IN2015DN00551A - - Google Patents

Info

Publication number
IN2015DN00551A
IN2015DN00551A IN551DEN2015A IN2015DN00551A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A IN 551DEN2015 A IN551DEN2015 A IN 551DEN2015A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A
Authority
IN
India
Prior art keywords
insulating layer
elasticity modulus
layer
sandwiched
substrate
Prior art date
Application number
Inventor
Ryoichi Suganuma
Hirofumi Arima
Satoru Suzuki
Takuya Sato
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of IN2015DN00551A publication Critical patent/IN2015DN00551A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Abstract

This substrate is equipped with: a first insulating layer; a second insulating layer that has an elasticity modulus different from the elasticity modulus of the first insulating layer; and a core layer that is sandwiched between the first insulating layer and the second insulating layer and has a higher rigidity than the first insulating layer and the second insulating layer.
IN551DEN2015 2012-06-22 2013-03-13 IN2015DN00551A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012141508 2012-06-22
JP2012177980 2012-08-10
JP2012179095 2012-08-10
PCT/JP2013/001678 WO2013190748A1 (en) 2012-06-22 2013-03-13 Substrate, imaging unit, and imaging device

Publications (1)

Publication Number Publication Date
IN2015DN00551A true IN2015DN00551A (en) 2015-06-26

Family

ID=49768363

Family Applications (1)

Application Number Title Priority Date Filing Date
IN551DEN2015 IN2015DN00551A (en) 2012-06-22 2013-03-13

Country Status (6)

Country Link
US (3) US9743510B2 (en)
EP (2) EP2866535B1 (en)
JP (3) JPWO2013190748A1 (en)
CN (2) CN109616485A (en)
IN (1) IN2015DN00551A (en)
WO (1) WO2013190748A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013190748A1 (en) * 2012-06-22 2016-02-08 株式会社ニコン Substrate, imaging unit, and imaging apparatus
KR101816967B1 (en) * 2013-09-30 2018-01-09 주식회사 엘지화학 Substrate for organic electronic device and manufacturing method thereof
JP6357784B2 (en) * 2014-02-03 2018-07-18 株式会社ニコン Imaging unit and imaging apparatus
JP6363712B2 (en) * 2014-07-18 2018-07-25 株式会社Ｆｕｊｉ Imaging device
US10580811B2 (en) * 2015-11-24 2020-03-03 Sony Corporation Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus
WO2017111125A1 (en) * 2015-12-25 2017-06-29 太陽誘電株式会社 Printed wiring board and camera module
JP6972523B2 (en) * 2016-09-13 2021-11-24 セイコーエプソン株式会社 Electronics
US10133158B2 (en) * 2016-10-17 2018-11-20 Panasonic Intellectual Property Management Co., Ltd. Imaging device
JP7383866B2 (en) * 2017-01-09 2023-11-21 サムソン エレクトロ－メカニックス カンパニーリミテッド． printed circuit board
JP2018120968A (en) * 2017-01-25 2018-08-02 太陽誘電株式会社 Printed wiring board, module using printed wiring board and camera module using printed wiring board
US10580725B2 (en) * 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP6783724B2 (en) * 2017-08-22 2020-11-11 太陽誘電株式会社 Circuit board
US10602608B2 (en) 2017-08-22 2020-03-24 Taiyo Yuden Co., Ltd. Circuit board
JP6745770B2 (en) * 2017-08-22 2020-08-26 太陽誘電株式会社 Circuit board
JP2019076358A (en) * 2017-10-24 2019-05-23 オリンパス株式会社 Image pickup module, endoscope, and method of manufacturing image pickup module
DE102018109920A1 (en) * 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling of power electronic circuits
TW202015208A (en) * 2018-10-09 2020-04-16 南茂科技股份有限公司 Substrate structure and semiconductor package
JP2020064998A (en) * 2018-10-18 2020-04-23 キヤノン株式会社 Mounting substrate and method of manufacturing the same
CN113169196B (en) * 2018-11-20 2024-01-19 Lg伊诺特有限公司 Substrate for image sensor
DE112020003363T5 (en) * 2019-07-12 2022-03-24 Sony Semiconductor Solutions Corporation WIRING MODULE AND IMAGE DEVICE
CN114450795A (en) 2019-09-30 2022-05-06 株式会社尼康 Imaging element and imaging device
JP7262626B2 (en) * 2020-01-22 2023-04-21 日立Astemo株式会社 Imaging device
US20230144963A1 (en) * 2021-11-05 2023-05-11 Omnivision Technologies, Inc. Stacked image sensor

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473695A (en) * 1987-09-14 1989-03-17 Mitsubishi Plastics Ind Substrate for printed-circuit board
JP2875076B2 (en) * 1990-11-29 1999-03-24 三井化学株式会社 Flexible wiring board
JPH07307572A (en) * 1994-05-13 1995-11-21 Cmk Corp Flexible printed wiring board and rigid flex printed wiring board
JP3817453B2 (en) * 2001-09-25 2006-09-06 新光電気工業株式会社 Semiconductor device
JP2003110892A (en) * 2001-09-26 2003-04-11 Sanyo Electric Co Ltd Camera module
JP4387076B2 (en) * 2001-10-18 2009-12-16 株式会社ルネサステクノロジ Semiconductor device
JP2003234926A (en) * 2002-02-08 2003-08-22 Seiko Precision Inc Solid-state image pickup device
JP2004356569A (en) 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd Package for semiconductor device
JP2005203420A (en) * 2004-01-13 2005-07-28 Murata Mach Ltd Electronic circuit board
TWI296154B (en) * 2004-01-27 2008-04-21 Casio Computer Co Ltd Optical sensor module
JP4089629B2 (en) * 2004-01-27 2008-05-28 カシオ計算機株式会社 Optical sensor module
JP2005284147A (en) * 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd Imaging apparatus
CN100531528C (en) * 2004-05-27 2009-08-19 揖斐电株式会社 Multilayer printed wiring board
JP2007028430A (en) * 2005-07-20 2007-02-01 Kyocera Corp Camera module
WO2007013234A1 (en) * 2005-07-28 2007-02-01 Nec Corporation Insulating material, wiring board and semiconductor device
JP2007150101A (en) * 2005-11-29 2007-06-14 Sony Corp Module board and imaging device
CN101321813B (en) * 2005-12-01 2012-07-04 住友电木株式会社 Prepreg, process for producing prepreg, substrate, and semiconductor device
WO2007063960A1 (en) * 2005-12-01 2007-06-07 Sumitomo Bakelite Company Limited Prepreg, process for producing prepreg, substrate, and semiconductor device
JP4983190B2 (en) * 2006-10-02 2012-07-25 住友ベークライト株式会社 Prepreg, circuit board and semiconductor device
US8377543B2 (en) * 2006-11-10 2013-02-19 Nec Corporation Multilayer-wired substrate
CN101803482A (en) * 2007-07-13 2010-08-11 揖斐电株式会社 Wiring board and manufacturing method thereof
US8283570B2 (en) * 2007-12-26 2012-10-09 Panasonic Corporation Semiconductor assembly and multilayer wiring board
CN101983425B (en) * 2008-03-31 2012-11-21 住友电木株式会社 Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board
JP5397037B2 (en) 2009-06-25 2014-01-22 株式会社ニコン Solid-state imaging device
JP2011059272A (en) 2009-09-08 2011-03-24 Canon Inc Imaging apparatus
CN102550138B (en) * 2009-09-28 2015-07-22 京瓷株式会社 Structure and process for producing same
JP2011228676A (en) * 2010-03-29 2011-11-10 Kyocera Corp Wiring board and mounting structure of the same
JP5582904B2 (en) 2010-07-22 2014-09-03 矢崎総業株式会社 Metal core substrate and manufacturing method thereof
WO2012014875A1 (en) * 2010-07-30 2012-02-02 京セラ株式会社 Insulating sheet, process for producing same, and process for producing structure using the insulating sheet
JPWO2013190748A1 (en) * 2012-06-22 2016-02-08 株式会社ニコン Substrate, imaging unit, and imaging apparatus
CN105191514B (en) * 2013-03-27 2018-01-23 京瓷株式会社 Circuit board and the assembling structure using the circuit board

Also Published As

Publication number Publication date
CN104584701B (en) 2018-11-13
EP3592121A1 (en) 2020-01-08
JP6344516B2 (en) 2018-06-20
US20170374735A1 (en) 2017-12-28
CN104584701A (en) 2015-04-29
JP6711370B2 (en) 2020-06-17
WO2013190748A1 (en) 2013-12-27
JP2018029180A (en) 2018-02-22
EP2866535B1 (en) 2019-09-04
EP2866535A4 (en) 2016-03-16
US9743510B2 (en) 2017-08-22
EP3592121B1 (en) 2021-02-17
EP2866535A1 (en) 2015-04-29
US11343907B2 (en) 2022-05-24
US10412824B2 (en) 2019-09-10
US20190350076A1 (en) 2019-11-14
JP2018166207A (en) 2018-10-25
US20150181698A1 (en) 2015-06-25
CN109616485A (en) 2019-04-12
JPWO2013190748A1 (en) 2016-02-08

Similar Documents

Publication Publication Date Title
IN2015DN00551A (en)
GB2497451A (en) Gate insulator layer for electronic devices
EP2992562A4 (en) Stress relieving semiconductor layer
SG195105A1 (en) Absorbent core for disposable absorbent articles
UY4151Q (en) VINCHA WITH HEADPHONES
EP3058586A4 (en) Integrated circuit package substrate
MX2013000283A (en) Component with multiple layers.
HK1189427A1 (en) Semiconductor devices with back surface isolation
EP3070745A4 (en) Display substrate and manufacturing method therefor, and flexible display device
PL2802029T3 (en) Cathode including insulating layer on cathode tab and secondary battery including cathode
IN2015DN03050A (en)
WO2014195482A3 (en) Organic electronic device
EP2901486A4 (en) Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates
BR112013026310A2 (en) electrical transmission cables with composite cores
EP2660868A4 (en) Laminate structure including oxide semiconductor thin film layer, and thin film transistor
IN2014CN03520A (en)
WO2012138903A3 (en) Dual active layers for semiconductor devices and methods of manufacturing the same
EP3041043A4 (en) Assembly and power-module substrate
MY163250A (en) MAGNETIC STACK INCLUDING MgO-Ti(ON) INTERLAYER
EP3032576A4 (en) Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device
FR2958441B1 (en) PSEUDO-INVERTER CIRCUIT ON SEOI
EP2676300A4 (en) Methods of forming semiconductor films including i2-ii-iv-vi4 and i2-(ii,iv)-iv-vi4 semiconductor films and electronic devices including the semiconductor films
EP3041045A4 (en) Assembly and power-module substrate
IN2014DN09305A (en)
EP2784808B8 (en) Electrical component resin, semiconductor device, and substrate