JP5458028B2 - Multi-wiring board - Google Patents

Description

  In the present invention, a plurality of wiring boards in which a plurality of wiring boards are arranged vertically and horizontally, and a metal plating is relatively uniformly coated on a conductor portion formed on the front surface, the back surface, or the bottom surface of each cavity of each wiring board. Regarding the substrate.

  The multi-cavity wiring board is composed of a product area in which a plurality of wiring boards are arranged vertically and horizontally, and a rectangular frame-shaped ear part positioned around the product area, and a pair of ear edges facing each other at the ear part. A plurality of plating electrodes for sequentially covering, for example, Ni plating and Au plating are formed on a conductor portion such as a pad exposed on the surface of each wiring board on the outer surface of each of the wiring boards. . Between the electrode for plating and the conductor portion of the wiring board located on the outermost side of the product area, the surface formed on the surface of the ear part or inside is electrically connected through a rectangular frame-shaped plating tie bar. It is possible. Each conductor portion is covered with the Au plating or the like by sequentially immersing it in a predetermined plating bath in a state where a rod electrode for plating is inserted into contact with the concave surface for each electrode for plating. .

By the way, the ear side of the ear part where the electrode for plating is formed and the ear side where the connection wiring extends from each conductor part of the wiring board located on the outermost side of the product region are adjacent to each other at right angles. In this case, the plating current is likely to flow excessively in the plating tie bar located at the corner portion where the two ear sides are connected at right angles.
Therefore, the surface of the plating tie bar near the corner is coated with a relatively thick plating film such as Au, while the conductor portion of the wiring board located near the center in the product area is plated. Since the coating becomes relatively thin and easy to coat, there is a problem that the thickness of the plating coating becomes non-uniform depending on the wiring board at each position in the product region. In order to solve such a problem, among the ears having a rectangular frame shape, the width of the plating tie bar located in the region for each corner part of the ear part is made larger than the width of the plating tie bar located in the other straight part. A wide multi-cavity wiring board has been proposed (see, for example, Patent Document 1).

  However, in the multi-cavity wiring board of Patent Document 1, the ear edge of the ear portion where the electrode for plating is formed, and the ear edge where the connection wiring extends from each conductor portion of the wiring board located on the outermost side of the product area, However, it is difficult to apply to a multi-piece wiring board having a common form. In addition, the conduction resistance to the wiring board located at the center of the product area relatively far away must be larger than that of the outermost wiring board in the product area located relatively close to the plating electrode. As a result, the thickness of the metal plating film coated on the conductor part of the outermost wiring board becomes thicker than the thickness of the metal plating film coated on the conductor part of the central wiring board, and the plating film varies. As a result, there is a problem that the quality becomes unstable among the plurality of wiring boards separated into individual pieces.

Japanese Patent Laid-Open No. 2006-1000054 (pages 1 to 11, FIG. 1)

  The present invention has both a product region in which a plurality of wiring boards are arranged vertically and horizontally and an ear portion on which an electrode for plating is formed on the outer surface, and is a wiring substrate at any position in the product region. An object of the present invention is to provide a multi-piece wiring board in which the thickness of the metal plating film coated on the conductor portion located on the surface thereof is uniform.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a multi-cavity wiring board of the above-described form, wherein the width of the plating tie bar is increased from a position close to the plating electrode to a position away from the plating electrode. Inspired by the idea.
That is, the multi-cavity wiring board of the present invention (Claim 1) is a product in which a plurality of insulating layers are laminated, and a plurality of wiring boards having a rectangular shape in a plan view along the thickness direction are arranged along the length and breadth. A region, an insulating layer laminated in the same manner as described above, an ear portion that is located along the outer periphery of the product region and has a rectangular frame shape in plan view, and a plating electrode formed on the outer surface of the ear portion; A plating tie bar formed between the ears and electrically connected between the electrode for plating and connection wires extending from conductor portions of a plurality of wiring boards located on the outermost side in the product region. The width of the plating tie bar is wider from a position close to the plating electrode toward a position away from the plating electrode.

According to this, the plating tie bar that conducts between the electrode for plating and the connection wiring extending from the conductor portions of the plurality of wiring boards located on the outermost side in the product region is the plating plate. The ear portion is formed so that the width increases from a position close to the electrode toward a position away from the plating electrode. As a result, the current from the plating electrode does not immediately flow excessively to the wiring board close to the electrode, so that the outermost wiring board in the product area located relatively close to the plating electrode and the plating electrode A difference in conduction resistance due to the length of the conduction path can be suppressed or reduced with respect to the wiring board located on the center side of the relatively distant product region.
Accordingly, since the plating current flows relatively uniformly to the wiring board at any position in the product area through the plating electrode, the plating tie bar, and the connection wiring, the surface of each wiring board, etc. This is a multi-piece wiring board in which the conductor portion located at is covered with a metal plating film whose thickness is approximate.

The insulating layer is a high-temperature fired ceramic layer such as alumina, a low-temperature fired ceramic layer including a glass-ceramic layer, or a resin layer.
The product region includes both a form in which a plurality of wiring boards are directly adjacent to each other vertically and horizontally and a form in which a plurality of wiring boards are arranged vertically and horizontally through an insulating layer.
Furthermore, the plating tie bar is formed between the front and back surfaces of the ear portion formed by laminating a plurality of ceramic layers and the like, or between a plurality of ceramic layers.
Further, the plating tie bar and the conductor portion of each wiring board located on the outermost side in the product area are individually connected by the dedicated connection conductor and are adjacent in the product area. The conductor portions of each wiring board to be connected are also connected by a similar relay conductor.
Furthermore, the conductor portion of the wiring board is an internal wiring layer, a connection terminal (pad) on the front or back surface, a pad on the bottom surface of the cavity, a through-hole conductor, or a sealing conductor frame on the surface surrounding the cavity.
Further, between the product region and the ear portion, and between adjacent wiring boards in the product region, a virtual planned cutting surface is located, or a dividing groove along the planned cutting surface is a surface. And at least one of the back surfaces.
Furthermore, the said ear | edge side points out any one side which comprises the ear | edge part of a rectangular frame shape.

In the present invention, the width of the plating tie bar is gradually increased from a position close to the plating electrode to a position away from the plating electrode, or is gradually increased. A multi-piece wiring board (claim 2) is also included.
According to this, the width of the plating tie bar is formed in the ear portion so as to gradually or stepwise widen from a position close to the plating electrode to a position away from the plating electrode. ing. As a result, since a relatively uniform plating current flows to the wiring board at any position in the product area, a multi-piece wiring board coated with a metal plating film whose thickness is approximate to the conductor portion of each wiring board and It has become. In addition, a conductive paste is gradually formed in the manufacturing process, for example, in a taper shape, between the front surface, the back surface, or the internal insulating layer of the ear portion formed by laminating a plurality of insulating layers made of a ceramic layer or the like. The tie bar for plating can be easily formed without greatly increasing the number of steps or making it complicated, for example, by printing with a pattern in which the width changes stepwise like a stepped shape. .
The term “gradual” means that the width increases in a tapered pattern, for example, from a position close to the plating electrode to a position away from the plating electrode. In addition, the “stepwise” means that the width is widened by, for example, a stepped pattern of a plurality of steps.

Further, according to the present invention, a plurality of the plating electrodes are formed on the outer surface of the ear portion, and the width of the plating tie bar connecting between the two adjacent plating electrodes is set to each plating electrode. Also included is a multi-wiring board (Claim 3) that is narrowest at a position close to, and widest at a position farthest from each electrode for plating.
According to this, in the product area, either the outer peripheral wiring board that is relatively close to one of the two adjacent plating electrodes or the wiring board that is relatively far from any of the plating electrodes. Even in such a case, since the difference in conduction resistance due to the length of the conduction path is small, the wiring board is a multi-piece wiring board in which the conductor portion of each wiring board is coated with a metal plating film whose thickness is approximate.

Further, in the present invention, a plurality of plating electrodes are formed for each pair of ear sides facing each other in plan view, and two adjacent plating electrodes are connected for each ear side. The width of the tie bar for plating includes the multi-piece wiring board (Claim 4) that is narrowest at a position close to each plating electrode and widest at a position farthest from each plating electrode.
According to this, a plurality of plating electrodes are formed for each pair of ear sides facing each other across the product region, and the width of the plating tie bar connecting between two adjacent plating electrodes at each ear side is It is narrowest at a position close to each plating electrode, and is widest at a position farthest from each plating electrode. As a result, since a relatively uniform plating current is applied to the wiring board at any position in the product area, a large number of conductors on each wiring board covered with a metal plating film whose thickness is approximated. It is a wiring board.

Further, according to the present invention, the multi-cavity wiring board has a thickness of the plating tie bar that increases from a position close to the plating electrode toward a position away from the plating electrode. Is also included.
According to this, since the plating tie bar increases in thickness and thickness from a position close to the plating electrode to a position away from the plating electrode, it can be located at any position in the product area. However, the difference in conduction resistance due to the length of the conduction path with the plating electrode is further reduced. Therefore, the wiring board is a multi-piece wiring board in which the conductor portion of each wiring board is coated with a metal plating film whose thickness is approximate. Moreover, since the width of the front and back surfaces of the ears can be suppressed, it is possible to reduce the size of the multi-piece wiring board.

In addition, according to the present invention, the thickness of the plating tie bar gradually increases or gradually increases from a position close to the plating electrode toward a position away from the plating electrode. A multi-piece wiring board (Claim 6) is also included.
According to this, since the plating tie bar gradually or stepwisely increases in width and thickness from a position close to the plating electrode to a position away from the plating electrode, Even in the position of the wiring board, the difference in conduction resistance due to the length of the conduction path with the plating electrode can be more reliably reduced.
In the plating tie bar, the portion where the thickness increases with the width of the tie bar includes a form protruding outward from the front or back surface of the ear part or a form biting into the inside of the ear part.

The top view which shows the multi-piece wiring board of one form by this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The horizontal sectional view along the arrow of the YY line in FIG. The top view which shows the multi-cavity wiring board of a different form by this invention. FIG. 5 is a vertical sectional view taken along the line ZZ in FIG. 4. The expanded sectional view of the part shown on the left side in FIG. The partial top view which shows the application form of the said multi-piece wiring board. The partial top view which shows the deformation | transformation form of the said multi-piece wiring board. The partial top view which shows the application form of the said multi-piece wiring board. The partial top view which shows the multi-cavity wiring board of another form. FIG. 11 is a vertical sectional view taken along the line U-U in FIG. 10. The partial top view which shows the multi-piece wiring board of another form. FIG. 13 is a vertical sectional view taken along the line VV in FIG.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a plan view showing a multi-piece wiring board 1a according to an embodiment of the present invention, FIG. 2 is a vertical sectional view taken along line XX in FIG. 1, and FIG. It is a horizontal sectional view in alignment with the arrow of the YY line.
As shown in FIGS. 1 to 3, the multi-piece wiring board 1 a has a front surface 2 and a back surface 3, and is formed by laminating two (plural) ceramic layers (insulating layers) s <b> 1 and s <b> 2. A product region Pa in which a plurality of wiring boards p exhibiting a rectangle (rectangle) in a plan view along the vertical direction and the ceramic layers s1 and s2 as described above are stacked, and is formed on the outer periphery of the product region Pa. A pair of (a plurality of) ears 5 that are positioned along the rectangular frame shape in plan view and are formed on the outer surfaces 4 of the pair of left and right ear sides 5 in FIGS. 1 and 3. And an electrode 6. The plating electrode 6 is a substantially semi-cylindrical body along the inner wall surface of the concave portion 7 provided on the outer side surface 4 of the ear portion 5 in a plan view.
The front surface 2 and the back surface 3 are common to the product region Pa and the ear portion 5.
The ceramic layers s1 and s2 contain, for example, alumina as a main component.
Furthermore, the broken line in FIG. 1, FIG. 3 has shown the virtual cutting plan surface cf.

As shown in FIGS. 1 and 2, the surface 2 of the product region Pa includes a square surface conductor 10 that straddles the corners of four wiring boards p adjacent vertically and horizontally and has a relatively large plan view, and a product. A surface conductor 11 having a rectangular shape in plan view, straddling each corner of two wiring boards p adjacent to each other along the outermost side of the area Pa, and each outer corner of the wiring board p positioned at the four corners of the product area Pa. The formed surface conductors 12 having a square shape that is relatively small in plan view are formed. That is, when separated into pieces along the scheduled cutting plane cf, four pads are individually formed at the four corners of the surface 2 of each wiring board p obtained.
As shown in FIGS. 2 and 3, among the ear portions 5 between the ceramic layers s <b> 1 and s <b> 2, a pair of left and right long side ear sides 5 are formed with facing plating tie bars 15, and one upper and lower side. A tie bar 18 for connection is formed to face the short edge 5. The plating tie bar 15 is connected to the central portion of the plating electrode 6 through the connection line 14 and moves from a position 16 close to the plating electrode 6 to a position 17 farthest from the plating electrode 6. , The width is formed to be tapered (gradually) 15t. The plating tie bar 15 located between the upper and lower adjacent plating electrodes 6 and 6 is also gradually widened toward the position 17 farthest from each plating electrode 6. On the other hand, the upper and lower connecting tie bars 18 that connect the upper and lower positions 17, 17 of the left and right plating tie bars 15 have a band shape with a constant width.

  As shown in FIGS. 2 and 3, between the ceramic layers s1 and s2, the outer corners of a plurality of wiring boards p arranged along the inner peripheral side of the ear portion 5 and the outermost side of the product region Pa, or The wiring portion (conductor portion) 8 formed in a plan view extending over each corner of the four wiring substrates p adjacent in the product region Pa is connected to the wiring portions 8 and 8 having a substantially square shape. A connecting wire 9 having a crank shape in plan view and a connecting conductor 9j for connecting the outermost wiring portion 8 and the plating tie bar 15 are formed. A through hole h penetrating the ceramic layers s1 and s2 in the thickness direction is located at the center of each wiring part 8, and a cylindrical through hole conductor td is formed along the inner wall surface of the through hole h. Is formed. Each wiring portion 8 and the surface conductors 10, 11, and 12 can be electrically connected to each other through the through-hole conductor td. As shown in FIG. 2, a plurality of back surface conductors 19 similar to the surface conductors 10 to 12 are formed on the back surface 3 on the ceramic layer s2 side. The back conductor 19 is also individually conductive with each wiring portion 8 and the front conductors 10 to 12 through the through-hole conductor td.

That is, four electrically independent wiring portions are disposed near the four corners between the ceramic layers s1 and s2 for each wiring board p when separated into pieces along the planned cutting plane cf. The wiring portion is electrically connected to the pad on the front surface 2 side and the back surface conductor on the back surface 3 side through the recessed groove conductors exposed on the outer surfaces of the four corners.
The plating electrode 6, the wiring portion 8, the connection wiring 9, the connection conductor 9 j, the front conductors 10 to 12, the plating tie bar 15, the connection tie bar 18, the back conductor 19, and the through-hole conductor td are, for example, W or It consists of Mo.
In addition, the plating tie bar 15 is obtained by printing a conductive paste containing W powder or the like on the surface of the green sheet to be the ceramic layer s2 later according to the pattern, and then laminating and baking the paste by a conventional method. It is easily formed.

  According to the multi-piece wiring board 1a as described above, the width of the pair of plating tie bars 15 formed facing the pair of left and right ear sides 5 in the ear portion 5 between the ceramic layers s1 and s2 is as described above. From a position 16 close to the pair of plating electrodes 6 toward a position 17 away from the plating electrode 6, the width is gradually increased in a tapered shape (gradually) 15t. As a result, between the outermost wiring board p of the product area Pa located relatively close to the plating electrode 6 and the wiring board p located on the center side of the product area Pa relatively far from the plating electrode 6. The difference in conduction resistance due to the length of the conduction path is also reduced. Therefore, since the plating current flows relatively uniformly to the wiring board p at any position in the product area Pa through the plating electrode 6, the plating tie bar 15, the connection wiring 9j, and the connection line 9, The front and back conductors 10 to 12 and 19 for each wiring board p are formed as a multi-piece wiring board 1a in which a Ni plating film or an Au plating film is coated with an approximate thickness.

4 is a plan view showing a multi-piece wiring board 1b of a different form, FIG. 5 is a vertical sectional view taken along the line ZZ in FIG. 4, and FIG. 6 is on the left side in FIG. It is an expanded sectional view of the part shown.
As shown in FIGS. 4 to 6, the multi-piece wiring board 1 b has a front surface 2 and a back surface 3, and is formed by laminating three ceramic layers s <b> 1 to s <b> 3, and is rectangular in plan view along the thickness direction. A product region Pa in which a plurality of wiring boards p exhibiting the above are arranged along the vertical and horizontal directions while being spaced apart from each other, and the same ceramic layers s1 to s3 as described above are laminated, and are located along the outer periphery of the product region Pa and are planar. The ear part 5 has a rectangular frame shape, and the same electrode 6 for plating formed on the outer surface 4 of the pair of left and right ear sides 5 in FIG.
The ceramic layers s1 to s3 are also mainly composed of alumina, for example.

  As shown in FIG. 4, a plating tie bar 25 is formed on the pair of left and right long sides 5 of the ears 5 on the surface 2 of the ceramic layer s1 so as to face each other. A tie bar for connection 28 is formed on the ear side 5 so as to face the ear side 5. The plating tie bar 25 is connected to the central portion of the plating electrode 6 via the connection line 14 and moves from a position 26 close to the plating electrode 6 to a position 27 farthest from the plating electrode 6. , The width is formed to be stepped (stepwise) 25s. Also in the plating tie bar 25 located between the upper and lower adjacent plating electrodes 6, 6, the width is gradually increased toward the position 27 farthest from each plating electrode 6. On the other hand, the upper and lower connecting tie bars 28 that connect the upper and lower positions 27, 27 of the left and right plating tie bars 25 have a band shape with a constant width.

As shown in FIG. 4 to FIG. 6, in the product region Pa, the plurality of wiring boards p arranged vertically and horizontally apart from each other have a cavity 23 that opens on the surface 2 and has a rectangular shape in plan view. A conductor frame (conductor portion) 20 for sealing having a rectangular plan view is individually formed along the surface 2 of the ceramic layer s1 surrounding the cavity 23. The conductor frames 20 and 20 of the wiring boards p and p adjacent to each other on the left and right are connected via a connection line 21, and the conductor frame 20 for each wiring board p located on the outermost side of the product area Pa includes a connection conductor 22. Via the left and right tie bars 25 for plating.
In each wiring board p, a pair of connection terminals 24 are formed on the surface of the lowermost ceramic layer s3 exposed on the bottom surface of the cavity 23, and the connection terminals 24 are connected to the ceramic layer s3 as shown in FIG. The pair of back surface conductors 29 formed on the back surface 3 and the through-hole conductors td penetrating the ceramic layer s3 can be individually conducted. Further, the pair of back surface conductors 29 for each wiring board p can be individually conducted to the conductor frame 20 on the front surface 2 side through through-hole conductors td penetrating the ceramic layers s1 to s3.

That is, as shown in FIGS. 4 to 6, the plating electrode 6 located on the left and right ear sides 5 is connected to the wiring board p via the connection line 14, the plating tie bar 25, the connection conductor 22, and the connection line 21. Each conductor frame 20 can be electrically connected to each other, and in each wiring board p, the conductor frame 20 and the pair of connection terminals 24 can be individually electrically connected through two types of long and short through-hole conductors td.
5 and 6, the planned cutting plane cf is shown along the outer sides of the four sides of the conductor frame 20 in each wiring board p in plan view.
The conductor frame 20, the wiring line 21, the connection wiring 22, the connection terminal 24, the plating tie bar 25, the connection tie bar 28, the back conductor 29, and the through-hole conductor td are made of, for example, W or Mo.
Further, the plating tie bar 25 is obtained by printing a conductive paste containing W powder or the like on the surface of the green sheet, which will be the ceramic layer s1 later, according to the pattern, and then laminating and firing by a conventional method. Easy to form.
In addition, in the wiring board p after being separated into pieces along the planned cutting plane cf, the conductor frame 20 is used for brazing with a metal lid plate that closes the opening of the cavity 23, and a pair It also serves as a ground in the circuit including the connection terminal 23.

According to the multi-piece wiring board 1b as described above, the width of the pair of plating tie bars 25 formed facing the pair of left and right ear sides (ear portions) 5 on the surface 2 of the ceramic layer s1 is the above-mentioned pair. From the position 26 close to the plating electrode 6 toward the position 27 far from the plating electrode 6, a stepped (stepwise) 25 s is widened. As a result, between the wiring board p on the outer peripheral side of the product area Pa located relatively close to the plating electrode 6 and the wiring board p located on the center side of the product area Pa relatively far from the plating electrode 6. Also, the difference in conduction resistance due to the length of the conduction path is suppressed.
Accordingly, the plating current is caused to flow relatively uniformly to the wiring board p at any position in the product area Pa via the plating electrode 6, the plating tie bar 25, the connection wiring 22, and the connection line 21. A multi-piece wiring board 1b is obtained in which the surface of the conductor frame 20, the connection terminal 24, and the back conductor 29 for each wiring board p is coated with a Ni plating film or an Au plating film with an approximate thickness.

FIG. 7 is a partial plan view showing a multi-piece wiring board 1c which is an applied form of the wiring board 1b.
As shown in FIG. 7, the multi-piece wiring board 1 c includes the same product region Pa in which a plurality of wiring boards p including the conductor frame 20, the connection terminals 24, the cavities 23, and the like are arranged vertically and horizontally, and the outside thereof. And the same ear portion 5 as described above. The multi-cavity wiring board 1 c is different from the wiring board 1 b in that plating tie bars 25 formed on the surface 2 of the left and right ear sides (ear portions) 5 are provided on the outer surface 4 of the ear side 5. The width is tapered (gradually) 25 t from a position 26 that is directly connected to the central portion of the plating electrode 6 and close to the plating electrode 6 to a position 27 farthest from the plating electrode 6. It is formed so as to be wide.
Further, a plating tie bar in which the width of the position adjacent to the position 27 is narrow on the surface 2 of the upper and lower ear edges 5 and the width is gradually increased toward the center of each ear edge 5 (gradually) 28t. 28b is formed, and connection is provided between the plating tie bar 28b and the conductor frame 20 for each wiring board p located on the outer peripheral side in the product area Pa along the vertical direction of FIG. Another difference from the wiring board 1b is that a wiring 22j and a connection line 21i for connecting the conductor frames 20 and 20 for each wiring board p adjacent in the vertical direction are further formed.

According to the multi-piece wiring board 1c as described above, the pair of left and right plating tie bars 25 provides the same effect as the wiring board 1b, and the pair of upper and lower plating tie bars 28b extends along the vertical direction. The connection wiring 22j and the connection line 21i are additionally provided, so that the distance from each plating electrode 6 is different also in the path along the longitudinal direction of the conductor frame 20 for each of the plurality of wiring boards p on the surface 2. Can be reduced or suppressed evenly at any position in the product area Pa. Accordingly, since the plating current supplied to each plating electrode 6 flows relatively uniformly to the wiring board p at any position in the product region Pa, the surface of the conductor frame 20 or the like for each wiring board p is applied. A multi-cavity wiring board 1c in which Ni and Au plating films are coated with a more uniform thickness can be obtained.
In the multi-piece wiring board 1b, instead of the connection tie bar 28, a plating tie bar 28b or a plating tie bar whose width changes stepwise is provided, and the connection wiring 22j and the connection line 21i are added. It is good also as the form which did.
Also in the multi-piece wiring board 1a, instead of the connection tie bar 18, a plating tie bar 28b or a plating tie bar whose width changes stepwise is provided, and further, connection wiring and connection lines along the vertical direction are provided. It is good also as a form which added.
Further, a connection wiring (22j) and a connection line (21i) along the vertical direction may be added between the connection tie bars 18 and 28 of the multi-piece wiring boards 1a and 1b and the wiring board p. .

FIG. 8 is a partial plan view showing a modified embodiment 1d of the multi-piece wiring board 1a.
As shown in FIG. 8, the multi-piece wiring board 1 d is positioned at a distance from the plating electrode 6 from a position 16 close to the plating electrode 6 on the pair of left and right ear edges 5 between the ceramic layers s 1 and s 2. The plating tie bars 15 that are widened stepwise (stepwise) 15 s are formed individually, and the same effects as those of the multi-cavity wiring board 1 a can be obtained.
FIG. 9 is a partial plan view showing an application form 1e of the multi-piece wiring board 1d.
As shown in FIG. 9, in addition to the pair of left and right plating tie bars 15 whose width changes stepwise (stepwise) 15s, the multi-piece wiring board 1e is adjacent to the upper and lower ear sides 5 and the position 17. A tie bar 18b for plating is formed in which the width of the position to be narrowed and the width is increased stepwise (stepwise) 18s toward the center of each ear edge 5 and along the vertical direction of FIG. Connection wiring 9k connecting between the plating tie bar 18b and the wiring portion 8 for each wiring board p located on the outer peripheral side in the product area Pa, and wiring portions 8 and 8 for each wiring board p adjacent in the vertical direction A connection line 9i is further added to connect them.

According to the multi-piece wiring board 1e as described above, in addition to the effects of the multi-piece wiring boards 1a and 1d, there are a pair of upper and lower plating tie bars 18b, a connection wiring 9k along the vertical direction, and a connection line 9i. In addition, the difference in distance from each plating electrode 6 can be determined at any position in the product area Pa in the path along the vertical direction of the wiring portions 8 and 8 for each of the plurality of wiring boards p. However, it can be further reduced or suppressed and uniformized. Accordingly, since the plating current supplied to each plating electrode 6 flows relatively uniformly with respect to the wiring board p at any position in the product region Pa, the conductor portion 8 for each wiring board p, etc. A multi-cavity wiring board 1e is formed by coating the surface with a Ni plating film and an Au plating film with a more uniform thickness.
In the multi-piece wiring board 1a, instead of the connection tie bar 18, a plating tie bar 18b or a plating tie bar whose width gradually changes is provided, and further, connection wiring and connection lines along the vertical direction are provided. It is good also as a form which added.

FIG. 10 is a partial plan view showing a multi-piece wiring board 1f which is an application form of the wiring board 1c, and FIG. 11 is a vertical sectional view taken along the line U-U in FIG.
As shown in FIG. 10, the multi-cavity wiring substrate 1f includes the same product region Pa in which a plurality of wiring substrates p including the conductor frame 20, the connection terminals 24, the cavities 23, and the like are arranged vertically and horizontally, and the outside thereof. And a pair of opposing ear sides 5 having a width of a plating tie bar 25 connected to the central portion of the plating electrode 6 provided on the outer side surface 4 of the ear side 5. It is formed so as to increase in a taper shape (gradually) 25t from a position 26 connected via the wire 14 and close to the plating electrode 6 toward a position 27 farthest from the plating electrode 6. Yes.
Further, in the multi-piece wiring board 1f, as shown in FIG. 11, the thickness of the plating tie bar 25 is changed from the position 26 close to the plating electrode 6 to the position 27v farthest from the plating electrode 6. Thus, the thickness is increased outwardly in a tapered shape (gradually) 25 tv. Also, between the pair of adjacent plating electrodes 6, 6, the thickness of the plating tie bar 25 is from the position 26 close to the plating electrode 6 toward the position 27 v farthest from each plating electrode 6. The taper shape (gradual) is increased to 25 tv.

FIG. 12 is a partial plan view showing a multi-piece wiring board 1g which is an applied form of the wiring board 1b, and FIG. 13 is a vertical sectional view taken along the line VV in FIG.
As shown in FIG. 12, the multi-piece wiring board 1g includes the same product region Pa and the ear portion 5 as described above, and the width of the plating tie bar 25 is equal to the width of the pair of opposite ear sides 5. 5 from a position 26 that is connected to the central portion of the plating electrode 6 provided on the outer surface 4 via the connecting line 14 and is close to the plating electrode 6, to a position 27 that is farthest from the plating electrode 6. Thus, it is formed so as to widen in a stepped (stepwise) 25 s. Further, in the multi-piece wiring board 1g, as shown in FIG. 12, the thickness of the plating tie bar 25 is changed from the position 26 close to the plating electrode 6 to the position 27v farthest from the plating electrode 6. Thus, the thickness is increased outward in a stepped (stepwise) 25 sv manner. Also, between the pair of adjacent plating electrodes 6, 6, the thickness of the plating tie bar 25 is from the position 26 close to the plating electrode 6 toward the position 27 v farthest from each plating electrode 6. The stepped (stepwise) thickness is 25 sv. The width and thickness of the plating tie bar 25 are gradually increased and thickened at the same position between the positions 26 and 27. However, if the change in width and thickness is the same as the above, the position 26 , 27 may be changed at different positions.

According to the multi-piece wiring boards 1f and 1g as described above, the thickness of the plating tie bar 25 is changed in the same manner as the change in which the width increases between the positions 26 and 27. Even with this wiring board p, the difference in distance from each plating electrode 6 can be made more uniform. Accordingly, since the plating current supplied to each plating electrode 6 flows relatively uniformly to the wiring board p at any position, Ni and Au plating is applied to the surface of the conductor frame 20 and the like for each wiring board p. The multi-cavity wiring boards 1f and 1g are coated with a more uniform thickness.
Note that the thickness of the plating tie bar 25 on the wiring boards 1f and 1g may be gradually or gradually increased toward the inside of the ceramic layer s1.
Also, with respect to the multi-piece wiring boards 1a, 1d, and 1e, by changing the thickness of the plating tie bar 15 in the same manner as the change in width between the positions 16 and 17, Even in the position of the wiring board p, the difference in distance from each plating electrode 6 can be made more uniform.

The present invention is not limited to the embodiments described above.
For example, the insulating layer may be made of a high-temperature fired ceramic other than alumina, or a glass-ceramic which is a kind of low-temperature fired ceramic, and further a resin such as epoxy. Among these, when glass-ceramic or epoxy resin is used, conductors such as the electrode 6 for plating, the conductor portion 8, the tie bars 15 and 25 for plating, and the conductor frame 20 are Cu, Ag, Cu alloy, or Ag alloy. Applies.
Further, only one plating electrode 6 may be provided on the same edge 5 of the ear portion 5, or three or more may be provided side by side.
Furthermore, one or more of the plating electrodes 6 may be formed in the same number or different numbers for each of the four sides 5 of the ear 5. In this embodiment, the plating tie bars 15 and 25 are arranged for each of the four ear edges 5.
The plating tie bar 15 may be disposed on the surface of the uppermost insulating layer among the plurality of insulating layers, and the plating tie bar 25 may be disposed between the plurality of insulating layers. good.

Further, the “gradual” includes a form in which the width increases in a curved shape (curved) from a position close to the plating electrode to a position away from the plating electrode.
In addition, the “stepwise” includes a form in which the width gradually increases stepwise through a plurality of inclined sides from a position close to the plating electrode to a position away from the plating electrode.
Furthermore, in the multi-cavity wiring boards 1a to 1g, in the form in which a virtual cutting planned surface cf indicated by a broken line is arranged at the boundary between the product region Pa and the ear portion 5 or the boundary between the wiring boards p and p, Each wiring board p is separated into pieces by carrying out a sinter (shearing) process along the scheduled cutting surface cf.
In addition, in the multi-piece wiring boards 1a to 1g, instead of the planned cutting surface cf, a substantially V-shaped dividing groove opened on the front surface 2 is formed, or both the front surface 2 and the back surface 3 are cross-sectioned. A pair of substantially V-shaped dividing grooves may be formed symmetrically, and each wiring board p may be singulated by bending along the dividing grooves.

  A product region in which a plurality of wiring boards are arranged vertically and horizontally and an ear portion on which an electrode for plating is formed on the outer surface are combined, and the wiring board at any position in the product region is covered with a conductor portion. A multi-piece wiring board with a uniform thickness of the metal plating film can be provided reliably.

1a to 1g …………………… Multiple wiring board 5 ……………………………… Ear part / ear side 6 ……………………………… Plating electrode 8 ……………………………… Wiring part (conductor part)
9j, 9i, 22, 22j ... Connection wiring 15, 25 ............ Plating tie bar 16, 26 ........................... Positions close to the plating electrode 17, 27 ......... ......... position away from the electrode for plating 20 ……………………………… Conductor frame (conductor part)
Pa ………………………… Product area p ……………………………… Wiring board s1 to s3 …………………… Ceramic layer (insulating layer)
15t, 25t, 25tv ... tapered (gradual)
15s, 25s, 25sv ... stepped (stepwise)

Claims (6)

A product region in which a plurality of insulating layers are stacked, and a plurality of wiring boards that are rectangular in a plan view along the thickness direction are arranged along the length and breadth,
In the same manner as described above, an insulating layer is laminated, and an ear portion that is located along the outer periphery of the product region and has a rectangular frame shape in plan view;
A plating electrode formed on the outer surface of the ear,
A plating tie bar formed between the ears and electrically connected between the electrode for plating and the connection wires extending from the conductor portions of the plurality of wiring boards located on the outermost side in the product region;
The width of the plating tie bar is increased from a position close to the plating electrode toward a position away from the plating electrode.
A multi-piece wiring board characterized by that. The width of the plating tie bar is gradually increased from a position close to the plating electrode to a position away from the plating electrode, or is gradually increased.
The multi-piece wiring board according to claim 1, wherein: A plurality of the plating electrodes are formed on the outer surface of the ear portion, and the width of the plating tie bar connecting between two adjacent plating electrodes is the narrowest at a position close to each plating electrode. And widest at the position farthest from each plating electrode,
The multi-piece wiring board according to claim 1, wherein the multi-piece wiring board is provided. Among the ear portions, a plurality of plating electrodes are formed for each pair of ear sides facing each other at least in plan view, and the width of the plating tie bar connecting between two adjacent plating electrodes for each ear side is: , Narrowest at a position close to each plating electrode, and widest at a position farthest from each plating electrode,
The multi-piece wiring board according to claim 1, wherein the wiring board is a multi-piece wiring board. The thickness of the plating tie bar is increased from a position close to the plating electrode toward a position away from the plating electrode.
The multi-piece wiring board according to any one of claims 1 to 4, wherein the wiring board is a multi-piece wiring board. The thickness of the plating tie bar is gradually increased from a position close to the plating electrode to a position away from the plating electrode, or is gradually increased.
The multi-piece wiring board according to claim 5, wherein the wiring board is a multi-piece wiring board.

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