JP2006100841A - Electronic component with shielding cap - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component with a shielding cap in which short circuit failures can be prevented, even if external stress is applied or a positional shift takes place. <P>SOLUTION: The electronic component with a shielding cap comprises a circuit board 11 having an upper surface for mounting electronic component elements 12, and a shielding cap body 13 bonded to the upper surface or the side face of the circuit board 11 while covering the electronic component elements 12 on the circuit board 11, wherein a cut 15 for preventing contact with the electronic component element 12 is made in the facing sidewall part on the side of the metallic shielding cap body 13 at least a part proximate to the electronic component element 12 on the circuit board 11. In the electronic component with a shielding cap, the facing sidewall part on the side of the metallic shielding cap body 13 terminates at a position higher than the profile of the electronic component element 12 on the circuit board 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component with a shield cap such as a VCO or an antenna switch module.

  A wiring board used at a high frequency is provided with a shield cap made of a metal material on the mounting surface in order to shield electromagnetic wave noise and protect the tower element. As a conventional example of this type, as shown in FIG. 7, the shield cap 1 is provided with a flange 1a around it, and an upper surface peripheral portion of a circuit board 3 such as a multilayer ceramic substrate or a printed circuit board on which an electronic component element 2 is mounted on the upper surface. There are known ones in which the flange 1a is bonded or fixed to (see Patent Document 1 and Patent Document 2).

  By the way, such circuit boards are used for home appliances, wireless communication devices, modules such as VCOs used in computers, and packages such as hybrid ICs. Miniaturization is progressing. However, in the shield cap with flange as described above, since the flange is fixed to the peripheral edge portion of the upper surface of the circuit board on which the electronic component element 2 is mounted, it is necessary to make the circuit board as large as the fixing area of the flange. This hinders the miniaturization of circuit boards. In other words, if the upper area is the same, the number and size of the electronic component elements 2 that can be mounted on the upper surface of the circuit board are limited.

  Therefore, as shown in FIG. 8, a box-shaped shield cap 4 without a flange is used, and two edge portions 4 a facing each other out of the peripheral side portions of the circuit board 6 on which the electronic component element 5 is mounted. There has been proposed a structure in which a portion of the upper surface of the circuit board 6 that is bonded or fixed to the upper surface is sacrificed (see Patent Document 3). From a similar viewpoint, FIG. 9 shows a portion that sacrifices the space on the upper surface of the circuit board 8 by fixing the peripheral side portion of the box-shaped shield cap 7 to the side surface of the circuit board 8 by the mechanical fitting means 9. The structure which reduced so that it is shown is shown (refer patent document 4).

Japanese Patent Laid-Open No. 4-216652 Japanese Patent Publication No.8-15236 JP 2001-15976 A Japanese Patent Laid-Open No. 5-206308

  The shield cap having the structure shown in FIGS. 8 and 9 can reduce the sacrifice of the space on the upper surface of the circuit board and is sufficient in terms of shielding electromagnetic noise and protecting electronic component elements. However, the metal shield cap is external. When stress is applied, it is easily deformed, or misalignment is likely to occur when positioning the metal shield cap on the circuit board in the assembly process. Therefore, the metal shield cap may come into contact with the electronic component element on the circuit board as shown in FIGS. 10 and 11 to cause a short circuit failure.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component with a shield cap that solves such problems and can prevent occurrence of a short-circuit failure even when an external stress is applied or a displacement occurs.

  To achieve the above object, according to the first aspect of the present invention, a circuit board on which an electronic component element is mounted on an upper surface, and an electronic component on the circuit board that is bonded or fixed to the upper surface or side surface of the circuit board In an electronic component with a shield cap having a shield cap body configured to cover an element, a metal shield cap body is attached to a ceiling wall portion, front and rear opposing side wall portions to be bonded or fixed to an upper surface or a side surface of a circuit board, and a circuit A laterally facing side wall portion that is spaced apart from the substrate and defines an opening between the upper surface of the circuit board and at least an electronic component element on the circuit board in the laterally facing side wall portion of the metal shield cap body. A cutout portion for preventing contact with the electronic component element is provided in the portion to be performed.

  According to the second aspect of the present invention, the laterally facing side wall portion of the metal shield cap body is terminated at a position higher than the height of the electronic component element on the circuit board.

  In the electronic component with a shield cap according to the first aspect of the present invention, the metal shield cap body is separated from the circuit board, the ceiling side wall part, the front and rear opposing side wall parts bonded or fixed to the upper surface or side surface of the circuit board, and the circuit board. A laterally facing side wall portion defining an opening between the upper surface of the circuit board and at least a portion of the laterally facing side wall portion of the metal shield cap body adjacent to the electronic component element on the circuit board, A notch that prevents contact with the electronic component element is provided, so even if the shield cap body is displaced with respect to the circuit board or the shield cap body is deformed by external stress, the shield cap body and circuit board Contact with the electronic component element can be avoided, and occurrence of a short circuit failure can be prevented.

  Further, in the electronic component with a shield cap according to the second invention of the present invention, the side wall portion facing the side of the metal shield cap body is terminated at a position higher than the height of the electronic component element on the circuit board. Similarly, even if the shield cap body is displaced relative to the circuit board or the shield cap body is deformed by external stress, contact between the shield cap body and the electronic component element on the circuit board is avoided, and a short circuit failure occurs. Can be prevented in advance.

    Embodiments of the present invention will be described below with reference to FIGS.

  1 to 3 show an embodiment of the present invention. Reference numeral 11 denotes a circuit board on the upper surface of which, for example, a transistor, a diode, a chip capacitor, a chip resistor, a chip coil, an IC, etc. A plurality of electronic component elements 12 are mounted. The circuit board 11 is made of a dielectric ceramic material, glass / ceramic material, low-temperature fired ceramic material, glass / epoxy composite material, or the like. Reference numeral 13 denotes a shield cap body, which is formed in a box shape from a metal material, and includes a ceiling wall portion 13o, front and rear opposing side wall portions 13a and 13b, and lateral opposing side wall portions and 13c and 13d. The front and rear opposing side wall portions 13a and 13b of the shield cap body 13 are longer in the height direction than the lateral opposing side wall portions 13c and 13d, and therefore the shield cap main body 13 has the front ends of the front and rear opposing side wall portions 13a and 13b. The parts are attached to the upper surface of the circuit board 11 by, for example, an adhesive, brazing material, or solder, and are configured to cover the respective electronic component elements 12 on the upper surface of the circuit board 11. As shown in the figure, when the shield cap body 13 is attached to the upper surface of the circuit board 11, the side walls 13 c and 13 d on the lateral side of the shield cap body 13 have an opening 14 between the upper surface of the circuit board 11. Is defined. These openings 14 improve the convective heat transfer effect and gas escape characteristics when the shield cap body 13 is fixed to the upper surface of the circuit board 11, and alleviates stress concentration that occurs when the shield cap body 13 is bonded or fixed. To work.

  As described above, since the entire peripheral portion of the shield cap body 13 is not bonded or fixed to the upper surface of the circuit board 11, the shield cap body 13 is likely to be deformed or displaced when subjected to external stress generated during bonding or fixing. The electronic component element 12 mounted on the upper surface of the circuit board 11 may come into contact with the metal shield cap body 13 and short circuit. Therefore, as shown in FIG. 2, in the side wall portions 13 c and 13 d on the side of the shield cap body 13 that are adjacent to the electronic component element 12 on the circuit board 11, contact with the electronic component element 12 is prevented. A notch 15 is provided.

  With this configuration, even when the shield cap body 13 bonded or fixed to the upper surface of the circuit board 11 is deformed or displaced due to external stress, the shield cap body 13 is an electronic component on the upper surface of the circuit board 11. The insulation state between the shield cap main body 13 and the electronic component element 12 is maintained without contact with the element 12.

4 to 6 show another embodiment of the present invention. In this embodiment, elements corresponding to those shown in FIGS. 1 to 3 are denoted by the same reference numerals. The ceiling wall portion 13o and the front and rear opposing side wall portions 13a and 13b of the shield cap main body 13 are configured in the same manner as in the embodiment shown in FIGS. Each of the portions 13c and 13d is dimensioned so as to terminate at a position higher than the height of the electronic component element 12 on the circuit board 11, as shown.
Thereby, for example, even if the shield cap main body 13 is deformed by the action of external stress or is displaced from a predetermined position with respect to the upper surface of the circuit board 11, the side wall portions 13c and 13d on the lateral side of the shield cap main body 13 are The component element 12 is not contacted and is kept in an electrically insulated state.

  In the two embodiments described above, the case where the front and rear opposing side wall portions 13a and 13b of the shield cap body 13 are bonded or fixed to the upper surface of the circuit board 11 is exemplified. In this case, the same effect as described above can be obtained.

The schematic perspective view of the principal part which shows one Embodiment of the electronic component with a shield cap by this invention. The longitudinal direction schematic side view of the electronic component with a shield cap of FIG. The schematic cross-sectional view of the electronic component with a shield cap of FIG. The schematic perspective view of the principal part which shows another embodiment of the electronic component with a shield cap by this invention. The longitudinal direction schematic side view of the electronic component with a shield cap of FIG. The schematic cross-sectional view of the electronic component with a shield cap of FIG. The schematic perspective view which shows an example of the conventional electronic component with a shield cap. The schematic perspective view which shows another example of the conventional electronic component with a shield cap. The schematic perspective view which shows another example of the conventional electronic component with a shield cap. The schematic sectional drawing which shows the generation | occurrence | production state of the short circuit failure in the conventional electronic component with a shield cap. The schematic sectional drawing which shows the generation | occurrence | production state of the short circuit failure in the conventional electronic component with a shield cap.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11: Circuit board 12: Electronic component element 13: Shield cap main body 13c, 13d: Side wall part 14 of the side of a shield cap main body 14: Opening part 15: Notch

Claims (2)

An electronic component with a shield cap, comprising: a circuit board on which an electronic component element is mounted on an upper surface; and a metal shield cap body that is bonded or fixed to an upper surface or a side surface of the circuit board and covers the electronic component element on the circuit board. The metal shield cap body defines an opening between the ceiling wall portion, the front and rear opposing side wall portions that are bonded or fixed to the upper surface or the side surface of the circuit board, and the upper surface of the circuit board spaced from the circuit board. And a notch portion for preventing contact with the electronic component element at least in a portion close to the electronic component element on the circuit board of the horizontal opposing side wall portion of the metal shield cap body. An electronic component with a shield cap. An electronic component with a shield cap, comprising: a circuit board on which an electronic component element is mounted on an upper surface; and a metal shield cap body that is bonded or fixed to an upper surface or a side surface of the circuit board and covers the electronic component element on the circuit board. The metal shield cap body defines an opening between the ceiling wall portion, the front and rear opposing side wall portions that are bonded or fixed to the upper surface or the side surface of the circuit board, and the upper surface of the circuit board spaced from the circuit board. An electronic component with a shield cap, characterized in that the horizontal opposing side wall portion of the metal shield cap main body terminates at a position higher than the height of the electronic component element on the circuit board. .

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