JP6336898B2 - Multi-cavity wiring board, wiring board and electronic device - Google Patents

Description

  The present invention relates to a multi-piece wiring board for manufacturing a wiring board on which electronic components such as a semiconductor element or a light emitting element are mounted.

  2. Description of the Related Art Conventionally, a wiring board for mounting an electronic component such as a semiconductor element or a crystal resonator has an insulating board made of an electric insulating material such as ceramics and a wiring conductor made of metallization such as a metal material.

  The wiring board has been downsized in response to the recent demand for downsizing of electronic devices, and is manufactured by dividing a multi-piece wiring board in order to efficiently manufacture a plurality of wiring boards. .

  The multi-cavity wiring board has a mother board in which a plurality of wiring board regions are arranged vertically and horizontally, and a wiring conductor provided in each of the plurality of wiring board regions. In addition, the multi-cavity wiring board is provided with a terminal for plating and a frame-like metal layer for depositing electroplating on the exposed surface of the wiring conductor in a peripheral area around the plurality of wiring board areas. (For example, refer to Patent Document 1).

JP 2011-243930 A

  However, the thickness of the plating layer deposited by electroplating on the exposed surface of the wiring conductor provided in the plurality of wiring board regions may vary greatly for each of the plurality of wiring board regions. This is because the electrical resistance from the plating terminal to the exposed surface of the wiring conductor is different between the central portion and the outer peripheral portion of the plurality of wiring board regions. In particular, there is a concern that a difference in the thickness of the plating layer is likely to be noticeable if the plating layer is to be deposited thickly.

A multi-piece wiring board according to another aspect of the present invention includes a mother board in which a plurality of wiring board regions having wiring conductors are arranged at a central portion, and a peripheral area is arranged around the plurality of wiring board regions. A frame-like metal layer provided to surround the plurality of wiring substrate regions in the surrounding region, and a plating terminal provided on an outer edge portion of the mother substrate outside the surrounding region, A strip-shaped plating common portion provided in the peripheral region of the mother substrate and connected to the plating terminal; a plurality of plating conductors connecting the plating common portion and the frame-shaped metal layer; and a plurality of connection wiring layer for connecting the wiring conductor and the frame-like metal layer, plating the conductor of said plurality of electrical resistance rather large and each compared with the plating common unit, plane In fluoroscopy, the common part for plating and the front Arranged to the frame-like metal layer and the plating conductor overlaps said plating conductor is provided to extend in the thickness direction of the mother substrate.

A multi-cavity wiring board according to one aspect of the present invention includes a mother board in which a plurality of wiring board regions having wiring conductors are arranged at a central portion, and a peripheral area is arranged around the plurality of wiring board areas, and the peripheral area A frame-like metal layer provided so as to surround a plurality of wiring board regions, a plating terminal provided on an outer edge of the mother board outside the surrounding area, and provided in a surrounding area of the mother board. A strip-shaped common portion for plating connected to the plating terminal, a plurality of plating conductors for connecting the common portion for plating and the frame-shaped metal layer, and a plurality for connecting the frame-shaped metal layer and the wiring conductor. It has a connection wiring layer, a plurality of plating conductors, each rather large electric resistance as compared with the common unit for plating, in a plan perspective, plating conductor and the plating for the common part and the frame-like metal layer And the conductor for plating is It is provided so as to extend in the thickness direction of the substrate. This reduces the ratio of electrical resistance from the plating terminal to each wiring conductor, thereby reducing the electrical resistance between the plating terminal and the connection wiring layer connected to the wiring conductor in each wiring board region. In addition to reducing the ratio, the current transmitted from the plating terminal to the connection area between the plating conductor and the frame-shaped metal layer spreads to the surrounding frame-shaped metal layer side rather than the plating conductor side and the connection wiring layer side. Since a large current is prevented from being transmitted directly to the conductor, the wiring conductor in each wiring board region is passed through a plating terminal, a common part for plating, a plating conductor, a frame-like metal layer, and a connection wiring layer by electroplating. The difference in the thickness of the plating layer deposited on the exposed surface can be reduced.

(A) is a top view which shows the multi-piece wiring board in the 1st Embodiment of this invention, (b) is an internal top view of the multi-piece wiring board shown by (a). (A) is the longitudinal cross-sectional view in the AA line of the multi-piece wiring board shown by Fig.1 (a), (b) is B of the multi-piece wiring board shown by Fig.1 (a). It is a longitudinal cross-sectional view in the -B line. (A) is a principal part enlarged top view in the A section of Drawing 1 (a), and (b) is a principal part expansion inside top view in the B section of Drawing 1 (b). (A) is a top view which shows the multi-piece wiring board in the 2nd Embodiment of this invention, (b) is an internal top view of the multi-piece wiring board shown by (a). FIG. 4A is a longitudinal sectional view taken along line AA of the multi-piece wiring board shown in FIG. 4A, and FIG. 4B is a cross-sectional view of B of the multi-piece wiring board shown in FIG. It is a longitudinal cross-sectional view in the -B line. (A) is the principal part enlarged top view in the A section of Drawing 4 (a), and (b) is the principal part expansion inside top view in the B section of Drawing 1 (b). (A) is a top view which shows the multi-piece wiring board in the 3rd Embodiment of this invention, (b) is an internal top view of the multi-piece wiring board shown by (a). (A) And (b) is an internal top view of the multi-piece wiring board shown by Fig.7 (a). FIG. 7A is a longitudinal sectional view taken along line AA of the multi-cavity wiring board shown in FIG. 7A, and FIG. 7B is a cross-sectional view of B of the multi-cavity wiring board shown in FIG. It is a longitudinal cross-sectional view in the -B line.

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
In the multi-cavity wiring board according to the first embodiment of the present invention, as in the example shown in FIGS. 1 to 3, a plurality of wiring board regions 11 having wiring conductors 2 are arranged in the central portion, A mother board 1 in which a peripheral region 12 is arranged around the wiring substrate region 11, a peripheral region 12, a frame-shaped metal layer 3 provided so as to surround the plurality of wiring substrate regions 11, and the peripheral region 12 A plating terminal 5 provided on the outer edge of the mother board 1 on the outer side, a strip-shaped plating common part 6 provided in the peripheral region 12 of the mother board 1 and connected to the plating terminal 5; And a plurality of plating conductors 7 for connecting the common portion 6 and the frame-shaped metal layer 3, and a plurality of connection wiring layers 4 for connecting the frame-shaped metal layer 3 and the wiring conductor 2. Each of the plurality of plating conductors 7 has a larger electric resistance than the plating common portion 6. In the example shown in FIGS. 1 to 3, the frame-shaped metal layer 3 is provided inside the mother board 1, and the plating common part 6 is provided on the surface of the mother board 1. In FIG. 1 to FIG. 3, the multi-piece wiring board is provided in a virtual xyz space, and the “upward direction” means the positive direction of the virtual z axis hereinafter for convenience. In addition, the distinction between the upper and lower sides in the following description is for convenience, and is not intended to limit the upper and lower sides when a multi-cavity wiring board and a wiring board obtained by dividing the multi-cavity wiring board are actually used. Absent.

  Each of the plurality of wiring board regions 11 is an area used as a wiring board mounted on an external circuit board by dividing a multi-piece wiring board and mounting, for example, an electronic component. The peripheral region 12 is a region where the frame-shaped metal layer 3, the plating terminal 5, the plating common portion 6, and the plating conductor 7 are disposed, and is a region used when the mother board 1 is manufactured or transported. Using this peripheral region 12, it is possible to perform positioning, fixing, etc. during processing or transfer of the generated shape for the mother substrate 1 or the mother substrate 1.

  The material of the mother board 1 is an insulator such as ceramics or resin. When the material of the mother substrate 1 is ceramic, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, or the like may be used. it can. Further, when the material of the mother board 1 is a resin, as the material, for example, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a polyester resin, a fluororesin such as a tetrafluoroethylene resin, a glass epoxy resin, or the like Can be used.

When the material of the base substrate 1 is an aluminum oxide sintered body, it is suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO) and magnesia (MgO). An organic solvent and a solvent are added and mixed to produce a slurry. A ceramic green sheet is produced by forming this quagmire into a sheet by employing a conventionally known doctor blade method or calendar roll method. Next, the ceramic green sheet is appropriately punched, and a plurality of ceramic green sheets are laminated to form a generated shape, and the generated shape is fired at a high temperature (about 1500 to 1800 ° C.) to form a mother substrate. 1 is produced.

  When the material of the mother board 1 is a resin, the mother board 1 is manufactured by, for example, a transfer mold method or an injection mold method using a mold that can be molded into a predetermined multi-piece wiring board shape. Further, for example, when the mother board 1 is a glass epoxy resin, a base material made of glass fiber is impregnated with an epoxy resin precursor, and the epoxy resin precursor is thermally cured at a predetermined temperature to thereby form the mother board 1. Is produced.

  The wiring conductor 2 is provided on the surface and inside of the mother board 1. The wiring conductor 2 is for mounting an electronic component on the wiring board after dividing the multi-piece wiring board, or for electrically connecting the mounted electronic component and an external circuit board. The wiring conductor 2 includes a wiring layer provided on the surface or inside of the mother board 1, a gold conductor provided inside the mother board 1, and wiring layers positioned vertically through the mother board 1 in the thickness direction. And a through conductor that electrically connects the two.

  As the material of the wiring conductor 2, when the material of the mother substrate 1 is ceramic, tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like can be used. For example, when the material of the mother board 1 is ceramic, the wiring conductor 2 is formed by applying a metallized paste for the wiring conductor 2 to a ceramic green sheet for the mother board 1 by a printing means such as a screen printing method. It is formed by firing together with the ceramic green sheet for No. 1. Further, the through conductor is, for example, filled with a metallized paste for the through conductor in the through hole formed in the ceramic green sheet for the mother substrate 1 by the printing means and fired together with the ceramic green sheet for the mother substrate 1. Formed by. The through hole is formed in the ceramic green sheet by a die or punching process using punching or a processing method such as laser processing.

  When the material of the mother board 1 is a resin, a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, and alloys thereof can be used as the material of the wiring conductor 2. The wiring conductor 2 is formed, for example, by transferring a copper foil processed into a predetermined shape onto a resin sheet made of glass epoxy resin, and laminating the resin sheet to which the copper foil is transferred and bonding with an adhesive. . In such a case, the wiring conductor 2 is formed by transferring a metal foil onto a resin sheet. Further, among the wiring conductors 2, the through conductors that penetrate the resin sheet in the thickness direction are deposited on the inner surfaces of the through holes formed in the resin sheet by printing or plating a conductor paste, or filled with the through holes. What is necessary is just to form. Such a through conductor is formed by, for example, integrating a metal foil or a metal column with the mother substrate 1 by resin molding, or depositing the metal substrate 1 on the mother substrate 1 using a sputtering method, a vapor deposition method, or the like.

  The surface of the wiring conductor 2 exposed from the mother board 1 is coated with a metal plating layer having excellent corrosion resistance, such as nickel or gold, by electroplating. Corrosion of the wiring conductor 2 can be reduced, and the electronic component, bonding wire or external circuit board and the wiring conductor 2 can be firmly bonded. For example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the surface of the wiring conductor 2.

  When a light emitting element is used as the electronic component, a silver plating layer having a thickness of about 1 to 10 μm may be applied to the surface of the wiring conductor 2. When a silver plating layer is deposited on the surface of the wiring conductor 2 on which the electronic components are mounted, when the light emitting element is mounted on the wiring board obtained by dividing the multi-piece wiring board, the wiring conductor Thus, a light emitting device capable of efficiently reflecting the light emitted toward the direction 2 can be obtained.

  Further, the surface of the wiring conductor 2 on which the electronic component is mounted may be coated with a Cu plating layer. For example, by applying a Cu plating layer of about 10 to 80 μm between the nickel plating layer and the gold plating layer or on the base layer of the nickel plating layer and the gold plating layer, the heat generated by the electronic component is efficiently applied to the wiring conductor 2. It is possible to obtain a highly reliable electronic device that can conduct heat well.

  The frame-shaped metal layer 3, the connection wiring layer 4, the plating terminal 5, the plating common part 6, and the plating conductor 7 are coated with a plating layer on the exposed surface of the wiring conductor 2 provided in each wiring board region 11. Is to do. The frame-shaped metal layer 3, the connection wiring layer 4, the plating terminal 5, the plating common part 6, and the plating conductor 7 can be manufactured using the same material as that of the wiring conductor 2 by the same method.

  The frame-shaped metal layer 3 is provided in a frame shape in the peripheral region 12 of the mother substrate 1 so as to surround the plurality of wiring substrate regions 11. The connection wiring layer 4 is provided between the wiring conductor 2 and the frame-shaped metal layer 3 to electrically connect the wiring conductor 2 and the frame-shaped metal layer 3 and to connect the wiring conductor 2 in the adjacent wiring board region 11. The wiring conductors 2 of the adjacent wiring board regions 11 are electrically connected to each other.

  The plating terminal 5 is provided on the outer edge of the mother board 1 outside the surrounding area 12. The plating common portion 6 is provided in a band shape in the peripheral region 12 of the mother substrate 1 and is connected to the plating terminal 5. A plurality of plating conductors 7 are provided between the frame-shaped metal layer 3 and the plating common portion 6, and electrically connect the frame-shaped metal layer 3 and the plating common portion 6. A plating layer by electroplating is applied to the wiring conductor 2 by bringing a jig electrically connected to the plating power source into contact with the plating terminal 5 and causing a current to flow from the plating terminal 5. In the example shown in FIGS. 1 and 2, the plating terminal 5 extends along the thickness direction of the mother substrate 1 on the inner surface of the notch provided on the two opposite side surfaces of the mother substrate 1. Is provided.

  When the material of the mother substrate 1 is ceramic, these plating terminals 5 are formed by punching out a ceramic green sheet with a mold or the like to form a notch, and then the mother substrate 1 is formed on the inner surface of the notch. It can be produced by the same method using the same material as the material of the wiring conductor 2 used in this case.

  Further, in the case where the material of the mother board 1 is resin, the plating terminal 5 is formed on the mother board 1 on the inner surface of the notch part after forming a notch part on the mother board 1 using, for example, laser processing or the like. It can be manufactured by the same method using the same material as the material of the wiring conductor 2 used when is a resin.

  When the plating terminal 5 is provided on the inner surface of the notch portion as in the example shown in FIGS. 1 and 2, it can easily come into contact with a jig connected to the power supply for plating. Moreover, you may provide a plating layer intensively by the some terminal 5 for plating contacting one jig | tool.

In the example shown in FIGS. 1 to 3, the plating conductor 7 is provided in the thickness direction (z-axis direction) of the mother board 1, and connects the frame-shaped metal layer 3 and the plating common part 6. ing. Here, the plurality of plating conductors 7 have a plurality of plating conductors 7 such as in the example shown in FIGS. Each conductor width is formed smaller than the conductor width of the plating common portion 6. In addition, the electrical resistivity of each of the plurality of plating conductors 7 is set to be larger than the electrical resistivity of the common plating part 6, and the respective electrical resistances of the plurality of plating conductors 7 are common to the plating. You may make it become larger than the electrical resistance of the part 6. FIG. Such a plating conductor 7 can be formed, for example, by adding glass or ceramic powder to the metallized paste of the plating conductor 7 so as to have a higher content than other parts. Here, the electric resistance of each of the plurality of plating conductors 7 is set according to the number of columns of the wiring board region 11 and the like, and is set to be about 10 to 100 times larger than the electric resistance of the plating common portion 6. It is preferable. The electrical resistances of the connection wiring layer 4 and the plating conductor 7 are set to be about 10 to 100 times larger than the electrical resistance of the frame-shaped metal layer 3. Accordingly, the ratio of the electrical resistance from the plating terminal 5 to the connection region between the plurality of plating conductors 7 and the frame-like metal layer 3 through the plating common portion 6 is reduced, thereby the plating terminal. 5 and the connection wiring layer 4 connected to the wiring conductor 2 of each wiring board region 11 can be reduced, and the frame-like metal layer 3 can be connected to the plating conductor 7 and the connection wiring having a large electric resistance. Since it is connected to the layer 4, the current transmitted from the plating terminal 5 to the connection region between the plating conductor 7 and the frame-like metal layer 3 is more peripheral than the plating conductor 7 side and the connection wiring layer 4 side. Since it spreads to the frame-like metal layer 3 side and prevents a large current from being directly transmitted to the wiring conductor 2, the plating terminal 5, the plating common part 6, the plating conductor 7, and the frame-like metal layer are electroplated. 3. Via each connection wiring layer 4, each wiring base Can reduce the difference in thickness of the plating layer is deposited on the exposed surface of the wiring conductor 2 of the region 11. In addition, the measurement of the electrical resistance of the plating common part 6 is performed by measuring the electric current between the connection area between the plating terminal 5 and the plating common part 6 and the connection area between the plating common part 6 and each plating conductor 7. The resistance is measured by using an electric resistance measuring instrument such as a digital multimeter. In addition, the measurement of the electrical resistance of the plating conductor 7 is performed by measuring the electric current between the plating common portion 6 and the connection region of each plating conductor 7 and the connection region between each plating conductor 7 and the frame-shaped metal layer 3. The resistance is measured by using an electric resistance measuring instrument such as a digital multimeter. The electrical resistances of the frame-shaped metal layer 3 and the connection wiring layer 4 are also measured by using the same method as described above and using the electrical resistance between the connection regions of the respective parts.

  In addition, when the frame-shaped metal layer 3, the connection wiring layer 4, the plating common part 6, and the plating conductor 7 are provided inside the mother board 1, the width of each conductor and The electrical resistance of each member may be calculated by measuring the thickness, etc., and measuring the resistivity of each member.

  When the material of the mother board 1 is ceramic, the thickness of the wiring conductor 2, the frame-shaped metal layer 3, the connection wiring layer 4, and the plating common part 6 is preferably 0.01 to 0.03 mm. When these conductor pastes are printed by a screen printing method or the like, the conductor paste is easily printed with a uniform thickness, and these wirings are formed with high accuracy.

  When the plurality of plating conductors 7 are connected to the frame-like metal layer 3 in the vicinity of each wiring board region 11 as in the example shown in FIGS. The ratio of the electrical resistance to the connection wiring layer 4 connected to the wiring conductor 2 in the substrate region 11 can be reduced. Furthermore, the plurality of plating conductors 7 are preferably connected to the frame-like metal layer 3 in the vicinity of the connection wiring layer 4 connected to the wiring conductor 2 of each wiring board region 11. The number of plating conductors 7 is preferably equal to or greater than the number of connection wiring layers 4 connected to the wiring conductors 2 of the wiring board regions 11 in each row.

  The plating conductor 7 and the frame-shaped metal layer 3 provided in the position closest to the plating terminal 5 are electrically connected to the plating conductor 7 and the plating common part 6 provided in the position closest to the plating terminal 5. If it is smaller than the electrical resistance to the connection region, the difference in the thickness of the plating layer deposited on the exposed surface of the wiring conductor 2 in each wiring board region 11 can be reduced satisfactorily.

  In the case described above, in the example shown in FIGS. 1 to 3, the conductor widths of the plurality of plating conductors 7 in plan view are all the same, but the plating conductors 7 far from the plating terminals 5 are used. If the width of the conductor is made larger than the conductor width of the plating conductor 7 far from the plating terminal 5, a plurality of plating conductors 7 and a frame-shaped metal layer are connected from the plating terminal 5 via the plating common portion 6. The ratio of the electrical resistance to each connection region with 3 can be reduced. Further, the conductor width of the plating conductor 7 may be gradually increased as the distance from the plating terminal 5 increases.

The multi-cavity wiring board of this embodiment includes a mother board 1 in which a plurality of wiring board regions 11 having wiring conductors 2 are arranged in the center, and a peripheral area 12 is arranged around the plurality of wiring board areas 11; A frame-like metal layer 3 provided to surround the plurality of wiring substrate regions 11 in the surrounding region 12, and a plating terminal 5 provided on the outer edge of the mother substrate 1 outside the surrounding region 12. The strip-shaped plating common portion 6 provided in the peripheral region 12 of the mother substrate 1 and connected to the plating terminal 5, and the plurality of plating conductors connecting the plating common portion 6 and the frame-shaped metal layer 3. 7 and a plurality of connection wiring layers 4 for connecting the frame-shaped metal layer 3 and the wiring conductor 2, and each of the plurality of plating conductors 7 has an electric resistance as compared with the plating common portion 6. large. Accordingly, the ratio of the electrical resistance from the plating terminal 5 to the connection region between the plurality of plating conductors 7 and the frame-like metal layer 3 through the plating common portion 6 is reduced, thereby the plating terminal. 5 and the connection wiring layer 4 connected to the wiring conductor 2 of each wiring board region 11 can be reduced, so that the plating terminal 5, the plating common part 6, the plating can be obtained by electroplating. The difference in the thickness of the plating layer deposited on the exposed surface of the wiring conductor 2 in each wiring board region 11 can be reduced via the conductor 7, the frame-shaped metal layer 3, and the connection wiring layer 4.

  In the first embodiment, the frame-shaped metal layer 3 and the plating common portion 6 are provided at different height positions on the mother board 1, and the plating conductor 7 is provided so as to extend in the thickness direction of the mother board 1. Therefore, the formation area of the frame-like metal layer 3, the plating common portion 6, and the plating conductor 7 on the same plane can be reduced, that is, the peripheral area 12 can be reduced, and a large number of wiring board areas 11 can be provided in the multi-piece wiring board. It becomes easy to form by arranging.

  The present embodiment can be suitably used when a thick plating layer is deposited on the exposed surface of the wiring conductor 2 by electroplating.

  In the example shown in FIGS. 1 to 3, the frame-shaped metal layer 3 is provided in the mother board 1 and the plating common part 6 is provided on the surface of the mother board 1. It may be provided on the surface of the substrate 1 and the plating common part 6 may be provided inside the mother substrate 1. In addition, when the connection wiring layer 4 straddling the boundary of the wiring board region 11 is provided inside the mother board 1, the plating layer is not deposited on the connection wiring layer 4, and when divided into individual wiring boards, The plating layer is not divided and individual wiring boards can be easily formed.

  In the present embodiment, the multi-piece wiring board is divided along the boundary between the wiring board regions 11 of the mother board 1 and the boundary between the wiring board region 11 and the surrounding region 12, thereby providing a plurality of wiring boards. It becomes. Electronic components are bonded and mounted on the wiring board obtained by dividing the multi-cavity wiring board. Further, the multi-piece wiring board may be divided after electronic components are mounted on each wiring board region 11. As a method of dividing the multi-cavity wiring board into the wiring boards, a method of dividing the multi-cavity wiring board by forming a dividing groove at the edge of the wiring board region 11 and bending along the dividing groove, Alternatively, a method of cutting the edge of the wiring board region 11 by a slicing method or the like can be used. The dividing groove is formed by pressing the cutter blade against the generated shape for the mother substrate 1 or by cutting it with a slicing device to be smaller than the thickness of the generated shape, or after firing, smaller than the thickness of the mother substrate 1 by the slicing device. It can be formed by cutting.

  According to the wiring board of the present embodiment, the plurality of wiring board regions 11 included in the multi-cavity wiring board described above are divided into pieces, so that the wiring conductor 2 of each wiring board is exposed. Since the plating layer is satisfactorily deposited on the surface by electroplating, a highly reliable wiring board can be obtained.

An electronic device is obtained by mounting electronic components on a wiring board obtained by dividing a multi-piece wiring board. The electronic component mounted on the wiring board is, for example, a semiconductor element or a light emitting element. In addition, a small electronic component such as a capacitor or a diode may be mounted together with a semiconductor element or a light emitting element. The electronic component is bonded to the upper surface of the wiring board by a conductive bonding material such as a brazing material made of a gold (Au) -silicon (Si) alloy or an epoxy resin containing silver (Ag). The electrode of the electronic component and the wiring conductor 2 are electrically connected via a connecting member such as a bonding wire mainly composed of Au. The electronic component is sealed with a sealing material such as a resin as necessary.

  According to the electronic device of the present embodiment, since the above-described wiring board and the electronic component mounted on the wiring board are provided, the electronic device is excellent in connection reliability with the electronic component and the external circuit board. be able to.

  In addition, as described above, when a wiring board in which a plating layer having excellent thermal conductivity such as copper is formed thick on the exposed surface of the wiring conductor 2, an electronic device having excellent heat dissipation is used. It can be.

(Second Embodiment)
Next, a multi-piece wiring board according to a second embodiment of the present invention will be described with reference to FIGS.

  The multi-cavity wiring board of the second embodiment differs from the multi-cavity wiring board of the first embodiment in that the frame-shaped metal layer 3 is a peripheral area 12 and a plurality of wiring board areas 11 are arranged. It is provided so as to surround and is connected to the plating terminal 5, the plating common part 6 is connected between the frame-like metal layer 3 and the wiring conductor 2, and the connection wiring layer 4 is for plating The common part 6 and the wiring conductor 2 are connected. In the example shown in FIGS. 4 to 6, the frame-shaped metal layer 3 is provided on the surface of the mother substrate 1, and the plating common part 6 is provided in the mother substrate 1.

  According to the multi-cavity wiring board of the second embodiment, the electrical resistance from the plating terminal 5 to the connection area between the plating common part 6 and each of the plurality of plating conductors 7 through the plating common part 6 The ratio of electrical resistance between the plating terminal 5 and the connection wiring layer 4 connected to the wiring conductor 2 of each wiring board region 11 can be reduced, and the plating common portion 6 Since the connection is made between the plating conductor 7 having a high electrical resistance and the connection wiring layer 4, the current transmitted from the plating terminal 5 to the connection region between the plating conductor 7 and the plating common part 6 is the plating conductor. 7 spreads to the plating common part 6 side than the connection wiring layer 4 side and suppresses a large current from being directly transmitted to the wiring conductor 2, so that the plating terminal 5, the frame-shaped metal layer 3, Plating conductor 7, both for plating Part 6, via a connection wiring layer 4, can reduce the difference in thickness of the plating layer is deposited on the exposed surface of the wiring conductor 2 of each wiring substrate area 11.

In the second embodiment, the electrical resistances of the connection wiring layer 4 and the plating conductor 7 are set to be about 10 to 100 times larger than the electrical resistance of the plating common part 6. The electric resistance of each of the plating conductors 7 is 10 to 100 higher than the electric resistance of the frame-shaped metal layer 3.
It is set to be about twice as large.

  In the second embodiment, similarly to the first embodiment, the frame-shaped metal layer 3 and the plating common portion 6 are provided at different height positions on the mother board 1, and the plating conductor 7 is provided on the mother board 1. Are provided so as to extend in the thickness direction, so that the formation area of the frame-like metal layer 3, the plating common portion 6, and the plating conductor 7 on the same plane can be reduced, that is, the peripheral area 12 can be reduced, and a large number of wiring It becomes easy to arrange and form many wiring board regions 11 in the board.

This embodiment can be suitably used when a thick plating layer is deposited on the exposed surface of the wiring conductor 2 by electroplating, as with the multi-cavity wiring board of the first embodiment. .

  4 to 6, the frame-shaped metal layer 3 is provided on the surface of the mother board 1 and the plating common portion 6 is provided inside the mother board 1. However, the frame-shaped metal layer 3 is provided on the mother board 1. The common part 6 for plating may be provided on the surface of the mother substrate 1 provided inside the substrate 1. Similar to the example shown in FIGS. 1 to 3, if the connection wiring layer 4 straddling the boundary of the wiring board region 11 is provided inside the mother board 1, a plating layer is deposited on the connection wiring layer 4. First, when dividing into individual wiring boards, the plating layer is not divided, and it becomes easy to form the individual wiring boards satisfactorily.

  Moreover, in the example shown in FIGS. 4-6, it arrange | positions so that the frame-shaped metal layer 3 and the plating common part 6 may not overlap by planar perspective. Such a multi-piece wiring board includes a region extending in the plane direction of the mother substrate 1 and a region extending in the thickness direction of the mother substrate 1 as in the examples shown in FIGS. 7 may be formed. If the frame-like metal layer 3 and the plating common part 6 are arranged so as not to overlap with each other in plan view, the peripheral area 12 of the multi-cavity wiring board becomes thick, and the peripheral area 12 of the multi-cavity wiring board It is possible to suppress the occurrence of deformation easily.

  The thickness of the plating conductor 7 in the region extending in the plane direction of the mother substrate 1 is as follows: when the material of the mother substrate 1 is ceramic, the wiring conductor 2, the frame-shaped metal layer 3, the connection wiring layer 4, and the plating common part Similarly to 6, 0.01 to 0.03 mm is preferable.

  4 to 6, the conductor lengths of the plurality of plating conductors 7 are all the same, but the conductor length of the plating conductor 7 in the region far from the plating terminal 5 is plated. You may make it smaller than the conductor length of the conductor 7 for plating in the area | region near the terminal 5 for an electric field. Further, the conductor width of the plating conductor 7 in the region far from the plating terminal 5 may be larger than the conductor width of the plating conductor 7 in the region near the plating terminal 5. For example, the frame-shaped metal layer 3 and the plating common portion 6 may be connected by varying the conductor length or conductor width of the plating conductor 7 in the region extending in the planar direction of the mother substrate 1.

  Further, when the difference in the area of the exposed surface of the wiring conductor 2 in each wiring board region 11 is large, the connection wiring layer 4 is proportional to the area of the wiring conductor 2 exposed on the upper and lower surfaces of the mother board 1. When the width is changed, the difference in the thickness of the plating layer to be deposited between the wiring conductors 2 in each wiring board region 11 can be reduced.

(Third embodiment)
Next, a multi-piece wiring board according to a third embodiment of the present invention will be described with reference to FIGS. When the mother board 1 is composed of a plurality of insulating layers, FIG. 7A is a top view of a multi-piece wiring board, and FIG. 7B is an insulating layer that is the second layer from the upper surface side of the mother board 1. 8A is a top view of an insulating layer that is the third layer from the upper surface side of the mother substrate 1, and FIG. 8B is an upper surface of the insulating layer that is the fourth layer from the upper surface side of the mother substrate 1. FIG.

  The multi-cavity wiring board in the third embodiment is different from the multi-cavity wiring board in the first embodiment in that the plating terminals 5 are arranged on the four sides of the outer edge of the mother board 1. On the upper surface, the plating common part 6 is connected to each of the plating terminals 5 arranged on two opposite sides, and on the lower surface of the mother board 1, the plating common part 6 is arranged on the other two opposite sides. It is a point provided so as to be connected to each of the plated terminals 5, and a point in which the frame-shaped metal layer 3 and the plating common part 6 are provided inside the mother substrate 1.

According to the multi-cavity wiring board of the third embodiment, each of the plurality of plating conductors from the plating terminal 5 through the plating common portion 6 is the same as the multi-cavity wiring board of the first embodiment. The ratio of electrical resistance to the connection region between the frame 7 and the frame-shaped metal layer 3 is reduced, and the frame-shaped metal layer 3 is connected between the plating conductor 7 and the connection wiring layer 4 having a large electrical resistance. The current transmitted from the plating terminal 5 to the connection region between the plating conductor 7 and the frame-shaped metal layer 3 spreads to the surrounding frame-shaped metal layer 3 side rather than the plating conductor 7 side and the connection wiring layer 4 side, and wiring By suppressing the direct transmission of a large current directly to the conductor 2, the ratio of the electrical resistance between the plating terminal 5 and the connection wiring layer 4 connected to the wiring conductor 2 of each wiring board region 11 can be reduced. Electroplating method, plating terminal 5, plating Via the common part 6, the plating conductor 7, the frame-shaped metal layer 3, and the connection wiring layer 4, the difference in the thickness of the plating layer deposited on the exposed surface of the wiring conductor 2 in each wiring board region 11 can be reduced. .

  In addition, the measurement of the electrical resistance of the common part 6 for plating and the conductor 7 for plating is performed by the method similar to 1st Embodiment.

  The multi-cavity wiring board of the third embodiment can be suitably used when a plating layer is deposited on the exposed surface of the wiring conductor 2 from the four sides.

  In the third embodiment, similarly to the second embodiment, the frame-shaped metal layer 3 is connected to the plating terminal 5, and the plating common portion 6 is formed between the frame-shaped metal layer 3 and the wiring conductor 2. You may be connected between.

  Moreover, when the frame-shaped metal layer 3 and the plating common part 6 are provided inside the mother board 1 as in the examples shown in FIGS. 7 to 9, the frame-shaped metal layer 3 and the plating common part It is possible to suppress that the thickness of the surrounding region 12 is larger than the thickness of the wiring board region 11 by depositing a plating layer on the substrate 6.

  In the third embodiment, similarly to the first embodiment, the frame-shaped metal layer 3 and the plating common portion 6 are provided at different height positions on the mother board 1, and the plating conductor 7 is provided on the mother board 1. Are provided so as to extend in the thickness direction, so that the formation area of the frame-like metal layer 3, the plating common portion 6, and the plating conductor 7 on the same plane can be reduced, that is, the peripheral area 12 can be reduced, and a large number of wiring It becomes easy to arrange and form many wiring board regions 11 in the board.

  Further, as in the examples shown in FIGS. 7 to 9, plating terminals 5 electrically connected on the upper surface side of the mother substrate 1 and plating electrically connected on the lower surface side of the mother substrate 1. If it is electrically independent from the terminal 5, a different plating layer is applied to each wiring conductor 2, or the surrounding area 12 is separated from the wiring board region 11, and an electrical short circuit between the wiring conductors 2 is performed. It can be used as a multi-piece wiring board that can be confirmed.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, a hole may be formed at a boundary between the plurality of wiring board regions 11 so as to become a groove when the multi-piece wiring board is divided, and a conductor may be formed on the inner surface of the hole. By dividing such a multi-piece wiring board, a wiring board having a so-called castellation conductor can be produced.

  In the example shown in FIGS. 1 to 9, at least one of the frame-shaped metal layer 3 and the plating common part 6 is provided inside the mother substrate 1. The parts 6 may be provided on the surface of the mother board 1, respectively. Of the frame-shaped metal layer 3 and the plating common portion 6, it is preferable to provide at least the side closer to the plating terminal 5 inside the mother substrate 1 because the effect of the present invention can be increased. In the first embodiment or the second embodiment, the frame-shaped metal layer 3 and the plating common part 6 may be provided inside the mother board 1, respectively.

  Moreover, although the terminal 5 for plating is formed in the inner surface of the notch part provided in the outer edge of the mother board 1 in the example shown in FIGS. 1-9, in the outer edge of the surrounding area | region 12 of the mother board 1, A through hole may be formed in the thickness direction of the mother substrate 1, and the plating terminal 5 may be formed on the inner surface of the through hole so as to extend along the thickness direction.

  1 to 9, two wiring conductors 2 are provided in each wiring board region 11, but a plurality of wiring board regions 11 provided with three or more wiring conductors 2 are arranged. A multi-piece wiring board may be used.

  Further, the wiring board region 11 may be provided with a cavity for storing, for example, an electronic component on the upper surface or the lower surface of the mother board 1, and a multi-piece wiring board having a dummy region between adjacent wiring board regions 11. It does not matter.

  The present invention also relates to a multi-piece wiring board in which each wiring board region 11 is provided with a metal conductor layer other than the wiring conductor 2, for example, a metal conductor layer for mounting an electronic component or a metal conductor layer for joining an external circuit board. It can be used similarly.

  Moreover, in the example shown in FIGS. 1-9, although the frame-shaped metal layer 3, the connection wiring layer 4, the common part 6 for plating, and the conductor 7 for plating are provided in the upper surface or lower surface of the mother board 1, When 1 consists of a plurality of insulating layers, the frame-shaped metal layer 3, the connection wiring layer 4, the plating common portion 6, and the plating conductor 7 may be disposed between the insulating layers. Compared with the case where it is provided on the surface of the mother board 1, it is possible to reduce warpage of the mother board 1 and short circuit between the wiring conductors 2 caused by the extension of the connection wiring layer 4 when dividing the multi-piece wiring board. .

  Further, a multi-piece wiring board obtained by combining the first embodiment to the third embodiment may be used.

1 ... Mother board
11 ... Wiring board area
12 ... Surrounding area 2 ... Wiring conductor 3 ... Frame-shaped metal layer 4 ... Connection wiring layer 5 ... Terminal for plating 6 ... Common part for plating 7 ... Conductor for plating

Claims (3)

A plurality of wiring board regions having wiring conductors are arranged in the center, and a mother board in which a peripheral region is arranged around the plurality of wiring board regions;
A frame-like metal layer provided in the surrounding region so as to surround the plurality of wiring board regions;
A terminal for plating provided on the outer edge of the mother board outside the peripheral region;
A strip-shaped common part for plating provided in the peripheral region of the mother board and connected to the terminal for plating;
A plurality of plating conductors connecting the common portion for plating and the frame-shaped metal layer;
A plurality of connection wiring layers connecting the frame-shaped metal layer and the wiring conductor;
Plating conductor The plurality of each electric resistance than said plating common unit rather large,
The planar common portion, the frame-like metal layer, and the plating conductor are disposed so as to overlap each other, and the plating conductor is provided so as to extend in the thickness direction of the mother board. Multi-cavity wiring board. The wiring board according to claim 1, wherein the plurality of wiring board regions included in the multi-cavity wiring board according to claim 1 are divided into pieces. A wiring board according to claim 2 ;
An electronic device comprising: an electronic component mounted on the wiring board.

Images