JP2003249580A - Electronic component with shield cap - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component having a shield cap, which is capable of preventing the occurrence of short-circuiting defects even if an external stress is applied to it or there is positional deviation. <P>SOLUTION: The electronic component with a shield cap comprises a circuit board which is mounted with electronic component elements on the top face, the body of the shield cap which is adhered or fastened to the top face or side faces of the circuit board so as to cover the electronic component elements on the circuit board. An insulation resin material is applied between at least some of the electronic component elements at least on the circuit board which have exposed conductive parts and the body of the shield cap in close vicinity to those electronic component elements. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield cap electronic component such as a VCO or an antenna switch module.

[0002]

2. Description of the Related Art In a wiring board used at high frequency, a shield cap made of a metal material is mounted on the mounting surface to shield electromagnetic noise and protect tower mounted elements. As a conventional example of this kind, as shown in FIG. 6, a shield cap 1 is provided with a flange 1a on the periphery thereof, and a peripheral portion of an upper surface of a circuit board 3 such as a multilayer ceramic board or a printed board on which an electronic component element 2 is mounted. There is known one in which the flange 1a is bonded or fixed (Japanese Patent Laid-Open No. Hei 4 (1998) -43977).
-216652 gazette, Japanese Patent Publication No. 8-15236 gazette).

By the way, such a circuit board is used for home electric appliances, wireless communication devices, computers and the like.
It is used for module parts such as CO, and packages for hybrid ICs, etc., and the miniaturization is further progressing in accordance with the tendency of miniaturization of these devices. However, in the shield cap with a flange as described above, the electronic component element 2
Since the flange is fixed to the peripheral edge portion of the upper surface of the circuit board to be mounted, the circuit board must be made larger by the area where the flange is fixed, which hinders the miniaturization of the circuit board. In other words, if the upper areas are the same, the number and size of the electronic component elements 2 that can be mounted on the upper surface of the circuit board are limited.

Therefore, as shown in FIG. 7, a box-shaped shield cap 4 without a flange is used, and the edges 4a of the two opposing side portions of the peripheral side portion thereof are mounted on the circuit where the electronic component element 5 is mounted. There has been proposed a structure in which a portion of the upper surface of the circuit board 6 which becomes a sacrifice of space is reduced by adhering or fixing to the upper surface of the board 6 (see Japanese Patent Laid-Open No. 2001-15976). From the same point of view, in FIG. 8, the peripheral side portion of the box-shaped shield cap 7 is mechanically fitted to the side surface of the circuit board 8.
In this configuration, the portion which sacrifices the space on the upper surface of the circuit board 8 is reduced by fixing the above (see JP-A-5-206308).

[0005]

The shield cap having the structure shown in FIGS. 7 and 8 can reduce the sacrifice of the space on the upper surface of the circuit board, and is sufficient from the viewpoint of shielding electromagnetic noise and protecting electronic component elements. However, the metal shield cap is easily deformed when external stress is applied,
When the metal shield cap is positioned on the circuit board in the assembly process, misalignment easily occurs. As a result, the metal shield cap may come into contact with the electronic component element on the circuit board to cause a short-circuit failure as shown in FIGS. 9 and 10.

Therefore, the present invention solves such a problem, and provides an electronic component with a shield cap for a circuit board, which can prevent the occurrence of a short circuit failure even when an external stress acts or a position shift occurs. Is intended.

[0007]

In order to achieve the above object, according to the present invention, a circuit board on which an electronic component element is mounted is mounted on the upper surface, and a circuit board is bonded or fixed to the upper surface or the side surface of the circuit board. An electronic component with a shield cap having a shield cap body adapted to cover the electronic component element above, in which at least the conductive component on the circuit board is exposed, and the portion of the shield cap body adjacent to the electronic component element It is characterized in that an insulating resin material is applied between and.

[0008] Preferably, the insulating resin material can be applied only on the electronic component element where at least the conductive portion on the circuit board is exposed.

In one embodiment of the present invention, the insulating resin material may be applied between the electronic component element on the circuit board and the side surface portion of the shield cap body.

In another embodiment of the present invention, the insulating resin material may be applied to the entire gap between the electronic component element on the circuit board and the shield cap body.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1 to 5 of the accompanying drawings. 1 to 3 show an embodiment of the present invention, 11 is a circuit board, and on its upper surface, for example, transistors, diodes, chip capacitors, chip resistors, chip coils, ICs, etc. A plurality of electronic component elements 12 are mounted. The circuit board 11 is made of a dielectric ceramic material, a glass / ceramic material, a low temperature fired ceramic material, a glass / epoxy composite material, or the like. Reference numeral 13 is a shield cap body, which is formed of a metal material into a box shape. The side surface portion of the shield cap body 13 includes front and rear facing side wall portions 13a and 13b and lateral side facing side wall portions 13c and 13d. Front and rear facing side wall part 1
3a and 13b extend in the height direction longer than the lateral opposing side wall portions 13c and 13d, and therefore the shield cap body 13 is provided with the front end portions of the front and rear opposing side wall portions 13a and 13b with, for example, an adhesive or a brazing material or solder. By circuit board 11
The electronic component elements 12 mounted on the upper surface of the circuit board 11 by being adhered or fixed to the upper surface of the circuit board 11.
Is configured to cover. Shield cap body 1
As shown in the drawing, when the shield cap main body 13 is attached to the upper surface of the circuit board 11, the lateral side wall portions 13c and 13d of the side wall 3 of FIG. There is. These openings 14 improve the convective heat transfer effect and the gas release property when the shield cap body 13 is fixed to the upper surface of the circuit board 11, and relax the stress concentration generated when the shield cap body 13 is bonded or fixed. Work.

Since the entire peripheral portion of the shield cap body 13 is not adhered or fixed to the upper surface of the circuit board 11 as described above, the shield cap body 1 is subjected to external stress.
3 is easily deformed or displaced, and the electronic component element 12 mounted on the upper surface of the circuit board 11 may come into contact with the metal shield cap body 13 to cause a short circuit. Therefore, as shown in FIG. 3, the insulating resin material 15 is injected into all the spaces between the electronic component element 12 on the circuit board 11 and the shield cap body 13, and the electronic component element 1 on the circuit board 11 is injected.
It is designed to fill the entire space defined between 2 and the shield cap body 13.

With this configuration, even if the shield cap body 13 bonded or fixed to the upper surface of the circuit board 11 receives external stress, the shield cap body 13 is provided.
Is held in a predetermined positional relationship with respect to the upper surface of the circuit board 11, no deviation occurs, and the insulating resin material 15 filled inside does not deform.

FIG. 4 shows another embodiment of the present invention.
In this case, the insulating resin material 16 is provided only on each electronic component element 12 on the upper surface of the circuit board 11, especially on the electronic component element 12 where the mounting electrode is formed up to the upper surface, that is, the conductive portion is exposed. Is applied to electrically insulate the electronic component element 12 and the metallic shield cap body 13 from each other. This allows
For example, even if the shield cap body 13 is deformed by the action of external stress or is displaced from the predetermined position with respect to the upper surface of the circuit board 11, the presence of the insulating resin material 16 causes the electronic component element 12 and the shield cap body made of metal. It is held in a state of being electrically insulated from 13.

FIG. 5 shows still another embodiment of the present invention. In this embodiment, the insulating resin material 17 is injected between the electronic component element 12 on the circuit board 11 and the side surface portion of the shield cap body 13, especially the lateral opposing side wall portions 13c and 13d, and the shield cap body 13 is injected. Even if is deformed or displaced due to external stress, the presence of the insulating resin material 17 keeps the electronic component element 12 and the metallic shield cap body 13 electrically insulated.

In each of the above embodiments, the case where the front and rear facing side wall portions 13a and 13b of the shield cap body 13 are adhered or fixed to the upper surface of the circuit board 11 has been described, but instead, the side surface of the circuit board 11 is used. It may be adhered or fixed to the above, and in that case, the same effects as those described above can be naturally obtained.

[0017]

As described above, in the electronic component with a shield cap for a circuit board according to the present invention, at least the electronic component element in which at least the conductive portion on the circuit board is exposed and the shield cap body adjacent to the electronic component element. Since an insulating resin material is applied between the shield cap body and the part of the circuit board, even if the shield cap body is displaced from the circuit board or the shield cap body is deformed by external stress, the shield cap body will not Direct contact with the element is avoided, and the occurrence of short-circuit failure can be prevented.

Further, in the case where the insulating resin material is applied only on the electronic component element where at least the conductive portion on the circuit board is exposed, short-circuit failure between the shield cap body and the electronic component element may occur. Not only can the amount of insulating resin material used be minimized while trying to prevent it, but the assembly process can be simplified, and cost reduction can be expected.

When the insulating resin material is applied between the electronic component element on the circuit board and the side surface portion of the shield cap body, displacement of the shield cap body can be prevented, and as a result, It is possible to prevent a short circuit failure between the shield cap body and the electronic component element.

Further, when the insulating resin material is applied to the entire gap between the electronic component element on the circuit board and the shield cap main body, it goes without saying that displacement of the shield cap main body is prevented. That is, even if an external stress acts on the shield cap body, the shield cap body is substantially prevented from being deformed, and as a result, the occurrence of a short-circuit failure can be prevented.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of essential parts showing an embodiment of an electronic component with a shield cap according to the present invention.

2 is a schematic side view in the longitudinal direction of the electronic component with a shield cap of FIG.

FIG. 3 is a schematic cross-sectional view of the electronic component with a shield cap shown in FIG.

FIG. 4 is a schematic transverse cross-sectional view of a main part showing another embodiment of an electronic component with a shield cap according to the present invention.

FIG. 5 is a schematic cross-sectional view of a main part showing still another embodiment of an electronic component with a shield cap according to the present invention.

FIG. 6 is a schematic perspective view showing an example of a conventional electronic component with a shield cap.

FIG. 7 is a schematic perspective view showing another example of a conventional electronic component with a shield cap.

FIG. 8 is a schematic perspective view showing another example of a conventional electronic component with a shield cap.

FIG. 9 is a schematic cross-sectional view showing a state of occurrence of a short circuit failure in a conventional electronic component with a shield cap.

FIG. 10 is a schematic cross-sectional view showing a state of occurrence of a short circuit failure in a conventional electronic component with a shield cap.

[Explanation of symbols]

11: Circuit board 12: Electronic component element 13: Shield cap body 14: Opening 15: Insulating resin material 16: Insulating resin material 17: Insulating resin material

Claims (4)

[Claims] 1. A shield having a circuit board on which an electronic component element is mounted, and a shield cap main body adhered or fixed to the upper surface or side surface of the circuit board so as to cover the electronic component element on the circuit board. In a capped electronic component, an insulating resin material is applied between at least an exposed electronic component element on a circuit board and a portion of a shield cap body in the vicinity of the exposed electronic component element. Electronic components. 2. The electronic component with a shield cap according to claim 1, wherein the insulating resin material is applied only on the electronic component element on which at least the conductive portion of the circuit board is exposed. 3. The electronic component with a shield cap according to claim 1, wherein the insulating resin material is applied between the electronic component element on the circuit board and the side surface portion of the shield cap body. 4. The electronic component with a shield cap according to claim 1, wherein the insulating resin material is applied to the entire gap between the electronic component element on the circuit board and the shield cap body.