JP4080905B2 - Electronic component with shield cap - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component with a shield cap such as a VCO or an antenna switch module.
[0002]
[Prior art]
A wiring board used at a high frequency is provided with a shield cap made of a metal material on the mounting surface in order to shield electromagnetic wave noise and protect the tower element. As a conventional example of this type, as shown in FIG. 7, the shield cap 1 is provided with a flange 1a around it, and an upper surface peripheral portion of a circuit board 3 such as a multilayer ceramic substrate or a printed circuit board having an electronic component element 2 mounted on the upper surface. There are known ones in which the flange 1a is bonded or fixed to (see Patent Document 1 and Patent Document 2).
[0003]
By the way, such circuit boards are used for home appliances, wireless communication devices, modules such as VCOs used in computers, and packages such as hybrid ICs. Miniaturization is progressing. However, in the shield cap with flange as described above, since the flange is fixed to the peripheral edge portion of the upper surface of the circuit board on which the electronic component element 2 is mounted, it is necessary to make the circuit board as large as the fixing area of the flange. This hinders the miniaturization of circuit boards. In other words, if the upper area is the same, the number and size of the electronic component elements 2 that can be mounted on the upper surface of the circuit board are limited.
[0004]
Therefore, as shown in FIG. 8, a box-shaped shield cap 4 without a flange is used, and two edge portions 4 a facing each other out of the peripheral side portions of the circuit board 6 on which the electronic component element 5 is mounted. There has been proposed a structure in which a portion of the upper surface of the circuit board 6 that is bonded or fixed to the upper surface is sacrificed (see Patent Document 3). From a similar viewpoint, FIG. 9 shows a portion that sacrifices the space on the upper surface of the circuit board 8 by fixing the peripheral side portion of the box-shaped shield cap 7 to the side surface of the circuit board 8 by the mechanical fitting means 9. The structure which reduced so that it is shown is shown (refer patent document 4).
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 4-216652 [Patent Document 2]
Japanese Patent Publication No.8-15236 [Patent Document 3]
JP 2001-15976 A [Patent Document 4]
JP-A-5-206308 [0006]
[Problems to be solved by the invention]
The shield cap having the structure shown in FIGS. 8 and 9 can reduce the sacrifice of the space on the upper surface of the circuit board and is sufficient in terms of shielding electromagnetic noise and protecting electronic component elements. However, the metal shield cap is external. When stress is applied, it is easily deformed, or misalignment is likely to occur when positioning the metal shield cap on the circuit board in the assembly process. Therefore, the metal shield cap may come into contact with the electronic component element on the circuit board as shown in FIGS. 10 and 11 to cause a short circuit failure.
[0007]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component with a shield cap that solves such problems and can prevent occurrence of a short-circuit failure even when an external stress is applied or a displacement occurs.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, a circuit board on which an electronic component element is mounted on an upper surface, and an electron on the circuit board that is bonded or fixed to the upper surface or side surface of the circuit board. In an electronic component with a shield cap having a metal shield cap body that covers a component element, the metal shield cap body is bonded or fixed to the ceiling wall portion and the upper surface or side surface of the circuit board with an adhesive, brazing material, or solder. A front and rear opposing side wall portion and a lateral opposing side wall portion that is spaced apart from the circuit board and defines an opening between the upper side surface of the circuit board and a lateral opposing side wall portion of the metal shield cap body. At least a portion near the electronic component element on the circuit board is provided with a notch that terminates at a position higher than the height of the electronic component element on the circuit board .
[0009]
According to the second aspect of the present invention, the laterally facing side wall portion of the metal shield cap body is terminated at a position higher than the height of the electronic component element on the circuit board.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to FIGS.
1 to 3 show an embodiment of the present invention. Reference numeral 11 denotes a circuit board on the upper surface of which, for example, a transistor, a diode, a chip capacitor, a chip resistor, a chip coil, an IC, etc. A plurality of electronic component elements 12 are mounted. The circuit board 11 is made of a dielectric ceramic material, glass / ceramic material, low-temperature fired ceramic material, glass / epoxy composite material, or the like. Reference numeral 13 denotes a shield cap body, which is formed in a box shape from a metal material, and includes a ceiling wall portion 13o, front and rear opposing side wall portions 13a and 13b, and lateral opposing side wall portions and 13c and 13d. The front and rear opposing side wall portions 13a and 13b of the shield cap main body 13 extend in the height direction longer than the lateral opposing side wall portions 13c and 13d, and therefore the shield cap main body 13 has the front ends of the front and rear opposing side wall portions 13a and 13b. The parts are attached to the upper surface of the circuit board 11 by, for example, an adhesive, brazing material, or solder, and are configured to cover the respective electronic component elements 12 on the upper surface of the circuit board 11. As shown in the figure, when the shield cap body 13 is attached to the upper surface of the circuit board 11, the side walls 13 c and 13 d on the lateral side of the shield cap body 13 have an opening 14 between the upper surface of the circuit board 11. Is defined. These openings 14 improve the convective heat transfer effect and gas escape characteristics when the shield cap body 13 is fixed to the upper surface of the circuit board 11, and alleviates stress concentration that occurs when the shield cap body 13 is bonded or fixed. To work.
[0011]
As described above, since the entire peripheral portion of the shield cap body 13 is not bonded or fixed to the upper surface of the circuit board 11, the shield cap body 13 is likely to be deformed or displaced when subjected to external stress generated during bonding or fixing. The electronic component element 12 mounted on the upper surface of the circuit board 11 may come into contact with the metal shield cap body 13 and short circuit. Therefore, as shown in FIG. 2, in the side wall portions 13 c and 13 d on the side of the shield cap body 13 that are adjacent to the electronic component element 12 on the circuit board 11, contact with the electronic component element 12 is prevented. A notch 15 is provided.
[0012]
With this configuration, even when the shield cap body 13 bonded or fixed to the upper surface of the circuit board 11 is deformed or displaced due to external stress, the shield cap body 13 is an electronic component on the upper surface of the circuit board 11. The insulation state between the shield cap main body 13 and the electronic component element 12 is maintained without contact with the element 12.
[0013]
4 to 6 show another embodiment of the present invention. In this embodiment, elements corresponding to those shown in FIGS. 1 to 3 are denoted by the same reference numerals. The ceiling wall portion 13o and the front and rear opposing side wall portions 13a and 13b of the shield cap body 13 are configured in the same manner as in the embodiment shown in FIGS. Each of the portions 13c and 13d is dimensioned so as to terminate at a position higher than the height of the electronic component element 12 on the circuit board 11, as shown.
Thereby, for example, even if the shield cap main body 13 is deformed by the action of external stress or is displaced from a predetermined position with respect to the upper surface of the circuit board 11, the side wall portions 13c and 13d on the lateral side of the shield cap main body 13 are The component element 12 is not contacted and is kept in an electrically insulated state.
[0014]
In the two embodiments described above, the case where the front and rear opposing side wall portions 13a and 13b of the shield cap body 13 are bonded or fixed to the upper surface of the circuit board 11 is exemplified. In this case, the same effect as described above can be obtained.
[0015]
【The invention's effect】
As described above, in the electronic component with a shield cap according to the first invention of the present invention, the metal shield cap main body and the opposing side wall portions before and after the upper and side surfaces of the circuit board are bonded or fixed to each other. And a laterally facing side wall portion that is spaced apart from the circuit board and defines an opening between the circuit board and an upper surface of the circuit board, and at least an electronic component on the circuit board of the laterally facing side wall portion of the metal shield cap body Since the notch that prevents contact with the electronic component element is provided in the part close to the element, even if the shield cap body is displaced with respect to the circuit board or the shield cap body is deformed by external stress, the shield Contact between the cap body and the electronic component element on the circuit board can be avoided, and occurrence of a short circuit failure can be prevented.
[0016]
Further, in the electronic component with a shield cap according to the second invention of the present invention, the side wall portion facing the side of the metal shield cap body is terminated at a position higher than the height of the electronic component element on the circuit board. Similarly, even if the shield cap body is displaced relative to the circuit board or the shield cap body is deformed by external stress, contact between the shield cap body and the electronic component element on the circuit board is avoided, and a short circuit failure occurs. Can be prevented in advance.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a main part showing an embodiment of an electronic component with a shield cap according to the present invention.
2 is a schematic side view in the longitudinal direction of the electronic component with a shield cap of FIG. 1;
3 is a schematic cross-sectional view of the electronic component with a shield cap of FIG.
FIG. 4 is a schematic perspective view of a main part showing another embodiment of an electronic component with a shield cap according to the present invention.
5 is a schematic side view in the longitudinal direction of the electronic component with a shield cap of FIG. 4;
6 is a schematic cross-sectional view of the electronic component with a shield cap in FIG. 4;
FIG. 7 is a schematic perspective view showing an example of a conventional electronic component with a shield cap.
FIG. 8 is a schematic perspective view showing another example of a conventional electronic component with a shield cap.
FIG. 9 is a schematic perspective view showing another example of a conventional electronic component with a shield cap.
FIG. 10 is a schematic cross-sectional view showing the occurrence of a short-circuit fault in a conventional electronic component with a shield cap.
FIG. 11 is a schematic cross-sectional view showing the occurrence of a short-circuit fault in a conventional electronic component with a shield cap.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11: Circuit board 12: Electronic component element 13: Shield cap main body 13c, 13d: Side wall part 14 of the side of a shield cap main body 14: Opening part 15: Notch

Claims (2)

An electronic component with a shield cap, comprising: a circuit board on which an electronic component element is mounted on an upper surface; and a metal shield cap body that is bonded or fixed to an upper surface or a side surface of the circuit board and covers the electronic component element on the circuit board. The metal shield cap body has a ceiling wall portion, opposite side wall portions before and after being bonded or fixed to the upper surface or side surface of the circuit board by an adhesive, a brazing material or solder, and the upper surface of the circuit board spaced from the circuit board. An electronic component on the circuit board at least in a portion adjacent to the electronic component element on the circuit board. An electronic component with a shield cap, characterized in that a notch that terminates at a position higher than the height of the element is provided.   An electronic component with a shield cap, comprising: a circuit board on which an electronic component element is mounted on an upper surface; and a metal shield cap body that is bonded or fixed to an upper surface or a side surface of the circuit board and covers the electronic component element on the circuit board. The metal shield cap main body has a ceiling wall portion, opposing side wall portions before and after being bonded or fixed to the upper surface or side surface of the circuit board with an adhesive, a brazing material, or solder, and the upper surface of the circuit board spaced from the circuit board. A laterally opposed side wall portion that defines an opening therebetween, and the laterally opposed side wall portion of the metal shield cap body is terminated at a position higher than the height of the electronic component element on the circuit board. Features electronic parts with shield caps.

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