JPH05115435A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To provide the solid-state image pickup device being small in size and having high reliability, in which a solid-state image pickup element and a substrate are connected stably. CONSTITUTION:A pad part is formed on two opposed sides of the photodetecting surface of a solid-state image pickup element 1, an inner lead 3 of a substrate 2-1 on which an IC 5 for constituting a peripheral circuit is mounted and the pad part are connected through a metallic projection 4, and in the same way, an inner lead 3 of a substrate 2-2 on which chip parts 6 are mounted and the pad part are connected through the metallic projection 4. Subsequently, between the side face of the solid-state image pickup element 1 and the substrates 2-1, 2-2, the substrates 2-1, 2-2 are bent in the direction of the opposite side to the photodetecting surface through an insulating plate 9. To a photodetecting part of the solid-state image pickup element 1, optical parts 7 are stuck with a transparent adhesive agent 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact and highly reliable solid-state image pickup device arranged in a minute portion such as a tip portion of an electronic endoscope.

[0002]

2. Description of the Related Art Conventionally, a solid-state image pickup device arranged in a minute portion such as a tip portion of an electronic endoscope is constructed as shown in FIG. That is, the solid-state imaging device 101 has a pad portion on one side of the light receiving surface, and the non-light receiving surface side has a cross section L.
The solid-state image sensor is fixed to the character-shaped insulating plate 102 by die bonding.
An optical member 103 such as a color filter or glass is adhered to the light receiving area of 101 with a transparent adhesive 104. Then, the inner lead portion 106 of the TAB substrate 105 on which the IC 108 constituting the peripheral circuit of the solid-state imaging device 101 and the chip component 109 are mounted is bonded to the pad portion of the solid-state imaging device 101 via the metal protrusion 107. Next, the substrate 105 is bent in the direction opposite to the light receiving surface of the solid-state image pickup device 101, and the periphery of the optical member 103, the mounting portion of the IC 108, and the like are protected by the light-shielding resin 110.
Then, the substrate 105 is bent into a U shape to form a solid-state imaging device.

[0003]

By the way, in the above-mentioned conventional solid-state image pickup device, since the substrate is connected only to one side of the solid-state image pickup element, it is difficult to make a stable connection at the time of bonding. As the size is reduced, electronic components such as capacitors, resistors, and ICs forming the signal line of the solid-state image pickup device and peripheral circuits must be mounted on one board, which causes a space limitation and reduces the size. Is limited. In addition, since the substrate is formed by bending several parts, disconnection of the wiring pattern is likely to occur, and there is a problem in reliability.

The present invention has been made in order to solve the above problems in the conventional solid-state image pickup device, and an object of the present invention is to provide a small-sized and highly reliable solid-state image pickup device in which stable connection is performed.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention has a pad portion formed on two or more sides of a light receiving surface of a solid-state image pickup element, and an electronic component for a peripheral circuit of the solid-state image pickup element. At least two or more independent boards mounted with are connected to the pad portion of the solid-state imaging device via the protruding electrodes, and the two or more substrates are respectively bent in the direction opposite to the light-receiving surface of the solid-state imaging device. To form a solid-state imaging device.

In the solid-state image pickup device constructed as described above, since two or more substrates are connected to at least two sides of the light-receiving surface of the solid-state image pickup device, stable connection can be achieved, and even if the device is downsized, it is mounted. You can take enough space. Further, since two or more substrates are used, it is possible to form the signal lines directly led from the solid-state image sensor to the outside and the signal lines to the capacitors, resistors, ICs and the like which form the peripheral circuits on separate substrates. Therefore, noise such as crosstalk can be prevented from occurring. Further, since the substrate is bent only at one place in the peripheral portion of the solid-state image sensor, it is easy to manufacture and the reliability can be improved.

[0007]

EXAMPLES Next, examples will be described. FIG. 1 is a sectional view showing a first embodiment of a solid-state image pickup device according to the present invention. In the figure, reference numeral 1 is a solid-state image sensor, and pad portions are formed on two opposite sides of its light-receiving surface. Then, the substrate 2-1 on which the IC 5 constituting the peripheral circuit of the solid-state image sensor 1 is mounted
The inner lead 3 and the pad portion of the solid-state image sensor 1
For example, metal protrusions 4 made of Au, Ag, Cu, In, solder, etc.
Are connected by thermocompression bonding, ultrasonic thermocompression bonding, ultrasonic waves, laser, etc. The metal protrusion 4 may be formed on both the solid-state imaging device 1 and the inner lead 3, or on either one of them. Similarly, the inner lead 3 of the substrate 2-2 on which the chip components 6 such as capacitors and resistors forming the peripheral circuit are mounted and the pad portion of the solid-state imaging device 1 are connected via the metal projection 4.

An optical component 7 such as a color filter, a prism or a glass plate is adhered to the light receiving portion of the solid-state image pickup device 1 with a transparent adhesive 8. As the transparent adhesive 8, any type can be used as long as it is a type that is cured with a photocurable resin such as an ultraviolet curable type or a visible light curable type, or a thermosetting type resin, or a combination thereof. Next, the side surface of the solid-state imaging device 1 on the side where the pad portion is formed, or the substrate 2 facing the side surface of the solid-state imaging device 1 when the substrates 2-1 and 2-2 are bent.
Insulating plates 9 and 9 are adhered to the parts -1 and 2-2 to form the substrates 2-1 and 2
Bend -2 in the direction opposite to the light receiving surface of the solid-state image sensor 1,
A light-shielding resin 10 such as an epoxy resin or a silicon resin seals the bent portion of the substrate, the peripheral portion of the optical component 7, and the mounting portion of the electronic component such as the IC 5 to form a solid-state imaging device.

FIG. 2 is a sectional view showing a second embodiment of the present invention, and the same or corresponding members as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals. In this embodiment, double-sided pattern substrates 11-1 and 11-2 are used as the two substrates connected to the solid-state image pickup device 1, and thus, the electronic components of the peripheral circuit of the solid-state image pickup device are formed. The mounting space can be widened.

FIG. 3 is a sectional view showing a main part of a third embodiment of the present invention. Similarly, the same or corresponding members as those of the first embodiment shown in FIG. There is. In this embodiment, a concave insulating plate 21 is used as an insulating plate between the solid-state image sensor 1 and the substrates 2-1 and 2-2, and the solid-state image sensor 1 is mounted in the recess. Is. With this configuration, it is possible to simultaneously insulate the solid-state imaging device 1 from the substrates 2-1 and 2-2 and protect the back surface of the solid-state imaging device 1.

FIG. 4 is a sectional view showing a main part of a fourth embodiment of the present invention. Similarly, members which are the same as or correspond to those of the first embodiment shown in FIG. There is. In this embodiment, the optical component 7 bonded and arranged on the light-receiving surface of the solid-state image sensor 1 is made larger than the light-receiving region of the solid-state image sensor 1, and the substrate 2
The size of the inner lead 3 of -1, 2-2 reaches the fixed portion to the solid-state image pickup device 1 is used.
By bonding the optical component 7 having such a size with the transparent resin 8, a light-shielding resin that seals the periphery of the optical component is not required, and the substrates 2-1 and 2-2 are bonded when the optical component 7 is bonded. Since the inner lead adhesive portion is sealed and protected, there is an advantage that the sealing step can be performed only once and can be easily manufactured.

In each of the above-mentioned embodiments, the pad portion is provided on the two opposite sides of the light receiving surface of the solid-state image pickup element, and the two substrates are connected to each other. However, the pad portion is limited to the two sides. However, it is also possible to provide it on three or four sides and connect three or four substrates corresponding to it.

[0013]

As described above on the basis of the embodiments,
According to the present invention, at least two of the light receiving surfaces of the solid-state image sensor are provided.
Since two or more substrates are connected to one side or more, stable connection can be achieved and a sufficient mounting space can be secured even if the size is reduced. Further, since two or more substrates are used, it is possible to form the signal lines directly led from the solid-state image sensor to the outside and the signal lines to the capacitors, resistors, ICs and the like which form the peripheral circuits on separate substrates. Therefore, noise such as crosstalk can be prevented from occurring.
Further, since the substrate is bent only once at the peripheral portion of the solid-state image pickup device, it is easy to manufacture and the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a solid-state imaging device according to the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a main part of a third embodiment of the present invention.

FIG. 4 is a sectional view showing a main part of a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a configuration example of a conventional solid-state imaging device.

[Explanation of symbols]

 1 Solid-state image sensor 2-1 and 2-2 Substrate 3 Inner lead 4 Metal protrusion 5 IC 6 Chip component 7 Optical component 8 Transparent adhesive 9 Insulation plate 10 Light-shielding resin

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/30 8509-4E

Claims (1)

[Claims] 1. A solid-state image pickup device having pad portions formed on two or more sides of a light-receiving surface, and at least two or more independent substrates on which electronic components for peripheral circuits of the solid-state image pickup device are mounted, via protruding electrodes. A solid-state image pickup device comprising: a pad portion of the solid-state image pickup element, and the two or more substrates each bent in a direction opposite to a light-receiving surface of the solid-state image pickup element.