CN115280399A

CN115280399A - Display module and electronic device

Info

Publication number: CN115280399A
Application number: CN202180020421.9A
Authority: CN
Inventors: 西川宽
Original assignee: Sony Group Corp
Current assignee: Sony Group Corp
Priority date: 2020-03-16
Filing date: 2021-03-12
Publication date: 2022-11-01
Also published as: WO2021187377A1; JPWO2021187377A1

Abstract

The display module has: a resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal; a display panel having a connection terminal and disposed on the one main surface of the resin molded circuit board; and a bonding wire connecting the first terminal and the connection terminal.

Description

Display module and electronic device

Technical Field

The present invention relates to a display module, and more particularly, to a display module including a substrate having terminals and a display panel, in which the terminals of the substrate and the terminals of the display panel are connected by bonding wires.

Background

Various electronic components such as a flexible printed circuit board (FPC) are connected to terminals through which electric signals for controlling display on the display panel flow. In a display module provided with a display panel, an increase in the area of a terminal connection region due to an increase in the amount of data resulting from higher definition of a display is improved.

For example, patent document 1 proposes an image display device including a display module including a multilayer substrate, a display panel, and a bonding wire, the display panel being disposed on a front surface side of the multilayer substrate, and a connector being provided on a rear surface side of the multilayer substrate.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2014-178616

Disclosure of Invention

Technical problem to be solved by the invention

In the technique of patent document 1, a terminal connection region is formed on the rear surface side of the multilayer substrate by a through hole (Via) and a wiring provided in the multilayer substrate. In the technique of patent document 1, a display module is still to be improved from the viewpoints of simplification of the manufacturing process and suppression of parasitic capacitance.

In view of the above problems, it is an object of the present invention to provide a display module and an electronic apparatus that can improve an increase in the area of a terminal connection region, simplify a manufacturing process, and suppress parasitic capacitance.

Means for solving the problems

For example, (1) the present application is a display module having: a resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal;

a display panel having a connection terminal and disposed on the one principal surface of the resin molded circuit board; and

and a bonding wire connecting the first terminal and the connection terminal.

(2) The present application may also be a display module having two device modules, the device modules having: a resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal; a display panel having a connection terminal and disposed on the one main surface of the resin molded circuit board; and a bonding wire connecting the first terminal and the connection terminal,

an FPC is disposed on the other main surface side of the resin molded circuit board in each device module, and each FPC is electrically connected to the second terminal,

the FPCs are bonded to each other at non-connection surfaces of the device module.

(3) The present application may also be a display module having: a first device module including a first resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a first wiring connecting the first terminal and the second terminal formed on a surface thereof, a display panel having a first connection terminal and disposed on the one main surface of the first resin-molded circuit board, and a first bonding wire connecting the first terminal and the first connection terminal; and

a second device module having: a second resin-molded circuit board having a third terminal formed on one main surface side, a fourth terminal formed on the other main surface side, and a second wiring for connecting the third terminal and the fourth terminal formed on the surface, a functional module having a function different from that of the display panel and a second connection terminal and being disposed on the one main surface of the first resin-molded circuit board, and a second bonding wire for connecting the third terminal and the second connection terminal,

a first FPC is disposed on the other principal surface side of the first resin molded circuit board and electrically connected to the second terminal,

a second FPC is disposed on the other main surface side of the second resin molded circuit board and electrically connected to the fourth terminal,

and the non-connection surface of the first FPC and the first device module and the non-contact surface of the second FPC and the second device module are mutually bonded.

The present application may also be an electronic device including the display module described in (1) above, for example.

Drawings

Fig. 1 is a cross-sectional view showing a schematic configuration of an example of a display module according to a first embodiment.

Fig. 2 (a) is a plan view showing a schematic configuration of an example of the display module according to the first embodiment. Fig. 2 (B) is a bottom view showing a schematic configuration of an example of the display module according to the first embodiment.

Fig. 3 is a cross-sectional view showing a schematic configuration of an example of the display module according to the first embodiment.

Fig. 4 (a) is a partial perspective view showing an example of the first terminal, the connection terminal, and the wiring. Fig. 4 (B) is a partial perspective view showing an example of the second terminal and the wiring.

Fig. 5 (a) is a partial perspective view showing an example of the first terminal, the connection terminal, and the wiring. Fig. 5 (B) is a partial perspective view showing an example of the second terminal and the wiring.

Fig. 6 is a cross-sectional view showing a schematic configuration of an example of a display module according to a second embodiment.

Fig. 7 is a cross-sectional view showing a schematic configuration of an example of a display module according to a third embodiment.

Fig. 8 (a) and 8 (B) are cross-sectional views each showing a schematic configuration of an example of a display module according to the fourth embodiment.

Fig. 9 is a cross-sectional view showing a schematic configuration of an example of a display module according to a fifth embodiment.

Fig. 10 is a cross-sectional view showing a schematic configuration of an example of a display module according to a sixth embodiment.

Fig. 11 is a diagram for describing an embodiment of an electronic device assembled with a display module.

Fig. 12 is a diagram for describing an embodiment of an electronic device assembled with a display module.

Fig. 13 is a diagram for describing an embodiment of an electronic device assembled with a display module.

Detailed Description

An embodiment and the like according to the present application will be described below with reference to the drawings. It should be noted that the description will be made in the following order. In the present specification and the drawings, components having substantially the same functional configurations are denoted by the same reference numerals, and are not described again.

It should be noted that the description will be made in the following order.

1. Display module according to first embodiment

2. Display module according to second embodiment

3. Display module according to third embodiment

4. Display module according to fourth embodiment

5. Display module according to fifth embodiment

6. Display module according to fifth embodiment

7. Electronic device

The following description is a preferred specific example of the present application, and the content of the present application is not limited to these embodiments and the like.

[1. First embodiment ]

(display Module 1 a)

As shown in fig. 1, 2 (a), 2 (B), 3, and the like, the display module 1a includes a resin molded circuit board 2, a display panel 3, and bonding wires 4. Fig. 1, 2 (a), 2 (B), and 3 are diagrams showing an example of the structure of a display module 1a according to the first embodiment. Note that in fig. 2 (a) and 2 (B), the sealing portion 17, the bonding wire 4, and the reinforcing portion 21 are not described for convenience of description. This is also the same for fig. 4 (a), 4 (B), 5 (a) and 5 (B).

(display panel 3)

The display panel 3 has connection terminals 5 and an image display region R.

The display panel 3 has an element mounting substrate 6, and an image display region R is formed on the surface thereof. The element-mounting substrate 6 includes a substrate on the surface of which a plurality of organic EL elements having a structure in which a transparent display electrode, an organic EL layer, and a back electrode are laminated are arranged. The connection terminal 5 is electrically connected to each organic EL element. The organic EL element is energized via a three-dimensional wiring portion 12, a bonding wire 4, and a connection terminal 5, which will be described later. An image corresponding to the energized state of the organic EL element is displayed in the image display region R.

Examples of the substrate constituting the element mounting substrate 6 include a silicon substrate. The protective substrate 7 is laminated so as to cover the image display region R of the element mounting substrate 6. As the protective substrate 7, a glass substrate is preferably used.

In the first embodiment, the description has been given taking a case where the display panel 3 is an OLED (Organic Light Emitting Diode) display (Organic EL display) as an example. However, this does not constitute a limitation on the display panel 3. As examples of the display panel 3, in addition to the OLED display, an LCOS (Liquid crystal Silicon) display, an LED (Light Emitting Diode) display, and the like can be specifically cited. This is also the same for the second to sixth embodiments.

On the display panel 3, a plurality of connection terminals 5 are arranged along at least a part of the outer peripheral edge thereof.

In the examples of fig. 1 and fig. 2 (a), etc., the display panel 3 is formed in a rectangular shape when the display panel 3 is viewed from above, and the plurality of connection terminals 5 are arranged along two opposing sides of the rectangular shape. This does not prohibit the connection terminal 5 from being formed along any of one side, three sides, and four sides of the display panel 3, and the connection terminal 5 may be disposed along at least one side of the display panel 3 along the peripheral edge. The case where the display panel 3 is viewed from above is a case where a direction parallel to the thickness direction of the display panel 3 (the direction of arrow Z in fig. 1) is a line of sight direction.

In the example of fig. 2 (a), a frame portion 8 serving as a non-image display region is formed outside the image display region R along the outer peripheral edge of the display panel 3, and a plurality of connection terminals 5 are arranged on the frame portion 8. The connection terminal 5 shown in fig. 2 (a) has a pad 5a connected to the bonding wire 4 at the front end.

In the examples of fig. 2 (a) and 4 (a), the connection terminals 5 are arranged such that the pads 5a at the front ends are aligned in a row, but the arrangement of the connection terminals 5 is not limited. For example, as shown in fig. 5 (a), the connection terminals 5 may be arranged such that the pads 5a at the front ends are arranged in a staggered manner. When the arrangement of the pads 5a is staggered, it is possible to form a state in which the arrangement of the pads 5a forms a plurality of columns (two columns in the example of fig. 5 a).

(resin molded Circuit Board 2)

As shown in fig. 1, fig. 2a, fig. 2B, fig. 4a, fig. 4B, fig. 5a, fig. 5B, and the like, the resin-molded circuit board 2 has a first terminal 9 formed on one main surface 2a side, a second terminal 10 formed on the other main surface 2B side, and a wiring 11 connecting the first terminal 9 and the second terminal 10 formed on the surface. The first terminal 9, the second terminal 10, and the wiring 11 connecting these are combined to form a three-dimensional wiring portion 12. One connection terminal 5 corresponds to one three-dimensional wiring portion 12. In the examples of fig. 1, fig. 2 (a), fig. 2 (B), and the like, a plurality of three-dimensional wiring portions 12 are formed, and each three-dimensional wiring portion 12 is arranged at a position corresponding to each connection terminal 5.

The material of the first terminal 9, the second terminal 10, and the wiring 11 is not particularly limited, and copper, silver, gold, or the like can be used, for example.

(first terminal 9)

The first terminals 9 are formed outside the setting region of the display panel 3. In the example of fig. 1 and the like, the first terminal 9 is formed outside a recess 13 described later on the resin molded circuit board 2. The shape and size of the first terminal 9 are not particularly limited as long as the bonding wire 4 can be connected by wire bonding.

The first terminals 9 are formed in plurality corresponding to the connection terminals 5 of the display panel 3. The first terminals 9 are arranged in a configuration corresponding to the connection terminals 5 of the display panel 3. In the examples of fig. 1, 2 (a), 4 (a), and 5 (a), the first terminals 9 are arranged such that the first terminals 9 face the connection terminals 5 of the display panel 3.

In the example of fig. 2 (a), the first terminals 9 are disposed at positions facing the two opposing sides of the display panel 3 on the one main surface 2a of the resin-molded circuit board 2. However, this does not prohibit the first terminals 9 from being formed at positions opposing one side of the display panel 3. Similarly, the first terminals 9 are not prohibited from being formed at positions facing three or four sides of the display panel 3.

In the examples of fig. 2 (a) and 4 (a), the first terminals 9 are arranged in a row, but the arrangement of the first terminals 9 is not limited. For example, as shown in fig. 5 (a), the first terminals 9 may be arranged in a staggered manner. When the first terminals 9 are arranged in a staggered arrangement, the arrangement of the first terminals 9 can be formed in a plurality of rows (two rows in the example of fig. 5 a).

(second terminal 10)

A plurality of second terminals 10 are formed corresponding to the first terminals 9. In the examples of fig. 2 (B) and 4 (B), the second terminals 10 are aligned in a line when the display panel 3 is viewed from above, but the arrangement of the second terminals 10 is not limited. For example, as shown in fig. 5 (B), the second terminals 10 may be arranged in a staggered manner. When the second terminals 10 are arranged in a staggered arrangement, the arrangement of the second terminals 10 can be formed in a state of a plurality of columns (two columns in the example of fig. 5 a). The shape and size of the second terminal 10 are not particularly limited as long as a predetermined electronic component such as an FPC can be connected to the second terminal 10.

(Wiring 11)

As shown in examples of fig. 1, 3, 4 (a), 5 (a), and the like, the wiring 11 is formed on the end face 2c of the resin molded circuit substrate 2, and the end face 2c of the resin molded circuit substrate 2 is slit in the thickness direction thereof (in the arrow Z direction in fig. 1). In fig. 4 (a), the end portion of the wiring 11 on the side of the one main surface 2a extends from the end surface 2c of the resin-molded circuit board 2 on the main surface 2a toward the first terminal 9 and is connected to the first terminal 9, and the end portion of the wiring 11 on the side of the other main surface 2b is connected to the second terminal 10.

It should be noted that the wiring 11 is not limited to the above example, and may be formed on the surface of the resin molded circuit substrate 2 so that one end can be connected to the first terminal 9 and the other end can be connected to the second terminal 10. For example, the wiring 11 may have a structure shown in the examples of the wiring 11a in fig. 5 (a) and 5 (B) depending on the positions of the first terminal 9 and the second terminal 10. In the case of the example of fig. 5 (B), the wiring 11a is formed on the end face 2c of the resin molded circuit substrate 2. Further, of the ends of the wiring 11a, the end on the side of the one principal surface 2a extends from the end surface 2c of the resin-molded circuit board 2 on the one principal surface 2a toward the first terminal 9, and is connected to the first terminal 9. The end portion of the wiring 11a on the other main surface 2b side extends from the end surface 2c of the resin-molded circuit board 2 to the second terminal 10 on the other main surface 2b, and is connected to the second terminal 10.

As described above, the first terminals 9, the second terminals 10, and the wirings 11 forming the three-dimensional wiring portions 12 are formed along the surface of the resin-molded circuit substrate 2. As the resin-Molded circuit board 2 on which the three-dimensional wiring portion 12 is formed, an MID (Molded Interconnect Device) can be preferably used. Examples of the method for producing the MID include a primary molding method (One-Shot method) and a secondary molding method (Two-Shot method). By using such a method, a substrate in which a circuit structure corresponding to the three-dimensional wiring portion 12 is formed along the surface of the resin molded plate by injection molding can be manufactured. This substrate is a resin molded circuit board 2.

By forming the three-dimensional wiring portion 12 on the surface of the resin molded circuit board 2, the wiring 11 connecting the two terminals (the first terminal 9 and the second terminal 10) formed on the different

main surfaces

2a and 2b can be arranged so as to avoid the inside of the board on which the display panel 3 can be mounted. Therefore, it is made possible to simultaneously suppress the formation of the through hole and the generation of the parasitic capacitance, and to provide the second terminal 10 as the connection portion with the FPC or the like on the other principal surface side (the non-provision surface side of the display panel 3).

The element mounting substrate 6 of the display panel 3 is fixed to the resin molded circuit board 2. The fixed position of the element mounting substrate 6 is determined on the one principal surface 2a side of the resin molded circuit substrate 2 so that the first terminals 9 and the connection terminals 5 are in a predetermined positional relationship with each other.

The method of fixing the bottom surface of the element-mounting substrate 6 to the one principal surface 2a side of the resin molded circuit substrate 2 is not particularly limited, but in the example of fig. 1, the element-mounting substrate 6 and the resin molded circuit substrate 2 are fixed by an adhesive layer 16 made of die bond paste. The die bond adhesive is not particularly limited as long as it is an adhesive that can bond the element mounting substrate 6 of the display panel 3 to the resin-molded circuit board 2.

(concave part 13)

The resin-molded circuit board 2 shown in the example of fig. 1 and 3 has a recess 13 having a bottom surface 14 and a wall portion 15 formed on the first terminal formation surface side (the side of the first main surface 2 a). The resin-molded circuit board 2 is formed in a stepped shape by the concave portion 13 and an outer portion of the concave portion 13. The recess 13 may be formed in a recessed shape in which the wall 15 is formed so as to surround the entire periphery of the bottom surface 14, or may be formed in a groove shape.

In the display module 1a according to the first embodiment, the display panel 3 is disposed on the resin-molded circuit board 2 with the bottom surface of the element-mounting board 6 facing the concave portion 13 of the resin-molded circuit board 2.

In the example of fig. 1 and 3, in a state where the display panel 3 is fixed to the resin molded circuit board 2, a gap is formed between the wall portion 15 of the resin molded circuit board 2 and the end face of the display panel 3, the gap is filled with a sealing resin described later, and a part of the sealing portion 17 is formed in the gap. The display module 1a is not limited to this example, and a gap may not be formed.

In the display module 1a, in a state where the display panel 3 is fixed to the resin molded circuit board 2, it is preferable that the position of the surface of the first terminal 9 (position P2 in fig. 1 and 3) is higher than the position of the back surface of the element mounting substrate 6 of the display panel 3 (position P1 in fig. 1 and 3) with respect to the position in the height direction with respect to the bottom surface (the other main surface 2 b) of the resin molded circuit board 2. In this case, as shown in fig. 1, the distance from the connection terminal 5 of the display panel 3 to the first terminal 9 can be made closer, and the length of the bonding wire 4 can be made shorter. Further, although the bonding wires 4 are sealed by the sealing portion 17 described later, according to the display module 1a, the amount of sealing resin used to form the sealing portion 17 can be reduced. The height represents a height in a case where the thickness direction of the resin molded circuit board 2 (the direction of arrow Z in fig. 1 and 3) is the vertical direction.

(bonding wire 4)

The first terminal 9 and the connection terminal 5 are connected by a wire bonding method (wire bonding connection) by the bonding wire 4. The material of the bonding wire 4 is not particularly limited, and gold, silver, aluminum, or the like can be used. The wire bonding method is not particularly limited, and for example, wedge bonding, ball bonding, or the like can be used. In the example of fig. 1, a ball portion 4a is formed at a connection end on the connection terminal 5 side and a wedge portion 4b is formed at a connection end on the first terminal 9 side on the bonding wire 4 by a wire bonding method.

In the display module 1a, the bonding wires 4 are sealed with a sealing resin such as an epoxy resin in a state where the first terminals 9 and the connection terminals 5 are joined. At this time, the portion sealed by the sealing resin forms the sealing portion 17. The sealing portion 17 can restrict the bonding wire 4 from being exposed to the outside, and can protect the bonding wire 4.

The example of fig. 1 is an example in which the display module 1a is not connected to a Flexible Printed Circuit (FPC) 18 (to be described later). Such a display module 1a can use the second terminal 10 as a terminal of LGA (Land Grid Array). In this case, the display module 1a can be specifically used by being mounted on an electronic component having a socket corresponding to the LGA, for example. In addition, the display module 1a is less likely to change in shape according to the shape of the FPC, and is easy to unify the shapes of the components.

As shown in the example of fig. 3, the display module 1a may also be provided with an FPC18. The FPC18 may be connected to the display module of the second embodiment and the display module of the fourth embodiment, or the FPC18 may not be connected to the display module.

(FPC18)

In the display module 1a shown in fig. 3, a Flexible Printed circuit board (FPC) 18 is electrically connected to the second terminals 10. The connection method of the FPC18 and the second terminal 10 is not particularly limited. A connection terminal electrically connected to a circuit of the FPC18 is formed on the surface of the FPC18. In the example of fig. 3, a conductive protrusion (bump 19) is formed as a connection terminal. The bump 19 and the second terminal 10 are electrically connected, so that the FPC18 and the second terminal 10 are electrically connected. An example of a method for connecting the bump 19 and the second terminal 10 is a method using an Anisotropic Conductive Film (ACF) 20 formed of a resin Film containing Conductive particles. The method can be carried out, for example, as follows. The other main surface 2b is opposed to the formation surface of the bumps 19 of the FPC18 so that the FPC18 is opposed to the second terminals 10 of the resin molded circuit substrate 2, and the ACF20 is interposed between the other main surface 2b and the formation surface of the bumps 19 of the FPC18. At this time, the resin molded circuit board 2 and the FPC18 are faced to the second terminal 10 through the ACF20 and the bump 19. Then, the resin molded circuit substrate 2, the ACF20, and the FPC18 are pressure-bonded, so that the second terminals 10 and the bumps 19 are electrically connected through the conductive particles contained in the ACF 20. Among the bumps 19 of the FPC18, bumps 19a formed at predetermined positions other than the connection region with the resin molded circuit board 2 are electrically connected to a driver board (not shown) which is a main board for controlling the driving of the display module 1a and the like.

(reinforcing part 21)

In the display module 1a, it is preferable that at least the end face 2c of the resin-molded circuit board 2 is covered with a resin to form the reinforcing portion 21. When the reinforcing portion 21 is formed, the wiring 11 can be restricted from being exposed to the outside, and the wiring 11 can be protected.

In the display module 1a according to the first embodiment, the second terminals 10 are provided on the second main surface 2b side of the resin molded circuit board 2 such that the region for connecting the FPC18 is formed on the non-installation surface side (the second main surface 2b side) of the display panel 3, and even if the area of the terminal connection region for connecting the second terminals 10 and the FPC18 is increased, the area of the terminal connection region can be secured while the image display region R is secured. Therefore, according to the display module 1a, it is possible to suppress restriction of the image display region R due to an increase in the area of the terminal connection region.

In addition, according to the display module 1a, since the second terminals 10 are formed on the side of the

principal surface

2a, 2b of the resin molded circuit board 2 other than the side where the display panel 3 is provided, the display module 1a can be downsized. Further, since the display module 1a includes the three-dimensional wiring portion 12 formed along the surface of the resin-molded circuit board 2, a process of forming a through hole for connecting the first terminal 9 and the second terminal 10 can be omitted, and parasitic capacitance can be suppressed.

[2. Second embodiment ]

Although the resin-molded circuit board 2 is formed in a stepped shape in the display module 1a according to the first embodiment, the resin-molded circuit board 2 may have a flat plate shape as shown in the display module 1b of the example of fig. 6 (second embodiment). This can be achieved by avoiding the formation of the recess 13 in the resin-molded circuit substrate 2. Fig. 6 is a sectional view for describing a display module 1b of the second embodiment.

In the display module 1b according to the second embodiment, the resin-molded circuit board 2 has a flat plate shape, and in a state where the display panel 3 is disposed on the resin-molded circuit board 2, the position of the front surface of the first terminal 9 (position P2 in fig. 6) is located at substantially the same height as the position of the back surface of the element-mounting substrate 6 of the display panel 3 (position P1 in fig. 6) with respect to the position in the height direction with respect to the other main surface 2b of the resin-molded circuit board 2 as a reference. The substantial identity referred to herein includes the completely identical case and the substantially identical case. According to the display module 1b, the three-dimensional structure of the resin molded circuit board 2 can be simplified, and the manufacturing cost can be further reduced.

[3 ] third embodiment ]

In the display module 1a according to the first embodiment, the FPC18 is electrically connected to the second terminals 10 of the resin molded circuit board 2 at predetermined positions, and the driving board is connected to the terminals by the bumps 19a formed at predetermined positions other than the connection region with the resin molded circuit board 2. That is, as shown in the example of the display module 1c of fig. 7, other electronic components or integrated circuits of the display module may be connected to the FPC18 (third embodiment). In the description of the third embodiment, these "other electronic components or integrated circuits of the display module" are referred to as FPC mounting components 22.

Examples of the FPC mounting member 22 include a microcomputer, a Display Driver IC (Display Integrated Circuits; DDIC), a chip Capacitor (CR), a Timing Controller (TCON), and the like. The FPC mounting member 22 is preferably an electronic component or an integrated circuit mounted on the driving board. In this case, the degree of freedom in designing the wiring of the driver board and the degree of freedom in designing the arrangement of the FPC mounting member 22 are improved, and the miniaturization of the driver board and the miniaturization of the electronic device to which the driver board is mounted are facilitated.

In the display module 1c according to the third embodiment, the surface of the FPC18 to which the FPC mounting member 22 is connected and the surface to which the resin molded circuit board 2 is connected (which may be referred to as a connection surface or a front surface) may be the same or different from each other, but as shown in the example of fig. 7, the FPC mounting member 22 is preferably connected to the surface opposite to the surface to which the resin molded circuit board 2 is connected (which may be referred to as a non-connection surface or a back surface). The FPC mounting member 22 is mounted on the rear surface of the FPC18, so that the display module 1c can be effectively downsized, and it is easy to further effectively downsize an electronic device or the like on which the display module 1c is mounted.

[4. Fourth embodiment ]

As shown in the example of the display module 1d in fig. 8 a and 8B, a configuration may be employed in which the resin-molded circuit board 2 has a recess 13 formed in a stepped shape, and a dust-proof panel 23 is provided on the one principal surface 2a side of the resin-molded circuit board 2 so as to cover the image display region R of the display panel 3 (fourth embodiment).

The dust-proof panel 23 may be, for example, a translucent substrate such as a glass substrate having a size capable of covering the recess 13 of the resin molded circuit board 2.

The dust-proof panel 23 is provided on the resin molded circuit board 2 by a fixing seal portion 24 formed of a fixing seal material, for example. As the fixing sealing material, a resin having adhesiveness to both the resin molded circuit board 2 and the dust-proof panel 23 can be preferably used.

The depth of the recess 13 of the resin-molded circuit board 2 (the difference in height between the outer peripheral portion of the recess 13 and the bottom surface 14 of the recess 13) is not particularly limited, but is preferably equal to or greater than the thickness of the display panel 3 in order to more reliably provide the dust-proof panel 23 to the resin-molded circuit board 2. From the viewpoint of sealing the space in the recessed portion 13 without a gap by the fixing seal portion 24, the dust-proof panel 23, and the resin molded circuit board 2, the recessed portion 13 is preferably formed in a recessed shape in which the wall portion 15 is formed so as to surround the entire periphery of the bottom surface 14.

In the display module 1d according to the fourth embodiment, it is preferable that the sealing resin for protecting the bonding wires 4 also serves as the fixing sealing material, from the viewpoint of simplifying the structure of the display module 1 d. Specifically, for example, a sealing resin is provided so as to seal the bonding wire 4 and surround the entire periphery of the recess 13, and the dust-proof panel 23 is disposed and fixed on the sealing resin. At this time, as shown in fig. 8 (a) and 8 (B), the seal portion 17 also serves as the fixed seal portion 24.

According to the display module 1d of the fourth embodiment, since the dust-proof panel 23 is provided, the display module can function to enclose the components of the display panel 3 by the combined structure of the dust-proof panel 23 and the resin-molded circuit board 2.

In the example of fig. 8 (a), the protective substrate 7 is provided on the display panel 3, but in the display module 1d according to the fourth embodiment, as shown in fig. 8 (B), the protective substrate 7 may not be provided on the element mounting substrate 6 surface of the display panel 3. In this case, the dust-proof panel 23 also functions as the protective substrate 7 of the display panel 3 on the resin-molded circuit board 2.

[5. Fifth embodiment ]

As shown in the example of the display module 1e in fig. 9, the structure may be such that two device modules (a first device module 25a and a second device module 25 b) are provided and two

FPCs

18 and 18 are further provided (fifth embodiment).

The device modules (the first device module 25a and the second device module 25 b) to which the FPC18 is connected have the same configuration as the display module 1a according to the first embodiment to which the FPC18 is connected.

That is, the first device block 25a and the second device block 25b each have: a resin-molded circuit board 2 having a first terminal 9 formed on one main surface 2a side, a second terminal 10 formed on the other main surface 2b side, and a wiring 11 formed on the surface to connect the first terminal 9 and the second terminal 10; a display panel 3 having a connection terminal 5; and a bonding wire 4 connecting the first terminal 9 and the connection terminal 5.

In addition, the first device module 25a and the second device module 25b are electrically connected to FPCs 18 at the second terminals 10, respectively. The method of connecting the second terminal 10 to the FPC18 is the same as the first embodiment.

In the display module 1e, a three-dimensional wiring portion 12 is formed by the first terminals 9, the second terminals 10, and the wirings 11, and the three-dimensional wiring portion 12 is formed along the surface of the resin-molded circuit substrate 2. As the resin molded circuit board 2 on which the three-dimensional wiring portion 12 is formed, MID can be preferably used as in the first embodiment.

The

FPCs

18, 18 connected to the respective device modules of the first device module 25a and the second device module 25b are bonded to each other at predetermined positions of a non-connection surface (rear surface) of the device module 25. The method of bonding the

FPCs

18, 18 is not particularly limited. In the example of fig. 9, the connection is made by an adhesive layer 39 formed of an adhesive.

According to the display module 1e of the fifth embodiment, a two-sided integrated module structure in which the display panel 3 is arranged on both sides of the FPC18 can be realized. In the display module 1e, the second terminals 10 are positioned on the second main surface 2b side of the resin-molded circuit board 2, and therefore the entire structure of the double-sided integrated module can be downsized. In addition, a VR (Virtual Reality) lens may be formed using the display module 1 e.

[6 ] sixth embodiment ]

Although the fifth embodiment described above includes two device modules (the first device module 25a and the second device module 25 b) each including the display panel 3, as shown in an example of a display module 1f in fig. 10, a function module 26 described later may be provided instead of the display panel 3 of the second device module 25b according to the fifth embodiment (sixth embodiment).

The display module 1f has a first device module 25c and a second device module 25d as device modules.

(first device Module 25 c)

The first device module 25c includes a first resin molded circuit board 27, a first bonding wire 28, and a display panel 35. The same components as the resin molded circuit board 2, the bonding wires 4, and the display panel 3 of the first device module 25a according to the fifth embodiment are used as the first resin molded circuit board 27, the first bonding wires 28, and the display panel 35.

That is, in the first device module 25c, the first resin molded circuit board 27 has the first terminal 31 formed on the first main surface 27a side, the second terminal 32 formed on the second main surface 27b side, and the first wiring 33 connecting the first terminal 31 and the second terminal 32 formed on the front surface. The first terminals 31, the second terminals 32, and the first wiring 33 form a three-dimensional wiring portion 34. As the first resin molded circuit board 27 on which the three-dimensional wiring portion 34 is formed, MID can be preferably used as in the fifth embodiment.

As shown in fig. 10, the display panel 35 has the first connection terminal 36, is disposed on the one principal surface 27a of the first resin-molded circuit board 27, and is fixed to the first resin-molded circuit board 27 by the adhesive layer 40, as in the fifth embodiment. In fig. 10,

reference numerals

52 and 53 denote an element mounting substrate and a protection substrate.

As in the fifth embodiment, the first bonding wire 28 is wire-bonded to the first terminal 31 and the first connection terminal 36, and is sealed by a sealing portion 47 made of a sealing resin.

On the other main surface 27b side of the first resin molded circuit board 27, a first FPC37 is electrically connected to the second terminals 32 of the first device module 25 c. The first FPC37 is the same FPC as the FPC18 described above. A method of connecting the second terminals 32 to the first FPC37 may be the same as the fifth embodiment. In the example of fig. 10, the second terminals 32 are connected with the bumps 55 of the first FPC37 through the ACF 54.

(second device Module 25 d)

The second device module 25d includes a second resin molded circuit board 29, a second bonding wire 30, and a functional module 26. The same components as those of the resin molded circuit board 2 and the bonding wires 4 of the second device module 25b according to the fifth embodiment are used as the second resin molded circuit board 29 and the second bonding wires 30.

In the second device module 25d, the second resin molded circuit board 29 has a third terminal 41 formed on the first main surface 29a side, a fourth terminal 42 formed on the second main surface 29b side, and a second wiring 43 connecting the third terminal 41 and the fourth terminal 42 formed on the front surface. Note that the three-dimensional wiring portion 44 is formed by the third terminal 41, the fourth terminal 42, and the second wiring 43. As the second resin molded circuit board 29 on which the three-dimensional wiring portion 44 is formed, MID can be preferably used as in the case of the resin molded circuit board 2 of the fifth embodiment.

The functional module 26 is a module in which an electronic circuit that performs a function other than the display panel 3 is mounted. As the functional module 26, an image sensor or the like may be specifically exemplified. As the image sensor, a CMOS (complementary metal-oxide-semiconductor) image sensor or the like can be given. For example, the CMOS image sensor has a configuration in which a plurality of image pickup elements are arranged in a sensor region positioned on a substrate, and the image pickup elements are electrically connected to second connection terminals 38 described later.

The functional module 26 has a second connection terminal 38, is disposed on the one main surface 29a of the second resin-molded circuit board 29, and is fixed to the second resin-molded circuit board 29 by an adhesive layer 45. The second connection terminals 38 of the functional modules 26 preferably have the same configuration as the connection terminals 5 of the display panel 3 described above, and have a layout pattern so that the second resin-molded circuit board 29 and the first resin-molded circuit board 27 can be shared.

As in the fifth embodiment, the second bonding wire 30 is used to wire-bond and connect the third terminal 41 and the second connection terminal 38, and is sealed by a sealing portion 48 made of a sealing resin.

On the other main surface 29b side of the second resin molded circuit substrate 29, a second FPC46 is electrically connected to the fourth terminals 42 of the second device module 25 d. The second FPC46 uses the same FPC as the FPC18 described above. A method of connecting the fourth terminal 42 and the second FPC46 may be the same as the method of connecting the second terminal 10 and the FPC18 in the fifth embodiment. In the example of fig. 10, the fourth terminals 42 are connected with the bumps 56 of the second FPC46 through the ACF 54.

In the display module 1f, the non-connection surface (back surface) of the first device module 25c and the non-connection surface (back surface) of the second device module 25d are bonded to each other on the surfaces of the first FPC 37. The method of bonding the first FPC37 and the second FPC46 is not particularly limited. In the example of fig. 10, the connection is made by an adhesive layer 51 formed of an adhesive.

In the display module 1f, it is preferable that at least the end surface of the first resin-molded circuit board 27 and the end surface of the second resin-molded circuit board 29 are covered with a resin to form the reinforcing

portions

49 and 50, from the viewpoint of protecting the first wiring lines 33 and the second wiring lines 43, as in the first to fifth embodiments.

According to the display module 1f of the sixth embodiment, as in the fifth embodiment, a double-sided integrated module structure in which display panels are arranged on both sides of an FPC can be realized, and it is easy to miniaturize the entire double-sided integrated module structure. In addition, an AR (Augmented Reality) lens can be formed by using the display module 1 f.

[7. Electronic Equipment ]

The display module according to any of the above embodiments can be incorporated into various electronic devices as a micro display module, for example. The display device is particularly suitable for a small display device which requires high resolution and is used for enlarging near the eye, such as an electronic viewfinder or a head-mounted display device of a video camera or a single lens reflex camera.

(concrete example 1)

Fig. 11 (a) and 11 (B) show an example of the external appearance of the digital still camera 310. The digital still camera 310 is of an interchangeable lens single lens reflex type, and includes an interchangeable photographing lens unit (interchangeable lens) 312 at substantially the center of the front of a camera body (camera body) 311, and a grip portion 313 on the left side of the front for a photographer to grip.

A monitor 314 is provided at a position shifted to the left from the center of the back surface of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided on the upper portion of the monitor 314. The photographer can visually recognize an optical image of the subject introduced from the photographing lens unit 312 by looking into the electronic viewfinder 315 to determine the composition. The display module according to any of the embodiments described above can be incorporated in the electronic viewfinder 315. This enables the digital still camera 310 to be further miniaturized.

(concrete example 2)

Fig. 12 shows an example of the appearance of the head mounted display 320. The head-mounted display 320 has, for example, ear loops 322 on both sides of a glasses-shaped display section 321 for wearing on the head of a user. The display module according to any of the above embodiments can be assembled as the display unit 321. When the display module 1e of the fifth embodiment is incorporated in the display unit 321 as described above, the head-mounted display 320 may be used as VR glasses, and when the display module 1f of the sixth embodiment is incorporated in the display unit 321, the head-mounted display 320 may be used as AR glasses. By incorporating the display module according to any of the above embodiments in the head-mounted display 320, the head-mounted display 320 can be further downsized.

For example, when the head-mounted display 320 is used as VR (Virtual Reality) glasses, the head-mounted display 320 is configured as follows as shown by VR glasses 320a in fig. 13: the display module 1e is disposed at the center, the mirrors 400 are provided on the left and right sides, and an image reflected on the display panel 3 advances in the direction of the arrow L1 and is reflected in the direction of the arrow L2 by the mirrors 400 to enter the eyes of the user U. Fig. 13 is a schematic diagram for schematically describing one example of VR glasses. In the example of the VR glasses 320a in fig. 13, the mirror 400 is used to transmit an image to the eyes of the user U, but a half mirror type prism may be provided instead of the mirror 400 or may be used together with the mirror 400.

While the embodiments of the present application and examples of electronic devices to which the embodiments are applied have been described in detail above, the present application is not limited to the embodiments and examples of electronic devices to which the embodiments are applied, and various modifications can be made based on the technical ideas of the present application.

For example, the configurations, methods, steps, shapes, materials, numerical values, and the like listed in the above embodiments and examples of electronic devices to which the embodiments are applied are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, and the like may be used as necessary.

In addition, the configurations, methods, steps, shapes, materials, numerical values, and the like recited in the above embodiments and examples of electronic devices to which the embodiments are applied may be combined with each other without departing from the gist of the present application.

The materials exemplified in the above embodiments may be used singly or in combination of two or more kinds unless otherwise specified.

It should be noted that the contents of the present invention should not be interpreted as being limited to the effects exemplified in the present application.

The present application may adopt the following configurations.

(1) A display module having: a resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal;

and a bonding wire connecting the first terminal and the connection terminal.

(2) The display module according to the above (1), wherein an FPC is arranged on the other main surface side of the resin molded circuit board, and the FPC is electrically connected to the second terminals.

(3) The display module according to the above (1), wherein the second terminal is a terminal of an LGA (land grid array).

(4) A display module having two device modules, the device modules having: a resin molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal; a display panel having a connection terminal and disposed on the one main surface of the resin molded circuit board; and a bonding wire connecting the first terminal and the connection terminal,

(5) A display module having: a first device module including a first resin molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a first wire connecting the first terminal and the second terminal formed on a surface thereof, a display panel, and a first bonding wire; the display panel has a first connection terminal and is disposed on the one main surface of the first resin-molded circuit board, and the first bonding wire connects the first terminal and the first connection terminal; and

a second device module including a second resin molded circuit board having a third terminal formed on one main surface side, a fourth terminal formed on the other main surface side, and a second wiring formed on a surface thereof to connect the third terminal and the fourth terminal, a functional module having a function different from that of the display panel and a second connection terminal and being disposed on the one main surface of the second resin molded circuit board, and a second bonding wire connecting the third terminal and the second connection terminal,

in the first device module, a first FPC is arranged on the other main surface side of the first resin molded circuit board and electrically connected to the second terminal,

in the second device module, a second FPC is disposed on the other main surface side of the second resin molded circuit board and electrically connected to the fourth terminal,

the non-connection surface of the first FPC with the first device module and the non-contact surface of the second FPC with the second device module are bonded to each other.

(6) The display module according to any one of the above (1) to (5), wherein the resin-molded circuit substrate has a stepped shape,

the first terminal is formed at a position higher than a mounting surface of the display panel.

(7) The display module according to any one of the above (1) to (5), wherein the resin-molded circuit substrate has a flat plate shape,

the first terminal is formed at a position having the same height as a mounting surface of the display panel.

(8) The display module according to the above (6), wherein the first resin-molded circuit substrate has a stepped shape,

(9) The display module according to the above (6), wherein the first resin-molded circuit substrate has a flat plate shape,

(10) The display module according to any one of (1) to (9), wherein the display panel is any one of an OLED display, an LCOS display, and an LED display.

(11) The display module according to any one of the above (1) to (5), wherein a plurality of connection terminals are arranged along at least one side of an outer peripheral edge of the display panel,

a plurality of three-dimensional wiring portions formed of the first terminals, the second terminals, and the wiring are formed on the resin-molded circuit board, and each three-dimensional wiring portion is arranged at a position corresponding to each of the connection terminals.

(12) The display module according to the above (6), wherein a plurality of first connection terminals are arranged along at least one side of a peripheral edge of the display panel,

a plurality of three-dimensional wiring portions formed of the first terminals, the second terminals, and the first wirings are formed on the first resin-molded circuit board, and each three-dimensional wiring portion is arranged at a position corresponding to each of the first connection terminals.

(13) The display module according to any one of the above (1) to (5), wherein the first terminals are formed in plural numbers, and are arranged in a row or in a staggered manner.

(14) The display module according to any one of the above (1) to (17), wherein the second terminals are arranged in a row or in a staggered shape.

(15) An electronic device comprising the display module according to any one of (1) to (17) above.

Description of the reference numerals

1a, 1b, 1c, 1d, 1e, 1f 8230; 2 8230the resin molded circuit substrate; 2a, 2b 8230a major face; 3 \ 8230, a display panel; 4 \ 8230and bonding wire; 5 \ 8230and a connecting terminal; 5a 8230and a bonding pad; 6 \ 8230and a device mounting substrate; 7\8230, protecting the substrate; 8 \ 8230and a frame edge part; 9\8230afirst terminal; 10, 8230, a second terminal; 11\8230andwiring; 12 \ 8230and a three-dimensional wiring part; 13 \ 8230and a concave part; 14\8230abottom surface; 15 \ 8230and a wall part; 16 \ 8230and adhesive layer; 17\8230jsealing part; 18 \ 8230and FPC; 19. 19a 8230and bump; 20 \ 8230; 21 \ 8230and a reinforcing part; 22 \ 8230and FPC mounting parts; 23 \ 8230and dustproof panel; 24 \ 8230and fixing the sealing part; 25a, 25c 8230a first device module; 25b, 25d 8230a second device module; 26 8230and a functional module; 27\8230firstresin molded circuit substrate; 27a, 27b 8230a major face; 28 \ 8230and a first bonding wire; 29 method 8230, molding a circuit substrate with a second resin; 29a, 29b 8230a major face; 30 \ 8230and a second bonding wire; 31, 8230, a first terminal; 32 \ 8230and a second terminal; 33\8230afirst wiring; 34 \ 8230and a three-dimensional wiring part; 35 \ 8230and a display panel; 36 \ 8230and a first connecting terminal; 37 \ 8230and a first FPC;38 \ 8230and a second connecting terminal; 39\8230abonding layer; 40 \ 8230and adhesive layer; 41, 8230a third terminal; 42 \ 8230and a fourth terminal; 43 \ 8230and a second wiring; 44 8230and a three-dimensional wiring part; 45, 8230and an adhesive layer; 46 \ 8230and a second FPC; 47. 48 \ 8230and a sealing part; 49. 50 8230and a reinforcing part; 51 \ 8230and adhesive layer; 52 \ 8230and a device mounting substrate; 53 \ 8230a glass substrate; 54 8230; 55. 56 \ 8230and convex block.

Claims

1. A display module having:

a resin molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal;

and a bonding wire connecting the first terminal and the connection terminal.

2. The display module of claim 1,

an FPC is arranged on the other main surface side of the resin molded circuit board, and the FPC is electrically connected to the second terminal.

3. The display module of claim 1,

the second terminal is a terminal of an LGA (land grid array).

4. A display module having:

two device modules, the device modules having: a resin-molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a wiring formed on a surface thereof to connect the first terminal and the second terminal; a display panel having a connection terminal and disposed on the one principal surface of the resin molded circuit board; and

a bonding wire connecting the first terminal and the connection terminal,

5. A display module having:

a first device module including a first resin molded circuit board having a first terminal formed on one main surface side, a second terminal formed on the other main surface side, and a first wiring for connecting the first terminal and the second terminal formed on a surface thereof, a display panel having a first connection terminal and disposed on the one main surface of the first resin molded circuit board, and a first bonding wire for connecting the first terminal and the first connection terminal; and

a first FPC is arranged on the other main surface side of the first resin molded circuit board and electrically connected to the second terminal,

6. The display module of claim 1,

the resin-molded circuit board has a stepped shape,

7. The display module of claim 1,

the resin-molded circuit board has a flat plate shape,

8. The display module of claim 1,

the display panel is any one of an OLED display, an LCOS display, and an LED display.

9. The display module of claim 1,

a plurality of the connection terminals are arranged along at least one side of an outer peripheral edge of the display panel,

a plurality of three-dimensional wiring portions each including the first terminal, the second terminal, and the wiring are formed on the resin-molded circuit board, and each of the three-dimensional wiring portions is arranged at a position corresponding to each of the connection terminals.

10. The display module of claim 1,

the first terminals are formed in plural, and arranged in a row or in a staggered manner.

11. The display module of claim 1,

the second terminals are formed in plural, and arranged in a row or in a staggered manner.

12. An electronic device provided with the display module according to claim 1.