JP3138191B2 - Solid-state imaging device - Google Patents
Solid-state imaging deviceInfo
- Publication number
- JP3138191B2 JP3138191B2 JP07204607A JP20460795A JP3138191B2 JP 3138191 B2 JP3138191 B2 JP 3138191B2 JP 07204607 A JP07204607 A JP 07204607A JP 20460795 A JP20460795 A JP 20460795A JP 3138191 B2 JP3138191 B2 JP 3138191B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- sensor chip
- imaging device
- state imaging
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title claims description 55
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面実装型のパッ
ケージに半導体チップを納めた固体撮像素子及びその固
体撮像素子を回路基板上に装着する実装方法に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a solid-state imaging device in which a semiconductor chip is housed in a surface mount type package and a mounting method for mounting the solid-state imaging device on a circuit board.
【０００２】[0002]
【従来の技術】ＣＣＤイメージセンサの如き半導体構成
の固体撮像素子は、センサチップの表面に被写体映像を
写す必要があるため、半導体チップの受光面に対応して
開口部が形成される。このため、固体撮像素子の場合に
は、開口部を形成し易いセラミックパッケージが従来よ
り多く用いられる。2. Description of the Related Art In a solid-state image pickup device having a semiconductor structure such as a CCD image sensor, an image of a subject needs to be projected on the surface of a sensor chip. Therefore, an opening is formed corresponding to a light receiving surface of the semiconductor chip. For this reason, in the case of a solid-state imaging device, a ceramic package in which an opening is easily formed is used more often than before.
【０００３】図４は、セラミックパッケージを用いた従
来の固体撮像素子の構造を示す斜視図である。セラミッ
クパッケージ１は、所定の深さの凹部を有する箱形を成
し、この凹部内にセンサチップ２を収納する。センサチ
ップ２は、シリコン等の半導体基板上に周知の半導体プ
ロセスによって形成される複数の受光画素及び各受光画
素に発生する情報電荷を転送するシフトレジスタを有
し、セラミックパッケージ１の凹部の中央部分に装着さ
れる。複数のリード３は、予めセラミックパッケージ１
に埋め込まれており、外部リードがセラミックパッケー
ジ１の側面に沿って配置され、内部リードが凹部内のセ
ンサチップ２の周辺部に配置される。これらの複数のリ
ード３の内部リードには、ワイヤボンディングによって
センサチップ２の周辺部に入出力端子として設けられる
電極パッドが接続される。そして、透明板４は、ガラス
やアクリル樹脂からなり、セラミックパッケージ１上に
凹部を塞ぐようにして装着される。これにより、センサ
チップ２が封止され、センサチップ２及びセンサチップ
２とリード３とを接続する配線が保護される。FIG. 4 is a perspective view showing the structure of a conventional solid-state imaging device using a ceramic package. The ceramic package 1 has a box shape having a concave portion with a predetermined depth, and the sensor chip 2 is stored in the concave portion. The sensor chip 2 has a plurality of light receiving pixels formed on a semiconductor substrate such as silicon by a known semiconductor process and a shift register for transferring information charges generated in each light receiving pixel. Attached to. The plurality of leads 3 are connected to the ceramic package 1 in advance.
The external leads are arranged along the side surface of the ceramic package 1 and the internal leads are arranged around the sensor chip 2 in the concave portion. Electrode pads provided as input / output terminals on the periphery of the sensor chip 2 are connected to the internal leads of these leads 3 by wire bonding. The transparent plate 4 is made of glass or acrylic resin, and is mounted on the ceramic package 1 so as to cover the recess. Thereby, the sensor chip 2 is sealed, and the wiring connecting the sensor chip 2 and the leads 3 to the leads 3 is protected.
【０００４】図５は、固体撮像素子の実装方法を説明す
る分解斜視図である。固体撮像素子１０は、図４に示す
構造のものであり、センサチップ２を収納したセラミッ
クパッケージ１の側面に複数のリード３が配置されてい
る。回路基板５は、ガラスエポキシ基板等の絶縁材料よ
りなり、一面あるいは両面に銅箔により配線パターンが
形成されている。この回路基板５には、固体撮像素子１
０のリード３に対応したスルーホール６が形成されてお
り、リード３をスルーホール６へ通して固体撮像素子１
０が所定の位置に装着される。そして、回路基板５上に
は、固体撮像素子１０に対して各種の駆動信号を供給す
るための駆動回路及び固体撮像素子１０の出力を取り込
んで所定の処理を施すための信号処理回路が設けられ、
配線パターンを介して固体撮像素子１０と接続される。FIG. 5 is an exploded perspective view for explaining a method of mounting the solid-state image sensor. The solid-state imaging device 10 has a structure shown in FIG. 4, and a plurality of leads 3 are arranged on a side surface of a ceramic package 1 containing a sensor chip 2. The circuit board 5 is made of an insulating material such as a glass epoxy board, and has a wiring pattern formed on one or both sides by copper foil. The circuit board 5 includes the solid-state imaging device 1
The through hole 6 corresponding to the lead 3 of the solid-state imaging device 1 is formed by passing the lead 3 through the through hole 6.
0 is mounted at a predetermined position. A drive circuit for supplying various drive signals to the solid-state imaging device 10 and a signal processing circuit for taking in the output of the solid-state imaging device 10 and performing predetermined processing are provided on the circuit board 5. ,
It is connected to the solid-state imaging device 10 via a wiring pattern.
【０００５】レンズユニット７は、マウント部８及び鏡
筒部９より構成される。マウント部８は、裏面側に固体
撮像素子１０を収納できる凹部を有し、固体撮像素子１
０を被うようにして回路基板５に装着される。鏡筒部９
は、固体撮像素子１０の受光面に被写体映像を結像させ
るレンズが取り付けられ、固体撮像素子１０の受光面と
対向するマウント部８の表面に取り付けられる。このレ
ンズユニット７は、例えば、凹部の側面を固体撮像素子
１０のセラミックパッケージ１の側面に接するようにし
て位置決めが成される。[0005] The lens unit 7 comprises a mount 8 and a lens barrel 9. The mount section 8 has a concave portion on the rear surface side in which the solid-state imaging device 10 can be stored.
It is mounted on the circuit board 5 so as to cover 0. Lens barrel 9
Is mounted on a light-receiving surface of the solid-state imaging device 10 with a lens for forming an image of a subject, and is mounted on the surface of the mount unit 8 facing the light-receiving surface of the solid-state imaging device 10. The positioning of the lens unit 7 is performed, for example, such that the side surface of the concave portion is in contact with the side surface of the ceramic package 1 of the solid-state imaging device 10.
【０００６】[0006]
【発明が解決しようとする課題】セラミックパッケージ
を用いた固体撮像素子においては、セラミックの加工が
難しく、パッケージ自体が高価なため、素子の組み立て
に要する製造コストが高くなるという問題を有してい
る。また、そのような固体撮像素子を回路基板上にレン
ズユニットと共に実装する場合には、固体撮像素子を被
うようなレンズマウントが必要となるため、レンズユニ
ット部分が回路基板から大きく突出することになり、小
型化の障害となっている。In a solid-state image pickup device using a ceramic package, there is a problem that the processing of ceramic is difficult and the package itself is expensive, so that the manufacturing cost required for assembling the device is increased. . When such a solid-state imaging device is mounted together with a lens unit on a circuit board, a lens mount that covers the solid-state imaging device is required. It is an obstacle to miniaturization.
【０００７】そこで本発明は、固体撮像素子の製造コス
トを低減すると共に、その固体撮像素子を回路基板上に
効率よく実装することを目的とする。Accordingly, an object of the present invention is to reduce the manufacturing cost of a solid-state imaging device and efficiently mount the solid-state imaging device on a circuit board.
【０００８】[0008]
【課題を解決するための手段】本発明の固体撮像素子
は、複数の受光画素がマトリクス状に配列され、各受光
画素に光電変換によって生じる情報電荷を蓄積するセン
サチップと、一方の面上に上記センサチップが装着さ
れ、装着部の周辺部に上記センサチップの電極と電気的
に接続される複数の配線が配置された絶縁性の底部材
と、この底部材の一方の面上で上記センサチップを取り
囲み、上記センサチップを収納する凹部を形成する絶縁
性の枠部材と、少なくとも上記センサチップの受光面を
被い、上記枠部材の対向する２辺に跨って装着される透
明板と、を備え、上記センサチップの受光面と上記透明
板との間に透明樹脂が充填されることを特徴とする。According to the present invention, there is provided a solid-state imaging device comprising: a plurality of light receiving pixels arranged in a matrix; a sensor chip for accumulating information charges generated by photoelectric conversion in each light receiving pixel; An insulating bottom member on which the sensor chip is mounted and a plurality of wirings electrically connected to electrodes of the sensor chip are arranged around a mounting portion; and the sensor on one surface of the bottom member. An insulating frame member surrounding the chip and forming a recess for accommodating the sensor chip, and a transparent plate covering at least the light receiving surface of the sensor chip and mounted across two opposing sides of the frame member; Wherein the space between the light receiving surface of the sensor chip and the transparent plate is filled with a transparent resin.
【０００９】これにより、センサチップの受光面の開口
を確保しながら、加工が容易で安価なエポキシ樹脂等の
絶縁材料でパッケージを構成することが可能なり、製造
コストを削減できる。また、センサチップが収納される
凹部を透明板で被う際、凹部の一部を開けるようにした
ことで、センサチップと透明板との間に充填される透明
樹脂の量の過不足が、透明板が装着されていない凹部に
生じる透明樹脂の膨らみあるいはへこみによって調整さ
れるようになる。従って、透明樹脂の注入量の制御が容
易になる。Thus, it is possible to form the package with an insulating material such as an epoxy resin which is easy and inexpensive, while securing the opening on the light receiving surface of the sensor chip, thereby reducing the manufacturing cost. Further, when covering the concave portion in which the sensor chip is stored with the transparent plate, by opening a part of the concave portion, the amount of the transparent resin filled between the sensor chip and the transparent plate is excessive or insufficient. The adjustment is made by the swelling or dent of the transparent resin generated in the concave portion where the transparent plate is not mounted. Therefore, control of the injection amount of the transparent resin becomes easy.
【００１０】そして、複数の受光画素がマトリクス状に
配列されたセンサチップが表面実装型パッケージに納め
られた固体撮像素子を光学レンズと共に回路基板上に装
着する実装方法において、回路基板に上記固体撮像素子
のセンサチップの受光面より大きく、パッケージより小
さい開口窓を形成し、この開口窓を被って上記回路基板
の一方の面に光学レンズが取り付けられるレンズマウン
トを装着し、上記開口窓を塞いで上記回路基板の他方の
面に上記固体撮像素子を装着することを特徴とする。In a mounting method of mounting a sensor chip having a plurality of light-receiving pixels arranged in a matrix on a circuit board together with an optical lens, a solid-state image pickup element housed in a surface mount type package is provided. An opening window larger than the light receiving surface of the sensor chip of the element and smaller than the package is formed, and a lens mount for mounting an optical lens on one surface of the circuit board covering the opening window is mounted, and the opening window is closed. The solid-state imaging device is mounted on the other surface of the circuit board.
【００１１】これにより、レンズマウントを固定した後
に固体撮像素を回路基板へ接続できるため、回路基板に
対するレンズマウントの位置合わせと、回路基板に対す
る固体撮像素子の位置合わせとを独立して行うことがで
きる。従って、回路基板を基準として固体撮像素子及び
レンズマウントの位置合わせが容易になる。また、レン
ズマウントは固体撮像素子を被うように装着する必要が
ないため、回路基板からの突出は少なくなる。Thus, since the solid-state image sensor can be connected to the circuit board after the lens mount is fixed, the alignment of the lens mount with respect to the circuit board and the alignment of the solid-state image sensor with respect to the circuit board can be performed independently. it can. Therefore, the alignment of the solid-state imaging device and the lens mount with reference to the circuit board becomes easy. Further, since it is not necessary to mount the lens mount so as to cover the solid-state imaging device, the projection from the circuit board is reduced.
【００１２】[0012]
【発明の実施の形態】図１は、本発明の固体撮像素子の
構造を示す分解斜視図である。センサチップ１１は、シ
リコン基板上に周知の半導体プロセスによって複数の受
光画素及びシフトレジスタが形成されたものであり、複
数の受光画素がマトリクス状に配列された受光面１２を
有する。底部材１３は、ガラスエポキシ基板等の絶縁材
料からなり、一方の面の中央部分にセンサチップ１１が
装着される。また、センサチップ１１の装着位置の周辺
部から側辺部まで延在する複数のリード１４が銅箔等の
導電材料によって形成される。この複数のリード１４
は、中央部側の端部がセンサチップ１１の周辺部分に入
出力端子として形成される電極パッドとワイヤボンディ
ングにより接続される。また、底部材１３の対向する２
辺の内側には、一対の位置決め穴１５が形成される。枠
部材１６は、底部材１３と同一材料で同一の大きさに形
成され、中央部にセンサチップ１１を納める凹部を形成
するための開口部１７が形成される。この枠部材１６の
対向する２辺の内側にも、底部材１３と同様に位置決め
穴１８が形成されている。この底部材１３が、枠部材１
６上に貼り合わせられ、底部材１３と枠部材１６の開口
部１７とで凹部が形成される。また、底部材１３と枠部
材１６とが貼り合わせられた後、それらの側面には、図
１に破線で示すように、リード１４に接続される電極が
形成される。これにより、表面実装型のパッケージが形
成される。尚、底部材１３と枠部材１６との貼り合わせ
は、底部材１３にセンサチップ１１を装着するよりも先
に行い、底部材１３の位置決め穴１５及び枠部材１６の
位置決め穴１８の形成は、底部材１３と枠部材１６とを
貼り合わせた後に同時に行うようにする。透明板１９
は、アクリル樹脂等の可視光に対して透明な材料からな
り、枠部材１６の開口部１７の対向する２辺に跨るよう
にして枠部材１６の表面に装着される。この透明板１９
は、一方の辺の長さが、開口部１７の一方の対向する２
辺の幅より長く形成され、且つ、他方の辺の長さが、開
口部１７の他方の対向する２辺の幅より短く形成され
る。これにより、透明板１９を開口部１７の対向する２
辺の間に跨るように装着すると、開口部１７の一部を開
けたままとなる。ここで、透明板１９は、少なくともセ
ンサチップ１１の受光面１２を被うようにして装着され
る。そして、センサチップ１１と透明板１９との間に
は、透明板１９と屈折率がほぼ同一の透明樹脂が充填さ
れ、センサチップ１１及び配線が保護される。FIG. 1 is an exploded perspective view showing the structure of a solid-state imaging device according to the present invention. The sensor chip 11 has a plurality of light receiving pixels and a shift register formed on a silicon substrate by a known semiconductor process, and has a light receiving surface 12 in which the plurality of light receiving pixels are arranged in a matrix. The bottom member 13 is made of an insulating material such as a glass epoxy substrate, and the sensor chip 11 is mounted on a central portion of one surface. Further, a plurality of leads 14 extending from a peripheral portion of the mounting position of the sensor chip 11 to a side portion are formed of a conductive material such as a copper foil. This plurality of leads 14
Is connected to an electrode pad formed as an input / output terminal on the peripheral portion of the sensor chip 11 by wire bonding at an end on the center side. In addition, the opposite 2 of the bottom member 13
A pair of positioning holes 15 are formed inside the side. The frame member 16 is formed of the same material and the same size as the bottom member 13, and has an opening 17 for forming a recess for receiving the sensor chip 11 in the center. Positioning holes 18 are also formed inside the two opposing sides of the frame member 16 similarly to the bottom member 13. This bottom member 13 is
6 and a concave portion is formed by the bottom member 13 and the opening 17 of the frame member 16. After the bottom member 13 and the frame member 16 are bonded to each other, electrodes connected to the leads 14 are formed on their side surfaces, as shown by broken lines in FIG. Thereby, a surface mount type package is formed. Note that the bonding of the bottom member 13 and the frame member 16 is performed before the sensor chip 11 is attached to the bottom member 13, and the positioning holes 15 of the bottom member 13 and the positioning holes 18 of the frame member 16 are formed. It is performed simultaneously after the bottom member 13 and the frame member 16 are bonded. Transparent plate 19
Is made of a material transparent to visible light such as acrylic resin, and is mounted on the surface of the frame member 16 so as to straddle two opposite sides of the opening 17 of the frame member 16. This transparent plate 19
The length of one side is 2
It is formed longer than the width of the side, and the length of the other side is formed shorter than the width of the other two opposite sides of the opening 17. As a result, the transparent plate 19 is moved to the opposite side of the opening 17.
When mounted so as to straddle between the sides, a part of the opening 17 remains open. Here, the transparent plate 19 is mounted so as to cover at least the light receiving surface 12 of the sensor chip 11. The space between the sensor chip 11 and the transparent plate 19 is filled with a transparent resin having substantially the same refractive index as that of the transparent plate 19 to protect the sensor chip 11 and the wiring.
【００１３】ここで、センサチップ１１と透明板１９と
の間に充填される透明樹脂は、実際の製造工程では、セ
ンサチップ１１を底部材１３に装着した直後に枠部材１
６の開口部１７で形成される凹部を埋めるように充填さ
れる。そして、透明樹脂が硬化する前に開口部１７の対
向する２辺の間に跨るようにして装着される。これによ
り、充填される透明樹脂が多かった場合には、開口部１
７の透明板１９で被われていない部分で盛り上がるた
め、透明板１９の浮き上がりは生じない。逆に、充填さ
れる透明樹脂が少なかった場合には、開口部１７の透明
板１９で被われていない部分でへこみが生じるため、セ
ンサチップ１１の受光面１２と透明板１９との間に気泡
が混入することはない。Here, in the actual manufacturing process, the transparent resin filled between the sensor chip 11 and the transparent plate 19 is used immediately after the sensor chip 11 is mounted on the bottom member 13.
6 to fill the recess formed by the opening 17. Then, before the transparent resin is cured, it is mounted so as to straddle between two opposing sides of the opening 17. Thereby, when the transparent resin to be filled is large, the opening 1
Since the portion which is not covered with the transparent plate 19 rises, the floating of the transparent plate 19 does not occur. Conversely, if the amount of the transparent resin to be filled is small, dents occur in portions of the opening 17 which are not covered with the transparent plate 19, so that air bubbles are generated between the light receiving surface 12 of the sensor chip 11 and the transparent plate 19. Is not mixed.
【００１４】このような固体撮像素子によれば、表面実
装型のパッケージを加工が容易で安価な材料により構成
することができるため、セラミックパッケージを使用し
た場合に比べて、製造コストを大幅に削減することがで
きる。また、センサチップ１１の受光面１２を保護する
透明板１９を枠部材１６の開口部１７の一部を開けて装
着することで、センサチップ１１と透明板１９の間に充
填する透明樹脂の充填量の制御が容易になり、製造工程
の作業効率を向上できる。According to such a solid-state imaging device, the surface mounting type package can be formed of an easy-to-process and inexpensive material, so that the manufacturing cost is greatly reduced as compared with the case where a ceramic package is used. can do. Also, by mounting a transparent plate 19 for protecting the light receiving surface 12 of the sensor chip 11 by opening a part of the opening 17 of the frame member 16, the transparent resin filled between the sensor chip 11 and the transparent plate 19 is filled. The quantity can be easily controlled, and the working efficiency of the manufacturing process can be improved.
【００１５】ところで、このような表面実装型のパッケ
ージを採用した固体撮像素子の場合、回路基板あるいは
光学系との位置合わせが難しくなる。即ち、表面実装型
のパッケージでは、固体撮像素子を被ってレンズユニッ
トを装着した後に固体撮像素子と回路基板との接続が不
可能なため、予め固体撮像素子を回路基板上の配線に半
田付けによって接続した上でレンズユニットを装着しな
ければならない。しかしながら、表面実装型のパッケー
ジは、そのパッケージの周辺部分に半田付けによる凹凸
が生じるため、パッケージの側面を基準としてレンズユ
ニットの位置決めを行うことができない。By the way, in the case of a solid-state image pickup device employing such a surface mount type package, it is difficult to align the position with a circuit board or an optical system. That is, in the case of the surface mount type package, it is impossible to connect the solid-state imaging device to the circuit board after the lens unit is mounted over the solid-state imaging device. After connection, the lens unit must be mounted. However, in a surface mount type package, unevenness due to soldering is generated in a peripheral portion of the package, so that the lens unit cannot be positioned with reference to the side surface of the package.
【００１６】図２は、図１に示すような表面実装型のパ
ッケージを用いた固体撮像素子の実装方法を説明する分
解斜視図で、図３は、回路基板上に固体撮像素子及びレ
ンズユニットを実装したときの断面図である。固体撮像
素子２０は、図１に示す構造のものであり、底部材１３
及び枠部材１６により構成されるパッケージの側面に、
リード１４に接続される複数の電極２１が形成されてい
る。回路基板２２は、ガラスエポキシ基板等の絶縁材料
よりなり、一面あるいは両面に銅箔により配線パターン
が形成され、これらの配線パターンを介して、固体撮像
素子２０を駆動する駆動回路や固体撮像素子２０の出力
を取り込む信号処理回路等が接続される。この回路基板
２２には、固体撮像素子２０の受光面に対応した開口窓
２３が設けられており、この開口窓２３に透明板１９を
納めるようにして固体撮像素子２０が装着される。即
ち、固体撮像素子２０は、回路基板２２の開口窓２３を
通して被写体映像を受けるように、受光面を回路基板２
２側に向けて装着される。また、回路基板２２には、開
口窓２３の両側に固体撮像素子２０の位置決め穴１８に
対応する貫通穴２４が設けられる。レンズユニット２５
は、マウント部２６及び鏡筒部２７より構成される。マ
ウント部２６は、裏面側に回路基板２２の貫通穴２４に
対応する位置決めピン２８が設けられ、この位置決めピ
ン２８を貫通穴２４に通して、固体撮像素子２０が装着
される面とは反対の面に開口窓２３を被うように装着さ
れる。このとき、位置決めピン２８は、回路基板２２の
裏側まで突出され、この突出部分に固体撮像素子２０の
位置決め穴１８がはめ込まれる。鏡筒部２７は、固体撮
像素子２０のセンサチップ１１の受光面１２に被写体映
像を結像させるレンズ２８が取り付けられ、マウント部
２６の固体撮像素子２０に対向する部分取り付けられ
る。FIG. 2 is an exploded perspective view for explaining a method of mounting the solid-state imaging device using the surface-mount type package as shown in FIG. 1. FIG. 3 is a perspective view showing the solid-state imaging device and the lens unit on a circuit board. It is sectional drawing at the time of mounting. The solid-state imaging device 20 has the structure shown in FIG.
And the side surface of the package constituted by the frame member 16,
A plurality of electrodes 21 connected to the leads 14 are formed. The circuit board 22 is made of an insulating material such as a glass epoxy substrate, and has a wiring pattern formed of copper foil on one or both surfaces, and a driving circuit for driving the solid-state imaging device 20 and the solid-state imaging device 20 via these wiring patterns. A signal processing circuit or the like that takes in the output of is connected. The circuit board 22 is provided with an opening window 23 corresponding to the light receiving surface of the solid-state imaging device 20, and the solid-state imaging device 20 is mounted so that the transparent plate 19 is accommodated in the opening window 23. That is, the solid-state imaging device 20 changes the light receiving surface of the circuit board
It is mounted facing two sides. In the circuit board 22, through holes 24 corresponding to the positioning holes 18 of the solid-state imaging device 20 are provided on both sides of the opening window 23. Lens unit 25
Is composed of a mount 26 and a lens barrel 27. The mounting portion 26 has a positioning pin 28 provided on the back surface side corresponding to the through hole 24 of the circuit board 22. The positioning pin 28 is passed through the through hole 24, and is opposite to the surface on which the solid-state imaging device 20 is mounted. It is mounted so as to cover the opening window 23 on the surface. At this time, the positioning pins 28 protrude to the back side of the circuit board 22, and the positioning holes 18 of the solid-state imaging device 20 are fitted into the protruding portions. The lens barrel 27 is provided with a lens 28 for forming a subject image on the light receiving surface 12 of the sensor chip 11 of the solid-state imaging device 20, and is mounted on a portion of the mount 26 facing the solid-state imaging device 20.
【００１７】このレンズユニット２５は、回路基板２２
の開口窓２３を被えばよく、固体撮像素子２０を収納す
る必要はないため、図５に示すレンズユニット７に比べ
て小さく形成することができる。また、レンズユニット
２５を装着した後でも、固体撮像素子２０が露出してい
るため、レンズユニット２５に対する固体撮像素子２０
の位置を決定した後に固体撮像素子２０を回路基板２２
の配線パターンに半田付けして固定できる。従って、回
路基板２２に対する固体撮像素子２０及びレンズユニッ
ト２５の位置決めが容易になる。The lens unit 25 includes a circuit board 22
It is not necessary to house the solid-state imaging device 20 as long as the opening window 23 is covered, and therefore, it can be formed smaller than the lens unit 7 shown in FIG. Further, even after the lens unit 25 is mounted, the solid-state imaging device 20 is exposed,
After the position of the solid-state imaging device 20 is determined,
Can be fixed by soldering to the wiring pattern. Therefore, the positioning of the solid-state imaging device 20 and the lens unit 25 with respect to the circuit board 22 becomes easy.
【００１８】以上の実施例においては、固体撮像素子２
０及び回路基板２４に位置決め穴１５、１８及び貫通穴
２４を設けた場合を例示したが、これらの穴１５、１８
及び２４は、レンズユニット２５の位置決めピン２８に
対応する切り欠きであってもよい。In the above embodiment, the solid-state imaging device 2
0 and the case where the positioning holes 15 and 18 and the through holes 24 are provided in the circuit board 24 are illustrated.
And 24 may be cutouts corresponding to the positioning pins 28 of the lens unit 25.
【００１９】[0019]
【発明の効果】本発明によれば、固体撮像素子のパッケ
ージを加工が容易で安価な材料で形成できるため、製造
コストを大幅に削減することができる。また、固体撮像
素子の表面に装着する透明板を枠部材の開口部より小さ
く形成したことで、半導体チップと透明板との間への透
明樹脂の充填が容易になるため、作業性が向上して製造
歩留まりの向上が望める。According to the present invention, the package of the solid-state imaging device can be formed of an easy-to-process and inexpensive material, so that the manufacturing cost can be greatly reduced. In addition, since the transparent plate mounted on the surface of the solid-state imaging device is formed smaller than the opening of the frame member, it becomes easy to fill the transparent resin between the semiconductor chip and the transparent plate, thereby improving workability. As a result, the production yield can be improved.
【００２０】そして、表面実装型のパッケージを採用し
た固体撮像素子を回路基板上に実装する際に、回路基板
に対する固体撮像素子及びレンズユニットの位置決めが
容易になり、組み立て行程の簡略化が望める。さらに、
レンズユニット自体を小さくすることができるため、回
路基板からの大きな突出がなくなり、小型化に有利であ
る。When a solid-state image pickup device employing a surface-mount type package is mounted on a circuit board, the positioning of the solid-state image pickup device and the lens unit with respect to the circuit board becomes easy, and the assembly process can be simplified. further,
Since the lens unit itself can be made smaller, there is no large protrusion from the circuit board, which is advantageous for miniaturization.
【図１】本発明の固体撮像素子の構造を示す分解斜視図
である。FIG. 1 is an exploded perspective view showing the structure of a solid-state imaging device according to the present invention.
【図２】本発明の固体撮像素子の実装方法を説明する分
解斜視図である。FIG. 2 is an exploded perspective view illustrating a mounting method of the solid-state imaging device of the present invention.
【図３】本発明の固体撮像素子の実装方法を説明する断
面図である。FIG. 3 is a cross-sectional view illustrating a method for mounting the solid-state imaging device of the present invention.
【図４】従来の固体撮像素子の構造を示す斜視図であ
る。FIG. 4 is a perspective view showing a structure of a conventional solid-state imaging device.
【図５】従来の固体撮像素子の実装方法を説明する分解
斜視図である。FIG. 5 is an exploded perspective view illustrating a mounting method of a conventional solid-state imaging device.
１ パッケージ ２、１１ センサチップ ３、１４ リード ４、１９ 透明板 ５、２２ 回路基板 ６ スルーホール ７、２５ レンズユニット ８、２６ マウント部 ９、２７ 鏡筒部 １２ 受光面 １３ 底部材 １５、１８ 位置決め穴 １６ 枠部材 １７ 開口部 ２０ 固体撮像素子 ２１ 電極 ２３ 開口窓 ２４ 貫通穴 ２８ 位置決めピン REFERENCE SIGNS LIST 1 Package 2, 11 Sensor chip 3, 14 Lead 4, 19 Transparent plate 5, 22 Circuit board 6 Through hole 7, 25 Lens unit 8, 26 Mount unit 9, 27 Lens tube unit 12 Light receiving surface 13 Bottom member 15, 18 Positioning Hole 16 Frame member 17 Opening 20 Solid-state imaging device 21 Electrode 23 Opening window 24 Through hole 28 Positioning pin
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−204050（ＪＰ，Ａ) 特開 平８−236736（ＪＰ，Ａ) 特開 平８−236739（ＪＰ，Ａ) 特開 平８−241974（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 27/14 H04N 5/335 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-204050 (JP, A) JP-A-8-236736 (JP, A) JP-A-8-236739 (JP, A) JP-A-8-236 241974 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 27/14 H04N 5/335
Claims (2)
れ、各受光画素に光電変換によって生じる情報電荷を蓄
積するセンサチップと、一方の面上に上記センサチップ
が装着され、装着部の周辺部に上記センサチップの電極
と電気的に接続される複数のリードが配置された絶縁性
の底部材と、この底部材の一方の面で上記センサチップ
を取り囲み、上記センサチップを収納する凹部を形成す
る上記底部材と同一の大きさの絶縁性の枠部材と、少な
くとも上記センサチップの受光面を被い、上記枠部材の
対向する２辺に跨って装着される透明板と、を備え、上
記センサチップの受光面と上記透明板との間に透明樹脂
が充填されることを特徴とする固体撮像素子。1. A sensor chip in which a plurality of light receiving pixels are arranged in a matrix, wherein each light receiving pixel stores information charges generated by photoelectric conversion, and the sensor chip is mounted on one surface, and a peripheral portion of a mounting portion is provided. An insulating bottom member on which a plurality of leads electrically connected to the electrodes of the sensor chip are arranged, and a concave portion for surrounding the sensor chip on one surface of the bottom member and accommodating the sensor chip. An insulating frame member having the same size as the bottom member, and a transparent plate that covers at least the light receiving surface of the sensor chip and is attached across two opposing sides of the frame member. A solid-state imaging device, wherein a transparent resin is filled between a light receiving surface of a sensor chip and the transparent plate.
面の上部以外で、上記枠部材が形成する凹部の一部を開
けて装着されることを特徴とする請求項１に記載の固体
撮像素子。2. The solid-state imaging device according to claim 1, wherein the transparent plate is mounted by opening a part of a concave portion formed by the frame member except for an upper portion of a light receiving surface of the sensor chip. element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07204607A JP3138191B2 (en) | 1995-08-10 | 1995-08-10 | Solid-state imaging device |
| KR1019960033152A KR100374959B1 (en) | 1995-08-10 | 1996-08-09 | Solid-state imaging device and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07204607A JP3138191B2 (en) | 1995-08-10 | 1995-08-10 | Solid-state imaging device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000311472A Division JP3600147B2 (en) | 2000-10-12 | 2000-10-12 | Mounting method of solid-state image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0955487A JPH0955487A (en) | 1997-02-25 |
| JP3138191B2 true JP3138191B2 (en) | 2001-02-26 |
Family
ID=16493272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07204607A Expired - Fee Related JP3138191B2 (en) | 1995-08-10 | 1995-08-10 | Solid-state imaging device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3138191B2 (en) |
| KR (1) | KR100374959B1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4405062B2 (en) | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | Solid-state imaging device |
| US7304684B2 (en) * | 2000-11-14 | 2007-12-04 | Kabushiki Kaisha Toshiba | Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus |
| JP3630096B2 (en) * | 2000-11-30 | 2005-03-16 | 三菱電機株式会社 | Mobile phone with imaging device |
| JP3821652B2 (en) | 2001-02-26 | 2006-09-13 | 三菱電機株式会社 | Imaging device |
| US6635941B2 (en) * | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
| JP4033439B2 (en) * | 2001-09-11 | 2008-01-16 | シャープ株式会社 | Solid-state imaging unit, manufacturing method thereof, and imaging device |
| KR100422040B1 (en) * | 2001-09-11 | 2004-03-11 | 삼성전기주식회사 | Module package of image capturing unit |
| KR100399640B1 (en) * | 2001-09-18 | 2003-09-29 | 삼성전기주식회사 | Module package of image capturing unit |
| KR20050034473A (en) * | 2003-10-09 | 2005-04-14 | 한성엘컴텍 주식회사 | A compact camera module |
| JP4170968B2 (en) | 2004-02-02 | 2008-10-22 | 松下電器産業株式会社 | Optical device |
| KR100673950B1 (en) | 2004-02-20 | 2007-01-24 | 삼성테크윈 주식회사 | Image sensor module and camera module package therewith |
| JP4686134B2 (en) * | 2004-04-26 | 2011-05-18 | パナソニック株式会社 | Optical device and manufacturing method thereof |
| US7057833B2 (en) * | 2004-09-03 | 2006-06-06 | Yeow-Thiam Ooi | Image capture device |
| KR100744925B1 (en) * | 2005-12-27 | 2007-08-01 | 삼성전기주식회사 | A Camera Module Package |
| KR101294419B1 (en) * | 2006-03-10 | 2013-08-08 | 엘지이노텍 주식회사 | Camera module and manufacturing method thereof |
| US7964945B2 (en) | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
| KR100917026B1 (en) * | 2007-09-28 | 2009-09-10 | 삼성전기주식회사 | Glass cap molding package and manufacturing method thereof, and camera module |
| JP6357784B2 (en) * | 2014-02-03 | 2018-07-18 | 株式会社ニコン | Imaging unit and imaging apparatus |
| JP6583611B2 (en) * | 2015-04-27 | 2019-10-02 | ミツミ電機株式会社 | Method for assembling camera device and method for assembling lens unit |
| KR101848654B1 (en) * | 2016-05-31 | 2018-05-24 | (주)캠시스 | Image sensor and PCB assembly having the same |
-
1995
- 1995-08-10 JP JP07204607A patent/JP3138191B2/en not_active Expired - Fee Related
-
1996
- 1996-08-09 KR KR1019960033152A patent/KR100374959B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100374959B1 (en) | 2003-05-09 |
| JPH0955487A (en) | 1997-02-25 |
| KR970013131A (en) | 1997-03-29 |
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