according to one aspect of the present invention includes a substrate having a mounting region on the top surface thereof on which an electronic device is mounted, and a frame containing a metal material located on the top surface of the substrate so as to surround the mounting region. the substrate has an inclined portion extending from the upper surface to the side surface; the substrate and the frame have joint portions at the upper surface and the inclined portion; It has a plurality of grooves, and the outer edge of the frame body is located outside the outer edge of the substrate in a plan view . Further, an electronic device mounting substrate according to another aspect of the present invention includes a substrate having a mounting region on which an electronic device is mounted on the upper surface, and a substrate located on the upper surface of the substrate so as to surround the mounting region in a plan view, a frame containing a metal material, the substrate having an inclined portion extending from the upper surface to the side surface, the substrate and the frame having joint portions on the upper surface and the inclined portion; The inclined portion has a plurality of groove portions, and the plurality of groove portions are characterized in that they are continuously positioned from the side surface of the substrate to the upper surface of the substrate. Further, an electronic device mounting substrate according to another aspect of the present invention includes a substrate having a mounting region on which an electronic device is mounted on the upper surface, and a substrate located on the upper surface of the substrate so as to surround the mounting region in a plan view, a frame containing a metal material, the substrate having an inclined portion extending from the upper surface to the side surface, the substrate and the frame having joint portions on the upper surface and the inclined portion; the slanted portion has a plurality of grooves, the substrate has a plurality of layers, the slanted portion is positioned from the lower surface of the uppermost layer to the upper surface of the uppermost layer among the plurality of layers, The plurality of grooves are characterized by being positioned from the upper surface to the lower surface of the uppermost layer.

An electronic device according to one aspect of the present invention is characterized by comprising an electronic element mounting substrate and an electronic element mounted in a mounting area.

An electronic module according to one aspect of the present invention is characterized by comprising an electronic device and a housing located on the upper surface of the electronic device.

An electronic device mounting substrate according to one aspect of the present invention has an inclined portion at a joint portion on the outer circumference of the substrate, and a plurality of grooves along the inclined portion on the side surface of the substrate. Since the board of the electronic device mounting board has an inclined part on the side surface, it does not increase the external size of the electronic device mounting board compared to the case where the frame is joined only on the upper surface of the board. , the bonding area between the substrate and the frame can be increased. In addition, since the inclined portion has the groove portion, the bonding material for bonding the substrate and the frame enters the groove portion, thereby making it possible to further improve bondability.

FIG. 1(a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to the first embodiment of the present invention, with the cover body omitted, and FIG. It is a vertical cross-sectional view corresponding to the X1-X1 line. FIG. 2(a) is a top view showing the appearance of an electronic module according to an embodiment of the first other aspect of the present invention, and FIG. 2(b) corresponds to line X2-X2 in FIG. 2(a). It is a vertical cross-sectional view. 3(a) and 3(b) are side views showing the appearance of an electronic device mounting board according to another aspect of the first embodiment of the present invention. FIG. 4 is a perspective view showing the appearance of the board portion of the electronic device mounting board according to another aspect of the first embodiment of the present invention. FIG. 5(a) is a side view showing the appearance of an electronic device mounting substrate according to the aspect of the second embodiment of the present invention, and FIG. 5(b) is another aspect of the second embodiment of the present invention. 1 is a side view showing the appearance of an electronic element mounting board according to FIG. FIG. 6(a) is a side view showing the appearance of an electronic device mounting substrate according to a third embodiment of the present invention, and FIG. 6(b) is another aspect of the third embodiment of the present invention. 1 is a side view showing the appearance of an electronic element mounting board according to FIG. FIG. 7(a) is a side view showing the appearance of an electronic device mounting substrate according to a fourth embodiment of the present invention, and FIG. 7(b) is another aspect of the fourth embodiment of the present invention. 1 is a side view showing the appearance of an electronic element mounting board according to FIG. FIG. 8(a) is a side view showing the appearance of an electronic device mounting substrate according to a fifth embodiment of the present invention, and FIG. 8(b) is another aspect of the fifth embodiment of the present invention. 1 is a side view showing the appearance of an electronic element mounting board according to FIG. FIG. 9 is a perspective view showing the appearance of the board portion of the electronic device mounting board according to the sixth embodiment of the present invention. FIG. 10 is a perspective view showing the appearance of the board portion of the electronic device mounting board according to the seventh embodiment of the present invention. FIG. 11 is a perspective view showing the appearance of the board portion of the electronic device mounting board according to another aspect of the seventh embodiment of the present invention. FIG. 12 is an enlarged cross-sectional view showing a main portion A of the substrate portion of the electronic device mounting substrate according to the aspect of the first embodiment of the present invention.

<Structure of Electronic Device Mounting Board and Electronic Device>
Several exemplary embodiments of the invention will now be described with reference to the drawings. In the following description, an electronic device is defined as a structure in which an electronic element is mounted on an electronic element mounting board. Further, an electronic module is defined as a structure having a housing or member provided so as to be located on the upper surface side of the electronic device mounting substrate or to surround the electronic device. The electronic element mounting board, the electronic device, and the electronic module may be oriented upward or downward, but for the sake of convenience, an orthogonal coordinate system xyz is defined, and the positive side in the z direction is oriented upward.

(First embodiment)
An electronic element mounting substrate 1 according to a first embodiment of the present invention, and an electronic module 31 and an electronic device 21 having the same will be described with reference to FIGS. 1 to 4 and 12. FIG. In addition, in this embodiment, FIG. 1 shows the electronic device 21 . In FIG. 2 an electronic module 31 is shown. 3 shows a side view of the appearance of the electronic device mounting board 1 in the X-axis and Y-axis directions. FIG. 4 shows a perspective view of only the substrate 2 of the electronic device mounting substrate 1. As shown in FIG. FIG. 12 shows an enlarged view of a main portion A of the substrate 2 of the electronic device mounting substrate 1. As shown in FIG.

The electronic device mounting substrate 1 has a substrate 2 having a mounting region 4 on which an electronic device is mounted. The upper surface of the substrate 2 is provided with a frame 5 which surrounds the mounting area 4 and is made of a metal material. The outer periphery of the substrate 2 has an inclined portion 2a at the joint portion with the frame 5 . The side surface of the substrate 2 has a plurality of grooves 2b along the inclined portion 2a.

The electronic device mounting substrate 1 has a substrate 2 having a mounting area 4 on which an electronic device 10 is mounted. Here, in the example shown in FIG. 1, the electronic element 10 is mounted on the top surface of the substrate 2, but may be mounted on the bottom surface. Further, the substrate 2 may be provided with other insulating layers such as a frame-shaped insulating layer on the upper surface and/or the lower surface, and the electronic element 10 may be positioned inside the frame-shaped insulating layer. In other words, the substrate 2 may have a recess containing another insulating layer such as a frame, and the electronic element 10 may be positioned on the bottom surface of the recess. Here, the mounting region 4 is a region in which at least one or more electronic elements 10 are mounted. It is possible to determine Further, the components to be mounted in the mounting area 4 are not limited to the electronic elements 10, and may be, for example, electronic components, and the number of electronic elements 10 and/or electronic components is not specified.

In the example shown in FIGS. 1 and 2, the substrate 2 is composed of a plurality of insulating layers. etc. The material of the insulating layer forming the substrate 2 includes, for example, electrically insulating ceramics or resin.

Examples of electrically insulating ceramics used as materials for the insulating layer forming the substrate 2 include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and silicon nitride. sintered bodies or glass-ceramic sintered bodies; Examples of resins used as materials for the insulating layer forming the substrate 2 include thermoplastic resins, epoxy resins, polyimide resins, acrylic resins, phenolic resins, fluorine-based resins, and the like. The fluororesin includes, for example, tetrafluoroethylene resin.

The substrate 2 may be formed of 6 insulating layers as shown in FIG. 1, or may be formed of 5 or less or 7 or more insulating layers. When the number of insulating layers is five or less, the thickness of the electronic element mounting substrate 1 can be reduced. Moreover, when the number of insulating layers is seven or more, the rigidity of the electronic element mounting board 1 can be increased. Further, as in the example shown in FIG. 1, each insulating layer may have an opening and a recess, and a stepped portion may be formed on the upper surface of the provided opening (recess) having a different size. may be

For example, the size of one side of the outermost circumference of the electronic device mounting substrate 1 is 0.3 mm to 10 cm. There may be. Further, for example, the thickness of the electronic element mounting board 1 is 0.2 mm or more.

The substrate 2 of the electronic device mounting substrate 1 may have electrode pads 3 . Here, the electrode pads 3 refer to pads electrically connected to the electronic element 10, for example.

External circuit connection electrodes may be provided on the upper surface, side surface, or lower surface of the substrate 2 of the electronic element mounting substrate 1 . The external circuit connection electrode may electrically connect the substrate 2 and the external circuit substrate, or the electronic device 21 and the external circuit substrate.

In addition to the electrode pads 3 and/or external circuit connection electrodes, the upper or lower surface of the substrate 2 is provided with electrodes formed between insulating layers, internal wiring conductors, and through conductors for vertically connecting the internal wiring conductors. may be These electrodes, internal wiring conductors or through conductors may be exposed on the surface of the substrate 2 . The electrode pads 3 and/or the external circuit connection electrodes may be electrically connected by the electrodes, internal wiring conductors, or through conductors.

The electrode pads 3, external circuit connection electrodes, electrodes, internal wiring conductors and/or through conductors are
When the plurality of insulating layers are made of electrically insulating ceramics, tungsten (W), molybdenum (Mo), manganese (Mn), palladium (Pd), silver (Ag) or copper (Cu), or at least selected from these Included are alloys and the like containing one or more metallic materials. Moreover, it may consist only of copper (Cu). Further, when the electrode pads 3, external circuit connection electrodes, internal wiring conductors and/or through conductors are made of a plurality of layers of resin, copper (Cu), gold (Au), aluminum (Al), nickel ( Ni), molybdenum (Mo), palladium (Pd), titanium (Ti), or alloys containing at least one metal material selected from these.

The exposed surfaces of the electrode pads 3, external circuit connection electrodes, electrodes, internal wiring conductors and/or through conductors may further have a plating layer. According to this configuration, it is possible to protect the exposed surfaces of the electrode for external circuit connection, the conductor layer, and the through conductor and reduce oxidation. Moreover, according to this configuration, the electrode pads 3 and the electronic element 10 can be electrically connected well through the electronic element bonding material 13 such as wire bonding. The plating layer is, for example, a Ni plating layer with a thickness of 0.5 μm to 10 μm, or a Ni plating layer and a gold (Au) plating layer with a thickness of 0.5 μm to 3 μm. good.

A frame 5 made of a metal material is provided on the upper surface of the substrate 2 of the electronic device mounting substrate 1 so as to surround the mounting area 4 . The frame 5 surrounds the mounting area 4 . In other words, the frame 5 has an opening in a portion overlapping the mounting area 4 when viewed from above. Here, for example, when there are two mounting areas 4, the frame 5 may have openings at two locations.

The frame body 5 containing metal material is made of metal such as stainless steel (SUS), Fe--Ni--Co alloy, 42 alloy, copper (Cu), copper alloy, or the like. In particular, if the frame body 5 is made of a material having a high thermal conductivity such as copper, heat dissipation can be enhanced. Here, when an aluminum oxide sintered body having a coefficient of thermal expansion of about 5 to 10 (×10 ⁻⁶ /° C.) is used as the substrate 2 , the frame 5 has a coefficient of thermal expansion of about 10 (×10 ⁻⁶ /°C) stainless steel (SUS410) or the like reduces the difference in thermal expansion between the substrate 2 and the frame 5 during use. This makes it possible to reduce distortion due to thermal expansion between the substrate 2 and the frame 5 in the process of bonding the frame 5 and the board 2, the process of mounting the electronic element 10, and the like. Therefore, it is possible to improve the balance of the electronic element mounting board 1 .

The frame body 5 may be composed only of the metal material described above, or may be, for example, an insulating material coated with or joined to the surface of the metal material.

The frame 5 and the substrate 2 are joined by a frame connecting member 15 . The frame connection member 15 is made of a material that does not change depending on the temperature at which the electronic element 10 is mounted or the temperature at which the electronic element 10 is operated. Separation from the body 5 can be reduced.

The frame 5 and the substrate 2 may be electrically connected, and when the frame 5 and the substrate 2 are electrically connected, the frame connecting member 15 may be electrically conductive. good. By electrically connecting the frame 5 and the substrate 2, for example, by connecting them at a ground potential, it is possible to have a shielding effect on the substrate 2. FIG.

The frame 5 may have a hole and/or a notch into which a part of the housing 32, which will be described later, can be inserted. Also, a plurality of these holes and notches may be provided. Here, the hole and/or notch may penetrate from the upper surface to the lower surface of the frame 5, or may be provided from the upper surface or the lower surface of the frame 5 to the middle of the frame 5. may be

The substrate 2 and the frame 5 are joined by a frame connecting member 15 at a joint located on the upper surface or the lower surface of the substrate 2 . Here, the joint portion is positioned around the mounting area 4 and is positioned on the outer peripheral portion of the substrate 2 . For example, when the substrate 2 has a recess and the electronic device 10 is positioned inside the recess, the bonding portion may be positioned on the upper surface of the side wall of the recess.

The periphery of the substrate 2 of the electronic device mounting substrate 1 has an inclined portion 2 a at the joint portion with the frame 5 . The side surface of the substrate 2 has a plurality of grooves 2b along the inclined portion 2a.

In recent years, there has been a demand for miniaturization of electronic devices, and substrates for mounting electronic elements have also been miniaturized. However, as the electronic element mounting substrate is miniaturized, the bonding area between the substrate and the frame becomes smaller. As a result, when vibration or stress is applied to the electronic device from the outside, the frame and the substrate may separate. was feared to cause

On the other hand, in this embodiment, the substrate 2 has an inclined portion 2a at the joint portion, and has a plurality of grooves 2b along the inclined portion 2a. Since the substrate 2 of the electronic device mounting substrate 1 has the inclined portion 2a on the side surface, the external size of the electronic device mounting substrate 1 can be reduced compared to the case where only the upper surface of the substrate is joined to the frame. Since the substrate 2 can be bonded from the upper surface to the side surface (inclined portion 2a) without increasing the size, the bonding area between the substrate 2 and the frame 5 can be increased. In addition, since the inclined portion 2a has the groove portion 2b, the frame connecting member 15 for joining the substrate 2 and the frame 5 can flow into the groove portion 2b. This makes it possible to increase the bonding area between the substrate 2 and the frame 5 . Furthermore, since the frame connecting member 15 is caught in the groove 2b, peeling can be reduced even when the electronic device 21 is subjected to vibration or stress. Therefore, it is possible to reduce the possibility that the frame 5 of the electronic element mounting substrate 1 and the substrate 2 are separated from each other, and it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. .

FIG. 12 shows an enlarged view of the main part A of the example shown in FIG. When the angle α of the inclined portion 2a shown in FIG. When the angle α of the inclined portion 2a is small, the frame connecting member 15 can be retained on the upper surface side of the inclined portion 2a, and the thickness of the frame connecting member 15 can be increased near the frame 5. Become. When the angle α of the inclined portion 2a is large, it becomes easy to spread the frame connecting member 15 over the entire inclined portion 2a, and the bonding area can be increased. moreover. By increasing the amount of the frame connecting member 15 that enters the groove 2b, the frame connecting member 15 is more likely to be caught by the groove 2b. As a result, the bonding strength between the frame 5 and the substrate 2 can be further improved.

The outer edge of the groove portion 2b may be a straight line, or may have a shape in which fine unevenness is continuous. Since the outer edge of the groove portion 2b has a shape in which fine unevenness is continuous, the frame connecting member 15 entering the groove portion 2b is more likely to be caught inside the groove portion 2b when a force is applied in a peeling direction. This makes it possible to further improve the bonding strength between the frame 5 and the substrate 2 .

At least two groove portions 2 b may be provided on one side of the substrate 2 . In addition, by further increasing the number of grooves 2b, the bonding strength between frame 5 and substrate 2 can be further improved. Therefore, it becomes possible to further improve the effect of the present embodiment.

As in the example shown in FIG. 1 , in the electronic device mounting substrate 1 , the outer edge of the frame 5 may be located outside the outer edge of the substrate 2 in plan view. Since the outer edge of the frame 5 is positioned outside the outer edge of the substrate 2, the effect of the present embodiment is exhibited, and the frame connecting member 15 that joins the frame 5 and the substrate 2 forms a large fillet. can do. Therefore, even if vibration or stress is applied to the electronic device 21 from the outside, the fillet can reduce the concentration of stress on a part of the frame body connection member 15, and the frame body 5 and the substrate 2 can be connected to each other. It is possible to further reduce the peeling of the. Further, since the inclined portion 2a of the substrate 2 has the groove portion 2b, the outer edge portion of the frame connecting member 15 is likely to be uneven. As a result, there is a concern that the frame connecting member 15 may be damaged and deteriorated during a transfer process or the like. On the other hand, since the outer edge of the frame 5 is positioned outside the outer edge of the substrate 2, even if the outer edge of the frame connecting member 15 is uneven, it is exposed to the outer periphery of the electronic device 21. can be reduced. Therefore, it is possible to reduce damage and deterioration of the frame body connection member 15 in the process of transferring the electronic device 21 and the like, and to reduce peeling of the frame body 5 and the substrate 2 .

As in the example shown in FIG. 1, the substrate 2 may have a recess and the mounting area 4 may be located on the bottom surface of the recess. Since the substrate 2 has a recess and the electronic element 10 (mounting area 4) is positioned on the bottom surface of the recess, the electronic device 21 can be made thinner. In addition, the joint portion between the frame 15 and the substrate 2, the inclined portion 2a and the groove portion 2b can be positioned so as to be continuous with the upper surface of the side wall of the recess. Therefore, it is possible to increase the area of the inclined portion and the groove portion 2b, and to increase the bonding area between the frame 5 and the substrate 2. FIG. In addition, since the amount of the frame connecting member 15 that enters the groove 2b can be increased, the frame connecting member 15 is more likely to be caught by the groove 2b. As a result, the bonding strength between the frame 5 and the substrate 2 can be further improved.

3(a) and 3(b) show side views of the appearance of the electronic device 21 in the present embodiment in the x-axis direction and the y-axis direction.

The inclined portion 2a may be positioned over the entire circumference of the substrate 2, as in the examples shown in FIGS. 3(a) and 3(b). Since the inclined portion 2a is positioned over the entire surface of the substrate 2, the bonding area between the frame 5 and the substrate 2 can be increased. In addition, since the inclined portion 2a is positioned over the entire circumference of the substrate 2, for example, when the substrate 2 is rectangular, the size (amount/area) of the fillet formed by the frame connecting members 15 on the opposite sides is are easier to equate. Therefore, the stress due to the fillet of the frame connecting member 15 can be made equal between the opposing sides, and the possibility of displacement or deformation of the frame connecting member 15 due to the stress due to the fillet can be reduced. Become. Therefore, it becomes possible to improve the effect of this embodiment.

When the inclined portion 2a is positioned over the entire circumference of the substrate 2, the groove portion 2b may be positioned at least on any part of the inclined portion 2a. In particular, for example, when the substrate 2 has a rectangular shape, it is possible to reinforce a portion having a small bonding area and a low bonding strength by locating the groove portion 2b in the inclined portion 2a located on the short side of each side. .

As in the example shown in FIGS. 3A and 3B, when the inclined portions 2a are positioned over the entire circumference of the substrate 2, the groove portions 2b are positioned in the inclined portions 2a on each side. good too. This makes it possible to increase the bonding area between the frame 5 and the substrate 2 . Further, since the groove portion 2b is positioned over the entire circumference of the substrate 2, for example, when the substrate 2 is rectangular, the amounts of the frame body connecting members 15 on the opposite sides entering the groove portion 2b can be made equal. Therefore, the amount of the frame connecting member 15 applied to the frame 5 or the substrate 2 can be easily adjusted, and the position of the frame connecting member 15 can be shifted or deformed due to the difference in the amount of the applied frame connecting member 15. It is possible to reduce the possibility of occurrence.

As in the example shown in FIG. 3, the plurality of grooves 2b may be positioned parallel to each other. Groove 2b
are positioned parallel to each other, the frame connecting member 15 can easily flow into the groove 2b. Therefore, it is possible to improve the effect of the present embodiment, it is possible to reduce the separation between the frame 5 of the electronic element mounting board 1 and the board 2, and the electronic device 21 operates. It is possible to reduce the occurrence of malfunctions.

In the example shown in FIG. 3, when the substrate 2 is made of a plurality of insulating layers, the inclined portion 2a is positioned across two insulating layers, but it may be positioned across, for example, two or more insulating layers, It may be located only in one insulating layer. Alternatively, it may be provided halfway through one insulating layer. The size of these inclined portions 2a varies depending on the desired bonding strength. For example, by locating the inclined portion 2a in at least two or more insulating layers, it is possible to further improve the bonding strength. In addition, for example, by providing the inclined portion 2a to the middle of one insulating layer, it is possible to moderate the shape (angle) of the fillet of the frame connecting member 15, and the frame connecting member 15 and the frame It is possible to reduce the possibility of dust or the like being trapped between the body 5 and the body 5 .

FIG. 4 shows a perspective view of the appearance of the electronic device 21 in this embodiment. 4, the frame 5, the frame connecting member 15, the electrode pad 3, and the electronic element 10 are omitted. As in the example shown in FIG. 4, the plurality of grooves 2b may be continuously positioned from the side surface of the substrate 2 to the upper surface of the substrate 2. FIG. In other words, one of the ends of the plurality of grooves 2b overlaps the upper surface of the substrate 2, and the opening is open. Since the groove portion 2b has an opening portion on the upper surface side of the substrate 2, it is possible to facilitate the flow of the frame connecting member 15 into the groove portion 2b. Therefore, it becomes possible to improve the effect of this embodiment. As a result, it is possible to reduce the possibility that the frame 5 of the electronic element mounting substrate 1 and the substrate 2 are separated from each other, and it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. .

As in the example shown in FIG. 4, the plurality of grooves 2b may be semicircular in top view. Since the plurality of grooves 2b are semicircular in top view, it is possible to increase the contact area between the frame connecting member 15 and the grooves 2b. In addition, it is possible to reduce deterioration of the frame connecting member 15 due to the gas in the gap by making it difficult for a gap to occur between the frame connecting member 15 and the groove portion 2b. In addition, it is possible to reduce the decrease in the bonding strength between the groove portion 2b and the frame body connection member 15 due to the further presence of the gap. Therefore, it becomes possible to improve the effect of this embodiment. As a result, it is possible to reduce the possibility that the frame 5 of the electronic element mounting substrate 1 and the substrate 2 are separated from each other, and it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Become.

<Structure of Electronic Device>
An example of an electronic device 21 is shown in FIG. The electronic device 21 includes an electronic element mounting board 1 and an electronic element 10 mounted on the upper or lower surface of the electronic element mounting board 1 .

The electronic device 21 has an electronic element mounting board 1 and an electronic element 10 mounted on the electronic element mounting board 1 . Examples of the electronic device 10 include an imaging device such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting device such as an LED (Light Emitting Diode), pressure, air pressure, acceleration, gyro, and the like. An element having a sensor function, an integrated circuit, or the like. Note that the electronic element 10 may be arranged on the upper surface of the substrate 2 via an adhesive. For this adhesive, for example, silver epoxy or thermosetting resin is used.

The electronic element 10 and the electronic element mounting substrate 1 may be electrically connected by an electronic element bonding material 13 including wire bonding, solder balls, gold bumps, or the like.

The electronic device 21 may have a cover that covers the electronic element 10 and is joined to the upper surface of the electronic element mounting board 1 . For example, when the electronic device 10 is an imaging device such as a CMOS or CCD, or a light emitting device such as an LED, a highly transparent member such as a glass material is used for the lid. Further, for example, when the electronic element 10 is an integrated circuit or the like, the lid body may be made of a metallic material, a ceramic material, or an organic material.

The lid may be joined to the electronic element mounting board 1 via the lid connecting member 15 . Examples of the material forming the lid connecting member 15 include thermosetting resin, low-melting-point glass, brazing material made of metal components, and the like.

Since the electronic device 21 has the electronic element mounting board 1 as shown in FIG. 1, it is possible to reduce the separation between the frame 5 and the board 2 . Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates.

<Structure of electronic module>
FIG. 2 shows an example of an electronic module 31 using the electronic element mounting board 1 . The electronic module 31 has an electronic device 21 and a housing 32 located on the top surface of the electronic device 21 or on the electronic device 21 . For the sake of explanation, the following example will be described using an imaging module as an example. Here, the housing 32 positioned on the upper surface of the electronic device 21 means that a part of the housing 32 is positioned on the electronic device 21 even when the electronic device 21 itself is covered with the housing 32, for example. Therefore, it is included in this configuration.

The electronic module 31 may have a housing 32 (such as a lens holder). Having the housing 32 makes it possible to improve the airtightness or reduce the direct application of external stress to the electronic device 21 . The housing 32 is made of, for example, resin or metal material. Further, when the housing 32 is a lens holder, the housing 32 may incorporate one or more lenses made of resin, liquid, glass, crystal, or the like. Further, the housing 32 is equipped with a driving device or the like for driving up, down, left, or right, and is electrically connected to pads or the like located on the surface of the electronic element mounting substrate 1 via a bonding material such as solder. good too.

The housing 32 may have openings in four directions or at least one side on the bottom side when viewed from above. An external circuit board may be inserted through the opening of the housing 32 and electrically connected to the electronic element mounting board 1 . After the external circuit board is electrically connected to the electronic element mounting board 1, the opening of the housing 32 is closed with a sealing material such as resin to keep the inside of the electronic module 31 airtight. may have been

The housing 32 may be joined with the frame 5 . In this case, the housing 32 and the frame 5 may or may not be electrically connected. When the housing 32 and the frame 5 are electrically connected, the frame 5 and the substrate 2 may also be electrically connected.

Since the electronic module 31 has the electronic element mounting substrate 1 as shown in FIG. 3, it is possible to reduce the occurrence of malfunctions when the electronic module 31 operates due to the separation between the frame 5 and the substrate 2. becomes possible.

<Electronic device mounting board and manufacturing method for electronic device>
Next, an example of a method for manufacturing the electronic element mounting substrate 1 and the electronic device 21 of this embodiment will be described. An example of the manufacturing method described below is a method of manufacturing the substrate 2 using a multi-piece wiring board.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, when obtaining the substrate 2 which is an aluminum oxide (Al ₂ O ₃ ) based sintered body, silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) is added to Al ₂ O ₃ powder as a sintering aid. ) are added, followed by the addition of suitable binders, solvents and plasticizers, and then the mixture is kneaded to form a slurry. After that, a molding method such as a doctor blade method or a calender roll method is used to obtain a ceramic green sheet for multi-piece production.

When the substrate 2 is made of, for example, a resin, the substrate 2 is molded by using a mold that can be molded into a predetermined shape by a transfer molding method, an injection molding method, or by pressing with a mold or the like. can be formed. Further, the substrate 2 may be a substrate made of glass fiber impregnated with a resin such as a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

(2) Next, the aforementioned green sheet is processed with a mold or the like. If the substrate 2 has an opening, notch, or the like, the opening or notch may be formed at a predetermined location on the green sheet that serves as the substrate 2 .

(3) Next, the ceramic green sheets to be the insulating layers of the substrate 2 are laminated and pressed. As a result, the green sheets to be each insulating layer may be laminated to produce a ceramic green sheet laminate to be the substrate 2 (electronic device mounting substrate 1).

(4) Next, by screen printing or the like, the ceramic green sheets or the ceramic green sheet laminate obtained in the steps (1) to (3) are coated with electrode pads 3, electrodes for external circuit connection, internal wiring conductors, A metal paste is applied or filled in the portion that will become the internal through conductor. This metal paste is prepared by adjusting the viscosity to an appropriate level by adding a suitable solvent and binder to the metal powder made of the metal material described above and kneading the mixture. Note that the metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2 .

When the substrate 2 is made of resin, the electrode pads 3, the external circuit connection electrodes, the internal wiring conductors and the penetrating conductors can be produced by a sputtering method, a vapor deposition method, or the like. Moreover, after providing a metal film on the surface, you may manufacture using the plating method.

(5) Next, dividing grooves may be provided at predetermined positions on the green sheet using a die, punching, laser, or the like. Incidentally, the dividing grooves can be formed by cutting with a slicing apparatus after firing to a size smaller than the thickness of the multi-cavity wiring board. It may be formed by cutting the ceramic green sheet laminate to a size smaller than the thickness thereof using a slicing machine. At this time, the inclined portion 2a and the groove portion 2b can be formed on a portion of the side surface of the substrate 2 at positions overlapping the dividing grooves using a die, punching, laser, or the like. In particular, in order to form the dividing grooves, a mold is prepared so that the inclined portion 2a and the groove portion 2b are formed, so that a step of forming the dividing groove, a step of forming the inclined portion 2a, and a step of forming the groove portion 2b are performed. can be performed once.

(6) Next, this ceramic green sheet laminate is fired at a temperature of about 1500° C. to 1800° C. to obtain a multi-cavity wiring board on which a plurality of substrates 2 (electronic element mounting substrates 1) are arranged. In this process, the metal paste described above is fired at the same time as the ceramic green sheet that becomes the substrate 2 (electronic device mounting substrate 1), and becomes the electrode pads 3, external circuit connection electrodes, internal wiring conductors, and through conductors. .

(7) Next, the multi-cavity wiring board obtained by firing is divided into a plurality of substrates 2 (electronic element mounting substrates 1). In this division, division grooves are formed in the multi-cavity wiring board in step (5) along the outer edge of the substrate 2 (electronic device mounting substrate 1), and the substrate is broken along the division grooves. There is a way to divide There is also a method of cutting along the outer edge of the substrate 2 (electronic device mounting substrate 1) by a slicing method or the like without performing the step (5). At this time, when the substrate 2 is cut from the multi-piece wiring board by slicing or the like, the inclined portion 2a and the groove portion 2b can also be formed in the substrate 2 by laser, chemical solution, or the like. Alternatively, the slanted portion 2a and the groove portion 2b may be formed in the state of the ceramic green sheet using a mold or laser, and then cut by a slicing method or the like. Before or after dividing the multi-cavity wiring board described above into a plurality of boards 2 (electronic element mounting boards 1), the electrode pads 3 and the external connection pads are plated by electrolytic or electroless plating, respectively. and exposed wiring conductors may be plated.

(8) Prepare the frame 5 to be joined to the main surface of the substrate 2 . The frame body 5 is formed by punching, etching, or the like using a conventionally known stamping die on a plate material made of metal, for example, to form an opening in the center and, if necessary, a through hole or a notch in the outer periphery. It is made by After that, when the frame 5 is made of metal such as Fe--Ni--Co alloy, 42 alloy, Cu, or copper alloy, the surface thereof may be coated with a nickel plating layer and a gold plating layer. Thereby, oxidation corrosion of the surface of the frame 5 can be effectively prevented.

(9) A step of joining the frame 5 to the insulating substrate 2 via the frame connecting member 15 . In this step, a paste-like thermosetting resin is applied to the bonding surface of either the insulating substrate 2 or the frame 5 by a screen printing method, a dispensing method, or the like, and dried in a tunnel-type atmosphere furnace or oven. The insulating substrate 2 and the frame 5 are put together in a tunnel atmosphere furnace or oven, and heated at about 150° C. for about 90 minutes to completely heat-harden the frame connecting member 15. The substrate 2 and the frame 5 are firmly adhered.

The frame connecting member 15 is composed of a base material such as bisphenol A liquid epoxy resin, bisphenol F liquid epoxy resin, phenol novolak liquid resin, etc., a filler such as spherical silicon oxide, and a filler such as tetrahydromethyl phthalic anhydride. It can be obtained by adding a hardening agent mainly composed of an acid anhydride and carbon powder as a coloring agent, and mixing and kneading them using a centrifugal stirrer or the like to form a paste.

In addition, as the frame connecting member 15, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, special novolak type epoxy resin, etc. , phenol derivative epoxy resin, bisphenol skeleton type epoxy resin, etc., to which a curing agent such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide is added etc. can be used.

In addition, low-melting-point glass can be used for the frame connecting member 15 in addition to the resin. The low-melting glass is, for example, a glass component containing 56 to 66% by mass of lead oxide, 4 to 14% by mass of boron oxide, 1 to 6% by mass of silicon oxide and 1 to 11% by mass of zinc oxide, and a zirconium oxide silica-based filler as a filler. A compound added with 4 to 15% by mass is used. A glass paste is obtained by adding and mixing a suitable organic solvent and a solvent to the glass powder having these compositions. This glass paste is laminated and printed to a predetermined thickness on the bonding surface of either the insulating substrate 2 or the frame 5 by a conventionally known screen printing method, and is fired at a temperature of about 430° C. to form the substrate 2 described above. Alternatively, the frame connecting member 15 is fixed to the surface of the frame 5 . After that, the frame body 5 and the substrate 2 are superimposed on each other, and the frame body connection member 15 is melted and adhered to the substrate 2 by heating to about 470° C. through a tunnel atmosphere furnace or an oven. The substrate 1 for mounting an electronic element is produced by firmly bonding it to the frame 5 .

(10) Next, the electronic device 10 is mounted on the electronic device mounting board 1 . The electronic element 10 is electrically bonded to the electronic element mounting substrate 1 by an electronic element bonding material 13 such as wire bonding. At this time, the electronic element 10 or the electronic element mounting substrate 1 may be fixed to the electronic element mounting substrate 1 by providing an adhesive or the like. Further, after the electronic element 10 is mounted on the electronic element mounting board 1, the lid may be bonded with a lid bonding material.

The electronic device 21 can be manufactured by manufacturing the electronic device mounting substrate 1 and mounting the electronic device 10 in the steps (1) to (9) above. Note that the order of steps (1) to (10) above is not specified as long as it is a workable order. In addition to the processes described above, it is also possible to manufacture by using, for example, a 3D printer.

(Second embodiment)
An electronic device 21 and an electronic element mounting substrate 1 according to a second embodiment of the present invention will be described with reference to FIG. Note that FIG. 5 shows a side view in the y-axis direction.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the shape of the groove portion 2b is different.

In the example shown in FIG. 5(a), the groove 2b has an arc portion when viewed from the side. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Further, for example, when stress is applied to the frame body 5 so as to lift it from the bottom side to the top side, there is a concern that the frame body connection member 15 may come off to the top side. In such a case, since the groove portion 2b has an arc portion, the stress applied to the frame connecting member 15 that is in the arc portion of the groove portion 2b can be prevented by pulling up the side of the frame connecting member 15. The substrate 2 will be located. As a result, even when stress is applied in the Z-axis direction, it becomes difficult to pull out. This makes it possible to reduce the separation between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

In the example shown in FIG. 5(b), the groove portion 2b is inclined in a side view. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Further, for example, when stress is applied to the frame body 5 so as to lift it from the bottom side to the top side, there is a concern that the frame body connection member 15 may come off to the top side. In such a case, it is possible to reduce the stress that pulls up the frame body connecting member 15 by slanting the groove 2b. This makes it possible to reduce the separation between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

As a method of manufacturing the electronic element mounting substrate 1 shown in FIG. 5, for example, there is a method of manufacturing using a 3D printer or the like. Moreover, for example, after manufacturing the substrate 2 after baking by the method described in the first embodiment, the substrate 2 can be cut. Alternatively, for example, it can be manufactured by manufacturing the substrate 2 with a mold resin or the like. Further, for example, it is also possible to use a circular blade or the like in the cutting process of the first embodiment and to rotate the circular blade.

(Third embodiment)
An electronic device 21 and an electronic element mounting substrate 1 according to a third embodiment of the present invention will be described with reference to FIG. Note that FIG. 6 shows a side view in the y-axis direction.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the shape of the groove portion 2b is different.

In the example shown in FIG. 6A, the opening of the groove portion 2b becomes smaller from the upper surface side to the lower surface side in a side view. In other words, the groove portion 2b is tapered downward. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Further, since the opening of the groove portion 2b is large on the upper surface side of the substrate 2, the frame body connection member 15 can easily flow into the groove portion 2b in the step of connecting the frame body 5. FIG. Furthermore, since the groove portion 2b is tapered on the lower surface side, it is possible to prevent the frame connecting member 15 from flowing too much into the groove portion 2b and falling off from the lower end portion of the groove portion 2b. Therefore, it becomes easier to secure the necessary frame body connection member 15 between the frame body 5 and the substrate 2, and the bonding strength between the frame body 5 and the substrate 2 can be improved. From the above, it becomes possible to further improve the effect of the present embodiment.

In the example shown in FIG. 6B, the opening of the groove portion 2b is enlarged from the upper surface side to the lower surface side in a side view. In other words, the groove portion 2b is tapered toward the upper surface. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Further, for example, when stress is applied to the frame body 5 so as to lift it from the bottom side to the top side, there is a concern that the frame body connection member 15 may come off to the top side. In such a case, since the upper end portion of the groove portion 2b has a constricted shape, it is possible to reduce the possibility that the frame connecting member 15 slips out of the opening at the upper end portion. This makes it possible to reduce the separation between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

The plurality of grooves 2b may be formed in a mixture of shapes that are tapered on the upper end side and shapes that are tapered on the lower end side. For example, a groove part with a shape that is tapered at the lower end side may be positioned next to the groove part 2b that is tapered at the top side. With such a structure, it is possible to achieve the two effects described above. Therefore, it is possible to further improve the effects of the present invention.

As a method of manufacturing the electronic element mounting board 1 shown in FIG. Moreover, for example, after manufacturing the substrate 2 after baking by the method described in the first embodiment, the substrate 2 can be cut. Alternatively, for example, it can be manufactured by manufacturing the substrate 2 with a mold resin or the like. In addition, for example, it is possible to form the mold for forming the groove portion 2b by the method described in the first embodiment so that the upper end or the lower end is tapered.

(Fourth embodiment)
An electronic device 21 and an electronic element mounting substrate 1 according to a fourth embodiment of the present invention will be described with reference to FIG. Note that FIG. 7 shows a side view in the y-axis direction.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the shape of the groove portion 2b is different.

In the example shown in FIG. 7A, adjacent grooves 2b are not parallel to each other, and are continuous at the upper end or the lower end. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Moreover, adjacent groove portions 2b of the plurality of groove portions 2b are not parallel to each other. In other words, the grooves 2b are inclined to face different directions when viewed from the side. Since the groove portion 2b is inclined, it is possible to reduce the stress that pulls up the frame connecting member 15. As shown in FIG. In other words, since the groove portion 2b is positioned at an angle, the substrate 2 is positioned on the upper surface side, making it difficult to come off even when stress is applied in the Z-axis direction. In addition, since the adjacent grooves 2b are inclined in different directions, the frame connecting member 15 can be pulled out of the grooves 2b even when stress is applied to the frame 5 in various directions on the oblique upper surface side. can be reduced. Therefore, it becomes possible to further improve the effects of the present invention.

In the example shown in FIG. 7(b), the plurality of grooves 2b does not penetrate to the upper surface side and/or the lower surface side. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. In addition, since it is not penetrated to the upper surface side, it is possible to reduce the possibility that the frame body connection member 15 is pulled out of the groove part 2b due to upward stress, and the bonding strength between the frame body 5 and the substrate 2 is reduced. can be reduced. In addition, it is possible to reduce the flow of the frame body connection member 15 from the groove 2b to the bottom side, and the frame body connection member 15 flows from the groove 2b to the bottom side, so that the frame body between the frame 5 and the substrate 2 is prevented from flowing out. As a result of fluctuation in the amount of the bonding material 15, it becomes possible to reduce the decrease in the bonding strength between the substrate 2 and the frame 5 due to the decrease. Therefore, it is possible to further improve the effects of the present invention.

As a method of manufacturing the electronic element mounting substrate 1 shown in FIG. 7, there is a method of manufacturing using a 3D printer or the like. Moreover, for example, after manufacturing the substrate 2 after baking by the method described in the first embodiment, the substrate 2 can be cut. Alternatively, for example, it can be manufactured by manufacturing the substrate 2 with a mold resin or the like. In addition, for example, it is possible to form the mold for forming the groove 2b in the method described in the first embodiment by forming the shape shown in FIGS. 7(a) and 7(b).

(Fifth embodiment)
An electronic device 21 and an electronic element mounting substrate 1 according to a fifth embodiment of the present invention will be described with reference to FIG. Note that FIG. 8 shows a side view in the y-axis direction.

The electronic device mounting substrate 1 of the present embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the number of layers having the inclined portions 2a is different and the shape of the groove portion 2b is different. It is a point.

In the example shown in FIG. 8, the substrate 2 has a plurality of layers, and the inclined portion 2a is located in the uppermost layer among the plurality of layers. Also, the inclined portion 2a may be positioned from the lower surface to the upper surface of the uppermost layer. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. In general, the frame 5 is connected to the substrate 2 by coating the frame connecting member 15 on the top surface of the substrate 2 , in other words, on the top surface of the uppermost layer. Therefore, since the inclined portion 2a is located in the uppermost layer, the frame connecting member 15 can easily reach the inclined portion 2a, and the bonding area can be increased. Therefore, it is possible to further improve the effects of the present invention.

In the example shown in FIG. 8A, the substrate 2 has a plurality of layers, the inclined portion 2a is located in the uppermost layer among the plurality of layers, and the groove portion 2a extends from the upper surface of the substrate 2 to the middle of the uppermost layer. positioned. With such a structure, it is possible to reduce the flow of the frame connecting member 15 from the groove 2b to the lower surface side. Therefore, the frame connecting member 15 flows from the groove 2b to the lower surface side, and the amount of the frame bonding material 15 between the frame 5 and the substrate 2 fluctuates. It is possible to reduce the decrease in the bonding strength of the. Therefore, it is possible to further improve the effects of the present invention.

In the example shown in FIG. 8(b), the substrate 2 has a plurality of layers, the inclined portion 2a is located in the uppermost layer among the plurality of layers, and the plurality of groove portions 2b is formed from the upper surface of the uppermost layer. It is located on the underside. Even with such a configuration, the effects of the present invention can be obtained, and the peeling between the frame 5 of the electronic element mounting substrate 1 and the substrate 2 can be reduced. Therefore, it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. Further, since the groove portion 2b is positioned from the top surface to the bottom surface of the uppermost layer, the bonding area of the frame connecting member 15 in the groove portion 2b can be increased. This makes it possible to improve the bonding strength between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

(Sixth embodiment)
An electronic device 21 and an electronic element mounting board 1 according to a sixth embodiment of the present invention will be described with reference to FIG. 9 shows a perspective view of the substrate 2. FIG. Note that the frame body 5, the frame body connection member 15, the electrode pads 3, and the electronic element 10 are omitted in FIG.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the shapes of the plurality of grooves 2b are different when viewed from above.

In the example shown in FIG. 9, the plurality of grooves 2b are V-shaped when viewed from above. In other words, the plurality of grooves 2b have a shape that widens from the center side of the substrate toward the outer periphery side of the substrate when viewed from above. Even with such a configuration, it is possible to obtain the effects of the present invention. In addition, since the groove portion 2b has a shape that widens from the center side of the substrate toward the outer periphery side of the substrate when viewed from above, it becomes easy to push out the air accumulated inside the groove portion 2b when the frame connecting member 15 flows. The connection member 15 can easily enter the groove 2b. In addition, in the example shown in FIG. 9, since the side surfaces of the plurality of grooves 2b are inclined and straight when viewed from above, the frame connecting member 15 can easily enter the grooves 2b. This makes it possible to improve the bonding strength between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

When the plurality of grooves 2b are V-shaped in top view, the vertices may be arc-shaped. This makes it difficult for a gap to occur between the frame connecting member 15 and the groove portion 2b, thereby reducing deterioration and peeling of the frame connecting member 15 due to gas in the gap. Therefore, it is possible to reduce the possibility that the frame 5 of the electronic element mounting substrate 1 and the substrate 2 are separated from each other, and it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. .

(Seventh embodiment)
An electronic device 21 and an electronic element mounting substrate 1 according to a seventh embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG. 10 and 11 show perspective views of the substrate 2. FIG. 10 and 11, frame body 5, frame body connection member 15, electrode pad 3, and electronic element 10 are omitted.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the shapes of the plurality of grooves 2b are different when viewed from above.

In the example shown in FIGS. 10 and 11, the plurality of grooves 2b are U-shaped (rectangular) when viewed from above. The U-shape means, for example, a shape surrounded on three sides. Even with such a configuration, it is possible to obtain the effects of the present invention. Further, since the plurality of grooves 2b are U-shaped, it is possible to further increase the bonding area between the frame connecting member 15 and the plurality of grooves 2b. This makes it possible to improve the bonding strength between the frame 5 and the substrate 2 . Therefore, it is possible to further improve the effects of the present invention.

When the plurality of grooves 2b has this character shape (rectangular shape) when viewed from above, the apex thereof may be arcuate. This makes it difficult for a gap to occur between the frame connecting member 15 and the groove portion 2b, thereby reducing deterioration and peeling of the frame connecting member 15 due to gas in the gap. Therefore, it is possible to reduce the possibility that the frame 5 of the electronic element mounting substrate 1 and the substrate 2 are separated from each other, and it is possible to reduce the occurrence of malfunctions when the electronic device 21 operates. .

The lower ends of the plurality of grooves 2b may be located within the inclined portion 2a as in the example shown in FIG. 10, or part of them may be located outside the inclined portion 2a as in the example shown in FIG. may When the lower ends of the plurality of grooves 2b are positioned within the inclined portion 2a, the effects of the present invention can be achieved while maintaining the rigidity of the substrate 2. FIG. Moreover, when a part of the lower ends of the plurality of grooves 2b is located outside the inclined portion 2a, more bonding material can be used, and the bonding strength can be further improved. In either case, since the groove portion 2b is positioned within the inclined portion 2a, the effects of the present invention can be obtained.

When a plurality of grooves 2b are provided on each side of the substrate 2, the grooves 2b may have different shapes when viewed from above. Furthermore, the shapes of the plurality of grooves 2b provided on one side when viewed from the top may be different from each other. By these, it becomes possible to play|play the effect mentioned above in each groove part 2b, respectively.

The present invention is not limited to the examples of the embodiments described above, and various modifications such as numerical values are possible. Further, for example, in the examples shown in the drawings, the shape of the electrode pad 3 is rectangular when viewed from above, but it may be circular or other polygonal shapes. In addition, the arrangement, number, and shape of the electrode pads 3, the mounting method of the electronic elements, and the like in this embodiment are not specified. Various combinations of characteristic portions in this embodiment are not limited to the examples of the above embodiments.

REFERENCE SIGNS LIST 1 Electronic element mounting substrate 2 Substrate 2a Inclined portion 2b Groove portion 3 Electrode pad 4 Mounting area 5 Frame body 10 Electronic element 13 Electronic element connection member 15 Frame connection member 21 Electronic device 31 Electronic module 32 Housing

Claims (10)

a substrate having a mounting region on which an electronic element is mounted;
a frame body including a metal material and positioned to surround the mounting area in a plan view on the upper surface of the substrate;
The substrate has an inclined portion from the upper surface to the side surface, the substrate and the frame have joint portions on the upper surface and the inclined portion, and the inclined portion has a plurality of grooves ,
An electronic element mounting substrate , wherein an outer edge of the frame body is located outside an outer edge of the substrate in plan view . a substrate having a mounting region on which an electronic element is mounted;
a frame body including a metal material and positioned to surround the mounting area in a plan view on the upper surface of the substrate;
The substrate has an inclined portion from the upper surface to the side surface, the substrate and the frame have joint portions on the upper surface and the inclined portion, and the inclined portion has a plurality of grooves ,
An electronic device mounting substrate, wherein the plurality of grooves are continuously positioned from the side surface of the substrate to the upper surface of the substrate. a substrate having a mounting area on which an electronic element is mounted on the upper surface;
a frame including a metal material and positioned to surround the mounting area in a plan view on the upper surface of the substrate;
The substrate has an inclined portion from the upper surface to the side surface, the substrate and the frame have joint portions on the upper surface and the inclined portion, and the inclined portion has a plurality of grooves ,
The substrate has a plurality of layers,
the inclined portion is located from the lower surface of the uppermost layer to the upper surface of the uppermost layer among the plurality of layers;
The substrate for mounting an electronic device , wherein the plurality of grooves are positioned from the upper surface to the lower surface of the uppermost layer . 4. The substrate for mounting an electronic element according to claim 2 , wherein an outer edge of said frame body is located outside an outer edge of said substrate in plan view. 5. The substrate for mounting an electronic element according to claim 1 , wherein the inclined portion is positioned over the entire circumference of the substrate. 6. The electronic element mounting board according to claim 1 , wherein the plurality of grooves are positioned parallel to each other. The substrate has a recess,
7. The substrate for mounting an electronic element according to claim 1 , wherein the mounting area is located on the bottom surface of the recess. The substrate has a plurality of layers,
3. The substrate for mounting an electronic element according to claim 1 , wherein the inclined portion is located from the lower surface of the uppermost layer of the plurality of layers to the upper surface of the uppermost layer. An electronic device mounting substrate according to any one of claims 1 to 8;
and an electronic device mounted in the mounting region of the electronic device mounting board. an electronic device according to claim 9;
and a housing positioned on the electronic device.

Images