JP6191254B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging apparatus.

There is known a digital camera in which an upper end surface of a ceramic package having a solid-state imaging element is attached to a printed board of a camera module.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  Depending on the position where the mounting portion for attaching the structure is provided in the imaging unit, the internal space of the imaging device may not be used effectively.

  In the first aspect of the present invention, the imaging unit includes an imaging chip, a first substrate on which the imaging chip is mounted, and an encircling member that is provided on the first substrate and surrounds the imaging chip. The surrounding member is disposed on another structure at a position outside the first substrate in a short side direction of the imaging chip from a side of the first substrate along a first long side of the imaging chip. An attachment portion for attaching the surrounding member is provided.

  In the second aspect of the present invention, an imaging apparatus includes the imaging unit described above.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is sectional drawing which shows typically the imaging unit 40 and the body part 60 which a single-lens reflex camera has. The enlarged view of the A section of FIG. 1 is shown. The front view which looked at the imaging unit 40 from the z-axis plus direction is shown. The front view which looked at the imaging unit 40 from the z-axis minus direction is shown. A perspective view of imaging unit 40 is shown. An exploded perspective view of imaging unit 40 is shown. It is a rear view at the time of seeing the image pick-up unit 40 and the body part 60 from the position of a z-axis minus direction. An example of the relationship between the area ratio R and the temperature of the imaging chip 100 is shown. An example of the board | substrate structure of the mounting board | substrate 120 is shown typically. Another example of the board | substrate structure of the mounting board | substrate 120 is shown typically. An imaging unit 1032 as a modification of the imaging unit 40 is shown. The top view which looked at the imaging unit 1032 from the z-axis plus direction position, and sectional drawing which shows the AA cross section of the imaging unit 1032 are shown. The top view which looked at the attachment member 1010 and the surrounding member 1040 from the position of the z-axis plus direction is shown. The example of arrangement | positioning of the thermal radiation material 1050 and 1060 is shown. An example of the surrounding member 1440 as a modification of the surrounding member 1040 is shown. An example of the surrounding member 1540 as a modification of the surrounding member 1440 is shown. An example of the surrounding member 1640 as a modification of the surrounding member 1040 is shown. An example of the surrounding member 1740 as a modification of the surrounding member 1640 is shown. An example of the surrounding member 1840 as a modification of the surrounding member 1040 is shown. It is sectional drawing which shows typically the imaging unit 2040 and the body part 60 of another form. A perspective view of imaging unit 2040 is shown.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a cross-sectional view schematically illustrating an imaging unit 40 and a body unit 60 included in a single-lens reflex camera that is an example of an imaging apparatus according to the present embodiment. FIG. 2 shows an enlarged view of part A of FIG.

  The body part 60 is an example of a structure in a single-lens reflex camera. The body part 60 has a body side mount 26 to which a lens unit is attached. The lens unit is an interchangeable lens and can be attached to and detached from the body side mount 26. When the lens unit is mounted on the body-side mount 26, the subject light beam enters the imaging unit 40 through an optical system arranged in the lens unit.

  In the present embodiment, the direction along the optical axis AX of the optical system arranged in the lens unit is defined as the z-axis direction. That is, the direction in which the subject light beam enters the imaging chip 100 included in the imaging unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The short direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are determined in the directions illustrated in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as the front side, the front side, or the like. Further, the z-axis minus direction may be referred to as rear, rear, or the like. Further, the y-axis plus direction may be referred to as “upper”, “upper”, “upper”, or the like. The negative y-axis direction may be referred to as “down”, “down”, or “bottom”.

  The body part 60 has a mirror unit 31 at a position in the negative z-axis direction from the body side mount 26. The mirror unit 31 is supported by the body part 60. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between a position where the main mirror 32 enters the optical path of the subject luminous flux emitted from the lens unit and a position where the main mirror 32 is retracted from the optical path of the subject luminous flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32. As described above, the mirror unit 31 takes the approach state in which the subject light flux enters the optical path and the retreat state in which the subject light flux is retracted.

  When the mirror unit 31 is in the entering state, a part of the subject light beam incident on the main mirror 32 is reflected by the main mirror 32 and guided to a pentaprism 82 described later. The pentaprism 82 is provided at a position of the body portion 60 in the y-axis plus direction. The subject light flux guided to the pentaprism 82 is observed from a finder window 86 (to be described later) through a finder optical system in a finder barrel section 84 (to be described later).

  When the mirror unit 31 is in the retracted state, light beams other than the subject light beam reflected by the main mirror 32 out of the subject light beam incident on the main mirror 32 enter the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux that has passed through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the focus detection unit 70. The focus detection unit 70 has a focus detection sensor for receiving an incident light beam and detecting a focus state. The signal output from the focus detection sensor is output to the MPU provided on the main board 180 included in the imaging unit 40. The MPU detects the focus state based on the input signal.

  A shutter unit 38 and an imaging unit 40 are attached to the body portion 60. The shutter unit 38 is located in the z-axis minus direction from the mirror unit 31. The imaging unit 40 is located in the z-axis minus direction from the shutter unit 38. When the mirror unit 31 is in the retracted state and the shutter unit 38 is in the open state, the subject light beam reaches the imaging surface of the imaging chip 100 included in the imaging unit 40.

  The imaging unit 40 includes an imaging chip 100, a mounting substrate 120, a surrounding member 140, and a cover glass 160.

  The imaging chip 100 is a CMOS image sensor or a CCD image sensor. The imaging chip 100 is configured to include an imaging area formed in the central portion of the imaging chip 100 and an area located around the imaging area. In the imaging region of the imaging chip 100, an imaging surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert subject light. A peripheral circuit of the imaging chip 100 includes a processing circuit that performs signal processing on a pixel signal obtained by photoelectric conversion in the photoelectric conversion element. The processing circuit includes an AD conversion circuit that converts an input pixel signal into a digital signal.

  The imaging chip 100 is mounted on the mounting substrate 120. The mounting substrate 120 includes a mounting substrate side first main surface 621 and a mounting substrate side second main surface 622 opposite to the mounting substrate side first main surface 621. The mounting board side first main surface 621 is located in the z-axis plus direction from the mounting board side second main surface 622. The imaging chip 100 is mounted on the mounting substrate side first main surface 621 of the mounting substrate 120.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is electrically connected to the mounting substrate 120 by wire bonding, for example. The pixel signal converted into a digital signal by the AD conversion circuit of the imaging chip 100 is output to the mounting substrate 120 via a wire, for example. The imaging chip 100 is bonded to the mounting substrate 120 with an adhesive, for example. Specifically, the imaging chip 100 is bonded to the mounting substrate side first main surface 621 of the mounting substrate 120 by, for example, a thermosetting adhesive. Note that the imaging chip 100 may be mounted on the mounting substrate 120 by flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 by, for example, bumps.

  The surrounding member 140 is disposed on the mounting substrate 120. The surrounding member 140 surrounds the imaging chip 100. The surrounding member 140 is disposed on the mounting substrate side first main surface 621 of the mounting substrate 120. The surrounding member 140 is fixed to the mounting substrate 120. The surrounding member 140 is bonded to the mounting substrate 120 with an adhesive, for example. Specifically, the surrounding member 140 is bonded to the mounting substrate side first main surface 621 of the mounting substrate 120 by, for example, a thermosetting adhesive. The surrounding member 140 has an opening 148. The imaging chip 100 is accommodated in the opening 148. The opening 148 is formed in the central portion of the surrounding member 140 in the xy plane.

  The cover glass 160 is disposed on the surrounding member 140. The cover glass 160 is provided on the surrounding member side first surface 641 of the surrounding member 140. The cover glass 160 is bonded to the surrounding member 140 with an adhesive. Specifically, the cover glass 160 is bonded to the surrounding member side first surface 641 of the surrounding member 140 by, for example, a thermosetting adhesive.

  The surrounding member 140 is attached to the bracket 150 by a plurality of screws including screws 241 and screws 242. The bracket 150 is attached to the body portion 60 by a plurality of screws including screws 251 and screws 252.

  FIG. 3 is a front view of the imaging unit 40 fixed to the bracket 150 as viewed from the z-axis plus direction toward the z-axis minus direction. FIG. 4 is a front view of the imaging unit 40 fixed to the bracket 150 as viewed from the z-axis minus direction. FIG. 5 is a perspective view of the imaging unit 40 fixed to the bracket 150. FIG. 6 is an exploded perspective view of the imaging unit 40 and the bracket 150. FIG. 7 is a rear view of the imaging unit 40 and the body part 60 when viewed from the negative z-axis direction.

  The imaging chip 100 has a rectangular shape on the xy plane. The imaging chip 100 has a first short side 401 and a second short side 402, and a first long side 403 and a second long side 404. The first short side 401 is located in the minus direction of the x axis from the second short side 402. The first long side 403 is located in the y-axis plus direction from the second long side 404.

  The mounting substrate 120 has a rectangular shape in the xy plane. The mounting board 120 includes a mounting board side first side 421 along the first short side 401 of the imaging chip 100, a mounting board side second side 422 along the second short side 402 of the imaging chip 100, and the first side of the imaging chip 100. The mounting board side third side 423 along the first long side 403 and the mounting board side fourth side 424 along the second long side 404 of the imaging chip 100 are provided. The mounting substrate side first side 421 is substantially parallel to the first short side 401 of the imaging chip 100. The mounting substrate side second side 422 is substantially parallel to the second short side 402 of the imaging chip 100. The mounting substrate side third side 423 is substantially parallel to the first long side 403 of the imaging chip 100. The mounting substrate side fourth side 424 is substantially parallel to the second long side 404 of the imaging chip 100. The mounting board side first side 421 is located in the minus direction of the x axis from the mounting board side second side 422. The mounting board side third side 423 is positioned in the y-axis plus direction from the mounting board side fourth side 424.

  The surrounding member 140 includes a surrounding member side first surface 641, a surrounding member side second surface 642, a surrounding member side third surface 643, a surrounding member side fourth surface 644, and a surrounding member side. It has the 5th surface 645 and the surrounding member side 6th surface 646. The surrounding member side sixth surface 646 forms an opening 148. The imaging chip 100 is surrounded by the surrounding member side sixth surface 646. The surrounding member side sixth surface 646 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The surrounding member side first surface 641 is a surface to which the cover glass 160 is bonded. The end of the surrounding member side first surface 641 is in contact with the end of the surrounding member side sixth surface 646. The surrounding member side first surface 641 is formed along the outer edge of the surrounding member side sixth surface 646. The surrounding member side first surface 641 is substantially parallel to the xy plane.

  The end of the surrounding member side second surface 642 is in contact with the end of the surrounding member side first surface 641. The surrounding member side second surface 642 is formed along the outer edge of the surrounding member side first surface 641. The surrounding member side second surface 642 has a surface substantially parallel to the xz plane.

  The end of the surrounding member side third surface 643 is in contact with the end of the surrounding member side second surface 642. The surrounding member side third surface 643 is substantially parallel to the xy plane and is substantially parallel to the surrounding member side first surface 641.

  The end of the surrounding member side fourth surface 644 is in contact with the end of the surrounding member side third surface 643. The surrounding member side fourth surface 644 is formed along the outer edge of the surrounding member side third surface 643. The surrounding member-side fourth surface 644 has a surface parallel to the xz plane.

  The end of the surrounding member side fifth surface 645 is in contact with the end of the surrounding member side fourth surface 644. The surrounding member side fifth surface 645 is a surface formed along the outer edge of the surrounding member side fourth surface 644. The surrounding member side fifth surface 645 is a surface substantially parallel to the xy plane. The surrounding member side fifth surface 645 is a surface substantially parallel to the surrounding member side first surface 641 and the surrounding member side third surface 643. The surrounding member side fifth surface 645 is a surface that is bonded to the mounting substrate side first main surface 621 of the mounting substrate 120. The end of the surrounding member side fifth surface 645 is in contact with the end of the surrounding member side sixth surface 646. The surrounding member side fifth surface 645 is a surface formed along the outer edge of the surrounding member side sixth surface 646.

  The imaging unit 40 is attached to the body part 60 via the surrounding member 140. Specifically, the imaging unit 40 is attached to the body part 60 by attaching the surrounding member 140 to the bracket 150 attached to the body part 60.

  The surrounding member 140 has a mounting hole 141, a mounting hole 142, and a mounting hole 143 as mounting parts. These three attachment holes 141, attachment holes 142, and attachment holes 143 are all holes that penetrate from the surrounding member side third surface 643 to the surrounding member side fifth surface 645. The attachment hole 141, the attachment hole 142, and the attachment hole 143 are all used for attaching the surrounding member 140 to the bracket 150. The surrounding member 140 is fixed to the bracket 150 by being screwed through the attachment hole 141, the attachment hole 142, and the attachment hole 143. The surrounding member 140 is fixed so that a part of the surrounding member side third surface 643 of the surrounding member 140 is in contact with the bracket 150.

  The mounting hole 141 is formed on the negative side in the y-axis direction from the position corresponding to the mounting substrate side fourth side 424 in the surrounding member 140. The mounting hole 142 and the mounting hole 143 are formed on the surrounding member 140 on the y-axis plus direction side from the mounting board side third side 423. The attachment hole 142 and the attachment hole 143 are formed along the x-axis direction. The attachment hole 142 and the attachment hole 143 are formed at the same position in the y-axis direction. In other words, the mounting hole 141, the mounting hole 142, and the mounting hole 143 are not formed between the position corresponding to the mounting board side third side 423 and the position corresponding to the mounting board side fourth side 424 in the y-axis direction. .

  Further, the mounting hole 141, the mounting hole 142, and the mounting hole 143 are formed between a position corresponding to the mounting board side first side 421 and a position corresponding to the mounting board side second side 422 in the x-axis direction. That is, the mounting hole 141, the mounting hole 142, and the mounting hole 143 are not formed on the x-axis minus direction side from the position corresponding to the mounting board side first side 421, but from the position corresponding to the mounting board side second side 422. It is not formed on the x-axis plus direction side. As described above, the mounting substrate 120 is located between the attachment hole 141 and the attachment hole 142 in the y-axis direction, and is located between the attachment hole 141 and the attachment hole 143 in the y-axis direction.

  The surrounding member 140 has a positioning hole 145 and a positioning hole 146. Each of the positioning hole 145 and the positioning hole 146 is a hole that penetrates from the surrounding member side third surface 643 to the surrounding member side fifth surface 645. Both the positioning hole 145 and the positioning hole 146 are used for positioning the surrounding member 140 with respect to the bracket 150. The positioning hole 146 is a fitting hole. The positioning hole 145 is formed as a long hole so that the position can be finely adjusted during assembly.

  The surrounding member 140 is positioned on the bracket 150 using the positioning hole 145 and the positioning hole 146. For example, the positioning pin provided in the bracket 150 is inserted into the positioning hole 145, and the positioning pin provided in the bracket 150 is fitted into the positioning hole 146, whereby the surrounding member 140 and the bracket 150 are positioned.

  The surrounding member 140 is fixed with screws in a state of being positioned with respect to the bracket 150. Specifically, the surrounding member 140 and the bracket 150 are fastened by inserting the screw 241 through the attachment hole 141 and the attachment hole 351 from the z-axis minus direction toward the z-axis plus direction.

  The surrounding member 140 and the bracket 150 are fastened by inserting the screw 242 through the mounting hole 142 and the mounting hole 352 from the z-axis minus direction toward the z-axis plus direction. The surrounding member 140 and the bracket 150 are fastened by inserting the screw 243 through the attachment hole 143 and the attachment hole 353 from the z-axis minus direction toward the z-axis plus direction. As described above, the surrounding member 140 is fixed to the bracket 150 by the three screws 241, 242 and 243. As will be described later, the bracket 150 is fixed in a state of being positioned on the body portion 60. Therefore, the imaging unit 40 is positioned on the body part 60 via the bracket 150.

  The bracket 150 has a first main surface 651 and a second main surface 652 opposite to the first main surface 651. As the bracket side attachment portion, there are an attachment hole 151, an attachment hole 152, and an attachment hole 153. The attachment hole 151, the attachment hole 152, and the attachment hole 153 are all holes that penetrate from the first main surface 651 to the second main surface 652 of the bracket 150. The attachment hole 151, the attachment hole 152, and the attachment hole 153 are all used for attaching the bracket 150 to the body portion 60. The bracket 150 is attached to the body portion 60 by being screwed through the attachment hole 151, the attachment hole 152, and the attachment hole 153. The bracket 150 is fixed so that a part of the first main surface 651 of the bracket 150 is in contact with the body portion 60.

  The bracket 150 has a positioning hole 155 and a positioning hole 156. Each of the positioning hole 155 and the positioning hole 156 is a hole penetrating from the first main surface 651 to the second main surface 652. Both the positioning hole 155 and the positioning hole 156 are used for positioning the bracket 150 with respect to the body portion 60. The positioning hole 156 is a fitting hole. The positioning hole 155 is formed as a long hole so that the position can be finely adjusted during assembly.

  The bracket 150 is positioned on the body portion 60 using the positioning hole 155 and the positioning hole 156. For example, the positioning pin provided in the body part 60 is inserted into the positioning hole 155 and fitted into the positioning hole 156 provided in the body part 60, whereby the bracket 150 and the body part 60 are positioned.

  The bracket 150 is fixed by screws in a state of being positioned with respect to the body portion 60. Specifically, the bracket 150 and the body part 60 are fastened by inserting the screw 251 through the attachment hole 151 and the attachment hole 61 from the z-axis minus direction toward the z-axis plus direction. By inserting the screw 252 through the attachment hole 152 and the attachment hole 62 from the z-axis minus direction toward the z-axis plus direction, the bracket 150 and the body part 60 are fastened. The bracket 150 and the body part 60 are fastened by inserting the screw through the attachment hole 143 and the attachment hole 63 from the z-axis minus direction toward the z-axis plus direction. Thus, the bracket 150 is attached to the body part 60 with three screws.

  The spring 68 is provided in a state where the screw 251 is inserted between the body portion 60 and the first main surface 651. The imaging unit 40 is biased in the z-axis minus direction with respect to the body portion 60. Therefore, by adjusting the tightening amount of the screw 251, the flange back that is the distance from the contact surface where the body side mount 26 and the lens unit are in contact to the imaging surface of the imaging chip 100 is adjusted.

  The cover glass 160 is used for sealing the imaging chip 100. The cover glass 160 is bonded to the surrounding member 140 so as to cover the opening 148 of the surrounding member 140. The cover glass 160 forms a sealed space together with the surrounding member 140 and the mounting substrate 120. As a material of the cover glass 160, for example, borosilicate glass, quartz glass, alkali-free glass, heat-resistant glass, or the like can be used. The thickness of the cover glass 160 is, for example, 0.5 mm to 0.8 mm. The cover glass 160 is an example of a translucent member having translucency. As the translucent member, quartz or the like can be applied in addition to glass.

  Thus, a sealed space is formed by the mounting substrate 120, the surrounding member 140, and the cover glass 160. The imaging chip 100 is disposed in a sealed space formed by the mounting substrate 120, the surrounding member 140, and the cover glass 160. As a result, the imaging chip 100 is less affected by the external environment. For example, the imaging chip 100 is not easily affected by moisture existing outside the sealed space. Therefore, deterioration of the imaging chip 100 can be prevented.

  The thickness of the surrounding member 140 will be described. The thickness of the surrounding member 140 is designed from various viewpoints such as a viewpoint of securing a distance between the imaging surface of the imaging chip 100 and the cover glass 160 and a viewpoint of rigidity of the surrounding member 140. The reflection on the image due to foreign matter or the like being attached to the cover glass 160 or being scratched can be reduced as the cover glass 160 moves away from the imaging surface of the imaging chip 100. From the viewpoint of reducing the influence of reflection, it is preferable that the distance between the imaging surface of the imaging chip 100 and the cover glass 160 is long. Therefore, the surrounding member 140 is preferably thicker. Reflection is also affected by the size of the imaging chip 100. For example, since the depth of field is deeper as the size of the imaging chip 100 is smaller, the influence is likely to appear when the distance between the imaging surface of the imaging chip 100 and the cover glass 160 is short. Therefore, the surrounding member 140 is preferably thicker.

  The encircling member 140 includes an encircling member side first surface 641, an encircling member side second surface 642, and an encircling member side third surface 643 positioned in the z-axis minus direction from the encircling member side first surface 641. And a step portion formed by The surrounding member 140 is attached to the bracket 150 on the surrounding member side third surface 643 of the surrounding member 140. Without changing the flange back, which is the distance from the contact surface where the body-side mount 26 and the lens unit are in contact to the image pickup surface of the image pickup chip 100, the space for providing the above-described spring 68 for adjusting the flange back can be provided with It can be ensured between the unit 60. Furthermore, an appropriate distance can be ensured between the imaging surface of the imaging chip 100 and the cover glass 160.

  A pentaprism is provided at a position in the positive y-axis direction of the body part 60. The finder barrel portion 84 is provided to be positioned with respect to the pentaprism. The finder barrel portion 84 has a finder optical system provided at a position in the negative z-axis direction from the pentaprism. The subject luminous flux guided to the pentaprism is observed as a subject image from the finder window 86 via the finder optical system in the finder barrel 84. An accessory shoe 89 is provided at a position in the y-axis plus direction of the finder barrel portion 84. The accessory shoe 89 is mounted with an external device such as a light emitting device separate from the imaging device, a sound collecting device separate from the imaging device, and a finder device separate from the imaging device. The finder barrel portion 84 and the accessory shoe 89 are located in the y-axis plus direction from the imaging unit 40.

  The mounting hole 62 is located on the x-axis minus direction side from the finder barrel portion 84. The mounting hole 63 is located on the x-axis plus direction side from the finder barrel portion 84. The mounting hole 152 and the mounting hole 153 of the bracket 150 are located on the y axis plus direction side from the opening 350. The bracket 150 has a recess 358 between the attachment hole 152 and the attachment hole 153. Therefore, the bracket 150 can be attached to the body portion 60 so that the finder barrel portion 84 does not interfere with the bracket 150. The attachment hole 61 is located on the y axis minus direction side from the opening 350. The attachment hole 61 is located between the attachment hole 62 and the attachment hole 63 in the x-axis direction. Specifically, the attachment hole 61 is located between the attachment hole 62 and the attachment hole 63 in the x-axis direction. Therefore, the angle of the imaging unit 40 with respect to the optical axis AX can be adjusted so that the imaging surface of the imaging chip 100 is perpendicular to the optical axis AX.

  The main board 180 is provided on the negative side of the mounting board 120 in the z-axis direction. The main board 180 has a mounting hole 181, a mounting hole 182, a mounting hole 183, and a mounting hole 184 as mounting parts for mounting the main board 180 to a single-lens reflex camera.

  The attachment hole 181 and the attachment hole 182 are used for attaching the main board 180 to a terminal cover member that covers an external input / output terminal such as a USB terminal. The main board 180 is screwed to the terminal cover member using the mounting holes 181 and 182. The attachment hole 183 and the attachment hole 184 are used for attaching the main board 180 to a battery housing member that houses a battery that supplies power to the imaging chip 100 and the like. The main board 180 is screwed to the battery housing member using the mounting hole 183 and the mounting hole 184. The battery housing member is located on the x-axis plus direction side from the mounting substrate 120. The terminal cover member is located on the x-axis minus direction side from the mounting substrate 120.

  The flexible printed circuit board 23 is connected to the mounting board 120 and the main board 180. The flexible printed board 23 transmits a signal between the imaging chip 100 and the main board 180. For example, the flexible printed board 23 transmits the image signal output from the imaging chip 100 from the mounting board 120 to the main board 180. The flexible printed board 23 transmits a control signal for controlling the driving of the imaging chip 100 from the main board 180 to the mounting board 120.

  The mounting board 120 is provided with a mounting board-side connector 21 to which one end of the flexible printed board 23 is connected. The mounting board side connector 21 is provided on the mounting board side second main surface 622.

  The main board 180 is provided with a main board side connector 22 to which the other end of the flexible printed board 23 is connected. The main substrate 180 has a first main surface 681 and a second main surface 682 opposite to the first main surface 681. The second main surface 682 is located on the z-axis minus direction side. The main board connector 22 is provided on the second main surface 682 of the main board 180.

  An AISC 52 is provided on the main board 180. The AISC 52 is provided on the second main surface 682. A signal from the imaging chip 100 is output to the ASIC 52 via the flexible printed board 23. The ASIC 52 processes a signal acquired from the imaging chip 100. The ASIC 52 is an example of an electronic circuit that acquires and processes a signal generated by the imaging chip 100 from the mounting substrate 120.

  The ASIC 52 generates display image data and recording image data based on the signal acquired from the imaging chip 100. The recording image data generated by the ASIC 52 is recorded on a recording medium attached to the single-lens reflex camera. The recording medium is configured to be detachable from the camera body 30. The main board 180 is provided with a slot 59 for mounting a recording medium. The slot 59 may be a memory card slot into which a memory card as an example of a recording medium for recording image data is mounted. The slot 59 is provided on the first main surface 681. The ASIC 52 and the slot 59 are located on the x axis plus direction side from the mounting substrate 120. The second main surface 682 of the main board 180 is mounted with an electronic circuit such as an MPU that controls the entire single-lens reflex camera, in addition to the main board-side connector 22 and the ASIC 52.

  The main board 180 has a terminal mounting portion for fixing the external input / output terminal described above. The terminal attachment portion is provided on the first main surface 681 of the main board 180. The terminal mounting portion is located on the x-axis minus direction side from the mounting substrate 120. Accordingly, the external input / output terminal is located on the x-axis minus direction side from the mounting substrate 120.

  The main board 180 is along the main board side first side 481 along the mounting board side first side 421, the main board side second side 482 along the mounting board side second side 422, and the mounting board side fourth side 424. It has a main board side third side 483 and a main board side fourth side 484. The main board side first side 481 is substantially parallel to the mounting board side first side 421. The main board side first side 481 is located in the vicinity of the mounting board side first side 421. The main board side second side 482 is substantially parallel to the mounting board side second side 422. The main board side second side 482 is located in the vicinity of the mounting board side second side 422. The main board side third side 483 and the main board side fourth side 484 are substantially parallel to the mounting board side fourth side 424.

  The main board side first side 481 is located on the x-axis minus direction side with respect to the mounting board side first side 421. The main board side second side 482 is located on the x-axis plus direction side with respect to the mounting board side second side 422. The main board side third side 483 and the main board side fourth side 484 are located on the y-axis minus direction side with respect to the mounting board side fourth side 424. The position in the y-axis direction on the main board side third side 483 substantially coincides with the position in the y-axis direction on the main board side fourth side 484.

  The main board side third side 483 extends in the x axis minus direction from the end of the main board side first side 481 on the y axis minus direction side. The end on the x-axis plus direction side of the main board side third side 483 is positioned in the x-axis minus direction from the screw 241.

  The main board 180 includes a main board-side fifth side 485 extending in the y-axis minus direction from an end on the x-axis plus direction side of the main board-side third side 483 and a main board-side fifth side 485 extending in the x-axis plus direction. And a main substrate side sixth side 486 extending in the positive direction and a main substrate side seventh side 487 extending in the y axis positive direction from the end portion of the main substrate side sixth side 486 on the x axis positive direction side. The end on the x-axis plus direction side of the main board side sixth side 486 is positioned in the x-axis plus direction from the positioning hole 145. The end on the x-axis plus direction side of the main board side sixth side 486 is located on the x-axis minus direction side with respect to the mounting board side second side 422.

  The main board side fourth side 484 extends in the x axis plus direction from the end of the main board side seventh side 487 on the y axis plus direction side. The main board side second side 482 extends in the y axis plus direction from the end on the x axis plus direction side of the main board side fourth side 484.

  The main board 180 includes a main board side eighth side 488 extending in the x axis minus direction from an end of the main board side first side 481 on the y axis plus direction side, and a y axis plus direction on the main board side second side 482. And a main substrate side ninth side 489 extending in the x-axis plus direction from the side end. Among the sides of the main board 180, the main board side eighth side 488 and the main board side ninth side 489 are located on the most plus direction side in the y-axis direction.

  In the mounting board 120, the mounting board side connector 21 has a long side along the mounting board side first side 421. The long side of the mounting board side connector 21 may be parallel to the mounting board side first side 421. The mounting board side connector 21 is located on the x-axis minus direction side from the first short side 401 of the imaging chip 100. The mounting board side connector 21 is provided in the vicinity of the mounting board side first side 421.

  In the main board 180, the main board side connector 22 has a long side along the main board side first side 481. The long side of the main board side connector 22 may be parallel to the main board side first side 481. The main board side connector 22 is provided in the vicinity of the main board side first side 481. The main board side connector 22 is provided at a position facing the mounting board side connector 21. The mounting board side connector 21 is provided on the mounting board 120 and the main board side connector 22 is provided on the main board 180 so that the insertion opening of the mounting board side connector 21 and the insertion opening of the main board side connector 22 face each other. One end of the flexible printed board 23 is inserted into the insertion port of the mounting board side connector 21. The other end of the flexible printed board 23 is inserted into the insertion opening of the main board side connector 22. The first main surface 681 and the second main surface 682 of the main substrate 180 have sides substantially parallel to the mounting substrate side first main surface 621 and the mounting substrate side first side 421.

  The mounting hole 141 is formed on the negative side in the y-axis direction from the position corresponding to the mounting substrate side fourth side 424 in the surrounding member 140. The mounting hole 142 and the mounting hole 143 are formed on the surrounding member 140 on the y-axis plus direction side from the mounting board side third side 423. The mounting hole 141, the mounting hole 142, and the mounting hole 143 are formed between a position corresponding to the mounting board side first side 421 and a position corresponding to the mounting board side second side 422 in the x-axis direction. Therefore, the main board side first side 481 can be extended to the vicinity of the mounting board side first side 421. Since the main board side first side 481 can be positioned in the vicinity of the mounting board side first side 421, the main board side connector 22 can be provided in the vicinity of the mounting board side connector 21. Therefore, the length of the signal transmission path between the imaging chip 100 and the ASIC 52 can be shortened.

  In the imaging unit 40, the first main surface 681 and the second main surface 682 of the main substrate 180 are positioned on the z-axis minus direction side from the mounting substrate side second main surface 622. However, at least one of the first main surface 681 and the second main surface 682 of the main substrate 180 may be positioned in the z-axis plus direction with respect to the mounting substrate side second main surface 622. That is, at least one of the first main surface 681 and the second main surface 682 of the main substrate 180 may be positioned closer to the imaging chip 100 than the mounting substrate side second main surface 622. Thereby, the length in the z-axis direction when the imaging unit 40 and the main board 180 are incorporated in the imaging apparatus can be shortened. In addition, the length of the signal transmission path between the imaging chip 100 and the ASIC 52 can be further shortened.

  The mounting substrate 120 and the surrounding member 140 overlap each other by a distance (d1) × 2 in the x-axis direction. The mounting substrate 120 and the surrounding member 140 overlap each other by a distance (d1) × 2 in the y-axis direction. From the viewpoint of heat dissipation, the distance d1 is preferably long. That is, it is preferable that the area S1 where the mounting substrate 120 and the surrounding member 140 overlap is larger. On the other hand, the shorter the distance d1, the lighter the imaging unit 40 can be. That is, the imaging unit 40 can be reduced in weight when the area S1 is smaller. Therefore, it is desirable to design the area S1 in consideration of heat dissipation. Furthermore, it is preferable to design an area ratio R1 that is a ratio of the area S1 to the total area of the mounting substrate 120 in consideration of heat dissipation.

FIG. 8 shows an example of the relationship between the area ratio R and the temperature of the imaging chip 100. Here, when the length of the mounting substrate side first side 421 and the mounting substrate side second side 422 is Y, and the length of the mounting substrate side third side 423 and the mounting substrate side fourth side 424 is X, the area S1 is Is represented by the following formula 1.
(Expression 1) S1 = (X · d1) · 2 + {(Y−2d1) · d1} · 2
The area ratio R1 is expressed by the following formula 2.
(Formula 2) R1 = S1 / (X · Y)

FIG. 8 shows a simulation result showing the temperature difference ΔT of the imaging chip 100 when the area ratio R1 is 0.23, 0.33, and 0.43, respectively. The data in FIG. 8 shows a simulation result assuming the temperature of the imaging chip 100 after the imaging unit 40 is incorporated in the camera and a moving image is captured for a predetermined time. Specifically, for each of the area ratios R, a specific temperature was given to the imaging chip 100 for a predetermined time to calculate a temperature when a thermal equilibrium state was reached, and a temperature difference ΔT was calculated.
The temperature difference ΔT indicates a difference with respect to temperature when the area ratio R1 is 0.43. The temperature of the imaging chip 100 when the area ratio R1 is 0.33 is 0.8 ° C. higher than the temperature of the imaging chip 100 when the area ratio R1 is 0.43. The temperature of the imaging chip 100 when the area ratio R1 is 0.23 is 2.1 ° C. higher than the temperature of the imaging chip 100 when the area ratio R1 is 0.43.

  When the imaging chip 100 generates heat locally, the distance d1 of the side close to the heat generating part of the imaging chip 100 may be increased. For example, when a heating unit such as an AD converter is provided along the first long side 403 of the imaging chip 100, the distance d1 from the first long side 403 may be larger than the distance d1 from the other side. When a heating unit such as an AD conversion unit is provided along the second long side 404 of the imaging chip 100, the distance d1 from the second long side 404 may be larger than the distance d1 from the other side.

  As shown in FIG. 2, the imaging unit 40 has a portion where the mounting substrate 120, the surrounding member 140, and the bracket 150 overlap in the z-axis direction. The mounting substrate 120, the surrounding member 140, and the bracket 150 overlap each other by a distance (d2) × 2 in the y-axis direction. As described above, the surrounding member 140 has a portion that is sandwiched between the mounting substrate 120 and the bracket 150 and contacts the mounting substrate 120 and the bracket 150. Therefore, the thermal resistance from the mounting substrate 120 to the bracket 150 can be reduced as compared with the case where the mounting substrate 120, the surrounding member 140, and the bracket 150 do not overlap in the z-axis direction. Therefore, heat generated by a heat source such as the imaging chip 100 can be efficiently released from the mounting substrate 120 to the body portion 60 via the bracket 150. Therefore, the temperature rise of the imaging chip 100 can be suppressed.

  From the viewpoint of heat dissipation, a longer distance d2 is preferable. That is, it is preferable that the area S2 where the mounting substrate 120, the surrounding member 140, and the bracket 150 overlap is larger. On the other hand, the shorter the distance d2, the lighter the imaging unit 40 can be. That is, the imaging unit 40 can be reduced in weight when the area S2 is smaller. Therefore, it is desirable to design the area S2 in consideration of heat dissipation. Furthermore, it is preferable to design an area ratio R2 that is a ratio of the area S2 to the total area of the mounting substrate 120 in consideration of heat dissipation.

  FIG. 9 schematically shows an example of the board configuration of the mounting board 120. The mounting substrate 120 is a multilayer core substrate. The mounting substrate 120 includes a first layer 851, a core layer 807, and a second layer 852.

  The first layer 851 includes a solder resist layer 801, a wiring layer 802, an insulating layer 803, a wiring layer 804, an insulating layer 805 and a wiring layer 806. The second layer 852 includes a wiring layer 808, an insulating layer 809, a wiring layer 810, an insulating layer 811, a wiring layer 812, and a solder resist layer 813. The mounting substrate 120 is a multilayer core substrate having a core layer 807 as a core layer.

  In the mounting substrate 120, the solder resist layer 801, the wiring layer 802, the insulating layer 803, the wiring layer 804, the insulating layer 805, the wiring layer 806, the core layer 807, the wiring layer 808, the insulating layer 809, the wiring layer in the negative z-axis direction 810, insulating layer 811, wiring layer 812, and solder resist layer 813 are arranged in this order.

  The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are, for example, resin layers. The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are resin filled with a filler. The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 have a thermal conductivity of about 3 to 0.8 W / mK compared to a substrate formed of a normal resin material. It has a thermal conductivity of about 5 W / mK. Therefore, the thermal conductivity of the mounting substrate 120 can be increased. The thickness of each of the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 is 30 μm to 40 μm. The thickness is the length in the z-axis direction.

  The wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812 include a wiring pattern. As a material for the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like can be used. The wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring pattern of the wiring layer 812 each have a thickness of about 10 μm to 30 μm. Thus, the first layer 851 includes a three-layer wiring pattern. The second layer 852 includes a three-layer wiring pattern.

  The core layer 807 is made of resin. The material of the core layer 807 may be FR4. The thickness of the core layer 807 is thicker than any thickness of the insulating layer included in the mounting substrate 120. The thickness of the core layer 807 is thicker than any thickness of the wiring layer included in the mounting substrate 120. The core layer 807 is about 100 μm to 400 μm. The rigidity of the core layer 807 is higher than any rigidity of the wiring that the mounting substrate 120 has. The rigidity of the core layer 807 may be higher than the rigidity of the first layer 851 and the second layer 852. The thickness of the solder resist layer 801 and the solder resist layer 813 is about 20 μm.

  As described above, the Young's modulus of a normal resin material is about 30 [GPa], whereas the Young's moduli of the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are 46 to 60 [GPa]. It is. As described above, the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 have a relatively high Young's modulus. Therefore, the core layer 807 can be formed of resin instead of metal. Therefore, the cost of the mounting substrate 120 can be reduced. Moreover, the shape stability at the time of high temperature can be improved. In addition, the thickness of the mounting substrate 120 can be reduced. Further, the rigidity of the mounting substrate 120 can be increased.

  The imaging chip 100 is mounted on the solder resist layer 801. At least a part of the wiring layer 802 is used for a wiring pattern that receives a signal output from the imaging chip 100 via a bonding wire. A part of the wiring pattern of another wiring layer may be used as a ground line or a power supply line.

  The wiring layers included in the mounting substrate 120 may be electrically connected to each other by vias. The pixel signal output from the imaging chip 100 is transmitted from the uppermost wiring layer 802 to the lowermost wiring layer 812 via the via. The mounting board side connector 21 is connected to the wiring layer 812. The signal output from the imaging chip 100 is transmitted to the main board 180 via the bonding wires, the wiring layers and vias of the mounting board 120, the mounting board side connector 21, and the flexible printed board 23. The solder resist layer 813 is provided with electronic components such as capacitors, resistors, and resistors. These electronic components constitute a power supply circuit that supplies power to the circuits in the imaging chip 100.

  FIG. 10 schematically shows another example of the board configuration of the mounting board 120. The mounting substrate 120 is a multilayer core substrate. The mounting substrate 120 includes a first layer 951, a core layer 907, a second layer 952, a core layer 911, and a third layer 953.

  The first layer 951 includes a solder resist layer 901, a wiring layer 902, an insulating layer 903, a wiring layer 904, an insulating layer 905, and a wiring layer 906. The second layer 952 includes a wiring layer 908, an insulating layer 909 and a wiring layer 910. The third layer 953 includes a wiring layer 912, an insulating layer 913, a wiring layer 914, an insulating layer 915, a wiring layer 916, and a solder resist layer 917. The mounting substrate 120 is a multilayer core substrate having a core layer 907 and a core layer 911 as core layers.

  In the mounting substrate 120, the solder resist layer 901, the wiring layer 902, the insulating layer 903, the wiring layer 904, the insulating layer 905, the wiring layer 906, the core layer 907, the wiring layer 908, the insulating layer 909, the wiring layer in the negative z-axis direction 910, core layer 911, wiring layer 912, insulating layer 913, wiring layer 914, insulating layer 915, wiring layer 916 and solder resist layer 917 are arranged in this order.

  The insulating layer 903, the insulating layer 905, the insulating layer 909, the insulating layer 913, and the insulating layer 915 have structures similar to those of the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811. The wiring layer 902, the wiring layer 904, the wiring layer 906, the wiring layer 908, the wiring layer 910, the wiring layer 912, the wiring layer 914, and the wiring layer 916 are the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring The structure is similar to that of the layer 810 and the wiring layer 812.

  The core layer 907 and the core layer 911 have the same configuration as the core layer 807. Made of resin. The core layer 807 is about 100 μm to 300 μm. The thickness of the solder resist layer 901 and the solder resist layer 917 is about 20 μm.

  The thickness of the mounting substrate 120 illustrated in FIGS. 9 and 10 may be within a range of 0.3 mm to 1.0 mm as a whole. The mounting substrate 120 illustrated in FIG. 10 includes more resin layers than the mounting substrate 120 illustrated in FIG. Thereby, the heat mobility in the xy plane of the mounting substrate 120 can be improved. Note that the insulating layer of the mounting substrate 120 may be thicker than 40 μm. For example, the thickness of the insulating layer of the mounting substrate 120 may be 100 μm. By increasing the thickness of the insulating layer of the mounting substrate 120, the heat mobility in the xy plane can be further enhanced.

  FIG. 11 shows an imaging unit 1032 as a modification of the imaging unit 40. In the imaging unit 1032 illustrated in FIG. 11, members having the same configuration as each unit of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted. The imaging unit 1032 includes a surrounding member 1040 as a modification of the surrounding member 140.

  FIG. 11 shows a plan view of the image pickup unit 1032 as seen from the position in the z-axis plus direction, and a cross-sectional view showing an AA cross section of the image pickup unit 1032. FIG. 12 shows a plan view of the imaging unit 1032 as viewed from the position in the negative z-axis direction, a cross-sectional view showing the BB cross section of the imaging unit 1032, and a cross-sectional view showing the CC cross section of the imaging unit 1032. FIG. 13 is a plan view of the mounting member 1010 and the surrounding member 1040 as seen from the position in the z-axis plus direction.

  The surrounding member 1040 includes an attachment member 1010 and a frame member 1020. The attachment member 1010 is formed of a material having a higher thermal conductivity than the frame member 1020. The attachment member 1010 is formed of a metal such as 42 alloy, for example. The frame member 1020 is formed of resin. The surrounding member 1040 is composed of a composite material of metal and resin. The attachment member 1010 may be formed on the frame member 1020 by outsert molding or adhesion.

  The attachment member 1010 is provided on the mounting substrate 120. The attachment member 1010 has a first main surface 1011 and a second main surface 1012 opposite to the first main surface 1011. The second main surface 1012 of the mounting member 1010 is provided in contact with the mounting substrate side first main surface 621 of the mounting substrate 120.

  The frame member 1020 is provided in contact with the mounting substrate 120 and the mounting member 1010. The frame member 1020 includes a first surface 1021 that provides the surrounding member side first surface 641, a second surface 1022 that provides the surrounding member side second surface 642, and an edge of the second surface 1022 in the x-axis direction. A third surface 1023 extending substantially parallel to the xy plane, a fourth surface 1024 extending in the negative z-axis direction from the edge of the third surface 1023, and substantially parallel to the xy plane from the edge of the fourth surface 1024. It has a fifth surface 1025 that extends, and a sixth surface 1026 that extends in the z-axis direction from the edge of the fifth surface 1025 and provides the surrounding member-side sixth surface 646.

  The third surface 1023 and the fifth surface 1025 of the frame member 1020 are surfaces opposite to the first surface 1021. The third surface 1023 and the fourth surface 1024 are in contact with the attachment member 1010. The third surface 1023 is in contact with the inner part of the first main surface 1011 of the mounting member 1010.

  The outer portion of the first main surface 1011 of the mounting member 1010 provides a surrounding member side third surface 643. A first side surface 1013 between the first main surface 1011 and the second main surface 1012 of the mounting member 1010 provides a surrounding member side fourth surface 644. A second side surface 1014 between the first main surface 1011 and the second main surface 1012 of the attachment member 1010 is a side surface outside the first side surface 1013. The second side surface 1014 of the mounting member 1010 contacts the fourth surface 1024 of the frame member 1020. The second main surface 1012 of the mounting member 1010 and the fifth surface 1025 of the frame member 1020 provide a surrounding member-side fifth surface 645.

  According to the imaging unit 1032, since a part of the mounting member 1010 of the surrounding member 140 is formed of metal, the thermal resistance can be reduced. Further, the strength of the part attached to the bracket 150 can be increased. Therefore, the thickness of the attachment member 1010 can be reduced. Further, the weight can be reduced as compared with the case where the surrounding member 140 is entirely made of metal. Moreover, since the surrounding member side sixth surface 646 is provided by resin, it is possible to reduce internal reflection of subject light on the surrounding member side sixth surface 646. Therefore, the influence of the light reflected from the inner surface on the surrounding member side sixth surface 646 on the image obtained by the imaging operation of the imaging chip 100 can be reduced.

  According to the surrounding member 1040, the mounting member 1010 has a shape surrounding the imaging chip 100. Therefore, the positioning accuracy of the positioning hole 145 and the positioning hole 146 provided in the attachment member 1010 can be improved. Thereby, the positioning accuracy when attaching the attachment member 1010 to the bracket 150 can be enhanced.

  The heat radiating material 1050 and the heat radiating material 1060 described later are provided on the surrounding member side third surface 643. The heat dissipation material 1050 is provided between the bracket 150 and the surrounding member side third surface 643. The heat dissipation material 1050 and the heat dissipation material 1060 are in contact with the bracket 150 and the surrounding member side third surface 643.

  FIG. 14 shows an arrangement example of the heat dissipation materials 1050 and 1060. FIG. 14 is a plan view of the surrounding member 140 as viewed from the position in the z-axis plus direction. The heat dissipation material 1050 is provided on the surface in the negative y-axis direction of the surrounding member side third surface 643. The heat dissipating material 1060 is provided on the surface in the y-axis plus direction on the surrounding member side third surface 643.

  The heat dissipation material 1050 has a through hole 1051 at a position corresponding to the mounting hole 141. The screw 241 is inserted into the mounting hole 141 and the through hole 1051. The heat dissipation material 1050 has a through hole 1055 into which a positioning pin is inserted at a position corresponding to the positioning hole 145.

  The heat dissipating material 1060 has a through hole 1062 at a position corresponding to the mounting hole 142. The heat dissipating material 1060 has a through hole 1063 at a position corresponding to the mounting hole 143. The heat dissipating material 1060 has a through hole 1066 into which a positioning pin is inserted at a position corresponding to the positioning hole 146.

  With the heat dissipation material 1050 and the heat dissipation material 1060, the thermal resistance between the mounting member 1010 and the bracket 150 can be reduced. Therefore, the heat generated in the imaging chip 100 can be efficiently transmitted to the bracket 150. Examples of the heat dissipation material 1050 and the heat dissipation material 1060 include a heat dissipation sheet and a heat conductive adhesive.

  As shown in FIG. 14, the heat dissipating material 1050 may be provided on all surfaces of the surrounding member side third surface 643 in the negative y-axis direction. However, the heat radiating member 1060 may be provided only around the attachment hole 141 in the surface in the y-axis minus direction of the surrounding member side third surface 643. The heat dissipating material 1060 may also be provided on all surfaces in the positive y-axis direction of the surrounding member side third surface 643 as shown in FIG. However, the heat radiation member 1060 may be provided only around the attachment hole 142 and around the attachment hole 143 in the surface in the y-axis plus direction of the surrounding member side third surface 643.

  FIG. 15 shows an example of the surrounding member 1440 as a modification of the surrounding member 1040. The surrounding member 1440 includes a mounting member 1410 and a frame member 1420. The attachment member 1410 includes a first attachment member 1411 and a second attachment member 1412 that is different from the first attachment member 1411. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 143, and a positioning hole 146. FIG. 15 is a plan view of the mounting member 1410 and the surrounding member 1440 as viewed from the z-axis plus direction.

  The first attachment member 1411 and the second attachment member 1412 are provided separately in the y-axis direction. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 141, and a positioning hole 146. The frame member 1020 is provided in contact with the mounting substrate 120 in a region between the first mounting member 1411 and the first mounting member 1411.

  According to the surrounding member 1440, the first mounting member 1411 and the second mounting member 1412 can be arranged mainly in the vicinity of the portion attached to the mounting portion with the bracket 150. Therefore, the surrounding member 1440 can be reduced in weight.

  FIG. 16 shows an example of the surrounding member 1540 as a modification of the surrounding member 1440. In the surrounding member 1540, the second mounting member 1412 includes a third mounting member 1413 and a fourth mounting member 1414 that is different from the third mounting member 1413. The third attachment member 1413 has an attachment hole 142. The fourth mounting member 1414 has a mounting hole 143 and a positioning hole 146. FIG. 16 is a plan view of the attachment member 1410 and the surrounding member 1440 as viewed from the z-axis plus direction.

  The third attachment member 1413 and the fourth attachment member 1414 are provided apart from each other in the x-axis direction. The frame member 1020 is provided in contact with the mounting substrate 120 in a region between the third mounting member 1413 and the fourth mounting member 1414.

  According to the surrounding member 1540, the third attachment member 1413 and the fourth attachment member 1414 can be provided mainly in the vicinity of the portion attached to the attachment portion with the bracket 150. Therefore, the surrounding member 1540 can be further reduced in weight.

  FIG. 17 shows an example of the surrounding member 1640 as a modification of the surrounding member 1040. The surrounding member 1640 includes an attachment member 1610 as a modification of the attachment member 1010 and a frame member 1620 as a modification of the frame member 1020. The attachment member 1610 is formed of a material having a higher thermal conductivity than the frame member 1620. The attachment member 1610 is made of a metal such as 42 alloy, for example. Frame member 1620 is formed of resin. The surrounding member 1040 is composed of a composite material of metal and resin.

  The frame member 1620 is not in contact with the mounting substrate 120. The frame member 1620 is provided on the first main surface 1011 of the mounting member 1610. The first side surface 1013 of the mounting member 1610 and the sixth surface 1026 of the frame member 1620 provide the surrounding member side sixth surface 646. Further, the second main surface 1012 of the mounting member 1610 provides the surrounding member side fifth surface 645.

  According to the surrounding member 1640, the frame member 1620 is not in contact with the mounting substrate 120, and a contact surface between the surrounding member 1640 and the mounting substrate 120 is provided by the second main surface 1012 of the mounting member 1610. . Therefore, it is not necessary to bond a plurality of types of members to the mounting substrate 120. Further, the shape of the frame member 1620 can be simplified. When the influence of the reflection of the subject light beam on the first side surface 1013 of the mounting member 1610 is small, the first side surface 1013 of the mounting member 1610 forms part of the surrounding member side sixth surface 646 as shown in FIG. Good.

  FIG. 18 shows an example of the surrounding member 1740 as a modification of the surrounding member 1640. The surrounding member 1740 includes an attachment member 1710 as a modification of the attachment member 1610 and a frame member 1720 as a modification of the frame member 1620. The attachment member 1710 is formed of a material having a higher thermal conductivity than the frame member 1720. The attachment member 1710 is made of a metal such as 42 alloy, for example. The frame member 1720 is formed of resin. The surrounding member 1740 is made of a composite material of metal and resin.

  The attachment member 1710 has a convex portion 1711 protruding on the first main surface 1011 in the z-axis plus direction. The frame member 1720 has a recess 1721 that is recessed in the z-axis plus direction on the third surface 1023. The convex portion 1711 of the mounting member 1710 is fitted into the concave portion 1721 of the frame member 1720. Thereby, the adhesiveness of the attachment member 1710 and the frame member 1720 can be improved.

  The mounting member 1710 has a recess 1712 that is recessed in the z-axis plus direction on the second main surface 1012. The mounting substrate 120 has a convex portion 1722 that protrudes in the z-axis plus direction on the mounting substrate side first main surface 621. The convex portion 1722 of the mounting substrate 120 fits into the concave portion 1712 of the mounting member 1710. Thereby, the adhesion between the mounting member 1710 and the mounting substrate 120 can be enhanced. In addition, the convex part 1711, the recessed part 1721, the recessed part 1712, and the convex part 1722 may be provided in the same position in xy plane.

  FIG. 19 shows an example of the surrounding member 1840 as a modification of the surrounding member 1040. The surrounding member 1840 includes an attachment member 1810 as a modification of the attachment member 1010 and a frame member 1820 as a modification of the frame member 1020. The attachment member 1010 is formed of a material having a higher thermal conductivity than the frame member 1820. The attachment member 1810 is formed of a metal such as 42 alloy, for example. The frame member 1820 is made of resin. The surrounding member 1840 is made of a composite material of metal and resin.

  The mounting member 1810 includes a flat plate-like first flat plate portion 1831 having a main surface substantially parallel to the xy plane, and a flat plate positioned in the z-axis plus direction from the first flat plate portion 1831 and having a main surface substantially parallel to the xy plane. And a connecting portion 1833 that connects the first flat plate portion 1831 and the second flat plate portion 1832. The first flat plate portion 1831 has a surface 1817 that contacts the mounting substrate side first main surface 621 of the mounting substrate 120. The second flat plate portion 1832 is not in contact with the mounting substrate 120. The attachment member 1810 may be formed on the frame member 1820 by insert molding.

  According to the surrounding member 1840, it is possible to ensure a wide bonding surface between the mounting substrate 120 formed of resin and the frame member 1820 formed of resin. Therefore, the adhesive strength between the mounting substrate 120 and the surrounding member 1840 can be increased. Further, since the mounting member 1810 has the second flat plate portion 1832 positioned in the z-axis plus direction from the first flat plate portion 1831, the adhesion between the mounting member 1810 and the frame member 1820 can be improved.

  In addition, the 1st flat plate part 1831 has the convex part which protrudes in the z-axis plus direction from the main surface 1841 of the z-axis plus direction side of the 1st flat plate part 1831 similarly to the convex part 1711 demonstrated in FIG. Good. The second flat plate portion 1832 may have a convex portion that protrudes in the z-axis positive direction from the main surface 1851 on the z-axis positive direction side of the second flat plate portion 1832, similarly to the convex portion 1711 described in FIG. 17. Moreover, the 2nd flat plate part 1832 has the convex part which protrudes in the z-axis minus direction from the main surface 1852 of the z-axis minus direction side of the 2nd flat plate part 1832 similarly to the convex part 1711 demonstrated in FIG. Good. Thereby, the adhesiveness of the frame member 1820 and the attachment member 1810 can be improved.

  FIG. 20 is a cross-sectional view schematically showing an imaging unit 2040 and a body portion 60 of another form. FIG. 21 shows a perspective view of the imaging unit 2040. The imaging unit 2040 is different from the imaging unit 40 in that it does not mainly have the bracket 150.

  The surrounding member 2140 has a mounting hole 2141 corresponding to the mounting hole 151. The surrounding member 2140 has a mounting hole 2142 corresponding to the mounting hole 152. The surrounding member 2140 has a mounting hole 2143 corresponding to the mounting hole 153. The surrounding member 2140 has a positioning hole 2145 corresponding to the positioning hole 155 and a positioning hole 2146 corresponding to the positioning hole 156.

  In the surrounding member 2140, screws 2251 are inserted into the attachment holes 2141 and 61 from the minus direction of the z axis. Similarly, in the surrounding member 2140, screws are inserted into the attachment hole 2142 and the attachment hole 62 from the minus direction of the z axis. Further, the surrounding member 2140 is screwed by inserting screws into the mounting hole 2143 and the mounting hole 63 from the negative direction of the z axis. Similar to the imaging unit 40, the imaging unit 2040 is screwed to the body portion 60 with three screws.

  According to the imaging unit 2040, the imaging unit 2040 can be fixed to the body portion 60 without using the bracket 150. For example, the surrounding member 2140 can be screwed directly to the body portion 60. Therefore, the positioning accuracy of the imaging chip 100 can be increased. In addition, the flange back can be largely adjusted. Moreover, the imaging unit 40 can be reduced in weight. Moreover, since the heat capacity of the surrounding member 2140 itself can be increased, it is possible to suppress the mounting substrate 120 from becoming high temperature.

  20 and 21, the surrounding member 2140 has a mounting hole at a position corresponding to the mounting hole of the bracket 150. However, the position in the x direction of the mounting hole 2142 of the surrounding member 2140 is a position in the x-axis plus direction from the mounting board side first side 421 and a position in the x axis minus direction from the mounting board side second side 422. Good. Further, the position in the x direction of the mounting hole 2143 of the surrounding member 2140 is also located in the x axis plus direction from the mounting board side first side 421 and in the x axis minus direction from the mounting board side second side 422. Good. Thereby, the mounting substrate 120 and the main substrate 180 can be connected in proximity.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

21 Mounting board side connector 22 Main board side connector 23 Flexible printed circuit board 26 Body side mount 30 Camera body 31 Mirror unit 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 52 AISC
59 slot 60 body portion 61 mounting hole 62 mounting hole 63 mounting hole 68 spring 70 focus detection unit 82 pentaprism 84 finder barrel portion 86 finder window 89 accessory shoe 100 imaging chip 120 mounting substrate 140 surrounding member 141 mounting hole 142 mounting hole 143 mounting hole 145 positioning hole 146 positioning hole 148 opening 150 bracket 151 mounting hole 152 mounting hole 153 mounting hole 155 hole 156 hole 160 cover glass 180 main board 181 mounting hole 182 mounting hole 183 mounting hole 184 mounting hole 241 screw 242 screw 243 Screw 251 Screw 252 Screw 350 Opening 351 Mounting hole 352 Mounting hole 353 Mounting hole 358 Recess 401 Short side 402 Short side 403 Long side 404 Long side 421 Mounting board side first side 422 Mounting board side second side 423 Mounting board Side side 424 Mounting board side fourth side 481 Main board side first side 482 Main board side second side 483 Main board side third side 484 Main board side fourth side 485 Main board side fifth side 486 Main board side Sixth side 487 Main board side seventh side 488 Main board side eighth side 489 Main board side ninth side 621 Mounting board side first main surface 622 Mounting board side second main surface 641 First surface 642 Second surface 643 3rd surface 644 4th surface 645 5th surface 646 6th surface 651 1st main surface 652 2nd main surface 681 1st main surface 682 2nd main surface 801 Solder resist layer 802 Wiring layer 803 Insulating layer 804 Wiring layer 805 Insulating layer 806 Wiring layer 807 Core layer 808 Wiring layer 809 Insulating layer 810 Wiring layer 811 Insulating layer 812 Wiring layer 813 Solder resist layer 851 First layer 852 Second layer 901 Solder resist 902 wiring layer 903 insulating layer 904 wiring layer 905 insulating layer 906 wiring layer 907 core layer 908 wiring layer 909 insulating layer 910 wiring layer 911 core layer 912 wiring layer 913 insulating layer 914 wiring layer 915 insulating layer 916 wiring layer 917 solder resist layer 951 First layer 952 Second layer 953 Third layer 1010 Mounting member 1011 First main surface 1012 Second main surface 1013 First side surface 1014 Second side surface 1020 Frame member 1021 First surface 1022 Second surface 1023 Third surface 1024 Fourth Surface 1025 5th surface 1026 6th surface 1032 Imaging unit 1040 Surrounding member 1050 Heat dissipating material 1051 Through hole 1055 Through hole 1060 Heat dissipating material 1062 Through hole 1063 Through hole 1066 Through hole 1410 Mounting member 1411 First mounting member 1412 Second mounting member 1413 Third mounting member 1414 Fourth mounting member 1420 Frame member 1440 Surrounding member 1540 Surrounding member 1610 Mounting member 1620 Frame member 1640 Surrounding member 1710 Mounting member 1711 Convex portion 1712 Recessed portion 1720 Frame member 1721 Concavity portion 1722 Convex portion 1740 Surrounding member 1810 Mounting member 1817 Surface 1820 Frame member 1831 First flat plate portion 1832 Second flat plate portion 1833 Connection portion 1840 Surrounding member 1841 Main surface 1851 Main surface 1852 Main surface 2040 Imaging unit 2140 Surrounding member 2141 Mounting hole 2142 Mounting hole 2143 Mounting hole 2145 Positioning hole 2146 Positioning Hole 2251 Screw

Claims (14)

An imaging chip for imaging a subject ;
A first substrate on which the imaging chip is disposed ;
An encircling member disposed on the first substrate and encircling the imaging chip;
An electronic component disposed on the substrate and driving the imaging chip;
An optical element fixed to the surrounding member so as to form a sealed space together with the first substrate and the surrounding member ,
The encircling member surrounds the other structure at a position outside the first substrate in the short side direction of the imaging chip from the side of the first substrate along the first long side of the imaging chip. An imaging unit having an attachment portion for attaching a member.   The imaging unit according to claim 1,
  The electronic component is an imaging unit disposed on a second surface opposite to a first surface on which the imaging chip is disposed on the substrate.   The imaging unit according to claim 2,
  In the second surface, the electronic component is an imaging unit disposed in a region on the opposite side of the region where the imaging chip is disposed in the first surface.   The imaging unit according to any one of claims 1 to 3,
  The electronic component is an imaging unit including an active element that drives the imaging chip.   The imaging unit according to claim 4,
  The active element is an imaging unit that constitutes at least a part of a power supply circuit that supplies power to the imaging chip. The imaging unit according to the signal generated by the imaging chip to any one of claims 1 to 5, further comprising a second substrate having an electronic circuit for processing acquired from the first substrate. The second substrate is substantially parallel to the first substrate side first main surface on which the imaging chip is mounted on the first substrate, and the first side along the first short side of the imaging chip on the first substrate. The imaging unit according to claim 6 , further comprising a second substrate side main surface having sides substantially parallel to. The first substrate has a first substrate side second main surface which is a main surface opposite to the first substrate side first main surface;
The imaging unit according to claim 7 , wherein at least one of the two second substrate side main surfaces of the second substrate is located closer to the imaging chip than the first substrate side second main surface. A bracket for attaching the imaging unit to a body portion to which the lens unit is attached;
The bracket includes a first attachment portion bracket side attached to said body portion, according to any one of claims 1 to 8 having said surrounding member of the mounting portion bracket side second attachment portion attached to Imaging unit. The imaging unit according to claim 9 , wherein the surrounding member has a portion that is sandwiched between the first substrate and the bracket and contacts the first substrate and the bracket. The imaging unit according to any one of claims 1 to 8 , wherein the attachment portion of the surrounding member is attached in contact with a body portion to which a lens unit is attached. The mounting portion has an opening into which a screw for mounting the surrounding member to the body portion is inserted in a direction substantially orthogonal to the imaging surface of the imaging chip,
The imaging unit is provided between the attachment portion of the surrounding member and the body portion, and is biased in a direction separating the surrounding member from the body portion, whereby the lens unit is disposed in the body portion. The imaging unit according to claim 11 , further comprising a spring member for adjusting a distance between a mounting surface to be mounted and the imaging surface. It said surrounding member is disposed on the first substrate, a mounting member made of metal, to any one of claims 1 to 12 and a frame member formed of a resin integrally with the mounting member The imaging unit described. An imaging device comprising the imaging unit according to any one of claims 1 to 13 .