JP7078151B2 - Imaging unit and imaging device - Google Patents

Description

The present invention relates to an image pickup unit and an image pickup device.

A digital camera in which the upper end surface of a ceramic package having a solid-state image sensor is attached to a printed circuit board of a camera module is known.
[Prior Art Document]
[Patent Document]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-019423

Depending on the position where the mounting portion for mounting the structure is provided in the image pickup unit, the internal space of the image pickup device may not be effectively used.

In the first aspect of the present invention, the image pickup unit comprises an image pickup chip, a first substrate on which the image pickup chip is mounted, and a ring member provided on the first substrate and surrounding the image pickup chip. The surrounding member is attached to another structure at a position outside the first substrate in the short side direction of the imaging chip from the side of the first substrate along the first long side of the imaging chip. It has a mounting part for mounting the surrounding member.

In the second aspect of the present invention, the image pickup apparatus includes the above-mentioned image pickup unit.

The outline of the above invention does not list all the necessary features of the present invention. A subcombination of these feature groups can also be an invention.

It is sectional drawing which shows typically the image pickup unit 40 and the body part 60 which a single-lens reflex camera has. The enlarged view of the part A of FIG. 1 is shown. The front view of the image pickup unit 40 seen from the z-axis plus direction is shown. The front view of the image pickup unit 40 seen from the minus direction of the z-axis is shown. The perspective view of the image pickup unit 40 is shown. The exploded perspective view of the image pickup unit 40 is shown. It is a rear view when the image pickup unit 40 and the body part 60 are seen from the position of the z-axis minus direction. An example of the relationship between the area ratio R and the temperature of the image pickup chip 100 is shown. An example of the board configuration of the mounting board 120 is schematically shown. Another example of the board configuration of the mounting board 120 is schematically shown. The image pickup unit 1032 as a modification of the image pickup unit 40 is shown. A plan view of the image pickup unit 1032 as viewed from a position in the plus direction of the z-axis and a cross-sectional view showing an AA cross section of the image pickup unit 1032 are shown. A plan view of the mounting member 1010 and the surrounding member 1040 as viewed from the position in the plus direction of the z-axis is shown. An arrangement example of the heat radiating materials 1050 and 1060 is shown. An example of the ring member 1440 as a modification of the ring member 1040 is shown. An example of the ring member 1540 as a modification of the ring member 1440 is shown. An example of the ring member 1640 as a modification of the ring member 1040 is shown. An example of the ring member 1740 as a modification of the ring member 1640 is shown. An example of the ring member 1840 as a modification of the ring member 1040 is shown. It is sectional drawing which shows typically the image pickup unit 2040 and the body part 60 of another form. The perspective view of the image pickup unit 2040 is shown.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention within the scope of the claims. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 is a cross-sectional view schematically showing an image pickup unit 40 and a body portion 60 included in a single-lens reflex camera which is an example of an image pickup apparatus according to the present embodiment. FIG. 2 shows an enlarged view of part A in FIG.

The body portion 60 is an example of a structure in a single-lens reflex camera. The body portion 60 has a body side mount 26 on which the lens unit is mounted. The lens unit is an interchangeable lens and is removable from the body side mount 26. When the lens unit is mounted on the body side mount 26, the subject luminous flux is incident on the image pickup unit 40 through the optical system arranged in the lens unit.

In the present embodiment, the direction along the optical axis AX of the optical system arranged in the lens unit is defined as the z-axis direction. That is, the direction in which the subject luminous flux is incident on the image pickup chip 100 included in the image pickup unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the image pickup chip 100 is defined as the x-axis direction. The lateral direction of the image pickup chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are defined in the directions shown in FIG. The x-axis, y-axis, and z-axis are right-handed Cartesian coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as a front side, a front side, or the like. Further, the z-axis minus direction may be referred to as a rear side, a rear side, or the like. Further, the y-axis plus direction may be referred to as an upper direction, an upper side, an upper part, or the like. The negative direction of the y-axis may be referred to as downward, lower, lower, or the like.

The body portion 60 has a mirror unit 31 at a position in the negative direction on the z-axis with respect to the body side mount 26. The mirror unit 31 is supported by the body portion 60. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between a position where the lens unit has entered the optical path of the subject luminous flux emitted by the lens unit and a position where the subject luminous flux is retracted from the optical path. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the approach position together with the main mirror 32, and retracts to the retracted position together with the main mirror 32. In this way, the mirror unit 31 takes an approach state in which the subject light beam enters the optical path and a retracted state in which the subject light beam is retracted from the subject light beam.

When the mirror unit 31 is in the approaching state, a part of the subject light flux incident on the main mirror 32 is reflected by the main mirror 32 and guided to the pentaprism 82 described later. The pentaprism 82 is provided at a position of the body portion 60 in the y-axis plus direction. The subject luminous flux guided to the pentaprism 82 is observed from the finder window 86 described later through the finder optical system in the finder lens barrel portion 84 described later.

When the mirror unit 31 is in the retracted state, the luminous flux other than the subject luminous flux reflected by the main mirror 32 among the subject luminous flux incident on the main mirror 32 is incident on the sub mirror 33. Specifically, the main mirror 32 has a half mirror region, and the subject luminous flux transmitted through the half mirror region of the main mirror 32 is incident on the sub mirror 33. The submirror 33 reflects the light flux incident from the half mirror region toward the focus detection unit 70. The focus detection unit 70 has a focus detection sensor for receiving a light incident beam and detecting a focal state. The signal output from the focus detection sensor is output to the MPU provided on the main board 180 included in the image pickup unit 40. The MPU detects the focal state based on the input signal.

A shutter unit 38 and an image pickup unit 40 are attached to the body portion 60. The shutter unit 38 is located in the negative direction on the z-axis with respect to the mirror unit 31. The image pickup unit 40 is located in the minus direction of the z-axis with respect to the shutter unit 38. When the mirror unit 31 is in the retracted state and the shutter unit 38 is in the open state, the subject luminous flux reaches the image pickup surface of the image pickup chip 100 included in the image pickup unit 40.

The image pickup unit 40 includes an image pickup chip 100, a mounting substrate 120, a surrounding member 140, and a cover glass 160.

The image pickup chip 100 is a CMOS image sensor or a CCD image sensor. The image pickup chip 100 includes an image pickup region formed in the central portion of the image pickup chip 100 and a region located around the image pickup region. In the image pickup region of the image pickup chip 100, an image pickup surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert subject light. In the peripheral region of the image pickup chip 100, there is a processing circuit that performs signal processing on the pixel signal obtained by the photoelectric conversion in the photoelectric conversion element. The processing circuit includes an AD conversion circuit that converts an input pixel signal into a digital signal.

The image pickup chip 100 is mounted on the mounting board 120. The mounting board 120 has a first main surface 621 on the mounting board side and a second main surface 622 on the mounting board side opposite to the first main surface 621 on the mounting board side. The first main surface 621 on the mounting board side is located in the z-axis plus direction from the second main surface 622 on the mounting board side. The image pickup chip 100 is mounted on the first main surface 621 of the mounting board 120 on the mounting board side.

The image pickup chip 100 is mounted on a mounting substrate 120 by COB (Chip On Board). The image pickup chip 100 is electrically connected to the mounting substrate 120 by wire bonding, for example. The pixel signal converted into a digital signal by the AD conversion circuit of the image pickup chip 100 is output to the mounting board 120 via, for example, a wire. The image pickup chip 100 is adhered to the mounting substrate 120 with, for example, an adhesive. Specifically, the image pickup chip 100 is adhered to the first main surface 621 of the mounting substrate 120 on the mounting substrate side by, for example, a thermosetting adhesive. The image pickup chip 100 may be mounted on the mounting board 120 by flip-chip mounting. The image pickup chip 100 is electrically connected to the mounting substrate 120 by, for example, a bump.

The surrounding member 140 is arranged on the mounting board 120. The surrounding member 140 surrounds the image pickup chip 100. The surrounding member 140 is arranged on the first main surface 621 of the mounting board 120 on the mounting board side. The surrounding member 140 is fixed to the mounting board 120. The surrounding member 140 is adhered to the mounting substrate 120 with, for example, an adhesive. Specifically, the surrounding member 140 is adhered to the first main surface 621 of the mounting substrate 120 on the mounting substrate side by, for example, a thermosetting adhesive. The surrounding member 140 has an opening 148. The image pickup chip 100 is housed in the opening 148. The opening 148 is formed in the central portion of the ring member 140 in the xy plane.

The cover glass 160 is arranged on the surrounding member 140. The cover glass 160 is provided on the first surface 641 of the surrounding member 140 on the surrounding member side. The cover glass 160 is adhered to the surrounding member 140 with an adhesive. Specifically, the cover glass 160 is adhered to the first surface 641 of the surrounding member 140 on the surrounding member side by, for example, a thermosetting adhesive.

The surrounding member 140 is attached to the bracket 150 by a plurality of screws including the screw 241 and the screw 242. The bracket 150 is attached to the body portion 60 by a plurality of screws including the screw 251 and the screw 252.

FIG. 3 shows a front view of the image pickup unit 40 fixed to the bracket 150 as viewed from the z-axis plus direction to the z-axis minus direction. FIG. 4 shows a front view of the image pickup unit 40 fixed to the bracket 150 as viewed from the minus direction of the z-axis. FIG. 5 shows a perspective view of the image pickup unit 40 fixed to the bracket 150. FIG. 6 shows an exploded perspective view of the image pickup unit 40 and the bracket 150. FIG. 7 is a rear view of the image pickup unit 40 and the body portion 60 when viewed from a position in the minus direction of the z-axis.

The image pickup chip 100 has a rectangular shape in the xy plane. The image pickup chip 100 has a first short side 401 and a second short side 402, and a first long side 403 and a second long side 404. The first short side 401 is located in the minus direction on the x-axis from the second short side 402. The first long side 403 is located in the y-axis plus direction from the second long side 404.

The mounting board 120 has a rectangular shape in the xy plane. The mounting board 120 has a mounting board side first side 421 along the first short side 401 of the image pickup chip 100, a mounting board side second side 422 along the second short side 402 of the image pickup chip 100, and a second side of the image pickup chip 100. It has a third side 423 on the mounting board side along one long side 403 and a fourth side 424 on the mounting board side along the second long side 404 of the image pickup chip 100. The first side 421 on the mounting board side is substantially parallel to the first short side 401 of the image pickup chip 100. The second side 422 on the mounting board side is substantially parallel to the second short side 402 of the image pickup chip 100. The third side 423 on the mounting board side is substantially parallel to the first long side 403 of the image pickup chip 100. The fourth side 424 on the mounting board side is substantially parallel to the second long side 404 of the image pickup chip 100. The first side 421 on the mounting board side is located in the minus direction on the x-axis from the second side 422 on the mounting board side. The third side 423 on the mounting board side is located in the y-axis plus direction from the fourth side 424 on the mounting board side.

The surrounding member 140 includes a first surface 641 on the surrounding member side, a second surface 642 on the surrounding member side, a third surface 643 on the surrounding member side, a fourth surface 644 on the surrounding member side, and the surrounding member side. It has a fifth surface 645 and a sixth surface 646 on the ring member side. The sixth surface 646 on the ring member side forms an opening 148. The image pickup chip 100 is surrounded by the sixth surface 646 on the ring member side. The sixth surface 646 on the ring member side has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

The first surface 641 on the ring member side is a surface to which the cover glass 160 is adhered. The end of the first surface 641 on the ring member side is in contact with the end of the sixth surface 646 on the ring member side. The first surface 641 on the ring member side is formed along the outer edge of the sixth surface 646 on the ring member side. The first surface 641 on the ring member side is substantially parallel to the xy plane.

The end of the second surface 642 on the ring member side is in contact with the end of the first surface 641 on the ring member side. The second surface 642 on the ring member side is formed along the outer edge of the first surface 641 on the ring member side. The second surface 642 on the ring member side has a surface substantially parallel to the xz plane.

The end of the third surface 643 on the ring member side is in contact with the end of the second surface 642 on the ring member side. The third surface 643 on the ring member side is substantially parallel to the xy plane, and is substantially parallel to the first surface 641 on the ring member side.

The end of the fourth surface 644 on the ring member side is in contact with the end of the third surface 643 on the ring member side. The fourth surface 644 on the ring member side is formed along the outer edge of the third surface 643 on the ring member side. The fourth surface 644 on the ring member side has a surface parallel to the xz plane.

The end of the fifth surface 645 on the ring member side is in contact with the end of the fourth surface 644 on the ring member side. The fifth surface 645 on the ring member side is a surface formed along the outer edge of the fourth surface 644 on the ring member side. The fifth surface 645 on the ring member side is a surface substantially parallel to the xy plane. The fifth surface 645 on the ring member side is a surface substantially parallel to the first surface 641 on the ring member side and the third surface 643 on the ring member side. The fifth surface 645 on the surrounding member side is a surface bonded to the first main surface 621 on the mounting board side of the mounting board 120. The end of the fifth surface 645 on the ring member side is in contact with the end of the sixth surface 646 on the ring member side. The fifth surface 645 on the ring member side is a surface formed along the outer edge of the sixth surface 646 on the ring member side.

The image pickup unit 40 is attached to the body portion 60 via the surrounding member 140. Specifically, the image pickup unit 40 is attached to the body portion 60 by attaching the ring member 140 to the bracket 150 attached to the body portion 60.

The surrounding member 140 has a mounting hole 141, a mounting hole 142, and a mounting hole 143 as a mounting portion. These three mounting holes 141, mounting holes 142, and mounting holes 143 are all holes that penetrate from the third surface 643 on the ring member side to the fifth surface 645 on the ring member side. The mounting holes 141, mounting holes 142 and mounting holes 143 are all used to mount the surrounding member 140 to the bracket 150. The surrounding member 140 is fixed to the bracket 150 by being screwed through the mounting holes 141, the mounting holes 142 and the mounting holes 143. The ring member 140 is fixed so that a part of the third surface 643 on the ring member side of the ring member 140 is in contact with the bracket 150.

The mounting hole 141 is formed in the surrounding member 140 on the y-axis minus direction side from the position corresponding to the fourth side 424 on the mounting board side. The mounting holes 142 and 143 are formed in the surrounding member 140 on the y-axis plus direction side from the third side 423 on the mounting board side. The mounting holes 142 and 143 are formed along the x-axis direction. The mounting holes 142 and 143 are formed at the same positions in the y-axis direction. In other words, the mounting holes 141, the mounting holes 142 and the mounting holes 143 are not formed between the positions corresponding to the third side 423 on the mounting board side and the positions corresponding to the fourth side 424 on the mounting board side in the y-axis direction. ..

Further, the mounting holes 141, the mounting holes 142, and the mounting holes 143 are formed between the positions corresponding to the first side 421 on the mounting board side and the positions corresponding to the second side 422 on the mounting board side in the x-axis direction. That is, the mounting holes 141, the mounting holes 142, and the mounting holes 143 are not formed on the x-axis minus direction side from the positions corresponding to the first side 421 on the mounting board side, but from the positions corresponding to the second side 422 on the mounting board side. It is not formed on the positive side of the x-axis. As described above, the mounting board 120 is located between the mounting holes 141 and the mounting holes 142 in the y-axis direction, and is located between the mounting holes 141 and the mounting holes 143 in the y-axis direction.

The surrounding member 140 has a positioning hole 145 and a positioning hole 146. Both the positioning hole 145 and the positioning hole 146 are holes that penetrate from the third surface 643 on the ring member side to the fifth surface 645 on the ring member side. Both the positioning hole 145 and the positioning hole 146 are used to position the surrounding member 140 with respect to the bracket 150. The positioning hole 146 is formed by a fitting hole. The positioning hole 145 is formed as an elongated hole so that the position can be finely adjusted at the time of assembly.

The surrounding member 140 is positioned on the bracket 150 using the positioning hole 145 and the positioning hole 146. For example, the positioning pin provided in the bracket 150 is inserted into the positioning hole 145, and the positioning pin provided in the bracket 150 is fitted into the positioning hole 146, whereby the ring member 140 and the bracket 150 are positioned.

The surrounding member 140 is fixed by a screw in a state of being positioned with respect to the bracket 150. Specifically, the ring member 140 and the bracket 150 are fastened by inserting the screw 241 into the mounting hole 141 and the mounting hole 351 from the z-axis minus direction to the z-axis plus direction.

The ring member 140 and the bracket 150 are fastened by inserting the screw 242 into the mounting hole 142 and the mounting hole 352 from the negative z-axis direction to the positive z-axis direction. The ring member 140 and the bracket 150 are fastened by inserting the screw 243 into the mounting hole 143 and the mounting hole 353 from the z-axis minus direction to the z-axis plus direction. In this way, the surrounding member 140 is fixed to the bracket 150 by three screws 241 and 242 and 243. As will be described later, the bracket 150 is fixed to the body portion 60 in a positioned state. Therefore, the image pickup unit 40 is positioned on the body portion 60 via the bracket 150.

The bracket 150 has a first main surface 651 and a second main surface 652 opposite to the first main surface 651. As the bracket side mounting portion, it has a mounting hole 151, a mounting hole 152, and a mounting hole 153. The mounting holes 151, the mounting holes 152, and the mounting holes 153 are all holes that penetrate from the first main surface 651 to the second main surface 652 of the bracket 150. The mounting holes 151, the mounting holes 152 and the mounting holes 153 are all used for mounting the bracket 150 to the body portion 60. The bracket 150 is attached to the body portion 60 by being screwed through the mounting holes 151, the mounting holes 152 and the mounting holes 153. The bracket 150 is fixed so that a part of the first main surface 651 of the bracket 150 is in contact with the body portion 60.

The bracket 150 has a positioning hole 155 and a positioning hole 156. Both the positioning hole 155 and the positioning hole 156 are holes penetrating from the first main surface 651 to the second main surface 652. Both the positioning hole 155 and the positioning hole 156 are used to position the bracket 150 with respect to the body portion 60. The positioning hole 156 is formed by a fitting hole. The positioning hole 155 is formed as an elongated hole so that the position can be finely adjusted at the time of assembly.

The bracket 150 is positioned on the body portion 60 using the positioning holes 155 and the positioning holes 156. For example, the bracket 150 and the body portion 60 are positioned by inserting the positioning pin provided in the body portion 60 into the positioning hole 155 and fitting the positioning pin into the positioning hole 156 provided in the body portion 60.

The bracket 150 is fixed by a screw in a state of being positioned with respect to the body portion 60. Specifically, the bracket 150 and the body portion 60 are fastened by inserting the screw 251 into the mounting hole 151 and the mounting hole 61 from the z-axis minus direction to the z-axis plus direction. The bracket 150 and the body portion 60 are fastened by inserting the screw 252 into the mounting hole 152 and the mounting hole 62 from the z-axis minus direction to the z-axis plus direction. The bracket 150 and the body portion 60 are fastened by inserting the screw into the mounting hole 143 and the mounting hole 63 from the z-axis minus direction to the z-axis plus direction. In this way, the bracket 150 is attached to the body portion 60 by three screws.

The spring 68 is provided with the screw 251 inserted between the body portion 60 and the first main surface 651. The image pickup unit 40 is urged to the body portion 60 in the negative direction on the z-axis. Therefore, by adjusting the tightening amount of the screw 251, the flange back, which is the distance from the contact surface where the body side mount 26 and the lens unit come into contact with the image pickup surface of the image pickup chip 100, is adjusted.

The cover glass 160 is used to seal the image pickup chip 100. The cover glass 160 is adhered to the surrounding member 140 so as to cover the opening 148 of the surrounding member 140. The cover glass 160 forms a sealed space together with the surrounding member 140 and the mounting substrate 120. As the material of the cover glass 160, for example, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass and the like can be used. The thickness of the cover glass 160 is, for example, 0.5 mm to 0.8 mm. The cover glass 160 is an example of a translucent member having translucency. As the translucent member, quartz or the like can be applied in addition to glass.

In this way, the mounting substrate 120, the surrounding member 140, and the cover glass 160 form a sealed space. The image pickup chip 100 is arranged in a sealed space formed by the mounting substrate 120, the surrounding member 140, and the cover glass 160. This makes the image pickup chip 100 less susceptible to the influence of the external environment. For example, the image pickup chip 100 is less susceptible to the influence of moisture existing outside the sealed space. Therefore, deterioration of the image pickup chip 100 can be prevented.

The thickness of the surrounding member 140 will be described. The thickness of the ring member 140 is designed from various viewpoints such as securing a distance between the image pickup surface of the image pickup chip 100 and the cover glass 160, and the rigidity of the ring member 140. The reflection on the image caused by foreign matter or the like being attached to or scratched on the cover glass 160 can be reduced as the cover glass 160 moves away from the image pickup surface of the image pickup chip 100. From the viewpoint of reducing the influence of reflection, it is preferable that the distance between the image pickup surface of the image pickup chip 100 and the cover glass 160 is long. Therefore, the thickness of the surrounding member 140 is preferably thick. The reflection is also affected by the size of the image pickup chip 100. For example, the smaller the size of the image pickup chip 100, the deeper the depth of field, so that the effect is likely to appear when the distance between the image pickup surface of the image pickup chip 100 and the cover glass 160 is short. Therefore, the thickness of the surrounding member 140 is preferably thick.

The ring member 140 has a first surface 641 on the ring member side, a second surface 642 on the ring member side, and a third surface 643 on the ring member side located in the minus direction of the z-axis from the first surface 641 on the ring member side. It has a step portion formed by. The surrounding member 140 is attached to the bracket 150 on the third surface 643 on the surrounding member side of the surrounding member 140. The bracket 150 and the body provide a space for providing the spring 68 for adjusting the flange back without changing the flange back, which is the distance from the contact surface where the body side mount 26 and the lens unit contact to the image pickup surface of the image pickup chip 100. It can be secured between the unit 60 and the unit 60. Further, an appropriate distance can be secured between the image pickup surface of the image pickup chip 100 and the cover glass 160.

A pentaprism is provided at a position of the body portion 60 in the plus direction on the y-axis. The finder lens barrel portion 84 is provided so as to be positioned with respect to the pentaprism. The finder lens barrel portion 84 has a finder optical system provided at a position in the minus direction of the z-axis with respect to the pentaprism. The subject luminous flux guided by the pentaprism is observed as a subject image from the finder window 86 via the finder optical system in the finder lens barrel portion 84. An accessory shoe 89 is provided at a position of the finder lens barrel portion 84 in the plus direction on the y-axis. The accessory shoe 89 is equipped with an external device such as a light emitting device separate from the image pickup device, a sound collector separate from the image pickup device, and a finder device separate from the image pickup device. The finder lens barrel portion 84 and the accessory shoe 89 are located in the y-axis plus direction from the image pickup unit 40.

The mounting hole 62 is located on the x-axis minus direction side of the finder lens barrel portion 84. The mounting hole 63 is located on the x-axis plus direction side of the finder lens barrel portion 84. The mounting hole 152 and the mounting hole 153 of the bracket 150 are located on the y-axis plus direction side of the opening 350. The bracket 150 has a recess 358 between the mounting holes 152 and the mounting holes 153. Therefore, the bracket 150 can be attached to the body portion 60 so that the finder lens barrel portion 84 does not interfere with the bracket 150. The mounting hole 61 is located on the negative side of the y-axis with respect to the opening 350. The mounting hole 61 is located between the mounting hole 62 and the mounting hole 63 in the x-axis direction. Specifically, the mounting hole 61 is located between the mounting hole 62 and the mounting hole 63 in the x-axis direction. Therefore, the angle of the image pickup unit 40 with respect to the optical axis AX can be adjusted so that the image pickup surface of the image pickup chip 100 is perpendicular to the optical axis AX.

The main board 180 is provided on the z-axis negative direction side of the mounting board 120. The main board 180 has mounting holes 181 and mounting holes 182, mounting holes 183 and mounting holes 184 as mounting portions for mounting the main board 180 to a single-lens reflex camera.

The mounting holes 181 and 182 are used to mount the main board 180 on a terminal cover member that covers external input / output terminals such as USB terminals. The main board 180 is screwed to the terminal cover member using the mounting holes 181 and the mounting holes 182. The mounting holes 183 and the mounting holes 184 are used to mount the main board 180 on a battery accommodating member that accommodates a battery that supplies electric power provided to the image pickup chip 100 and the like. The main board 180 is screwed to the battery accommodating member using the mounting holes 183 and the mounting holes 184. The battery accommodating member is located on the x-axis plus direction side of the mounting board 120. The terminal cover member is located on the x-axis minus direction side of the mounting board 120.

The flexible printed circuit board 23 is connected to the mounting board 120 and the main board 180. The flexible printed circuit board 23 transmits a signal between the image pickup chip 100 and the main board 180. For example, the flexible printed circuit board 23 transmits an image signal output by the image pickup chip 100 from the mounting board 120 to the main board 180. The flexible printed circuit board 23 transmits a control signal for controlling the drive of the image pickup chip 100 from the main board 180 to the mounting board 120.

The mounting board 120 is provided with a mounting board side connector 21 to which one end of the flexible printed circuit board 23 is connected. The mounting board side connector 21 is provided on the mounting board side second main surface 622.

The main board 180 is provided with a main board side connector 22 to which the other end of the flexible printed circuit board 23 is connected. The main substrate 180 has a first main surface 681 and a second main surface 682 opposite to the first main surface 681. The second main surface 682 is located on the negative side of the z-axis. The main board side connector 22 is provided on the second main surface 682 of the main board 180.

AISC 52 is provided on the main board 180. The AISC 52 is provided on the second main surface 682. The signal from the image pickup chip 100 is output to the ASIC 52 via the flexible printed substrate 23. The ASIC 52 processes the signal acquired from the image pickup chip 100. The ASIC 52 is an example of an electronic circuit that acquires a signal generated by the image pickup chip 100 from the mounting board 120 and processes it.

The ASIC 52 generates image data for display and image data for recording based on the signal acquired from the image pickup chip 100. The image data for recording generated by the ASIC 52 is recorded on a recording medium mounted on the single-lens reflex camera. The recording medium is detachably configured on the camera body 30. The main board 180 is provided with a slot 59 for mounting a recording medium. The slot 59 may be a memory card slot in which a memory card as an example of a recording medium for recording image data is mounted. The slot 59 is provided on the first main surface 681. The ASIC 52 and the slot 59 are located on the x-axis plus direction side of the mounting board 120. In addition to the main board side connector 22 and the ASIC 52, electronic circuits such as an MPU that controls the entire single-lens reflex camera are mounted on the second main surface 682 of the main board 180.

The main board 180 has a terminal mounting portion for fixing the above-mentioned external input / output terminals. The terminal mounting portion is provided on the first main surface 681 of the main board 180. The terminal mounting portion is located on the x-axis minus direction side of the mounting board 120. Therefore, the external input / output terminal is located on the x-axis minus direction side of the mounting board 120.

The main board 180 is along the first side 481 on the main board side along the first side 421 on the mounting board side, the second side 482 on the main board side along the second side 422 on the mounting board side, and the fourth side 424 on the mounting board side. It has a third side 483 on the main board side and a fourth side 484 on the main board side. The first side 481 on the main board side is substantially parallel to the first side 421 on the mounting board side. The first side 481 on the main board side is located in the vicinity of the first side 421 on the mounting board side. The second side 482 on the main board side is substantially parallel to the second side 422 on the mounting board side. The second side 482 on the main board side is located in the vicinity of the second side 422 on the mounting board side. The third side 483 on the main board side and the fourth side 484 on the main board side are substantially parallel to the fourth side 424 on the mounting board side.

The first side 481 on the main board side is located on the minus direction side of the x-axis with respect to the first side 421 on the mounting board side. The second side 482 on the main board side is located on the x-axis plus direction side from the second side 422 on the mounting board side. The third side 483 on the main board side and the fourth side 484 on the main board side are located on the y-axis minus direction side from the fourth side 424 on the mounting board side. The position in the y-axis direction on the third side 483 on the main board side substantially coincides with the position in the y-axis direction on the fourth side 484 on the main board side.

The third side 483 on the main board side extends in the minus direction on the x-axis from the end on the minus direction side of the y-axis of the first side 481 on the main board side. The end on the x-axis plus direction side of the third side 483 on the main board side is located in the x-axis minus direction from the screw 241.

The main board 180 has a fifth side 485 on the main board side extending in the minus direction on the y-axis from an end on the plus direction side of the x-axis on the third side 483 on the main board side, and a plus direction on the x-axis from the fifth side 485 on the main board side. It further has a 6th side 486 on the main substrate side extending to the main substrate side and a 7th side 487 on the main substrate side extending in the plus direction on the y-axis from the end on the 6th side 486 on the main substrate side in the plus direction on the x-axis. The end on the x-axis plus direction side of the sixth side 486 on the main board side is located in the x-axis plus direction from the positioning hole 145. The end on the x-axis plus direction side of the sixth side 486 on the main board side is located on the x-axis minus direction side from the second side 422 on the mounting board side.

The fourth side 484 on the main board side extends in the plus direction on the x-axis from the end on the plus direction side of the y-axis on the seventh side 487 on the main board side. The second side 482 on the main board side extends in the plus direction on the y-axis from the end on the fourth side 484 on the main board side on the plus direction side of the x-axis.

The main board 180 has a main board side 8th side 488 extending in the x-axis minus direction from an end on the y-axis plus direction side of the main board side 1st side 481 and a y-axis plus direction on the main board side 2nd side 482. It further has a 9th side 489 on the main substrate side extending from the end on the side in the plus direction on the x-axis. Of the sides of the main board 180, the 8th side 488 on the main board side and the 9th side 489 on the main board side are located on the most positive side in the y-axis direction.

In the mounting board 120, the mounting board side connector 21 has a long side along the first side 421 of the mounting board side. The long side of the mounting board side connector 21 may be parallel to the first side 421 on the mounting board side. The mounting board side connector 21 is located on the x-axis minus direction side of the first short side 401 of the image pickup chip 100. The mounting board side connector 21 is provided in the vicinity of the first side 421 on the mounting board side.

In the main board 180, the main board side connector 22 has a long side along the first side 481 on the main board side. The long side of the main board side connector 22 may be parallel to the first side 481 on the main board side. The main board side connector 22 is provided in the vicinity of the first side 481 on the main board side. The main board side connector 22 is provided at a position facing the mounting board side connector 21. The mounting board side connector 21 is provided on the mounting board 120, and the main board side connector 22 is provided on the main board 180 so that the insertion port of the mounting board side connector 21 and the insertion port of the main board side connector 22 face each other. One end of the flexible printed circuit board 23 is inserted into the insertion slot of the mounting board side connector 21. The other end of the flexible printed circuit board 23 is inserted into the insertion slot of the main board side connector 22. The first main surface 681 and the second main surface 682 of the main board 180 have sides substantially parallel to the first main surface 621 on the mounting board side and the first side 421 on the mounting board side.

The mounting hole 141 is formed in the surrounding member 140 on the y-axis minus direction side from the position corresponding to the fourth side 424 on the mounting board side. The mounting holes 142 and 143 are formed in the surrounding member 140 on the y-axis plus direction side from the third side 423 on the mounting board side. The mounting hole 141, the mounting hole 142, and the mounting hole 143 are formed between the position corresponding to the first side 421 on the mounting board side and the position corresponding to the second side 422 on the mounting board side in the x-axis direction. Therefore, the first side 481 on the main board side can be extended to the vicinity of the first side 421 on the mounting board side. Since the first side 481 on the main board side can be located near the first side 421 on the mounting board side, the main board side connector 22 can be provided near the connector 21 on the mounting board side. Therefore, the length of the signal transmission path between the image pickup chip 100 and the ASIC 52 can be shortened.

In the image pickup unit 40, the first main surface 681 and the second main surface 682 of the main board 180 are located on the z-axis minus direction side from the second main surface 622 on the mounting board side. However, at least one of the first main surface 681 and the second main surface 682 of the main board 180 may be located in the z-axis plus direction from the second main surface 622 on the mounting board side. That is, at least one of the first main surface 681 and the second main surface 682 of the main board 180 may be located closer to the image pickup chip 100 than the second main surface 622 on the mounting board side. As a result, the length in the z-axis direction when the image pickup unit 40 and the main substrate 180 are incorporated in the image pickup apparatus can be shortened. Further, the length of the signal transmission path between the image pickup chip 100 and the ASIC 52 can be further shortened.

The mounting board 120 and the surrounding member 140 overlap by a distance (d1) × 2 in the x-axis direction. The mounting board 120 and the surrounding member 140 overlap each other by a distance (d1) × 2 in the y-axis direction. From the viewpoint of heat dissipation, it is preferable that the distance d1 is long. That is, it is preferable that the area S1 in which the mounting substrate 120 and the surrounding member 140 overlap is large. On the other hand, the shorter the distance d1, the lighter the image pickup unit 40 can be. That is, the smaller the area S1, the lighter the image pickup unit 40 can be. Therefore, it is desirable to design the area S1 in consideration of heat dissipation. Further, it is preferable to design the area ratio R1 which is the ratio of the area S1 to the total area of the mounting substrate 120 in consideration of heat dissipation.

FIG. 8 shows an example of the relationship between the area ratio R and the temperature of the image pickup chip 100. Here, assuming that the lengths of the first side 421 on the mounting board side and the second side 422 on the mounting board side are Y, and the lengths of the third side 423 on the mounting board side and the fourth side 424 on the mounting board side are X, the area S1 is , Expressed by the following equation 1.
(Equation 1) S1 = (X · d1) · 2 + {(Y-2d1) · d1} · 2
The area ratio R1 is expressed by the following equation 2.
(Equation 2) R1 = S1 / (XY)

FIG. 8 shows a simulation result showing the temperature difference ΔT of the image pickup chip 100 in each case where the area ratio R1 is 0.23, 0.33 and 0.43. The data in FIG. 8 shows a simulation result assuming the temperature of the image pickup chip 100 after the image pickup unit 40 is incorporated in the camera and a moving image is taken for a predetermined time. Specifically, for each of the area ratios R, the temperature when a specific temperature was applied to the imaging chip 100 for a predetermined time to reach a thermal equilibrium state was calculated, and the temperature difference ΔT was calculated.
The temperature difference ΔT indicates the difference with respect to the temperature when the area ratio R1 is 0.43. The temperature of the image pickup chip 100 when the area ratio R1 is 0.33 is 0.8 ° C. higher than the temperature of the image pickup chip 100 when the area ratio R1 is 0.43. The temperature of the image pickup chip 100 when the area ratio R1 is 0.23 is 2.1 ° C. higher than the temperature of the image pickup chip 100 when the area ratio R1 is 0.43.

When the image pickup chip 100 generates heat locally, the distance d1 near the heat generation portion of the image pickup chip 100 may be increased. For example, when a heat generating unit such as an AD conversion unit is provided along the first long side 403 of the image pickup chip 100, the distance d1 from the first long side 403 may be larger than the distance d1 from the other side. When a heat generating portion such as an AD conversion unit is provided along the second long side 404 of the image pickup chip 100, the distance d1 from the second long side 404 may be larger than the distance d1 from the other side.

As shown in FIG. 2, the image pickup unit 40 has a portion where the mounting substrate 120, the surrounding member 140, and the bracket 150 overlap each other in the z-axis direction. The mounting board 120, the surrounding member 140, and the bracket 150 overlap each other by a distance (d2) × 2 in the y-axis direction. As described above, the surrounding member 140 has a portion sandwiched between the mounting board 120 and the bracket 150 and in contact with the mounting board 120 and the bracket 150. Therefore, the thermal resistance from the mounting board 120 to the bracket 150 can be reduced as compared with the case where the mounting board 120, the surrounding member 140, and the bracket 150 do not overlap in the z-axis direction. Therefore, the heat generated by the heat source such as the image pickup chip 100 can be efficiently discharged from the mounting substrate 120 to the body portion 60 via the bracket 150. Therefore, it is possible to suppress the temperature rise of the image pickup chip 100.

From the viewpoint of heat dissipation, it is preferable that the distance d2 is long. That is, it is preferable that the area S2 on which the mounting substrate 120, the surrounding member 140, and the bracket 150 overlap is large. On the other hand, the shorter the distance d2, the lighter the image pickup unit 40 can be. That is, the smaller the area S2, the lighter the image pickup unit 40 can be. Therefore, it is desirable to design the area S2 in consideration of heat dissipation. Further, it is preferable to design the area ratio R2, which is the ratio of the area S2 to the total area of the mounting substrate 120, in consideration of heat dissipation.

FIG. 9 schematically shows an example of the board configuration of the mounting board 120. The mounting board 120 is a multilayer core board. The mounting board 120 includes a first layer 851, a core layer 807, and a second layer 852.

The first layer 851 includes a solder resist layer 801 and a wiring layer 802, an insulating layer 803, a wiring layer 804, an insulating layer 805, and a wiring layer 806. The second layer 852 includes a wiring layer 808, an insulating layer 809, a wiring layer 810, an insulating layer 811, a wiring layer 812, and a solder resist layer 813. The mounting substrate 120 is a multilayer core substrate having a core layer 807 as a core layer.

In the mounting board 120, the solder resist layer 801 and the wiring layer 802, the insulating layer 803, the wiring layer 804, the insulating layer 805, the wiring layer 806, the core layer 807, the wiring layer 808, the insulating layer 809, and the wiring layer in the negative direction of the z-axis. The 810, the insulating layer 811, the wiring layer 812, and the solder resist layer 813 are arranged in this order.

The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are, for example, resin layers. The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are resins filled with a filler. Compared to the thermal conductivity of a substrate made of a normal resin material of about 0.3 to 0.8 W / mK, the insulating layer 803, the insulating layer 805, the insulating layer 809 and the insulating layer 811 are 3 It has a thermal conductivity of about 5 W / mK. Therefore, the thermal conductivity of the mounting substrate 120 can be increased. The thickness of each of the insulating layer 803, the insulating layer 805, the insulating layer 809 and the insulating layer 811 is 30 μm to 40 μm. The thickness is the length in the z-axis direction.

The wiring layer 802, wiring layer 804, wiring layer 806, wiring layer 808, wiring layer 810, and wiring layer 812 include wiring patterns. As a material for the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812, nickel and iron alloys (for example, 42alloy, 56alloy), copper, aluminum, and the like can be used. The thickness of each of the wiring patterns included in the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812 is about 10 μm to 30 μm. As described above, the first layer 851 includes the wiring pattern of three layers. The second layer 852 includes a wiring pattern of three layers.

The core layer 807 is made of resin. The material of the core layer 807 may be FR4. The thickness of the core layer 807 is thicker than any of the insulating layers of the mounting substrate 120. The thickness of the core layer 807 is thicker than any of the wiring layers of the mounting substrate 120. The core layer 807 is about 100 μm to 400 μm. The rigidity of the core layer 807 is higher than the rigidity of any of the wirings of the mounting board 120. The rigidity of the core layer 807 may be higher than the rigidity of the first layer 851 and the second layer 852. The thickness of the solder resist layer 801 and the solder resist layer 813 is about 20 μm.

As described above, the Young's modulus of a normal resin material is about 30 [GPa], whereas the Young's modulus of the insulating layer 803, the insulating layer 805, the insulating layer 809 and the insulating layer 811 is 46 to 60 [GPa]. Is. As described above, the insulating layer 803, the insulating layer 805, the insulating layer 809 and the insulating layer 811 have a relatively high Young's modulus. Therefore, the core layer 807 can be formed of resin instead of metal. Therefore, the cost of the mounting board 120 can be reduced. In addition, shape stability at high temperatures can be improved. Further, the thickness of the mounting board 120 can be reduced. In addition, the rigidity of the mounting board 120 can be increased.

The image pickup chip 100 is mounted on the solder resist layer 801. At least a part of the wiring layer 802 is used for a wiring pattern that receives a signal output from the image pickup chip 100 via the bonding wire. A part of the wiring pattern of the other wiring layer may be used as a ground line or a power supply line.

The wiring layers of the mounting board 120 may be electrically connected to each other by vias. The pixel signal output from the image pickup chip 100 is transmitted from the uppermost wiring layer 802 to the lowermost wiring layer 812 via vias. The mounting board side connector 21 is connected to the wiring layer 812. The signal output by the image pickup chip 100 is transmitted to the main board 180 via the bonding wire, the wiring layer and vias of the mounting board 120, the mounting board side connector 21, and the flexible printed circuit board 23. The solder resist layer 813 is provided with electronic components such as capacitors, registers, and resistors. These electronic components constitute a power supply circuit or the like that supplies electric power to the circuit in the image pickup chip 100.

FIG. 10 schematically shows another example of the board configuration of the mounting board 120. The mounting board 120 is a multilayer core board. The mounting board 120 has a first layer 951, a core layer 907, a second layer 952, a core layer 911, and a third layer 953.

The first layer 951 includes a solder resist layer 901, a wiring layer 902, an insulating layer 903, a wiring layer 904, an insulating layer 905, and a wiring layer 906. The second layer 952 includes a wiring layer 908, an insulating layer 909, and a wiring layer 910. The third layer 953 includes a wiring layer 912, an insulating layer 913, a wiring layer 914, an insulating layer 915, a wiring layer 916, and a solder resist layer 917. The mounting substrate 120 is a multilayer core substrate having a core layer 907 and a core layer 911 as core layers.

In the mounting board 120, the solder resist layer 901, the wiring layer 902, the insulating layer 903, the wiring layer 904, the insulating layer 905, the wiring layer 906, the core layer 907, the wiring layer 908, the insulating layer 909, and the wiring layer in the negative direction of the z-axis. 910, core layer 911, wiring layer 912, insulating layer 913, wiring layer 914, insulating layer 915, wiring layer 916, and solder resist layer 917 are arranged in this order.

The insulating layer 903, the insulating layer 905, the insulating layer 909, the insulating layer 913, and the insulating layer 915 have the same configurations as the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811. Wiring layer 902, wiring layer 904, wiring layer 906, wiring layer 908, wiring layer 910, wiring layer 912, wiring layer 914, wiring layer 916 are wiring layer 802, wiring layer 804, wiring layer 806, wiring layer 808, wiring. It has the same configuration as the layer 810 and the wiring layer 812.

The core layer 907 and the core layer 911 have the same structure as the core layer 807. Formed of resin. The core layer 807 is about 100 μm to 300 μm. The thickness of the solder resist layer 901 and the solder resist layer 917 is about 20 μm.

The thickness of the mounting substrate 120 illustrated in FIGS. 9 and 10 may be in the range of 0.3 mm to 1.0 mm as a whole. The mounting board 120 illustrated in FIG. 10 contains a large amount of resin layer as compared with the mounting board 120 illustrated in FIG. This makes it possible to improve the heat transferability of the mounting substrate 120 in the xy plane. The insulating layer of the mounting substrate 120 may be thicker than 40 μm. For example, the thickness of the insulating layer of the mounting substrate 120 may be 100 μm. By thickening the insulating layer of the mounting substrate 120, the heat transferability in the xy plane can be further improved.

FIG. 11 shows an image pickup unit 1032 as a modification of the image pickup unit 40. In the image pickup unit 1032 illustrated in FIG. 11, members having the same configuration as each part of the image pickup unit 40 may be designated by the same reference numerals, and the description thereof may be omitted. The image pickup unit 1032 has a ring member 1040 as a modification of the ring member 140.

FIG. 11 shows a plan view of the image pickup unit 1032 as viewed from a position in the plus direction of the z-axis, and a cross-sectional view showing an AA cross section of the image pickup unit 1032. FIG. 12 shows a plan view of the image pickup unit 1032 as viewed from a position in the minus direction of the z-axis, a cross-sectional view showing a BB cross section of the image pickup unit 1032, and a cross-sectional view showing a CC cross section of the image pickup unit 1032. FIG. 13 shows a plan view of the mounting member 1010 and the surrounding member 1040 as viewed from the position in the plus direction of the z-axis.

The surrounding member 1040 has a mounting member 1010 and a frame member 1020. The mounting member 1010 is made of a material having a higher thermal conductivity than the frame member 1020. The mounting member 1010 is made of a metal such as 42alloy. The frame member 1020 is made of resin. The surrounding member 1040 is composed of a composite material of metal and resin. The mounting member 1010 may be formed by outsert molding, adhesion, or the like to the frame member 1020.

The mounting member 1010 is provided on the mounting board 120. The mounting member 1010 has a first main surface 1011 and a second main surface 1012 on the opposite side of the first main surface 1011. The second main surface 1012 of the mounting member 1010 is provided in contact with the first main surface 621 on the mounting board side of the mounting board 120.

The frame member 1020 is provided in contact with the mounting board 120 and the mounting member 1010. The frame member 1020 has a first surface 1021 that provides a first surface 641 on the ring member side, a second surface 1022 that provides a second surface 642 on the ring member side, and an edge portion of the second surface 1022 in the x-axis direction. A third surface 1023 extending substantially parallel to the xy plane, a fourth surface 1024 extending in the minus direction of the z-axis from the edge of the third surface 1023, and substantially parallel to the xy plane from the edge of the fourth surface 1024. It has a fifth surface 1025 to be stretched and a sixth surface 1026 to be stretched in the z-axis direction from the edge of the fifth surface 1025 to provide a sixth surface 646 on the ring member side.

The third surface 1023 and the fifth surface 1025 of the frame member 1020 are surfaces opposite to the first surface 1021. The third surface 1023 and the fourth surface 1024 come into contact with the mounting member 1010. The third surface 1023 comes into contact with the inner portion of the first main surface 1011 of the mounting member 1010.

The outer portion of the first main surface 1011 of the mounting member 1010 provides a third surface 643 on the ring member side. The first side surface 1013 between the first main surface 1011 and the second main surface 1012 of the mounting member 1010 provides a fourth surface 644 on the ring member side. The second side surface 1014 between the first main surface 1011 and the second main surface 1012 of the mounting member 1010 is a side surface outside the first side surface 1013. The second side surface 1014 of the mounting member 1010 contacts the fourth surface 1024 of the frame member 1020. The second main surface 1012 of the mounting member 1010 and the fifth surface 1025 of the frame member 1020 provide a fifth surface 645 on the ring member side.

According to the image pickup unit 1032, since the mounting member 1010 of a part of the surrounding member 140 is made of metal, the thermal resistance can be reduced. In addition, the strength of the portion attached to the bracket 150 can be increased. Therefore, the thickness of the mounting member 1010 can be reduced. Further, the weight can be reduced as compared with the case where the surrounding member 140 is entirely made of metal. Further, since the sixth surface 646 on the ring member side is provided with a resin, it is possible to reduce the internal reflection of the subject light on the sixth surface 646 on the ring member side. Therefore, it is possible to reduce the influence of the light reflected on the inner surface of the sixth surface 646 on the ring member side on the image obtained by the image pickup operation of the image pickup chip 100.

According to the surrounding member 1040, the mounting member 1010 has a shape that surrounds the image pickup chip 100. Therefore, the positioning accuracy of the positioning holes 145 and the positioning holes 146 provided in the mounting member 1010 can be improved. As a result, the positioning accuracy when the mounting member 1010 is mounted on the bracket 150 can be improved.

The heat radiating material 1050 and the heat radiating material 1060 described later are provided on the third surface 643 on the ring member side. The heat radiating material 1050 is provided sandwiched between the bracket 150 and the third surface 643 on the ring member side. The heat radiating material 1050 and the heat radiating material 1060 come into contact with the bracket 150 and the third surface 643 on the ring member side.

FIG. 14 shows an arrangement example of the heat radiating materials 1050 and 1060. FIG. 14 is a plan view of the surrounding member 140 as seen from the position in the plus direction of the z-axis. The heat radiating material 1050 is provided on the y-axis minus direction surface of the third surface 643 on the ring member side. The heat radiating material 1060 is provided on the y-axis plus direction surface of the third surface 643 on the ring member side.

The radiating material 1050 has a through hole 1051 at a position corresponding to the mounting hole 141. The screw 241 is inserted into the mounting hole 141 and the through hole 1051. The radiating material 1050 has a through hole 1055 into which a positioning pin is inserted at a position corresponding to the positioning hole 145.

The radiating material 1060 has a through hole 1062 at a position corresponding to the mounting hole 142. The radiating material 1060 has a through hole 1063 at a position corresponding to the mounting hole 143. The radiating material 1060 has a through hole 1066 into which the positioning pin is inserted at a position corresponding to the positioning hole 146.

The heat radiating material 1050 and the heat radiating material 1060 can reduce the thermal resistance between the mounting member 1010 and the bracket 150. Therefore, the heat generated by the image pickup chip 100 can be efficiently transferred to the bracket 150. As the heat radiating material 1050 and the heat radiating material 1060, a heat radiating sheet, a heat conductive adhesive, and the like can be exemplified.

As for the heat radiating material 1050, as shown in FIG. 14, the heat radiating material 1050 may be provided on all the surfaces of the third surface 643 on the ring member side in the minus direction of the y-axis. However, the heat radiating material 1060 may be provided only around the mounting hole 141 in the y-axis minus direction surface of the third surface 643 on the ring member side. The heat radiating material 1060 may also be provided on all surfaces in the y-axis plus direction of the third surface 643 on the ring member side as shown in FIG. However, the heat radiating material 1060 may be provided only around the mounting hole 142 and around the mounting hole 143 in the y-axis plus direction surface of the third surface 643 on the ring member side.

FIG. 15 shows an example of the surrounding member 1440 as a modification of the surrounding member 1040. The surrounding member 1440 has a mounting member 1410 and a frame member 1420. The mounting member 1410 has a first mounting member 1411 and a second mounting member 1412 separate from the first mounting member 1411. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 143, and a positioning hole 146. FIG. 15 shows a plan view of the mounting member 1410 and the surrounding member 1440 as viewed from the position in the plus direction of the z-axis.

The first mounting member 1411 and the second mounting member 1412 are provided apart from each other in the y-axis direction. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 141, and a positioning hole 146. The frame member 1020 is provided in contact with the mounting board 120 in the region between the first mounting member 1411 and the first mounting member 1411.

According to the surrounding member 1440, the first mounting member 1411 and the second mounting member 1412 can be arranged mainly in the vicinity of the portion to be mounted to the mounting portion with the bracket 150. Therefore, the weight of the surrounding member 1440 can be reduced.

FIG. 16 shows an example of the surrounding member 1540 as a modification of the surrounding member 1440. In the surrounding member 1540, the second mounting member 1412 has a third mounting member 1413 and a fourth mounting member 1414 separate from the third mounting member 1413. The third mounting member 1413 has a mounting hole 142. The fourth mounting member 1414 has a mounting hole 143 and a positioning hole 146. FIG. 16 shows a plan view of the mounting member 1410 and the surrounding member 1440 as viewed from the position in the plus direction of the z-axis.

The third mounting member 1413 and the fourth mounting member 1414 are provided apart from each other in the x-axis direction. The frame member 1020 is provided in contact with the mounting board 120 in the region between the third mounting member 1413 and the fourth mounting member 1414.

According to the surrounding member 1540, the third mounting member 1413 and the fourth mounting member 1414 can be provided mainly in the immediate vicinity of the portion to be mounted to the mounting portion with the bracket 150. Therefore, the surrounding member 1540 can be made lighter.

FIG. 17 shows an example of the surrounding member 1640 as a modification of the surrounding member 1040. The surrounding member 1640 has a mounting member 1610 as a modification of the mounting member 1010 and a frame member 1620 as a modification of the frame member 1020. The mounting member 1610 is made of a material having a higher thermal conductivity than the frame member 1620. The mounting member 1610 is made of a metal such as 42 alley. The frame member 1620 is made of resin. The surrounding member 1040 is composed of a composite material of metal and resin.

The frame member 1620 is not in contact with the mounting board 120. The frame member 1620 is provided on the first main surface 1011 of the mounting member 1610. The first side surface 1013 of the mounting member 1610 and the sixth surface 1026 of the frame member 1620 provide a sixth surface 646 on the ring member side. Further, the second main surface 1012 of the mounting member 1610 provides a fifth surface 645 on the ring member side.

According to the surrounding member 1640, the frame member 1620 is not in contact with the mounting board 120, and the contact surface between the surrounding member 1640 and the mounting board 120 is provided by the second main surface 1012 of the mounting member 1610. .. Therefore, it is not necessary to bond a plurality of types of members to the mounting board 120. Further, the shape of the frame member 1620 can be simplified. When the influence of the reflection of the subject luminous flux on the first side surface 1013 of the mounting member 1610 is small, even if the first side surface 1013 of the mounting member 1610 forms a part of the sixth surface 646 on the surrounding member side as shown in FIG. good.

FIG. 18 shows an example of the surrounding member 1740 as a modification of the surrounding member 1640. The surrounding member 1740 has a mounting member 1710 as a modification of the mounting member 1610 and a frame member 1720 as a modification of the frame member 1620. The mounting member 1710 is made of a material having a higher thermal conductivity than the frame member 1720. The mounting member 1710 is made of a metal such as 42alloy. The frame member 1720 is made of resin. The surrounding member 1740 is composed of a composite material of metal and resin.

The mounting member 1710 has a convex portion 1711 protruding in the plus direction of the z-axis on the first main surface 1011. The frame member 1720 has a recess 1721 recessed in the z-axis plus direction on the third surface 1023. The convex portion 1711 of the mounting member 1710 fits into the concave portion 1721 of the frame member 1720. This makes it possible to improve the adhesion between the mounting member 1710 and the frame member 1720.

The mounting member 1710 has a recess 1712 recessed in the z-axis plus direction on the second main surface 1012. The mounting board 120 has a convex portion 1722 protruding in the plus direction of the z-axis on the first main surface 621 on the mounting board side. The convex portion 1722 of the mounting board 120 fits into the concave portion 1712 of the mounting member 1710. As a result, the adhesion between the mounting member 1710 and the mounting board 120 can be improved. The convex portion 1711, the concave portion 1721, the concave portion 1712, and the convex portion 1722 may be provided at the same position in the xy plane.

FIG. 19 shows an example of the surrounding member 1840 as a modification of the surrounding member 1040. The surrounding member 1840 has a mounting member 1810 as a modification of the mounting member 1010 and a frame member 1820 as a modification of the frame member 1020. The mounting member 1010 is made of a material having a higher thermal conductivity than the frame member 1820. The mounting member 1810 is made of a metal such as 42alloy. The frame member 1820 is made of resin. The surrounding member 1840 is composed of a composite material of metal and resin.

The mounting member 1810 is a flat plate having a main surface substantially parallel to the xy plane and a flat plate having a main surface substantially parallel to the xy plane and located in the z-axis plus direction from the first flat plate portion 1831. It has a second flat plate portion 1832 and a connecting portion 1833 that connects the first flat plate portion 1831 and the second flat plate portion 1832. The first flat plate portion 1831 has a surface 1817 that contacts the first main surface 621 on the mounting board side of the mounting board 120. The second flat plate portion 1832 is not in contact with the mounting substrate 120. The mounting member 1810 may be formed on the frame member 1820 by insert molding.

According to the surrounding member 1840, it is possible to secure a wide adhesive surface between the mounting substrate 120 made of resin and the frame member 1820 made of resin. Therefore, the adhesive strength between the mounting substrate 120 and the surrounding member 1840 can be increased. Further, since the mounting member 1810 has the second flat plate portion 1832 located in the z-axis plus direction from the first flat plate portion 1831, the adhesion between the mounting member 1810 and the frame member 1820 can be improved.

The first flat plate portion 1831 has a convex portion protruding in the z-axis plus direction from the main surface 1841 on the z-axis plus direction side of the first flat plate portion 1831, similarly to the convex portion 1711 described with reference to FIG. good. The second flat plate portion 1832 may have a convex portion protruding in the z-axis plus direction from the main surface 1851 on the z-axis plus direction side of the second flat plate portion 1832, similarly to the convex portion 1711 described with reference to FIG. Further, the second flat plate portion 1832 has a convex portion protruding in the negative direction of the z-axis from the main surface 1852 of the second flat plate portion 1832 on the negative direction side of the z-axis, similarly to the convex portion 1711 described with reference to FIG. good. This makes it possible to improve the adhesion between the frame member 1820 and the mounting member 1810.

FIG. 20 is a cross-sectional view schematically showing another form of the image pickup unit 2040 and the body portion 60. FIG. 21 shows a perspective view of the image pickup unit 2040. The image pickup unit 2040 differs from the image pickup unit 40 in that it mainly does not have the bracket 150.

The surrounding member 2140 has a mounting hole 2141 corresponding to the mounting hole 151. The surrounding member 2140 has a mounting hole 2142 corresponding to the mounting hole 152. The surrounding member 2140 has a mounting hole 2143 corresponding to the mounting hole 153. The surrounding member 2140 has a positioning hole 2145 corresponding to the positioning hole 155 and a positioning hole 2146 corresponding to the positioning hole 156.

In the surrounding member 2140, the screw 2251 is inserted into the mounting hole 2141 and the mounting hole 61 from the minus direction of the z-axis. Similarly, in the surrounding member 2140, screws are inserted into the mounting holes 2142 and the mounting holes 62 from the minus direction of the z-axis. Further, the surrounding member 2140 is screwed into the mounting hole 2143 and the mounting hole 63 from the minus direction of the z-axis. Like the image pickup unit 40, the image pickup unit 2040 is screwed to the body portion 60 by three screws.

According to the image pickup unit 2040, the image pickup unit 2040 can be fixed to the body portion 60 without using the bracket 150. For example, the surrounding member 2140 can be directly screwed to the body portion 60. Therefore, the positioning accuracy of the image pickup chip 100 can be improved. In addition, the flange back can be greatly adjusted. In addition, the weight of the image pickup unit 40 can be reduced. Further, since the heat capacity of the surrounding member 2140 itself can be increased, it is possible to prevent the mounting substrate 120 from becoming hot.

In the examples of FIGS. 20 and 21, it is assumed that the surrounding member 2140 has a mounting hole at a position corresponding to the mounting hole of the bracket 150. However, the position of the mounting hole 2142 of the ring member 2140 in the x-axis direction is located in the plus direction on the x-axis from the first side 421 on the mounting board side and in the minus direction on the x-axis from the second side 422 on the mounting board side. good. Further, the position of the mounting hole 2143 of the ring member 2140 in the x-axis direction is also the position in the x-axis plus direction from the first side 421 on the mounting board side and the position in the x-axis minus direction from the second side 422 on the mounting board side. good. As a result, the mounting board 120 and the main board 180 can be connected in close proximity to each other.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

The order of execution of each process such as operation, procedure, step, and step in the apparatus, system, program, and method shown in the claims, the specification, and the drawing is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

21 Mounting board side connector 22 Main board side connector 23 Flexible printed circuit board 26 Body side mount 30 Camera body 31 Mirror unit 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 52 AISC
59 Slot 60 Body 61 Mounting hole 62 Mounting hole 63 Mounting hole 68 Spring 70 Focus detection unit 82 Penta prism 84 Finder lens barrel 86 Finder window 89 Accessory shoe 100 Imaging chip 120 Mounting board 140 Surrounding member 141 Mounting hole 142 Mounting hole 143 Mounting hole 145 Positioning hole 146 Positioning hole 148 Opening 150 Bracket 151 Mounting hole 152 Mounting hole 153 Mounting hole 155 Hole 156 Hole 160 Cover glass 180 Main board 181 Mounting hole 182 Mounting hole 183 Mounting hole 184 Mounting hole 241 Screw 242 Screw 243 Screw 251 Screw 252 Screw 350 Opening 351 Mounting hole 352 Mounting hole 353 Mounting hole 358 Recess 401 Short side 402 Short side 403 Long side 404 Long side 421 Mounting board side 1st side 422 Mounting board side 2nd side 423 Mounting board side 3rd Side 424 Mounting board side 4th side 481 Main board side 1st side 482 Main board side 2nd side 483 Main board side 3rd side 484 Main board side 4th side 485 Main board side 5th side 486 Main board side 6th side 487 Main board side 7th side 488 Main board side 8th side 489 Main board side 9th side 621 Mounting board side 1st main surface 622 Mounting board side 2nd main surface 641 1st surface 642 2nd surface 643 3rd surface 644 4th surface 645 5th surface 646 6th surface 651 1st main surface 652 2nd main surface 681 1st main surface 682 2nd main surface 801 Solder resist layer 802 Wiring layer 803 Insulation layer 804 Wiring layer 805 Insulation layer 806 Wiring layer 807 Core layer 808 Wiring layer 809 Insulation layer 810 Wiring layer 81 Insulation layer 812 Wiring layer 813 Solder resist layer 851 First layer 852 Second layer 901 Solder resist layer 902 Wiring layer 903 Insulation layer 904 Wiring layer 905 Insulation layer 906 Wiring layer 907 Core layer 908 Wiring layer 909 Insulation layer 910 Wiring layer 911 Core layer 912 Wiring layer 913 Insulation layer 914 Wiring layer 915 Insulation layer 916 Wiring layer 917 Solder resist layer 951 First layer 952 Second layer 953 Third layer 1010 Mounting member 1011 First 1 Main surface 1012 2nd main surface 1013 1st side surface 1014 2nd side surface 1020 Frame member 1021 1st surface 1022 2nd surface 1023 3rd surface 1024 4th surface 1025 5th surface 1026 6th surface 1032 Imaging unit 1040 Surrounding member 1050 Heat dissipation material 1051 penetration Hole 1055 Through hole 1060 Heat dissipation material 1062 Through hole 1063 Through hole 1066 Through hole 1410 Mounting member 1411 First mounting member 1412 Second mounting member 1413 Third mounting member 1414 Fourth mounting member 1420 Frame member 1440 Surrounding member 1540 Surrounding member 1610 Mounting member 1620 Frame member 1640 Surrounding member 1710 Convex 1712 Convex 1712 Frame member 1721 Recess 1722 Convex 1740 Enclosing member 1810 Mounting member 1817 Surface 1820 Frame member 1831 First flat plate 1832 Second flat plate 1833 Connection Part 1840 Surrounding member 1841 Main surface 1851 Main surface 1852 Main surface 2040 Imaging unit 2140 Surrounding member 2141 Mounting hole 2142 Mounting hole 2143 Mounting hole 2145 Positioning hole 2146 Positioning hole 2251 Screw

Claims (12)

An imaging chip that captures the subject and
The substrate on which the image pickup chip is placed and
A ring member arranged so as to surround the image pickup chip on the substrate is provided.
The surrounding member has a first mounting portion and a second mounting portion for mounting on the bracket.
The first mounting portion and the second mounting portion are image pickup units formed in regions extending outward from the substrate in a direction along the short side of the image pickup chip. In the imaging unit according to claim 1,
The first mounting portion and the second mounting portion are image pickup units having a hole portion penetrating the surrounding member. In the imaging unit according to claim 2,
The surrounding member is an image pickup unit screwed to the bracket via the hole portion of the first mounting portion and the hole portion of the second mounting portion. The imaging unit according to any one of claims 1 to 3.
The surrounding member is an image pickup unit made of resin. The imaging unit according to any one of claims 1 to 4.
The image pickup chip has a first long side and a second long side forming an outer edge of the image pickup chip together with the short side.
The first mounting portion is formed on the first long side side of the imaging chip in the surrounding member.
The second mounting portion is an imaging unit formed on the second long side side of the imaging chip in the surrounding member. In the imaging unit according to any one of claims 1 to 5.
It is equipped with electronic components for driving the image pickup chip.
The electronic component is an image pickup unit arranged on the substrate. In the imaging unit according to claim 6,
The electronic component is an image pickup unit arranged on a second surface of the substrate opposite to the first surface on which the image pickup chip is arranged. In the imaging unit according to claim 6 or 7.
The electronic component is an image pickup unit including an active element for driving the image pickup chip. In the imaging unit according to claim 8,
The active element is an image pickup unit that constitutes at least a part of a power supply circuit that supplies electric power to the image pickup chip. An image pickup apparatus comprising the image pickup unit according to any one of claims 1 to 9. In the image pickup apparatus according to claim 10,
An image pickup apparatus including a signal processing circuit that processes a signal from the image pickup chip. In the image pickup apparatus according to claim 11,
The signal processing circuit is an image pickup device arranged on a substrate different from the substrate.

Images