JP6756357B2 - Imaging device - Google Patents

Description

The present invention relates to an imaging unit and an imaging device.

A camera module in which a solid-state image sensor is die-bonded to the bottom surface of a ceramic package and the upper end surface of the ceramic package is bonded to a printed circuit board is known.
[Prior art literature]
[Patent Document]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-019423

There is a problem that the heat generated by the image pickup chip cannot be efficiently dissipated from the image pickup chip to the outside.

In the first aspect of the present invention, the imaging unit includes an imaging chip, a first surface on which the imaging chip is mounted, a second surface opposite to the first surface, an end of the first surface, and a second surface. An image pickup unit having a mounting substrate including a third surface formed along the edge of the surface, a mounting member having an opening for mounting the image pickup unit, and a third surface and a mounting member of the mounting board. It is provided with a heat conductive member provided in contact with the inner wall forming the opening of the above.

In the second aspect of the present invention, the imaging device includes the imaging unit described above.

The outline of the above invention does not list all the necessary features of the present invention. Subcombinations of these feature groups can also be inventions.

It is a schematic cross-sectional view of the camera 10 which is an example of an image pickup apparatus. It is sectional drawing which shows typically the optical unit 50 together with the image pickup unit 40. It is a perspective view which shows typically the optical unit 50 together with the image pickup unit 40. It is a top view which shows typically the bracket 150 together with the image pickup unit 40. It is a top view which shows typically the bracket 150 together with the image pickup chip 100 and the mounting substrate 120. It is sectional drawing which shows typically the image pickup unit 1000 as a modification of the image pickup unit 40. It is sectional drawing which shows typically the image pickup unit 800 as a modification of the image pickup unit 40. It is sectional drawing which shows typically the image pickup unit 900 as a modification of the image pickup unit 40. It is sectional drawing which shows typically the image pickup unit 1300 as a modification of the image pickup unit 40. It is sectional drawing which shows typically the mounting substrate 120 together with the image pickup chip 100, the frame 140, the bracket 150, and the heat conductive resin 180. The top view which shows typically the mounting substrate 120 together with the image pickup chip 100 is shown. It is sectional drawing which shows typically the image pickup unit 2000 in another form. It is a top view which shows typically the chip mounting substrate 2110 together with the image pickup chip 100 in the image pickup unit 2000. A cross-sectional view schematically showing a mounting board 1800 as a modification of the mounting board 2110 is shown. It is a plane sectional view which shows typically the wiring layer in the mounting board 1800.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the inventions claimed in the claims. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 is a schematic cross-sectional view of a camera 10 which is an example of an imaging device. The camera 10 includes a lens unit 20 and a camera body 30. A lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides the incident subject luminous flux to the image pickup unit 40 of the camera body 30.

The direction in which the subject luminous flux is incident on the image pickup chip 100 included in the image pickup unit 40 is defined as the z-axis direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction, and the lateral direction is defined as the y-axis direction. The direction in which the subject luminous flux is directed toward the image pickup chip 100 is defined as the z-axis plus direction. In FIG. 1, the direction toward the front of the paper is the x-axis plus direction, the direction toward the back of the paper is the x-axis minus direction, the direction toward the bottom of the paper is the y-axis plus direction, the direction toward the top of the paper is the y-axis minus direction, and the paper surface. The direction toward the right is defined as the z-axis plus direction, and the direction toward the left side of the paper is defined as the z-axis minus direction.

The camera body 30 includes a main mirror 32 and a sub mirror 33 behind the body mount 26 coupled to the lens mount 24. Unless otherwise specified, the rear means the z-axis plus direction. The main mirror 32 is rotatably supported between an approach position in which the lens unit 20 has entered the optical path of the subject luminous flux emitted by the lens unit 20 and a retracted position retracted from the optical path of the subject luminous flux. The sub mirror 33 is rotatably supported by the main mirror 32. The sub mirror 33 enters the approach position together with the main mirror 32, and retracts to the retracted position together with the main mirror 32.

When the main mirror 32 is in the approach position, a part of the subject luminous flux incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is arranged at a position conjugate with the image pickup surface of the image pickup chip 100 included in the image pickup unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the finder 86 through the pentaprism 82 and the finder optical system 84.

When the main mirror 32 is in the approach position, among the subject luminous flux incident on the main mirror 32, the luminous flux other than the subject luminous flux reflected by the main mirror 32 is incident on the sub mirror 33. Specifically, the main mirror 32 has a half mirror region, and the subject luminous flux transmitted through the half mirror region of the main mirror 32 is incident on the sub mirror 33. The sub-mirror 33 reflects the luminous flux incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light flux to the focus detection sensor 72. The focus detection sensor 72 outputs the detection result to the CPU 51.

The focus plate 80, the pentaprism 82, the main mirror 32, and the sub mirror 33 are supported by the mirror box 60 as a support member. When the main mirror 32 and the sub mirror 33 are retracted to the retracted position and the front curtain and the rear curtain of the shutter unit 38 are opened, the subject luminous flux transmitted through the lens unit 20 is an optical unit arranged behind the shutter unit 38. It passes through 50 and reaches the imaging surface of the imaging chip 100.

A substrate 62 and a rear display unit 88 are sequentially arranged behind the image pickup unit 40. A liquid crystal panel or the like can be applied to the rear display unit 88. The display surface of the rear display unit 88 appears on the back surface of the camera body 30. The rear display unit 88 displays an image generated from the output signal from the image pickup chip 100.

Electronic circuits such as CPU 51 and ASIC 52 are mounted on the board 62. The CPU 51 is responsible for controlling the entire camera 10. The output signal from the image pickup chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

The ASIC 52 generates image data for display based on the output signal from the image pickup chip 100. The rear display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the image pickup chip 100. The image data for recording generated by the ASIC 52 is recorded on a recording medium mounted on the camera body 30. The recording medium is configured to be removable from the camera body 30.

FIG. 2 is a cross-sectional view schematically showing the optical unit 50 together with the imaging unit 40. FIG. 3 is a perspective view schematically showing the optical unit 50 together with the imaging unit 40. FIG. 2 shows a cross section taken along the line AA in FIG. The image pickup unit 40 includes an image pickup chip 100, a mounting board 120, an electronic component mounting board 130, a frame 140, and a cover glass 160.

The imaging chip 100 is mounted on the mounting board 120 by COB (Chip On Board). Specifically, the image pickup chip 100 is mounted on the mounting substrate 120 with an LGA (Land Grid Array), a BGA (Ball Grid Array), an adhesive or the like. The image pickup chip 100 is electrically connected to the mounting substrate 120 by, for example, wire bonding or bumps. As a result, the image pickup chip 100 can output the generated pixel signal to the mounting board 120, and the mounting board 120 can output the drive signal for driving the image pickup chip 100 to the image pickup chip 100. The mounting board 120 includes a first surface 121, which is a mounting surface on which the imaging chip 100 is mounted, a second surface 122, which is a surface opposite to the first surface 121, and an end of the first surface 121 and a second surface 122. The side surface 124a formed along the end of the first surface 121, the side surface 124b formed along the end of the first surface 121 and the end of the second surface 122, and the end of the first surface 121 and the end of the second surface 122. It has a side surface 124c formed along the above and a side surface 124d formed along the end of the first surface 121 and the end of the second surface 122.

The mounting board 120 is a multilayer board including a plurality of wiring layers and an insulating layer that insulates the wiring layers. The mounting board 120 may be a single-layer board including one wiring layer and an insulating layer that insulates the wiring layer. The mounting board 120 is mounted on the electronic component mounting board 130. The second surface 122 of the mounting board 120 is mounted on the electronic component mounting board 130. The mounting board 120 and the electronic component mounting board 130 are mounted by LGA (Land Grid Array), BGA (Ball Grid Array), or the like.

In the electronic component mounting board 130, the electronic component is mounted on the surface 132 opposite to the surface 131 on which the mounting board 120 is mounted. Examples of electronic components include capacitors, registers, resistors, and the like. The electronic components constitute a power supply circuit or the like that supplies electric power to the image pickup chip 100. The wiring pattern of the wiring layer on which the electronic component is mounted and the electronic component are electrically connected via solder or the like.

A connector may be mounted on the surface 132 of the electronic component mounting board 130. For example, a flexible printed circuit board is connected to the connector. In this case, the pixel signal output from the image pickup chip 100 is output to the connector via the vias provided on the mounting board 120 and the electronic component mounting board 130. The pixel signal output to the connector is output to the ASIC 52 as an example of the processing circuit via the flexible printed circuit board.

The frame 140 surrounds the imaging chip 100. The frame 140 is fixed to the first surface 121 of the mounting substrate 120 by, for example, an adhesive. The frame 140 is fixed to the frame 140 at the peripheral portion of the first surface 121 of the mounting substrate 120. The image pickup chip 100 is surrounded by a frame 140 fixed to the mounting substrate 120. As the material of the frame 140, a metal such as aluminum, brass, iron, or a nickel alloy can be used. Resin can also be used as the material of the frame 140. As the material of the frame 140, a material in which metal and resin are insert-molded can also be used.

The frame 140 is fixed to the bracket 150. The bracket 150 is an example of a mounting member for mounting the imaging unit 40. The frame 140 is fastened to the bracket 150 by screws 142. The frame 140 is screwed at two points in the vicinity of the end portion separated from the center of the imaging surface in the minus direction of the x-axis by the screws 142.

The cover glass 160 seals the image pickup chip 100. As the material of the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass and the like can be used. The cover glass 160 is fixed to the frame 140 by, for example, an adhesive. A sealed space is formed by the mounting substrate 120, the frame 140, and the cover glass 160. The imaging chip 100 is arranged in the sealed space. The heat generated by the image pickup chip 100 can be dissipated to the outside of the image pickup unit 40 via the frame 140. By using a metal or a material in which a metal and a resin are insert-molded as the material of the frame 140, heat can be dissipated more efficiently through the frame as compared with the case where the resin is used as the material of the frame 140.

The bracket 150 has a first surface 151, a second surface 152, a third surface 153, a fourth surface 154, and an opening 155. The first surface 151 is, for example, a surface orthogonal to the z-axis direction and a surface facing the frame 140. The second surface 152 is, for example, a surface orthogonal to the z-axis direction and is a surface opposite to the first surface 151. The third surface 153 is, for example, a surface orthogonal to the z-axis direction, and is located between the first surface 151 and the second surface 152 in the z-axis direction. The fourth surface 154 is a surface formed between the first surface 151 and the third surface 153. Specifically, the fourth surface 154 is formed along the end of the first surface 151 and the end of the third surface 153. That is, the fourth surface 154 is formed along the outer edge of the first surface 151 and the outer edge of the third surface 153. The bracket 150 is fixed to the camera body 30.

A heat conductive resin 180 is provided between the mounting substrate 120 and the frame 140. For example, the gap between the mounting substrate 120 and the frame 140 is filled with the heat conductive resin 180. The heat generated by the image pickup chip 100 is transferred to the bracket 150 via the mounting substrate 120 and the heat conductive resin 180. The heat transferred to the bracket 150 can be dissipated through the structure.

The thermally conductive resin 180 thermally connects the mounting substrate 120 and the bracket 150. The heat conductive resin 180 functions as a heat transfer unit. The heat conductive resin 180 is, for example, a heat conductive adhesive. The heat conductive adhesive is, for example, a thermosetting heat conductive adhesive. Examples of the heat conductive adhesive include resins such as epoxy resin, acrylic resin, silicon resin, and urethane resin. The thermally conductive resin 180 contains a thermally conductive filler.

When the frame 140 and the bracket 150 are assembled, an opening 141a, an opening 141b, an opening 141c, and an opening 141d are formed which communicate with the space where the heat conductive resin 180 is provided. The heat conductive resin 180 is injected from the opening 141a, the opening 141b, the opening 141c, and the opening 141d in a state where the frame 140 and the bracket 150 are assembled. When a thermosetting adhesive is used as the thermosetting adhesive, the thermosetting adhesive is injected from the openings 141a, 141b, 141c, and 141d, and then heated to the curing temperature to obtain the thermosetting adhesive. To cure.

The thermally conductive resin 180 is preferably a resin having a curing temperature lower than the melting point of the solder used in the imaging unit 40. The thermally conductive resin 180 is preferably a resin having a curing temperature lower than the heat resistant temperature of the imaging chip 100. The thermally conductive resin 180 is preferably a resin having a curing temperature lower than the heat resistant temperature of the electronic component provided on the electronic component mounting substrate 130. The thermally conductive resin 180 has a curing temperature lower than the lowest of the melting point of the solder used in the imaging unit 40, the heat resistant temperature of the imaging chip 100, and the heat resistant temperature of the electronic component provided on the electronic component mounting substrate 130. It is preferably a resin. The thermally conductive resin 180 is preferably a resin having a curing temperature of less than 230 degrees Celsius. The thermally conductive resin 180 is more preferably a resin having a curing temperature of less than 120 degrees Celsius. The cured thermosetting adhesive is in contact with the mounting substrate 120, the frame 140, and the bracket 150. When a photocurable adhesive is used as the heat conductive adhesive, the photocurable adhesive is injected through the openings 141a, 141b, 141c, and 141d, and then photocured by irradiating light such as ultraviolet rays. Cure the sex adhesive.

In this way, the heat conductive resin 180 is provided in contact with the mounting substrate 120, the frame 140, and the bracket 150. The heat conductive resin 180 may be provided in contact with the mounting substrate 120 and the bracket 150, and may not be in contact with the frame 140.

By thermally connecting the mounting substrate 120 and the bracket 150 by the thermally conductive resin 180, the mounting substrate 120 is compared with the case where the thermally conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. The thermal resistance between the bracket 150 and the bracket 150 can be reduced. By thermally connecting the mounting substrate 120 and the bracket 150 by the thermally conductive resin 180, the mounting substrate 120 is compared with the case where the thermally conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. The amount of heat transfer per unit time between the bracket 150 and the bracket 150 can be increased. By thermally connecting the mounting substrate 120 and the bracket 150 by the thermally conductive resin 180, the mounting substrate 120 is compared with the case where the thermally conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. The amount of heat transfer per unit temperature difference between the bracket 150 and the bracket 150 can be increased, that is, the heat flux per unit temperature difference between the mounting substrate 120 and the bracket 150 can be increased.

The optical unit 50 includes a mask rubber 272, an optical element 274, and a pressing member 280. The optical element 274 includes an optical low-pass filter 276 and an infrared cut filter 278. The optical low-pass filter 276 and the infrared cut filter 278 are arranged in the z-axis positive direction in the order of the optical low-pass filter 276 and the infrared cut filter 278. The cover glass 160 may include the functions of some of the plurality of optical layers constituting the optical low-pass filter 276. In this case, the optical low-pass filter 276 can be composed of only the remaining optical layers among the plurality of optical layers, excluding the functions of some optical layers included in the cover glass 160.

The pressing member 280 is screwed to the bracket 150 by the screw 282. The pressing member 280 fixes the optical element 274 in a state of being pressed against the image pickup unit 40 via the mask rubber 272. The optical element 274 is pressed against the image pickup unit 40 by the force in the z-axis positive direction applied from the pressing member 280 when the pressing member 280 is screwed to the bracket 150.

The pressing member 280 has a pair of flat portions 288. The pressing member 280 is screwed to the bracket 150 by the screw 282 at the flat portion 288. As a result, the optical unit 50 is assembled to the imaging unit 40.

FIG. 4 is a top view schematically showing the bracket 150 together with the image pickup unit 40. FIG. 5 is a top view schematically showing the bracket 150 together with the image pickup chip 100 and the mounting substrate 120.

The image pickup chip 100 includes a pixel area 101 and a circuit area 102. The pixel region 101 is formed, for example, in the central portion of the imaging chip 100. The pixel region 101 has a plurality of photoelectric conversion elements that photoelectrically convert the received subject image, and forms an imaging surface. The circuit area 102 has a processing circuit that performs signal processing of the pixel signal obtained by photoelectric conversion. The processing circuit includes an AD conversion circuit that converts a pixel signal, which is an analog signal, into a digital signal. The processing circuit includes a circuit for removing noise of a pixel signal, such as a CDS circuit. The processing circuit includes an amplifier circuit that amplifies the pixel signal. The circuit area 102 is formed around the pixel area 101 of the image pickup chip 100. The circuit region 102 is formed in the vicinity of the long side 110 of one of the four sides forming the pixel region 101 in the image pickup chip 100.

The bracket 150 has an opening 155 for accommodating the electronic component mounting board 130. The bracket 150 has a stepped portion 158 formed by a first surface 151, a fourth surface 154, and a third surface 153.

The heat conductive resin 180 is provided in contact with the step portion 158. The heat conductive resin 180 is provided in contact with the fourth surface 154 and the third surface 153 forming the step portion 158. The heat conductive resin 180 is composed of a heat conductive resin 180a, a heat conductive resin 180b, a heat conductive resin 180c, and a heat conductive resin 180d. The heat conductive resin 180a is provided in contact with the side surface 124a of the mounting substrate 120 and the step portion 158a facing the side surface 124a. The heat conductive resin 180b is provided in contact with the side surface 124b of the mounting substrate 120 and the step portion 158b facing the side surface 124b. The heat conductive resin 180c is provided in contact with the side surface 124c of the mounting substrate 120 and the step portion 158c facing the side surface 124c. The heat conductive resin 180d is provided in contact with the side surface 124d of the mounting substrate 120 and the step portion 158d facing the side surface 124d.

The heat conductive resin 180 may be provided in contact with the side surface of the mounting substrate 120, which is closer to the circuit region 102 among the side surfaces 124a, 124b, 124c, and 124d. The heat conductive resin 180 may be provided in contact with the side surface 124d without contacting the side surface 124a, the side surface 124b, and the side surface 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface 124c and the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124d and 124a of the mounting substrate 120 without contacting the side surfaces 124b and 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124d and 124b of the mounting substrate 120 without contacting the side surfaces 124a and 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124b of the mounting substrate 120 without contacting the side surfaces 124c and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a, 124b, and 124d of the mounting substrate 120 without contacting the side surface 124c of the mounting substrate 120.

Although the circuit region 102 has been described with reference to an example in which the image pickup chip 100 is formed in the vicinity of one long side of the four sides forming the pixel region 101, the four sides forming the pixel region 101 in the image pickup chip 100 have been described. It may be formed in the vicinity of one of the short sides. When the circuit region 102 is formed in the vicinity of the short side of one of the four sides forming the pixel region 101 in the image pickup chip 100, the heat conductive resin 180 is formed on the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124c of the mounting substrate 120. It may be provided in contact with the side surface of the side surface 124d close to the circuit area 102.

When the circuit region 102 is formed in the vicinity of two long sides of the four sides forming the pixel region 101 in the image pickup chip 100, the heat conductive resin 180 is formed on the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124c of the mounting substrate 120. It may be provided in contact with the side surface of the side surface 124d close to the circuit area 102. The thermally conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface 124c and the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124b of the mounting substrate 120 without contacting the side surfaces 124c and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124c of the mounting substrate 120 without contacting the side surfaces 124b and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124d of the mounting substrate 120 without contacting the side surfaces 124b and 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surfaces 124b and 124c of the mounting substrate 120 without contacting the side surfaces 124a and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124b and 124d of the mounting substrate 120 without contacting the side surfaces 124a and 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124c and 124d of the mounting substrate 120 without contacting the side surfaces 124a and 124b of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a, 124b, and 124c of the mounting substrate 120 without contacting the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surfaces 124a, 124c and 124d of the mounting substrate 120 without contacting the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120.

The circuit region 102 has been described with reference to an example in which the image pickup chip 100 is formed in the vicinity of two long sides of the four sides forming the pixel region 101, but the four sides forming the pixel region 101 in the image pickup chip 100 have been described. It may be formed in the vicinity of two short sides. When the circuit region 102 is formed in the vicinity of two short sides of the four sides forming the pixel region 101 in the image pickup chip 100, the heat conductive resin 180 is formed on the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124c of the mounting substrate 120. It may be provided in contact with the side surface of the side surface 124d close to the circuit area 102.

When the circuit region 102 is formed in the vicinity of each of the four sides forming the pixel region 101 in the image pickup chip 100, the heat conductive resin 180 is formed on the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. It may be provided in contact with the side surface close to the circuit area 102. The thermally conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c and the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface c and the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124c of the mounting substrate 120 without contacting the side surface 124a, the side surface 124b and the side surface 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124d of the mounting substrate 120 without contacting the side surface 124a, the side surface b and the side surface 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124b of the mounting substrate 120 without contacting the side surfaces 124c and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124c of the mounting substrate 120 without contacting the side surfaces 124b and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a and 124d of the mounting substrate 120 without contacting the side surfaces 124b and 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surfaces 124b and 124c of the mounting substrate 120 without contacting the side surfaces 124a and 124d of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124b and 124d of the mounting substrate 120 without contacting the side surfaces 124a and 124c of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124c and 124d of the mounting substrate 120 without contacting the side surfaces 124a and 124b of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surfaces 124a, 124b, and 124c of the mounting substrate 120 without contacting the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided not in contact with the side surface 124a of the mounting substrate 120, but in contact with the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surfaces 124a, 124c and 124d of the mounting substrate 120 without contacting the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120.

In the image pickup unit 40, the heat conductive resin 180 is not in contact with the surface 132 of the electronic component mounting board 130, but the heat conductive resin 180 may be in contact with the surface 132 of the electronic component mounting board 130. .. The thermally conductive resin 180 may cover a part of the surface 132 of the electronic component mounting substrate 130. Therefore, the heat generated in the electronic circuit of the electronic component mounting board 130 can be transferred to the bracket 150 with higher efficiency. In particular, in the heat conductive resin 180, at least a part of the region where the heat conductive resin 180 covers the surface 132 of the electronic component mounting substrate 130 overlaps with at least a part of the imaging chip 100 in the xy plane. It may be provided. In particular, at least a part of the region where the heat conductive resin 180 covers the surface 132 of the electronic component mounting substrate 130 may overlap with the peripheral region of the image pickup chip 100 in the xy plane. In this case, the heat generated in the peripheral portion of the image pickup chip 100 may be efficiently transferred to the bracket 150. Therefore, it may be possible to reduce the heat flux toward the pixel region 101 of the image pickup chip 100.

FIG. 6 is a cross-sectional view schematically showing an imaging unit 1000 as a modification of the imaging unit 40. In the image pickup unit 1000, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted.

In the image pickup unit 1000, the heat conductive resin 180 is in contact with the mounting substrate 120 and not with the electronic component mounting substrate 130. The position of the third surface 153 of the bracket 150 in the image pickup unit 1000 in the z-axis direction is on the minus side of the z axis of the position of the third surface 153 of the bracket 150 in the image pickup unit 40 in the z-axis direction.

In the image pickup unit 1000, the electronic component mounting substrate 130 is connected to the outside of the image pickup unit 40 via a heat conductive member such as a graphite sheet or a sheet metal shield material. For example, the electronic component mounting substrate 130 is connected to the structural material of the imaging unit 40 via a heat conductive member. The heat generated by the electronic components mounted on the electronic component mounting substrate 130 is released to the outside of the image pickup unit 40 via the heat transfer member.

FIG. 7 is a cross-sectional view schematically showing an image pickup unit 800 as a modification of the image pickup unit 40. In the image pickup unit 800, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted.

The bracket 150 is formed with a penetrating portion 810 that penetrates from the second surface 152 to the third surface 153. The penetrating portion 810 communicates the outside of the image pickup unit 800 with the space provided with the heat conductive resin 180. The heat conductive adhesive is injected from the outside of the image pickup unit 800 through the penetration portion 810 to cure the heat conductive adhesive.

The penetration portion 810 may be a hole extending from the second surface 152 to the third surface 153. The cross-sectional shape of the penetrating portion 810 on the second surface 152 and the third surface 153 is not limited to a circular shape and may be any shape. Instead of the penetrating portion 810, a groove may be formed in the bracket 150 so as to reach from the second surface 152 to the third surface 153 and along the side portion of the mounting substrate 120. In this case, the heat conductive adhesive is injected from the outside of the image pickup unit 800 through the groove to cure the heat conductive adhesive.

FIG. 8 is a cross-sectional view schematically showing an image pickup unit 900 as a modification of the image pickup unit 40. In the image pickup unit 900, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted.

In the image pickup unit 900, the frame 140 is formed with a penetrating portion 910 penetrating from the first surface 941 to the second surface 942. The penetrating portion 910 communicates the outside of the imaging unit 900 with the space where the heat conductive resin 180 is provided. A heat conductive adhesive is injected from the outside of the image pickup unit 900 through the penetrating portion 910 to cure the heat conductive adhesive.

The penetration portion 910 may be a hole extending from the first surface 941 to the second surface 942. The cross-sectional shape of the penetrating portion 910 on the first surface 941 and the second surface 942 is not limited to a circular shape and may be any shape. In the imaging unit 900, the frame 140 may have a penetrating portion 910, and the bracket 150 may have a penetrating portion similar to the penetrating portion 810 of the imaging unit 800.

FIG. 9 is a cross-sectional view schematically showing an imaging unit 1300 as a modification of the imaging unit 40. In the image pickup unit 1300, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted.

In the image pickup unit 1300, the image pickup chip 100 is mounted on one mounting board 1320. The mounting board 1320 is, for example, a core board on which the imaging chip 100 is mounted. Specifically, the mounting substrate 1320 has a plurality of wiring layers, an insulating layer that insulates between the wiring layers, and a core layer.

The thickness of the mounting substrate 1320 is, for example, 0.8 mm to 3.0 mm as a whole. As an example, the core layer is sandwiched between wiring layers. The core layer may be sandwiched between the insulating layer and the insulating layer. Examples of the mounting substrate 1320 include a metal core substrate using a metal such as an alloy of nickel and iron (for example, 42alloy, 56alloy), copper, and aluminum for the core layer, and a resin core substrate using a resin such as an epoxy resin for the core layer. be able to. The mounting substrate 1320 does not have to include the core layer. Examples of the mounting substrate 1320 include a substrate made of ceramic or the like.

The mounting board 1320 has a first surface 1321 and a second surface 1322 which is a surface opposite to the first surface 1321. Similar to the electronic component mounting board 130, electronic components, connectors, and the like are mounted on the second surface 1322 of the mounting board 1320. As described above, the mounting board 1320 has the functions of the mounting board 120 and the electronic component mounting board 130 in the imaging unit 40, the imaging unit 1000, the imaging unit 800, and the imaging unit 900. The thermally conductive resin 180 comes into contact with the side portion of the mounting substrate 1320, the bracket 150, and the frame 140. Since these points are the same as those of the mounting board 120 in the imaging unit 40, the description thereof will be omitted.

The mounting substrate 1320 may be a substrate other than the multilayer substrate having the metal core or the resin core described above. The mounting board 1320 may be a single-layer board including one wiring layer and an insulating layer that insulates the wiring layer. The mounting board 1320 may be a multilayer board having no core.

In the description of the image pickup unit 40, the image pickup unit 1000, the image pickup unit 800, and the image pickup unit 900, the heat conductive resin 180 is formed of the heat conductive adhesive. The thermally conductive resin 180 may be formed of a material other than the thermally conductive adhesive. The heat conductive resin 180 may be formed of a heat conductive rubber instead of the adhesive. By forming the heat conductive resin 180 with the heat conductive rubber, the process for forming the heat transfer portion between the mounting substrate 120 and the bracket 150 can be simplified. For example, the thermosetting step required when using a thermosetting adhesive can be omitted.

FIG. 10 is a cross-sectional view schematically showing the image pickup chip 100, the mounting substrate 120, the frame 140, the bracket 150, and the heat conductive resin 180 in the image pickup unit 40. FIG. 11 shows a top view schematically showing the mounting substrate 120 together with the imaging chip 100.

The mounting board 120 has a solder resist layer 610, a wiring layer 620 including a wiring layer 620a and a wiring layer 620b, and an insulating layer 630 including an insulating layer 630a and an insulating layer 630b. When the image pickup unit 40 is assembled to the camera 10, the solder resist layer 610, the wiring layer 620a, the insulating layer 630a, the wiring layer 620b, and the insulating layer 630b are arranged in this order in the z-axis positive direction. The imaging chip 100 is mounted on the solder resist layer 610. The wiring layer 620 is, for example, a copper foil. The wiring layer 620a is the layer closest to the imaging chip 100 among the wiring layers 620. The insulating layer 630 is a layer that insulates the wiring layer 620.

The mounting board 120 has a region where the wiring layer 620a is exposed on the outer peripheral portion of the first surface 121. That is, the mounting substrate 120 has a region on the outer peripheral portion of the first surface 121 where the solder resist layer 610 is not formed. The frame 140 is provided in a region where the wiring layer 620a is exposed, that is, a region where the solder resist layer 610 is not formed. Therefore, the amount of heat released to the bracket 150 via the frame 140 can be increased as compared with the case where the frame 140 is provided on the solder resist layer 610. The thickness of the wiring layer 620a is preferably formed to be thicker than the thickness of the wiring layer 620b. The thickness of the wiring layer 620a is preferably formed to be thicker than the thickness of any other wiring layer 620 of the mounting substrate 120. As a result, the heat generated by the image pickup chip 100 can be efficiently transferred to the frame 140. Therefore, the heat generated by the image pickup chip 100 can be efficiently released to the outside.

The wiring layer 620a and the wiring layer 620b extend to the side surfaces 124a and 124b of the mounting substrate 120. The wiring layer 620a and the wiring layer 620b are exposed on 124a and the side surface 124b of the mounting substrate 120. The thermally conductive resin 180 is in contact with the wiring layer 620a and the wiring layer 620b at 124a and the side surface 124b of the mounting substrate 120. Therefore, the heat generated by the image pickup chip 100 can be efficiently transferred to the heat conductive resin 180. Therefore, the heat generated by the image pickup chip 100 can be efficiently released to the outside.

The mounting board 120 has a plurality of vias 650. The via 650 functions as a thermal via. The imaging chip 100 is thermally connected to the wiring layer 620a via the via 650. As a result, the heat generated by the image pickup chip 100 can be efficiently transferred to the frame 140. Therefore, the heat generated by the image pickup chip 100 can be efficiently released to the outside. Further, the image pickup chip 100 is thermally connected to the wiring layer 620a and the wiring layer 620b via the via 650. As a result, the heat generated by the image pickup chip 100 can be efficiently transferred to the heat conductive resin 180. Therefore, the heat generated by the image pickup chip 100 can be efficiently released to the outside.

The via 650 is provided at a position corresponding to the circuit region 102 of the image pickup chip 100 on the mounting substrate 120. The density of the via 650 provided at the position corresponding to the circuit area 102 is preferably higher than the density of the via 650 provided at the position other than the position corresponding to the circuit area 102 on the mounting board 120. Therefore, it is possible to reduce the heat generated in the processing circuit of the circuit area 102 toward the pixel area 101.

The side surface 124a, side surface 124b, side surface 124c, and side surface 124d of the mounting substrate 120 that come into contact with the heat conductive resin 180 may have a shape such as a curved surface or an uneven surface that increases the contact area with the heat conductive resin 180. .. For example, the outer edge of the wiring layer 620 that comes into contact with the heat conductive resin 180 may be provided so as to protrude from the outer edge of the insulating layer 630.

In connection with FIGS. 10 and 11, the configurations of the image pickup chip 100, the mounting substrate 120, the frame 140, the bracket 150, and the heat conductive resin 180 in the image pickup unit 40 have been described. The same configuration can be applied to the imaging unit 1000, the imaging unit 800, and the imaging unit 900. Further, the same configuration can be applied to the imaging unit 1300. For example, the multilayer structure described in relation to the mounting substrate 120 can be applied to the multilayer structure of a single mounting substrate 1320 included in the imaging unit 1300.

FIG. 12 is a cross-sectional view schematically showing the imaging unit 2000 in another form. The image pickup unit 2000 includes an image pickup chip 100, a mounting substrate 2110, a frame 140, and a cover glass 160. FIG. 13 is a top view schematically showing the mounting substrate 2110 together with the imaging chip 100 in the imaging unit 2000. In the image pickup unit 2000, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted.

The mounting board 2110 mounts the imaging chip 100. The frame 140 surrounds the imaging chip 100. The cover glass 160 seals the image pickup chip 100. The cover glass 160 is fixed to the frame 140. A sealed space is formed by the mounting substrate 2110, the frame 140, and the cover glass 160. The imaging chip 100 is arranged in the sealed space.

As the mounting board 2110, the same configuration as the mounting board 120 and the electronic component mounting board 130 or the same configuration as the mounting board 1320 can be applied. Similar to the mounting board 120 described in relation to FIG. 10 and the mounting board 1320 described in relation to FIG. 9 and the like, the mounting board 2110 is formed by a solder resist layer 2610 for mounting the imaging chip 100 and a solder resist layer 2610. At least includes the provided wiring layer 2620.

When the image pickup unit 40 is assembled to the camera 10, the solder resist layer 2610 and the wiring layer 2620 are arranged in this order in the z-axis plus direction. The mounting board 2110 has a region where the wiring layer 2620 is exposed on the outer peripheral portion of the mounting surface on which the image pickup chip 100 is mounted. That is, the mounting substrate 2110 has a region on the outer peripheral portion of the mounting surface where the solder resist layer 2610 is not formed. The frame 140 is provided in a region where the solder resist layer 2610 is not formed.

As a result, the thermal resistance between the imaging chip 100 and the frame 140 can be reduced as compared with the case where the frame 140 is provided on the solder resist layer 2610. Therefore, the heat flux from the imaging chip 100 to the frame 140 can be increased.

FIG. 14 shows a cross-sectional view schematically showing a mounting board 1800 as a modification of the mounting board 2110. FIG. 15 is a plan sectional view schematically showing a wiring layer in the mounting substrate 1800. The mounting board 1800 differs from the mounting board 2110 in that the wiring layer 2620 is substantially separated into an inner wiring layer 2621 and an outer wiring layer 2622.

The inner wiring layer 2621 is provided corresponding to the pixel region 101. Specifically, the inner wiring layer 2621 is provided at a position corresponding to the pixel region 101 in the xy plane. The outer wiring layer 2622 is located outside the inner wiring layer 2621. The outer wiring layer 2622 is located around the inner wiring layer 2621. The outer wiring layer 2622 is provided corresponding to an area other than the pixel area 101.

The outer wiring layer 2622 and the inner wiring layer 2621 are thermally separated from each other. The outer wiring layer 2622 is separated from the inner wiring layer 2621 by a gap 1820. The gap 1820 has an annular shape. Since the outer wiring layer 2622 and the inner wiring layer 2621 are thermally separated, the heat generated in the circuit region 102 and transferred to the outer wiring layer 2622 is difficult to transfer to the inner wiring layer 2621. The heat transferred to the outer wiring layer 2622 can be released to the outside through the frame 140.

The mounting board 1800 may have vias similar to the vias 650 in the mounting board 120. For example, a via that functions as a thermal via may be provided corresponding to the circuit region 102 of the imaging chip 100, and the circuit region 102 and the outer wiring layer 2622 may be thermally connected. As a result, the heat generated in the circuit region 102 can be easily transferred to the outer wiring layer 2622, and the heat flux toward the pixel region 101 can be reduced.

As a modification of the mounting board 1800, a configuration in which the outer wiring layer 2622 is provided and the inner wiring layer 2621 is not provided can also be adopted. With this configuration as well, the heat flux toward the pixel region 101 can be reduced.

Although the mounting board 1800 has been described as a modification of the mounting board 2110, the same configuration as the mounting board 1800 can be applied to the mounting board 120 and the mounting board 1320. For example, the same configuration as the inner wiring layer 2621 and the outer wiring layer 2622 can be applied to the wiring layer 620 and the like on the mounting board 120. The same configuration as that of the inner wiring layer 2621 and the outer wiring layer 2622 can be applied to the mounting board 1320.

The above-described embodiment can be modified as follows. The image pickup chip 100 is arranged in a sealed space formed by a mounting board such as a mounting board 120, a mounting board 1320, and a mounting board 2110, a frame 140, and a cover glass 160, but the frame is not limited to this. It may be arranged in a sealed space formed by a molded mounting substrate and a cover glass.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

The execution order of each process such as operation, procedure, step, and step in the device, system, program, and method shown in the claims, the specification, and the drawing is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 50 Optical unit 51 CPU
52 ASIC
60 Mirror box 62 Board 70 Imaging optical system 72 Focus detection sensor 80 Focus plate 82 Penta prism 84 Finder optical system 86 Finder 88 Rear display 100 Imaging chip 101 Pixel area 102 Circuit area 110 Long side 120 Mounting board 121 First surface 122 2nd surface 124 Side surface 130 Electronic component mounting board 131 Surface 132 Surface 140 Frame 142 Screw 150 Bracket 151 1st surface 152 2nd surface 153 3rd surface 154 4th surface 155 Opening 158 Step 160 Cover glass 180 Thermal conductive resin 272 Mask rubber 274 Optical element 132 Surface 141 Opening 180 Thermal conductive resin 276 Optical low-pass filter 278 Infrared cut filter 280 Member 282 Screw 288 Flat part 610 Solder resist layer 620 Wiring layer 630 Insulation layer 650 Via 800 Imaging unit 810 Penetration 900 Imaging unit 910 Penetration 941 First surface 942 Second surface 1000 Imaging unit 1300 Imaging unit 1320 Mounting board 1321 First surface 1322 Second surface 1800 Mounting board 1820 Gap 2000 Imaging unit 2110 Mounting board 2610 Solder resist layer 2620 Wiring layer 2621 Inner wiring layer 2622 outer wiring layer

Claims (12)

A substrate having a first surface on which an imaging chip for imaging a subject is arranged and a second surface opposite to the first surface .
A first member arranged so as to surround the imaging chip on the first surface of the substrate,
A second member having thermal conductivity arranged so as to be in contact with the substrate,
A third member to which the first member is disposed on the second surface side of the substrate is that a member attached, is contacted with said second member,
An imaging device comprising. The substrate has a third surface which is formed along the front edge of Symbol the second surface and the end of the first surface, and
The imaging device according to claim 1, wherein the second member is arranged so as to come into contact with the third surface of the substrate. The first member has a first region facing the first surface and a second region different from the first region.
The imaging device according to claim 2, wherein the second member is arranged so as to come into contact with the second region of the first member. The third member has a third region facing the third surface of the substrate.
The imaging device according to claim 2 or 3, wherein the second member is arranged so as to come into contact with the third region. The first member has a first region facing the first surface of the substrate on which the imaging chip is arranged and a second region different from the first region.
The imaging device according to any one of claims 1 to 4, wherein the third member is attached to the first member in the second region of the first member. The imaging device according to any one of claims 1 to 5, wherein the second member is made of resin. The imaging device according to claim 6, wherein the second member is made of a thermosetting adhesive. A glass substrate fixed to the first member is provided.
The imaging device according to any one of claims 1 to 7, wherein the imaging chip is arranged in a sealed space formed by the substrate, the first member, and the glass substrate. The imaging device according to any one of claims 1 to 8, which is arranged on the second surface of the substrate and includes electronic components constituting a power supply circuit that supplies electric power to the imaging chip. A claim that the imaging chip has a pixel unit in which a plurality of pixels that generate a signal by photoelectrically converted charges are arranged, and a processing circuit unit that is arranged outside the pixel unit and has a processing circuit that processes the signal. The imaging device according to any one of claims 1 to 9 . The imaging device according to claim 10 , wherein the substrate has wiring for outputting the signal. The imaging device according to claim 10 or 11, which is arranged on the second surface of the substrate and includes a connector for outputting the signal.

Images