JP2013042359A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that electronic components cannot be disposed near a housing of a substrate because the electronic components provided on the substrate may contact with the housing due to vibrations or the like and cause a short circuit in an imaging apparatus.SOLUTION: An imaging apparatus A includes: a holding member 21 holding a photographic optical system 1; a first substrate 41 which is joined to the holding member 21 and is provided with an image pickup device 411 optically converting an image formed by the photographic optical system and a first connector 412 for connection; a second substrate 42 provided with a second connector 422 connecting with the first connector 412 and electronic components 42e; and a shield case 5 which is fixed to the holding member 21 enclosing around the first substrate 41 and the second substrate 42. The second substrate 42 has a joining part 42a joined to the shield case 5, and at least an electronic component 42f which is located near the joining part 42a of the shield case 5, from among the electronic components 42e provided on the second substrate 42, is covered by a non conductive material.

Description

  The present invention relates to an imaging apparatus used for an in-vehicle camera, a digital camera, a digital video camera, and the like.

  2. Description of the Related Art Conventionally, there has been known an image pickup apparatus including a photographing lens and an image pickup element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

  Such an imaging apparatus is used for a digital camera, a digital video camera, an in-vehicle camera attached to the outside of a car body or in a vehicle interior, an outdoor surveillance camera, and the like.

  In many cases, an imaging apparatus used as an in-vehicle camera or a surveillance camera is configured by providing a shield case so as to surround a substrate on which an imaging element and electronic components are provided for electromagnetic wave countermeasures.

  For example, in Patent Document 1, a casing that constitutes an exterior, a lens that is incorporated in a front portion of the casing and constitutes a photographing optical system, and a subject guided by the photographing optical system provided inside the casing. An image pickup apparatus configured to include an image pickup device that picks up an image and a printed wiring board that is disposed inside the housing and has the image pickup device mounted thereon, wherein the printed wiring board is attached to the housing. It is attached to the provided support wall with an adhesive.

  According to such a configuration, since the printed wiring board on which the image sensor is mounted is attached to the support wall with an adhesive, an effect that a large degree of freedom in positioning the image sensor with respect to the lens can be obtained.

  In recent years, imaging devices used as in-vehicle cameras and surveillance cameras in particular have been required to be downsized and highly functional, and it is necessary to increase the range in which electronic components are provided on a substrate and to mount many electronic components.

  However, in the configuration of the imaging device according to Patent Document 1, there is a case where an electronic component provided on the substrate comes into contact with the housing due to vibration or the like and short-circuits, and the electronic component is disposed near the housing of the substrate. There is a problem that cannot be done.

  Therefore, in view of the above problems, the present invention provides a holding member that holds an imaging optical system, an imaging element that is bonded to the holding member and optically converts an image formed by the imaging optical system, and a first connector for connection. A first board provided with a second connector connected to the first connector, a second board provided with electronic components, and surrounding the first board and the second board to be fixed to the holding member The second substrate has a joint for joining to the shield case, and at least the shield case among the electronic components provided on the second substrate. The electronic component in the vicinity of the joint is coated with a non-conductive material.

  According to the embodiment of the present invention, among the electronic components provided on the substrate, the electronic component in the vicinity of the joint between the substrate and the shield case is covered with the non-conductive material. Even if it comes into contact with the shield case, the parts will not be damaged by a short circuit.

  Therefore, since a large number of electronic components can be mounted on the substrate, it is possible to reduce the size and increase the functionality of the imaging apparatus.

The perspective view which shows the external appearance of the imaging device which concerns on embodiment The perspective view which looked at the imaging device concerning an embodiment from the back of a connection cord The perspective view of the state which removed the rear side case and the connection cord from the imaging device which concerns on embodiment Sectional drawing of the state which removed the rear side case and the connection cord from the imaging device which concerns on embodiment The perspective view which looked at what fixed the 1st substrate to the front case of the imaging device concerning an embodiment from the slanting back. The perspective view which looked at the front case of the imaging device concerning an embodiment from the slanting back The perspective view which shows the structure inside the rear side case of the imaging device which concerns on embodiment 1 is an exploded perspective view showing a first substrate and a second substrate of an imaging apparatus according to an embodiment. The perspective view of the shield case of the imaging device which concerns on embodiment 1 is an exploded perspective view of a shield case of an imaging apparatus according to an embodiment. The principal part perspective view which shows the state before joining of the convex part for joining and the opening part for joining of the imaging device which concerns on embodiment 2A and 2B are diagrams for explaining a mounting range of electronic components on a second substrate of the imaging apparatus according to the embodiment. The principal part perspective view which shows the state after joining of the convex part for joining and the opening part for joining of the imaging device which concerns on embodiment

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the drawings.
<Configuration of imaging device>
FIG. 1 is an external configuration diagram of an imaging apparatus A according to an embodiment of the present invention. As illustrated, the imaging apparatus A includes a photographing optical system 1, an outer case 2, and a connection cord 3.

  The outer case 2 is divided in the front-rear direction into a front case (holding member) 21 that houses and holds the photographing optical system 1 and a rear case 22 that houses a first substrate 41 and a second substrate 42 described later. Yes. In addition, the arrow FR shown in the figure is the imaging direction by the imaging apparatus A, and the arrow RR is the opposite direction. The arrow FR direction is referred to as the front, and the arrow RR direction is referred to as the rear.

  The imaging apparatus A according to the present embodiment is installed as, for example, an in-vehicle camera that is installed around a bumper or a number plate around the rear of the vehicle and is attached so as to capture an obliquely lower part behind the vehicle. The captured image of the imaging device A is transmitted to an in-vehicle computer (not shown) for each imaging frame, and displayed on a liquid crystal display device (not shown) installed in the vehicle interior.

  Note that the usage example of the in-vehicle camera is not limited to this, and the front of the vehicle can be imaged and used for obstacle detection or the like. Further, the present invention is not limited to a vehicle-mounted camera, but can be applied to a digital camera, a video camera, a surveillance camera, and the like.

  FIG. 2 shows a view of the imaging apparatus A as viewed from the rear of the connection cord 3. As shown in the figure, the rear surface 22a of the rear case 22 of the image pickup apparatus A has screw holes 22b and 22c used for screwing the image pickup apparatus A to the vehicle body outside the figure, and the connection cord 3 is connected to the rear case 22 Screw holes 22d and 22e used for screwing are formed.

  FIG. 3 is a diagram illustrating a state where the rear case 22 and the connection cord 3 are removed from the imaging apparatus A, and FIG. 4 is a cross-sectional view thereof.

  The front case 21 is a member formed of resin, for example, and holds the photographing optical system 1 as shown in FIG. The photographing optical system 1 is composed of six lenses 11 to 16 in this embodiment. A first substrate 41 is bonded to the rear side of the front case 21.

  An image sensor 411 is held on the front side of the first substrate 41. The image sensor 411 is a solid-state imaging device such as a CCD or a CMOS, photoelectrically converts an image formed by the photographing optical system 1, and outputs the image signal to the outside (for example, an in-vehicle computer).

  FIG. 5 is a perspective view of the first case 41 fixed to the front case 21 shown in FIG.

  As shown in the figure, the first substrate 41 is formed in a substantially rectangular shape, and concave portions 41a and 41b that are formed in a concave shape are formed in two corners located at opposite corners. The first substrate 41 is provided with a first connector 412 for mounting an electronic component 41e such as a capacitor and a resistor on the rear surface side, and for connecting to a second substrate 42 described later.

  Similarly, the front case 21 is formed with recesses 21a and 21b corresponding to the recesses 41a and 41b. The cylindrical side spaces formed by the recesses 41a and 21a and the recesses 41b and 21b are respectively When the front case 21 and the rear case 22 are fastened with two screws (not shown), they are used as spaces for the screws to pass through.

  Next, a configuration for fixing the first substrate 41 to the front case 21 will be described.

  FIG. 6 is a perspective view of the front case 21 as viewed obliquely from the rear. As shown in the figure, the front case 21 is provided with four support members that are erected by forming a substantially rectangular cylindrical outer peripheral wall 211 that surrounds the outer periphery and a substantially rectangular insertion groove 216 formed between the outer peripheral wall 211. The walls 212a, 212b, 212c, and 212d are integrally provided with a substantially cylindrical lens barrel portion 213 disposed inside these support walls 212a, 212b, 212c, and 212d.

  Further, although not shown in detail in the corner portion between the support wall 212a and the support wall 212b and the corner portion between the support wall 212c and the support wall 212d, vertical grooves 214 are respectively formed. Each of the support walls 212a, 212b, 212c, and 212d includes a rear end surface 215 that extends in a plane perpendicular to the optical axis of the photographing optical system 1.

  The first substrate 41 is positioned in the optical axis direction of the photographic optical system 1 and in a direction perpendicular to the optical axis so that the subject image guided by the photographic optical system 1 is imaged at the center of the imaging surface of the image sensor 411. In the adjusted state, it is fixed to the rear end face 215. The first substrate 41 is fixed to the front case 21 by bonding with an adhesive and partially bonded through a fixing member 23 (see FIGS. 3 and 4). The reason why the adhesive is used without screwing or the like is that the size and weight are not increased.

  Further, the fixing member 23 is formed in a substantially L-order cross-sectional shape by a material that transmits ultraviolet rays, and is bonded so as to fit in the recesses 212 e formed in the support walls 212 b and 212 d of the front case 21.

  Further, an ultraviolet curable adhesive is used to bond the fixing member 23 to the first substrate 41 and the front case 21, and a thermosetting adhesive is used to connect the other first substrates 41. ing.

  Next, the configuration of the rear portion of the imaging apparatus A will be described.

  FIG. 7 is a perspective view showing a structure inside the rear case 22 of the imaging apparatus A according to the present embodiment.

  A shield case 5 is provided inside the rear case 22. The shield case 5 shields electromagnetic waves, and a metal casing or a resin casing covered with a metal film is used.

  A first substrate 41 and a second substrate 42 are provided inside the shield case 5.

  FIG. 8 is an exploded perspective view of the first substrate and the second substrate.

As shown in FIG. 8, the second substrate 42 is provided with a second connector 422 on the front side thereof, and the second connector 422 is connected to the first connector 412 of the first substrate 41, so that both Are electrically connected. Note that a plurality of electronic components 42 e are provided on the rear surface side of the second substrate 42. The second substrate 42 is joined to the shield case 5, and the shield case 5 is assembled and joined to the front case 21.
<Junction structure between second substrate and shield case>
Next, in describing the bonding structure of the second substrate 42 to the shield case 5, the shield case 5 will be described first.

  FIG. 9 is a perspective view of the shield case 5, and FIG. 10 is an exploded perspective view of the shield case 5.

  As shown in FIGS. 9 and 10, the shield case 5 includes a case bottom surface portion 51, a case tube portion 52, and a case top surface portion 53.

  The case cylinder 52 is formed in a substantially rectangular parallelepiped cylinder as shown. A square frame-like case bottom surface portion 51 is attached to the front end portion of the case cylinder portion 52, while a square frame-like case upper surface portion 53 is attached to the rear end portion of the case cylinder portion 52.

  The case cylinder 52 is formed by bending one sheet of a substantially rectangular thin plate at four corners 52b, 52c, 52d, and 52e, and joining portions 52g provided at positions adjacent to the corner 52b. It is made to join and it is formed in the substantially square cylinder shape provided with the four side walls 521,522,523,524.

  The shield case 5 is fixed to the front case 21 with an adhesive or the like in a state where the case tube portion 52 is inserted into an insertion groove 216 formed between the outer peripheral wall 211 of the front case 21 and the support walls 212a to 212d. The

  In the second substrate 42, the outer periphery of the second substrate 42 and the case cylinder 52 are not in direct contact with the inside of the case cylinder 52 of the shield case 5, and a space SP1 and a gap SP2 described later are interposed therebetween. In this state, it is joined to the case tube portion 52 via the joining member 6. The details of this joining structure will be described below.

  As shown in FIG. 8, at least one of the four sides of the outer periphery of the second substrate 42 is formed with a protruding projection 42 a protruding in the outer peripheral direction of the second substrate 42. In the present embodiment, the bonding convex portions 42a are formed on three sides of the second substrate 42 (two of them appear in FIG. 8), but are desirably formed on all four sides.

  FIG. 11 shows a state before joining between the joining convex portion 42 a of the second substrate 42 and the joining opening 52 a of the case tube portion 52.

  The case cylinder portion 52 has an inner circumference that is larger than the outer circumference of the second substrate 42, and a space SP <b> 1 is formed between the inner circumference of the case cylinder portion 52 and the outer circumference of the second substrate 42. . Then, the second substrate 42 is connected to the first substrate 41 on the side walls 521 to 523 excluding the side wall 524 among the four side walls 521 to 524 that form the square cylindrical case tube portion 52 of the case tube portion 52. At this time, a rectangular bonding opening 52a is opened at a position facing the outer peripheral direction of the bonding convex portion 42a of the second substrate 42.

  The bonding opening 52a formed on the side walls 521 to 523 of the case cylinder 52 is formed with a dimension in the front-rear direction larger than the thickness dimension of the second substrate 42, and an arrow SD orthogonal to the front-rear direction. The dimension of the width direction shown by is formed in a dimension larger than the width dimension of the convex part 42a for joining. That is, in the state where the second substrate 42 is connected to the first substrate 41 and the shield case 5 is fixed to the front case 21, as shown in FIG. 11, the bonding convex portion 42a has the bonding opening 52a. Is formed so that a gap SP2 exists in the front-rear direction and the width direction between the projection 42a for bonding and the opening 52a for bonding.

  The dimensional difference between the inner periphery of the case cylinder 52 and the outer periphery of the second substrate 42 (the dimension of the space SP1) and the dimensional difference between the bonding opening 52a and the bonding convex portion 42a (the dimension of the gap SP2) are as follows. Even if the second substrate 42 moves within a preset possible range, the second substrate 42 is provided in such a size that it does not contact and interfere with each other.

  That is, the position of the first substrate 41 is adjusted so that a good image can be obtained with respect to the photographing optical system 1 of the front case 21, and the movable range thereof is set in advance. Accordingly, the movable range of the second substrate 42 connected to the first substrate 41 via both connectors 412 and 422 is set according to the first substrate 41.

  Therefore, as the first substrate 41 moves relative to the front case 21 within the set movable range, the second substrate 42 is fixed to the front case 21 even if it moves within the set movable range. The above dimensional difference (spaces SP1 and SP2) is set so as not to interfere with the case cylinder 52 of the shield case 5.

  In the present embodiment, the dimensions of the four sides of the second substrate 42 are 20 × 20 (mm), the thickness is 1 (mm), the width of the bonding convex portion 42a is 3 (mm), and the bonding opening The width of 52a is formed to be 5 × 5 (mm), but this size is appropriately set in consideration of the above-mentioned movable range, the dimensional accuracy of the second substrate 42, the shield case 5, etc., the mounting accuracy, and the like. be able to.

  FIG. 12 is a diagram for explaining the mounting range of the electronic components 42e and 42f on the second substrate 42.

  The second substrate 42 is connected to the connector 412 of the first substrate 41 via the connector 422, and the position of the second substrate 42 can vary with the first substrate 41 within the movable range of the first substrate.

  Therefore, spaces SP1 and SP2 are provided between the second substrate 42 and the shield case 5, but when the position of the second substrate 42 is fluctuated due to vibration or the like, the second substrate 42 and the shield case 5 or The electronic component 42e on the second substrate 42 and the shield case 5 may come into contact with each other.

  Accordingly, there is a possibility that the electronic component 42e disposed in the vicinity of the shield case 5 of the second substrate 42 or on the bonding convex portion 42a may come into contact with the shield case 5 to cause a short circuit. The part 42e could not be disposed.

  However, in the imaging apparatus A according to the present embodiment, among the electronic components 42e provided on the second substrate 42, at least the electronic component 42f in the vicinity of the bonding convex portion 42a is covered with a nonconductive material. Therefore, it is possible to dispose the electronic component 42f on the end portion of the second substrate 42, particularly on the bonding convex portion 42a bonded to the shield case 5, and the electronic component 42f contacts the shield case 5 due to vibration or the like. Even in such a case, it is possible to avoid damage due to a short circuit.

  The electronic component 42f in the vicinity of the bonding convex portion 42a can be covered with a non-conductive material in advance, but is covered with a non-conductive bonding member at the time of bonding the second substrate 42 and the shield case 5 described later. Is also possible. Covering the electronic component 42f at the time of joining the second substrate 42 and the shield case 5 is preferable because the step of previously covering the electronic component 42f can be omitted.

  A non-conductive material may be coated to protect the circuit pattern of the second substrate 42, or may be coated around the bonding opening 52 a of the shield case 5. The flange 52f to be bonded to the second substrate 42 of the shield case 5 and the peripheral portion of the bonding opening 52a are covered with a non-conductive material, thereby contacting the electronic component 42f on the second substrate 42. Therefore, it is possible to more reliably prevent a short circuit and damage.

  As described above, by covering at least the electronic component 42f in the vicinity of the bonding convex portion 42a of the second substrate 42 with the nonconductive material, the range in which the electronic component can be mounted can be expanded, so that more electronic components can be mounted. Can be implemented. Therefore, it is possible to realize downsizing and high functionality of the imaging apparatus A.

  FIG. 13 shows a state after the joining convex portion 42 a of the second substrate 42 and the joining opening 52 a of the case tube portion 52 are joined.

  The second substrate 42 and the case cylinder 52 are joined by the joining member 6 shown in FIG. 13 with a joining convex portion 42a of the second substrate 42 and a flange 52f formed on the front edge of the joining opening 52a. It is made by joining.

  A non-conductive material is used for the bonding member 6, and for example, an adhesive made of a resin such as epoxy, silicone, acrylic, or a solvent-based adhesive can be used. Of these, UV curable adhesives and room temperature curable adhesives are preferable. Furthermore, in order to reduce the load on the second connector 422 of the second substrate connected to the first substrate 41, it is preferable that the material is soft after curing.

By using a non-conductive material as the bonding member 6, even when the bonding member 6 spreads on the first substrate 41 or the second substrate 42 or inside the shield case 5 at the time of bonding, electricity is not passed. There is no risk of short circuit.
<Assembly of imaging device>
Next, the procedure for assembling the imaging apparatus A will be described.

  First, the first substrate 41 is fixed to the front case 21 that holds the photographing optical system 1. Next, the optical axis of the photographic optical system 1 is picked up so that the subject image guided by the photographic optical system 1 is imaged in the center of the imaging surface of the image sensor 411 while being supported by a jig (not shown). The position of the first substrate 41 is adjusted with a jig in a direction perpendicular to the direction and the optical axis. After the position adjustment is completed, the first substrate 41 and the front case 21 are bonded with an adhesive.

  Subsequently, the bonding convex portion 42a of the second substrate 42 is inserted into the bonding opening 52a, and the outer periphery of the second substrate 42 is separated from the inner periphery of the shield case 5 with a margin. The case cylinder 52 is attached to the front case 21 to which the first substrate 41 is fixed from behind.

  In this state, by connecting the second connector 422 of the second substrate 42 to the first connector 412 of the first substrate 41, the second substrate 42 is supported by the first substrate 41.

  The shield case 5 is joined by an adhesive after the front end portion of the case tube portion 52 is inserted into the insertion groove 216 of the front case 21 and positioned.

  At this time, a sufficient space SP1 is secured between the case tube portion 52 of the shield case 5 and the second substrate 42 based on the dimensional difference, and the bonding convex portion 42a and the bonding opening 52a are separated from each other. A gap SP2 is secured between them. For this reason, while the shield case 5 is positioned with respect to the front case 21, even if the second substrate 42 moves within the movable range of the first substrate 41, the second substrate 42 and the case tube portion 52 interfere with each other. The first connector 412 and the second connector 422 can be connected without applying a load.

  Next, the bonding convex portion 42 a of the second substrate 42 and the flange 52 f of the bonding opening 52 a are bonded from the outside of the case tube portion 52 by the bonding member 6.

  At this time, as described above, the case cylindrical portion 52 and the second substrate 42 are bonded together by the bonding member 6 that is a non-conductive material, and the electronic component 42f near the bonding convex portion 42a of the second substrate 42 is simultaneously covered. You can also. Although it is possible to coat the electronic component 42f and the like with a non-conductive material in advance, the electronic component 42f is covered by covering the electronic component 42f at the time of joining the second substrate 42 and the case tube portion 52. Thus, the manufacturing process can be simplified. In addition, since the non-conductive material covering the electronic component 42f and the non-conductive joining member of the shield case 5 and the second substrate 42 are made of the same material, it is not necessary to use different types of materials. Costs can be reduced.

After the connection between the second substrate 42 and the case cylinder 52, the shield case 5 is covered with the rear case 22, the front case 21 and the rear case 22 are joined, and the connection cord 3 is connected to the second substrate 42. This completes the assembly of the imaging device A.
<Summary>
As described above, in the imaging apparatus A according to this embodiment, among the electronic components 42e provided on the second substrate 42, at least the electronic component 42f in the vicinity of the bonding convex portion 42a is coated with the nonconductive material. Yes. Accordingly, the position of the second substrate 42 fluctuates due to vibration or the like, and even when the electronic component 42f in the vicinity of the bonding convex portion 42a is in contact with the shield case 5, the electronic component 42f is not short-circuited and damaged. .

  Therefore, the range in which electronic components can be disposed on the second substrate 42 can be expanded, and more electronic components can be mounted. This greatly contributes to downsizing and high functionality of the imaging device A. it can.

  It should be noted that the present invention is not limited to the configuration shown here, such as a combination with other elements in the configuration described in the above embodiment. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form.

DESCRIPTION OF SYMBOLS 1 Imaging | photography optical system 5 Shield case 6 Nonelectroconductive material 21 Holding member 41 1st board | substrate 42 2nd board | substrate 42a Bonding convex part (joining part)
42e, 42f Electronic component 411 Image sensor (imaging device)
412 1st connector 422 2nd connector A Imaging device

JP 2008-33010 A

Claims (4)

A holding member for holding the photographing optical system;
A first substrate provided with an image pickup element bonded to the holding member and optically converting an image formed by the photographing optical system and a first connector for connection;
A second board provided with a second connector and an electronic component connected to the first connector;
A shield case that is fixed to the holding member so as to surround the first substrate and the second substrate;
An imaging device having
The second substrate has a joint portion that joins the shield case,
Of the electronic components provided on the second substrate, at least the electronic component in the vicinity of the joint is covered with a non-conductive material. The imaging apparatus according to claim 1, wherein a joint portion of the shield case with the second substrate and a peripheral portion of the joint portion of the shield case are covered with a nonconductive material. The imaging apparatus according to claim 1, wherein the shield case and the second substrate are joined by a non-conductive material. The non-conductive material that covers the electronic component, the non-conductive material that covers the joint portion and the peripheral portion of the shield case, and the non-conductive material that joins the shield case and the second substrate. The imaging apparatus according to claim 3, wherein the material is the same material.

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