JP2007028430A - Camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module which can cut off electromagnetic radiation noise and can be downsized. <P>SOLUTION: A camera module 1 is provided with: a lens group 2; an imaging element 4 on which light from the lens group 2 forms an image; a main substrate 5 whereon the imaging element 4 is provided; a non-conductive exterior case 6 covering the circuit board 5; and a shield plate 25 which is buried in the exterior case 6 for shielding the main substrate 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a camera module.

In a camera that forms an image from an optical lens on an image sensor such as a CCD, a shield case that shields a substrate on which the image sensor is provided is provided in order to block electromagnetic radiation noise (eg, Patent Document 1). FIG. 7 is a cross-sectional view of a conventional camera module 601. In the camera module 601, a shield case 603 that shields the image sensor 602 is provided inside the resinous exterior case 604. Also known is a camera module that blocks noise by forming an outer case from metal.
JP 2003-46875 A

  When the exterior case is made of metal or when the shield case is placed inside the resinous exterior case, the shield case and the electronic parts that are not coated with a non-conductive material must be in contact and electrically connected In order to prevent this, it is necessary to secure a clearance between the electronic component and the shield case. In particular, a camera module that is susceptible to vibration and thermal deformation, such as a camera module for a vehicle, needs to have a large clearance. For this reason, it is difficult to reduce the size of a camera module having a shield case, in particular, a camera module used under vibration or the like by reducing the clearance between the outer case and the electronic component.

  An object of the present invention is to provide a camera module that can block electromagnetic radiation noise and can be miniaturized.

  A camera module according to a first aspect of the present invention includes an optical lens, an image sensor on which light from the optical lens forms an image, a circuit board on which the image sensor is provided, and a nonconductive material that houses the circuit board. An exterior case, and a shield body embedded in the exterior case and shielding the circuit board.

  Preferably, the shield body has a protrusion that protrudes from the outer case to the inside of the case, and the protrusion holds the circuit board and is electrically connected to the ground of the circuit board. Yes.

  Preferably, the exterior case includes a side surface that surrounds the outer periphery of the circuit board, and the protruding portion protrudes from the side surface in a direction perpendicular to the optical axis of the optical lens, and the optical axis of the circuit board. It is fixed with respect to the plane orthogonal to

  Preferably, the exterior case includes a front surface portion that covers the optical lens side of the circuit board, and the protruding portion protrudes from the front surface portion in a direction parallel to the optical axis of the optical lens, It is fixed with respect to the outer periphery.

  Preferably, the exterior case further includes a lens holding portion that contacts the lens and holds the lens, and the front surface portion and the lens holding portion are integrally formed.

  Preferably, there is a gap between the outer periphery of the circuit board and the inner side surface of the exterior case.

  A camera module according to a second aspect of the present invention covers an optical lens, an image sensor on which light from the optical lens forms an image, a circuit board on which the image sensor is provided, and the optical lens side of the circuit board. A non-conductive front side case member, a front side shield body that is embedded in the front side case member and shields the circuit board, and is disposed on the opposite side of the circuit board from the optical lens; And a rear shield body for shielding.

  Preferably, the circuit board further includes a non-conductive back side case member that covers the side opposite to the optical lens, and the back side shield body is embedded in the back side case member.

  Preferably, the front shield body is provided with a protrusion that protrudes from the front case member to the inside of the case, holds the circuit board, and is electrically connected to the ground of the circuit board. The back shield body is provided with a spring portion that is electrically connected to the protruding portion and biases the protruding portion.

  According to the camera module of the present invention, electromagnetic radiation noise can be blocked and downsizing can be achieved.

First Embodiment FIG. 1 is a sectional view showing a camera module 1 according to a first embodiment of the present invention. The camera module 1 is configured as an in-vehicle camera for imaging a white line on a road or a blind spot of a vehicle, for example, and an ECU (Engine Control Unit) (not shown) that controls driving of the automobile The operation is controlled by. The electric signal output from the camera module 1 is converted into an image signal by the ECU and displayed on a display (not shown), for example.

  The camera module 1 includes a lens group 2, a lens barrel 3 that holds the lens group 2, an imaging element 4 on which light from the lens group 2 forms an image, a main substrate 5 that holds the imaging element 4, a lens mirror An outer case 6 that holds the cylinder 3 and the main board 5 is provided.

  The lens group 2 includes, for example, a first lens 7, a second lens 8, and a third lens 9 that are arranged in a stacked manner from the subject side (upper side in the drawing). Each of the lenses 7 to 9 is made of, for example, glass or plastic.

  The lens barrel 3 includes an insertion portion 3 a that is inserted into the opening 6 a of the outer case 6 and a flange portion 3 b that extends from the insertion portion 3 a to the outer peripheral side on the subject side of the outer case 6. A screw (not shown) is cut on the outer peripheral side of the insertion portion 3a, and a groove (not shown) into which the screw of the insertion portion 3a is screwed is formed in the opening 6a. Therefore, the lens barrel 3 can be advanced and retracted in the direction of the optical axis LL by rotating the insertion portion 3a as a male screw with respect to the opening 6a as a female screw.

  The first lens 7 is in contact with the subject side surface of the collar 3 b and is restrained from the subject side by the retainer 11. The retainer 11 is fixed to the side surface of the lens barrel 3 with, for example, an adhesive or solder. The second lens 8 and the third lens 9 are press-fitted into the opening 3c of the lens barrel 3 (insertion portion 3a), and are fixed by, for example, an adhesive or solder. The second lens 8 and the third lens 9 are in contact with a positioning portion (not shown) protruding from the wall surface of the opening 3c, for example, and the positions in the optical axis direction are fixed. Note that a mask or a diaphragm may be provided at an appropriate position of the lens group 2, or the outer periphery of the first lens 7 may be fixed by the lens barrel 3 like the second lens 8 or the like.

  The image sensor 4 is configured by, for example, a CCD or a CMOS. The image sensor 4 is housed in the sub-board 13. The sub-board 13 is made of, for example, a ceramic wiring board whose main component is alumina, and houses the imaging element 4 in a cavity (not shown) formed on the subject side. The cavity is sealed with a glass lid 14. A plurality of terminals 13 a extend from the sub-board 13 and are fixed to the main board 5 with solder or the like. The image pickup device 4 and the main board 5 are electrically connected by the terminal 13a, and the sub board 13 is supported by the main board 5.

  The main substrate 5 is configured by, for example, a printed wiring board formed by impregnating a glass cloth with an epoxy resin or adding a glass filler to the epoxy resin. In addition, it is preferable that the addition amount of a glass cloth or a glass filler is set so that the thermal expansion coefficient of the sub board | substrate 13 and the thermal expansion coefficient of the main board | substrate 5 may become equivalent. On the surface of the main substrate 5 opposite to the image sensor 4, an IC 16 that processes an electrical signal from the image sensor 4, a connector 17 that connects a cable 18 that connects the main substrate 5 and an ECU (not shown), and the like. Is provided.

  The exterior case 6 includes a front case member 21 disposed on the subject side and a rear case member 22 disposed on the rear side thereof, and is accommodated by the front case member 21 and the rear case member 22. The image sensor 4 and the main board 5 are accommodated in the space. The front side case member 21 and the back side case member 22 are made of a non-conductive resin such as polycarbonate (PC) or polyphthalamide (PPA), for example, to reduce the weight.

  The front side case member 21 includes a front surface portion 21 a that covers the subject side of the image sensor 4 and the main substrate 5, and a side surface portion 21 b that is continuous with the front surface portion 21 a and surrounds the outer periphery of the image sensor 4 and the main substrate 5. . The front surface portion 21a has a plane parallel to the main substrate 5 and an inclined surface inclined to the plane and extending to the side surface portion 21b. The front surface portion 21a is generally formed in a cone shape, and has a lens mirror at the center side. The above-described opening 6a into which the cylinder 3 is inserted is provided.

  The front side case member 21 has a shield plate 25 embedded therein for shielding the image pickup device 4, the main substrate 5, and the like. In other words, the outer surface and the inner surface of the shield plate 25 are covered with a non-conductive material. The shield plate 25 is made of a conductive material such as metal. The metal is, for example, aluminum or copper. The shield plate 25 is embedded over the front surface portion 21a and the side surface portion 21b of the front surface side case member 21, and the overall shape is substantially similar to the front surface side case member 21, and has a front surface portion 25a and a side surface portion 25b. ing.

  The shield plate 25 is formed to bend toward the inner side of the exterior case 6 at the end of the side surface portion 25b on the back side (the lower side in the drawing) and protrude from the front case member 21a, and has a protruding portion 25c. ing. The protruding portion 25 c protrudes in a direction perpendicular to the optical axis, and holds the main substrate 5 in contact with the back surface of the main substrate 5. The main substrate 5 and the protruding portion 25 c are fixed to each other through the solder 50. The main substrate 5 is fixed so that the side surface of the main substrate 5 does not contact the inner surface of the front case member 21.

  The back side case member 22 includes a side surface portion 22 a that is continuous with the side surface portion 21 b of the front surface side case member 21, and a back surface portion 22 b that covers the back side of the main substrate 5 (the side opposite to the lens group 2). The side surface portion 21b of the front side case member 21 and the side surface portion 22a of the back side case member 22 are fixed to each other by, for example, an adhesive or solder. An opening for inserting the cable 18 is opened in the back surface portion 22b.

  A shield case 26 for shielding the main substrate 5 and the like is provided on the case inner side of the back side case member 22. As with the shield plate 25, the shield case 26 is formed of a conductive material such as metal. The shield case 26 is formed in a shape that fits inside the back side case member 22, and includes a side surface portion 26a and a back surface portion 26b. An opening for inserting the cable 18 is opened in the back surface portion 26b.

  An end portion 26c of the side surface portion 26a on the front case member 21 side (upper side in the drawing) is formed in an arc shape that curves inward and has the front case member 21 side convex. The end portion 26c is in contact with and electrically connected to the back side case member 22 side (the lower side in the drawing) of the protruding portion 25c of the shield plate 25. Further, the end portion 26c is elastically deformed toward the rear case member 22 side by a reaction force from the protruding portion 25c. In other words, the end portion 26c functions as a leaf spring that biases the protruding portion 25c toward the front case member 21 side.

  The shield case 26 may be fixed to the back side case member 22 by a fixing means such as an adhesive or a screw, or is fitted and inserted into the back side case member 22 and the protruding portion 25c. It may just be suppressed by. However, from the viewpoint of suppressing vibration of the shield case 26, it is preferable to fix the shield case 26 to the back side case member 22 by a fixing means.

  The cable 18 includes, for example, a plurality of cables 27 extending from the connector 17 in the exterior case 6 and a cable 29 connected to the plurality of cables 27 via the connector 28 and extending from the exterior case 6. The back side case member 22 is fixed by being fixed to the opening of the portion 22b with an adhesive or the like.

  FIG. 2 is a schematic view showing an attachment structure between the front case member 21 and the main board 5, and is a perspective view seen from the back side of the camera module 1 (downward in FIG. 1). A plurality of protruding portions 25c are provided. For example, the front case member 21 is formed in a rectangular cross section, and the protrusions 25c are arranged on three sides of four sides of the rectangle, and a total of three are provided. The shape of the protruding portion 25c viewed in the optical axis direction may be set as appropriate, but is rectangular, for example.

  On the back side of the main substrate 5 (the front side in FIG. 2), a plurality of fixing portions 5a fixed to the protruding portions 25c are provided corresponding to the plurality of protruding portions 25c. For example, a terminal (not shown) connected to the ground layer of the main board 5 is provided in the fixing portion 5a. Accordingly, the substrate 5 is held by the protruding portion 25c, whereby the ground layer of the main substrate 5 and the shield plate 25 are electrically connected.

  A method for manufacturing the camera module 1 will be described.

  The front side case member 21 in which the shield plate 25 is embedded is formed, for example, by placing the shield plate 25 in a cavity for injection molding and pouring the raw material of the front side case member 21.

  The lens barrel 3 to which the lens group 2 is attached is screwed to the front case member 21. Next, the fixing portion 5a of the main substrate 5 to which the image pickup device 4 and the sub substrate 13 are attached is brought into contact with the protruding portion 25c.

  In this state, the cable 18 is connected to an inspection device (not shown), and an image captured by the image sensor 4 is referred to and evaluated by the inspection device. For example, it is evaluated whether or not the camera module 1 is focused on a test subject that is separated from the lens group 2 by a predetermined distance. The image captured by the image sensor 4 may be displayed on a monitor, and the image quality may be evaluated by the operator visually recognizing the image.

  Based on the evaluation of the image quality, the lens barrel 3 is rotated with respect to the front case member 21 to determine the positions of the lens group 2 and the main board 5 in the optical axis direction, and the main board 5 is projected. The position of the main board 5 is determined by parallel movement or rotational movement in a plane orthogonal to the optical axis while being in contact with the portion 25c.

  When the positioning is completed, the main substrate 5 is attached to the front side cover member 21 by irradiating the protruding portion 25c with laser light or infrared spot light and welding the solder 50 previously formed on the fixing portion 5a. Fix it. If the biasing force of the end portion 26c of the shield case 26 is relatively large and the distance between the main substrate 5 and the lens group 2 may change due to the biasing force, after the rear case member 22 is attached, The position of the lens barrel 3 may be adjusted while evaluating the image quality again.

  Thereafter, the back side case member 22 in which the shield case 26 is housed is positioned with respect to the front side case member 21 and fixed by, for example, an adhesive.

  In the above-described method for manufacturing a camera module, some or all of the processes may be automated, or all processes may be performed manually by an operator.

  According to the above embodiment, since the shield plate 25 is embedded in the front side case member 21, there is no possibility that the electronic components on the main board 5 are brought into contact with the shield plate 25. Therefore, the main board 5 can be disposed close to the inner side surface of the front case member 21 to reduce the size.

  Since the main board 5 is fixed to the protrusion 25c, the impact on the front case member 21 is relaxed by the elasticity of the protrusion 25c and transmitted to the main board 5. Therefore, as shown in FIG. 7, the electronic components such as the image pickup device 4 provided on the main substrate 5 and the main substrate 5 as compared with the case where the main substrate 5 is screwed to the resin portion or the like of the front case member 21. The damage of the is suppressed. Furthermore, since the projecting portion 25c serves as both a holding member that holds the main substrate 5 and a connection member that connects the shield plate 25 to the ground layer of the main substrate 5, the camera module 1 can be reduced in size.

  Since a gap is provided between the side surface of the main substrate 5 and the inner surface of the front case member 21, the main substrate 5 is deformed when the projecting portion 25 c is deformed in order to reduce the impact transmitted to the main substrate 5. Is less likely to come into contact with the front case member 21.

  The protrusion 25c has a surface substantially orthogonal to the optical axis, and the main substrate 5 is moved in a direction orthogonal to the optical axis while the main substrate 5 is in contact with the surface to position the main substrate 5. Can be assembled easily.

  Since the back case member 22 is also provided with a shield case 26 and shields not only the front side of the main board 5 but also the back side, noise is more reliably blocked.

  Since the end portion 26c of the shield case 26 biases the protruding portion 25c, the elastic coefficient of the protruding portion 25c apparently increases. Therefore, for example, it becomes easy to obtain the strength necessary for holding the main board 5.

Second Embodiment FIG. 3 is a sectional view showing a camera module 101 according to a second embodiment. In addition, about the structure similar to the camera module 1 of 1st Embodiment, the code | symbol similar to 1st Embodiment is attached | subjected.

  In the camera module 101, a shield plate 126 provided on the back side (the lower side in the drawing) of the main substrate 5 is embedded in the back case member 122. The schematic shapes of the back side case member 122 and the shield plate 126 are the same as those of the back side case member 22 and the shield case 26 of the first embodiment, and are formed in a box shape as a whole.

  An end 126c of the shield plate 126 on the front case member 21 side is curved inward of the case and protrudes from the inner surface of the rear case member 122. The end portion 126c is in contact with and electrically connected to the protruding portion 25c of the shield plate 25 embedded in the front case member 21, similarly to the protruding portion 26c of the first embodiment. 25c is urged to the front side.

  The back side case member 122 in which the shield plate 126 is embedded may be formed by pouring a resin or the like into the cavity with the shield plate 126 disposed in the cavity, as with the front side case member 21. Good. Other steps of the manufacturing method are the same as those in the first embodiment.

  According to the camera module 101 of the second embodiment described above, the same effects as those of the first embodiment can be obtained. Furthermore, since the shield plate 126 is embedded in the non-conductive back side case member 122, the back side of the main board 5 is also brought close to the shield plate 126 without contacting the components etc. with the shield plate 126, Miniaturization can be achieved.

Third Embodiment FIG. 4 is a cross-sectional view showing a camera module 201 according to a third embodiment. In addition, about the structure similar to the camera module 1 of 1st Embodiment, the code | symbol similar to 1st Embodiment is attached | subjected.

  In the third embodiment, the lens barrel 3 in the first embodiment is not provided, and the lens group 2 is attached to the front case member 221. Specifically, it is as follows.

  The front-side case member 221 includes a front surface part 221 a that covers the subject side of the image sensor 4 and the main substrate 5, and a side surface part 221 b that is continuous with the front surface part 221 a and surrounds the outer periphery of the image sensor 4 and the main substrate 5. . The front surface portion 221a is formed in a generally conical shape as a whole, and a lens holding portion 206a for holding the lens group 2 is formed at the center side.

  The lens holding part 206a is integrally formed with the front part 221a and the side part 221b by injection molding or the like. The first lens 7 abuts on the subject side surface of the lens holding portion 206 a and is restrained from the subject side by the retainer 211. The retainer 211 is fixed to the side surface of the lens holding portion 206a with, for example, an adhesive or solder. The second lens 8 and the third lens 9 are press-fitted into an opening 206b that opens in the lens holding portion 206a, and are fixed by, for example, an adhesive or solder. The second lens 8 and the third lens 9 are in contact with a positioning portion (not shown) protruding from the wall surface of the opening 206b, for example, and the positions in the optical axis direction are fixed. Note that a mask or a diaphragm may be provided at an appropriate position of the lens group 2, or the outer periphery of the first lens 7 may be fixed by the lens holding portion 206a like the second lens 8 or the like.

  The shield plate 225 is embedded in the front side case member 221 similarly to the shield plate 25 of the first embodiment. However, the protruding portion 225c of the shield plate 225 protrudes from the front surface portion 221a of the front surface side case member 221 to the inside of the case.

  FIG. 5 is a schematic view showing an attachment structure between the front case member 221 and the main board 5, and is a perspective view seen from the back side of the camera module 201 (the lower side in the drawing of FIG. 4). For example, four protrusions 225 c are provided corresponding to the four corners of the rectangular main substrate 205. The protruding portion 225c is formed substantially in an axial shape and extends in parallel with the optical axis LL. A boss 221c formed integrally with the front surface portion 221a is provided on the base side of the protruding portion 225c. The boss 221c may be omitted.

  On the other hand, the main substrate 205 has a through hole 205a through which the protruding portion 225c is inserted. The through-hole 205a is also a cut-out part in which the edge of the main substrate 205 is cut out. In FIG. The case where the direction is set to a direction orthogonal to each other is illustrated.

  FIG. 6 is a cross-sectional view of the protruding portion 225c shown with the protruding portion 225c inserted through the through hole 205a. The cross-sectional shape of the projecting portion 225c is C-shaped. The outer diameter of the protrusion 225c and the inner diameter of the through hole 205a are set so that a gap is generated between the protrusion 225c and the through hole 205a. For example, the inner diameter D1 of the through hole 205a is 1.5 mm, the outer diameter D2 of the protrusion 225c is 1.0 mm, and the thickness t1 of the protrusion 225c is 0.15 mm.

  The main substrate 205 is fixed to the side surface (side surface with respect to the longitudinal direction, surface parallel to the optical axis LL) of the protruding portion 225c with, for example, solder. Further, since it is fixed by solder, the ground layer of the main substrate 205 is electrically connected to the protruding portion 225c. In order to make the fixation by soldering firmer, it is preferable to form a thin film mainly composed of metal on the inner peripheral surface of the through-hole 205a of the main substrate 205 and perform metallization in advance.

  A method for manufacturing the camera module 201 will be described.

  First, the lens group 2 is attached to the front case member 221 and fixed by the retainer 211 (lens fixing step). Thereby, the lens group 2 cannot move in any direction of the optical axis direction, around the optical axis, and in the direction orthogonal to the optical axis with respect to the front side case member 221.

  Next, the main board 205 to which the image sensor 5 and the sub board 13 are attached is fixed to the front case member 221 (board fixing process). Specifically, first, the main substrate 205 is positioned by inserting the protruding portion 225 c into the through hole 205 a of the main substrate 205. At this time, the cable 18 is connected to an inspection device or a monitor (not shown), and an image picked up by the image pickup device 5 is evaluated as in the first embodiment. Then, the main board 205 is positioned based on the evaluation. In positioning, not only the position in the plane orthogonal to the optical axis LL but also the position of the main substrate 205 in the optical axis direction with respect to the lens group 2 and the inclination with respect to the optical axis are adjusted. After that, the main substrate 205 is fixed to the protruding portion 225c with solder.

  According to the above embodiment, the same effect as the first embodiment can be obtained. In addition, since the main substrate 205 is fixed to the side surface of the protruding portion 225c extending in the optical axis direction of the lens group 2, the main substrate 205 is moved along the protruding portion 225c so that the main substrate 205 is moved at an appropriate position. Can be fixed. That is, by adjusting the position of the image sensor 4 in the optical axis direction, the distance between the lens group 2 and the image sensor 4 can be set appropriately. Therefore, the lens barrel can be omitted, and the lens holding portion 206a for holding the lens and the front surface portion 221a of the front case member 221 can be integrally formed to reduce the size.

  Since the main substrate 205 has a through hole 205a through which the protruding portion 225c is inserted, the main substrate 205 can be easily attached to the protruding portion 225c, and is fixed to be solidified from a liquefied state such as solder or adhesive. When fixed by means, the main substrate 205 and the protruding portion 225c can be fixed firmly as compared with the case where the through hole 205a is not provided. Specifically, as shown in FIG. 4, the solder 250 protrudes from the main substrate 205 in a state where the solder 250 spreads uniformly around the protrusion 225 c and extends to both sides of the main substrate 205 along the longitudinal direction of the protrusion 225 c. It can fix with respect to the part 225c.

  Since the through-hole 205a is also a cutout portion in which the edge of the main substrate 205 is cut out, the stress from the protruding portion 225c and the protruding portion 225c due to thermal expansion of the main substrate 205 to the main substrate 205 causes the cutout portion. The main substrate 205 is absorbed by deformation on the edge side of the main substrate 205 that is brought close to or away from, and damage to the main substrate 205 is prevented. Further, since the protruding portion 225c has a C-shaped cross section, the stress from the main substrate 205 to the protruding portion 225c due to thermal expansion of the protruding portion 225c or the main substrate 205 causes the notch portion of the protruding portion 225c to approach or The main substrate 205 is prevented from being damaged by being absorbed by the deformation to be separated.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The camera module is not limited to a vehicle-mounted one, and may be for a mobile phone, for example. The lens group only needs to include at least one lens that forms an optical image on the image sensor.

  The exterior case may be any one in which either the front surface, the back surface, or the outer periphery of the circuit board is formed of a non-conductive material, and the shield body is embedded in the portion. For example, one of the front case member and the rear case member may be a non-conductive case member in which a shield body is embedded, and the other may be a conductive case member formed of metal. Further, the exterior case is not limited to a case in which the front case member and the rear case member are combined.

  The position and shape of the protrusion for holding the circuit board may be set as appropriate. As in the first and second embodiments, the front or back surface of the circuit board is brought into contact with the protrusion, and the circuit board is moved in a direction along the surface (a direction perpendicular to the optical axis) for positioning. When providing a protrusion so that it can do, the protrusion should just have a part orthogonal to an optical axis. Therefore, the protruding portion does not have to protrude from the side surface portion of the exterior case. However, the shape of the protruding portion is simplified by protruding from the side surface portion. Further, as in the third embodiment, when a protrusion is provided so that the protrusion is brought into contact with the outer periphery of the circuit board and can be positioned by moving the circuit board in a direction perpendicular to the surface (optical axis direction). It is sufficient that the protruding portion has a portion parallel to the optical axis. Accordingly, the protruding portion may not protrude from the front surface portion of the exterior case. However, the shape of the protruding portion is simplified by protruding from the front surface portion. The fixing of the circuit board and the protruding portion is not limited to solder, and may be fixed to each other by, for example, a bolt and a nut.

FIG. 2 is a cross-sectional view illustrating a configuration of a camera module according to the first embodiment of the present invention. The perspective view which shows the attachment structure of the board | substrate of the camera module of FIG. Sectional drawing which shows the structure of the camera module of the 2nd Embodiment of this invention. Sectional drawing which shows the structure of the camera module of the 3rd Embodiment of this invention. The perspective view which shows the attachment structure of the board | substrate of the camera module of FIG. Sectional drawing of the protrusion part of the camera module of FIG. Sectional drawing which shows the structure of the conventional camera module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Camera module, 4 ... Image sensor, 5 ... Main board (circuit board), 6 ... Exterior case, 7, 8, 9 ... Lens, 25 ... Shield plate (shield body), 25c ... Projection part.

Claims (9)

An optical lens,
An image sensor on which light from the optical lens forms an image;
A circuit board provided with the imaging device;
A non-conductive exterior case that houses the circuit board;
A shield body embedded in the exterior case and shielding the circuit board;
Camera module with. The shield body has a protrusion that protrudes from the exterior case to the inside of the case,
The camera module according to claim 1, wherein the protrusion holds the circuit board and is electrically connected to a ground of the circuit board. The exterior case includes a side surface surrounding the outer periphery of the circuit board,
The camera module according to claim 2, wherein the protruding portion protrudes from the side surface portion in a direction orthogonal to the optical axis of the optical lens and is fixed to a surface orthogonal to the optical axis of the circuit board. The exterior case includes a front surface portion that covers the optical lens side of the circuit board,
The camera module according to claim 2, wherein the protruding portion protrudes from the front surface portion in a direction parallel to the optical axis of the optical lens and is fixed to the outer periphery of the circuit board. The outer case further includes a lens holding part that holds the lens in contact with the lens,
The camera module according to claim 4, wherein the front surface portion and the lens holding portion are integrally formed. The camera module according to claim 2, wherein there is a gap between an outer periphery of the circuit board and an inner surface of the exterior case. An optical lens,
An image sensor on which light from the optical lens forms an image;
A circuit board provided with the imaging device;
A non-conductive front side case member covering the optical lens side of the circuit board;
A front shield body embedded in the front case member and shielding the circuit board;
A back side shield that is disposed on the opposite side of the circuit board from the optical lens and shields the circuit board;
Camera module with. A non-conductive back side case member that covers the opposite side of the circuit board from the optical lens;
The camera module according to claim 7, wherein the back side shield body is embedded in the back side case member. The front shield body is provided with a protrusion that protrudes from the front case member toward the inside of the case, holds the circuit board, and is electrically connected to the ground of the circuit board.
The camera module according to claim 7, wherein the back side shield body is provided with a spring portion that is electrically connected to the protruding portion and biases the protruding portion.

Images