JP5060935B2 - Image sensor module and portable electronic device using the same - Google Patents

Image sensor module and portable electronic device using the same Download PDF

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JP5060935B2
JP5060935B2 JP2007321138A JP2007321138A JP5060935B2 JP 5060935 B2 JP5060935 B2 JP 5060935B2 JP 2007321138 A JP2007321138 A JP 2007321138A JP 2007321138 A JP2007321138 A JP 2007321138A JP 5060935 B2 JP5060935 B2 JP 5060935B2
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heat
heat radiating
image sensor
flexible printed
radiating member
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JP2008219861A (en
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国雄 山宮
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Olympus Imaging Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

The invention relates to an imaging device module and a portable electronic device using the imaging the module. In the imaging device module according to the invention, an opening (24) is provided in an FPC board (22) accommodated in an apparatus chassis (68). An insulating sheet (14) of an imaging device (12) is mounted opposite the opening on the FPC board (22). In a configuration of the imaging device module (10), a heat reflection member (16) is thermally coupled to the insulating sheet (14), and a first radiation member (42) thermally coupled to both the apparatus chassis (68) and the imaging device (12) is disposed so as to face the heat reflection member (16).

Description

この発明は、例えば撮像素子一体型レンズ交換式やカメラヘッドユニット等の電子カメラ装置を含む携帯用電子機器に係り、特に、その撮像素子モジュールの冷却構造に関する。   The present invention relates to a portable electronic device including an electronic camera device such as an image sensor integrated lens interchangeable type or a camera head unit, and more particularly to a cooling structure of the image sensor module.

一般に、この種の携帯用電子機器においては、電子部品である撮像素子や、制御回路を構成するＣＰＵ（中央演算装置）を内装する場合、防塵性を持たせたうえで、その熱対策を採ることが要請されている。このうち熱対策は、防塵性を高めると、電子部品の温度が上昇して、雑音レベルが上がると、電子カメラ装置の場合、画質の劣化を招くために、最近の撮像素子やＣＰＵの高性能化により、特に、重要な課題の一つとなっている。   In general, in this type of portable electronic device, when an image pickup device that is an electronic component or a CPU (Central Processing Unit) that constitutes a control circuit is installed, it is necessary to take measures against heat while providing dust resistance. It is requested. Among these measures, the heat countermeasure increases the temperature of electronic components and increases the temperature of the electronic components, and if the noise level increases, in the case of an electronic camera device, the image quality deteriorates. This has become one of the most important issues.

そこで、このような放熱構造としては、液体冷却方式や空冷却方式の例えば特許文献１〜３が提案されている。   Therefore, as such a heat dissipation structure, for example, Patent Documents 1 to 3 of a liquid cooling method and an air cooling method have been proposed.

特許文献１には、回路基板上に搭載されている集積回路素子の表面に冷却板を接触させ、微細の冷媒流路に冷却水などを供給し、冷却板を水冷させる液体冷却方式の構成が開示されている。そして、この冷却板と集積回路素子との間である熱接合部に熱伝導性の優れたコンパウンド等の熱伝導性可変形物質を介在させ、接触面積を増大させることにより、熱伝導性を良好とする試しも実施されている。   Patent Document 1 discloses a liquid cooling system configuration in which a cooling plate is brought into contact with the surface of an integrated circuit element mounted on a circuit board, cooling water or the like is supplied to a fine refrigerant flow path, and the cooling plate is cooled with water. It is disclosed. The thermal junction between the cooling plate and the integrated circuit element is interspersed with a thermally conductive deformable material such as a compound having excellent thermal conductivity to increase the contact area, thereby improving the thermal conductivity. A trial has been carried out.

具体的には、セラミック板等の回路基板の一面側に多数の集積回路素子が搭載されている。そして、回路基板に設置される液体冷却モジュールは、冷媒流路から冷媒が供給される冷却板と、集積回路素子の表面との間に熱伝導性の優れたコンパウンド等の熱伝導性可変形物質が介在されており、スプリングのバネ圧により、冷却板と集積回路素子との熱接合を良好なものにしている。また、液体供給手段は、冷媒流路につなぐ冷媒供給管と、開閉弁と、メカニカルポンプを備えている。   Specifically, many integrated circuit elements are mounted on one side of a circuit board such as a ceramic plate. The liquid cooling module installed on the circuit board includes a heat conductive variable material such as a compound having excellent heat conductivity between the cooling plate to which the refrigerant is supplied from the refrigerant flow path and the surface of the integrated circuit element. And the thermal pressure between the cooling plate and the integrated circuit element is improved by the spring pressure of the spring. The liquid supply means includes a refrigerant supply pipe connected to the refrigerant flow path, an on-off valve, and a mechanical pump.

また、特許文献２は、カメラボディ内の本体構造体に組み込まれ、撮影レンズを支持するボディ側マウントと、本体構造体の開口部に光軸に沿って配されるシャッタと、撮像ユニット等からなる空気冷却方式を採用した撮像装置が開示されている。即ち、撮像ユニットは、本体構造体に固定支持される撮像素子固定板、光学ローパスフィルタ、保護ガラス、ベアチップタイプの撮像素子が設けられ、撮像素子が、その非撮像面側表面に対して放熱板を構成する撮像素子固定板が接着固定されてボデイ側マウントの表面から撮像素子の撮像面（光電変換面）までの光軸方向の距離を精度よく組み付けられる。そして、撮像素子は、その駆動に伴い発生した熱が、撮像素子固定板を介して放熱されることで、温度上昇が抑えられている。   Patent Document 2 includes a body-side mount that is incorporated in a main body structure in a camera body and supports a photographing lens, a shutter disposed along an optical axis in an opening of the main body structure, an imaging unit, and the like. An imaging apparatus that employs an air cooling method is disclosed. That is, the imaging unit is provided with an imaging element fixing plate fixed to the main body structure, an optical low-pass filter, protective glass, and a bare chip type imaging element, and the imaging element is a heat sink with respect to the non-imaging surface side surface. The image sensor fixing plate constituting the image sensor is adhered and fixed, and the distance in the optical axis direction from the surface of the body side mount to the image pickup surface (photoelectric conversion surface) of the image sensor can be assembled with high accuracy. And as for the image pick-up element, the heat | fever generate | occur | produced by the drive is thermally radiated via an image pick-up element fixing plate, and the temperature rise is suppressed.

また、特許文献３には、パッケージ、リード端子、カバーガラス等から成る撮像素子を回路基板上に実装して、回路基板に設けた開口部と、パッケージの裏面に可塑性シートを介在してペルチェ素子等の冷却素子の吸熱面を当接させた撮像素子揺動方式の手ブレ補正機能付き撮像ユニットが開示されている。このパッケージの裏面と、冷却素子の吸熱面との間に小型放熱部材を配置し、筐体側に大型放熱部材を配置して、両者の間を熱伝達部材で熱的に結合される。
特開平０２−１４３１５２号公報 特開２００６−３３２８９４号公報 特開２００６−１７４２２６号公報 Patent Document 3 discloses a Peltier element in which an image pickup element made of a package, a lead terminal, a cover glass, and the like is mounted on a circuit board, an opening provided in the circuit board, and a plastic sheet is interposed on the back surface of the package. An imaging unit with a shake correction function of an imaging element swinging system in which a heat absorbing surface of a cooling element such as the above is brought into contact is disclosed. A small heat radiating member is disposed between the back surface of the package and the heat absorbing surface of the cooling element, and a large heat radiating member is disposed on the housing side, and the two are thermally coupled by a heat transfer member.
Japanese Patent Laid-Open No. 02-143152 JP 2006-332894 A JP 2006-174226 A

しかしながら、上記特許文献１の構成では、メカニカルポンプからの冷媒液を導くための冷媒流路を必要とする構成上、冷媒液の流速損失により、冷却効率が劣るという問題を有する。また、冷媒流路の配置スペースがそれぞれ必要となることで、その設計の自由度が劣るうえ、機器筐体が大型となるという問題を有する。   However, the configuration of Patent Document 1 has a problem in that the cooling efficiency is inferior due to the flow rate loss of the refrigerant liquid due to the configuration that requires the refrigerant flow path for guiding the refrigerant liquid from the mechanical pump. Moreover, since the arrangement | positioning space of a refrigerant flow path is each required, the freedom degree of the design is inferior and there exists a problem that an apparatus housing becomes large sized.

また、特許文献２の構成では、撮像素子からの熱が熱輸送される放熱部材の放熱面積により、その放熱効率が決まるために、放熱量を高めると、機器筐体が大型となるという問題を有する。また、十分な放熱面積を確保することが困難なために、撮像素子近傍に、いわゆる熱の淀みが起こり、その熱抵抗が大きいことで、放熱部材への効率的な熱輸送が困難であるという問題も有する。   Moreover, in the structure of patent document 2, since the heat radiation efficiency is determined by the heat radiation area of the heat radiation member to which heat from the image sensor is thermally transported, if the heat radiation amount is increased, the device casing becomes large. Have. Also, since it is difficult to secure a sufficient heat radiation area, so-called heat stagnation occurs in the vicinity of the image sensor, and due to its large thermal resistance, efficient heat transport to the heat radiating member is difficult. There are also problems.

また、特許文献３の構成では、ペルチェ素子をパッケージ型撮像素子の下面に配して、撮像素子を、ペルチェ素子を挟んで回路基板に搭載し、このペルチェ素子及び回路基板を介して放熱板に接合する構成のために、その組立作業が非常に面倒なうえ、その取付け精度により、放熱効率が低下されるという問題を有する。   In the configuration of Patent Document 3, the Peltier element is disposed on the lower surface of the package-type image sensor, and the image sensor is mounted on the circuit board with the Peltier element sandwiched between the Peltier element and the circuit board. Due to the joining structure, the assembling work is very troublesome, and the heat radiation efficiency is lowered due to the mounting accuracy.

この発明は、上記の事情に鑑みてなされたもので、簡易な構成で、高効率な熱移送を実現して、冷却効率の高効率化を図り得、且つ、設計を含む製作の自由度の向上を図り得るようにした撮像素子モジュール及びそれを用いた携帯用電子機器を提供することを目的とする。   The present invention has been made in view of the above circumstances, achieves high-efficiency heat transfer with a simple configuration, can achieve high cooling efficiency, and has a high degree of freedom in manufacturing including design. An object of the present invention is to provide an imaging device module that can be improved and a portable electronic device using the imaging device module.

この発明は、機器筐体に収容されるもので、機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、前記フレキシブル印刷基板を支持し、移動枠に固定された放熱部材と、この放熱部材に収容される潜熱蓄熱材と、前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を備えて撮像素子モジュールを構成した。
また、この発明は、機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、前記フレキシブル印刷基板を支持し、前記機器筐体に固定された放熱部材と、この放熱部材に収容される潜熱蓄熱材と、前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を備えて撮像素子モジュールを構成した。 The present invention is housed in a device housing, and is housed in a device housing. A flexible printed wiring board on which an image pickup element is mounted , and a heat dissipation that supports the flexible printed board and is fixed to a moving frame. An image pickup device module is configured by including a member , a latent heat storage material accommodated in the heat radiating member, and a pressing member that supports the flexible printed wiring board on the heat radiating member .
Further, the present invention is housed in a device housing, and includes a flexible printed wiring board on which an image sensor is mounted, a heat radiating member that supports the flexible printed circuit board and is fixed to the device housing, and the heat radiating member. The image pickup device module is configured to include a latent heat storage material housed in a heat sink and a holding member that supports the flexible printed wiring board on the heat radiating member.

この発明は、機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、前記フレキシブル印刷配線基板を支持し、移動枠に固定された放熱部材と、この放熱部材に収容される潜熱蓄熱材と、前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を備えて携帯用電子機器を構成した。
また、この発明は、機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、前記フレキシブル印刷配線基板を支持し、前記機器筺体に固定された放熱部材と、この放熱部材に収容される潜熱蓄熱材と、前記放熱部材に前記フレキシブル印刷配線基板を支持する支持部材と、を備えて携帯用電子機器を構成した。 The present invention is housed in a device housing, and includes a flexible printed wiring board on which an image sensor is mounted , a heat radiating member that supports the flexible printed wiring board and is fixed to a moving frame, and is housed in the heat radiating member. A portable electronic device comprising a latent heat storage material and a holding member that supports the flexible printed wiring board on the heat radiating member.
Further, the present invention is housed in a device housing, and includes a flexible printed wiring board on which an image sensor is mounted, a heat radiating member that supports the flexible printed wiring board and is fixed to the device housing, and the heat radiating member. The portable electronic device is configured to include a latent heat storage material housed in a storage member and a support member that supports the flexible printed wiring board on the heat dissipation member.

以上述べたように、この発明によれば、簡易な構成で、高効率な熱移送を実現して、冷却効率の高効率化を図り得、且つ、設計を含む製作の自由度の向上を図り得るようにした撮像素子モジュール及びそれを用いた携帯用電子機器を提供することができる。   As described above, according to the present invention, a highly efficient heat transfer can be realized with a simple configuration, the cooling efficiency can be improved, and the degree of freedom in manufacturing including design can be improved. It is possible to provide an image pickup device module and a portable electronic device using the same.

以下、この発明の実施の形態に係る撮像素子モジュール及びそれを用いた携帯用電子機器について、図面を参照して詳細に説明する。   Hereinafter, an image sensor module and a portable electronic device using the same according to embodiments of the present invention will be described in detail with reference to the drawings.

（第１の実施の形態）
初めに、この発明の第１の実施の形態について説明する。 (First embodiment)
First, a first embodiment of the present invention will be described.

図１（ａ）は、この発明の第１の実施の形態に係る撮像素子モジュール１1 を示すもので、撮像素子１０は、その背面の絶縁シート１０１に赤外線反射部材である熱反射部材（低放射シート）１１が接合されて、例えばセラミック製のパッケージ本体１２内に収容配置される。この熱反射部材１１は、例えばアルミニウム材で、鏡面仕上げ（放射率０．１以下）されて形成され、その表面に金属箔や金属酸化物や赤外線カットフィルタ（赤外線の反射率が高い）等がコーティング、あるいは樹脂シートに白色塗料（放射率が低い塗料）を塗布し、放射率が０．１から０．６以下で赤外線反射率７５から９０％の処理面が形成される。これにより、熱反射部材１１は、撮像素子１０からの熱を放熱板に伝熱すると外部（例えば、放熱板）から放射される赤外線を遮光し、赤外線の入射を阻止する。 1 (a) is shows the image sensor module 1 1 according to the first embodiment of the present invention, the imaging device 10, the heat reflecting member (low an infrared reflective member to the insulating sheet 101 in the back (Radiation sheet) 11 is joined and accommodated in, for example, a ceramic package body 12. The heat reflecting member 11 is made of, for example, an aluminum material and has a mirror finish (emissivity of 0.1 or less), and a metal foil, a metal oxide, an infrared cut filter (having high infrared reflectivity), or the like on the surface. A white paint (paint having a low emissivity) is applied to the coating or the resin sheet to form a treated surface with an emissivity of 0.1 to 0.6 and an infrared reflectivity of 75 to 90%. Thus, when the heat reflection member 11 transfers the heat from the image sensor 10 to the heat radiating plate, the heat radiating member 11 shields infrared rays radiated from the outside (for example, the heat radiating plate) and blocks the incidence of infrared rays.

上記放熱板の表面に黒色塗料、ジルコニア系セラミック、セラミック含有材料等の高放射率の塗料を塗布した放熱板と、この放熱板からの赤外線を熱反射部材（低放射率の樹脂シート）の表面で反射し、撮像素子の温度が再上昇することを抑制すると共に、放熱板の熱を空間（撮像素子付近の隙間等）に放熱することができる。   The surface of the above heat sink is coated with a high emissivity paint such as black paint, zirconia-based ceramic, ceramic-containing material, etc., and the surface of the heat reflecting member (low emissivity resin sheet) receives infrared rays from this heat sink , The temperature of the image sensor is prevented from rising again, and the heat of the heat sink can be radiated to a space (such as a gap near the image sensor).

上記パッケージ本体１２には、放熱用開口部１２１が熱反射部材１１に対向して設けられる。このパッケージ本体１２は、その開口部１２１が、例えば弾性変形自在なフレキシブル印刷配線基板（以下、ＦＰＣ基板と記す）１３に設けられた放熱用開口部１３１に対向されて該ＦＰＣ基板１３に搭載されて熱的に結合される。そして、このパッケージ本体１２は、そのリード端子１２２が、撮像素子１０の電極とボンディング１４で接続されている。このリード端子１２２は、外部に引き出されて上記ＦＰＣ基板１３の配線パターンに接続される。また、撮像素子１０と電気的に接続されているリード端子１２２の配置される側部と、直交する両側部が、図２に示すように熱伝導性の優れた接着剤１５を用いて上記ＦＰＣ基板１３に接着されて熱結合され、その上面部に保護ガラス１６が被着されて撮像素子１０が密閉収容される。   The package body 12 is provided with a heat radiation opening 121 facing the heat reflecting member 11. The package body 12 is mounted on the FPC board 13 so that the opening 121 is opposed to a heat radiation opening 131 provided on, for example, an elastically deformable flexible printed wiring board (hereinafter referred to as an FPC board) 13. And thermally coupled. The package body 12 has lead terminals 122 connected to the electrodes of the image sensor 10 by bonding 14. The lead terminal 122 is pulled out and connected to the wiring pattern of the FPC board 13. Further, the side portion where the lead terminal 122 electrically connected to the image pickup device 10 is disposed and the both side portions orthogonal to each other are bonded to each other using the adhesive 15 having excellent thermal conductivity as shown in FIG. The image pickup device 10 is hermetically accommodated by being bonded to the substrate 13 and thermally coupled, and having a protective glass 16 attached to the upper surface portion thereof.

上記ＦＰＣ基板１３には、例えば基板端部１３２が上記開口部１３１を挟んで設けられ、この基板端部１３２には、放熱部材を構成する第１の放熱部材１７に設けられた突部１７１が対向されて上記パッケージ本体１２と接合される。この第１の放熱部材１７は、銅やアルミニウム合金等の金属材料で形成され、その略中央部に開口部１７０が上記ＦＰＣ基板１３の開口部１３１に対向して設けられる。ここで、パッケージ本体１２は、第１の放熱部材１７により位置決め支持される。   For example, a substrate end 132 is provided on the FPC board 13 with the opening 131 interposed therebetween, and a protrusion 171 provided on the first heat radiating member 17 constituting the heat radiating member is provided on the substrate end 132. It is opposed and joined to the package body 12. The first heat radiating member 17 is formed of a metal material such as copper or aluminum alloy, and an opening 170 is provided at a substantially central portion thereof so as to face the opening 131 of the FPC board 13. Here, the package body 12 is positioned and supported by the first heat radiating member 17.

上記第１の放熱部材１７には、赤外線吸収部材である高放熱シート１８が、上記放熱部材１７の凹部１３１に位置するように設けられる。この高放熱シート１８は、例えばアルミニウム材で形成して、その表面側に黒色アルマイト処理、スプライン加工、砂目処理（赤外線が反射しないように規則性あるいは不規則に凹凸を形成）等を施して０．９以上の放射率で、赤外線の反射率が低く熱吸収性を高めた処理面が形成され、開口部１８０が上記第２の放熱部材２０の突起部１７０に挿通して設けられる。これにより、高放熱シート１８は、外部または熱反射部材１１からの赤外線を効率よく吸収して、熱反射部材への赤外線の放射を最小限に抑えることが可能となる。   The first heat radiating member 17 is provided with a high heat radiating sheet 18 as an infrared absorbing member so as to be positioned in the recess 131 of the heat radiating member 17. The high heat dissipation sheet 18 is formed of, for example, an aluminum material, and is subjected to black alumite treatment, spline processing, graining treatment (regular or irregular irregularities are formed so that infrared rays are not reflected), and the like. A treatment surface having an emissivity of 0.9 or more, a low infrared reflectance, and a high heat absorption property is formed, and an opening 180 is provided through the protrusion 170 of the second heat dissipation member 20. As a result, the high heat dissipation sheet 18 can efficiently absorb infrared rays from the outside or the heat reflecting member 11 and minimize infrared radiation to the heat reflecting member.

また、上記突起部１７０の上面に小孔を形成した開口部を形成し、熱反射部材１１と高放熱シート１８間に蓄積される熱を外部へ直接放射すると、放熱効率が向上する。   Further, when an opening having a small hole is formed on the upper surface of the protrusion 170 and the heat accumulated between the heat reflecting member 11 and the high heat dissipation sheet 18 is directly radiated to the outside, the heat dissipation efficiency is improved.

なお、上記高放熱シート１８としては、例えば第１の放熱部材１７の熱反射部材１１に対向する部位に、上述した表面処理を施して、該第１の放熱部材１７で直接的に構成するようにしても良い。   In addition, as the said high heat radiating sheet 18, the surface treatment mentioned above is given to the site | part which opposes the heat | fever reflection member 11 of the 1st heat radiating member 17, for example, and it is comprised directly by this 1st heat radiating member 17. Anyway.

また、第１の放熱部材１７には、高放熱シート１８の背面側に凹部１７２が設けられ、この凹部１７２に熱伝導材１９を介在させて、突起部１７０および中空状の突部２００を有した第２の放熱部材２０が、例えばカシメ加工により圧着されて一体的に組みつけられる。この第２の放熱部材２０は、例えば第１の放熱部材１７と同材料で形成される。そして、熱伝導材１９は、第１及び第２の放熱部材１７，２０より熱伝導性の優れたグラファイトカーボン材、シリコンゲル、金属発泡材、各種の多孔質結晶体、グラファイトシート等の材料で形成される。   Further, the first heat radiating member 17 is provided with a concave portion 172 on the back side of the high heat radiating sheet 18, and a thermal conductive material 19 is interposed in the concave portion 172, so that the projection 170 and the hollow projection 200 are provided. The second heat radiating member 20 is integrally assembled by being crimped by caulking, for example. The second heat radiating member 20 is made of the same material as that of the first heat radiating member 17, for example. The heat conductive material 19 is made of a material such as graphite carbon material, silicon gel, metal foam material, various porous crystals, graphite sheet, etc. having better heat conductivity than the first and second heat radiating members 17 and 20. It is formed.

これにより、熱反射部材１１からの熱が高放熱シート１８の開口部１８０から第２の放熱部材２０の突起部１７０内を通り、外部に排熱されて、いわゆる熱の淀みがなくなり、撮像素子１０の熱飽和の防止が図れる。   As a result, the heat from the heat reflecting member 11 passes through the inside of the protrusion 170 of the second heat radiating member 20 from the opening 180 of the high heat radiating sheet 18 and is exhausted to the outside. 10 thermal saturation can be prevented.

また、熱伝導体に代え、相変化材を用いた潜熱蓄熱材で、有機系として例えば、マイクロカプセル型パラフィン材料に炭素繊維を充填した有機材料からなる樹脂シートを形成してもよい。これにより、潜熱蓄熱材の相変化温度を４０から５０℃に設定すると、機器内の急激な温度上昇を抑制でき、温度センサによる温度異常検出を遅延することができるため、ユーザの利便性が良くなる。   Further, instead of the heat conductor, a latent heat storage material using a phase change material may be used, and as an organic system, for example, a resin sheet made of an organic material filled with carbon fibers in a microcapsule type paraffin material may be formed. Thereby, when the phase change temperature of the latent heat storage material is set to 40 to 50 ° C., rapid temperature rise in the device can be suppressed, and temperature abnormality detection by the temperature sensor can be delayed, which is convenient for the user. Become.

また、放熱部材１７の下面を平坦（後述のカシメ加工が不要）とし、この放熱部材１７にマイクロカプセル型パラフィン材料に炭素繊維を充填した有機材料からなる樹脂シートを接合すると、より放熱板１７の構造が簡素で組み立ても容易となる。   Further, when the lower surface of the heat radiating member 17 is flat (no need for caulking processing described later) and a resin sheet made of an organic material filled with carbon fibers in a microcapsule-type paraffin material is joined to the heat radiating member 17, Simple structure and easy assembly.

上記第１の放熱部材１７には、筐体結合部１７３が設けられ、この筐体結合部１７３は、例えば上記ＦＰＣ基板１３に設けられた挿通孔１３３に挿通されて機器筐体２１に熱的に結合される。これにより、第１の放熱部材１７は、熱移送された熱の一部を、機器筐体２１に熱移送して該機器筐体２１から放熱して撮像素子１０の熱の上昇が抑制される。   The first heat radiating member 17 is provided with a housing coupling portion 173. The housing coupling portion 173 is inserted into an insertion hole 133 provided in the FPC board 13, for example, and is thermally applied to the device housing 21. Combined with As a result, the first heat radiating member 17 transfers a part of the heat transferred to the device housing 21 to dissipate the heat from the device housing 21 and suppresses an increase in the heat of the image sensor 10. .

また、上記ＦＰＣ基板１３には、例えばそのパッケージ本体１２との接合部である上記接着剤１５を挟んで４個の切り欠き部１３４が設けられ（図２参照）、この切り欠き部１３４には、上記第１の放熱部材１７に立設した受熱部１７６が挿入される。この受熱部１７６は、上記高放熱シート１８とは別にパッケージ本体１２の周壁から放熱される熱を受熱する。   In addition, the FPC board 13 is provided with four notches 134 (see FIG. 2), for example, with the adhesive 15 that is a joint with the package body 12 interposed therebetween. The heat receiving portion 176 erected on the first heat radiating member 17 is inserted. The heat receiving portion 176 receives heat radiated from the peripheral wall of the package body 12 separately from the high heat dissipation sheet 18.

上記構成により、撮像素子１０が駆動されて発熱すると、その熱は、そのパッケージ本体１２及びＦＰＣ基板１３から第１の放熱部材１７に熱伝導により熱移送される。同時に、ＦＰＣ基板１３の他の電子部品からの熱が、該ＦＰＣ基板１３を介して第１の放熱部材１７に熱伝導により熱移送される。   With the above configuration, when the image sensor 10 is driven to generate heat, the heat is transferred from the package body 12 and the FPC board 13 to the first heat radiating member 17 by heat conduction. At the same time, heat from other electronic components of the FPC board 13 is transferred by heat conduction to the first heat radiating member 17 through the FPC board 13.

なお、パッケージ本体１２の下面と第１の放熱部材１７との隙間から放出される熱がＦＰＣ基板に伝熱されないように、パッケージ本体１２の一部を接着剤１５で塞ぐことが望ましい。   In addition, it is desirable to block part of the package body 12 with the adhesive 15 so that heat released from the gap between the lower surface of the package body 12 and the first heat radiating member 17 is not transferred to the FPC board.

また、上記撮像素子１０で発生した熱は、絶縁シート１０１を通して直接的に熱反射部材１１に熱移送され、この熱反射部材１１で赤外線として放射されて高放熱シート１８を介して第１の放熱部材１７に熱移送される。さらに、撮像素子１０からの熱の一部は、パッケージ本体１２の側壁から放熱される。この熱は、第１の放熱部材１７の受熱部１７６に対流伝熱されて該第１の放熱熱部材１７に熱移送される。   Further, the heat generated in the image pickup device 10 is directly transferred to the heat reflecting member 11 through the insulating sheet 101, and is radiated as infrared rays by the heat reflecting member 11 to be radiated through the high heat radiating sheet 18. Heat is transferred to the member 17. Further, a part of the heat from the image sensor 10 is radiated from the side wall of the package body 12. This heat is convectively transferred to the heat receiving portion 176 of the first heat radiating member 17 and transferred to the first heat radiating heat member 17.

このように３つの形態で第１の放熱部材１７に熱移送された熱は、熱伝導材１９を介して第２の放熱部材２０に熱移送されて全体に効率よく熱伝導されて、その筐体結合部１７３より機器筐体２１に熱移送されて外部に放熱され、ここに、撮像素子１０が冷却されて所望の温度に熱が抑制される。この際、ＦＰＣ基板１３の他の搭載電子部品からの熱も排熱されて、該電子部品の冷却も行われる。   Thus, the heat transferred to the first heat radiating member 17 in three forms is transferred to the second heat radiating member 20 through the heat conducting material 19 and efficiently transferred to the entire heat transfer member. Heat is transferred from the body coupling portion 173 to the device casing 21 to be dissipated to the outside, and the image sensor 10 is cooled here to suppress heat to a desired temperature. At this time, heat from other mounted electronic components of the FPC board 13 is also exhausted, and the electronic components are also cooled.

このように、上記撮像素子モジュール１1 は、機器筐体２１に収容されるＦＰＣ基板１３に開口部１３１を設けて、この開口部１３１に対して撮像素子１０の絶縁シート１０１を対向させてＦＰＣ基板１３に搭載し、その絶縁シート１０１に熱反射部材１１を熱的に結合させて、この熱反射部材１１に対向して機器筐体２１及び撮像素子１０の双方に熱的に結合される第１の放熱部材１７を配置するように構成した。 Thus, the imaging device module 1 1 is an opening 131 provided on the FPC substrate 13 which is accommodated in the apparatus housing 21, are opposed to the insulating sheet 101 of the imaging device 10 with respect to the opening 131 FPC The heat reflecting member 11 is mounted on the substrate 13 and thermally coupled to the insulating sheet 101. The heat reflecting member 11 is thermally coupled to both the device casing 21 and the imaging element 10 so as to face the heat reflecting member 11. 1 radiating member 17 is arranged.

ここで、熱反射部材は、低放射シートなどの塗布された樹脂シートを用いた場合には、絶縁シート１０１を省くことができる。   Here, the insulating sheet 101 can be omitted as the heat reflecting member when an applied resin sheet such as a low radiation sheet is used.

これによれば、ＦＰＣ基板１３に半田付けされた撮像素子１０の熱は、その絶縁シート１０１から熱反射部材１１に熱移送される。その後、熱移送された熱の一部は、熱反射部材１１からＦＰＣ基板１３の半田付け面と逆側に配置した第１の放熱部材１７に接合された高放熱シート１８や突起部１７０の内部へと赤外線を放出して熱移送される。さらに、熱反射部材１１に伝導された熱は、パッケージ本体１２からＦＰＣ基板１３や受熱部１７６に熱伝導されて第１の放熱部材１７に熱伝導される。   According to this, the heat of the image sensor 10 soldered to the FPC board 13 is transferred from the insulating sheet 101 to the heat reflecting member 11. Thereafter, a part of the heat transferred is transferred from the heat reflecting member 11 to the first heat radiating member 17 disposed on the side opposite to the soldering surface of the FPC board 13 and inside the high heat radiating sheet 18 and the protrusion 170. Infrared rays are emitted to the heat transfer. Further, the heat conducted to the heat reflecting member 11 is conducted from the package body 12 to the FPC board 13 and the heat receiving unit 176 and conducted to the first heat radiating member 17.

また、図１（ｂ）は、この発明の第１の実施の形態に係る撮像素子モジュールの他の構成例を示した断面図である。   FIG. 1B is a cross-sectional view showing another configuration example of the image sensor module according to the first embodiment of the present invention.

図１（ａ）と異なる点は、第１の放熱部材１７に、熱伝導材１７１ａ、第３の放熱部材１７１ｂ、熱伝導材１９、第２の放熱部材２０及び放熱シート２０ａが積層状に設けられて、突起部１７０が設けられていないことである。上記放熱シート２０ａは、セラミック含有材料が第２の放熱部材２０の表面に塗布されることによって形成されるもので、放熱した熱を空間に放出するために設けられている。   The difference from FIG. 1A is that the first heat radiating member 17 is provided with a heat conductive material 171a, a third heat radiating member 171b, a heat conductive material 19, a second heat radiating member 20, and a heat radiating sheet 20a in a laminated form. In other words, the protrusion 170 is not provided. The heat radiating sheet 20a is formed by applying a ceramic-containing material on the surface of the second heat radiating member 20, and is provided to release the radiated heat to the space.

このように、第１の放熱部材１７を２部品に分解し、熱伝導体１７１ａを両部品の境界部に介在させ、放熱シート２０ａを表面に貼り付けることで、より高い放熱効率を得ることができ、放熱板の小型化が可能となる。   Thus, by disassembling the first heat radiating member 17 into two parts, interposing the heat conductor 171a at the boundary between both parts, and attaching the heat radiating sheet 20a to the surface, higher heat radiation efficiency can be obtained. This makes it possible to reduce the size of the heat sink.

また、上記撮像素子はパッケージ型のタイプについて説明したが、ベアチップ型のタイプに置き換えることも可能である。   In addition, although the image pickup element has been described as a package type, it can be replaced with a bare chip type.

次に、上記撮像素子モジュールの使用形態について説明する。なお、ここでは、一例として、図１（ｂ）に示す構成の撮像素子モジュール１を例として説明する。   Next, a usage pattern of the image sensor module will be described. Here, as an example, the imaging element module 1 having the configuration shown in FIG. 1B will be described as an example.

例えば上記撮像素子モジュール１は、図３に示すように携帯用電子機器である電子カメラのレンズユニット５０とカメラ本体５１との間に組付けられて使用に供される。但し、この図３においては、上記図１及び図２と同一部分について、同一符合を付して詳細な説明を省略する。   For example, as shown in FIG. 3, the imaging element module 1 is assembled between a lens unit 50 and a camera body 51 of an electronic camera that is a portable electronic device, and is used. However, in FIG. 3, the same parts as those in FIGS. 1 and 2 are given the same reference numerals, and detailed description thereof is omitted.

即ち、上記撮像素子モジュール１は、ユニット接続環５２に収容され、その第１の放熱部材１７が上記ユニット接続環５２に熱的に結合される。そして、このユニット接続環５２は、その基端がカメラ本体５１に螺子部材５３を用いて螺着される。そして、この撮像素子モジュール１の上面には、例えば図４に示す防塵機構５４が組付けられる。   That is, the image sensor module 1 is accommodated in the unit connection ring 52, and the first heat radiating member 17 is thermally coupled to the unit connection ring 52. The base end of the unit connection ring 52 is screwed to the camera body 51 using a screw member 53. For example, a dustproof mechanism 54 shown in FIG. 4 is assembled on the upper surface of the imaging element module 1.

この防塵機構５４は、ローパスフィルタ５４１が取付け部材５４２に設けられた開口部５４３を閉塞するように設けられ、このローパスフィルタ５４１は、環形状したゴム材の支持板５４４を介して上記撮像素子１０の上面に配置される。そして、取付け部材５４２は、そのローパスフィルタ５４１が上記撮像素子１０上に支持板５４４を介して対向配置された状態で、上記パッケージ本体１２に対して螺子部材５４５を用いて、図示されていないが、機器筐体２１に螺着されて配置される。これにより、パッケージ本体１２の保護ガラス１６の表面への塵埃の侵入を防止することができる。   The dust-proof mechanism 54 is provided so that the low-pass filter 541 closes the opening 543 provided in the mounting member 542, and the low-pass filter 541 is connected to the imaging element 10 via the ring-shaped rubber material support plate 544. It is arranged on the upper surface. The mounting member 542 is not shown in the drawing using a screw member 545 with respect to the package body 12 in a state where the low-pass filter 541 is disposed on the imaging element 10 via a support plate 544. The device casing 21 is screwed and arranged. Thereby, the penetration | invasion of the dust to the surface of the protective glass 16 of the package main body 12 can be prevented.

また、取付け部材５４２には、ローパスフィルタ５４１に対向して防塵用の透明ガラス基板５４６が所定の間隔を有して配置され、この透明ガラス基板５４６は、弾性部材５４７を介在して螺子部材５４８を用いて所望の気密性を有して閉塞されて組付けられる。そして、この透明ガラス基板５４６と取付け部材５４２との間には、圧電素子等の加振部材５４９と、ローパスフィルタ５４１の表面への塵埃の侵入を防止するために環状に形成されたゴム部材５５０（ここではＯリングとしたが、加振部材５４９の幅と同一幅でもよい）が介在される。   In addition, a dust-proof transparent glass substrate 546 is disposed on the attachment member 542 so as to face the low-pass filter 541 with a predetermined interval. The transparent glass substrate 546 is interposed between the screw member 548 with an elastic member 547 interposed therebetween. Is closed and assembled with a desired airtightness. Between the transparent glass substrate 546 and the mounting member 542, a vibration member 549 such as a piezoelectric element and a rubber member 550 formed in an annular shape to prevent dust from entering the surface of the low-pass filter 541 are provided. (Here, it is an O-ring, but it may be the same width as the vibration member 549).

ここで、透明ガラス基板５４６は、ローパスフィルタ５４１に対して気密を有して振動可能に対向配置され、加振部材５４９が図示しない駆動制御部を介して駆動されて加振されると、その振動が伝達される。すると、透明ガラス基板５４６は、弾性部材５４７の弾性力に抗して気密を保った状態で振動され、その表面等に付着した塵等を除去して、ローパスフィルタ５４１内への塵の侵入を阻止する。   Here, the transparent glass substrate 546 is arranged to face the low-pass filter 541 in an airtight manner so as to vibrate, and when the vibration member 549 is driven and vibrated via a drive control unit (not shown), Vibration is transmitted. Then, the transparent glass substrate 546 is vibrated in an airtight state against the elastic force of the elastic member 547 to remove dust and the like adhering to the surface of the transparent glass substrate 546 and prevent the dust from entering the low-pass filter 541. Stop.

上記ユニット接続環５２の先端部には、上記レンズユニット５０が組付けられる。このレンズユニット５０には、撮像レンズ系が収納配置される。この撮像レンズ系は、例えば第１群の第１のレンズ５５ａ、第２群の第２及び第３のレンズ５５ｂ，５５ｃ、第３群の第４のレンズ２５ｄの３群４枚で構成され、その第２群の第２及び第３のレンズ５５ｂ，５５ｃを光軸Ｏ方向に移動させて焦点調節が行われる。   The lens unit 50 is assembled to the tip of the unit connection ring 52. In this lens unit 50, an imaging lens system is accommodated. The imaging lens system includes, for example, four lenses in three groups: a first lens 55a in the first group, second and third lenses 55b and 55c in the second group, and a fourth lens 25d in the third group. Focus adjustment is performed by moving the second and second lenses 55b and 55c in the second group in the direction of the optical axis O.

上記第1のレンズ５５ａと、第４のレンズ５５ｄは、それぞれホルダ５６ａ，５６ｄに収容され、このホルダ５６ａ，５６ｄを介して光軸上に位置決め固定されて配置される。そして、第２及び第３のレンズ５５ｂ、５５ｃは、ホルダ５６ｂに収容され、このホルダ５６ｂは、例えばガタ防止構造を有した案内機構５７に光軸に対応した矢印Ａ，Ｂ方向に移動自在に支持される。   The first lens 55a and the fourth lens 55d are accommodated in holders 56a and 56d, respectively, and are positioned and fixed on the optical axis via the holders 56a and 56d. The second and third lenses 55b and 55c are accommodated in a holder 56b. The holder 56b is movable in the directions of arrows A and B corresponding to the optical axis, for example, in a guide mechanism 57 having a backlash prevention structure. Supported.

このホルダ５６ｂは、直線螺子機構５８に光軸方向の矢印Ａ，Ｂ方向に直線移動自在に連結される。この直線螺子機構５８は、例えばステッピングモータ５９に駆動自在に連結され、このステッピングモータ５９の駆動に連動して回転駆動されて、上記ホルダ５６ａを矢印Ａ，Ｂ方向に直線移動される。この際、ホルダ５６ｂは、上記案内機構５７に案内されて矢印Ａ，Ｂ方向に移動されて、上記第２及び第３のレンズ５５ｂ，５５ｃを光軸方向に移動させて焦点調整を実行する。   The holder 56b is coupled to the linear screw mechanism 58 so as to be linearly movable in the directions of arrows A and B in the optical axis direction. The linear screw mechanism 58 is connected to, for example, a stepping motor 59 so as to be freely driven, and is rotationally driven in conjunction with the driving of the stepping motor 59 to linearly move the holder 56a in the directions of arrows A and B. At this time, the holder 56b is guided by the guide mechanism 57 and moved in the directions of arrows A and B, and the focus adjustment is performed by moving the second and third lenses 55b and 55c in the optical axis direction.

このように上記撮像素子モジュール１は、電子カメラのレンズユニット５０に組付けることで、上述したように高効率な冷却を実現したうえで、その熱設計を含む製作の自由度の向上が図れるため、そのカメラ本体５１の小形化に寄与することが可能となる。   As described above, the imaging device module 1 is assembled in the lens unit 50 of the electronic camera, so that the highly efficient cooling can be realized as described above, and the manufacturing flexibility including the thermal design can be improved. It is possible to contribute to downsizing of the camera body 51.

なお、上記第１の実施の形態では、弾性変形自在なＦＰＣ基板１３を用いて構成した場合について説明したが、これに限ることなく、その他、ハードタイプの印刷配線基板を用いて構成することも可能で、同様に有効な効果が期待される。   In the first embodiment, the case where the elastically deformable FPC board 13 is used has been described. However, the invention is not limited to this, and a hard type printed wiring board may also be used. It is possible and expected to be effective as well.

また、この発明は、上記第１の実施の形態に限ることなく、その他、例えば図５、図６、図７、図８、図９及び図１０、図１１にそれぞれ示すように撮像素子モジュール１ａ、１ｂ、１ｃ、１ｄ、１ｅ、１ｆを構成してよく、同様に有効な効果を期待することができる。但し、図５乃至図１１においては、上記図１及び図２と同一部分について同一符号を付して、その詳細な説明を省略する。   In addition, the present invention is not limited to the first embodiment, and other components such as the image sensor module 1a as shown in FIGS. 5, 6, 7, 8, 9, 10 and 11, for example. 1b, 1c, 1d, 1e, and 1f may be configured, and similarly effective effects can be expected. However, in FIG. 5 to FIG. 11, the same parts as those in FIG. 1 and FIG.

図５に示す撮像素子モジュール１ａは、上記撮像素子１０をパッケージ本体１２に収容したパッケージタイプに適用したもので、このパッケージ本体１２の底面に撮像素子１０の絶縁シート１０１に対応して開口部１２１を形成する。そして、この開口部１２１には、上記撮像素子１０の絶縁シート１０１に接合した赤外線反射部材である上記熱反射部材１１が配置される。   An image sensor module 1a shown in FIG. 5 is applied to a package type in which the image sensor 10 is accommodated in a package body 12. An opening 121 corresponding to the insulating sheet 101 of the image sensor 10 is formed on the bottom surface of the package body 12. Form. In the opening 121, the heat reflecting member 11 that is an infrared reflecting member bonded to the insulating sheet 101 of the imaging element 10 is disposed.

また、上記撮像素子１０が搭載されたＦＰＣ基板１３には、開口部１３１が上記パッケージ本体１２の開口部１２１に連続して形成される。そして、このパッケージ本体１２の開口部１２１及び上記ＦＰＣ基板１３の開口部１３１には、アルミニウム合金等の金属材料製の放熱部材６０の一端部に設けられる凹状の第1の熱結合部６０１が挿通されて、該第１の熱結合部６０１の先端部が、上記撮像素子１０の絶縁シート１０１と熱的に結合される。   An opening 131 is continuously formed in the opening 121 of the package body 12 in the FPC board 13 on which the imaging element 10 is mounted. A concave first heat coupling portion 601 provided at one end of a heat radiating member 60 made of a metal material such as an aluminum alloy is inserted into the opening 121 of the package body 12 and the opening 131 of the FPC board 13. As a result, the tip of the first thermal coupling portion 601 is thermally coupled to the insulating sheet 101 of the image sensor 10.

上記放熱部材６０の第１の熱結合部６０１には、その内壁に放熱フィン６０２が形成され、その底面に高放熱シート１８ａが、上記熱反射部材１１に対向して配置される。それと共に、高放熱シート１８が、ＦＰＣ基板１３に沿って延出して配置される。これにより、この高放熱シート１８ａは、上記熱反射部材１１から放射される赤外線を受熱して第１の熱結合部６０１に熱移送する。   The first heat coupling portion 601 of the heat radiating member 60 has heat radiating fins 602 formed on the inner wall thereof, and a high heat radiating sheet 18a is disposed on the bottom surface thereof so as to face the heat reflecting member 11. At the same time, the high heat dissipation sheet 18 extends along the FPC board 13. As a result, the high heat dissipation sheet 18 a receives the infrared rays emitted from the heat reflecting member 11 and transfers the heat to the first heat coupling portion 601.

また、上記第1の熱結合部６０１には、幅広な第２の熱結合部６０３が着脱可能に設けられる。この第２の熱結合部６０３は、その幅広部位が上記ＦＰＣ基板１３の背面側に熱的に結合される。   The first thermal coupling portion 601 is detachably provided with a wide second thermal coupling portion 603. The wide portion of the second thermal coupling portion 603 is thermally coupled to the back side of the FPC board 13.

第２の熱結合部６０３には、例えば内外壁に放熱フィンが突設された中空部６０４が設けられ、この中空部６０４内には、例えば上述した熱伝導性の優れたグラファイトカーボン材、シリコンゲル、金属発泡材、各種の多孔質結晶体、グラファイトシート等の熱伝導材１９や無機または有機系の潜熱蓄熱材が密閉収容される。これにより、放熱部材６０は、十分な放熱面積が得られ、第１の熱結合部６０１に熱が移送されると、その熱伝導材１９を経由して、第２の熱結合部６０３を含む全体に効率よく熱伝導され、高効率な放熱が実現できる。   The second thermal coupling portion 603 is provided with, for example, a hollow portion 604 in which heat radiating fins are projected on inner and outer walls. In the hollow portion 604, for example, the above-described graphite carbon material having excellent thermal conductivity, silicon The heat conductive material 19 such as gel, metal foam material, various porous crystals, graphite sheet, and inorganic or organic latent heat storage material are hermetically contained. Thereby, the heat radiating member 60 has a sufficient heat radiating area, and when heat is transferred to the first thermal coupling portion 601, the second thermal coupling portion 603 is included via the thermal conductive material 19. The whole is efficiently heat-conductive and high-efficiency heat dissipation can be realized.

また、図６に示す撮像素子モジュール１ｂは、いわゆるベアチップタイプの撮像素子１０ａを用いて構成したもので、ＦＰＣ基板１３には、撮像素子１０ａの絶縁シート１０１ａに対応して開口部１３１を形成する。そして、この開口部１３１には、上記撮像素子１０ａの絶縁シート１０１ａに上記赤外線反射部材である熱反射部材１１が接合されて配置される。   The imaging element module 1b shown in FIG. 6 is configured using a so-called bare chip type imaging element 10a, and an opening 131 is formed in the FPC board 13 corresponding to the insulating sheet 101a of the imaging element 10a. . And in this opening part 131, the heat | fever reflection member 11 which is the said infrared reflection member is joined and arrange | positioned at the insulating sheet 101a of the said image pick-up element 10a.

さらに、上記撮像素子１０ａが搭載されたＦＰＣ基板１３の背面には、支持部材を構成する第１の放熱部材６２が熱的に結合されて積重配置される。この第１の放熱部材６２には、開口部６２１が上記熱反射部材１１に対向して形成され、この開口部６２１には、例えば銅等の金属材料製の凹状の第２の放熱部材６３が、上記熱反射部材１１に対向して、例えば螺子部材６４を用いて螺着される。   Further, a first heat radiating member 62 constituting a support member is thermally coupled and stacked on the back surface of the FPC board 13 on which the imaging element 10a is mounted. An opening 621 is formed in the first heat radiating member 62 so as to face the heat reflecting member 11, and a concave second heat radiating member 63 made of a metal material such as copper is formed in the opening 621. For example, a screw member 64 is used to face the heat reflecting member 11.

この第２の放熱部材６３には、例えばその側壁に排気孔６３１が設けられ、その底面外壁には、放熱フィン６３２が形成される。これにより、第２の放熱部材６３は、その排気孔６３１及び放熱フィン６３２を介して熱移送された熱を外部に効率よく排熱することができる。   The second heat radiating member 63 is provided with, for example, exhaust holes 631 on the side wall thereof, and heat radiating fins 632 are formed on the bottom outer wall thereof. Thus, the second heat radiating member 63 can efficiently exhaust the heat transferred through the exhaust holes 631 and the heat radiating fins 632 to the outside.

第２の放熱部材６３には、その内部に例えば金属材料製の第３の放熱部材６５が、紫外線硬化型接着剤を用いて接合されて収容配置される。この第３の放熱部材６５には、その周壁に放熱フィン６５１が設けられ、この放熱フィン６５１に先端部が第２の放熱部材６３の内壁に熱的に結合されている。そして、この第３の放熱部材６５には、例えば排気孔６５２が上記第２の放熱部材６３の排気孔６３１に対応して設けられ、この排気孔６５２を通して熱移送された熱を外部に効率よく排熱することができる。   In the second heat radiating member 63, for example, a third heat radiating member 65 made of a metal material is joined and disposed by using an ultraviolet curable adhesive. The third heat radiating member 65 is provided with a heat radiating fin 651 on its peripheral wall, and the tip of the heat radiating fin 651 is thermally coupled to the inner wall of the second heat radiating member 63. The third heat radiating member 65 is provided with, for example, an exhaust hole 652 corresponding to the exhaust hole 631 of the second heat radiating member 63, and the heat transferred through the exhaust hole 652 is efficiently transferred to the outside. Heat can be exhausted.

また、上記第１の放熱部材６２には、突起部６２２が設けられ、この突起部６２２が上記ＦＰＣ基板１３の挿通孔１３２に挿通されて、機器筐体６６に熱的に結合される。これにより、第１の放熱部材６２は、撮像素子１０ａ及びＦＰＣ基板１３を介して熱移送された熱を機器筐体６６に熱移送して排熱することができる。   The first heat radiating member 62 is provided with a protrusion 622, and the protrusion 622 is inserted into the insertion hole 132 of the FPC board 13 and is thermally coupled to the device housing 66. As a result, the first heat radiating member 62 can transfer the heat transferred through the imaging element 10a and the FPC board 13 to the device housing 66 to exhaust the heat.

なお、上記第１乃至第３の放熱部材６２，６３，６５は、例えば同一金属材料で形成される。   The first to third heat radiating members 62, 63, 65 are made of, for example, the same metal material.

また、図７に示す撮像素子モジュール１ｃは、手振れ補正を有する一眼レフレックスデジタルカメラに適用される。したがって、撮像素子はカメラ本体によって撮影レンズの光軸に直交するＸＹ平面上に変位可能な状態で支持され、撮影時に手振れ補正機構（例えば、駆動コイルと永久磁石で構成されたリニアモータやステップモータとネジ軸の構成による電磁駆動、あるいは圧電素子や屈曲振動子を用いたリニアモータなど）により手振れ状態に対応してＸＹ平面を駆動される。上記ベアチップタイプの撮像素子１０ａを用いて構成したもので、ＦＰＣ基板１３には、撮像素子１０ａが、その絶縁シート１０１ａが基板面に対向して搭載される。このＦＰＣ基板１３には、開口部１３１が絶縁シート１０１ａに対向して設けられ、この開口部１３１には、上記熱反射部材１１が接合される。   Further, the image sensor module 1c shown in FIG. 7 is applied to a single-lens reflex digital camera having camera shake correction. Therefore, the image pickup device is supported by the camera body in a state in which it can be displaced on the XY plane orthogonal to the optical axis of the photographing lens, and a camera shake correction mechanism (for example, a linear motor or a step motor composed of a drive coil and a permanent magnet) at the time of photographing. The XY plane is driven in response to the hand shake state by electromagnetic drive using a screw shaft configuration or a linear motor using a piezoelectric element or a bending vibrator. The bare chip type image pickup device 10a is used, and the image pickup device 10a is mounted on the FPC board 13 with the insulating sheet 101a facing the substrate surface. An opening 131 is provided in the FPC board 13 so as to face the insulating sheet 101 a, and the heat reflecting member 11 is joined to the opening 131.

このＦＰＣ基板１３は、例えば金属材料で形成される第１の放熱部材６７に積重され、この第１の放熱部材６７により支持されて配置される。この第１の放熱部材６７には、開口部６７１が上記ＦＰＣ基板１３の開口部１３１に対向して形成され、この第１の放熱部材６７の開口部６７１には、例えば金属材料で形成される凹状の第２の放熱部材６８の先端部が熱的に結合されて取付けられる。   The FPC board 13 is stacked on a first heat radiating member 67 made of, for example, a metal material, and is supported and arranged by the first heat radiating member 67. An opening 671 is formed in the first heat radiating member 67 so as to face the opening 131 of the FPC board 13, and the opening 671 of the first heat radiating member 67 is formed of, for example, a metal material. The tip of the concave second heat radiating member 68 is attached by being thermally coupled.

この第２の放熱部材６８は、その中間部にヒートパイプタイプの、いわゆるウィック管である周知の板状の金属管６９が熱的に結合されて閉塞される。金属管６９には、その一方の面に上述した赤外線の反射率が低く熱吸収性を高めた処理面を有する高放熱シート１８が、上記熱反射部材１１に対向して配置される。   The second heat radiating member 68 is closed by thermally coupling a known plate-like metal tube 69, which is a so-called wick tube, to the middle portion thereof. In the metal tube 69, the high heat dissipation sheet 18 having a treatment surface with low infrared reflectance and high heat absorption is disposed on one surface of the metal tube 69 so as to face the heat reflecting member 11.

また、第２の放熱部材６８には、内壁に案内溝６８１が設けられ、この案内溝６８１には、銅材等の金属材料製の金属板７０が、上記金属管６９との間に上記シリコンゲル、グラファイトシート材等の熱伝導材１９が介在されて移動自在に組付けられる。金属板７０には、上記第２の放熱部材６８の底部に螺合調整自在に設けられた調整螺子部材７１の先端部が係合され、この調整螺子部材７１の螺合調整により、昇降移動されて熱伝導材１９を挟んで上記金属管６９に圧接される。   The second heat radiating member 68 is provided with a guide groove 681 on the inner wall, and a metal plate 70 made of a metal material such as a copper material is interposed between the silicon tube 69 and the silicon tube 69 in the guide groove 681. A heat conductive material 19 such as a gel or a graphite sheet material is interposed, and is assembled to be movable. The metal plate 70 is engaged with a leading end portion of an adjusting screw member 71 provided so as to be screwed and adjustable at the bottom of the second heat radiating member 68, and is moved up and down by adjusting the screwing of the adjusting screw member 71. Thus, the metal pipe 69 is pressed against the heat conductive material 19.

この際、熱伝導材１９は、金属板７０に設けられた空気抜き孔７０１によりその内部空気が抜けて金属管６９と金属板７０との間に挟装される。これにより、金属管６９と第２の放熱部材６８との間は、熱伝導材１９及び金属板７０を介して効率的な熱伝導を可能とり、高効率な熱伝導が可能となる。   At this time, the heat conducting material 19 is sandwiched between the metal tube 69 and the metal plate 70 through the air vent holes 701 provided in the metal plate 70 so that the internal air is released. Thereby, efficient heat conduction is possible between the metal pipe 69 and the second heat radiating member 68 via the heat conducting material 19 and the metal plate 70, and highly efficient heat conduction is possible.

なお、上記金属管６９は、接続管６９２を介して循環路を構成する例えば可撓性合成樹脂管７２に接続される。この可撓性合成樹脂管７２には、図示しない機器本体側のシャーシに配置された凝縮器及び圧電ポンプに順に配管接続され、このウイック付きヒートパイプや圧電ポンプにより、純水、アルコール、相変化媒体等の作動流体が上記金属管６９および凝縮器に循環供給されて撮像素子から熱移送された熱の排熱を実現する。この場合、上記作動流体は、撮像素子１０ａの発熱温度の飽和温度に対する最適な沸点のものに設定することが好ましい。   The metal pipe 69 is connected to, for example, a flexible synthetic resin pipe 72 that constitutes a circulation path via a connection pipe 692. The flexible synthetic resin pipe 72 is connected in order to a condenser and a piezoelectric pump arranged in a chassis (not shown) on the equipment body side, and pure water, alcohol, phase change is performed by the heat pipe with the wick or the piezoelectric pump. A working fluid such as a medium is circulated and supplied to the metal tube 69 and the condenser to realize exhaust heat of the heat transferred from the image sensor. In this case, the working fluid is preferably set to have an optimum boiling point with respect to the saturation temperature of the heat generation temperature of the image sensor 10a.

また、上記第１の放熱部材６７は、熱結合部６７２が設けられ、この熱結合部６７２は、上記ＦＰＣ基板１３に設けられた挿通孔１３２に挿通されて上記機器筐体６６に熱的に結合される。これにより、第１の放熱部材６７は、撮像素子１０ａを含むＦＰＣ基板１３より熱移送された熱を、その熱結合部６７２を介して機器筐体６６に熱移送して排熱することができる。   The first heat radiating member 67 is provided with a thermal coupling portion 672, and the thermal coupling portion 672 is inserted into the insertion hole 132 provided in the FPC board 13 and thermally connected to the device housing 66. Combined. As a result, the first heat radiating member 67 can exhaust the heat transferred from the FPC board 13 including the imaging element 10a to the device housing 66 through the heat coupling portion 672 and exhaust the heat. .

なお、上記第１及び第２の放熱部材６７，６８、金属板７０は、例えば同一材料で形成される。   The first and second heat radiation members 67 and 68 and the metal plate 70 are made of the same material, for example.

また、図８に示す撮像素子モジュール１ｄ（図７と同様に手振れ補正機能を有する一眼レフレックスデジタルカメラに適用）は、上記ベアチップタイプの撮像素子１０ａを用いて構成したもので、ＦＰＣ基板１３には、開口部１３１が撮像素子１０ａの絶縁シート１０１ａに対向して設けられ、この開口部１３１には、例えば上記放射率が０．１以下の処理面を有した熱反射部材１１が接合される。   An image sensor module 1d shown in FIG. 8 (applied to a single-lens reflex digital camera having a camera shake correction function as in FIG. 7) is configured using the bare-chip type image sensor 10a. The opening 131 is provided to face the insulating sheet 101a of the image pickup device 10a, and the heat reflecting member 11 having, for example, a processing surface having an emissivity of 0.1 or less is joined to the opening 131. .

ＦＰＣ基板１３は、銅材等の金属材料製の基板保持部を構成する第１の放熱部材７３に載置されて熱的に結合され、この第１の放熱部材７３により保持された状態で、該第１放熱部材７３を包み込むように折返されて、例えば銅等の金属材料製の押え部材７４に沿うように係合されて位置決めされる。この押え部材７４には、突部７４１が形成され、この突部７４１が上記ＦＰＣ基板１３に挿通されて上記第１の放熱部材７３に対して面接触され、熱的に結合される。   The FPC board 13 is placed on and thermally coupled to the first heat radiating member 73 that constitutes the board holding portion made of a metal material such as copper, and is held by the first heat radiating member 73. The first heat dissipating member 73 is folded back so as to be engaged and positioned so as to follow a presser member 74 made of a metal material such as copper. A protrusion 741 is formed on the pressing member 74, and the protrusion 741 is inserted into the FPC board 13 and brought into surface contact with the first heat radiating member 73 to be thermally coupled.

第１の放熱部材７３には、例えば上記ＦＰＣ基板１３の開口部１３１が収容可能な筒状に形成され、その内壁部には、案内溝７３１が設けられる。そして、この案内溝７３１には、金属材料製の第２の放熱部材７５及び第３の放熱部材７６が、例えば上記シリコンゲル、グラファイトシート等で構成される熱伝導材１９を挟んで接合された状態で、移動自在に収容される。   The first heat radiating member 73 is formed in a cylindrical shape that can accommodate the opening 131 of the FPC board 13, for example, and a guide groove 731 is provided on the inner wall thereof. Then, the second heat radiating member 75 and the third heat radiating member 76 made of a metal material are joined to the guide groove 731 with the heat conductive material 19 made of, for example, the above-described silicon gel, graphite sheet or the like interposed therebetween. In a state, it is accommodated movably.

これら第２及び第３の放熱部材７５，７６には、それぞれ対向する一方面に放熱フィン７５１，７６１が設けられ、この各放熱フィン７５１，７６１が熱伝導材１９を介して熱的に結合されている。そして、これら第２及び第３の放熱部材７５，７６は、例えばその第３の放熱部材７６の一部が、上記第１の放熱部材７３に螺子部材７７を用いて螺着されて該第１の放熱部材７３内に収容配置される。なお、第２の放熱部材７５上の熱本社部材１１と対向する面には、高放熱シート７５ａが接合されている。   The second and third heat radiating members 75 and 76 are provided with heat radiating fins 751 and 761 on one side facing each other, and the heat radiating fins 751 and 761 are thermally coupled via the heat conducting material 19. ing. The second and third heat radiating members 75, 76 are, for example, a part of the third heat radiating member 76 is screwed to the first heat radiating member 73 using a screw member 77. The heat radiating member 73 is accommodated and disposed. A high heat dissipation sheet 75 a is joined to the surface of the second heat dissipation member 75 facing the thermal head office member 11.

また、上記ＦＰＣ基板１３には、例えば温度センサ７８が搭載され、この温度センサ７８で上記第１の放熱部材７３内の温度が検出される。この温度センサ７８は、第１の放熱部材７３内の周囲温度を検出して図示しない制御部に出力する。この制御部（図示せず）は、温度センサ７８の検出信号に基づいて、その温度が所定時間以上、所定の温度以上であるのを検出した状態で、危険信号を生成して図示しない表示部に動作停止等の危険を表示したりする。   Further, for example, a temperature sensor 78 is mounted on the FPC board 13, and the temperature in the first heat radiating member 73 is detected by the temperature sensor 78. The temperature sensor 78 detects the ambient temperature in the first heat radiating member 73 and outputs it to a control unit (not shown). This control unit (not shown) generates a danger signal based on the detection signal of the temperature sensor 78 and detects that the temperature is higher than the predetermined temperature for a predetermined time or more, and displays a display unit (not shown). Display a danger such as operation stop.

さらに、上記撮像素子１０ａには、例えばその撮像面の周囲部に、例えば周知の手振れ防止機構を構成する移動枠７９に支持された押え部材８０が係合され、その面方向が一定に維持された状態で、移動枠７９を介して二次元的に移動されて、いわゆる手振れ補正が可能に構成される。この移動枠７９は、例えば図示しない結合手段を介して上記押え部材７４に熱的に結合され、その駆動に伴う熱が結合手段を介して上記押え部材７４、第１の放熱部材７３に熱移送されて排熱される。   Furthermore, for example, a pressing member 80 supported by a moving frame 79 constituting a known camera shake prevention mechanism is engaged with the imaging element 10a, for example, around the imaging surface, and the surface direction is maintained constant. In this state, the image is moved two-dimensionally via the moving frame 79, and so-called camera shake correction is possible. The moving frame 79 is thermally coupled to the pressing member 74 through, for example, a coupling means (not shown), and heat accompanying driving thereof is transferred to the pressing member 74 and the first heat radiating member 73 through the coupling means. Is exhausted.

ここで、図８中、７６２は、例えば上記第３の放熱部材７６に設けられ、上記第２の放熱部材７５と熱伝導材１９を介在させて接合する際の熱伝導材１９の内部空気を排出するための空気抜き孔である。   Here, in FIG. 8, 762 is provided in the third heat radiating member 76, for example, and the internal air of the heat conductive material 19 when the second heat radiating member 75 and the heat conductive material 19 are joined. It is an air vent hole for discharging.

この実施の形態においては、上記第２の放熱部材７５の他方面に、例えば上述した赤外線の反射率が低く熱吸収性を高めた処理面を有した高放熱シート１８を、上記熱反射部材１１に対向して配置することで、さらに良好な熱移送特性を得ることが期待できる。   In this embodiment, the heat radiating member 11 is provided with the high heat radiating sheet 18 having, for example, the above-described treatment surface with low infrared reflectance and high heat absorption on the other surface of the second heat radiating member 75. It can be expected that better heat transfer characteristics can be obtained by disposing them facing each other.

また、図９に示す撮像素子モジュール１ｅは、上記図８に示す実施の形態において、第１及び第２の放熱部材７５，７６に周知のウィックタイプのヒートパイプ８１を熱的に結合させて組付けて、このヒートパイプ８１で上記ＦＰＣ基板１３の開口部１３１を通して上記撮像素子１０ａの絶縁シート１０１ａに熱的に結合された熱反射部材１１からの放射された赤外線を受光するように構成したものである。そこで、図９の説明においては、上記図８と同一部分について同一符号を付して、その詳細な説明を省略する。   Further, in the embodiment shown in FIG. 8, the imaging element module 1e shown in FIG. 9 is assembled by thermally connecting a well-known wick type heat pipe 81 to the first and second heat radiating members 75 and 76. In addition, the heat pipe 81 is configured to receive infrared rays emitted from the heat reflecting member 11 thermally coupled to the insulating sheet 101a of the imaging element 10a through the opening 131 of the FPC board 13. It is. Therefore, in the description of FIG. 9, the same parts as those in FIG. 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

上記ヒートパイプ８１は、作動流体が内蔵された循環路で形成され、その中間部に、例えば特開２００３−２８０６８号公報等に開示されている周知の圧電型ポンプ８２が、図９の要部を拡大して示した一部断面図である図１０に示すように、封止弁８３を介在して配管接続される。この圧電型ポンプ８２は、例えば上記ＦＰＣ基板１３に搭載され、封止弁８３が図示しない制御部を介して駆動制御されると、作動流体が循環供給され、上記熱反射部材１１から放射される熱を受熱して第１及び第２の放熱部材７５，７６に熱移送して放熱を実現する。   The heat pipe 81 is formed of a circulation path in which a working fluid is incorporated, and a known piezoelectric pump 82 disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-28068 is provided in the middle part of FIG. As shown in FIG. 10 which is a partial cross-sectional view showing an enlarged view, the pipe connection is made with a sealing valve 83 interposed therebetween. The piezoelectric pump 82 is mounted on, for example, the FPC board 13. When the sealing valve 83 is driven and controlled via a control unit (not shown), the working fluid is circulated and supplied and radiated from the heat reflecting member 11. Heat is received and transferred to the first and second heat radiating members 75 and 76 to realize heat radiation.

ところで、上記撮像素子モジュール１ｅは、電子カメラに用いた場合、使用者が撮影モードを切替えたり、電源動作開始時において、撮像素子１０ａ近傍に温度が所定値以上となると、図示しない制御部が上記圧電型ポンプ８２を駆動するように構成される。この圧電型ポンプ８２が駆動されると、作動流体が循環路に循環され、第２の放熱部材７５、熱伝導材１９、第３の放熱部材７６に熱移送され、撮像素子１０ａ近傍の温度上昇が抑制される。   By the way, when the image sensor module 1e is used in an electronic camera, when the user switches the shooting mode or the temperature of the image sensor 10a exceeds a predetermined value at the start of power supply operation, a control unit (not shown) The piezoelectric pump 82 is configured to be driven. When this piezoelectric pump 82 is driven, the working fluid is circulated through the circulation path, and is transferred to the second heat radiating member 75, the heat conducting material 19, and the third heat radiating member 76, and the temperature rises in the vicinity of the image sensor 10a. Is suppressed.

なお、上記ヒートパイプ８１のループ形状としては、例えば図中左側となる中。間部を湾曲状として、両端部を平面状に設定してもよい。これによると、空間的に余裕が取れることで、例えば移動枠７９の移動をガイドするガイド軸に組付ける軸受等の組付けの簡素化を図ることが可能となる。   The loop shape of the heat pipe 81 is, for example, the left side in the figure. The intermediate portion may be curved and both end portions may be set to be flat. According to this, it is possible to simplify the assembly of a bearing or the like that is assembled to a guide shaft that guides the movement of the moving frame 79, for example, by providing a space.

この実施の形態においては、ヒートパイプ８１の熱反射部材１１と対向する位置に高放熱シート１８を設けると、さらに良好な効果が期待される。   In this embodiment, if the high heat dissipation sheet 18 is provided at a position facing the heat reflecting member 11 of the heat pipe 81, a further better effect is expected.

また、図１１に示す撮像素子モジュール１ｆは、上記ベアチップタイプの撮像素子１０ａを用いて構成したもので、ＦＰＣ基板１３には、撮像素子１０ａが、その絶縁シート１０１ａが基板面に対向して搭載される。このＦＰＣ基板１３には、開口部１３１が絶縁シート１０１ａに対向して設けられ、この絶縁シート１０１ａを含む周囲部が銅材等の金属材料製の凹状の第１の放熱部材８４の外面壁に積重されて熱的に結合される。   An imaging element module 1f shown in FIG. 11 is configured by using the bare chip type imaging element 10a. The imaging element 10a is mounted on the FPC board 13 with its insulating sheet 101a facing the substrate surface. Is done. An opening 131 is provided in the FPC board 13 so as to face the insulating sheet 101a, and a peripheral portion including the insulating sheet 101a is formed on the outer wall of the concave first heat radiating member 84 made of a metal material such as a copper material. Stacked and thermally coupled.

第１の放熱部材８４には、例えば同材で形成される凹状の第２の放熱部材８５が、互いの開口側を対向させて、その内部に上記熱伝導性の優れにシリコンゲル、グラファイトシート等の熱伝導材１９を収容されて接合される。これら第１及び第２の放熱部材８４，８５には、その内壁に放熱フィン８４１，８５１が設けられ、この放熱フィン８４１，８５１が、上記熱伝導材１９内に埋設された状態で接合されている。   The first heat radiating member 84 includes, for example, a concave second heat radiating member 85 formed of the same material, with the opening sides facing each other, and the silicon gel and graphite sheet having excellent thermal conductivity therein. The thermal conductive material 19 such as the like is accommodated and joined. The first and second heat radiating members 84 and 85 are provided with heat radiating fins 841 and 851 on their inner walls, and the heat radiating fins 841 and 851 are joined in a state of being embedded in the heat conducting material 19. Yes.

第１の放熱部材８４は、支持枠部材８６に支持され、この支持枠部材８６を介して例えば図示しない機器筐体に熱的に結合される。この支持枠部材８６には、ローパスフィルタ８７及びシャッタ８８が上記撮像素子１０ａの素子面に対向して順に組付け配置される。さらに、撮像素子１０ａとローパスフィルタ８７との間には、ローパスフィルタ８７の表面への塵埃の侵入を防止するために環状に形成されたゴム部材８７ａが介在される。   The first heat radiating member 84 is supported by a support frame member 86 and is thermally coupled to, for example, an equipment housing (not shown) via the support frame member 86. In this support frame member 86, a low-pass filter 87 and a shutter 88 are assembled and arranged in order facing the element surface of the imaging element 10a. Further, an annular rubber member 87 a is interposed between the image sensor 10 a and the low-pass filter 87 in order to prevent dust from entering the surface of the low-pass filter 87.

また、上記第２の放熱部材８５には、上記ＦＰＣ基板１３に搭載された、例えばＣＰＵ（中央演算処理装置）等の電子部品８９が支持板９０を介して熱的に結合される。これにより、第２の放熱部材８５には、支持板９０を介してＦＰＣ基板１３に搭載された電子部品８９の駆動に伴う熱が熱移送される。   Further, an electronic component 89 such as a CPU (Central Processing Unit) mounted on the FPC board 13 is thermally coupled to the second heat radiating member 85 via a support plate 90. As a result, heat accompanying the driving of the electronic component 89 mounted on the FPC board 13 is transferred to the second heat radiating member 85 via the support plate 90.

ここで、第１及び第２の放熱部材８４，８５は、撮像素子１０ａ及び電子部品８９から熱移送されると、その各熱が各放熱フィン８４１，８５１及び熱伝導材１９を経由して効率よく他方に熱伝導されて全体的に均一的な温度に設定され、その熱を上記支持枠部材８６を介して高効率に放熱することが可能となる。   Here, when the first and second heat radiating members 84 and 85 are thermally transferred from the imaging device 10 a and the electronic component 89, their heats are efficiently transmitted via the heat radiating fins 841 and 851 and the heat conducting material 19. The heat is often conducted to the other and set to a uniform temperature as a whole, and the heat can be radiated with high efficiency through the support frame member 86.

上記図１１に示す撮像素子モジュール１ｆは、携帯型電子機器を構成する、例えば図１２に示す一眼レフ用電子カメラのカメラ筐体であるカメラ本体９１に内装されて使用に供される。   The imaging device module 1f shown in FIG. 11 is used for use in a camera body 91 that is a camera housing of a single-lens reflex electronic camera shown in FIG.

即ち、一眼レフ用電子カメラは、カメラ本体９１に撮像光学系、ファインダー光学系、焦点検出光学系が配置される。このうち撮像光学系は、光路の順に撮影レンズ群９２ａ、ハーフミラー９２ｂ、反射ミラー９２ｃで構成される。   That is, in the single-lens reflex electronic camera, an imaging optical system, a finder optical system, and a focus detection optical system are arranged in the camera body 91. Among these, the imaging optical system includes a photographing lens group 92a, a half mirror 92b, and a reflecting mirror 92c in the order of the optical path.

この撮影レンズ群９２ａは、マウントを介してカメラ本体９１に着脱自在に組付けられる。ハーフミラー９２ｂは、撮影レンズ群９２ａからの光路を上記撮像素子モジュール１ｆの方向とファインダー光学系とに分割するように構成される。また、このハーフミラー９２ｂは、上記シャッタ８８と連動して持ち上がるクイックリターンミラーで構成されている。   The photographic lens group 92a is detachably attached to the camera body 91 via a mount. The half mirror 92b is configured to divide the optical path from the photographing lens group 92a into the direction of the imaging element module 1f and the finder optical system. The half mirror 92b is composed of a quick return mirror that lifts in conjunction with the shutter 88.

反射ミラー９２ｃは、撮影レンズ群９２ａからの光を焦点検出光学系に導くように構成されている。また、反射ミラー９２ｃは、ハーフミラー９２ｂと連動して持ち上がるように構成され、持ち上げられたときに光路から外れて撮影レンズ群９２ａからの光が撮像素子モジュール１ｆに導かれて、撮影レンズ群９２ａからの光路が撮像素子モジュール方向と焦点検出光学系とに切替え設定される。   The reflection mirror 92c is configured to guide the light from the photographing lens group 92a to the focus detection optical system. The reflection mirror 92c is configured to be lifted in conjunction with the half mirror 92b. When the reflection mirror 92c is lifted, the reflection mirror 92c is off the optical path, and the light from the photographing lens group 92a is guided to the imaging element module 1f, so that the photographing lens group 92a. Is switched to the image sensor module direction and the focus detection optical system.

焦点検出光学系は、撮影レンズ群９２ａの結像面と等価な予定結像面９２ｄ近傍に配置されたコンデンサーレンズ９３ａと、このコンデンサーレンズ９３ａからの光を折曲げてカメラ本体９１内でコンパクトに収めるための反射ミラー９３ｂと、縦横方向にそれぞれ一対の開口絞りを持つ開口絞り群９３ｃと、再結像レンズ９３ｄが開口絞り９３ｃに対応して一体形成された再結像光学系９３ｅとの組み合わせと、光電変換素子列９３ｆとで構成されている。   The focus detection optical system is compact in the camera body 91 by bending a condenser lens 93a disposed in the vicinity of a planned imaging plane 92d equivalent to the imaging plane of the photographic lens group 92a, and bending light from the condenser lens 93a. A combination of a reflecting mirror 93b for accommodating, an aperture stop group 93c having a pair of aperture stops in the vertical and horizontal directions, and a re-imaging optical system 93e in which a re-imaging lens 93d is integrally formed corresponding to the aperture stop 93c. And a photoelectric conversion element array 93f.

また、一対の開口絞り９３ｃと対応する一対の再結像レンズ９３ｄとの組み合わせにおいて、それぞれの開口絞り９３ｃの中心及びそれに対応する再結像レンズ９３ｄは、撮影レンズ群９２ａの光軸から偏心している。ファインダー光学系は、ハーフミラー９２ｂで反射された方向の光路上において撮影レンズ群９２ａの結像面と等価な予定結像面に配置されたスクリーン９４ａと、ペンタダハプリズム９４ｂと、接眼レンズ９４ｃとで構成されている。   In the combination of the pair of aperture stops 93c and the corresponding pair of re-imaging lenses 93d, the center of each aperture stop 93c and the corresponding re-imaging lens 93d are decentered from the optical axis of the photographing lens group 92a. Yes. The finder optical system includes a screen 94a, a penta roof prism 94b, and an eyepiece lens 94c that are arranged on a planned imaging surface equivalent to the imaging surface of the photographing lens group 92a on the optical path in the direction reflected by the half mirror 92b. It is configured.

さらに、上記ローパスフィルタ８７とシャッタ８８との間には、例えば上述した図４に示す防塵機構５４が組付け配置される。即ち、上記取付け部材５４２は、上記支持枠部材８６に螺子部材５４５を用いて螺着されて上記ローパスフィルタ８７とシャッタ８８との間に収容配置される。これにより、透明ガラス基板５４６は、その加振部材５４９の駆動に連動して振動が伝達されて、その振動により表面に付着した塵等を除去して、ローパスフィルタ８７への侵入を阻止する。   Furthermore, between the low-pass filter 87 and the shutter 88, for example, the dustproof mechanism 54 shown in FIG. That is, the attachment member 542 is screwed to the support frame member 86 using a screw member 545 and is accommodated and disposed between the low-pass filter 87 and the shutter 88. Thereby, the vibration is transmitted to the transparent glass substrate 546 in conjunction with the driving of the vibration member 549, and dust or the like attached to the surface is removed by the vibration to prevent entry into the low-pass filter 87.

なお、上記実施の形態では、撮像素子モジュール１，１ａ〜１ｆをカメラユニットや一眼レフ用電子カメラに組み込んだ場合について、代表して説明したが、これに限ることなく、その他、例えば携帯電話等の携帯端末を含む携帯用電子機器に搭載するように構成しても、同様に有効な効果を期待することができる。   In the above-described embodiment, the case where the image sensor modules 1 and 1a to 1f are incorporated in a camera unit or a single-lens reflex electronic camera has been described as a representative example. Even if it is configured to be mounted on a portable electronic device including the portable terminal, the same effective effect can be expected.

（第２の実施の形態）
次いで、図１３を参照して、この発明の第２の実施の形態について説明する。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG.

図１３は、この発明の第２の実施の形態のミラー／撮像素子ユニット周りの構成例を示す水平断面図である。   FIG. 13 is a horizontal sectional view showing a configuration example around the mirror / image sensor unit according to the second embodiment of the present invention.

この第２の実施の形態のミラー／撮像素子ユニット３００は、一眼レフレックスデジタルカメラに適用され、カメラボディ（図示せず）のフレーム本体に支持されるユニットであって、撮影レンズ（図示せず）が交換自在に装着可能なボディ側マウント３２２と、このボディ側マウント３２２が装着される前フレーム３２０と、ミラーボックス３０１と、このミラーボックス３０１内に収納される回動自在なクイックリターンミラー３０２と、撮像素子１０と、サイドフレーム３３０Ｌ、３３０Ｒの背面に固着される放熱板としての後フレーム３４０とからなる。   The mirror / imaging device unit 300 according to the second embodiment is a unit that is applied to a single-lens reflex digital camera and supported by a frame body of a camera body (not shown), and is a photographic lens (not shown). ) Which can be exchangeably mounted, a front frame 320 to which the body mount 322 is mounted, a mirror box 301, and a rotatable quick return mirror 302 housed in the mirror box 301. And the imaging device 10 and a rear frame 340 as a heat radiating plate fixed to the back surfaces of the side frames 330L and 330R.

前フレーム３２０は、中央開口部を有し、その前面側にボディ側マウント３２２が固着され、後面側中央にミラーボックス３０１が固着され、後面部がフレーム本体のサイドフレーム３３０Ｌ、３３０Ｒに支持される。   The front frame 320 has a central opening, the body side mount 322 is fixed to the front side thereof, the mirror box 301 is fixed to the center of the rear side, and the rear side is supported by the side frames 330L and 330R of the frame body. .

後フレーム３４０は、ステンレス金属板またはアルミニウム板からなり、ミラーボックス３０１の後端部を跨いで配され、サイドフレーム３３０Ｌ、３３０Ｒに対して支柱３３８ｃ、３３８ａを挟んで固着されている。この支柱３３８ａ、３３８ｃは、撮像素子１０で発生した熱が後フレーム３４０からサイドフレーム３３０Ｌ、３３０Ｒへの熱伝達を遮断するための断熱部材となる。また、後フレーム３４０には、放熱効果を向上させるために、後述する熱反射部材１１と対向した位置に高放熱シート１８との放熱用フィン３４０ａが外方に配されている。そして、後フレーム３４０に形成された多数の挿通孔のうちの所定の挿通孔を利用して、サイドフレーム３３０Ｌ、３３０Ｒに後フレーム３４０がねじ止めされている。   The rear frame 340 is made of a stainless steel plate or an aluminum plate, and is disposed across the rear end portion of the mirror box 301, and is fixed to the side frames 330L and 330R with the columns 338c and 338a interposed therebetween. The support columns 338a and 338c serve as heat insulating members for blocking heat generated from the image sensor 10 from heat transfer from the rear frame 340 to the side frames 330L and 330R. Further, in order to improve the heat dissipation effect, the rear frame 340 is provided with heat-dissipating fins 340a with the high heat-dissipating sheet 18 at positions facing the heat reflecting member 11 described later. Then, the rear frame 340 is screwed to the side frames 330L and 330R using a predetermined insertion hole among a large number of insertion holes formed in the rear frame 340.

上述のように、前フレーム３２０と、サイドフレーム３３０Ｌ、３３０Ｒと、後フレーム３４０とが順次固定され、これら３つの部材が一体化されて、カメラの外形形状に合わせた中空のボックス形状のフレーム本体が構成される。   As described above, the front frame 320, the side frames 330L and 330R, and the rear frame 340 are sequentially fixed, and these three members are integrated to form a hollow box-shaped frame body that matches the outer shape of the camera. Is configured.

なお、右側のサイドフレーム３３０Ｒは、左側のサイドフレーム３３０Ｌよりも薄く形成されているため、その厚さ不足を補うように断熱部材を用いた支柱３３８ａがサイドフレーム３３０Ｒの背面から後方に延びており、支柱３３８ａおよびサイドフレーム３３０Ｌに立設された支柱３３８ｃの先端のねじ孔にビスが螺合され、後フレーム３４０が固着される。支柱３３８ａと平行に延びる長い支柱３３８ｂは、後フレーム３４０の背後の回路基板３７０をサイドフレーム３３０Ｌの先端に形成された鍔部に挿入してサイドフレーム３３０Ｒに固定するために使用される。   Since the right side frame 330R is formed thinner than the left side frame 330L, a column 338a using a heat insulating member extends rearward from the back surface of the side frame 330R so as to compensate for the lack of thickness. The screws are screwed into the screw holes at the tips of the columns 338a and the columns 338c provided upright on the side frame 330L, and the rear frame 340 is fixed. The long support column 338b extending in parallel with the support column 338a is used to insert the circuit board 370 behind the rear frame 340 into the flange formed at the tip of the side frame 330L and fix it to the side frame 330R.

ミラーボックス３０１は、中央開口部を有したボックス形状に形成され、前面フランジ部にて前フレーム３２０に取付けられる。中央開口部の内部に回動可能なクイックリターンミラー３０２が配され、開口部上方にスクリーン（図示せず）が配置されている。また、後方部に撮像素子支持板３８０を介して撮像素子１０が固着される。この撮像素子１０の近傍には、撮像素子１０の近傍の温度を検出する温度センサ（図示せず）が配されている。   The mirror box 301 is formed in a box shape having a central opening, and is attached to the front frame 320 at the front flange portion. A rotatable quick return mirror 302 is disposed inside the central opening, and a screen (not shown) is disposed above the opening. In addition, the image sensor 10 is fixed to the rear portion via the image sensor support plate 380. A temperature sensor (not shown) that detects the temperature in the vicinity of the image sensor 10 is disposed in the vicinity of the image sensor 10.

また、撮像素子１０は、その背面の絶縁シート１０１に熱反射部材１８が接合されている。撮像素子支持板３８０は、挿通孔に挿通するビスをミラーボックス３０１の背面のねじ孔に螺着することによりミラーボックス３０１に取付けられている。   In addition, the heat reflecting member 18 is bonded to the insulating sheet 101 on the back surface of the imaging element 10. The image sensor support plate 380 is attached to the mirror box 301 by screwing a screw inserted through the insertion hole into a screw hole on the back surface of the mirror box 301.

また、ストッパとしての位置決めピンがミラーボックス３０１の背面に形成され、撮像素子支持板３８０の挿通孔、後フレーム３４０の挿通孔に挿通されている。後フレーム３４０の位置決め孔に対しては、十分な隙間を残して位置決めピンが挿通され、いわゆる、スキマハメの状態にあり、ミラーボックス３０１は、後フレーム３４０に直接固定されていない。位置決めピンと後フレーム３４０の位置決め孔との嵌合は、ミラーボックス３０１の位置決めピンの直径寸法誤差とミラーボックス３０１におけるその位置寸法誤差および後フレーム３４０の位置決め孔の外径寸法誤差と後フレーム３４０の位置決め孔の位置寸法誤差を考慮してもなお、位置決めピンと位置決め孔との間に隙間があるように設定されている。そして、フレーム本体が大きく変形すれば、この片側隙間が詰まって、それ以上の変形を防ぐことができ、大きな変形が防止される。   In addition, a positioning pin as a stopper is formed on the back surface of the mirror box 301 and is inserted through the insertion hole of the image sensor support plate 380 and the insertion hole of the rear frame 340. A positioning pin is inserted into the positioning hole of the rear frame 340 while leaving a sufficient gap, and is in a so-called skimming state, and the mirror box 301 is not directly fixed to the rear frame 340. The positioning pin and the positioning hole of the rear frame 340 are fitted to each other with respect to the diameter dimension error of the positioning pin of the mirror box 301, the positional dimension error of the mirror box 301, the outer diameter error of the positioning hole of the rear frame 340, and the rear frame 340. Even when the positional dimension error of the positioning hole is taken into consideration, the gap is set between the positioning pin and the positioning hole. And if a frame main body deform | transforms greatly, this one-side clearance will be clogged and the further deformation | transformation can be prevented and a big deformation | transformation is prevented.

撮像素子３６０は、ミラーボックス３０１の背面開口に配され、撮像素子支持板３８０の前面に接着固定され、フレーム本体に囲まれるように配置されている。また、撮像素子１０は、その上下に、光軸Ｏ方向に延出した一対の複数のリード（接続端子）３６２を有する。撮像素子１０のリード３６２は、撮像素子支持板３８０の長孔（逃げ孔）、後フレーム３４０の円形の逃げ孔、回路基板３７０の長孔（逃げ孔）を遊嵌状態で挿通し、さらに、回路基板３７０上のフレキシブルプリント基板３９０に挿着されて、撮像素子１０と回路基板３７０とが一対のフレキシブルプリント基板３９０によって電気的に接続されている。なお、回路基板３７０は、サイドフレーム３３０Ｌに設けられた爪部３３０ａに挿入し、支柱３３８ｂに支持されて、小ネジ３３９で固定する。そして、一対のフレキシブルプリント基板３９０は、いずれも、撮像素子３６０のリード３６２が挿入可能な周囲に導電パターンを有する複数の挿入孔を有すると共に、導電パターンと電気的に接続されていて回路基板３７０上の接続パターンと接続される複数の接続パターンを有している。   The image sensor 360 is disposed in the rear opening of the mirror box 301, is fixed to the front surface of the image sensor support plate 380, and is disposed so as to be surrounded by the frame body. In addition, the imaging element 10 includes a plurality of pairs of leads (connection terminals) 362 extending in the direction of the optical axis O on the upper and lower sides thereof. The lead 362 of the image sensor 10 is inserted through the long hole (relief hole) of the image sensor support plate 380, the circular relief hole of the rear frame 340, and the long hole (relief hole) of the circuit board 370 in a loose fit state, The imaging element 10 and the circuit board 370 are electrically connected by a pair of flexible printed boards 390 by being inserted into a flexible printed board 390 on the circuit board 370. The circuit board 370 is inserted into the claw portion 330a provided on the side frame 330L, supported by the support column 338b, and fixed with the machine screw 339. Each of the pair of flexible printed boards 390 includes a plurality of insertion holes having conductive patterns around the leads 362 of the image sensor 360 that can be inserted, and is electrically connected to the conductive patterns so as to be connected to the circuit board 370. A plurality of connection patterns are connected to the upper connection pattern.

なお、本発明は、上述した実施の形態に限らず、本発明の趣旨を逸脱しない範囲であれば、種々の変形が可能である。例えば、上述の第２及び第３の実施の形態は、電子カメラとしてレンズ交換可能な一眼レフレックス式デジタルカメラへの適用例で説明したが、このようなカメラに限らず、例えばコンパクト型のデジタルカメラ等であっても同様に適用することができる。   The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the second and third embodiments described above have been described with reference to an application example to a single-lens reflex digital camera in which a lens can be exchanged as an electronic camera. However, the present invention is not limited to such a camera. The same applies to a camera or the like.

よって、この発明は、上記実施の形態に限ることなく、その他、実施段階ではその要旨を逸脱しない範囲で種々の変形を実施し得ることが可能である。さらに、上記実施の形態には、種々の段階の発明が含まれており、開示される複数の構成要件における適宜な組合せにより種々の発明が抽出され得る。   Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

例えば実施の形態に示される全構成要件から幾つかの構成要件が削除されても、発明が解決しようとする課題の欄で述べた課題が解決でき、発明の効果で述べられている効果が得られる場合には、この構成要件が削除された構成が発明として抽出され得る。   For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

（ａ）はこの発明の第１の実施の形態に係る撮像素子モジュールを示した断面図、（ｂ）はこの発明の第１の実施の形態に係る撮像素子モジュールの他の構成例を示した断面図である。(A) is sectional drawing which showed the image sensor module which concerns on 1st Embodiment of this invention, (b) showed the other structural example of the image sensor module which concerns on 1st Embodiment of this invention. It is sectional drawing. 図１（ａ）を撮像素子の受光面側から見た状態を示した平面図である。It is the top view which showed the state which looked at Fig.1 (a) from the light-receiving surface side of the image pick-up element. 図１（ｂ）の撮像素子モジュールを用いたカメラユニットを説明するために示した断面図である。It is sectional drawing shown in order to demonstrate the camera unit using the image pick-up element module of FIG.1 (b). 図３のカメラユニットに組み込まれる防塵機構を取出して示した断面図である。It is sectional drawing which took out and showed the dust-proof mechanism integrated in the camera unit of FIG. この発明の第１の実施の形態に係る撮像素子モジュールの他の例を示した断面図である。It is sectional drawing which showed the other example of the image pick-up element module which concerns on 1st Embodiment of this invention. この発明の第１の実施の形態に係る撮像素子モジュールの他の例を示した断面図である。It is sectional drawing which showed the other example of the image pick-up element module which concerns on 1st Embodiment of this invention. この発明の第１の実施の形態に係る撮像素子モジュールの他の例を示した断面図である。It is sectional drawing which showed the other example of the image pick-up element module which concerns on 1st Embodiment of this invention. この発明の第１の実施の形態に係る撮像素子モジュールの他の例を示した断面図である。It is sectional drawing which showed the other example of the image pick-up element module which concerns on 1st Embodiment of this invention. この発明の第１の実施の形態に係る撮像素子モジュールの他の例を示した断面図である。It is sectional drawing which showed the other example of the image pick-up element module which concerns on 1st Embodiment of this invention. 図９の要部を拡大して示した一部断面図である。FIG. 10 is a partial cross-sectional view showing an enlarged main part of FIG. 9. この発明の第１の実施の形態の係る撮像素子モジュールのさらに他の例を示した断面図である。It is sectional drawing which showed the further another example of the image pick-up element module which concerns on 1st Embodiment of this invention. この発明の第１の実施の形態に係る撮像素子モジュールを用いた一眼レフ用電子カメラの概略構成を示した構成図である。1 is a configuration diagram showing a schematic configuration of a single-lens reflex electronic camera using an image sensor module according to a first embodiment of the present invention. この発明の第２の実施の形態のミラー／撮像素子ユニット周りの構成例を示す水平断面図である。It is a horizontal sectional view showing a configuration example around a mirror / image sensor unit according to a second embodiment of the present invention.

符号の説明Explanation of symbols

１，１1 ，１ａ，１ｂ，１ｃ，１ｄ，１ｅ，１ｆ…撮像素子モジュール、１０，１０ａ…撮像素子、１０１，１０１ａ…絶縁シート、１１…熱反射部材、１２…パッケージ本体、１２１…開口部、１２２…リード端子、１３…ＦＰＣ基板、１３１…凹部、１３２…基板端部、１３４…切り欠き部、１４…ボンディングワイヤ、１５…接着剤、１６…保護ガラス、１７…第１の放熱部材、１７０…突起部、１７１…突部、１７２…凹部、１７３…筐体結合部、１７６…受熱部、１８…高放熱シート、１８０…開口部、１９…熱伝導材、２０…第２の放熱部材、２０ａ…放熱シート、２００…突部、２１…機器筐体、５０…レンズユニット、５４…防塵機構、６０…放熱部材、６０１…第１の熱結合部、６０２…放熱フィン、６０３…第２の熱結合部、６０４…中空部、６２…第１の放熱部材、６２１…開口部、６２２…突起部、６３…第２の放熱部材、６３１…排気孔、６３２…放熱フィン、６４…螺子部材、６５…第３の放熱部材、６５１…放熱フィン、６５２…排気孔、６６…機器筐体、６７…第１の放熱部材、６７１…開口部、６７２…熱結合部、６８…第２の放熱部材、６８１…案内溝、６９…金属管、６９２…接続管、７０…金属板、７０１…空気抜き孔、７１…調整螺子部材、７２…可撓性合成樹脂管、７３…第１の放熱部材、７３１…案内溝、７４…押え部材、７４１…突部、７５…第２の放熱部材、７６…第３の放熱部材、７５１，７６１…放熱フィン、７６２…空気抜き孔、７７…螺子部材、７８…温度センサ、７９…移動枠、８０…押え部材、８１…ヒートパイプ、８２…圧電ポンプ、８３…封止弁、８４…第１の放熱部材、８５…第２の放熱部材、８４１，８５１…放熱部材、８６…支持枠部材、８７…ローパスフィルタ、８８…シャッタ、８９…電子部品、９０…支持板、９１…カメラ本体。 1, 1 1 , 1 a , 1 b, 1 c, 1 d, 1 e, 1 f... Imaging element module, 10, 10 a... Imaging element, 101, 101 a .. Insulating sheet, 11. 122 ... Lead terminal, 13 ... FPC board, 131 ... Recess, 132 ... Substrate edge, 134 ... Notch, 14 ... Bonding wire, 15 ... Adhesive, 16 ... Protective glass, 17 ... First heat dissipation member, 170 ... Projection, 171 ... Projection, 172 ... Recess, 173 ... Housing coupling part, 176 ... Heat receiving part, 18 ... High heat dissipation sheet, 180 ... Opening part, 19 ... Heat conduction material, 20 ... Second heat dissipation member , 20a ... heat dissipation sheet, 200 ... projection, 21 ... device casing, 50 ... lens unit, 54 ... dust-proof mechanism, 60 ... heat dissipation member, 601 ... first heat coupling part, 602 ... heat dissipation fin, 603 ... second No heat 604 ... hollow part 62 ... first heat radiating member 621 ... opening part 622 ... projection part 63 ... second heat radiating member 631 ... exhaust hole 632 ... heat radiating fin 64 ... screw member 65 ... Third heat dissipating member, 651... Heat dissipating fin, 652 .. Exhaust hole, 66... Equipment housing, 67... First heat dissipating member, 671. ... Guide groove, 69 ... Metal pipe, 692 ... Connection pipe, 70 ... Metal plate, 701 ... Air vent hole, 71 ... Adjustment screw member, 72 ... Flexible synthetic resin pipe, 73 ... First heat dissipation member, 731 ... Guide Groove, 74 ... presser member, 741 ... projection, 75 ... second heat radiating member, 76 ... third heat radiating member, 751, 761 ... heat radiating fin, 762 ... air vent, 77 ... screw member, 78 ... temperature sensor, 79 ... Moving frame, 80 ... Presser member, 81 ... Heat pie , 82 ... piezoelectric pump, 83 ... sealing valve, 84 ... first heat radiating member, 85 ... second heat radiating member, 841,851 ... heat radiating member, 86 ... support frame member, 87 ... low pass filter, 88 ... shutter, 89 ... electronic components, 90 ... support plate, 91 ... camera body.

Claims (6)

機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、
前記フレキシブル印刷基板を支持し、移動枠に固定された放熱部材と、
この放熱部材に収容される潜熱蓄熱材と、
前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を具備とすることを特徴とする撮像素子モジュール。 A flexible printed wiring board on which an image sensor is mounted;
A heat dissipation member that supports the flexible printed circuit board and is fixed to a moving frame;
A latent heat storage material housed in the heat radiating member;
An imaging element module comprising: a pressing member that supports the flexible printed wiring board on the heat dissipation member . 機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、A flexible printed wiring board on which an image sensor is mounted;
前記フレキシブル印刷基板を支持し、前記機器筐体に固定された放熱部材と、A heat dissipation member that supports the flexible printed circuit board and is fixed to the device housing;
この放熱部材に収容される潜熱蓄熱材と、A latent heat storage material housed in the heat radiating member;
前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を具備とすることを特徴とする撮像素子モジュール。An imaging element module comprising: a pressing member that supports the flexible printed wiring board on the heat dissipation member. 前記放熱部材は、前記潜熱蓄熱材の封入される面に放熱フィンが形成された第１及び第２の放熱部で形成されていることを特徴とする請求項１又は２記載の撮像素子モジュール。The imaging device module according to claim 1, wherein the heat radiating member is formed by first and second heat radiating portions in which heat radiating fins are formed on a surface where the latent heat storage material is enclosed. 機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、A flexible printed wiring board on which an image sensor is mounted;
前記フレキシブル印刷配線基板を支持し、移動枠に固定された放熱部材と、A heat dissipating member that supports the flexible printed wiring board and is fixed to a moving frame;
この放熱部材に収容される潜熱蓄熱材と、A latent heat storage material housed in the heat radiating member;
前記放熱部材に前記フレキシブル印刷配線基板を支持する押え部材と、を具備とすることを特徴とする撮像素子モジュールを用いた携帯用電子機器。A portable electronic device using an imaging element module, comprising: a pressing member that supports the flexible printed wiring board on the heat dissipation member. 前記撮像モジュールは、レンズの光軸に直交する平面上で変位可能な状態で支持されるとともに、手振れ補正機構を有することを特徴とする請求項４記載の撮像素子モジュールを用いた携帯用電子機器。5. The portable electronic device using an imaging element module according to claim 4, wherein the imaging module is supported in a displaceable state on a plane orthogonal to the optical axis of the lens and has a camera shake correction mechanism. . 機器筺体に収容されるもので、撮像素子が搭載されたフレキシブル印刷配線基板と、A flexible printed wiring board on which an image sensor is mounted;
前記フレキシブル印刷配線基板を支持し、前記機器筺体に固定された放熱部材と、A heat dissipating member that supports the flexible printed wiring board and is fixed to the device housing;
この放熱部材に収容される潜熱蓄熱材と、A latent heat storage material housed in the heat radiating member;
前記放熱部材に前記フレキシブル印刷配線基板を支持する支持部材と、を具備とすることを特徴とする撮像素子モジュールを用いた携帯用電子機器。A portable electronic device using an imaging element module, comprising: a support member that supports the flexible printed wiring board on the heat dissipation member.
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