JP2005347479A - Laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component 10 in which a chip component 20 is mounted on a multilayered substrate 11 wherein, when the chip component 20 is mounted on the bottom 13 of a cavity 12, four corners 22 of the chip component 20 are prevented from being cracked. <P>SOLUTION: The laminated electronic component 10 comprises: a multilayered substrate 11 having the cavity 12 on a main surface thereof; a shield electrode 14 formed so as to cover at least the chip component mounting region of the bottom 13 of the cavity 12; and the chip component 20 which is secured to the bottom 13 of the cavity 12 by using the shield electrode 14 as a die bond surface. A portion relevant to the four corners 22 of the chip component 20 housed in the cavity 12 is configured to be formed with a notch 18 in the shield electrode 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multilayer electronic component in which a chip component is mounted on a multilayer substrate.

  Conventionally, a multilayer electronic component in which a chip component such as an IC is mounted on a multilayer substrate in which capacitors and coils are formed has been proposed (for example, Patent Document 1).

  A multilayer electronic component is configured by forming a cavity in one main surface of a multilayer substrate and housing a chip component in the cavity. An electrode for shielding is formed on the bottom surface of the cavity, and the chip component is fixed to the bottom surface of the cavity with this electrode as a die bond surface.

  The shield electrode is an electrode for shielding electrical coupling between the circuit in the multilayer substrate and the circuit in the chip component, and is preferably connected to the ground in order to increase the shielding effect.

  Furthermore, the wiring pattern exposed in the cavity and the electrode of the chip component are electrically connected by wire bonding.

However, in the above-described conventional configuration, it is often seen that the chip parts housed in the cavity are chipped at the four corners.
JP 2004-103608 A

  Therefore, in the present invention, it is an object to be solved to provide a multilayer electronic component that can prevent chipping at four corners of a chip component housed in a cavity.

  The multilayer electronic component according to the present invention includes a multilayer substrate having a cavity on a main surface, a shield electrode formed so as to cover at least a chip component mounting region on a bottom surface of the cavity, and the cavity using the shield electrode as a die bond surface. The shield electrode is cut out at a portion corresponding to the four corners of the chip component housed in the cavity or a portion corresponding to the outer periphery.

  When the present inventors diligently examined the chipping at the four corners of the chip component, in the conventional multilayer electronic component, the shield electrode formed on the bottom surface of the cavity is sufficient to effectively shield the radiation from the chip component. In order to ensure a good shielding property, it is formed so as to cover at least the chip component mounting region.

  However, since the shrinkage rate of the shield electrode is different from that of the multilayer substrate (the shield electrode is less likely to shrink than ceramic), unevenness may occur on the bottom surface of the cavity. In particular, when trying to mount a chip component with the center part of the bottom of the cavity slightly bent so that it falls, the four corners of the chip component come into contact with the surface of the shielded shield electrode, and the impact causes the four corners of the chip component to be brittle. As a result of finding out that it is missing and further intensive studies based on this, the present invention has been completed.

  According to the multilayer electronic component of the present invention, the notch is formed in the shield electrode formed on the bottom surface of the cavity in the portion corresponding to the four corners of the chip component housed in the cavity or the portion corresponding to the outer periphery. When the chip part is fixed to the bottom surface of the cavity with the die bonding surface as the die bond surface, the four corners of the chip part enter the notch of the shield electrode, the surface of the shield electrode does not contact, and the chip part can be prevented from being chipped. . Furthermore, when the notch is formed in the shield electrode in the portion corresponding to the outer periphery of the chip component, not only the four corners of the chip component but also the outer peripheral chip can be prevented.

  According to the multilayer electronic component of the present invention, chipping can be prevented from occurring at the four corners of the chip component when the chip component is mounted on the bottom surface of the cavity.

  The best embodiment of the present invention is shown in FIGS.

  1 is a cross-sectional view of a multilayer electronic component, FIG. 2 is a partial enlarged cross-sectional view of the multilayer electronic component, FIG. 3 is a partial enlarged bottom view of the multilayer electronic component, and FIG. 4 is a partial enlarged cross-sectional view when the chip component is mounted. It is.

  As shown in FIG. 1, the multilayer electronic component 10 has a cavity 12 formed in the main surface of a ceramic multilayer substrate 11, and a chip component 20 is accommodated in the cavity 12. A shield electrode 14 is formed on the bottom surface 13 of the cavity 12 over the entire bottom surface 13 of the cavity 12 so as to cover a mounting region of the chip component 20 such as a bare chip IC. The chip component 20 attaches the shield electrode 14 to the die bond surface. As fixed to the bottom surface 13 of the cavity 12. Further, the chip component 20 is electrically connected to a conductive land (not shown) of the multilayer substrate 11 by wire bonding or flip chip bonding (bump connection). Further, after the chip component 20 is mounted in the cavity 12, the cavity 12 may be filled with an electrically insulating sealing resin.

  When the multilayer electronic component 10 is mounted on the mounting substrate 15, the multilayer electronic component 10 is disposed so that the cavity 12 faces downward, and is electrically connected to the mounting substrate 15 via the external conductor 16. A chip component 21 such as a capacitor, an inductor, a resistor, a diode, an IC, a memory, a SAW filter, or a crystal resonator is mounted on the upper surface opposite to the cavity 12 via an external conductor 17. Further, a metal cover (not shown) for protecting the mounted chip component 21 may be attached to the multilayer substrate 11.

  The shield electrode 14 has a total of four rectangular cutouts 18 at portions corresponding to the four corners 22 of the chip component 20 housed in the cavity 12. Accordingly, as shown in FIG. 4, when the chip component 20 is stored in the cavity 12 in a state where the shield electrode 14 is bent due to a difference in shrinkage between the shield electrode 14 and the multilayer substrate 11, The four corners 22 enter the notch 18 of the shield electrode 14 and are fixed to the bottom surface 13 of the cavity 12.

  According to the multilayer electronic component 10 configured as described above, the notch 18 is formed in the shield electrode 14 formed on the bottom surface 13 of the cavity 12 in the portion corresponding to the four corners 22 of the chip component 20 housed in the cavity 12. Therefore, when the chip component 20 is fixed to the bottom surface 13 of the cavity 12 using the shield electrode 14 as a die bond surface, the four corners 22 of the chip component 20 enter the notch 18 of the shield electrode 14 and do not contact the surface of the shield electrode 14. It is possible to prevent chipping at the four corners 22 of the chip component 20.

  It should be noted that the shape of the notch formed in the shield electrode 14 in the portion corresponding to the four corners 22 of the chip component 20 is not limited to a rectangle. For example, as shown in FIG. 5, an opening having an arbitrary shape is formed only in a portion corresponding to the four corners 22 of the chip component 20, rather than being cut out in a triangular shape or cutting out all four corners of the shield electrode 14. It may be.

  In the multilayer electronic component 10 of the above embodiment, the cavity 12 is formed on the mounting substrate 15 side (lower side). However, as shown in FIG. 6, the side opposite to the mounting substrate 15 (upper side). Alternatively, the cavity 12 may be formed, the chip component 20 may be accommodated, and an electrically insulating sealing resin may be filled therein. When the multilayer electronic component 10 is mounted on the mounting substrate 15, the multilayer electronic component 10 is disposed with the cavity 12 facing upward and is electrically connected to the mounting substrate 15 via the external conductor 16. Further, the chip component 21 is mounted on the upper surface on the cavity 12 side via the external conductor 17.

  Another embodiment of the present invention is shown in FIGS.

  FIG. 7 is a partially enlarged bottom view of the multilayer electronic component, and FIG. 8 is a partially enlarged cross-sectional view when the chip component is mounted.

  This embodiment is characterized in that a cutout 31 is formed in a frame shape on the shield electrode 30 in a portion corresponding to the outer periphery of the chip component 20 housed in the cavity 12. Other configurations are the same as the example shown in FIG.

  Thus, by forming the cutout 31 in a frame shape on the shield electrode 30, as shown in FIG. 7, when the chip component 20 is stored in the cavity 12 with the shield electrode 30 bent, The outer peripheral edge 23 of the component 20 enters the notch 31 and is fixed to the bottom surface 13 of the cavity 12 without contacting the surface of the shield electrode 30. Therefore, chipping can be prevented from occurring at the four corners 22 and the outer peripheral edge 23 of the chip component 20.

  Further, the frame-shaped cutout 31 formed in the shield electrode 30 can absorb the shrinkage difference between the shield electrode 30 and the multilayer substrate 11, and the unevenness formed on the surface of the shield electrode 30 can be alleviated.

  The present invention is useful as a multilayer electronic component in which a chip component such as an IC is mounted on a ceramic multilayer substrate.

Sectional drawing of the multilayer electronic component in embodiment of this invention Partial expanded sectional view of the multilayer electronic component in the embodiment of the present invention The partial expanded bottom view of the multilayer electronic component in embodiment of this invention Partial expanded sectional view at the time of mounting of chip parts in an embodiment of the present invention The partial expanded bottom view of the multilayer electronic component of the modification in embodiment of this invention Sectional drawing of the multilayer electronic component of the modification in embodiment of this invention The partially expanded bottom view of the multilayer electronic component in other embodiment of this invention Partial expanded sectional view at the time of mounting of chip parts in other embodiments of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Multilayer type electronic component 11 Multilayer substrate 12 Cavity 13 Bottom surface 14, 30 Shield electrode 18, 31 Notch 20 Chip component 22 Corner 23 Outer periphery

Claims (2)

A multilayer substrate having a cavity on a main surface; a shield electrode formed so as to cover at least a chip component mounting region on a bottom surface of the cavity; and a chip component fixed to the bottom surface of the cavity with the shield electrode as a die bond surface. A laminated electronic component comprising:
A multilayer electronic component, wherein notches are formed in the shield electrode at portions corresponding to the four corners of the chip component housed in the cavity. A multilayer substrate having a cavity on a main surface; a shield electrode formed so as to cover at least a chip component mounting region on a bottom surface of the cavity; and a chip component fixed to the bottom surface of the cavity with the shield electrode as a die bond surface. A laminated electronic component comprising:
A multilayer electronic component, wherein a cutout is formed in the shield electrode in a portion corresponding to the outer periphery of the chip component housed in the cavity.

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