JPH06163810A - Lead block for surface packaging hybrid ic - Google Patents

Abstract

PURPOSE:To bring about the electrostatic shielding effect on a hybrid IC at low cost by a method wherein an electrostatic shielding conductive film is formed on outer wall surface while a hybrid IC containing stepped part is pro vided on the upper part of a substrate in rectangular plane shape as well as an electrostatic shielding conductive film is formed on the upper end and outer wall surface. CONSTITUTION:Within the lead block 1 for surface packaging hybrid IC, wiring films 3, 3..., through holes 4, etc., are formed on a substrate 2 comprising ceramic or resin in rectangular plane shape while a hybrid IC containing stepped part 5 is formed on the upper part of inner peripheral part. Next, an electrostatic shielding conductive film 10 is formed on the outer wall surface and upper surface of the lead block 1. A hybrid IC 6 is covered with a conductive film 11 thereof and the electrostatic shielding conductive film 10 which are to be grounded. Accordingly, the title lead block 1 can be externally and electrostatically shielded thereby enabling any external noise to be abated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC surface mounting lead block, and more particularly to a novel hybrid IC surface mounting lead block capable of obtaining an electrostatic shield effect.

[0002]

2. Description of the Related Art Mounting of a hybrid IC on a wiring board is often performed via a lead block in order to reduce the manufacturing cost.

The lead block has a wiring film formed on the surface of a member made of an insulating material such as ceramics, and a hybrid IC is connected to the lead block.
After that, the hybrid IC is attached to the wiring board by connecting the lead block to the wiring board.

Each wiring film of the lead block electrically connects each electrode of the hybrid IC to the wiring film of the wiring board. By the way, in the case of electrostatically shielding the hybrid IC from the other, conventionally, a shield case made of metal is separately prepared and attached to the wiring board so as to cover the hybrid IC and the lead block.

[0005]

However, according to the conventional technique of electrostatically shielding by covering the hybrid IC and the electrostatic shield with the shield case, the material cost of the shield case, the processing cost, and the cost required for assembly. Therefore, there is a problem that it is difficult to reduce the cost of the wiring board mounted with the hybrid IC.

The present invention has been made to solve such problems, and an object thereof is to obtain an electrostatic shield effect for a hybrid IC at low cost.

[0007]

The lead block for hybrid IC surface mounting according to claim 1 is characterized in that a conductive film for electrostatic shield is formed on the outer wall surface. The lead block for hybrid IC surface mounting according to claim 2, wherein the planar shape is a rectangular frame shape, and the hybrid IC storage step portion is formed on the upper portion,
It is characterized in that a conductive film for electrostatic shield is formed on the upper surface and the outer wall surface.

[0008]

According to the lead block for hybrid IC surface mounting of claim 1, since the electrostatic shield conductive film is formed on the outer wall surface, the electrostatic shield conductive film is grounded. Hybrid I with conductive film
It is possible to electrostatically shield C from the others. Further, the electrostatic shield effect can be obtained without using a shield case, which requires high material cost and processing cost, so that the electrostatic shield effect can be obtained at low cost.

According to the hybrid IC surface-mounting lead block of the second aspect, since the conductive film for electrostatic shield is provided on the upper surface and the outer wall surface, the surface facing upward when the hybrid IC is stored in the hybrid IC storage step portion. By connecting the formed conductive film for grounding and the conductive film for electrostatic shield on the upper surface of the lead block by, for example, soldering or the like, the stored hybrid IC is grounded by the IC itself and the upper and outer surfaces of the lead block. Since it can be covered with the conductive film for electrostatic shield on the wall surface, the hybrid IC can be more easily and completely shielded from the other electrostatic charges.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC surface mounting lead block of the present invention will be described in detail below with reference to the illustrated embodiments. Figure 1
(A), (B) shows one Example of the lead block for hybrid IC surface mounting of this invention, (A) is sectional drawing, (B) is a bottom view. In the drawing, reference numeral 1 is a lead block for surface mounting of a hybrid IC, in which a wiring film 3, 3, ..., Through holes 4 and the like are formed on a substrate 2 made of ceramic or resin having a rectangular frame shape (square shape) in plan view. ,
A hybrid IC storage step portion 5 is formed on the upper portion of the inner peripheral portion.

A hybrid IC 6 is housed in the hybrid IC housing step portion 5. 7 is, for example, a ceramic substrate of a hybrid IC, 8, 8, ... Are electronic components mounted on the surface of the hybrid IC, and 9, 9 ,.
, And the wiring films 3, 3 of the hybrid IC housing step portion 5 of the lead block 1 which are the wiring films on the surface.
The hybrid IC 6 is held in the storage step portion 5 with the electronic component mounting surface facing downward by the connection with.

Reference numeral 10 denotes an electrostatic shield conductive film which is entirely formed on the outer wall surface and the upper surface of the lead block 1. The electrostatic shield conductive film 10 is provided in the hybrid IC surface mounting lead block. This is the greatest feature. The electrostatic shield conductive film 10 is connected to one wiring film 3 on the bottom surface of the lead block 1. 11 is hybrid I
The conductive film 11 is a conductive film formed entirely on the surface opposite to the side where the electronic component C6 is mounted. The conductive film 11 and the electrostatic shield conductive film 10 on the upper surface of the lead block 1 are soldered together. Connected.

FIG. 2 is a sectional view showing a state in which the hybrid IC surface mounting lead block 1 is mounted on the wiring board 13. In this hybrid IC surface mounting lead block 1, each wiring film 3 of the hybrid IC housing step portion 5 and each wiring film 3 on the lower surface are connected by through holes 4, so that each wiring film 9 of the hybrid IC 6 is on the lower surface. Is electrically connected to each of the wiring films 3, and the wiring film 9 is connected to the wiring film 15 on the surface of the base 14 of the wiring substrate 13. Then, the electrostatic shield conductive film 10 is connected to one earth wiring film 15.

According to such a hybrid IC surface mounting lead block 1, the hybrid IC 6 is covered with the conductive film 11 and the electrostatic shield conductive film 10 of the hybrid IC 6 itself, and the conductive film 11 and the electrostatic shield. Since the conductive film 10 is grounded, it is electrostatically shielded from the outside. Therefore, it is possible to prevent noise from entering from the outside.

3 (A) and 3 (B) show another embodiment of the lead block for hybrid IC surface mounting of the present invention. FIG. 3 (A) is a sectional view and FIG. 3 (B) is a bottom view. In Example 1a, the conductive film 10 for electrostatic shield is formed not only on the outer wall surface and the upper surface but also on the inner wall surface and the lower surface.

The conductive film 10 for electrostatic shield on the lower surface is shown in FIG.
In (B), as shown by the diagonal lines, the wiring films 3, 3, ... In this embodiment, the conductive film 11 of the hybrid IC 6a has the through hole 13.
Is formed on one wiring film 3 on the surface of the hybrid IC 6a on the electronic component side, and the wiring film 3 is connected to the electrostatic shield conductive film 10 of the lead block 1a.

According to the present hybrid IC surface mounting lead block 1a, since the electrostatic shield conductive film 10 is formed on the lower surface and the inner wall surface as well, the hybrid IC 6a can be electrostatically shielded more completely.

[0018]

The hybrid IC surface mounting lead block according to the first aspect of the invention is characterized in that the electrostatic shield conductive film is formed on the outer wall surface. Therefore, according to the hybrid IC surface mounting lead block of claim 1, since the electrostatic shield conductive film is formed on the outer wall surface, the electrostatic shield conductive film is grounded so that the electrostatic shield conductive film is grounded. The conductive film can electrostatically shield the hybrid IC from others. Further, the electrostatic shield effect can be obtained without using a shield case in which the material cost and the processing cost are high, so that the electrostatic shield effect can be obtained at a low cost.

According to a second aspect of the present invention, the lead block for surface mounting of the hybrid IC has a rectangular frame shape in plan view, the hybrid IC storage step portion is formed on the upper portion, and the electrostatic shield conductive film is formed on the upper surface and the outer wall surface. It is characterized by.
Therefore, according to the hybrid IC surface mounting lead block of the second aspect, since the conductive film for electrostatic shield is provided on the upper surface and the outer wall surface, the hybrid IC can be used as
The stored hybrid IC is connected to the ground itself by connecting the grounding conductive film formed on the surface facing up when stored in the storage step portion and the electrostatic shield conductive film on the upper surface of the lead block by, for example, soldering. Can be covered with the conductive film for grounding and the conductive film for electrostatic shield on the upper surface and the outer wall surface of the lead block, and the hybrid IC can be more easily and completely shielded from the other.

[Brief description of drawings]

1A and 1B show an embodiment of a lead block for surface mounting of a hybrid IC of the present invention,
(A) is a sectional view and (B) is a bottom view.

FIG. 2 is a cross-sectional view showing a state in which the hybrid IC surface mounting lead block of FIG. 1 is connected to a wiring board.

3A and 3B show another embodiment of the lead block for surface mounting of the hybrid IC of the present invention. FIG.
Is a cross-sectional view, and (B) is a bottom view.

[Explanation of symbols]

 1, 1a Lead block for hybrid IC surface mounting 6, 6a Lead block 10 Conductive film for electrostatic shield

Claims (2)

[Claims] 1. A lead block for surface mounting of a hybrid IC, characterized in that a conductive film for electrostatic shield is formed on an outer wall surface. 2. A lead for hybrid IC surface mounting, wherein the planar shape is a rectangular frame shape, a hybrid IC storage step portion is provided on an upper portion, and an electrostatic shield conductive film is formed on an upper end surface and an outer wall surface. block