JP2020188236A - Electronic component mounting package and electronic device - Google Patents

Abstract

To provide an electronic component mounting package capable of preventing convergence of stress to an electronic component, and to provide an electronic device.SOLUTION: An electronic component mounting package 1 includes: a base body 2 which has a principal plane and a recess 2d formed in the principal plane; and an electronic component mounting part 11 mounted with a curved electronic component 10 formed on a bottom plane 4 of the recess 2d and an opening 2c of the recess 2d. The electronic component mounting package 1 has an arced part 2e or an inclination part 2f between the principal plane and an inner wall of the recess 2d in the electronic component mounting part 11 of the opening 2c.SELECTED DRAWING: Figure 1

Description

The present invention relates to curved electronic components such as CCD (Charge Coupled Device) type or CMO.
The present invention relates to an electronic component mounting package and an electronic device on which electronic components such as an S (Complementary Metal Oxide Semiconductor) type image sensor and a light emitting element such as an LED (Light Emitting Diode) are mounted.

Curved electronic components have been conventionally known, and as a package for mounting electronic components on which curved electronic components are mounted, an insulating substrate having a mounting portion and a curved electronic component connected to an upper surface of the insulating substrate are connected. It has a pad. Some of the mounting portions of the electronic component mounting package have through holes, and by mounting the curved electronic component on the electronic component mounting package, it becomes an electronic device.

Japanese Unexamined Patent Publication No. 2004-356175

Generally, in the process of wire-bonding a curved electronic component to an electronic component mounting package, stress is applied to the curved electronic component at the time of wire bonding to the curved electronic component or at the time of fixing the curved electronic component. Therefore, in the process of mounting the curved electronic component, when the above-mentioned stress is applied to the curved electronic component, the curved electronic component comes into contact with the corner portion between the main surface of the electronic component mounting package and the inner wall of the through hole. Stress may be concentrated on the part to be used. There was a concern that the curved electronic component would be distorted or cracked due to the concentration of stress in the process of mounting the curved electronic component. In addition, there is a concern that cracks or cracks may occur at the corners between the main surface of the electronic component mounting package and the inner wall of the through hole, and the curved electronic component may not be fixed well.

The electronic component mounting package according to one aspect of the present invention has a curved shape provided on a main surface, a substrate having a recess provided on the main surface, a bottom surface of the recess, and an opening of the recess. It has an electronic component mounting portion on which electronic components are mounted, and has an arc-shaped portion or an inclined portion between the main surface and the inner wall of the recess in the electronic component mounting portion of the opening.

The electronic device according to one aspect of the present invention includes the above-mentioned electronic component mounting package and the curved electronic component mounted on the electronic component mounting package.

The electronic component mounting package of the present invention is an electronic component on which a main surface, a substrate having recesses provided on the main surface, and curved electronic components provided on the bottom surface of the recess and the opening of the recess are mounted. It has a mounting portion, and has an arc-shaped portion or an inclined portion between the main surface and the inner wall of the recess in the electronic component mounting portion of the opening. As a result, in the process of mounting the curved electronic component, the stress at the time of wire bonding to the curved electronic component or the fixing of the curved electronic component is generated between the main surface of the electronic component mounting package and the inner wall of the recess. It is possible to reduce the concentration of stress on the portion of the curved electronic component that comes into contact with the main surface of the electronic component mounting package and the inner wall of the recess. .. Therefore, it is possible to reduce the occurrence of distortion or cracks in the curved electronic component. Further, it is possible to reduce the concentration of stress between the main surface of the electronic component mounting package and the inner wall of the recess. Therefore, it is possible to reduce the occurrence of cracks or cracks between the main surface of the electronic component mounting package and the inner wall of the recess, and it is possible to satisfactorily fix the curved electronic component.

Since the electronic device according to one aspect of the present invention has the above-mentioned electronic component mounting package, cracks or cracks occur between the main surface of the curved electronic component or the electronic component mounting package and the inner wall of the recess. It is possible to reduce this.

(A) is a top view showing the appearance of the electronic component mounting package and the electronic device according to the first embodiment of the present invention, and (b) is a vertical section corresponding to the line AA of (a). It is a top view. (A) is a top view showing the appearance of the electronic component mounting package and the electronic device according to another aspect of the first embodiment of the present invention, and (b) is the line AA of (a). It is a vertical sectional view corresponding to. (A) is a top view showing the appearance of the electronic module according to the second embodiment of the present invention, and (b) is a vertical sectional view corresponding to the line AA of (a). It is a vertical cross-sectional view of the electronic component mounting package and the electronic device which concerns on 3rd Embodiment of this invention. It is a vertical sectional view of the package for mounting an electronic component, and an electronic device which concerns on another aspect of 3rd Embodiment of this invention. (A) is a top view showing the appearance of the electronic component mounting package and the electronic device according to the fourth embodiment of the present invention, and (b) is another aspect of the fourth embodiment of the present invention. It is a top view which shows the appearance of the electronic component mounting package and an electronic device which concerns on.

Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an electronic component mounting package having a plurality of electronic component mounting portions will be referred to as an electronic component mounting package. Further, the electronic device is configured in which curved electronic components are mounted on a package for mounting electronic components. The electronic component mounting package and the electronic device may be in either direction upward or downward, but for convenience, the Cartesian coordinate system xyz is defined and the upper surface is defined with the positive side in the z direction as upward. Alternatively, the word on the bottom surface shall be used.

(First Embodiment)
The electronic device 21 and the electronic component mounting package 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. The electronic device 21 in this embodiment has an electronic component mounting package 1 and a curved electronic component 10.

In the example shown in FIG. 1, the electronic component mounting package 1 is provided on a main surface, a base 2 having a recess 2d provided on the main surface, a bottom surface 4 of the recess 2d, and an opening 2c of the recess 2d. It has an electronic component mounting portion 11 on which a curved curved electronic component 10 is mounted, and an arc-shaped portion 2e or an arc-shaped portion 2e or an arc-shaped portion 2e between the main surface and the inner wall of the recess 2d in the electronic component mounting portion 11 of the opening 2c. It has an inclined portion 2f.

In the examples shown in FIGS. 1 and 2, the substrate 2 has a main surface and a recess 2d provided on the main surface. Further, in the examples shown in FIGS. 1 and 2, a curved electronic component connecting pad 3 is provided on the main surface of the substrate 2.

The substrate 2 is formed by forming a wiring conductor described later on an insulating substrate. As the material of this insulating substrate, for example, electrically insulating ceramics, resin, or the like is used.

Examples of the electrically insulating ceramics used as the material of the insulating substrate of the substrate 2 include an aluminum oxide sintered body, a mulite sintered body, a silicon carbide sintered body, an aluminum nitrided sintered body, and a silicon nitride calcined material. Examples thereof include a body and a glass-ceramic sintered body.

Examples of the resin used as the material of the insulating substrate of the substrate 2 include epoxy resin, polyimide resin, acrylic resin, phenol resin, fluororesin and the like. Examples of the fluorine-based resin include polyester resin and tetrafluoroethylene resin.

As shown in the examples shown in FIGS. 1 and 2, the substrate 2 is formed by laminating a plurality of insulating layers made of the above-mentioned materials one above the other.

The substrate 2 may be formed of four insulating layers as in the examples shown in FIGS. 1 and 2, or may be formed of a single layer to three layers or five or more insulating layers. In the examples shown in FIGS. 1 and 2, the substrate 2 is formed of four insulating layers.

The substrate 2 may be provided with electrodes for connecting an external circuit on the upper surface, the side surface, or the lower surface. The electrode for connecting an external circuit is provided, for example, for electrically connecting the electronic device 21 and the external device or the like.

Inside the substrate 2, a wiring conductor including a through conductor for conducting each insulating layer and an internal wiring may be provided, or the substrate 2 may have a wiring conductor exposed on the surface. Further, the external circuit connection electrode and the curved electronic component connection pad 3 may be electrically connected by the wiring conductor. Further, each wiring conductor provided inside each frame body 2a forming the substrate 2 may be electrically connected by a wiring conductor or the like exposed on the surface of each frame body 2a.

When the base 2 is made of electrically insulating ceramics, the curved electronic component connecting pad 3, the external circuit connecting electrode and the wiring conductor are made of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag). ) Or copper (Cu), or an alloy containing at least one metal material selected from these. Further, when the substrate 2 is made of resin, the curved electronic component connecting pad 3, the external circuit connecting electrode and the wiring conductor are copper (Cu), gold (Au), aluminum (Al), nickel (Ni). , Chromium (Cr), molybdenum (Mo) or titanium (Ti), or an alloy containing at least one metal material selected from these.

It is preferable that a plating layer is provided on the exposed surfaces of the curved electronic component connecting pad 3, the external circuit connecting electrode, and the wiring conductor. According to this configuration, it is possible to protect the exposed surfaces of the curved electronic component connecting pad 3, the external circuit connecting electrode, and the wiring conductor to prevent oxidation. Further, according to this configuration, it is possible to improve the electrical connection between the curved electronic component connecting pad 3 and the curved electronic component 10 via wire bonding or the like. The plating layer is, for example, coated with a Ni plating layer having a thickness of 0.5 to 10 μm. Alternatively, a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be adhered on the Ni plating layer.

As shown in the examples shown in FIGS. 1 and 2, the electronic component mounting package 1 is an electronic component on which a curved electronic component 10 provided in the bottom surface 4 of the recess 2d and the opening 2c of the recess 2d is mounted. It has a mounting unit 11.

The electronic component mounting unit 11 refers to an area on which the curved electronic component 10 is mounted. In the examples shown in FIGS. 1 and 2, the electronic component mounting portion 11 is inside the curved electronic component connecting pad 3, and is a region overlapping the outer edge portion of the curved electronic component 10 in a plan view, or curved electrons. The area outside the outer edge of the component 10 is shown. Further, the electronic component mounting portion 11 may be an area including the curved electronic component connecting pad 3.

In the example shown in FIG. 1, the electronic component mounting portion 11 of the opening 2c of the electronic component mounting package 1 has an arc-shaped portion 2e between the main surface and the inner wall of the recess 2d.

In the example shown in FIG. 2, an inclined portion 2f is provided between the main surface and the inner wall of the recess 2d in the electronic component mounting portion 11 of the opening 2c of the electronic component mounting package 1.

As shown in the examples shown in FIGS. 1 and 2, a step of mounting the curved electronic component 10 by having an arc-shaped portion 2e or an inclined portion 2f between the main surface of the substrate 2 and the inner wall of the recess 2d. In the above, the stress at the time of wire bonding to the curved electronic component 10 or at the time of fixing the curved electronic component 10 is an arc-shaped portion 2e or an inclined portion between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. The components are dispersed at 2f, and it is possible to reduce the concentration of stress on the portion of the curved electronic component 10 that comes into contact with the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. Therefore, it is possible to reduce the occurrence of distortion or cracks in the curved electronic component 10. Further, it is possible to reduce the concentration of stress between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d, and between the main surface of the electronic component mounting package 1 and the inner wall of the recess 2d. It is possible to reduce the occurrence of cracks or cracks in the surface. Therefore, the curved electronic component 10 can be satisfactorily fixed.

Further, as shown in FIG. 2, since the electronic component mounting package 1 has the inclined portion 2f, the shape of the lower surface of the curved electronic component 10 and the shape of the inclined portion 2f can be partially approximated, so that the curved electronic component 10 can be better fixed.

The arcuate portion 2e provided between the main surface of the substrate 2 and the inner wall of the recess 2d has a radius R of 0.05 mm or more, so that the space between the main surface of the substrate 2 and the inner wall of the recess 2d Therefore, the arc-shaped portion 2e can be reliably provided, and the stress applied to the portion in contact with the curved electronic component 10 can be more reliably reduced.

Further, when the angle θ formed by the inclined portion 2f and the concave portion 2d is θ ≧ 110 °, the lower surface of the curved electronic component 10 is likely to be along the inclined portion 2f. Therefore, mounting becomes easy in the process of mounting the curved electronic component 10, and the curved electronic component 10 can be stably mounted. Further, when the angle θ formed by the inclined portion 2f and the side wall of the recess 2d is θ <110 °, the height of the frame body 2a can be reduced. Further, since the radius r of the curved electronic component 10 can be increased, the stress applied to the curved electronic component 10 can be reduced.

Further, the inclined portion 2f may have a concave curved surface along the lower surface of the curved electronic component 10. As a result, the curved electronic component 10 can be mounted more stably in the step of mounting.

Further, as in the examples shown in FIGS. 1 and 2, the curved electronic component 10 is in contact with the bottom surface 4 of the recess 2d. As a result, the position of the curved electronic component 10 can be satisfactorily fixed. Further, in the process of mounting the curved electronic component 10, since the curved electronic component 10 is in contact with the bottom surface 4, various stresses at the time of mounting can be released to the bottom surface 4, and as a result, the electronic component mounting package 1 It is possible to reduce the concentration of stress between the main surface and the inner wall of the recess 2d and the contact portion with the curved electronic component 10.

In the examples shown in FIGS. 1 and 2, the substrate 2 is made of one kind of material. Further, as will be described later, the substrate 2 of the electronic component mounting package 1 may be composed of a frame body 2a and a flat plate 2b provided on the lower surface thereof. At this time, the material used for the frame body 2a is, for example, electrically insulating ceramics or resin, and the material used for the flat plate 2b is, for example, electrically insulating ceramics, resin, or metal. Further, the frame body 2a and the flat plate 2b may be provided with a wiring conductor composed of a through conductor and an internal wiring for conducting each insulating layer, or may have a wiring conductor exposed on the surface. Further, at this time, the frame body 2a and the flat plate 2b may be electrically connected.

Next, the electronic device 21 will be described with reference to FIGS. 1 and 2. In the examples shown in FIGS. 1 and 2, the electronic device 21 has an electronic component mounting package 1 and a curved electronic component 10 mounted on the electronic component mounting unit 11.

As the curved electronic component 10, for example, an image pickup element such as a CCD or CMOS type, a light emitting element such as an LED, a semiconductor circuit element, or the like is used. In the examples shown in FIGS. 1 and 2, each electrode of the curved electronic component 10 is electrically connected to the curved electronic component connecting pad 3 by a connecting member 13 (bonding wire).

The electronic device 21 of the present invention includes the electronic component mounting package 1 having the above configuration and the curved electronic component 10 mounted on the electronic component mounting unit 11, whereby the curved electronic component 10 or the electronic component is mounted. It is possible to reduce the occurrence of cracks or cracks in the opening 2c of the portion 11.

Next, an example of the manufacturing method of the electronic component mounting package 1 of the present embodiment will be described.

An example of the manufacturing method shown below is a manufacturing method using a large number of wiring boards.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, in the case of obtaining a substrate 2 which is an aluminum oxide (Al ₂ O ₃ ) quality sintered body, silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) or calcia (CaO) is added to the powder of Al ₂ O ₃ as a sintering aid. ) And other powders are added, and appropriate binders, solvents and plasticizers are added, and then the mixture thereof is kneaded to form a slurry. After that, a ceramic green sheet for taking a large number of pieces is obtained by a molding method such as a conventionally known doctor blade method or a calender roll method.

When the substrate 2 is made of resin, for example, the substrate 2 can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold capable of molding into a predetermined shape.

Further, the substrate 2 may be a substrate made of glass fibers impregnated with a resin, for example, a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a base material made of glass fiber with a precursor of an epoxy resin and thermosetting the epoxy resin precursor at a predetermined temperature.

(2) Next, wiring including a curved electronic component connection pad 3, an external circuit connection electrode, a through conductor, and internal wiring in the ceramic green sheet obtained in the step (1) above by a screen printing method or the like. A metal paste is applied or filled in the part to be a conductor.

This metal paste is produced by adding an appropriate solvent and a binder to the metal powder made of the above-mentioned metal material and kneading the paste to adjust the viscosity to an appropriate level. The metal paste may contain glass and ceramics in order to increase the bonding strength with the substrate 2.

(3) Next, a ceramic green sheet to be a substrate 2 having the recess 2d is prepared. In order to prepare the substrate 2 having the recess 2d, for example, there is a method of preparing a ceramic green sheet to be a frame body 2a and a flat plate 2b, and integrating them by a step of laminating and pressurizing described later. The ceramic green sheet to be the frame body 2a can be produced by punching out a portion to be an opening 2c by using, for example, a mold or laser processing. Further, a plurality of ceramic green sheets may be laminated and pressed to produce a ceramic green sheet laminate, and then the portion to be the opening 2c may be punched out.

When the opening 2c has an arc-shaped portion 2e, it can be created in the step of creating the opening 2c. For example, a ceramic green sheet to be a frame body 2a may be created in a step of creating the opening 2c with a normal mold, and then pressed with a mold having an arc-shaped portion to form the ceramic green sheet. Further, for example, when forming the opening 2c using a mold, an arc-shaped portion is provided at the base of the convex mold, punched out, and pressed to form the opening 2c and the arc-shaped portion 2e in one step. can do.

When the opening 2c has the inclined portion 2f, it can be created in the step of creating the opening 2c. For example, when a die is used, it can be produced by punching using a convex die and a die having a concave portion larger than the size of the convex.

Further, even if the ceramic green sheet to be the frame body 2a punched out by the above-mentioned die and the ceramic green sheet to be the frame body 2a punched out by the normal die are integrated in the step of laminating and pressurizing described later. good.

For example, a ceramic green sheet to be a frame body 2a may be created in a step of creating the opening 2c with a normal mold, and then pressed with a mold having an inclined portion to form the ceramic green sheet. Further, for example, when forming the opening 2c using a mold, an inclined portion is provided at the base of the convex mold, punched out, and pressed to form the opening 2c and the inclined portion 2f in one step. be able to.

(4) Next, a ceramic green sheet laminate to be the substrate 2 is produced by laminating and pressurizing the ceramic green sheets to be the insulating layers. At this time, the ceramic green sheet laminate to be the integrated substrate 2 can be produced by laminating and pressurizing the ceramic green sheet to be the frame body 2a and the ceramic green sheet to be the flat plate 2b described above.

Further, in the step of laminating and pressurizing the ceramic green sheet to be the frame body 2a and the ceramic green sheet to be the flat plate 2b, the arcuate portion is pressed by using a mold having a curved surface or an inclined portion at the position of the opening 2c. It is possible to form a ceramic green sheet laminate to be a substrate 2 while forming 2e or an inclined portion 2f.

(5) Next, this ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C. to obtain a multi-layer wiring board in which a plurality of substrates 2 are arranged. By this step, the metal paste described above is fired at the same time as the ceramic green sheet serving as the base 2, and becomes a pad 3 for connecting curved electronic components, an electrode for connecting an external circuit, or a wiring conductor.

(6) Next, the multi-layer wiring board obtained by firing is divided into a plurality of substrates 2. In this division, a large number of dividing grooves are formed along the outer edge of the substrate 2 and the wiring board is divided by breaking along the dividing grooves, or the substrate 2 is divided by a slicing method or the like. A method of cutting along the outer edge can be used. The dividing groove can be formed by cutting with a slicing device to be smaller than the thickness of the multi-cavity wiring board after firing, but the cutter blade may be pressed against the ceramic green sheet laminate for the multi-cavity wiring board. It may be formed by cutting with a slicing device to be smaller than the thickness of the ceramic green sheet laminate.

By the steps (1) to (6) above, the electronic component mounting package 1 is obtained. The process order of (1) to (6) above is not specified.

The electronic device 21 can be manufactured by mounting the curved electronic component 10 on the electronic component mounting portion 11 of the electronic component mounting package 1 thus formed.

(Second Embodiment)
Next, the electronic component mounting package 1 and the electronic device 21 according to the second embodiment of the present invention will be described with reference to FIG.

The electronic device 21 of the present embodiment is different from the electronic device 21 of the first embodiment in that the substrate 2 is composed of a frame body 2a and a flat plate 2b made of a material different from the frame body 2a.

In the example shown in FIG. 3, the substrate 2 is composed of a frame body 2a and a flat plate 2b provided on the lower surface of the frame body 2a, and the flat plate 2b is made of a metal material.

Generally, the temperature of the curved electronic component 10 increases due to heat generated when the curved electronic component 10 operates or heat generated in the process of mounting the curved electronic component 10. At this time, when the operation of the curved electronic component is completed or when the mounting process of the curved electronic component 10 is completed, the heat generation is eliminated, so that the curved electronic component 10 is thermally shrunk. Due to the shrinkage, the curved electronic component 10 and the main surface of the electronic component mounting package 1 and the inner wall of the concave portion 2d rub against each other, resulting in distortion or cracking of the curved electronic component 10, or the main surface of the substrate 2 and the concave portion 2d. It was feared that it was one of the causes of the crack between the inner wall and the wall. As in the example shown in FIG. 3, since the flat plate 2b is made of a metal material, the heat generated when the curved electronic component 10 is operated or in the process of mounting the curved electronic component 10 is efficiently dissipated. This makes it possible to reduce the rise in temperature of the curved electronic component 10. Therefore, the magnitude of heat shrinkage of the curved electronic component 10 can be reduced, and distortion or cracking of the curved electronic component 10 and cracking between the main surface of the substrate 2 and the inner wall of the recess 2d occur. Can be reduced.

Here, when the flat plate 2b is made of a metal material, the flat plate 2b is made of, for example, stainless steel (SUS), Fe—Ni—Co alloy, 42 alloy, copper (Cu), copper alloy or the like. Further, the material used for the frame body 2a is, for example, electrically insulating ceramics or resin. Further, for example, when the main component of the frame body 2a is an aluminum oxide sintered body having a thermal expansion coefficient of about 5 × 10 ^-6 / ° C. to 10 × 10 ^-6 / ° C., the flat plate 2b is about 10 × 10 ^−. Stainless steel (SUS410) having a coefficient of thermal expansion of ⁶ / ° C. is preferable. In this case, since the difference in thermal contraction and the difference in thermal expansion between the frame body 2a and the flat plate 2b becomes small when the electronic device 21 is operated, the thermal stress applied to the bonding material that joins the frame body 2a and the flat plate 2b is increased. It can be relaxed and the dissociation between the frame body 2a and the flat plate 2b can be reduced.

As a method of joining the frame 2a and the flat plate 2b, for example, a paste-like thermosetting resin (adhesive member) is applied to the joint surface of either the frame 2a or the flat plate 2b by a screen printing method, a dispensing method, or the like to form a tunnel. After drying in a type atmosphere furnace or oven or the like, the frame 2a and the flat plate 2b are overlapped and passed through a tunnel type atmosphere furnace or oven or the like and heated at about 150 ° C. for about 90 minutes to join. The material is completely thermoset, and the frame body 2a and the flat plate 2b are firmly adhered to each other.

The flat plate 2b is bonded to the frame 2a by a bonding material made of a brazing material, a thermosetting resin, low melting point glass, or the like. Further, the bonding material may be a conductive material such as an anisotropic conductive film (ACF). As the thermosetting resin, for example, a bisphenol A type liquid epoxy resin or the like is used. By using a bonding material that is not denatured by heat during mounting or operation of the curved electronic component 10, it is preferable that the frame 2a and the flat plate 2b are separated from each other during mounting or operation of the curved electronic component 10. It is preferable because it can be suppressed to.

The bonding material is, for example, a main agent made of bisphenol A type liquid epoxy resin, bisphenol F type liquid epoxy resin, phenol novolac type liquid resin, etc., a filler made of spherical silicon oxide, etc., and an acid anhydride such as tetrahydromethylphthalic anhydride. It is obtained by adding carbon powder or the like as a curing agent and a coloring agent mainly for the above, mixing and kneading with a centrifugal stirrer or the like to form a paste.

In addition, as the bonding material, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative. Epoxy resins such as epoxy resins and bisphenol skeleton type epoxy resins to which curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, and dicyandiamide are added are used. can do.

(Third Embodiment)
Next, the electronic component mounting package 1 and the electronic device 21 according to the third embodiment of the present invention will be described with reference to FIGS. 4 to 5.

The difference between the electronic device 21 of the present embodiment and the electronic device 21 of the second embodiment is that the bottom surface 4 of the recess 2d is concave or convex in the thickness direction in a cross-sectional view, and the curved electronic component 10 The point is that the adhesive 19 is provided between the bottom surface 4 and the bottom surface 4.

In the example shown in FIG. 4, the bottom surface 4 of the recess 2d is concave in the thickness direction of the substrate 2 in a vertical cross-sectional view. That is, the bottom surface 4 of the recess 2d of the electronic component mounting package 1 has a minimum point 4b in the thickness direction. Further, in the example shown in FIG. 4, the concave minimum point 4c of the bottom surface 4 of the recess 2d overlaps with the center of the electronic component mounting portion 11 in a plan view.

As shown in the example shown in FIG. 4, when the electronic component mounting package 1 has the lowest point 4b on the bottom surface 4, it becomes easy to mount the curved electronic component 10 at a predetermined position. Further, since the lowest point 4b overlaps with the center of the electronic component mounting portion 11 in a plan view, it becomes easy to mount the curved electronic component 10 at the center of the electronic component mounting portion 11, and the mountability can be improved. It becomes.

In the example shown in FIG. 5, the bottom surface 4 of the recess 2d is convex in the thickness direction of the substrate 2 in a vertical cross-sectional view. That is, the bottom surface 4 of the recess 2d of the electronic component mounting package 1 has a maximum point 4a in the thickness direction. Further, in the example shown in FIG. 5, the convex maximum point 4a of the bottom surface 4 of the concave portion 2d overlaps with the center of the electronic component mounting portion 11 in a plan view.

As shown in the example shown in FIG. 5, when the electronic component mounting package 1 has the highest point 4a on the bottom surface 4, the distance from the opening 2c of the substrate 2 to the bottom surface 4 can be reduced. Therefore, since it is possible to mount the curved electronic component 10 without reducing the radius r, it is possible to reduce the stress applied to the curved electronic component 10. Further, since the highest point 4a overlaps with the center of the electronic component mounting portion 11 in a plan view, when the curved electronic component 10 is mounted, the most protruding portion of the curved electronic component 10 and the highest point 4a can easily come into contact with each other. Therefore, it is possible to improve the mountability of the curved electronic component 10.

Further, in the examples shown in FIGS. 4 and 5, the adhesive 19 is provided between the curved electronic component 10 and the bottom surface 4. As a result, the curved electronic component 10 can be securely fixed, so that the possibility that the opening 2c of the electronic component mounting package 1 and the curved electronic component 10 are rubbed by the movement of the curved electronic component 10 can be reduced. It is possible to reduce the possibility that the curved electronic component 10 is distorted or cracked, and the possibility that the opening 2c of the curved electronic component 10 is cracked. Further, in particular, since the bottom surface 4 has the highest point 4a as shown in FIG. 5, the fillet shape of the adhesive 19 becomes a concave curved shape. This makes it possible to increase the stress that the adhesive 19 pulls the curved electronic component 10 toward the bottom surface 4. Therefore, the curved electronic component 10 can be more firmly adhered to the bottom surface 4, and the electronic component mounting package 1 and the curved electronic component 10 can be more firmly bonded to each other.

As a method of providing the highest point 4a or the lowest point 4b on the bottom surface, when the substrate 2 or the flat plate 2b is made of electrically insulating ceramics, in the step of laminating and pressurizing a plurality of ceramic green sheets, for example, the bottom surface is made of a mold or resin. By pressing the portion to be 4 from the upper surface or the lower surface, it is possible to form the highest point 4a or the lowest point 4b on the bottom surface 4. Further, by sucking the portion to be the bottom surface 4 from the upper surface or the lower surface, it is possible to form the highest point 4a and the lowest point 4b on the bottom surface 4. When the flat plate 2b is made of a metal plate, the highest point 4a or the lowest point 4b can be formed on the metal plate material by press working or etching using a conventionally known mold. After that, when the flat plate 2b is made of a metal such as Fe—Ni—Co alloy, 42 alloy, Cu, or copper alloy, a nickel plating layer and a gold plating layer may be adhered to the surface thereof. Thereby, oxidative corrosion of the surface of the flat plate 2b can be effectively prevented.

(Fourth Embodiment)
Next, the electronic component mounting package 1 and the electronic device 21 according to the fourth embodiment of the present invention will be described with reference to FIG.

The difference between the electronic device 21 of the present embodiment and the electronic device 21 of the first embodiment is that the shape of the opening 2c is different in a plan view.

In the example shown in FIG. 6A, the opening 2c of the recess 2d has a rectangular shape, and at least one set of opposite sides of the rectangular opening 2c has a notch 2g. In FIG. 5A, a total of four notches 2g are provided on the two opposite sets of sides.

Generally, when the curved electronic component 10 is mounted in the rectangular opening 2c, the curved electronic component 10 is supported by one point on each side, that is, four points and five points in contact with the bottom surface 4. Become. By having the notch 2g, the curved electronic component 10 is supported at the point where the notch 2g and the opening 2c intersect. Therefore, as shown in the example shown in FIG. 5A, the curved electronic component 10 has eight points in contact with the opening 2c and the bottom surface because the notches 2g are provided on the two sets of opposite sides in total of four. It is possible to support with a total of 9 points, one point in contact with 4, and the curved electronic component 10 can be mounted more stably.

In the example shown in FIG. 5B, the opening 2c of the recess 2d has a circular shape.

Since the opening 2c has a circular shape, the curved electronic component 10 is not supported at each point, but is supported by a line. Therefore, the curved electronic component 10 can be mounted more stably.

As a method of providing such a circular opening 2c and a notch 2g, for example, a ceramic green sheet to be a frame 2a may be formed into a circular shape, a mold having a predetermined notch 2g shape, or laser machining. It can be produced by punching out a portion to be an opening 2c.

The present invention is not limited to the above-described embodiment, and various modifications such as numerical values are possible.

Further, for example, in the examples shown in FIGS. 1 to 6, the shape of the curved electronic component connecting pad 3 is rectangular, but it may be circular or other polygonal shape.

Further, the arrangement, number, shape, etc. of the curved electronic component connecting pads 3 in the present embodiment are not specified.

Further, the various combinations of the feature portions in the present embodiment are not limited to the examples of the above-described embodiment.

1 ... Package for mounting electronic components 2 ... Base 2a ... Frame 2b ... Flat plate 2c ... Opening 2d ... Recess 2e ... Arc-shaped part 2f ... Inclined part 2g ... Notch 3 ... Curved electronic component connection pad 4 ... Bottom surface 4a ... Highest point 4b ... Minimum point 10 ... Curved electronic component 11 ... Electronic Component mounting unit 13 ... Connecting member 19 ... Adhesive 21 ... Electronic device

The electronic component mounting package according to one aspect of the present invention includes a substrate having a main surface, a recess provided on the main surface, and an electronic component mounting portion on which a curved curved electronic component is mounted. The recess has a bottom surface, an inner wall, and a corner portion located between the main surface and the inner wall, and the corner portion is an arc-shaped portion or an inclined portion, and the electron. The component mounting portion includes a part of the bottom surface of the recess and the corner portion located apart from the part .

Claims (7)

A main surface, a substrate having a recess provided on the main surface, and
It has an electronic component mounting portion on which a curved electronic component is mounted, which is provided on the bottom surface of the recess and the opening of the recess.
A package for mounting an electronic component, wherein the electronic component mounting portion of the opening has an arc-shaped portion or an inclined portion between the main surface and the inner wall of the recess. The substrate is composed of a frame body and a flat plate provided on the lower surface of the frame body.
The electronic component mounting package according to claim 1, wherein the flat plate is made of a metal material. The electronic component mounting package according to claim 1 or 2, wherein the bottom surface of the recess is convex or concave in the thickness direction of the substrate in a vertical cross-sectional view. The opening of the recess is rectangular and has a rectangular shape.
The electronic component mounting package according to any one of claims 1 to 3, wherein at least one set of opposite sides of the rectangular opening has a notch. The electronic component mounting package according to any one of claims 1 to 3, wherein the opening of the recess has a circular shape. The electronic component mounting package according to claim 3, wherein the convex or concave center of the bottom surface of the concave portion overlaps the center of the electronic component mounting portion in a plan view. The electronic component mounting package according to any one of claims 1 to 6.
An electronic device having the curved electronic component mounted on the electronic component mounting package.

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