JP6357784B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging apparatus.

An imaging unit having a package structure in which an imaging chip is mounted in a ceramic package is known.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  In a manufacturing process of an imaging unit including an imaging chip and a mounting substrate provided with an imaging chip surrounding member, the surrounding member may be warped. When the surrounding member is warped, the mounting substrate may be warped.

  In the first aspect, the imaging unit includes a mounting substrate, an imaging chip mounted on the mounting surface of the mounting substrate, a first surrounding portion provided on the mounting substrate and surrounding the imaging chip, and a first ring. And a second surrounding portion that surrounds the imaging chip. The first surrounding portion extends in a direction along the mounting surface to a second surface opposite to the first surface that contacts the mounting substrate. A protrusion is formed, and the second surrounding part is provided in the first surrounding part at least in contact with the upper surface of the protrusion.

  In the second aspect, the imaging unit includes a mounting substrate, an imaging chip mounted on the mounting substrate, a first surrounding portion provided on the mounting substrate and surrounding the imaging chip, and a first surrounding portion. And a second surrounding portion surrounding the imaging chip, wherein the first surrounding portion has a first width from an inner edge portion surrounding the imaging chip to an outer edge portion outside the inner edge portion. A first portion and a second portion having a second width greater than the first width from the inner edge to the outer edge, and the second surrounding portion includes the first portion and the second portion The first surrounding portion is provided on the second surface opposite to the first surface in contact with the mounting substrate, and the second surrounding portion is in contact with the first portion in the direction from the inner edge portion to the outer edge portion. Is smaller than the length of the second surrounding portion in contact with the second portion.

  In a third aspect, an imaging device includes the imaging unit.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is typical sectional drawing of the camera 10 which is an example of an imaging device. It is a top view which shows typically the imaging unit 40 which has the flame | frame 140 which concerns on 1st Example. It is a figure which shows the flame | frame 140 typically. It is sectional drawing which shows the AA cross section of FIG. 2 typically. It is sectional drawing which expands and shows the C section of FIG. It is sectional drawing which shows the BB cross section of FIG. 2 typically. It is a rear view which shows typically the flame | frame 740 which concerns on 2nd Example. It is sectional drawing which shows typically the imaging unit 890 provided with the flame | frame 840 which concerns on 3rd Example. It is sectional drawing which shows typically the imaging unit 990 provided with the flame | frame 940 which concerns on 4th Example.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic cross-sectional view of a camera 10 that is an example of an imaging apparatus. The camera 10 includes a lens unit 20 and a camera body 30. The lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides an incident subject light flux to the imaging unit 40 of the camera body 30.

  In the present embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject light beam enters the imaging chip 100 included in the imaging unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The short direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are determined in the directions illustrated in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as front, front, upper, or the like. Also, the z-axis minus direction may be referred to as rear, rear, lower, etc. Further, a view when viewed in the z-axis minus direction from a position in the z-axis plus direction may be referred to as a top view or the like. Further, a view when viewed in the z-axis plus direction from a position in the z-axis minus direction may be referred to as a rear view or the like.

  The camera body 30 has a mirror unit 31 at a position in the negative z-axis direction from the body mount 26 coupled to the lens mount 24. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between an entry position where it enters the optical path of the subject light beam emitted from the lens unit 20 and a retreat position where it is retracted from the optical path of the subject light flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32. As described above, the mirror unit 31 takes the approach state in which the subject light flux enters the optical path and the retreat state in which the subject light flux is retracted.

  When the mirror unit 31 is in the entering state, a part of the subject light beam incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is disposed at a position conjugate with the imaging surface of the imaging chip 100 included in the imaging unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the finder window 86 through the pentaprism 82 and the finder optical system 84.

  When the mirror unit 31 is in the entering state, light beams other than the subject light beam reflected by the main mirror 32 out of the subject light beam incident on the main mirror 32 enter the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux that has passed through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light beam to a focus detection sensor 72 for detecting the focus position. The focus detection sensor 72 outputs the focus position detection result to the MPU 51.

  The focus plate 80, the pentaprism 82, the main mirror 32, the sub mirror 33, and the finder optical system 84 are supported by a mirror box 60 as a support member. When the mirror unit 31 is in the retracted state and the front curtain and the rear curtain of the shutter unit 38 are in the open state, the subject luminous flux that passes through the lens unit 20 reaches the imaging surface of the imaging chip 100.

  A substrate 62 and a display unit 88 are sequentially arranged at a position in the negative z-axis direction of the imaging unit 40. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image generated from the output signal from the imaging chip 100.

  Electronic circuits such as MPU 51 and ASIC 52 are mounted on the substrate 62. The MPU 51 is responsible for overall control of the camera 10. An output signal from the imaging chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

  The ASIC 52 generates image data for display based on the output signal from the imaging chip 100. The display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the imaging chip 100. The ASIC 52 generates image data for recording by performing, for example, image processing or compression processing on the output signal of the imaging chip. The recording image data generated by the ASIC 52 is recorded on a recording medium attached to the camera body 30. The recording medium is configured to be detachable from the camera body 30.

  FIG. 2 is a top view schematically showing the imaging unit 40 having the frame 140 according to the first embodiment. FIG. 3 is a diagram schematically showing the frame 140. FIG. 3A is a top view schematically showing the frame 140. FIG. 3B is a rear view schematically showing the frame 140. FIG. 4 is a cross-sectional view schematically showing the AA cross section of FIG. FIG. 5 is an enlarged cross-sectional view of a portion C in FIG.

  The imaging unit 40 includes an imaging chip 100, a mounting substrate 120, a frame 140, and a cover glass 160. The imaging chip 100 is a CMOS image sensor or a CCD image sensor. The imaging chip 100 includes an imaging area 101 and a peripheral area 102. The imaging region 101 is formed in the central part of the imaging chip 100. In the imaging region 101 of the imaging chip 100, an imaging surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert subject light. The peripheral area 102 of the imaging chip 100 is located around the imaging area 101. The peripheral area 102 of the imaging chip 100 includes a processing circuit that reads out a pixel signal obtained by photoelectric conversion in the photoelectric conversion element and performs signal processing. The processing circuit includes an AD conversion circuit that converts the output pixel signal into a digital signal.

  The imaging chip 100 has a rectangular shape on the xy plane. The imaging chip 100 has a first short side 105a and a second short side 105b, and a first long side 106a and a second long side 106b. The first short side 105a is located in the x-axis plus direction from the second short side 105b. The first long side 106a is positioned in the y-axis plus direction from the second long side 106b.

  The imaging chip 100 is mounted on the mounting substrate 120. The imaging chip 100 is mounted on the mounting substrate 120 by, for example, flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 via bonding wires 110. The pixel signal converted into a digital signal by the AD conversion circuit of the imaging chip 100 is output to the mounting substrate 120 via the bonding wire 110. The imaging chip 100 is bonded to the mounting substrate 120 with an adhesive. The imaging chip 100 is accommodated in the opening 138 of the frame 140. The frame 140 is an example of a surrounding member that surrounds the imaging chip 100.

  The mounting substrate 120 mounts the imaging chip 100. The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having the core layer 207 as a core layer.

  On the mounting substrate 120, along the optical axis 22, the imaging chip 100, solder resist layer 201, wiring layer 202, insulating layer 203, wiring layer 204, insulating layer 205, core layer 207, insulating layer 215, wiring layer 214, insulating The layer 213, the wiring layer 212, and the solder resist layer 211 are arranged in this order.

  The insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 are, for example, resin layers. The thickness of each of the insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 is 20 μm to 50 μm. The thickness is a length in the z-axis direction.

  The wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 include a wiring pattern. As a material for the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like can be used. Each of the wiring patterns included in the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 has a thickness of about 10 μm to 50 μm.

  The core layer 207 is made of metal. When the core layer 207 is formed of a metal, for example, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like may be used as the material of the core layer 207. The thickness of the core layer 207 is thicker than any of the wiring layers 202, 204, 214, and 212. The thickness of the core layer 207 is thicker than any of the insulating layers 203, 205, 215, and 213. Specifically, the thickness of the core layer 207 is about 0.1 mm to 0.8 mm. The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, 204, 214, and 212. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

  The core layer 207 may be made of resin. When the core layer 207 is formed of resin, the core layer 207 may be formed using, for example, FR4 or a material having a higher elastic modulus than FR4. When the core layer 207 is formed of resin, the core layer 207 is sandwiched between the wiring layers in the z-axis direction. For example, when the core layer 207 is formed of resin, along the optical axis 22, the imaging chip 100, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the core layer 207, the wiring layer 214, and the insulating layer 213, the wiring layer 212, and the solder resist layer 211 may be arranged in this order. When two wiring layers are additionally disposed, an additional insulating layer that contacts the wiring layer 204 and an additional wiring layer that contacts the core layer 207 are between the wiring layer 204 and the core layer 207. 22, and an additional wiring layer that contacts the core layer 207 and an additional insulating layer that contacts the wiring layer 214 are disposed along the optical axis 22 between the core layer 207 and the wiring layer 214. Are arranged in order.

  As described above, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be about 0.3 mm to 1.0 mm as a whole.

  At least a part of the wiring layer 202 is used for a wiring pattern that receives a pixel signal output from the imaging chip 100 via the bonding wire 110. The wiring layer 202 includes a bonding pad 240 to which the bonding wire 110 is connected.

  The wiring pattern included in the wiring layer 204 and the wiring pattern included in the wiring layer 214 can be used for, for example, a ground line, a power supply line, and the like.

  The imaging chip 100 is mounted on the solder resist layer 201. The imaging chip 100 is electrically connected to the bonding pad 240 by the bonding wire 110. The bonding pad 240 and the wiring layer 212 are electrically connected by a via 131 that penetrates the first layer 121 and the core layer 207. The via 131 is covered with an insulator 132. Pixel signals output from the imaging chip 100 are transmitted to the wiring layer 212 through the wiring layer 202 and the via 131.

  An electronic component 180 is provided on the solder resist layer 211. That is, the electronic component 180 is mounted on the second main surface 112 on the opposite side of the mounting substrate 120 from the first main surface 111 on which the imaging chip 100 is mounted. The electronic component 180 includes, for example, a connector, a capacitor, a resistor, a regulator, a transistor, and the like. Some components of the electronic component 180 constitute a power supply circuit that supplies power to the imaging chip 100.

  For example, a flexible board is connected to the connector as a part of the electronic component 180. The connector as a part of the electronic component 180 is connected to the wiring layer 212, and the pixel signal transmitted to the wiring layer 212 is transmitted to an external electronic circuit such as the ASIC 52 via the connector and the flexible substrate.

  Electronic component 180 and wiring layer 212 are electrically connected by a lead member. The lead member of the electronic component 180 is fixed to the wiring layer 212 with solder or the like. A part of the wiring layer 212 is exposed to the outside through an opening formed in the solder resist layer 211 to provide an electrode such as a land.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is mounted on the mounting substrate 120 by being bonded by, for example, an adhesive portion 551. Specifically, the imaging chip 100 is bonded to the solder resist layer 201 of the mounting substrate 120 with an adhesive portion 551. The bonding part 551 is formed of, for example, an adhesive. Specifically, the bonding portion 551 is formed by thermosetting a thermosetting adhesive. The imaging chip 100 is mounted on the mounting substrate 120 through an imaging chip mounting process. In the imaging chip mounting step, the mounting substrate 120 is heated when the imaging chip 100 is mounted on the mounting substrate 120. The imaging chip 100 is mounted on a heated mounting substrate 120 by thermocompression bonding.

  The bonding wire 110 is mounted on the imaging chip 100 and the bonding pad 240. The bonding wire 110 electrically connects the imaging chip 100 and the bonding pad 240 through a wire bonding process (bonding wire mounting process). In the wire bonding process, when the bonding wire 110 is mounted on the bonding pad 240, the bonding pad 240 is heated, and the bonding wire 110 is mounted on the heated bonding pad 240 by thermocompression bonding. In the wire bonding process, the bonding wire 110 may be mounted on the bonding pad 240 by ultrasonic pressure bonding.

  The frame 140 is bonded to the mounting substrate 120 with an adhesive portion 552. Specifically, the frame 140 is bonded to the solder resist layer 201 of the mounting substrate 120 by the bonding portion 552. The bonding part 552 is formed of, for example, an adhesive. Specifically, the bonding portion 552 is formed by thermosetting a thermosetting adhesive. The bonding portion 552 is formed by thermosetting a thermosetting adhesive. In the frame mounting process, the frame 140 is mounted on the mounting substrate 120. In the frame mounting process, when the frame 140 is mounted on the mounting substrate 120, the frame 140 is heated, and the frame 140 is mounted on the heated mounting substrate 120 by thermocompression bonding.

  The frame 140 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, and a sixth surface 146. The sixth surface 146 forms an opening 138. The sixth surface 146 forms the inner wall surface of the frame 140. The opening 138 is formed at, for example, a central portion in the xy plane.

  The first surface 141 is a surface that is bonded by the cover glass 160 and the bonding portion 553. The first surface 141 is a surface in contact with the end of the sixth surface 146. The first surface 141 is formed along the outer edge of the sixth surface 146. The first surface 141 is a surface substantially parallel to the xy plane.

  The second surface 142 is a surface in contact with the end of the first surface 141. The second surface 142 is a surface formed along the outer edge of the first surface 141. The second surface 142 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The third surface 143 is a surface in contact with the end of the second surface 142. The third surface 143 is a surface substantially parallel to the xy plane and a surface substantially parallel to the first surface 141.

  The fourth surface 144 is a surface in contact with the end of the third surface 143. The fourth surface 144 is a surface formed along the outer edge of the third surface 143. The fourth surface 144 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The fifth surface 145 is a surface in contact with the end of the fourth surface 144. The fifth surface 145 is a surface formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface substantially parallel to the xy plane. The fifth surface 145 is a surface substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is a surface that is bonded to the solder resist layer 201 of the mounting substrate 120 by the bonding portion 552. The fifth surface 145 faces the adhesive portion 552. The fifth surface 145 is a surface in contact with the end of the sixth surface 146. The fifth surface 145 is formed along the outer edge of the sixth surface 146.

  The frame 140 has a step portion formed by the first surface 141, the second surface 142, and the third surface 143. The frame 140 has a mounting hole 148 as a mounting portion. The frame 140 has, for example, three attachment holes 148. All of the three attachment holes 148 pass through the third surface 143 to the fifth surface 145. All of the three attachment holes 148 are used for attaching the imaging unit 40 to another structure such as the mirror box 60.

  The frame 140 is fixed to the bracket 150 by being screwed with screws through the three mounting holes 148. The bracket 150 is fixed to the mirror box 60 by, for example, screwing. Therefore, the imaging unit 40 is fixed to the mirror box 60.

  When the frame 140 and the bracket 150 are screwed with, for example, a metal screw using the mounting holes 148, the heat generated when the imaging chip 100 is operating is heated toward the mirror box 60 via the screw. A heat transfer path for escape can be formed.

  The frame 140 has a positioning hole 147. The frame 140 has two positioning holes 147, for example. Each of the two positioning holes 147 is a hole penetrating from the third surface 143 to the fifth surface 145. Any of the positioning holes 147 is used to position the imaging unit 40 with respect to the imaging unit 40. Of the two positioning holes 147, one positioning hole is a fitting hole, and the other positioning hole 147 is a long hole.

  The frame 140 is positioned with respect to the bracket 150 using the two positioning holes 147. For example, the frame 140 and the bracket 150 are positioned by inserting two positioning pins provided on the bracket 150 into the two positioning holes 147. The frame 140 is fixed while being positioned with respect to the bracket 150. Therefore, the imaging unit 40 is fixed while being positioned on the mirror box 60. The frame 140 and the bracket 150 may be fixed to a structure other than the mirror box 60.

  The imaging unit 40 may be fixed to the mirror box 60 without using the bracket 150. The imaging unit 40 may be fixed to the mirror box 60 by, for example, screwing through the three mounting holes 148.

  The cover glass 160 is used for sealing the imaging chip 100. Cover glass 160 is fixed to frame 140 so as to cover opening 138 of frame 140. The cover glass 160 uses the opening 138 as a sealed space together with the frame 140 and the mounting substrate 120.

  The cover glass 160 is bonded to the frame 140 by the bonding portion 553. The adhesion part 553 is formed of an adhesive. Specifically, the bonding portion 552 is formed by curing a photocurable adhesive. For example, the bonding portion 553 is formed by curing an ultraviolet curable adhesive with ultraviolet rays. As a material for the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, or the like can be used. The cover glass 160 has translucency. The thickness of the cover glass 160 is 0.5 mm to 0.8 mm.

  The cover glass 160 is fixed to the frame 140 after the imaging chip 100, the bonding wire 110 and the frame 140 are mounted on the mounting substrate 120. Since the cover glass 160 has a light-transmitting property, the cover glass 160 and the frame 140 can be bonded using a photo-curing adhesive. The cover glass 160 is an example of a translucent member. As the translucent member, quartz or the like can be applied in addition to glass.

  Thus, the mounting space is formed by the mounting substrate 120, the frame 140, and the cover glass 160. The imaging chip 100 is disposed in a sealed space formed by the mounting substrate 120, the frame 140, and the cover glass 160. As a result, the imaging chip 100 is less affected by the external environment. For example, the imaging chip 100 is not easily affected by moisture existing outside the sealed space. Therefore, deterioration of the imaging chip 100 can be prevented.

  The frame 140 includes a first frame part 210 and a second frame part 220. The first frame portion 210 has a first main surface 311, a second main surface 312, an inner surface 314, and an outer surface 313. The second frame part 220 has a first main surface 321, a second main surface 322, an inner surface 324, and an outer surface 323. The first main surface 311, the second main surface 312, the first main surface 321, and the second main surface 312 are surfaces substantially parallel to the xy plane.

  A part of the first main surface 311 of the first frame part 210 is in contact with the second frame part 220. A portion of second main surface 312 is in contact with mounting substrate 120. The inner side surface 314 and the outer side surface 313 are surfaces between the first main surface 311 and the second main surface 312. The inner side surface 314 forms an inner edge portion of the first frame portion 210 that surrounds the imaging chip 100. The outer side surface 313 is located outside the inner side surface 314. The outer side surface 313 forms an outer edge portion of the first frame portion 210. The inner side surface 314 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The outer side surface 313 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  Part of the first main surface 321 of the second frame part 220 is in contact with the cover glass 160. A part of second main surface 322 is in contact with first frame portion 210. A part of the second main surface 322 is in contact with the first main surface 321 of the first frame portion 210. The inner side surface 324 and the outer side surface 323 are surfaces between the first main surface 321 and the second main surface 322. The inner side surface 324 forms an inner edge portion of the second frame portion 220 that surrounds the imaging chip 100. The outer side surface 323 is located outside the inner side surface 324. The outer side surface 323 forms an outer edge portion of the second frame portion 220. The inner side surface 324 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The outer side surface 323 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The first main surface 321 of the second frame part 220 provides the first surface 141 of the frame 140. The outer surface 323 of the second frame part 220 provides the second surface 142 of the frame 140. A part of the first main surface 311 of the first frame part 210 provides a third surface 143 of the frame 140. The outer surface 313 of the first frame part 210 provides the fourth surface 144 of the frame 140. The second main surface 312 of the first frame part 210 provides the fifth surface 145 of the frame 140. The inner surface 314 of the first frame part 210, a part of the second main surface 322 of the second frame part 220 and the inner surface 324 of the second frame part 220 provide a sixth surface 146 of the frame 140.

  The material forming the second frame part 220 is different from the material forming the first frame part 210. The coefficient of thermal expansion of the material forming the second frame part 220 is different from the coefficient of thermal expansion of the material forming the first frame part 210. In the present embodiment, the second frame part 220 is formed of resin. The first frame part 210 is made of metal. The material forming the first frame part 210 may be an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like. The frame 140 is formed by insert molding the material forming the first frame part 210 and the material forming the second frame part 220. The frame 140 may be formed by outsert molding. The method of forming the frame 140 is not limited to insert molding or outsert molding, and various methods can be applied.

  The first frame part 210 has a protrusion 400 a and a protrusion 400 b on the first main surface 311. The protrusion 400a and the protrusion 400b extend in the xy plane. The protrusion 400 a and the protrusion 400 b are formed by half-pressing the material forming the first frame part 210 in the process of manufacturing the first frame part 210. The second frame part 220 is provided at least in contact with the upper surface 410a of the protrusion 400a and the upper surface 410b of the protrusion 400b.

  A lower surface 420 a opposite to the upper surface 410 a of the protrusion 400 a is separated from the second main surface 312 of the first frame unit 210. A lower surface 420b opposite to the upper surface 410b of the protrusion 400b is separated from the second main surface 312 of the first frame portion 210. Specifically, the lower surface 420 a and the lower surface 420 b are located in the z-axis plus direction from the second main surface 312 of the first frame portion 210. As described above, a convex portion is formed on the first main surface 311 of the first frame portion 210, and a convex portion is formed on the second main surface 312 at a position in the z-axis minus direction of the convex portion of the first main surface 311. The recessed part corresponding to is formed.

  The inner side surface 314 of the first frame part 210 provides an inner edge part 305a, an inner edge part 305b, an inner edge part 306a, and an inner edge part 306b that surround the imaging chip 100. The outer surface 313 of the first frame part 210 provides an outer edge part 307a, an outer edge part 307b, an outer edge part 308a, and an outer edge part 308b outside the inner edge part 305b, the inner edge part 306a, and the inner edge part 306b.

  The first frame portion 210 includes a first portion 301a and a first portion 301b, and a second portion 302a and a second portion 302b. The first portion 301a, the first portion 301b, the second portion 302a, and the second portion 302b form a rectangular frame. The first portion 301a is a portion between the inner edge portion 305a and the outer edge portion 307a. The first portion 301b is a portion between the inner edge portion 305b and the outer edge portion 307b. The second portion 302a is a portion between the inner edge portion 306a and the outer edge portion 308a. The second portion 302b is a portion between the inner edge portion 306b and the outer edge portion 308b.

  The inner edge portion 305a, the inner edge portion 305b, the inner edge portion 306a, and the inner edge portion 306b form a rectangle in a plane parallel to the xy plane. The inner edge portion 305a is substantially parallel to the inner edge portion 305b and is located in the x-axis plus direction from the inner edge portion 305b. The inner edge portion 306a is substantially parallel to the inner edge portion 306b and is located in the y-axis plus direction from the inner edge portion 306b.

  The inner edge portion 305a and the inner edge portion 305b are substantially parallel to the first short side 105a. The inner edge portion 306a and the inner edge portion 306b are substantially parallel to the first long side 106a. The length of the inner edge portion 305a and the length of the inner edge portion 305b are shorter than the length of the inner edge portion 306a. The length of the inner edge portion 305a and the length of the inner edge portion 305b are shorter than the length of the inner edge portion 306b.

  The first portion 301a is between the surface on the x-axis plus side of the outer surface 313 parallel to the yz plane and the surface on the x-axis plus side of the inner surface 314 parallel to the yz plane. Part. The first portion 301b is a portion between the surface on the negative side of the x axis in the surface parallel to the yz plane in the outer surface 313 and the surface on the negative side of the x axis in the surface parallel to the yz plane on the inner surface 314. is there.

  In addition, the second portion 302a is between the surface on the y-axis plus side of the surface parallel to the xz plane on the outer side surface 313 and the surface on the y-axis plus side of the surface parallel to the xz plane on the inner side surface 314. Part. The second portion 302a is a portion between the surface on the negative side of the y-axis in the surface parallel to the xz plane on the outer surface 313 and the surface on the negative side of the y-axis in the surface parallel to the xz plane on the inner surface 314. is there.

  In the description of the present embodiment, the widths of the first portion 301a, the first portion 301b, the second portion 302a, and the first portion 301b are represented by lengths in the direction from the inner edge portion toward the outer edge portion. In terms of the coordinate axes set in the present embodiment, the width of the first portion 301a and the width of the first portion 301b are expressed by the length in the direction along the x-axis. The widths of the second portion 302a and the second portion 302b are represented by the length in the direction along the y-axis.

  In this case, the width of the first portion 301a is substantially the same as the width of the first portion 301b. The width of the second portion 302a is substantially the same as the width of the second portion 302b. The width of the first portion 301a and the width of the first portion 301b are smaller than the width of the second portion 302a. The width of the first portion 301a and the width of the first portion 301b are smaller than the width of the second portion 302b.

  Here, the protrusion 400a is provided in the first portion 301a. The protrusion 400b is provided on the first portion 301b. The second portion 302a and the second portion 302b are not provided with a protrusion similar to the protrusion 400a and the protrusion 400b. Thus, the 1st frame part 210 is provided with the protrusion in the 1st part 301a and the 1st part 301b with a small width. That is, the protrusion is provided in a portion of the first frame portion 210 that is easily deformed by an external force.

  The protrusion 400a and the protrusion 400b extend in a direction along the xy plane. Specifically, the protrusion 400a extends along the inner edge 305a. Therefore, the strength against the stress that deforms the first portion 301a into a convex shape or a concave shape in the yz plane is increased. Further, the strength against bending stress that deforms the first portion 301b into a convex shape or a concave shape in the yz plane is increased. For this reason, the curvature of the z-axis direction which arises in the 1st frame part 210 can be controlled. Further, the warp of the frame 140 can be suppressed. Further, warpage of the mounting substrate 120 can be suppressed.

  For example, when the coefficient of thermal expansion of the first frame unit 210 and the coefficient of thermal expansion of the second frame unit 220 are different, between the first frame unit 210 and the second frame unit 220 in the xy plane caused by a temperature change. There may be a difference in expansion rate or contraction rate. If there is a difference in expansion rate or contraction rate, the first frame part 210 may be pulled by the second frame part 220 on the surface in contact with the second frame part 220, and the first frame part 210 may be warped. . As a result, the entire frame 140 may be warped. For example, the frame 140 may be warped due to temperature changes in the manufacturing process of the frame 140, the mounting process of the imaging chip 100, the electronic component 180, the cover glass 160, and the like and the subsequent cooling process. Further, the mounting substrate 120 may be warped in accordance with the warp generated in the frame 140.

  However, according to the frame 140 of the present embodiment, since the protrusion 400a and the protrusion 400b are formed on the first frame portion 210, the strength of the first frame portion 210 can be increased. Therefore, deformation such as warpage occurring in the first frame portion 210 can be suppressed.

  6 is a cross-sectional view schematically showing a BB cross section of FIG. As shown in FIGS. 6 and 3B, the first frame part 210 includes a through hole 610a, a through hole 610b, a through hole 610c, a through hole 610d, a through hole 610e, and a through hole 610f. Have The second frame part 220 includes a penetration part 620a, a penetration part 620b, a penetration part 620c, a penetration part 620d, a penetration part 620e, and a penetration part 620f.

  The through hole 610a, the through hole 610c, and the through hole 610e are provided in the second portion 302a. The through hole 610b, the through hole 610d, and the through hole 610f are provided in the second portion 302b. The through hole 610a, the through hole 610c, and the through hole 610e are formed along the inner edge 306a. The through hole 610b, the through hole 610d, and the through hole 610f are formed along the inner edge portion 306b.

  The through hole 610 a and the through hole 610 b reach from the first main surface 311 to the second main surface 312 of the first frame part 210, respectively. Similarly, the through hole 610c, the through hole 610d, the through hole 610e, and the through hole 610f reach the first main surface 311 to the second main surface 312 of the first frame portion 210, respectively.

  The through portion 620a is formed to fill the through hole 610a. The through portion 620b is formed to fill the through hole 610b. The through portion 620c is formed so as to fill the through hole 610c. The through portion 620d is formed to fill the through hole 610d. The through portion 620e is formed to fill the through hole 610e. The through portion 620f is formed so as to fill the through hole 610f. The through part 620 a, the through part 620 b, the through part 620 c, the through part 620 d, the through part 620 e, and the through part 620 f reach the first layer 121 of the mounting substrate 120. Thus, the penetration part 620a, the penetration part 620c, and the penetration part 620e are provided so as to penetrate from the first main surface 311 to the second main surface 312 in the second portion 302a. The through part 620b, the through part 620d, and the through part 620f are provided so as to penetrate from the first main surface 311 to the second main surface 312 in the second portion 302b.

  As described above, the first frame part 210 has the through hole 610a, the through hole 610b, the through hole 610c, the through hole 610d, the through hole 610e, and the through hole 610f outside the inner edge part, and the second frame part 220 is provided. The first frame portion 210 has a penetrating portion 620a, a penetrating portion 620b, a penetrating portion 620c, a penetrating portion 620d, a penetrating portion 620e, and a penetrating portion 620f outside the inner edge portion of the first frame portion 210. Therefore, the second frame part 220 and the first frame part 210 can be tightly adhered. In addition, the second frame part 220 is unlikely to peel off from the first frame part 210. Further, the contact area between the second frame part 220 and the mounting substrate 120 increases. For this reason, the adhesion between the frame 140 and the mounting substrate 120 is also improved. In addition, deformation of the first frame unit 210 can be reduced, and warpage of the first frame unit 210 can be reduced in some cases.

  FIG. 7 is a rear view schematically showing the frame 740 according to the second embodiment. The frame 740 includes a first frame portion 710 as a modification of the first frame portion 210. The first frame portion 710 further includes a protrusion 400 c and a protrusion 400 d in addition to the components included in the frame 140. Except for this point, the frame 740 has substantially the same configuration as that of the frame 140.

  The protrusion 400c is provided along the inner edge 306a. The protrusion 400d is provided along the inner edge 306b. As described above, the protrusion is provided along the rectangular inner edge of the first frame portion 210. That is, the protrusions are provided so as to surround the imaging chip 100 along four inner edge portions that form a rectangular inner shape in which the first frame portion 210 surrounds the imaging chip 100. Thereby, the curvature which arises in the frame 140 can be suppressed more.

  In addition, in the frame 140 according to the first example and the frame 740 according to the second example, the form in which the second frame part 220 has six through parts has been described. However, the number of penetrating parts included in the second frame part 220 is not limited to six. The second frame part 220 may have one or more arbitrary numbers of through parts. When providing a penetration part in the 2nd frame part 220, it is preferred to provide one or more penetration parts in the 2nd portion 302a and the 2nd part 302b of the 1st frame part 210, respectively. Further, the position where the penetrating portion is provided is not limited to the position shown in FIG. However, the position of the penetrating portion in the xy plane is preferably point-symmetric with respect to the optical axis 22. A configuration in which the penetrating portion 620a, the penetrating portion 620b, the penetrating portion 620c, the penetrating portion 620d, the penetrating portion 620e, and the penetrating portion 620f are not provided may be applied.

  FIG. 8 is a cross-sectional view schematically showing an imaging unit 890 including a frame 840 according to the third embodiment. The frame 840 includes a second frame portion 820 as a modification of the second frame portion 220. 8 is a cross-sectional view of the imaging unit 890 cut along a cross section corresponding to the AA cross section of FIG. Here, differences between the imaging unit 890 and the imaging unit 40 will be mainly described. Among the components included in the imaging unit 890, components having the same configuration as the configuration included in the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  The width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a of the first frame portion 210 is greater than the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301a in the frame 140. small. Further, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b of the first frame portion 210 is the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301b in the frame 140. Less than width.

  The width of the second frame portion 820 in the x-axis direction is approximately the same as the width of the cover glass 160 in the x-axis direction. The width of the second frame portion 820 in the x-axis direction may be substantially the same as the width of the cover glass 160 in the x-axis direction. Considering the assembly of the second frame part 820 and the cover glass 160, the width of the second frame part 820 in the x-axis direction is allowed to have some play, and the width of the second frame part 820 in the x-axis direction is determined by the cover glass. It may be slightly longer than the width of 160 in the x-axis direction. Note that the area of the portion where the cover glass 160 and the second frame portion 820 are in contact with each other needs to be a predetermined value or more so that the cover glass 160 can be bonded to the second frame portion 820. Therefore, the width in the x-axis direction where the cover glass 160 and the second frame portion 820 are in contact with each other is preferably equal to or greater than a predetermined lower limit necessary for bonding the cover glass 160 to the second frame portion 820. The width in the x-axis direction of the second frame portion 820 may be reduced until the width in the x-axis direction where the cover glass 160 and the second frame portion 820 are in contact reaches the lower limit.

  According to the frame 840, since the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a and the first portion 301b is small, the stress applied to the first frame portion 210 by the second frame portion 820 is reduced. can do. Therefore, the warp of the first frame part 210 can be further suppressed.

  In the third embodiment, the width in the x-axis direction where the second frame portion 820 is in contact with the first portion 301a is greater than the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302a. small. Further, the width in the x-axis direction where the second frame portion 820 is in contact with the first portion 301a is smaller than the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302b. Similarly, the width in the x-axis direction where the second frame portion 820 is in contact with the first portion 301b is smaller than the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302a. Further, the width in the x-axis direction where the second frame portion 820 is in contact with the first portion 301b is smaller than the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302b. Thus, since the width in the y direction where the second portion 302a and the second portion 302b of the first frame portion 210 are in contact with the second frame portion 820 is increased, the second frame portion 820 and the first frame are Adhesion with the part 210 can be ensured. In addition, since the width in the y direction of the second part 302a and the second part 302b is longer than the width in the x direction of the first part 301a and the first part 301b, the strength against the warp of the second part 302a and the second part 302b is The strength against warpage of the first portion 301a and the first portion 301b is higher. Therefore, even if the width in the y direction in which the second portion 302a and the second portion 302b are in contact with the second frame portion 820 is increased, it is possible to suppress the occurrence of a large warp in the yz plane.

  As a modification of the second frame portion 820, the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302a, and the x-axis direction where the second frame portion 820 is in contact with the first portion 301a. The width may be reduced to substantially the same width. Further, the width in the y-axis direction where the second frame portion 820 is in contact with the second portion 302b is reduced to substantially the same width as the width in the x-axis direction where the second frame portion 820 is in contact with the first portion 301a. May be. Similarly, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302a is reduced to substantially the same width as the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b. May be. Further, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302b is reduced to substantially the same width as the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b. May be.

  Note that the frame 840 described above may employ a configuration that does not include the protrusion 400a and the protrusion 400b.

  FIG. 9 is a cross-sectional view schematically showing an imaging unit 990 including a frame 940 according to the fourth embodiment. The frame 940 includes a first frame part 910 as a modification example of the first frame part 210 and a second frame part 920 as a modification example of the second frame part 220. FIG. 9 is a cross-sectional view of the imaging unit 990 taken along a cross section corresponding to the AA cross section of FIG. Here, differences between the imaging unit 990 and the imaging unit 40 will be mainly described. Of the components included in the imaging unit 990, components having the same configuration as the configuration included in the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  The first frame portion 910 includes a first portion 901a corresponding to the first portion 301a and a first portion 901b corresponding to the first portion 301b. The first frame portion 910 generally has a shape that does not have a portion on the inner edge side from the protrusion 400a and a portion on the inner edge side from the protrusion 400b in the first frame portion 210. The first frame portion 910 has a shape provided with a protrusion 900a and a protrusion 900b on the inner edge. Similar to the protrusion 400a and the protrusion 400b, the protrusion 900a and the protrusion 900b are formed by half punching.

  The protrusion 900a has an upper surface 911a, a lower surface 912a opposite to the upper surface 911a, and a side surface 913a between the upper surface 911a and the lower surface 912a. The lower surface 912a is separated from the mounting substrate 120. Similarly, the protrusion 900b has an upper surface 911b, a lower surface 912b opposite to the upper surface 911b, and a side surface 913b between the upper surface 911b and the lower surface 912b. The lower surface 912b is separated from the mounting substrate 120.

  The second frame portion 920 is provided in contact with the upper surface 911a of the protrusion 900a and the lower surface 912a of the protrusion 900a. The second frame portion 920 is provided in contact with the side surface 913a of the protrusion 900a. The second frame part 920 is provided so as to surround the three surfaces of the protrusion 900a. The second frame portion 920 is provided so as to contact the mounting substrate 120. Thus, the inner edge portion of the first portion 901a of the first frame portion 910 is covered with the second frame portion 920.

  Similarly, the second frame portion 920 is provided in contact with the upper surface 911b of the protrusion 900b and the lower surface 912b of the protrusion 900b. The second frame portion 920 is provided in contact with the side surface 913b of the protrusion 900b. The second frame part 920 is provided so as to surround the three surfaces of the protrusion 900b. The second frame portion 920 is provided so as to contact the mounting substrate 120. Thus, the inner edge portion of the first portion 901b of the first frame portion 910 is covered with the second frame portion 920.

  According to the frame 940, the second frame portion 920 is provided in contact with the upper surface 911a of the protrusion 900a, the lower surface 912a of the protrusion 900b, the upper surface 911b of the protrusion 900b, and the lower surface 912b of the protrusion 900b. Thus, since the second frame portion 920 is provided in contact with both the upper surface and the lower surface of the protrusion, for example, stress caused by a difference in expansion coefficient between the first frame portion 910 and the second frame portion 920 is reduced. it can. Further, the first frame part 910 and the second frame part 920 can be more strongly fixed. Moreover, the curvature of the 1st frame part 210 can be suppressed more. In addition, since the second frame portion 920 is in contact with the mounting substrate 120, the adhesion between the frame 940 and the mounting substrate 120 is enhanced.

  Similarly to the frame 840 according to the third embodiment, the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901a of the first frame portion 910 is equal to the second frame portion 220 in the frame 140. It is smaller than the width in the x-axis direction in contact with the one portion 301a. Further, the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901b of the first frame portion 910 is the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301b in the frame 140. Less than width. For this reason, since the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901a and the first portion 901b is small, the stress applied to the first frame portion 910 by the second frame portion 920 can be reduced. it can. Therefore, the warp of the first frame part 210 can be further suppressed.

  In addition, you may provide the protrusion similar to the protrusion 900a and the protrusion 900b along the other inner edge part of the other 1st flame | frame part 910. FIG. That is, a protrusion may be provided along the rectangular inner edge of the first frame portion 910. As described above, the first frame portion 910 is formed in the frame 940 by providing the protrusions so as to surround the imaging chip 100 along the four inner edges forming the rectangular inner shape surrounding the imaging chip 100. Warpage can be further suppressed.

  In addition, in connection with the frame 940 according to the fourth embodiment, the example in which the protrusions such as the protrusions 900a and the protrusions 900b are formed by half punching has been described. However, similar to the protrusions 900a and 900b, the protrusions may be formed by drawing on the surface where the second frame part 920 and the first frame part 910 are in contact.

  In the frame 940 described above, a configuration in which the width of the second frame portion 920 in the x-axis direction is further increased may be applied. For example, a configuration in which the second frame portion 920 is expanded in the x-axis direction in the direction of the outer edge portion from the protrusion 900a and the protrusion 900b may be applied.

  In the embodiment described above, the material forming the first frame part 210, the first frame part 710, and the first frame part 910 is a metal. In other embodiments, the frame portions such as the first frame portion 210 and the first frame portion 910 may be formed of resin.

  In the above description, the camera 10 including the lens unit 20 and the camera body 30 has been described as an example of an imaging apparatus. However, the imaging device may not include the lens unit 20. For example, the camera body 30 is an example of an imaging device. The imaging device is a concept that includes a lens non-exchangeable imaging device in addition to a lens-exchangeable imaging device such as a single-lens reflex camera. The imaging chip 100 is an example of an electronic device. The combination of each structure which concerns on the flame | frame, mounting board | substrate, and cover glass demonstrated above is applicable not only to the imaging chip 100 but various electronic devices sealed.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 31 Mirror unit 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 51 MPU
52 ASIC
60 mirror box 62 substrate 70 imaging optical system 72 focus detection sensor 80 focus plate 82 penta prism 84 finder optical system 86 finder window 88 display unit 100 imaging chip 101 imaging region 102 peripheral region 105 short side 106 long side 110 wire 111 first Main surface 112 second main surface 120 mounting substrate 121 first layer 122 second layer 131 via 132 insulator 138 opening 140 frame 141 first surface 142 second surface 143 third surface 144 fourth surface 145 fifth surface 146 first 6 surfaces 147 Positioning hole 148 Mounting hole 150 Bracket 160 Cover glass 180 Electronic component 201, 211 Solder resist layer 202, 204, 212, 214 Wiring layer 203, 205, 213, 215 Insulating layer 207 Core layer 551, 552, 553 Adhesive part 240 Bonding pad 3 1 the first portion 302 second portion

Claims (12)

  A substrate having a first surface on which an imaging chip for imaging a subject is disposed;
  A member disposed on the first surface so as to surround at least a part of the imaging chip, and having a second surface facing the first surface and a third surface opposite to the second surface; A first surrounding portion having a thermal expansion coefficient different from that of the substrate, wherein a protrusion protruding in the direction from the second surface toward the third surface is formed on the third surface;
  A second surrounding portion disposed on the third surface and having a fourth surface facing the third surface and having a coefficient of thermal expansion different from that of the first surrounding portion,
  The substrate and the first surrounding portion are bonded by a thermosetting adhesive disposed between the first surface and the second surface,
  The imaging unit in which the first surrounding portion and the second surrounding portion are bonded by a thermosetting adhesive disposed between the third surface and the fourth surface.   The first surrounding portion includes an inner edge portion that forms an accommodation space for the imaging chip together with the substrate, an outer edge portion outside the inner edge portion, and a first surface from the inner edge portion to the outer edge portion on the third surface. A first portion having a width, and a second portion having a second width larger than the first width from the inner edge portion to the outer edge portion on the third surface;
  The imaging unit according to claim 1, wherein the protrusion is formed in the first portion. The imaging unit according to claim 2, wherein the protrusion is formed to extend along the inner edge portion in the first portion.   The first surrounding portion has a rectangular first opening formed by the inner edge portion,
  The imaging unit according to claim 3, wherein the protrusion is formed to have a length equal to or longer than a side forming the first opening in the first portion.   The imaging unit according to claim 4, wherein the second surrounding portion has a second opening having an opening area smaller than that of the first opening.   The first surrounding portion is made of metal and has a first thickness in a direction from the second surface toward the third surface;
  The said 2nd surrounding part is comprised with resin, and has any 2nd thickness thicker than a said 1st thickness in the direction which goes to the said 3rd surface from the said 2nd surface. The imaging unit according to claim 1.   The first surrounding portion includes an inner edge portion that forms an accommodation space for the imaging chip together with the substrate, an outer edge portion outside the inner edge portion, and a first surface from the inner edge portion to the outer edge portion on the third surface. A first portion having a width, and a second portion having a second width larger than the first width from the inner edge portion to the outer edge portion on the third surface;
  The imaging unit according to claim 6, wherein the second portion is formed with an attachment portion to be attached to a structure disposed on the direction side from the second surface toward the third surface with respect to the third surface. .   The imaging unit according to claim 7, wherein the attachment portion has a through hole that penetrates in the direction from the second surface toward the third surface in the second portion.   The imaging unit according to any one of claims 1 to 8, wherein the second surrounding portion is formed with an insertion portion into which the protrusion is inserted on the fourth surface.   The substrate has a fifth surface opposite to the first surface, and a power supply circuit unit that supplies power to the imaging chip on the fifth surface and an image signal of a subject imaged by the imaging chip externally The imaging unit according to any one of claims 1 to 9, wherein a connector portion for outputting to the camera is disposed.   The imaging unit according to any one of claims 1 to 10, wherein the protrusion is formed by half punching. An imaging device comprising the imaging unit according to any one of claims 1 to 11 .

Images