WO2023166849A1

WO2023166849A1 - Package member and method for manufacturing package

Info

Publication number: WO2023166849A1
Application number: PCT/JP2023/000073
Authority: WO
Inventors: 優美鈴木; 廣仁宮崎
Original assignee: ソニーセミコンダクタソリューションズ株式会社
Priority date: 2022-03-03
Filing date: 2023-01-05
Publication date: 2023-09-07
Also published as: JPWO2023166849A1

Abstract

The present invention improves the stability of a cover when attached to a package while the cover is detachable from the package.　This package member comprises: a frame member; protrusions; and recesses. The frame member is provided with a flat surface that faces the cover and that has a frame shape. The protrusions are positioned on the flat surface and protrude from the flat surface. The recesses are arranged on the flat surface so as to be adjacent to the protrusions. The recesses may be arranged on the flat surface so as to surround the protrusions. The cover may be provided with depressions into which the protrusions can be inserted while in contact with the flat surface. A bonding material having a melting point of at least 50℃ may be further provided, the bonding material filling the depressions while the protrusions are inserted into the depressions.

Description

Package member and package manufacturing method

This technology relates to a package member and a package manufacturing method. Specifically, the present technology relates to a package member with a removable cover and a method of manufacturing the package.

A transparent cover is sometimes attached to the package in which the solid-state image sensor is mounted in order to prevent dust from adhering to the solid-state image sensor. When the transparent cover is attached to the package, a ghost may appear in the captured image due to the difference in refractive index between the transparent cover and the outside world. Therefore, the solid-state imaging device is sometimes used with the transparent cover removed from the package. For example, in order to remove the transparent cover from the package, the adhesive strength of the adhesive that adheres the transparent cover should be such that the transparent cover can be removed without breaking the transparent cover when handling the imaging device. A configuration has been proposed (see Patent Document 1, for example).

JP-A-11-355508

However, in the conventional technology described above, if the adhesive force is set to a strength that allows the transparent cover to be removed without breaking it, the transparent cover may come off when handling the imaging device.

This technology was created in view of this situation, and aims to improve stability when the cover is attached while making it possible to remove the package cover.

The present technology has been made to solve the above-described problems, and a first side thereof includes a frame member having a flat surface in the shape of a frame; and a recess provided in the flat surface adjacent to the protrusion. As a result, the cover can be detached from and attached to the frame member based on the insertion and removal of the projecting portion.

Further, according to the first side surface, the recess may be provided on the flat surface so as to surround the protrusion. This provides an effect that the joint material used for attaching the cover is housed in the recess when the cover is removed.

Further, according to the first aspect, the protrusion may include a region whose horizontal spread changes so as to increase in the distal direction. This provides an effect that the protruding portion surrounded by the solidified bonding material cannot be pulled out.

Further, according to the first side surface, a cover having a recess into which the protrusion can be inserted while in contact with the flat surface may be further provided. As a result, the cover is detached from and attached to the frame member based on the insertion and removal of the projection into and out of the recess.

Further, according to the first aspect, the cover may be a cover glass. This provides an effect that light is incident on the inside of the frame member through the cover.

The first side surface further includes a bonding material having a melting point of 50° C. or higher, which is positioned in the recess when the cover is removed from the frame member, and the cover is attached to the frame member. The bonding material may be filled into the recess while the protrusion is inserted into the recess. As a result, when the package provided with the cover is stored or transported, the cover is fixed to the frame member via the joint material, and the cover can be removed from the frame member by heating the joint material.

Further, according to the first aspect, the bonding material may be low melting point solder or low melting point alloy. As a result, the bonding material is solidified at a temperature lower than 50.degree. C., and is melted at a temperature of 50.degree. C. or higher.

Further, according to the first aspect, the recess may include a region whose horizontal extent changes to increase toward the bottom. This provides an effect that the solidified bonding material cannot be pulled out from the recess.

The first side surface further includes a substrate on which the frame member is mounted, and a semiconductor chip mounted on the substrate surrounded by the frame member and having a solid-state imaging device formed thereon. good too. This brings about the effect of obtaining a captured image free from the influence of ghosts.

Further, the first side surface may further include a housing that supports the lens, and the housing may be installed on the frame member. This provides an effect that the lens is supported via the frame member from which the cover is removed.

Further, according to the first aspect, the projection may be formed in a frame shape on the flat surface, and may further include an air hole formed at a position crossing the frame-shaped projection. This brings about the effect of suppressing the pressure rise in the hollow package sealed with the cover.

Further, according to the first aspect, the air hole may be a groove separating the protrusions so that the protrusions are aligned. This brings about the effect that the length of the air hole is longer than the width of the protrusion.

Further, according to the first aspect, the material of the protrusion may be metal or resin. This brings about an effect that the joint material is joined to the projecting portion provided on the frame member.

Further, according to the first aspect, when the material of the protrusion is metal, the aspect ratio may be 1 or more. This provides an effect of increasing the bonding area between the protrusion provided on the frame member and the bonding material.

The second side surface includes a substrate provided with a frame-shaped first flat surface around a semiconductor chip mounting area, and a protruding portion located on the first flat surface and protruding from the first flat surface. and a recess provided adjacent to the protrusion. As a result, the frame member to which the cover is adhered is detached from the substrate based on the insertion and removal of the projecting portion.

Further, according to the second side surface, the recess may be provided on the first flat surface so as to surround the protrusion. This provides an effect that the joint material used for attaching the frame member to which the cover is adhered is accommodated in the recess when the frame member is removed.

Further, according to the second aspect, the resin layer further includes a resin layer positioned around the protrusion on the first flat surface, and the recess is provided in the resin layer so as to surround the protrusion. good too. This provides an effect that the joint material used for attaching the cover is housed in the recess when the cover is removed.

Further, according to the second aspect, the protrusion may include a region whose horizontal spread changes so as to increase in the distal direction. This provides an effect that the protruding portion surrounded by the solidified bonding material cannot be pulled out.

The second side surface has a frame-like second flat surface facing the first flat surface of the substrate, and the second flat surface is in contact with the first flat surface. The semiconductor device may further include a frame member having a recess in which the protrusion can be inserted, provided on the second flat surface, and a cover bonded to the frame member with a gap from the semiconductor chip. This provides an effect that the frame member to which the cover is adhered is detached from the substrate based on the movement of the projection into and out of the recess.

Further, according to the second aspect, the cover may be a cover glass. This provides an effect that light is incident on the inside of the frame member through the cover.

The second side surface further includes a bonding material having a melting point of 50° C. or higher, which is positioned in the recess when the frame member is detached from the substrate, and the bonding material is attached to the substrate. The bonding material may be filled into the recess while the protrusion is inserted into the recess. As a result, when the package provided with the cover is stored or transported, the frame member to which the cover is adhered is fixed to the substrate via the bonding material, and at a temperature higher than the temperature at which the package is stored or transported, the cover is is attached to the frame member can be removed from the substrate.

Also, according to the second aspect, the bonding material may be low melting point solder or low melting point alloy. As a result, the bonding material is solidified at a temperature lower than 50.degree. C., and is melted at a temperature of 50.degree. C. or higher.

Further, according to the second aspect, the recess may include a region whose horizontal extent changes to increase toward the bottom. This provides an effect that the solidified bonding material cannot be pulled out from the recess.

Further, as for the second aspect, a solid-state imaging device may be formed on the semiconductor chip. This brings about the effect of obtaining a captured image free from the influence of ghosts.

Further, according to the second aspect, the substrate may include a cavity in which a mounting area for the semiconductor chip is provided. This brings about the effect that the semiconductor chip is mounted at a position lower than the surface of the substrate.

Further, according to the second aspect, the projection may be formed in a frame shape, and may further include an air hole formed at a position crossing the frame-shaped projection. As a result, an effect of suppressing a pressure rise in the mounting area of the semiconductor chip sealed with the cover is brought about.

Further, according to the second aspect, the air hole may comprise grooves separating the protrusions so that the protrusions are aligned. This brings about the effect that the length of the air hole is longer than the width of the protrusion.

Further, according to the second aspect, the material of the protrusion may be metal or resin. This brings about an effect that the bonding material is bonded to the projecting portion provided on the substrate.

Further, according to the second aspect, when the material of the protrusion is metal, the aspect ratio may be 1 or more. This brings about the effect of increasing the bonding area between the projecting portion provided on the substrate and the bonding material.

Further, the third side surface includes a step of mounting the chip on a package member having a protrusion projecting from a flat surface around a mounting area of the chip and a recess adjacent to the protrusion; A step of bonding a bonding material provided on the cover facing the cover and capable of phase transition from a solid phase to a liquid phase to the projecting portion; mounting the package member to which the cover is attached to the motherboard; Manufacture of a package comprising a step of melting the bonding material based on reflow of the mounted package member, dropping it into the recess, and solidifying it in the recess, and a step of removing the cover from the package member. The method. As a result, when the package provided with the cover is stored or transported, the cover is fixed to the package member via the bonding material, and the cover can be removed from the package member during reflow.

According to the third aspect, the package member includes a substrate on which the chip is mounted, and a frame member positioned on the substrate so as to surround the chip and provided with the protrusion and the recess. may be provided. As a result, a hollow structure is formed while the cover is supported on the substrate by the frame member.

Further, according to the third aspect, the package member includes a cavity in which the chip is mounted, a resin layer positioned on the flat surface, the protrusion, and a recess formed in the resin layer. A substrate may be provided. This provides an effect of forming a hollow structure while supporting the cover on the substrate without using a frame member.

Also, the third side surface may be formed with the recess based on the router processing of the resin layer. This brings about the effect that the concave portion is formed after the formation of the resin layer.

Further, the recess may be formed on the third side surface based on the patterning of the resin layer. This brings about the effect that the concave portion is formed together with the formation of the resin layer.

Also, the third side surface may form the protrusions based on a plating process. This brings about the effect of forming the projecting portion made of metal.

Also, the third side surface may have an air hole formed at a position crossing the protrusion based on patterning during formation of the protrusion. This brings about an effect that an air hole is formed together with the formation of the projecting portion.

Further, on the third side surface, grooves separating the protrusions so as to be arranged in parallel may be formed in the air holes based on patterning during formation of the protrusions. As a result, an air hole having a length larger than the width of the protrusion is formed along with the formation of the protrusion.

It is a figure which shows the structural example of the package member which concerns on 1st Embodiment. FIG. 4 is a first cross-sectional view showing an example of a method for manufacturing the package member according to the first embodiment; FIG. 7 is a second cross-sectional view showing an example of the method of manufacturing the package member according to the first embodiment; It is the 3rd sectional view which shows an example of the manufacturing method of the package member which concerns on 1st Embodiment. It is the 4th sectional drawing which shows an example of the manufacturing method of the package member which concerns on 1st Embodiment. It is the 5th sectional view which shows an example of the manufacturing method of the package member which concerns on 1st Embodiment. FIG. 11 is a plan view showing a configuration example of a package member according to a second embodiment; It is a top view which shows the structural example of the package member which concerns on 3rd Embodiment. It is a sectional view showing an example of composition of a package member concerning a 4th embodiment. It is a sectional view showing an example of composition of a package member concerning a 5th embodiment. It is a sectional view showing an example of composition of a package member concerning a 6th embodiment. It is a sectional view showing an example of a manufacturing method of a package member concerning a 6th embodiment. It is a figure which shows the structural example of the package member which concerns on 7th Embodiment. FIG. 21 is a cross-sectional view showing a configuration example of a package member according to an eighth embodiment; FIG. 21 is a plan view showing a configuration example of a package member according to a ninth embodiment; FIG. 21 is a cross-sectional view showing a configuration example of a package member according to a ninth embodiment; It is the 1st sectional drawing which shows an example of the manufacturing method of the package member which concerns on 9th Embodiment. It is the 2nd sectional view which shows an example of the manufacturing method of the package member which concerns on 9th Embodiment. It is the 3rd sectional view which shows an example of the manufacturing method of the package member which concerns on 9th Embodiment. FIG. 22 is a fourth cross-sectional view showing an example of a method of manufacturing a package member according to the ninth embodiment; It is the 5th sectional view showing an example of the manufacturing method of the package member concerning a 9th embodiment. FIG. 20 is a sixth cross-sectional view showing an example of a method of manufacturing a package member according to the ninth embodiment; It is sectional drawing which shows the modification of the manufacturing method of the package member which concerns on 9th Embodiment. FIG. 21 is a plan view showing a configuration example of a package member according to a tenth embodiment;

Hereinafter, a form for carrying out the present technology (hereinafter referred to as an embodiment) will be described. Explanation will be given in the following order.
1. First embodiment (an example in which the cover is attached/detached based on the phase transition of the bonding material in the concave portion provided in the cover)
2. Second embodiment (an example in which the protrusions provided on the frame member are arranged linearly)
3. Third embodiment (an example in which projections provided on a frame member are arranged in a frame shape)
4. Fourth Embodiment (Example in which the shape of the concave portion provided in the cover is a reverse tapered shape)
5. Fifth embodiment (an example in which a projecting portion provided on a frame member is provided with a region in which the horizontal spread increases toward the distal end)
6. Sixth Embodiment (Protruding portion provided on the frame member is provided with a region whose horizontal spread increases toward the distal end, and a concave portion provided on the cover has a horizontal spread extending toward the bottom.) Example of setting an area that changes so as to increase toward
7. Seventh embodiment (an example in which a frame member to which a cover is adhered is attached/detached based on the phase transition of the bonding material in the concave portion provided in the frame member)
8. Eighth embodiment (an example in which a lens is mounted via a frame member after the cover is removed from the frame member)
9. Ninth Embodiment (Example in which an air hole is provided in a package member using a substrate having a cavity formed therein)
10. Tenth embodiment (an example in which grooves are provided in the air holes for separating the projections provided on the substrate so that they are arranged in parallel)

<1. First Embodiment>
FIG. 1 is a diagram showing a configuration example of a package member according to the first embodiment. Note that a in FIG. 10 is a cross-sectional view showing a configuration example in which the package 100 is vertically cut before the cover glass 103 is removed. b in the same figure is a cross-sectional view showing a configuration example of cutting the package 100 in the vertical direction after the cover glass 103 has been removed. c in the figure is a plan view showing a configuration example of the package 100 after the cover glass 103 is removed. In a and b in the same figure, an example of the configuration cut at the position of the A1-A2 line of c in the same figure is shown.

In the figure, the package 100 comprises a substrate 101, a frame member 102 and a cover glass 103. The package 100 can be used as a hollow package whose inside is sealed. Cover glass 103 is removable from package 100 . When the cover glass 103 is provided on the package 100 , the cover glass 103 is supported on the substrate 101 via the frame member 102 .

For the substrate 101, for example, an organic substrate or a ceramic substrate can be used. Wiring and pad electrodes can be formed on the substrate 101 . The substrate 101 may be an interposer substrate, a printed substrate, or a buildup substrate.

A semiconductor chip 105 is mounted on the substrate 101 . A solid-state imaging device such as a CCD (Charged Coupled Device) sensor or a CMOS (Complementary Metal-Oxide Semiconductor) sensor can be formed on the semiconductor chip 105 . The material of the semiconductor substrate used for the semiconductor chip 105 may be a single crystal semiconductor such as Si, or a compound semiconductor such as GaN, GaAs, or InGaAsP.

A color filter 115 is formed on the imaging surface of the semiconductor chip 105 for each pixel, and an on-chip lens 125 is formed on the color filter 115 for each pixel. The color filters 115 may form, for example, a Bayer array. Semiconductor chip 105 is electrically connected to substrate 101 through bonding wires 135 . The material of the bonding wire 135 may be Au or Al, for example. A land electrode 111 is formed on the back side of the substrate 101 . The material of the land electrode 111 may be, for example, Cu or Al.

The frame member 102 supports the cover glass 103 on the substrate 101 . The planar shape of the frame member 102 can be, for example, a frame shape. At this time, the upper surface side of the frame member 102 can face the peripheral portion of the cover glass 103 , and the lower surface side of the frame member 102 can face the peripheral portion of the substrate 101 .

A frame-shaped flat surface MP facing the cover glass 103 is provided on the upper surface side of the frame member 102 . A protrusion 112 is provided on the flat surface MP. The protrusions 112 may be discretely arranged on the flat surface MP. The vertical cross-sectional shape of the protruding portion 112 may be tapered, and the cross-sectional shape of the protruding portion 112 may be disk-shaped. Further, recesses 122 are provided adjacent to the protrusions 112 on the flat surface MP. The recess 122 may be formed on the flat surface MP so as to surround the protrusion 112 . The recess 122 may be a hole or a groove. Here, the depth and diameter of the recess 122 can be set so that the capacity of the bonding material 104 that can be accommodated in the recess 122 is larger than the capacity of the bonding material 104 that can be accommodated in the recess 113 . The material of the frame member 102 may be, for example, resin such as epoxy, stainless steel, or die-cast aluminum. The frame member 102 provided with the protrusions 112 and the recesses 122 may be formed by molding, cutting, laser processing, or 3D printing. good too. An adhesive may be used to bond the frame member 102 and the substrate 101 together. Note that the frame member 102 is an example of a package member described in the claims.

The cover glass 103 seals the inside of the package 100 and protects the inside of the package 100 from dust and the like. A depression 113 is provided on the surface of the cover glass 103 that faces the upper surface of the frame member 102 . The protrusion 112 can be inserted into the depression 113 while the cover glass 103 is in contact with the flat surface MP of the frame member 102 . The recesses 113 may be holes or grooves. Cutting or etching may be used to form the depression 113 . Note that the cover glass 103 is an example of the cover described in the claims.

Instead of the cover glass 103, a transparent cover made of transparent resin such as acrylic or polycarbonate may be used. Alternatively, instead of the cover glass 103, an opaque cover made of epoxy resin, ceramic, metal, or the like may be used.

The bonding material 104 fixes the protrusion 112 within the recess 113 . The bonding material 104 is a solid with a melting point of 50° C. or higher. At this time, the bonding material 104 can undergo a phase transition from a solid phase to a liquid phase at a temperature of 50° C. or higher. For example, when solder reflow is used to mount the package 100, the bonding material 104 may undergo a phase transition from a solid phase to a liquid phase at around 200.degree.

The bonding material 104 is filled in the depression 113 and solidified with the protrusion 112 inserted. The material of the joining material 104 may be a low melting point solder or a low melting point alloy. The low melting point solder may be, for example, a Pb--Sn system, a Sn--Zn system, a Sn--Ag--Bi system, a Sn--Ag--In system, or a Sn--Bi system. The low melting point alloy may be Wood metal or Rose metal. In order to prevent contamination when the bonding material 104 is melted, it is preferable that the bonding material 104 does not contain an acidic component such as flux that promotes soldering. In addition, it is preferable that the bonding material 104 does not contain a component such as a solvent that causes degassing during melting.

By removing the cover glass 103 of the package 100, a coverless package can be constructed as shown in b and c in the figure. At this time, the bonding material 104 is removed from the recess 113 of the cover glass 103, accommodated in the recess 122 of the frame member 102, and solidified.

2 to 6 are cross-sectional views showing an example of the method of manufacturing the package member according to the first embodiment. Note that b in FIG. 5 is a cross-sectional view showing an enlarged region RA of a in FIG.

A plate-shaped cover glass 103 is prepared as shown in a in FIG.

Next, as shown in FIG. 2b, recesses 113 are formed in the cover glass 103 by a method such as photolithography and etching. Note that the depression 113 may be formed by a method such as cutting.

Next, as shown in c in FIG. 2, the recess 113 is filled with the bonding material 104 . The bonding material 104 may be filled by melting the bonding material 104 and pouring it into the depression 113 , or by inserting the bonding material 104 molded into pellets into the depression 113 .

On the other hand, as shown in FIG. 3a, a substrate 101 having a land electrode 111 formed on the back side is prepared. Wiring, land electrodes, and through electrodes may be formed on the substrate 101 .

Next, as shown in FIG. 3b, the semiconductor chip 105 with the color filter 115 and the on-chip lens 125 formed thereon is die-bonded onto the substrate 101. Then, as shown in FIG. Then, the semiconductor chip 105 and the substrate 101 are electrically connected through the bonding wires 135 .

Next, as shown in c in FIG. 3, the frame member 102 is adhered onto the substrate 101 so as to surround the semiconductor chip 105 . An adhesive may be used to bond the frame member 102 and the substrate 101 together.

Next, as shown in a in FIG. 4, the cover glass 103 is heated to melt the bonding material 104 . Also, the substrate 101 is positioned so that the tip of the protruding portion 112 faces the recess 113 .

Next, as shown in b in FIG. 4, the projecting portion 112 is inserted into the bonding material 104 so that the flat surface MP of the frame member 102 contacts the cover glass 103 . Then, the heating of the cover glass 103 is stopped and the bonding material 104 is solidified to manufacture the package 100 with the cover glass 103 attached. By attaching the cover glass 103 to the package 100, the semiconductor chip 105 can be protected from dust adhesion and contamination during storage and transportation.

Next, the package 100 is mounted on the motherboard 141 as shown in c in FIG. A wiring 142 is formed on the motherboard 141 . Also, solder balls 143 may be formed on the motherboard 141 . Then, the package 100 is positioned so that the land electrodes 111 face the solder balls 143 .

Next, as shown in FIGS. 5a and 5b, the package 100 is mounted on the motherboard 141 by reflowing the solder balls 143 while the package 100 is placed on the motherboard 141. FIG. At this time, the bonding material 104 is removed from the recess 113 of the cover glass 103, accommodated in the recess 122 of the frame member 102, and solidified. Therefore, the fixation of the cover glass 103 via the bonding material 104 is released. Here, even if the bonding material 104 is removed from the depression 113 of the cover glass 103 , the protrusion 112 remains inserted into the depression 113 before removing the cover glass 103 from the frame member 102 . Therefore, it is possible to prevent the cover glass 103 from falling from the frame member 102 due to the lateral shift of the cover glass 103 .

Next, the cover glass 103 is removed from the frame member 102 as shown in a in FIG. As a result, the package 100 without the cover glass 103 is mounted on the motherboard 141 as shown in FIG. 6b. At this time, since the bonding material 104 is separated from the cover glass 103 , the cover glass 103 is not adhered to the frame member 102 . Therefore, the cover glass 103 can be removed without applying a load to the cover glass 103 by a method such as vacuum adsorption, and breakage of the cover glass 103 can be prevented. As a result, the cover glass 103 can be reused, and the cost of the cover glass 103 can be suppressed.

As described above, in the above-described first embodiment, the projecting portion 112 of the frame member 102 can be inserted and removed based on the phase transition of the bonding material 104 in the depression 113 provided in the cover glass 103 . At this time, by solidifying the bonding material 104 , the projecting portion 112 can be fixed in the depression 113 , and the cover glass 103 can be fixed on the frame member 102 . Further, by melting the bonding material 104 , the projecting portion 112 can be extracted from the recess 113 , and the cover glass 103 can be removed from the frame member 102 . As a result, while the cover glass 103 can be removed, it is possible to prevent the cover glass 103 from being detached when handling the package 100, and the on-chip lens 125 can be prevented from being affected by ghosts during imaging, and dust can adhere to the on-chip lens 125. can be prevented.

Further, by providing the recess 122 around the protruding portion 112, the melted bonding material 104 can be accumulated in the recess 122, and the melted bonding material 104 can be prevented from scattering inside the package 100.

Further, by using the bonding material 104 to fix the protruding portion 112 in the recess 113, the bonding material 104 is melted based on solder reflow during mounting of the package 100, and the cover glass 103 can be removed from the frame member 102. can be done. Therefore, the heating process of the bonding material 104 for removing the cover glass 103 from the frame member 102 does not need to be provided separately from the solder reflow process when mounting the package 100, and an increase in the number of processes can be suppressed.

<2. Second Embodiment>
In the above-described first embodiment, the frame member 102 is discretely provided with projections 112 that can be inserted and removed based on the phase transition of the bonding material 104 in the depressions 113 provided in the cover glass 103 . In the second embodiment, the frame member is linearly provided with a projecting portion that can be inserted and removed based on the phase transition of the bonding material in the depression provided in the cover glass.

FIG. 7 is a plan view showing a configuration example of a package member according to the second embodiment. Note that a in FIG. 2 is a plan view showing a configuration example of the cover glass 203, and b in FIG.

In the figure, the package 200 includes a frame member 202 instead of the frame member 102 of the first embodiment described above. Other configurations of the package 200 of the second embodiment are the same as those of the package 100 of the first embodiment described above.

The frame member 202 includes a projecting portion 212 and a recessed portion 222 instead of the projecting portion 112 and the recessed portion 122 of the first embodiment described above. Other configurations of the frame member 202 of the second embodiment are the same as those of the frame member 102 of the above-described first embodiment.

A frame-shaped flat surface MP facing the cover glass 203 is provided on the upper surface side of the frame member 202 . A protrusion 212 is provided on the flat surface MP. The projecting portion 212 is linearly arranged on the flat surface MP. Further, recesses 222 are provided adjacent to the protrusions 212 on the flat surface MP. The recess 222 may be formed on the flat surface MP so as to surround the protrusion 212 . Here, the depth and width of the recess 222 can be set so that the capacity of the bonding material 104 that can be accommodated in the recess 222 is larger than the capacity of the bonding material 104 that can be accommodated in the recess 213 .

The cover glass 203 seals the inside of the package 200 and protects the inside of the package 200 from dust and the like. A depression 213 is provided on the surface of the cover glass 203 that faces the upper surface of the frame member 202 . The depression 213 allows the protrusion 212 to be inserted while the cover glass 203 is in contact with the flat surface MP.

A bonding material 104 can be used to fix the protrusion 212 within the recess 213 . At this time, the bonding material 104 is filled in the recesses 213 and solidified with the protrusions 212 inserted.

The package 200 is a coverless package. A cover glass 203 is removed from the package 200 . At this time, the bonding material 104 is removed from the recesses 213 of the cover glass 203, accommodated in the recesses 222 of the frame member 202, and solidified.

Thus, in the above-described second embodiment, the frame member 202 is linearly provided with the projecting portion 212 that can be inserted and removed based on the phase transition of the bonding material 104 in the recess 213 provided in the cover glass 203 . As a result, the contact area between the bonding material 104 and the protrusions 212 can be increased compared to the case where the protrusions 112 are discretely provided on the frame member 102 , and the cover glass 203 can be held on the frame member 202 more firmly. can be fixed to

<3. Third Embodiment>
In the above-described second embodiment, the frame member 102 is linearly provided with the protruding portion 212 that can be inserted/extracted based on the phase transition of the bonding material 104 in the recess 113 provided in the cover glass 103 . In the third embodiment, the frame member is provided with a frame-like protruding portion that can be pulled out and inserted based on the phase transition of the bonding material in the depression provided in the cover glass.

FIG. 8 is a plan view showing a configuration example of a package member according to the third embodiment. Note that a in FIG. 10 is a plan view showing a configuration example of the cover glass 303, and b in FIG.

In the figure, a package 300 includes a frame member 302 instead of the frame member 102 of the first embodiment described above. Other configurations of the package 300 of the third embodiment are the same as those of the package 100 of the first embodiment described above.

The frame member 302 includes a projecting portion 312 and a recessed portion 322 instead of the projecting portion 112 and the recessed portion 122 of the first embodiment described above. Other configurations of the frame member 302 of the third embodiment are the same as those of the frame member 102 of the above-described first embodiment.

A frame-shaped flat surface MP facing the cover glass 303 is provided on the upper surface side of the frame member 302 . A protrusion 312 is provided on the flat surface MP. The projecting portion 312 is arranged in a frame shape on the flat surface MP. In addition, recesses 322 are provided adjacent to the protrusions 312 on the flat surface MP. The recess 322 may be formed on the flat surface MP so as to surround the protrusion 312 . Here, the depth and width of the recess 322 can be set so that the capacity of the bonding material 104 that can be accommodated in the recess 322 is larger than the capacity of the bonding material 104 that can be accommodated in the recess 313 .

The cover glass 303 seals the inside of the package 300 and protects the inside of the package 300 from dust and the like. A depression 313 is provided on the surface of the cover glass 303 that faces the upper surface of the frame member 302 . The depression 313 allows the protrusion 312 to be inserted while the cover glass 303 is in contact with the flat surface MP.

A bonding material 104 can be used to fix the protrusion 312 within the recess 313 . At this time, the bonding material 104 is filled in the recesses 313 and solidified with the protrusions 312 inserted.

The package 300 is a coverless package. Cover glass 303 is removed from package 300 . At this time, the bonding material 104 is removed from the recesses 313 of the cover glass 303, accommodated in the recesses 322 of the frame member 302, and solidified.

Thus, in the above-described third embodiment, the frame member 302 is provided with the projecting portion 312 that can be inserted and removed based on the phase transition of the bonding material 104 in the recess 313 provided in the cover glass 303 . As a result, the periphery of the package 300 can be surrounded by the projecting portion 312, and the sealing performance of the package 300 when the cover glass 303 is attached can be improved.

<4. Fourth Embodiment>
In the above-described first embodiment, the recess 113 having a tapered cross section is provided in the cover glass 103, but in the fourth embodiment, a recess having a reverse tapered cross section is provided in the cover glass.

FIG. 9 is a cross-sectional view showing a configuration example of a package member according to the fourth embodiment. Note that a to c in FIG. 5 indicate portions corresponding to the area RA of a in FIG. In addition, a in FIG. 4 indicates the state before the cover glass 403 is attached, and corresponds to the state of the step a in FIG. b in FIG. 4 shows the state after the cover glass 403 is attached, and corresponds to the state of the step b in FIG. In FIG. 5, c shows a state in which the bonding material 104 is melted after the cover glass 403 is attached, and corresponds to the states of steps a and b in FIG.

In the same figure, the cover glass 403 has a recess 413 instead of the recess 113 of the cover glass 103 of the first embodiment. Other configurations of the cover glass 403 of the fourth embodiment are the same as those of the cover glass 103 of the above-described first embodiment.

A depression 413 is provided on the surface of the cover glass 403 that faces the upper surface side of the frame member 102 . The depression 413 allows the protrusion 112 to be inserted while the cover glass 403 is in contact with the flat surface MP. The cross-sectional shape of the depression 413 can be a reverse tapered shape. In addition, the depression 413 is an example of a region in which the horizontal spread described in the claims changes so as to increase toward the bottom.

As shown in a in the figure, the bonding material 104 is filled in the recess 413 in order to fix the protruding part 112 in the recess 413 .

Then, as shown in b in the figure, the bonding material 104 is solidified in a state in which the projecting portion 112 is inserted into the bonding material 104 so that the flat surface MP of the frame member 102 is in contact with the cover glass 403. , the cover glass 403 is fixed to the frame member 102 . Here, the cross-sectional shape of the depression 413 of the cover glass 403 is a reverse tapered shape. Therefore, when the bonding material 104 solidifies in the recess 413 , a resistance force acts on the bonding material 104 against an external force that separates the bonding material 104 from the bottom of the recess 413 . As a result, the bonding material 104 is kept in the recess 413 even when an external force is applied to the bonding material 104 in the direction of getting out of the recess 413 .

Furthermore, as shown in c in the same figure, when the cover glass 403 is heated and the bonding material 104 filled in the depression 413 is melted, the bonding material 104 is removed from the depression 413 and the cover through the bonding material 104 is removed. The fixation of the glass 403 is released. At this time, the cover glass 403 can be removed from the frame member 102, and the bonding material 104 removed from the recess 413 of the cover glass 403 falls into the recess 122 of the frame member 102 and is stored in the recess 122. solidified.

Thus, in the above-described fourth embodiment, the cover glass 403 is provided with the depression 413 having a reverse tapered cross-sectional shape. As a result, the solidified bonding material 104 can be prevented from slipping out of the recess 413, and even if the adhesiveness between the solidified bonding material 104 and the cover glass 403 is weak, the separation of the cover glass 403 can be prevented. .

<5. Fifth Embodiment>
In the above-described first embodiment, the projecting portion 112 having a tapered cross-sectional shape is provided on the frame member 102, but in the fifth embodiment, the width in the horizontal direction increases toward the distal end. A region is provided in the projecting portion of the frame member.

FIG. 10 is a cross-sectional view showing a configuration example of a package member according to the fifth embodiment. Note that a to c in FIG. 5 indicate portions corresponding to the area RA of a in FIG. In addition, a in FIG. 4 indicates the state before the cover glass 103 is attached, and corresponds to the state of the step a in FIG. b in FIG. 4 shows the state after the cover glass 103 is attached, and corresponds to the state of the step b in FIG. c in the figure shows the state in which the bonding material 104 is melted after the cover glass 103 is attached, and corresponds to the state in the steps a and b in FIG.

In the figure, a frame member 502 includes a projecting portion 512, a widened portion 532 and a recessed portion 522 instead of the projecting portion 112 and recessed portion 122 of the frame member 102 of the first embodiment. Other configurations of the frame member 502 of the fifth embodiment are the same as those of the frame member 102 of the first embodiment described above.

In the frame member 502, a flat surface MP facing the cover glass 103 is provided in a frame shape on the upper surface side. A protrusion 512 is provided on the flat surface MP. The protruding portions 512 may be arranged discretely on the flat surface MP, may be arranged linearly, or may be arranged in a frame shape. A widened portion 532 is provided at the tip of the projecting portion 512 . The widened portion 532 has a region where the diameter or width of the projecting portion 512 changes so as to increase in the distal direction. The widened portion 532 may have a structure in which a step is provided at the tip of the projecting portion 512, or may have an anchor shape. It should be noted that the widened portion 532 is an example of a region in which the horizontal spread described in the claims changes so as to increase in the distal direction. Further, recesses 522 are provided adjacent to the protrusions 512 on the flat surface MP. The recess 522 may be formed on the flat surface MP so as to surround the protrusion 512 . Note that 3D printing or 3D processing may be used to provide the projecting portion 512, the widening portion 532, and the recessed portion 522 in the frame member 502. FIG.

As shown in a in the same figure, the bonding material 104 is filled in the recess 113 in order to fix the protruding part 512 in the recess 113 .

Then, as shown in b in the figure, the bonding material 104 is solidified in a state in which the projecting portion 512 is inserted into the bonding material 104 so that the flat surface MP of the frame member 502 contacts the cover glass 103. , the cover glass 103 is fixed to the frame member 502 . Here, the protrusion 512 has a widened portion 532 . Therefore, when the bonding material 104 solidifies in the recess 113 , a resistance force acts on the widened part 532 against an external force that pulls out the widened part 532 from the bonding material 104 . As a result, even when an external force acts on the widened portion 532 to pull it out from the jointing material 104 , the widened portion 532 is held by the jointing material 104 together with the projecting portion 512 .

Furthermore, as shown in c in the figure, when the cover glass 103 is heated and the bonding material 104 filled in the depression 113 is melted, the bonding material 104 is removed from the depression 113, and the cover through the bonding material 104 is removed. The fixation of the glass 103 is released. At this time, the cover glass 103 can be removed from the frame member 502, and the bonding material 104 removed from the recess 113 of the cover glass 103 falls into the recess 522 of the frame member 502 and is stored in the recess 522. solidified.

Thus, in the fifth embodiment described above, the projecting portion 512 of the frame member 502 is provided with the widened portion 532 . As a result, it is possible to prevent the protruding portion 512 from slipping out of the solidified bonding material 104, and even if the adhesiveness between the solidified bonding material 104 and the frame member 102 is weak, the detachment of the cover glass 103 can be prevented. can.

<6. Sixth Embodiment>
In the first embodiment described above, the projecting portion 112 having a tapered cross-sectional shape is provided in the frame member 102 , and the recess 113 having a tapered cross-sectional shape is provided in the cover glass 103 . In this sixth embodiment, the projecting portion of the frame member is provided with a region in which the horizontal spread increases toward the tip, and the horizontal spread changes so as to increase toward the bottom. A region is provided in the recess of the cover glass.

FIG. 11 is a cross-sectional view showing a configuration example of a package member according to the sixth embodiment. Note that a to c in FIG. 5 indicate portions corresponding to the area RA of a in FIG. In addition, a in FIG. 4 indicates the state before the cover glass 603 is attached, and corresponds to the state of the step a in FIG. b in FIG. 4 shows the state after the cover glass 603 is attached, and corresponds to the state of the step b in FIG. In FIG. 5, c shows the state in which the bonding material 104 is melted after the cover glass 603 is attached, and corresponds to the state of the steps a and b in FIG.

In the figure, the cover glass 603 includes a recess 613 and a widened portion 623 instead of the recess 113 of the cover glass 103 of the first embodiment. Other configurations of the cover glass 603 of the sixth embodiment are the same as those of the cover glass 103 of the above-described first embodiment. The frame member 602 includes a projecting portion 612, a widened portion 632 and a recessed portion 622 in place of the projecting portion 112 and the recessed portion 122 of the frame member 102 of the first embodiment. Other configurations of the frame member 602 of the sixth embodiment are the same as those of the frame member 102 of the above-described first embodiment.

A depression 613 is provided on the surface of the cover glass 603 that faces the upper surface of the frame member 602 . The recess 613 allows the protrusion 612 to be inserted while the cover glass 603 is in contact with the flat surface MP. A widened portion 632 is provided at the bottom of the recess 613 . The widened portion 632 has a region where the diameter or width of the recess 613 changes so as to increase toward the bottom. Note that the recess 613 is an example of a region in which the horizontal spread described in the claims changes so as to increase toward the bottom.

In the frame member 602, a flat surface MP facing the cover glass 603 is provided in the shape of a frame on its upper surface side. A protrusion 612 is provided on the flat surface MP. The protruding portions 612 may be arranged discretely on the flat surface MP, may be arranged linearly, or may be arranged in a frame shape. A widened portion 632 is provided on the projecting portion 612 . The widened portion 632 has a region where the diameter or width of the projecting portion 612 changes so as to increase in the distal direction. The widened portion 632 may have a structure in which a step is provided at the tip of the projecting portion 612, or may have an anchor shape. It should be noted that the widened portion 632 is an example of a region in which the horizontal spread described in the claims changes so as to increase toward the distal direction. In addition, recesses 622 are provided adjacent to the protrusions 612 on the flat surface MP. The recess 622 may be formed on the flat surface MP so as to surround the protrusion 612 . 3D printing or 3D processing may be used to provide the projecting portion 612, the widened portion 632, and the recessed portion 622 in the frame member 602. FIG.

As shown in a in the figure, the bonding material 104 is filled in the recess 613 in order to fix the protruding part 612 in the recess 613 .

Then, as shown in b in the figure, the bonding material 104 is solidified in a state in which the projecting portion 612 is inserted into the bonding material 104 so that the flat surface MP of the frame member 602 is in contact with the cover glass 603. , a cover glass 603 is fixed to the frame member 602 . Here, the recess 613 of the cover glass 603 has a widened portion 623 . Therefore, when the bonding material 104 solidifies in the recess 613 , a resistance against an external force that pulls the bonding material 104 away from the bottom of the recess 613 acts on the bonding material 104 , and the bonding material 104 is held in the recess 613 . The projecting portion 612 of the frame member 602 also includes a widened portion 632 . Therefore, when the bonding material 104 solidifies in the recess 613 , the widened part 632 is held in the recess 613 together with the projecting part 612 by resisting the external force that pulls out the widened part 632 from the bonding material 104 . be killed.

Furthermore, as shown in c in the figure, when the cover glass 603 is heated and the bonding material 104 filled in the depression 613 is melted, the bonding material 104 is removed from the depression 613, and the cover through the bonding material 104 is removed. The fixation of the glass 603 is released. At this time, the cover glass 603 can be removed from the frame member 602, and the bonding material 104 removed from the recess 613 of the cover glass 603 falls into the recess 622 of the frame member 602 and is stored in the recess 622. solidified.

FIG. 12 is a cross-sectional view showing an example of a method of manufacturing a package member according to the sixth embodiment.

A plate-shaped cover glass 603 is prepared as shown in a in the figure.

Next, as shown in b in the figure, a recess 613 is formed in the cover glass 603 by a method such as photolithography and etching. Note that the depression 613 may be formed by a method such as cutting.

Next, an etchant 633 is dripped onto the bottom of the recess 613 as shown in c in the figure. As the etchant 633, for example, a hydrofluoric acid-based chemical can be used. Also, the liquid surface of the etching liquid 633 may be positioned lower than the surface of the cover glass 603 . At this time, the cover glass 603 is isotropically etched at the position of the bottom of the recess 613, and is etched not only in the depth direction but also in the lateral direction. As a result, a widened portion 623 is formed at the bottom of the recess 613, as indicated by d in FIG. After the widened portion 623 is formed, the etchant 633 is removed from the cover glass 603 by a method such as washing.

Thus, in the sixth embodiment described above, the widened portion 623 is provided in the depression 613 of the cover glass 603 . As a result, it is possible to prevent the solidified bonding material 104 from slipping out of the recess 613 of the cover glass 603 and to prevent the projecting portion 612 from slipping out of the solidified bonding material 104 . Therefore, even if the solidified bonding material 104 does not adhere to the frame member 602 and the cover glass 603, it is possible to prevent the cover glass 603 from coming off.

Note that the frame member 602 of the sixth embodiment described above may be combined with the cover glass 403 of the fourth embodiment described above. Alternatively, the cover glass 603 of the sixth embodiment described above may be combined with the frame member 502 of the fifth embodiment described above.

<7. Seventh Embodiment>
In the first embodiment described above, in order to make the cover glass 103 detachable, the cover glass 103 is provided with the depression 113 and the frame member 102 is provided with the projecting portion 112 . In the seventh embodiment, the frame member is provided with a recess and the substrate is provided with a protrusion in order to make the cover glass detachable.

FIG. 13 is a diagram showing a configuration example of a package member according to the seventh embodiment. In the figure, a is a cross-sectional view showing an example of a configuration obtained by vertically cutting the package 700 before removing the frame member 702 to which the cover glass 703 is adhered. FIG. 7b is a cross-sectional view showing an example of a configuration obtained by cutting the package 700 in the vertical direction after removing the frame member 702 to which the cover glass 703 is adhered. FIG. 7c is a plan view showing a configuration example of the package 700 after removing the frame member 702 to which the cover glass 703 is adhered. In a and b in the same figure, an example of the configuration cut at the position of the B1-B2 line of c in the same figure is shown.

In the figure, a package 700 includes a substrate 701, a frame member 702 and a cover glass 703 instead of the substrate 101, frame member 102 and cover glass 103 of the first embodiment. Other configurations of the package 700 of the seventh embodiment are the same as those of the package 100 of the first embodiment described above.

In the figure, the package 700 can be used as a hollow package whose inside is sealed with a cover glass 703 . At this time, the frame member 702 with the cover glass 703 adhered thereto can be removed from the package 700 . When the package 700 is provided with the frame member 702 to which the cover glass 703 is adhered, the cover glass 703 is supported on the substrate 701 via the frame member 702 .

For the substrate 701, for example, an organic substrate or a ceramic substrate can be used. Wiring and pad electrodes can be formed on the substrate 701 . The board 701 may be an interposer board, a printed board, or a buildup board.

A frame-shaped flat surface MP1 is provided on the upper surface side of the substrate 701 around the mounting area of the semiconductor chip 105 . A projecting portion 711 is provided on the flat surface MP1. The protrusions 711 may be discretely arranged on the flat surface MP1. The vertical cross-sectional shape of the projecting portion 711 may be tapered, and the horizontal cross-sectional shape of the projecting portion 711 may be disk-shaped. In addition, recesses 721 are provided adjacent to the protrusions 711 on the flat surface MP1. The recess 721 may be formed on the flat surface MP1 so as to surround the protrusion 711 . Here, the depth and diameter of the recess 721 can be set so that the capacity of the bonding material 104 that can be accommodated in the recess 721 is larger than the capacity of the bonding material 104 that can be accommodated in the recess 712 . Cutting, laser processing, or 3D printing may be used to form the protruding portion 711 and the recessed portion 721 . Note that the substrate 701 is an example of the package member described in the claims.

The frame member 702 supports the cover glass 703 on the substrate 701 with a gap from the semiconductor chip 105 . The planar shape of the frame member 702 can be, for example, a frame shape. At this time, the frame member 702 can be provided with a flat surface MP2 facing the flat surface MP1 of the substrate 701 in a frame shape. A depression 712 is provided on the flat surface MP2. The depression 712 allows the protrusion 711 to be inserted while the flat surface MP1 of the substrate 701 is in contact with the flat surface MP2 of the frame member 702 . The material of the frame member 702 may be, for example, resin such as epoxy, stainless steel, or die-cast aluminum. The frame member 702 having the recesses 712 may be formed by molding, cutting, laser processing, or 3D printing. Note that the frame member 702 is an example of a package member described in the claims.

The cover glass 703 seals the inside of the package 700 and protects the inside of the package 700 from dust and the like. A cover glass 703 is adhered to the frame member 702 . An adhesive may be used to bond the cover glass 703 and the frame member 702 together. A transparent cover made of a transparent resin such as acrylic or polycarbonate may be used instead of the cover glass 703 . Alternatively, instead of the cover glass 703, an opaque cover made of epoxy resin, ceramic, or the like may be used.

A coverless package can be configured by removing the frame member 702 to which the cover glass 703 is adhered from the package 700, as shown in b and c in the figure. At this time, the bonding material 104 is removed from the recess 712 of the frame member 702, accommodated in the recess 721 of the substrate 701, and solidified.

Thus, in the seventh embodiment described above, the projecting portion 711 of the substrate 701 can be inserted and removed based on the phase transition of the bonding material 104 in the recess 712 provided in the frame member 702 . At this time, by solidifying the bonding material 104 , the projecting portion 711 can be fixed in the depression 712 , and the frame member 702 to which the cover glass 703 is adhered can be fixed on the substrate 701 . Further, by melting the bonding material 104 , the projecting portion 711 can be extracted from the recess 712 , and the frame member 702 to which the cover glass 703 is adhered can be removed from the substrate 701 . As a result, while the cover glass 703 can be removed, it is possible to prevent the cover glass 703 from being detached when handling the package 700. As a result, the on-chip lens 125 can be prevented from being affected by ghosts during imaging, and dust can adhere to the on-chip lens 125. can be prevented.

Further, by providing the recess 721 around the protruding portion 711 , the melted bonding material 104 can be accumulated in the recess 721 and the melted bonding material 104 can be prevented from scattering inside the package 700 .

The protrusion 711 and the

depressions

712 and 721 of the seventh embodiment described above may be linearly provided in the same manner as the protrusion 212 and the

depressions

213 and 222 of the second embodiment described above. Alternatively, the protrusion 711 and the

depressions

712 and 721 of the seventh embodiment described above may be provided in a frame shape like the protrusion 312 and the

depressions

313 and 322 of the third embodiment described above.

Further, instead of the shape of the recess 712 of the seventh embodiment described above, the shape of the recess 413 of the fourth embodiment described above may be used, or the shape of the recess 613 of the sixth embodiment described above may be used. may be Further, instead of the shape of the projecting portion 711 of the above-described seventh embodiment, the shape of the projecting portion 512 of the above-described fifth embodiment may be used, or the shape of the projecting portion of the above-described sixth embodiment may be used. 612 may be used.

<8. Eighth Embodiment>
In the first embodiment described above, the cover glass 103 is removed from the frame member 102 based on the phase transition of the bonding material 104 in the depression 113 provided in the cover glass 103 . In the eighth embodiment, a lens is provided on the semiconductor chip 105 through the frame member 102 from which the cover glass 103 is removed.

FIG. 14 is a cross-sectional view showing a configuration example of a package member according to the eighth embodiment. Note that a in FIG. 10 is a cross-sectional view showing a configuration example in which the package 100 and the lens 802 are vertically cut before the lens 802 is attached. b in FIG. 4 is a cross-sectional view showing an example of a configuration in which the package 800 configured by attaching the lens 802 to the package 100 is cut in the vertical direction.

In b in the figure, the package 800 comprises the package 100 and the lens 802 . The lens 802 forms an image of light incident on the imaging surface of the semiconductor chip 105 on the imaging surface of the semiconductor chip 105 . A lens 802 is supported by a housing 801 . The housing 801 is installed on the frame member 102 so that the lens 802 faces the imaging surface of the semiconductor chip 105 . The housing 801 has a flat surface MK facing the flat surface MP of the frame member 102 . The flat surface MK of the housing 801 can be configured in a frame shape like the flat surface MP of the frame member 102 . A concave portion 811 is provided on the flat surface MK. The concave portion 811 can accommodate the projecting portion 112 while the flat surface MP of the frame member 102 and the flat surface MK of the housing 801 are in contact with each other. The material of the housing 801 may be resin, stainless steel, or aluminum die-cast. For bonding the frame member 102 and the housing 801, for example, a thermosetting resin 803 such as an epoxy resin can be used.

When bonding the frame member 102 and the housing 801 together, the thermosetting resin 803 is filled into the recess 811 as indicated by a in FIG. Then, the flat surface MK of the housing 801 is brought into contact with the flat surface MP of the frame member 102 with the projecting portion 112 of the frame member 102 inserted into the recess 811, as shown in FIG. Then, the thermosetting resin 803 is cured at a temperature lower than the melting point of the bonding material 104 to bond the frame member 102 and the housing 801 together. The step of bonding the frame member 102 and the housing 801 can be performed following the step b in FIG. 6 of the first embodiment described above.

Thus, in the eighth embodiment described above, the lens 802 is mounted on the semiconductor chip 105 via the frame member 102 after the cover glass 103 is removed from the frame member 102 . This eliminates the need to provide a region for supporting the lens 802 on the mother board 141, making it possible to increase the mounting area for electronic components on the mother board 141. FIG. In addition, the flat surface MP of the frame member 102 can be used for positioning the lens 802, and compared to the case where the housing for supporting the lens 802 is provided on the motherboard 141, the burden of adjusting the positioning of the lens 802 is reduced. can do.

In the eighth embodiment described above, instead of the protrusion 112 of the frame member 102, the protrusion 512 of the frame member 502 of the fifth embodiment may be provided. A protrusion 612 on the frame member 602 of the embodiment may be provided.

In the above-described embodiments, in order to construct a hollow package with a cover attached, the configuration using a frame member that separates the cover from the substrate and supports it on the substrate is taken as an example. In the following embodiments, a structure in which a cover is mounted on a substrate provided with a cavity in order to form a hollow package with a cover is taken as an example.

<9. Ninth Embodiment>
In the above-described third embodiment, a projecting portion 312 that can be pulled out and inserted based on the phase transition of the bonding material 104 in the recess 313 provided in the cover glass 303 is provided in a frame shape with respect to the frame member 302 . In the ninth embodiment, a frame-like projection is formed on a substrate from which a cover glass can be attached and detached based on the phase transition of a bonding material provided on the cover glass, and an air hole is provided in the projection.

FIG. 15 is a plan view showing a configuration example of a package member according to the ninth embodiment, and FIG. 16 is a cross-sectional view showing a configuration example of the package member according to the ninth embodiment. 15A is a plan view showing a configuration example of the cover glass 903, and FIG. 15B is a plan view showing a configuration example of the package 900 after the cover glass 903 is removed. FIG. 16a is a cross-sectional view showing a configuration example of vertically cutting the package 900 before the cover glass 903 is removed. FIG. 16b is a cross-sectional view showing a configuration example of cutting the package 900 in the vertical direction after the cover glass 903 has been removed. The cover glass 903 of a in FIG. 16 shows a configuration example cut at the position of the C1-C2 line of a in FIG. 15, and the substrate 901 of a in FIG. A cut configuration example is shown.

15 and 16, the package 900 includes a substrate 901 and a cover glass 903. The package 900 can be used as a hollow package whose inside is sealed. Cover glass 903 is removable from package 900 .

For the substrate 901, for example, an organic substrate or a ceramic substrate can be used. Substrate 901 may be a multi-layer substrate. FIG. 16 shows an example using a three-layer substrate as the substrate 901 .

A cavity 963 is formed in the substrate 901 . A mounting area for the semiconductor chip 981 is provided in the cavity 963 . A semiconductor chip 981 is mounted in the cavity 963 . A solid-state imaging device such as a CCD sensor or a CMOS sensor can be formed on the semiconductor chip 981 . Semiconductor chip 981 is electrically connected to substrate 901 through bonding wires 982 .

Further, the substrate 901 is provided with insulating

layers

911 , 921 and 931 . Wiring 941 and vias 946 are formed in the insulating layer 911 , and back wiring 940 and solder resist 951 are formed on the back side of the insulating layer 911 . The wiring 941 and the back wiring 940 are connected via vias 946 . The solder resist 951 is arranged around the back wiring 940 , and the plated layer 944 is formed on the back wiring 940 .

A wiring 942 , a through-hole 961 and a through-hole wiring 948 are formed in the insulating layer 921 , and the wiring 941 and the wiring 942 are connected via the through-hole wiring 948 . A resin 962 is embedded in the through hole 961 .

A wiring 943 and a via 947 are formed in the insulating layer 931 , and the wiring 943 and the wiring 942 are connected via the via 947 . Further, the insulating layer 931 is provided with a flat surface MP1 facing the cover glass 903 . A projecting portion 971 projecting from the flat surface MP1 is provided on the wiring 943 .

The projecting portion 971 is arranged to surround the cavity 963 as shown in FIG. 15b. The material of the projecting portion 971 may be metal or resin. When the material of the projecting portion 971 is metal, the same material as that of the wiring 941 may be used. When the material of the projecting portion 971 is resin, the same material as the solder resist 951 may be used. When the material of the projection 971 is metal, the aspect ratio is preferably 1 or more, and more preferably 2 or more. An air hole 973 is formed in the protruding portion 971 at a position crossing the protruding portion 971 .

The air hole 973 can form an air passage between the cavity 963 and the outside when the inside of the cavity 963 is sealed with the cover glass 903 as shown in FIG. 16a. One or more air holes 973 may be provided in the projecting portion 971 . It is preferable that the diameter of the air hole 973 be as small as possible within the range where clogging by foreign matter such as dust can be prevented. A plated layer 945 is formed on the projecting portion 971 . Further, a solder resist 950 positioned around the projecting portion 971 is provided on the flat surface MP1. A recess 972 is provided in the solder resist 950 so as to surround the protrusion 971 . The concave portion 972 is formed by a single stroke, and the portion of the air hole 973 is discontinuous. The solder resist 950 is an example of the resin layer described in claims.

The material of the

wirings

941, 942 and 943, the back wiring 940, the

vias

946 and 947, the through-hole wiring 948, and the projecting portion 971 is metal such as Cu, for example. At this time, the wiring 943 and the projecting portion 971 can be integrally configured. The material of the plated

layers

944 and 945 is metal such as Au, for example. The plated layers 944 and 945 can improve solder wettability.

The cover glass 903 seals the inside of the package 900 and protects the inside of the package 900 from dust and the like. A bonding material 923 is provided on the cover glass 903 . An underlayer 913 may be provided between the bonding material 923 and the cover glass 903 to reduce stress between the bonding material 923 and the cover glass 903 .

The bonding material 923 can be bonded to the projecting portion 971 via the plated layer 945 . The bonding material 923 can be formed in a frame shape at a position where it can face the projecting portion 971 as shown in FIG. The bonding material 923 can undergo a phase transition from a solid phase to a liquid phase at a temperature of 50° C. or higher. For example, when solder reflow is used to mount the package 900, the bonding material 923 may undergo a phase transition from a solid phase to a liquid phase at around 200.degree. The material of the bonding material 923 is, for example, low melting point solder.

A coverless package can be constructed by removing the cover glass 903 of the package 900 as shown in FIG. At this time, the bonding material 923 is removed from the cover glass 903, accommodated in the recess 972 of the substrate 901, and solidified.

17 to 22 are cross-sectional views showing an example of a method of manufacturing a package member according to the ninth embodiment.

A substrate 901' is prepared as shown in a in FIG. The substrate 901′ is the substrate 901 of FIG. 16a before the cavity 963 and the recess 972 are formed. In substrate 901 ′, air holes 973 can be provided in protrusions 971 . In forming the air holes 973 , the air holes 973 can be patterned together with the patterning of the wiring 943 and the protrusions 971 on the insulating layer 931 . The pattern of protrusions 971 and air holes 973 may be determined based on the surface layer design of the metal layer used for wiring 943 .

Next, as shown in FIG. 17B, recesses 972 are formed in the solder resist 950 so as to surround the protruding portions 971 . The recesses 972 may be formed by router processing, laser processing, or patterning using photolithography. The pattern of the recesses 972 may be determined based on the surface layer design of the solder resist 950 .

Next, as shown in FIG. 18a, a substrate 901 is formed by forming a cavity 963 at a position surrounded by the protruding portion 971. Then, as shown in FIG. In forming the cavity 963, for example, router processing can be used.

Next, as shown in FIG. 18b, solder balls 980 are formed on the back wiring 940 with a plated layer 944 interposed therebetween.

Next, as shown in FIG. 19a, the semiconductor chip 981 is die-bonded into the cavity 963. Then, as shown in FIG.

Next, as shown in FIG. 19b, the semiconductor chip 981 and the substrate 901 are electrically connected via bonding wires 982. Then, as shown in FIG.

Next, as shown in FIG. 20a, the cover glass 903 is placed on the substrate 901 so that the bonding material 923 and the plated layer 945 are in contact with each other. Then, the bonding material 923 is bonded to the projecting portion 971 via the plating layer 945 to manufacture the package 900 with the cover glass 903 attached. At this time, the cover glass 903 may be heated to melt the bonding material 923 to bond the bonding material 923 to the protrusion 971 . The bonding material 923 and the projecting portion 971 may be bonded by pressing the bonding material 923 through the plated layer 945 . By attaching the cover glass 903 to the package 900, the semiconductor chip 981 can be protected from dust adhesion and contamination during storage and transportation.

Next, as shown in b in FIG. 20, the package 900 with the cover glass 903 attached is placed on the motherboard 141 . Then, while the package 900 is placed on the motherboard 141 , the solder balls 980 are reflowed to mount the package 900 on the motherboard 141 .

At this time, as shown in a in FIG. 21, the bonding material 923 is melted, so that the bonding material 923 drops, is removed from the cover glass 903, is accommodated in the recess 972 of the substrate 901, and is solidified. . Therefore, the fixation of the cover glass 903 via the bonding material 923 is released, and the cover glass 903 can be removed from the substrate 901 .

Next, as shown in FIG. 21b, the substrate 901 from which the cover glass 903 has been removed is washed. In this cleaning, residue on the substrate 901 may be removed by blowing nitrogen gas.

Next, as shown in FIG. 22, the upper housing 992 is fixed to the motherboard 141. A bolt 997 may be used to fix the upper housing 992 . The upper housing 992 is provided with a support member 993 that supports the lens 995 on the substrate 901 . Lens 995 is fixed to support member 993 via adhesive layer 996 . At this time, the upper housing 992 can be arranged such that the lens 995 is positioned on the substrate 901 . A lower housing 991 is fixed under the upper housing 992 . The lower housing 991 may be fixed to the upper housing 992 via an adhesive layer 994 .

Thus, in the above-described ninth embodiment, by using the substrate 901 provided with the cavity 963 in order to configure the hollow package, the frame member can be made unnecessary, and the number of components of the package 900 can be reduced. can be reduced.

In addition, by providing the air hole 973 in the protruding portion 971, it is possible to suppress the pressure increase in the cavity 963 sealed with the cover glass 903 during reflow of the package 900, thereby preventing peeling and cracking of the semiconductor chip 981. be able to.

In addition, by using low-melting-point solder as the material of the bonding material 923, even if residue is generated in the cavity 963 when the cover glass 903 is removed, problems due to aging deterioration of the residue can be reduced. In addition, low-melting-point solder can improve heat resistance and moisture resistance compared to resin adhesives, and can improve connection reliability. In addition, low-melting-point solder can reduce the risk of outgassing and improve the reliability of the package 900 . This can be achieved by fluxless soldering or reflow while exposing to formic acid gas.

In addition, in the formation of the protrusions 971, the air holes 973, and the recesses 972, a desired seal pattern can be formed based on the surface layer design of the substrate 901, and an increase in the number of steps can be suppressed while using existing manufacturing processes. can do.

Also, by setting the aspect ratio to 1 or more when the material of the protruding portion 971 is metal, it is possible to increase the wetting and spreading of the bonding material 923, and to facilitate attachment and detachment of the package 900.

In the package 300 of the third embodiment described above, an example in which the cover glass 303 is combined with the frame member 302 is shown. It may be combined with the frame member 302 of the form. At this time, the projecting portion 971 of the ninth embodiment may be provided on the frame member 302 instead of the projecting portion 312 of the third embodiment. Also, an air hole may be provided in the protruding portion 971 provided instead of the protruding portion 312 of the frame member 302 of the above-described third embodiment.

FIG. 23 is a cross-sectional view showing a modification of the manufacturing method of the package member according to the ninth embodiment. Note that a in FIG. 23 shows a first modification of the method for manufacturing the package member according to the ninth embodiment. FIG. 23b shows a second modification of the method of manufacturing the package member according to the ninth embodiment. FIG. 23c shows a third modification of the method of manufacturing the package member according to the ninth embodiment.

In the figure, the board of the first modified example is provided with a projecting portion 975 instead of the projecting portion 971 of the ninth embodiment. The material of the projecting portion 975 is, for example, metal such as Cu. The projecting portion 975 can be formed in a bump shape on the wiring 943 by electroplating, for example. The aspect ratio of the protrusion 975 can be 1 or more. The steps after the step a in the figure are the same as the steps shown in FIGS. 18 to 22 described above.

As described above, according to the first modification of the ninth embodiment described above, the aspect ratio of the protrusion 975 can be easily increased by forming the protrusion 975 in a bump shape on the wiring 943 . can be done.

In b in the figure, the substrate of the second modified example is provided with a protruding portion 976 instead of the protruding portion 971 of the ninth embodiment. The material of the projecting portion 976 is, for example, resin such as solder resist 950 . The protrusions 976 may be formed by router processing of the solder resist 950, laser processing, or patterning using photolithography. The pattern of the protrusions 976 may be determined based on the surface layer design of the solder resist 950 . The steps after the step a in the figure are the same as the steps shown in FIGS. 18 to 22 described above.

Thus, in the second modification of the ninth embodiment described above, the joint material 923 can be pressure-bonded to the protrusion 976 by using resin as the material of the protrusion 976 . Therefore, it is not necessary to melt the bonding material 923 in order to bond the bonding material 923 to the projecting portion 976, and the number of steps can be reduced.

Moreover, by using the solder resist 950 as the material of the protruding portion 976, the protruding portion 976, the recessed portion 972, and the air hole 973 can be simultaneously formed on the flat surface MP1 based on the surface layer design of the solder resist 950. An increase in the number of steps can be suppressed.

Also, by using resin as the material of the projecting portion 976, crimping can be used to bond the bonding material 923 and the projecting portion 976, and attachment and detachment of the bonding material 923 and the projecting portion 976 can be facilitated.

In c of the figure, the board of the third modified example is provided with a projecting portion 977 instead of the projecting portion 976 of the above-described second modified example. The material of the projecting portion 977 is, for example, resin such as solder resist 950 . The protrusions 977 may be formed by, for example, applying the solder resist 950 again on the protrusions 976 of the second modified example described above. The aspect ratio of the protrusion 977 can be 1 or more. The steps after the step a in the figure are the same as the steps shown in FIGS. 18 to 22 described above.

As described above, in the third modification of the ninth embodiment described above, by using resin as the material of the projecting portion 977, crimping can be used to bond the bonding material 923 and the projecting portion 977. Attachment and detachment between the bonding material 923 and the projecting portion 977 can be facilitated.

<10. Tenth Embodiment>
In the above-described ninth embodiment, a frame-shaped projecting portion 971 is formed on the substrate 901 to which the cover glass 903 can be attached and detached based on the phase transition of the bonding material 923 provided on the cover glass 903. An air hole 973 is provided in 971 . In the tenth embodiment, grooves are provided in the air holes so that the projections provided on the substrate are arranged in parallel.

FIG. 24 is a plan view showing a configuration example of a package member according to the tenth embodiment. In addition, a in the same figure shows the 1st example of 10th Embodiment, and b in the same figure shows the 2nd example of 10th Embodiment.

In FIG. 10a, the package 1000 has a projecting portion 1071, a recessed portion 1072, an air hole 1073, and a groove 1074 instead of the projecting portion 971, the recessed portion 972, and the air hole 973 of the package 900 of the ninth embodiment. Prepare. Other configurations of the package 1000 are the same as those of the package 900 of the ninth embodiment described above.

The substrate 1001 is provided with a projecting portion 1071 and a recessed portion 1072 . An air hole 1073 is provided in the projecting portion 1071 . A groove 1074 is provided in the air hole 1073 . The grooves 1074 separate the protrusions 1071 such that the protrusions 1071 are side by side. The groove 1074 can form an air passage between the cavity 963 and the outside when the inside of the cavity 963 is sealed with the cover glass. At this time, the groove 1074 can give the air hole 1073 a folded structure. Other configurations of the projecting portion 1071 and the recessed portion 1072 are the same as the configurations of the projecting portion 971 and the recessed portion 972 of the ninth embodiment described above.

Note that the groove 1074 can be formed as part of the air hole 1073 . The pattern of air holes 1073 and grooves 1074 may be determined based on the surface design of substrate 1001 .

As described above, in the first example of the tenth embodiment described above, by providing the groove 1074 in the air hole 1073 , it is possible to make it difficult for foreign matter such as dust to pass through the air hole 1073 . Therefore, even when the protrusion 1071 is provided with the air hole 1073, it is possible to prevent foreign matter from entering the cavity 963 sealed with the cover glass.

11B, the package 1100 has a protrusion 1171, a recess 1172, an air hole 1173, and a groove 1174 instead of the protrusion 971, recess 972, and air hole 973 of the package 900 of the ninth embodiment. Prepare. Other configurations of the package 1100 are the same as those of the package 900 of the ninth embodiment described above.

The substrate 1101 is provided with a projecting portion 1171 and a recessed portion 1172 . An air hole 1173 is provided in the projecting portion 1171 . A groove 1174 is provided in the air hole 1173 . The grooves 1174 separate the protrusions 1171 such that the protrusions 1171 are side by side. The groove 1174 can form an air passage between the cavity 963 and the outside when the inside of the cavity 963 is sealed with the cover glass. At this time, the groove 1174 can make the length of the air hole 1173 longer than the width of the protrusion 1171 . Other configurations of the projecting portion 1171 and the recessed portion 1172 are the same as the configurations of the projecting portion 971 and the recessed portion 972 of the ninth embodiment described above.

Note that the groove 1174 can be formed as part of the air hole 1173. The pattern of air holes 1173 and grooves 1174 may be determined based on the surface layer design of substrate 1101 .

Thus, in the second example of the tenth embodiment described above, by providing the groove 1174 in the air hole 1173, it is possible to make it difficult for foreign matter such as dust to pass through the air hole 1173. Therefore, even when the protrusion 1171 is provided with the air hole 1173, it is possible to prevent foreign matter from entering the cavity 963 sealed with the cover glass.

In the package 300 of the third embodiment described above, an example in which the cover glass 303 is combined with the frame member 302 is shown. may be combined with a frame member 302 in the form of At this time, the projecting portion 1071 or the projecting portion 1171 of the tenth embodiment may be provided on the frame member 302 instead of the projecting portion 312 of the third embodiment. In addition, the protrusion 1071 or the protrusion 1171 provided in place of the protrusion 312 of the frame member 302 of the above-described third embodiment is provided with an air hole and a groove for increasing the length of the air hole. good too.

In addition, the above-described embodiment shows an example for embodying the present technology, and the matters in the embodiment and the matters specifying the invention in the scope of claims have corresponding relationships. Similarly, the matters specifying the invention in the scope of claims and the matters in the embodiments of the present technology with the same names have corresponding relationships. However, the present technology is not limited to the embodiments, and can be embodied by various modifications to the embodiments without departing from the scope of the present technology. Also, the effects described herein are merely examples and are not limiting, and other effects may also occur.

Note that the present technology can also have the following configuration.
(1) a frame member having a frame-shaped flat surface;
a protrusion located on the flat surface and protruding from the flat surface;
and a recess provided in the flat surface adjacent to the protrusion.
(2) The package member according to (1), wherein the concave portion is provided on the flat surface so as to surround the projecting portion.
(3) The package member according to (1) or (2), wherein the projecting portion has a region whose horizontal spread increases toward the distal end.
(4) The package member according to any one of (1) to (3), further comprising a cover provided with a recess into which the protrusion can be inserted while in contact with the flat surface.
(5) The package member according to (4), wherein the cover is a cover glass.
(6) further comprising a bonding material positioned in the recess when the cover is removed from the frame member and having a melting point of 50° C. or higher;
According to any one of the above (1) to (5), when the cover is attached to the frame member, the bonding material is filled in the recess with the protrusion inserted into the recess. packaging material.
(7) The package member according to (6), wherein the bonding material is a low melting point solder or a low melting point alloy.
(8) The package member according to (4), wherein the recess has a region whose horizontal extent changes toward the bottom.
(9) a substrate on which the frame member is mounted;
The package member according to any one of (1) to (8), further comprising a semiconductor chip mounted on the substrate while being surrounded by the frame member, and having a solid-state imaging device formed thereon.
(10) further comprising a housing for supporting the lens,
The package member according to any one of (1) to (9), wherein the housing is installed on the frame member.
(11) the projecting portion is formed in a frame shape on the flat surface;
The package member according to any one of (1) to (10), further comprising an air hole formed across the frame-like protrusion.
(12) The package member according to (11), wherein the air hole includes grooves separating the protrusions so that the protrusions are aligned.
(13) The package member according to any one of (1) to (12), wherein the material of the projecting portion is metal or resin.
(14) The package member according to any one of (1) to (13), wherein the aspect ratio when the material of the protrusion is metal is 1 or more.
(15) A substrate provided with a frame-shaped first flat surface around a semiconductor chip mounting area;
a protrusion located on the first flat surface and protruding from the first flat surface;
a recess provided adjacent to the protrusion.
(16) The package member according to (15), wherein the concave portion is provided on the first flat surface so as to surround the projecting portion.
(17) further comprising a resin layer positioned around the protrusion on the first flat surface;
The package member according to (15), wherein the concave portion is provided in the resin layer so as to surround the projecting portion.
(18) The package member according to any one of (15) to (17), wherein the projecting portion has a region whose horizontal spread increases toward the distal end.
(19) A second flat surface facing the first flat surface of the substrate is provided in a frame shape, and the protrusion can be inserted in a state in which the second flat surface is in contact with the first flat surface. a frame member provided with a depression in the second flat surface;
The package member according to any one of (15) to (18), further comprising the semiconductor chip and a cover bonded to the frame member with a space therebetween.
(20) The package member according to (19), wherein the cover is a cover glass.
(21) further comprising a bonding material positioned in the recess when the frame member is detached from the substrate and having a melting point of 50° C. or higher;
According to any one of (15) to (20) above, when the frame member is attached to the substrate, the bonding material fills the recess with the protrusion inserted into the recess. packaging material.
(22) The package member according to (21), wherein the bonding material is a low melting point solder or a low melting point alloy.
(23) The package member according to (19), wherein the depression has a region whose horizontal extent changes toward the bottom.
(24) The package member according to any one of (15) to (23), wherein a solid-state imaging device is formed on the semiconductor chip.
(25) The package member according to any one of (15) to (24), wherein the substrate includes a cavity in which a mounting area for the semiconductor chip is provided.
(26) The projecting portion is formed in a frame shape,
The package member according to any one of (15) to (25), further comprising an air hole formed across the frame-like protrusion.
(27) The package member according to (26), wherein the air hole includes grooves separating the protrusions so that the protrusions are aligned.
(28) The package member according to any one of (15) to (27), wherein the material of the projecting portion is metal or resin.
(29) The package member according to any one of (15) to (28), wherein when the material of the protrusion is metal, the aspect ratio is 1 or more.
(30) mounting the chip on a package member having a protrusion projecting from a flat surface around a mounting area of the chip and a recess adjacent to the protrusion;
a step of bonding a bonding material, which is provided on the cover so as to face the protrusion and is capable of phase transition from a solid phase to a liquid phase, to the protrusion;
mounting the package member to which the cover is attached on a motherboard;
a step of melting the bonding material based on reflow of the package member mounted on the motherboard, dropping the bonding material into the recess, and solidifying the bonding material in the recess;
and removing the cover from the package member.
(31) The package member is
a substrate on which the chip is mounted;
The method of manufacturing a package according to (30), further comprising a frame member positioned on the substrate so as to surround the chip and provided with the protrusion and the recess.
(32) The package member is
The method of manufacturing a package according to (30) above, comprising a substrate provided with a cavity in which the chip is mounted, a resin layer positioned on the flat surface, the protrusion, and a recess formed in the resin layer. .
(33) The method of manufacturing a package according to (32), wherein the recess is formed by routing the resin layer.
(34) The method of manufacturing a package according to (32), wherein the recess is formed by patterning the resin layer.
(35) The method of manufacturing a package according to (32), wherein the projecting portion is formed by plating.
(36) The method of manufacturing a package according to (32), wherein an air hole is formed at a position crossing the projection based on patterning during formation of the projection.
(37) The method of manufacturing a package according to (36), wherein grooves are formed in the air holes for separating the protrusions so that the protrusions are arranged side by side, based on patterning during formation of the protrusions.

Reference Signs List

100, 200, 300, 700, 800, 900, 1000, 1100 package 101 substrate 102 frame member 103 cover glass 104 bonding material 111 land electrode 112

protrusion

113, 122 recess 105 semiconductor chip 115 color filter 125 on-chip lens 135 bonding wire

Claims

a frame member having a frame-shaped flat surface;
a protrusion located on the flat surface and protruding from the flat surface;
and a recess provided in the flat surface adjacent to the protrusion.
2. The package member according to claim 1, wherein the recess is provided on the flat surface so as to surround the protrusion.
2. A package member according to claim 1, wherein said projection comprises a region whose horizontal extent changes to increase in the distal direction.
The package member according to claim 1, further comprising a cover provided with a recess into which the protrusion can be inserted while in contact with the flat surface.
5. The package member according to claim 4, wherein the cover is a cover glass.
a bonding material positioned in the recess when the cover is removed from the frame member and having a melting point of 50° C. or higher;
5. The package member according to claim 4, wherein when the cover is attached to the frame member, the bonding material is filled into the recess while the protrusion is inserted into the recess.
7. The package member according to claim 6, wherein said bonding material is low melting point solder or low melting point alloy.
5. A package member according to claim 4, wherein said recess comprises a region of varying horizontal extent that increases toward the bottom.
a substrate on which the frame member is mounted;
2. The package member according to claim 1, further comprising a semiconductor chip mounted on said substrate while being surrounded by said frame member, and having a solid-state imaging device formed thereon.
further comprising a housing that supports the lens,
2. The packaging member of claim 1, wherein said housing is mounted on said frame member.
The projecting portion is formed in a frame shape on the flat surface,
2. The package member according to claim 1, further comprising an air hole formed across the frame-like protrusion.
2. The package member of claim 1, wherein said air holes comprise grooves separating said protrusions such that said protrusions are aligned.
2. The package member according to claim 1, wherein the material of said projecting portion is metal or resin.
2. The package member according to claim 1, wherein the aspect ratio of the protrusion is 1 or more when the material of the protrusion is metal.
a substrate provided with a frame-shaped first flat surface around a semiconductor chip mounting area;
a protrusion located on the first flat surface and protruding from the first flat surface;
a recess provided adjacent to the protrusion.
16. The package member according to claim 15, wherein the recess is provided on the first flat surface so as to surround the protrusion.
further comprising a resin layer positioned around the protrusion on the first flat surface;
16. The package member according to claim 15, wherein the recess is provided in the resin layer so as to surround the protrusion.
16. The package member according to claim 15, wherein the projecting portion has a region whose horizontal extent changes so as to increase toward the distal end.
A second flat surface facing the first flat surface of the substrate is provided in the shape of a frame, and a recess is formed into which the protrusion can be inserted while the second flat surface is in contact with the first flat surface. a frame member provided on the second flat surface;
16. The package member of claim 15, further comprising a cover bonded to said frame member and spaced apart from said semiconductor chip.
The package member according to claim 19, wherein the cover is cover glass.
a bonding material positioned in the recess when the frame member is detached from the substrate and having a melting point of 50° C. or higher;
20. The package member according to claim 19, wherein when the frame member is attached to the substrate, the bonding material is filled into the recess while the protrusion is inserted into the recess.
22. The package member according to claim 21, wherein said bonding material is low melting point solder or low melting point alloy.
20. The packaging member of claim 19, wherein the recess comprises a region of varying horizontal extent that increases toward the bottom.
16. The package member according to claim 15, wherein the semiconductor chip is formed with a solid-state imaging device.
16. The package member according to claim 15, wherein said substrate has a cavity in which a mounting area for said semiconductor chip is provided.
the projecting portion is formed in a frame shape,
16. The package member according to claim 15, further comprising an air hole formed across the frame-like protrusion.
27. The packaging member of claim 26, wherein said air holes comprise grooves separating said protrusions such that said protrusions are juxtaposed.
16. The package member according to claim 15, wherein the material of said projecting portion is metal or resin.
16. The package member according to claim 15, wherein the aspect ratio is 1 or more when the material of the protrusion is metal.
a step of mounting the chip on a package member having a protrusion projecting from a flat surface around a mounting area of the chip and a recess adjacent to the protrusion;
a step of bonding a bonding material, which is provided on the cover so as to face the protrusion and is capable of phase transition from a solid phase to a liquid phase, to the protrusion;
mounting the package member to which the cover is attached on a motherboard;
a step of melting the bonding material based on reflow of the package member mounted on the motherboard, dropping the bonding material into the recess, and solidifying the bonding material in the recess;
and removing the cover from the package member.
The package member is
a substrate on which the chip is mounted;
31. The method of manufacturing a package according to claim 30, further comprising a frame member positioned on the substrate so as to surround the chip and provided with the protrusion and the recess.
The package member is
31. The method of manufacturing a package according to claim 30, further comprising a substrate provided with a cavity in which said chip is mounted, a resin layer located on said flat surface, said projecting portion, and a recess formed in said resin layer.
33. The method of manufacturing a package according to claim 32, wherein the recess is formed based on router processing of the resin layer.
33. The method of manufacturing a package according to claim 32, wherein the recess is formed based on patterning of the resin layer.
33. The method of manufacturing a package according to claim 32, wherein the protrusion is formed by plating.
33. The method of manufacturing a package according to claim 32, wherein an air hole is formed at a position crossing the protrusion based on patterning during formation of the protrusion.
37. The method of manufacturing a package according to claim 36, wherein grooves are formed in said air holes for separating said projections so that said projections are arranged side by side based on patterning during formation of said projections.