JP2019079987A - Electronic element mounting substrate, electronic device, and electronic module - Google Patents

Abstract

To provide an electronic element mounting substrate that reduces the occurrence of cracks in the substrate from a portion of a gap of an internal conductor due to external stress, and can improve the rigidity of the electronic element mounting substrate.SOLUTION: An electronic element mounting substrate 1 includes a first insulating layer 2a, a second insulating layer 2b located on the lower surface of the first insulating layer 2a, and a third insulating layer 2c located on the lower surface of the second insulating layer 2b. The electronic element mounting substrate 1 further includes a first conductor layer 5a located between the first insulating layer 2a and the second insulating layer 2b and a second conductor layer 5b located between the second insulating layer 2b and the third insulating layer 2c. The first conductor layer 5a has a first gap 5ag. The second conductor layer 5b has a second gap 5bg. In a plan view, the first gap 5ag overlaps with the second conductor layer 5b, and the second gap 5bg overlaps with the first conductor layer 5a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device mounted with an electronic device, for example, an imaging device such as a charge coupled device (CCD) type or a complementary metal oxide semiconductor (CMOS) type, a light emitting element such as a light emitting diode (LED), or an integrated circuit. The present invention relates to a substrate, an electronic device, and an electronic module.

  Conventionally, a substrate for mounting an electronic element provided with a wiring substrate made of an insulating layer has been known. There is also known an electronic device in which an electronic element is mounted on such an electronic element mounting substrate (see Patent Document 1).

JP, 2011-165992, A

  In the electronic device mounting substrate of Patent Document 1, an internal conductor is provided between a plurality of insulating layers. A plurality of internal conductors are provided in the same layer, and a gap is provided between the plurality of internal conductors for the convenience of electrodes such as taking a plurality of electrodes. At this time, in general, the electronic element mounting substrate is required to have improved electrical characteristics. Therefore, the thickness of the inner conductor tends to be increased in order to reduce the electrical resistance. When the thickness of the internal conductor increases, the gaps between the layers also tend to increase. When the gaps between the layers overlap, there is a possibility that the substrate may be cracked or broken due to external stress or the like.

  A substrate for mounting an electronic element according to one aspect of the present invention includes a first insulating layer, a second insulating layer, a third insulating layer, a first conductor layer, and a second conductor layer. The electronic device is located above or below the first insulating layer. The second insulating layer is located on the lower surface of the first insulating layer. The third insulating layer is located on the lower surface of the second insulating layer. The first conductor layer has a first space located between the first insulating layer and the second insulating layer. The second conductor layer has a second gap located between the second insulating layer and the third insulating layer. In a plan view, the first conductor layer is positioned overlapping with the second conductor layer, and the second segment is positioned overlapping with the first conductor layer.

  An electronic device according to an aspect of the present invention includes an electronic element mounting substrate and an electronic element mounted on the electronic element mounting substrate.

  An electronic module according to one aspect of the present invention includes a top surface of the electronic device or a housing positioned surrounding the electronic device.

  The substrate for mounting an electronic element according to one aspect of the present invention can be reduced in the occurrence of a crack or a crack of the substrate for mounting an electronic element by the above-described configuration. Furthermore, by using the electronic device provided with the above-described electronic element mounting substrate, it is possible to provide an electronic device and an electronic module which can improve rigidity.

1 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the first embodiment of the present invention, and FIG. 1 (b) is taken along line X1-X1 in FIG. 1 (a). FIG. Fig.2 (a) is a top view which shows the external appearance of the electronic module based on the 1st Embodiment of this invention, FIG.2 (b) is a longitudinal cross-sectional view corresponding to the X2-X2 line of FIG. 2 (a). is there. FIG. 3 (a) is an enlarged schematic view of the main part A of the electronic element mounting substrate according to the first embodiment of the present invention, and FIG. 3 (b) is an electron according to the first embodiment of the present invention FIG. 6 is a schematic view of another enlarged example of the main part A of the element mounting substrate. FIG. 4A and FIG. 4B are schematic views showing a part of the electronic device mounting board according to the first embodiment of the present invention. FIG. 5A and FIG. 5B are schematic views showing a part of the electronic device mounting board according to the first embodiment of the present invention. 6A and 6B are schematic views showing a part of the electronic element mounting substrate according to the first embodiment of the present invention. 7 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the second embodiment of the present invention, and FIG. 7 (b) is taken along line X7-X7 of FIG. 7 (a). FIG. FIG. 8A is an enlarged schematic view of the main part A of the electronic device mounting substrate according to the second embodiment of the present invention, and FIG. 8B is an electron according to the second embodiment of the present invention FIG. 6 is a schematic view of another enlarged example of the main part A of the element mounting substrate. FIG. 9 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the third embodiment of the present invention, and FIG. 9 (b) is taken along line X9-X9 of FIG. 9 (a). FIG. FIG. 10 (a) is a top view showing an appearance of a substrate for mounting an electronic device and an electronic device according to a third other embodiment of the present invention, and FIG. 10 (b) is an X10-X10 of FIG. It is a longitudinal cross-sectional view corresponding to a line.

<Configuration of Electronic Device Mounting Substrate and Electronic Device>
Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, a configuration in which an electronic element is mounted on a substrate for mounting an electronic element is referred to as an electronic device. Further, a configuration having a housing or a member provided on the upper surface side of the electronic element mounting substrate or surrounding the electronic device is referred to as an electronic module. The electronic element mounting substrate, the electronic device, and the electronic module may have any direction upward or downward, but for convenience, the orthogonal coordinate system xyz is defined, and the positive side in the z direction is upward.

First Embodiment
An electronic module 31, an electronic device 21 and an electronic element mounting substrate 1 according to a first embodiment of the present invention will be described with reference to FIGS. The main part A will be described with reference to FIG. 4 to 6, the first conductor layer 5a having the first gap 5ag located between the first insulating layer 2a and the second insulating layer 2b, the second insulating layer 2b, and the third insulating layer. The second conductor layer 5b having the second gap 5bg located between the layer 2c and the layer 2c will be described. Further, in FIG. 4 to FIG. 6, the first conductor 5a and the second conductor 5b are shown by dots and solid lines.

The electronic element mounting substrate 1 has a first insulating layer 2a, a second insulating layer 2b located on the lower surface of the first insulating layer 2a, and a third insulating layer 2c located on the lower surface of the second insulating layer 2b. ing. The electronic element mounting substrate 1 has a first conductor layer 5a located between the first insulating layer 2a and the second insulating layer 2b, and a third located between the second insulating layer 2b and the third insulating layer 2c. And 2 conductor layers 5b. The first conductor layer 5a has a first gap 5ag. The second conductor layer 5b has a second portion 5bg. In plan view, the first 5ag overlaps with the second conductor layer 5b, and the second
5bg is located overlapping with the first conductor layer 5a.

  The electronic element mounting substrate 1 has a first insulating layer 2a, a second insulating layer 2b located on the lower surface of the first insulating layer 2a, and a third insulating layer 2c located on the lower surface of the second insulating layer 2b. ing. Here, as in the example shown in FIG. 1, the electronic element mounting substrate 1 may have other insulating layers 2e in addition to the first insulating layer 2a, the second insulating layer 2b and the third insulating layer 2c. Good.

  The material of the insulating layer constituting the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and the other insulating layer 2e is, for example, an electrically insulating ceramic or a resin. Hereinafter, the insulating base formed of the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c, and the other insulating layer 2e is referred to as a base 2.

  Examples of electrically insulating ceramics used as materials of the insulating layer forming the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c, and the other insulating layer 2e include, for example, aluminum oxide sintered body, mullite And sintered silicon carbide, sintered aluminum nitride, sintered silicon nitride or sintered glass ceramic.

  As a resin used as a material of the insulating layer which forms the 1st insulating layer 2a, the 2nd insulating layer 2b, the 3rd insulating layer 2c, and other insulating layers 2e, thermoplastic resin, an epoxy resin, a polyimide resin, There are acrylic resin, phenol resin or fluorine resin. Examples of the fluorine-based resin include tetrafluoroethylene resin and the like.

  A plurality of other insulating layers 2e may be stacked vertically on the upper surface of the first insulating layer 2a and / or the lower surface of the third insulating layer 2c. The base 2 comprising the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and / or the other insulating layer 2e may be formed of six insulating layers as shown in FIG. , 5 or less or 7 or more layers of insulating layers. When the number of insulating layers is five or less, thinning of the electronic element mounting substrate 1 can be achieved. When the number of insulating layers is six or more, the rigidity of the electronic element mounting substrate 1 can be increased. In addition, as in the example shown in FIGS. 1 to 2, an opening may be provided in each insulating layer, and a stepped portion may be formed on the upper surface where the sizes of the provided openings are different. 3 may be provided in the step portion.

  For example, the size of one side of the outermost periphery of the electronic element mounting substrate 1 is 0.3 mm to 10 cm, and may be square or rectangular when the electronic element mounting substrate 1 has a rectangular shape in plan view It may be. Further, for example, the thickness of the electronic element mounting substrate 1 is 0.2 mm or more.

  The electronic element mounting substrate 1 is provided between the first conductor layer 5a located between the first insulating layer 2a and the second insulating layer 2b, and between the second insulating layer 2b and the third insulating layer 2c. It has two conductor layers 5b. Further, the base 2 composed of the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and the other insulating layer 2c of the electronic element mounting substrate 1 may have the electrode pad 3 on the surface. Here, the electrode pad 3 may be provided on the surface of any of the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c, and / or the other insulating layer 2c in top view, and the first insulating layer It may be provided on any or all of the surfaces of any of the layer 2a, the second insulating layer 2b, the third insulating layer 2c and / or the other insulating layer 2c.

  Electrodes for external circuit connection may be provided on the upper surface, the side surface, or the lower surface of the base 2. The electrode for external circuit connection electrically connects the base 2 with the external circuit board or the electronic device 21 with the external circuit board.

Furthermore, on the upper surface or the lower surface of the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and / or the other insulating layer 2c of the substrate 2, the electrode pad 3, the first conductor layer 5a, the second conductor layer A through conductor may be provided to connect the inner conductors with each other and the inner conductor layers 5 b and the other inner conductor layers. These inner conductor layers or through conductors may be exposed on the surface of the base 2. The electrode pad 3, the first conductor layer 5 a, the second conductor layer 5 b, and the other internal conductor layers may be electrically connected to the electrodes for external circuit connection by the internal conductor layers or the through conductors.

  The electrode pad 3, the first conductor layer 5a, the second conductor layer 5b, the electrode for connecting an external circuit, the inner conductor layer and the through conductor are the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and others When the insulating layer 2e is made of an electrically insulating ceramic, tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu) or at least one metal selected from these It consists of an alloy etc. which contain material. The electrode pad 3, the first conductor layer 5a, the second conductor layer 5b, the electrode for connecting an external circuit, the inner conductor and the through conductor are the first insulating layer 2a, the second insulating layer 2b, the second insulating layer 2c and When the other insulating layer 2e is made of resin, copper (Cu), gold (Au), aluminum (Al), nickel (Ni), molybdenum (Mo) or titanium (Ti), or at least one selected from these. There are alloys etc. containing the above metal materials.

  A plated layer may be provided on the exposed surfaces of the electrode pad 3, the electrode for external circuit connection, the internal conductor, and the through conductor. According to this configuration, the exposed surface of the electrode for connecting the external circuit, the internal conductor and the through conductor can be protected to suppress oxidation. Moreover, according to this configuration, the electrode pad 3 and the electronic element 10 can be electrically connected favorably through the electronic element connection material 13 such as wire bonding. The plating layer may be, for example, a Ni plating layer having a thickness of 0.5 μm to 10 μm, or the Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 μm to 3 μm in sequence. Good.

  The first conductor layer 5a has a first gap 5ag. Further, the first conductor layer 5a has a first conductor 5aa and a second conductor 5ab. During the first period 5ag is located between the first conductor 5aa and the second conductor 5ab. The first conductor 5aa and the second conductor 5ab can be electrically isolated by the first gap 5ag. When the first conductor 5aa and the second conductor 5ab are insulated, the first conductor 5aa and the second conductor 5ab have different power supply potentials and different signal signal lines, and when the first conductor 5aa and the second conductor 5ab are not insulated, the first The three conductors 5ba and the fourth conductor 5bb have the same power supply potential and the same signal signal line. In the case of the same power supply potential and the same signal signal line, for example, conduction may be performed in another part such as the upper layer or the lower layer. The first interval 5ag between the first conductor 5aa and the second conductor 5ab may be, for example, 20 μm or more or 1% or more of one side of the base 2.

  The first conductors 5aa and the second conductors 5ab may be solid, that is, wide plane conductors used for the ground or power supply potential. When the first conductor 5aa and the second conductor 5ab are wide plane conductors used for the ground or power supply potential, for example, a signal conductor is provided between the first conductor 5aa and the second conductor 5ab and the first 5ag. It may be done. For example, in the wide plane, one side of the wide plane may be 150 μm or more.

  The second conductor layer 5b has a second portion 5bg. The second conductor layer 5b has a third conductor 5ba and a fourth conductor 5bb. During the second period 5bg is located between the third conductor 5ba and the fourth conductor 5bb. The third conductor 5ba and the fourth conductor 5bb can be electrically isolated by the second portion 5bg. When the third conductor 5ba and the fourth conductor 5bb are insulated, the third conductor 5ba and the fourth conductor 5bb have different power supply potentials and different signal signal lines, and when the third conductor 5ba and the fourth conductor 5bb are not insulated The third conductor 5ba and the fourth conductor 5bb have the same power supply potential and the same signal signal line. In the case of the same power supply potential and the same signal signal line, it may be conducted in another part such as the upper layer or the lower layer. The second interval 5bg between the third conductor 5ba and the fourth conductor 5bb may be, for example, 20 μm or more or 1% or more of one side of the base 2.

  The third conductor 5ba and the fourth conductor 5bb may be wide plane conductors used for the ground or the power supply potential. In addition, when the third conductor 5ba and the fourth conductor 5bb are wide plane conductors used for the ground or power supply potential, for example, a signal conductor is provided between the third conductor 5ba, the fourth conductor 5bb, and the second 5bg. It may be done. For example, in the wide plane, one side of the wide plane may be 150 μm or more. In a plan view, the first interval 5ag overlaps with the second conductor layer 5b, and the second interval 5bg overlaps with the first conductor layer 5a.

  The thickness of the internal conductors (the first conductor layer 5a and the second conductor layer 5b) tends to be thicker in order to reduce the electrical resistance. Furthermore, there is a demand for thinning of the electronic element mounting substrate 1, and the respective insulating layers (the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c and / or the other insulating layers 2e) become thinner. There is. That is, the height of the gap tends to be higher than the thickness of the insulating layer. In other words, the gap of the internal conductor, that is, the first interval 5ag and the second interval 5bg overlap in a plurality of layers in top view, and there is a high possibility that a crack or a crack may occur in the base 2 due to external stress. . From such a tendency, it has been feared that a crack or a crack may be generated in the base 2 from a portion where a plurality of gaps of the inner conductor overlap in a top view due to an external stress.

  On the other hand, in the present embodiment, the first interval 5ag overlaps with the second conductor layer 5b, and the second interval 5bg overlaps with the first conductor layer 5a. As a result, it is possible to reduce the possibility of the occurrence of cracks or cracks in the substrate from the portion where the gaps of the internal conductors overlap in a top view due to external stress.

  At this time, the first conductor layer 5a and the second conductor layer 5b may be different metal materials or may be the same metal material. When different metals or their compositions are different, the toughness strength of the substrate 2 is improved by using a metal material optimum for the planar shape and conductor strength of each conductor layer for the first conductor layer 5a and the second conductor layer 5b. be able to. In the case where the same metal or the composition thereof is the same, it is possible to reduce the problems occurring at the time of manufacturing the substrate 2.

  The first conductor layer 5a and the second conductor layer 5b may be partially embedded in the first insulating layer 2a, the second insulating layer 2b, and the third insulating layer 2c in the thickness direction in a cross-sectional view. When part of the first conductor layer 5a and the second conductor layer 5b is embedded, the bonding strength between the conductor layer and the insulating layer can be improved. As a result, this leads to the improvement of the toughness and strength of the substrate 2. Similarly, in the first conductor layer 5a and the second conductor layer 5b, the whole of the first insulating layer 2a, the second insulating layer 2b, and the third insulating layer 2c in the thickness direction may be embedded in a cross sectional view. When the whole is embedded, the bonding strength between the conductor layer and the insulating layer can be further improved. As a result, this leads to the improvement of the toughness and strength of the substrate 2. The cross-sectional shapes of the end portions of the first conductor layer 5a and the second conductor layer 5b may be a single-edged or trapezoidal shape as in the example shown in FIG. 1 and FIGS. Other shapes may be used as in the lens shape of the example shown in 2.). For example, in the case of a lens shape, the cross-sectional shape of the end of the first conductor layer 5a / the second conductor layer 5b is smoother. As a result, for example, even when the shapes of the first conductor layer 5a and the second conductor layer 5b appear on the surface, the surface shape of the base 2 becomes smooth, whereby bonding defects or tilt defects of the electronic element 10, the lid 12, etc. Etc. can be reduced.

The main part A is shown in FIG. As shown in FIG. 3A, the first interval 5ag and the second interval 5bg may partially overlap. Even in such a case, the overlapping portion between the first 5ag and the second 5bg can be made smaller, so that the toughness strength of the base 2 can be improved, and generation of cracks and cracks can be achieved. It is possible to reduce concerns. Further, by reducing the overlapping portion of the first 5ag and the second 5bg, the surface shape of the base 2 becomes smooth, and the reduction of defects in mounting of the electronic element 10, the lid 12 and the like is reduced. Can be

  Furthermore, as shown in FIG. 3 (b), the first interval 5ag and the second interval 5bg may be separated. For example, it is preferable that the first gap 5ag be separated from the second gap 5bg by a narrow gap. The toughness strength of the substrate 2 can be further improved by not overlapping the first interval 5ag and the second interval 5bg. It becomes possible to reduce the concern about the occurrence of a crack or a crack. In addition, the surface shape of the base 2 is further smoothed by not overlapping the first period 5ag and the second period 5bg, thereby further reducing defects in the mounting of the electronic element 10, the lid 12 and the like. .

  The shapes of the first conductor layer 5 a and the second conductor layer 5 b will be described with reference to FIGS. 4 to 6. FIG. 4 (a) shows that the first conductor layer 5a is disposed on the second insulating layer 2b, and FIG. 4 (b) shows that the second conductor layer 5b is on the third insulating layer 2c. It shows that it is arranged. Further, α1 represents a virtual line passing through the center of the base 2 and parallel to the X-axis, and α2 passing through the center of the base 2 represents a virtual line changed to the Y-axis. The phantom lines α1 and α2 of the base 2 are shown by the two-dot chain lines in FIGS.

  In the example shown in FIG. 4, the conductor shapes of the outer edge of the first conductor 5aa and the outer edge of the second conductor 5ab in the portion where the first gap 5ag is located are linear. The conductor shapes of the third conductor 5ba and the fourth conductor 5bb in the portion where the second portion 5bg is located are also linear. Further, the first interval 5ag overlaps the third conductor 5ba in top view, and the second interval 5bg overlaps the second conductor 5ab.

  Even in such a case, it is possible to improve the toughness and strength of the base 2 by reducing the overlapping portion of the first 5ag and the second 5bg, and generation of cracks and cracks in the base 2 It is possible to reduce the concern of

  In FIG. 4, the first interval 5ag and third conductor 5ba overlap the second interval 5bg and the second conductor 5ab in top view, but the first interval 5ag and fourth conductor 5bb, second interval in top view It is possible to improve the toughness strength of the substrate 2 by reducing the overlapping portion of the first interval 5ag and the second interval 5bg even if the interval 5bg overlaps the first conductor 5aa. It is possible to reduce the concern of the occurrence of cracks and cracking.

  Furthermore, by arranging the conductor layer 5a and the conductor layer 5b on the entire base 2 as shown in FIG. 4, it becomes possible to improve the toughness strength of the base 2 and reduce the concern of the occurrence of cracks or cracks in the base 2. It becomes possible. When the conductor layer 5a and the conductor layer 5b are wide plane conductors used for the ground or power supply potential, the power supply resistance is low, and the effect of reducing the power supply noise can also be obtained.

In the example shown in FIG. 5, the conductor shape of the outer edge of the first conductor 5aa and the outer edge of the second conductor 5ab in the portion where the first portion 5ag is located and the outer edge of the third conductor 5ba in the portion where the second portion 5bg is located. And the conductor shape of the outer edge of the fourth conductor 5bb meanders linearly at an angle. Furthermore, in a top view, the first interval 5ag and the third conductor 5ba or / and the fourth conductor 5bb, and the second interval 5bg to the first in a top view.
The conductor 5aa or / and the second conductor 5ab overlap.

  As shown in FIG. 5, the meandering of the first interval 5ag and the second interval 5bg makes it possible to reduce the overlapping portion of the first interval 5ag and the second interval 5bg. This makes it possible to improve the toughness and strength of the substrate 2 and to reduce the concern of the occurrence of cracks and cracks in the substrate 2.

  Here, meandering refers to a shape in which the outer edge of the conductor is straight and bent at an angle. That is, it has a portion which is linear in top view. The angle at this time, the size of the straight portion, etc. need not be specified. In the example shown in FIG. 6, the conductor shape of the outer edge of the first conductor 5aa and the outer edge of the second conductor 5ab in the portion where the first portion 5ag is located and the outer edge of the third conductor 5ba in the portion where the second portion 5bg is located. The conductor shape of the outer edge of the fourth conductor 5bb is a curved wave shape.

  By forming a wave shape as in the example shown in FIG. 6, the conductor shape between the outer edge of the first conductor 5aa and the outer edge of the second conductor 5ab in the portion where the first gap 5ag in FIG. The acute-angled portions of the conductor shapes of the outer edge of the third conductor 5ba and the outer edge of the fourth conductor 5bb can be eliminated. This can reduce stress concentration at the corners of the first conductor layer 5a and the second conductor layer 5b. Therefore, the possibility of local stress concentration can be reduced, and it becomes possible to reduce the concern of the occurrence of a crack or a crack.

  Here, the wave shape refers to a shape in which the outer edge of the conductor is connected by a curve. The direction of the curve at this time, the size of the radius of the curve, etc. need not be specified.

  Although an example of the outer edge shape of 1st conductor 5aa, 2nd conductor 5ab, 3rd conductor 5ba, and 4th conductor 5bb was explained in Drawing 4-Drawing 6, 1st conductor 5aa, 2nd conductor 5ab, and 3rd conductor 5ba And the 4th conductor 5bb can be arranged between other places besides the above, for example not only one place but several places. Moreover, it is also possible to change the shape between the upper and lower conductor layers. Even if there are various shapes in these combinations, it is possible to reduce the occurrence of cracks and cracks in the base 2 because the first period 5ag and the second period 5bg satisfy the conditions of the present embodiment. .

<Configuration of Electronic Device>
An example of the electronic device 21 is shown in FIGS. The electronic device 21 includes an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1.

  The electronic device 21 includes an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1. The electronic element 10 is, for example, an imaging element such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), a light emitting element such as a light emitting diode (LED), or an integrated circuit such as a large scale integrated (LSI). is there. The electronic element 10 may be disposed on the upper surface of the base 2 via an adhesive. As the adhesive, for example, silver epoxy or thermosetting resin is used.

  The electronic device 21 may have a lid 12 that covers the electronic element 10 and is bonded to the upper surface of the electronic element mounting substrate 1. Here, the electronic element mounting substrate 1 may be connected to the lid 12 on the upper surface of the frame 2 of the base 2 or may be supported by the lid 12 and provided on the upper surface of the base 2 so as to surround the electronic element 10. You may provide the frame-like body. Also, the frame body and the base 2 may be made of the same material, or may be made of different materials.

  When the frame body and the base body 2 are made of the same material, the base body 2 may be made integral with the uppermost insulating layer by providing an opening with the frame body, or separately It may be joined with a brazing material or the like to be provided.

Further, as an example in which the base 2 and the frame are made of different materials, the frame may be made of the same material as the lid bonding material 14 for bonding the lid 12 and the base 2. At this time, by providing the lid bonding material 14 thick, it is possible to combine the effect of adhesion and the effect as a frame-like body (member supporting the lid 12). The lid bonding material 14 at this time may be, for example, a thermosetting resin, a low melting glass, or a brazing material made of a metal component. In addition, the frame and the lid 12 may be made of the same material, and in this case, the frame and the lid 12 may be configured as the same individual.

  For example, when the electronic device 10 is an imaging device such as a CMOS or a CCD, or a light emitting device such as an LED, the lid 12 is made of a highly transparent member such as a glass material. Further, for example, when the electronic device 10 is an integrated circuit or the like, a metal material or an organic material may be used for the lid 12.

  The lid 12 is bonded to the electronic element mounting substrate 1 via a lid bonding material 14. Examples of the material constituting the lid bonding material 14 include a thermosetting resin, a low melting glass, or a brazing material made of a metal component.

  The electronic device 21 has an electronic element mounting substrate 1 as shown in FIGS. 1 and 2. The toughness of the electronic device 21 can be improved when the electronic element 10 and the lid 12 or the like mounted on the electronic element mounting substrate 1 overlap in a top view between the first 5ag and the second 5bg. It becomes. From this, the possibility of a crack or a crack of the electronic element mounting substrate 1 can be reduced, and a malfunction of the electronic device 21 caused by the crack or the crack can be reduced.

<Configuration of electronic module>
An example of the electronic module 31 using the electronic element mounting substrate 1 is shown in FIG. The electronic module 31 has an electronic device 21 and a housing 32 provided to cover the upper surface of the electronic device 21 or the electronic device 21. In the following example, an imaging module is described as an example for the purpose of explanation.

  The electronic module 31 has a housing 32 (lens holder). By having the housing 32, it is possible to improve the airtightness or reduce the application of external stress directly to the electronic device 21. The housing 32 is made of, for example, a resin or a metal material. When the housing 32 is a lens holder, the housing 32 may be incorporated with one or more lenses made of resin, liquid, glass, crystal or the like. Further, the housing 32 may be provided with a drive device or the like for driving up, down, left, and right, and may be electrically connected to the electronic element mounting substrate 1.

  The housing 32 may be provided with an opening on at least one side in four directions in top view. Then, an external circuit board may be inserted from the opening of the housing 32 and electrically connected to the electronic element mounting board 1. Further, after the external circuit board is electrically connected to the electronic element mounting substrate 1, the opening of the housing 32 is closed with a sealing material such as resin, etc. to close the gap of the opening and the inside of the electronic module 31 is airtight. It may be done.

  The electronic module 31 has an electronic element mounting substrate 1 as shown in FIG. The toughness of the electronic module 31 is improved when the electronic element 10 mounted on the electronic element mounting substrate 1 and the lid 12 and the housing 32 overlap the first space 5ag and the second space 5bg in a top view. It becomes possible. From this, the possibility of a crack or a crack of the electronic element mounting substrate 1 can be reduced, and a malfunction of the electronic module 31 caused by the crack or the crack can be reduced.

<A substrate for mounting an electronic device and a method of manufacturing an electronic device>
Next, an example of a method of manufacturing the electronic element mounting substrate 1 and the electronic device 21 of the present embodiment will be described. In addition, an example of the manufacturing method shown below is a manufacturing method using many substrates 2 and a wiring board.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, in the case of obtaining the base 2 which is a sintered body of aluminum oxide (Al ₂ O ₃ ), powder of Al ₂ O ₃ is mixed with silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) as a sintering aid. Etc.), and further adding suitable binders, solvents and plasticizers, and then the mixture is kneaded to form a slurry. Thereafter, a multi-piece ceramic green sheet is obtained by a forming method such as a doctor blade method or a calender roll method.

  In addition, when the base | substrate 2 consists of resin, for example, the base | substrate 2 can be formed by shape | molding by a transfer mold method, an injection mold method, etc. using the metal mold | die which can be shape | molded in a predetermined shape. Further, the substrate 2 may be a substrate made of glass fibers impregnated with a resin, such as a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

  (2) Next, a metal layer (such as the first conductor layer 5a and the second conductor layer 5b), the electrode pad 3, and the external circuit connection are provided on the ceramic green sheet obtained in the above step (1) by screen printing method A metal paste is applied or filled to the portions to be the electrode, the internal wiring and the through conductor. The metal paste is prepared by adjusting the viscosity to an appropriate level by adding a suitable solvent and a binder to the metal powder made of the above-mentioned metal material and kneading. The metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2.

  For example, in the case of creating the first interval 5ag, it can be created by applying a metal paste by providing a predetermined gap between the first conductor 5aa and the second conductor 5ab. Similarly, in the case of creating the second space 5bg, it can be created by applying a metal paste by providing a predetermined gap between the third conductor 5ba and the fourth conductor 5bb.

  (3) Next, the above-mentioned green sheet is processed by a mold or the like. Here, when the base 2 has a recess or a notch or the like which becomes castellation, a cavity or the like, a recess (through hole) or a notch or the like may be formed at a predetermined position of the green sheet to be the base 2.

  (4) Next, the ceramic green sheets to be the respective insulating layers are laminated and pressurized. As a result, green sheets to be the respective insulating layers may be stacked, and a ceramic green sheet laminate to be the base 2 (the electronic element mounting substrate 1) may be produced.

  (5) Next, the ceramic green sheet laminate is fired at a temperature of about 1500 ° C. to 1800 ° C. to obtain a multi-cavity wiring board in which a plurality of substrates 2 (electronic device mounting substrates 1) are arranged. In this step, the metal paste described above is fired simultaneously with the ceramic green sheet to be the base 2 (substrate 1 for mounting an electronic element), and conductor layers (such as the first conductor layer 5a and the second conductor layer 5b), electrodes It becomes a pad 3, an electrode for external circuit connection, an internal wiring and a through conductor.

(6) Next, the multi-cavity wiring board obtained by firing is divided into a plurality of substrates 2 (electronic device mounting substrates 1). In this division, dividing grooves are formed in the multi-cavity wiring board along the locations to be the outer edge of the base 2 (electronic element mounting substrate 1), and the dividing grooves are broken along the dividing grooves or divided. It is possible to use a method of cutting along the location to be the outer edge of the base 2 (substrate 1 for mounting electronic element) by the slicing method or the like. The dividing grooves can be formed by cutting with a slicing apparatus to a thickness smaller than the thickness of the wiring board after firing, but the cutter blade may be pressed against the ceramic green sheet laminate for the wiring board. You may form by cutting less than the thickness of a ceramic green sheet laminated body with a slicing apparatus. Before or after dividing the above-described multi-cavity wiring substrate into a plurality of substrates 2 (substrates 1 for mounting an electronic element), electrode pads 3 and pads for external connection are formed using electrolytic or electroless plating, respectively. And plating may be applied to the exposed wiring conductor.

  (7) Next, the electronic element 10 is mounted on the upper surface or the lower surface of the electronic element mounting substrate 1. The electronic element 10 is electrically bonded to the electronic element mounting substrate 1 by wire bonding or the like. At this time, an adhesive or the like may be provided on the electronic element 10 or the electronic element mounting substrate 1 and fixed to the electronic element mounting substrate 1. In addition, after the electronic element 10 is mounted on the electronic element mounting substrate 1, the lid 12 may be joined by the lid bonding material 14.

  The electronic device 21 can be manufactured by manufacturing the electronic element mounting substrate 1 in the steps (1) to (6) and mounting the electronic element 10 in the step (7). . In addition, the process order of said (1)-(7) is not designated.

Second Embodiment
Next, an electronic element mounting substrate 1 according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 8. FIG. 7 shows the shapes of the electronic element mounting substrate 1 and the electronic device 21 in the present embodiment. FIG. 8 shows the main part B.

  The electronic element mounting substrate 1 in the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that a fourth insulating layer 2d located on the lower surface of the third insulating layer 2c, and a third insulating layer. The point further includes a third conductor layer 5c located between the second insulating layer 2c and the fourth insulating layer 2d and having a third gap 5cg. While the third interval 5cg is positioned overlapping the first conductor layer 5a and the second conductor layer 5b, the first interval 5ag and the second interval 5bg are positioned overlapping the third conductor layer. That is the point.

  In the example shown in FIG. 7, it has the 4th insulating layer 2d located in the lower surface of the 3rd insulating layer 2c. It further includes a third conductor layer 5c located between the third insulating layer 2c and the fourth insulating layer 2d and having a third gap 5cg.

  The thickness of the internal conductors (the first conductor layer 5a, the second conductor layer 5b and the third conductor layer 5c) tends to be thicker in order to reduce the electrical resistance. Furthermore, there is a demand for thinning of the electronic element mounting substrate 1, and each insulating layer (the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c, the fourth insulating layer 2d or / and other insulating layers) 2e) is thinner. In other words, the gap between the inner conductors, the first interval 5ag, the second interval 5bg, and the third interval 5cg overlap in multiple layers in top view, and the gap in the inner conductors overlap in multiple layers in top view As a result, there is a high possibility that cracks or cracks may occur in the substrate 2 due to external stress. From such a tendency, it has been feared that a crack or a crack may be generated in the base 2 plate from a portion where the gap of the inner conductor overlaps in a top view due to the stress from the outside. In the example shown in FIG. 8A, the third space 5cg is positioned to overlap the first conductor layer 5a and the second conductor layer 5b, and the first space 5ag and the second space 5bg are the third conductor. It is located overlapping with the layer. This can reduce the overlapping area of the third conductor 5cg and the second conductor 5bg of the first conductor layer 5a and the second conductor layer 5b due to stress from the outside, thereby reducing the third conductor 5cg and the second conductor 5bg. It is possible to reduce the possibility of the occurrence of a crack or a crack in the base 2 from the overlapping portion.

  In the method of manufacturing the electronic element mounting substrate 1 of the second embodiment, the fourth insulating layer 2d and the third conductor layer 2c are formed in the steps (1) and (2) of the first embodiment, and (3 The subsequent steps can be made in the same manner as in the first embodiment.

Third Embodiment
Next, an electronic element mounting substrate 1 according to a third embodiment of the present invention will be described with reference to FIGS. 9 to 10. 9 to 10 show the shapes of the electronic element mounting substrate 1 and the electronic device in the present embodiment. The electronic element mounting substrate 1 in the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that the base 2 has a through hole (the mounting method of the electronic element 10 is different), the base 2 Have a notch 7 and a metallized layer 7a in part of the side surface.

  In the example shown in FIG. 9, the electronic element mounting substrate 1 has through holes at positions overlapping the electronic element 10 in top view. Further, the electronic device 10 mounted on the electronic device 21 is provided so as to be located in the through hole provided in the base 2 in top view. With such a configuration, for example, when the electronic element 10 is an imaging element, the height of the electronic module 31 can be further reduced. In addition, although the electronic element mounting substrate 1 has the electronic components 22 on the surface, in the example structure shown in FIG. Miniaturization is possible.

The electronic component 22 is, for example, a chip capacitor, an inductor, a passive component such as a resistor, or an OIS
(Optical Image Stabilization), signal processing circuits, active components such as gyro sensors, and the like. The electronic components 22 are connected to pads provided on the base 2 by a bonding material such as solder or conductive resin. Note that these electronic components 22 may be connected to the electronic element 10 via an internal conductor or the like provided on the base 2.

In the case of the mounting form as shown in FIG. 9, after the electronic element 10 is connected to the electronic element mounting substrate 1 by the electronic element connecting material 13 such as a gold bump or a solder ball, the connection is reinforced by the sealing material. And may be further sealed. Further, they may be connected by an electronic element connection material 13 such as, for example, ACF (Anisotropic Conductive Film).

  In the example shown in FIG. 9, the electronic element mounting substrate 1 has the notch 7 from the side wall of the first insulating layer 2a to the side wall of the second insulating layer 2b, and the notch 7 is provided with the metallized layer 7a. It is done. As described above, the electronic element mounting substrate 1 has the notch 7, and the notch 7 has the metallized layer 7a, so that the metallized layer 7a provided in the notch 7 and the notch 7 is a side terminal It can be used as Therefore, in the electronic module 31 using the electronic element mounting substrate 1, it is possible to electrically connect the housing 32 and the electronic element mounting substrate 1.

  Further, by providing the notch 7 in the electronic element mounting substrate 1, the leg portion or the like of the housing 32 can be fitted into the notch 7. Further, by providing the metallized layer 7a in the notch 7, the case 32 and the electronic element mounting substrate 1 can be fixed with a metal material such as solder, and the connection strength can be further improved. Further, the notches 7 and / or the metallized layer 7a may be provided also in the other insulating layers 2e, and the first insulating layer 2a, the second insulating layer 2b, the third insulating layer 2c or / and the other insulating layer The size of the notches 7 provided in 2e may be different in each layer.

  The metallized layer 7a may be made of a material similar to the first conductor layer 5a, the second conductor layer 5b, or the third conductor layer 5c. Here, the metallized layer 7a and the first conductor layer 5a, the second conductor layer 5b, and / or the third conductor layer 5c may be made of the same material or may be made of different materials. Since the metallized layer 7a and the first conductor layer 5a, the second conductor layer 5b, and / or the third conductor layer 5c are made of the same material, it is possible to equalize the physical properties and characteristics, so that they can be manufactured at the time of manufacture. It becomes possible to arrange the specifications. In addition, when the metallized layer 7a and the first conductor layer 5a, the second conductor layer 5b, and / or the third conductor layer 5c are made of different materials, it is possible to equalize the physical properties and the characteristics, and hence it is possible to further manufacture It becomes possible to select the material which has easy specification easily. In particular, since the metallized layer 7a is provided on the side surface, it is also possible to select a material having a high viscosity or the like, and to use the material of the metallized layer 7a and the first conductor layer 5a, the second conductor layer 5b and / or the third conductor layer 5c. It can be done by making it different.

  The method of manufacturing the electronic element mounting substrate 1 as shown in FIGS. 9 and 10 includes the first conductor layer 5a, the second conductor layer 5b, or the third conductor layer in addition to the steps described in the first embodiment. Step of providing 5c over the side walls of the first insulating layer 2a, the second insulating layer 2b, and the third insulating layer 2c, and other positions from the upper surface of the first conductor 5a or the second conductor 5b extended to the notch 7 side The step of covering the side surface of the notch 7 with the metallized film 7 a is provided to the upper surface of the first conductor 5 a or the second conductor 5 b provided in the above. By obtaining such a process, it is possible to manufacture the electronic element mounting substrate 1 as in the example shown in FIGS.

  In the step of covering the side surface of the notch 7 with the metallized film 7 a, for example, from the upper surface of the notch 7 using a plate made so that printing is positioned inside the side surface of the notch 7 using screen printing method or the like. The method etc. which apply | coat the metal paste used as the metallized film 7a are mentioned.

  The present invention is not limited to the examples of the embodiments described above, and all the embodiments according to the present invention can be combined in any combination as long as no contradiction occurs in the contents thereof. Various modifications such as numerical values are possible. Also, for example, in the examples shown in FIGS. 4 to 6, although an example of the shape of the conductor layer has been described, the conductor layer may have another shape other than the above, for example, not only one position but a plurality of places it can. In addition, it is also possible to change the shape of the conductor layers facing each other through the gap and the shape between the conductor layers of the upper and lower layers. By being able to realize the shape between various kinds by combination of them, it becomes possible to reduce the occurrence of the crack and the crack. Further, the arrangement, the number, the shape, the mounting method of the electronic element, and the like of the electrode pad 3 and the component pad 5 in the present embodiment are not specified.

1 .... Electronic element mounting substrate 2 ... ... Base 2a ... First insulating layer 2b ... Second insulating layer 2c ... Third insulating layer 2d ... Fourth insulating layer 2e ... · · · Other insulating layer 3 · · · electrode pad 5a · · · first conductor layer 5aa · · first conductor 5ab · · second conductor 5ag · · between the first 5b · · · second conductor layer 5ba · · · · Third conductor 5bb · · Fourth conductor 5bg · · · Second interval 5c · · · third conductor layer 5ca · fifth conductor 5cb · · sixth conductor 5cg · · third interval 7 · · · cut Notches 7a: Metallized layer 10: Electronic element 12: Lid 13: Electronic element connection member 14: Lid bonding material 21: Electronic device 22: Electronic part 31: ···・ Electronic module 32 ... housing

Claims (10)

A first insulating layer in which the electronic element is located above or below;
A second insulating layer located on the lower surface of the first insulating layer;
A third insulating layer located on the lower surface of the second insulating layer;
A first conductor layer having a first gap located between the first insulating layer and the second insulating layer, located between the first insulating layer, the second insulating layer, and the third insulating layer. And a second conductor layer having a second gap,
In a plan view, the electronic device is characterized in that the first conductor layer is overlapped with the second conductor layer and the second conductor layer is overlapped with the first conductor layer in a plan view. Board.   The substrate for mounting an electronic device according to claim 1, wherein the first and second portions overlap with each other.   The substrate for mounting an electronic device according to claim 1 or 2, wherein in the plan view, the first and second portions are separated from each other. A fourth insulating layer located on the lower surface of the third insulating layer;
And a third conductor layer positioned between the third insulating layer and the fourth insulating layer and having a third gap,
While being positioned to overlap with the first conductor layer and the second conductor layer during the third period, and being positioned to overlap the third conductor layer during the first and second periods. The substrate for mounting an electronic device according to any one of claims 1 to 3, characterized in that:   5. The electronic element mounting substrate according to claim 4, wherein a part of the third and the first and / or the second is overlapped.   The electronic element mounting substrate according to claim 4, wherein in the plan view, the third and the first and / or the second are separated.   The electronic element mounting according to any one of claims 1 to 3, wherein the first insulating layer, the second insulating layer, and the third insulating layer have a through hole at a central portion in plan view. Board.   The first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer each have a through hole at a central portion in a plan view. The electronic element mounting substrate according to the above. The electronic element mounting substrate according to any one of claims 1 to 8.
An electronic device comprising: an electronic element mounted on the electronic element mounting substrate. An electronic device according to claim 9;
An electronic module comprising: a case located on the upper surface of the electronic device.

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