JP2002034910A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an imaging device allowing easy handling of a solid imaging element during assembling, easy folding work without damaging an external terminal, and easy and certain assembling. SOLUTION: A plurality of electric connecting parts 48 disposed in the peripheral part of an image area 41 of the solid imaging element 42 are electrically connected to one end of each corresponding external terminal 49. The external terminals 49 are held by a tape carrier 51 molded so as to cover the external terminals 49 from both surfaces. The external terminals 49 are connected to the electric connecting parts 48 of the solid imaging element 42 and extended in the lateral direction of the image area 41, a circuit board 44 is connected to the external terminals 49 toward the rear side of the solid imaging element 42, the external terminals 49 are folded to the rear side of the solid imaging element 42 along a side surface of the solid imaging element 42 to position the circuit board 44 in the rear surface direction of the solid imaging element 42.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device used for an endoscope or the like.

[0002]

2. Description of the Related Art In recent years, an objective optical system and an image pickup device having a solid-state image pickup device such as a CCD and a circuit board have been arranged in the distal end portion of an endoscope insertion portion, and an endoscope observation image has been electrically connected. 2. Description of the Related Art Electronic endoscopes for obtaining various image signals are widely used.

[0003] The electronic endoscope is an image processing apparatus in which an electric signal obtained by forming an observation image of a part to be observed on an imaging surface of the solid-state imaging device by the objective optical system is provided outside the endoscope. Is transmitted through a signal cable, converted into an image signal, and an image of the observation target portion is displayed on a monitor for observation.

[0004] Such an image pickup device built in a small space such as the distal end portion of an insertion portion of an electronic endoscope is used for driving a solid-state image pickup device as described in, for example, Japanese Patent Application Laid-Open No. 11-478084. A circuit board on which electronic components are mounted is arranged in parallel with the solid-state image sensor, and the endoscope is connected to the solid-state image sensor via the circuit board and a signal cable connected to the solid-state image sensor. An image pickup unit configured as an image pickup unit has been proposed.

[0005]

However, the imaging device (imaging unit for an endoscope) described in Japanese Patent Application Laid-Open No. H11-478084 has a plurality of external terminals (external leads) extending from the solid-state imaging device. Must be connected in accordance with the distance between the solder lands provided on the circuit board, and the assemblability is poor.

When a very thin external terminal is bent behind a solid-state image pickup device (CCD bare chip), there is a joint with the external terminal on the imaging surface side of the solid-state image pickup device (CCD bare chip). In some cases, the external terminals may be damaged due to, for example, contact with the edge of the solid-state imaging device, which deteriorates the assemblability.

Further, in recent years, a tape carrier type package in which elements are mounted on a film-like flexible board is sometimes used. This means that the elements must be handled carefully during assembly because the board is flexible. The assembly was poor.

The present invention has been made in view of these circumstances. The solid-state imaging device can be easily handled at the time of assembling, the bending operation can be easily performed without damaging external terminals, and the assembling can be simplified. It is an object of the present invention to provide an imaging device that can be surely provided.

[0009]

In order to achieve the above object, an image pickup apparatus according to the present invention comprises: a solid-state image pickup device having an electric connection portion in a peripheral portion of an image area provided on a front surface; a circuit board on which electronic components are mounted; An external terminal capable of inputting and outputting an electric signal between the solid-state imaging device and the circuit board by connecting one end to an electric connection portion of the solid-state imaging device and connecting the other end to the circuit board, The external terminal is connected to an electrical connection portion of the solid-state imaging device and is extended in a lateral direction of the image area. The circuit board is connected to the external terminal toward a rear side of the solid-state imaging device. The external terminal is bent along the side surface of the solid-state imaging device to the rear side of the solid-state imaging device, and the circuit board is positioned in the back direction of the solid-state imaging device. With this configuration, it is possible to realize an imaging apparatus that can easily handle the solid-state imaging device during assembly, can easily perform a bending operation without damaging external terminals, and can easily and reliably assemble.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1 to 13 show a first embodiment of the present invention.
FIG. 1 is an explanatory view showing the entire configuration of an endoscope apparatus provided with an imaging device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the distal end side of an insertion section in FIG. FIG. 3 is a cross-sectional view showing the image pickup apparatus according to the first embodiment of the present invention, FIG. 4 is a front view showing the vicinity of the solid-state image pickup device before assembly, and FIG. 6 is a front view of the vicinity of the solid-state image sensor during assembly, FIG. 7 is a cross-sectional view of the vicinity of the solid-state image sensor of FIG. 6,
8 is a cross-sectional view of the vicinity of the solid-state imaging device when the device mask is bonded to the glass lid, FIG. 9 is a front view of the vicinity of the solid-state imaging device of FIG. 8, and FIG. 10 shows the state of FIG. 11 is a cross-sectional view of the vicinity of the solid-state imaging device when sealing is performed, FIG. 11 is a cross-sectional view of the vicinity of the solid-state imaging device when sealing the space between the solid-state imaging device and the glass lid, and FIG. 12 and FIG. FIG. 12 is an explanatory view when sealing the space between the imaging device and the glass lid. FIG. 12 is a front view near the solid-state imaging device, and FIG.
13 is a cross-sectional view near the solid-state imaging device in FIG.

As shown in FIG. 1, an endoscope apparatus 1 according to the present embodiment includes, for example, an endoscope 2 for obtaining an observation image of a part to be inspected, and a light source apparatus for supplying illumination light to the endoscope 2. 3
A video processor 4 for controlling the endoscope 2 and performing signal processing on an image signal obtained by the endoscope 2, and a monitor 5 for receiving a video signal output from the video processor 4 and displaying an observation image It is mainly composed of The endoscope 2 includes a distal end portion 6 on which an illumination optical system and an observation optical system are disposed, a bending portion 7 connected to the distal end portion 6 and capable of bending in, for example, up, down, left, and right directions. And a flexible insertion section 9 having a flexible portion 8 having flexibility. The insertion section 9 is provided with an operation section 10 at a proximal end thereof. The universal cord 11 in which a light guide or the like is inserted extends from the section. Also,
The endoscope 2 is detachably connected to the light source device 3 via a light guide connector 11a provided at an end of the universal cord 11, and extends from a side of the light guide connector 11a. Signal cable 12
Is detachably connected to the video processor 4 via an electric connector 12a provided at an end of the video processor 4.

As shown in FIG. 2, the distal end of the light guide 13 inserted into the insertion portion 9 is provided with a base 15 in a through hole forming an illumination window of a rigid distal end body 14 constituting the distal end portion 6. An illumination lens 16 is hermetically fixed to an illumination window which is fixed by soldering or an adhesive via an intermediary surface and has an enlarged diameter so as to face the front end surface. The light guide 13 is constituted by a fiber bundle in which flexible fibers are bundled, and this fiber bundle is covered with a flexible tube 17.

The distal end main body 14 is provided with a through hole having an image pickup window adjacent to the illumination window, and an image pickup device 20 having a function of picking up an image is fixed by screws (not shown) or the like. From the rear end of the imaging device 20, a signal cable (or an imaging cable) 21 that transmits a captured image (as a transmission body of an electric image) extends. A plurality of the signal cables 21 are bundled and covered with a flexible protective tube 22. The signal cable 21 is inserted into the universal cord 11 from the operation section 10 via the insertion section 9 and is connected to the electric connector 12a.

A first bending piece 23 is fixed to the rear end of the tip body 14 by soldering or the like, and a second bending piece 23 such as a rivet is attached to the rear end of the first bending piece 23. A large number of bending pieces 23 are rotatably connected to each other so as to be connected via a rotatable connection member to form the bending portion 7. The outer circumference of the bending piece 23 is covered with a flexible outer skin 24 such as a rubber tube.
Is also hermetically fixed to the tip body 14.

Illumination light emitted from a lamp (not shown) provided in the light source device 3 passes through the light guide connector 11a, the universal cord 11, and the operation unit 10 and the insertion unit 9 of the endoscope 2. Light guide 1
The illumination light transmitted to the distal end portion 6 via the optical path 3 is transmitted through the illumination lens 16 from the distal end surface to further illuminate the subject side such as a diseased part in front. After the image of the inspection target site obtained by being illuminated by the illumination light is captured by the imaging device 20 provided at the distal end portion 6 and converted into an electric signal,
The electric signal is transmitted to the video processor 4, the video signal is generated by the video processor 4, and the video signal is transmitted to the monitor 5 to display an observation image on a monitor screen. .

Next, the detailed configuration of the image pickup device 20 built in the endoscope 2 will be described with reference to FIG. As shown in FIG. 3, the imaging device 20 includes an objective optical unit 31 and an imaging unit 32, which are objective lens systems. The objective optical unit 31 includes objective lenses 33a to 33d and these objective lenses 33a to 33d. 33d is fixedly arranged at a predetermined position. An annular ring 35a, 35b is provided between the objective lens 33c and the objective lens 33d.
The optical stop 36 is similarly held by the lens frame 34 in a state where the optical position is determined.

The base of the lens frame 34 holding the objective lenses 33a to 33d is provided with an element frame 3 having a glass lid 37 constituting the image pickup section 32 disposed at the base.
The focus adjustment is performed while adjusting the relative position of the solid-state imaging device 42 (described later) held in the device frame 38 with respect to an image area 41.

An element mask 39 is fitted into the element frame 38, and the element mask 39 is joined to the glass lid 37 by a joining method described later.

The image pickup section 32 has an image area (light receiving section) 4 at a substantially central portion on the distal end surface side which is the objective optical section 31 side.
1 and a solid-state image sensor 42
And two circuit boards 44 made of a hard material such as ceramics on which the electronic components 43a and 43b are disposed, which are bonded and fixed to the base end surface side by a connection method described later. The electronic component 43a is a bare chip IC, and is electrically connected to the circuit board 44 by a ball grid array. The electronic component 43b is a chip resistor, and is a resistor for impedance matching of an output signal from the solid-state imaging device 42. The electronic component 43b is connected to the circuit board 44 together with the signal cable 21. The electronic component 43
c is a chip capacitor.

An insulating sheet 45 is sandwiched between the two circuit boards 44 to prevent contact between the electronic component 43a and the electronic components 43b and 43c. A cable connection land (not shown) is provided on the rear end surface of the circuit board 44 on which the electronic components 43a, 43b, and 43c are mounted, and the core wires 21a of the plurality of signal cables 21 are connected.

The periphery of the solid-state imaging device 42 and the circuit board 44 is filled with a sealant 46 having electrical insulation and high moisture resistance, and is sealed from the outside. The outer periphery of the sealant 46 is covered with a heat-shrinkable shield tube 47. The shield tube 47 is made of the sealant 4
6, after molding and sealing the peripheral portions of the solid-state imaging element 42 and the circuit board 44, the shield tube 47 is molded and contracted, and then a metal such as aluminum or gold is vapor-deposited on the outer surface of the shield tube 47 to provide an electrical shielding effect. And the imaging device 2
0 Increases moisture resistance inside.

The image area 4 of the solid-state image sensor 42
1 is connected to the electrical connection portion 4 of the solid-state imaging device 42.
8 is provided, and one end of an external terminal 49 such as a flexible lead is electrically connected to the electric connection portion 48 by thermocompression bonding or ultrasonic compression bonding. The glass lid 37 is adhesively fixed while being sandwiched by the solid-state imaging device 42 around the crimping portion. The external terminal 4
Reference numeral 9 denotes a thin copper foil having a gold-plated surface, and is held by a tape carrier 51 made of polyimide or the like formed so as to cover the external terminals 49 from both sides.

In the present embodiment, the external terminal 49 is connected to the electric connection portion 48 of the solid-state image sensor 42 and extends in the horizontal direction of the image area 41.
The circuit board 44 is connected to the rear side of the solid-state imaging device 42 and the external terminal 49 is connected to the solid-state imaging device 4.
The circuit board 44 is bent along the side surface 2 to the rear side of the solid-state image sensor 42 so that the circuit board 44 is positioned in the rear direction of the solid-state image sensor 42.

As shown in FIG. 4 and FIG.
An external terminal 49 before assembling 2 extends to a device hole 52 formed in the tape carrier 51, and the external terminal 49 is connected to the electric connection portion 48 of the solid-state imaging device 42.

The electric connection section 48 is connected to the solid-state imaging device 4.
2 are arranged around the image area 41,
The corresponding external terminals 49 are connected.

The glass lid 37 is placed on the front side surface of the external terminal 49 and covers the front surface of the image area 41. The external terminal 49 connected to the electrical connection part 48 extends in the lateral direction of the image area 41 of the solid-state imaging device 42, and the tape carrier 5 for external connection.
1 is extended to a connection hole 53 formed by extracting a part.

Here, as shown in FIGS. 6 and 7, during the assembly of the solid-state imaging device 42, when the external terminals 49 are bent rearward of the solid-state imaging device 42 in a later step, the circuit board 44 is bent. The circuit board 44 is connected to the external terminals 49 so as to be positioned in the direction of the back of the solid-state imaging device 42 while accurately positioning the solid-state imaging device 4.
2 are connected to the rear side.

When the external terminals 49 are bent rearward of the solid-state image sensor 42, the circuit board 44 has a stepped portion 44a that abuts against a side surface of the solid-state image sensor 42, and the solid-state image sensor 42 Is provided with a thin portion 44b located on the side surface.

In this embodiment, in order to accurately position the circuit board 44, a positioning index 54 is printed on the tape carrier 51 on which the solid-state imaging device 42 is mounted. In addition, as the index for positioning, the circuit board 44 is positioned so that it can be positioned together with the index 54.
May be printed on the end of the external terminal 49, or a projection may be provided on a part of the external terminal 49 to serve as a positioning index.

The thin portion 44b of the circuit board 44
Is located on the side surface of the solid-state imaging device 42 so that the external terminal 49 can be prevented from contacting the solid-state imaging device 42. At this time, the circuit board 44 facing each of the external terminals 49 is provided with connection lands 55 for connecting an electric circuit mounted on the circuit board 44 and the external terminals 49.

Then, the plurality of external terminals 49 are collectively connected to the connection lands 55 of the circuit board 44 by ultrasonic crimping or soldering. At this time, the electronic components 43a to 43a
After connecting the circuit board 44 to the external terminals 49 to facilitate mounting of the electronic components 43a to 43b,
43b is mounted.

Subsequently, unnecessary portions of the tape carrier 51 and the external terminals 49 are cut off, and as shown in FIG.
The external terminal 49 connected to the circuit board 44 so as to abut on the solid-state imaging device 42 is bent along the side surface of the solid-state imaging device 42 rearward (in the direction of the arrow in FIG. 7) of the solid-state imaging device 42. The circuit board 44 is positioned in the rear direction of the circuit board. At this time, if the signal cable 21 is connected before the circuit board 44 is fixed, the connection work can be easily performed.

Next, the element mask 39 is bonded to the glass lid 37. As shown in FIGS. 8 and 9, the outer shape of the glass lid 37 is square, and the outer shape of the element mask 39 is circular and has an octagonal opening 61 formed therein. Of the light beams passing through the objective lenses 33a to 33d, unnecessary light beams that cause flare or the like are blocked by the element mask 39 other than the opening 61. The element mask 39 is formed of the glass lid 37.
Area 41 of solid-state image sensor 42 seen through
Then, the outer shape or the octagonal opening 61 of the element mask 39 is positioned and bonded and fixed. That is, the solid-state imaging device 42 and the device mask 39 are fixed in an optically centered state.

Then, as shown in FIG. 10, the element mask 39 is fitted into the element frame 38 which is a holding member of the solid-state image pickup element 42, and the glass lid 37 is pushed to the rear wall 62 of the element frame 38. The solid-state imaging element 42 and the element frame 38 are bonded and sealed with the sealing agent 46 in a state where the solid-state imaging element 42 and the element frame 38 are locked in the axial direction. That is, the element mask 3
9 is a centering member for the solid-state imaging device 42 and the device frame 38.

Conventionally, a glass lid 37 is formed using an optical adhesive.
Although the objective lens was bonded to the surface, the bonded surface was separated due to the invasion of moisture to the bonded surface or the stress in the shearing direction, and the separated portion was sometimes reflected in an observation image of an endoscope. In the present embodiment, since the objective lens is not bonded to the front surface of the glass lid 37, peeling of the bonding surface does not occur.

Further, for the same reason, the joint surface between the solid-state image pickup device 42 and the glass lid 37 may be separated. Therefore, in the present embodiment, as shown in FIG. 11, an elastic spacer 63 formed of a rubber material is interposed between the solid-state imaging device 42 and the glass lid 37, and then the solid-state imaging device 42 and the glass Lid 37
Are sealed with the sealant 46. At this time, the sealant 46 is cured while pressing the solid-state imaging device 42 and the glass lid 37 in the approaching direction, respectively, but an air layer is present corresponding to the pressure of the elastic spacer 63. Pressing and sealing between the solid-state imaging device 42 and the glass lid 37 are performed by using a thin caulking metal fitting 64 from each side of the solid-state imaging device 42 and the glass lid 37 as shown in FIGS. It may be done by tightening. Thereby, a joint surface between the solid-state imaging element 42 and the glass lid 37 having high airtightness and shear strength can be simply obtained.

As described above, the electronic components 43a to 43c are mounted on the circuit board 44 by sandwiching the insulating sheet 45 between the two circuit boards 44, and the core 21a of the signal cable 21 is also mounted on the circuit board 44. It is connected to a cable connection land (not shown) of the circuit board 44. Then, the periphery of the solid-state imaging device 42 and the circuit board 44 is filled with the sealing agent 46 and molded and sealed, and then covered with the shield tube 47. Next, as described above, after the shield tube 47 is formed and contracted, a metal such as aluminum or gold is vapor-deposited on the outer surface thereof.

By configuring the imaging device 20 as described above, even if the solid-state imaging device 42 is packaged in a tape carrier type, which is difficult to handle, the rigid circuit board 44 is first electrically connected. Since the flexible external terminal 49 is bent from the outside, the handling of the solid-state imaging device 42 in the assembling process becomes easy, and the external terminal 49 is bent.
Can be easily bent, and assembling can be surely and simplified without damaging the external terminals 49. Further, since the external terminals 49 can be collectively connected to the circuit board 44, assembly can be further simplified.

(Second Embodiment) FIGS. 14 to 19
14 relates to a second embodiment of the present invention, FIG. 14 is a cross-sectional view showing an imaging device according to a second embodiment of the present invention, FIG. 15 is a front view near a solid-state imaging device before assembly, and FIG. FIG. 17 is a cross-sectional view near the solid-state imaging device in FIG. 15, FIG. 17 is a cross-sectional view near the solid-state imaging device in the middle of assembly, and FIGS. 18 and 19 are explanatory diagrams when a bent portion of the external terminal is reinforced using a composite film. FIG. 18 is a cross-sectional view of the vicinity of the solid-state imaging device when the composite film is attached to the side surface of the bent portion of the external terminal. FIG. 19 is a cross-sectional view of the vicinity of the solid-state imaging device when the composite film is heated from the state of FIG. It is.

The second embodiment uses a solid-state imaging device smaller than that of the first embodiment, and uses a thin flexible board instead of the hard circuit board 44 in order to further reduce the size of the imaging apparatus. It is configured using a circuit board. The rest of the configuration is the same as in the first embodiment, and a description thereof will be omitted.
The same components will be described with the same reference numerals.

That is, as shown in FIG. 14, an imaging device 100 according to the second embodiment has a solid-state imaging device 101 smaller than the first embodiment and a solid-state imaging device 101.
Flexible circuit board 10 adhered and fixed to the base end face side
2.

As shown in FIGS. 15 and 16, the external terminals 49 before assembling the solid-state imaging device 101 are provided with device holes 52 of a tape carrier 51 formed of thin polyimide or the like as in the first embodiment. One end of the external terminal 49 is connected to the solid-state imaging device 101.
Is connected to the above-mentioned electric connection part 48.

The electric connection section 48 is connected to the solid-state imaging device 1.
A plurality of the external terminals 49 are arranged around the image area 41 of FIG. In the present embodiment, the electric connection portion 48
Are solder bumps formed at the same height.

The glass lid 37 is mounted on the front side surface of the external terminal 49 and covers the front surface of the image area 41. The external terminal 49 connected to the electric connection portion 48 extends in the lateral direction of the image area 41 of the solid-state imaging device 101, and is a connection hole formed by partially removing the tape carrier 51 for external connection. It extends to 53.

Then, when the external terminals 49 are bent in a later step, the rear end of the flexible circuit board 102 is connected to the projection-like indicator 103 provided on the external terminals 49.
The circuit board 10 is connected to the external terminals 49 so that the external terminals 49 are positioned on the side surface of the solid-state imaging device 101 in the back direction of the solid-state imaging device 101 while accurately positioning the solid-state imaging device 101.
2 is connected to the rear side of the solid-state imaging device 42.

Since a part of the flexible circuit board 102 is located on the side surface in the back direction of the solid-state image sensor 101, the external terminals 49 can be prevented from contacting the solid-state image sensor 101. At this time, the flexible circuit board 102 facing each external terminal 49 is provided with a connection land 55 for connecting an electric circuit mounted on the flexible circuit board 102 and the external terminal 49.

In this embodiment, a plurality of external terminals 4
The other end of the solder paste 9 is connected to the connection land 55 of the flexible circuit board 102 by reflowing the cream solder. At this time, the flexible circuit board 102 is connected to the external terminals 4 to facilitate mounting of electronic components.
After the connection to No. 9, the electronic components 43a to 43c are mounted. Subsequently, unnecessary portions of the tape carrier 51 and the external terminals 49 are cut off, and the flexible circuit board 102 is positioned such that a part of the flexible circuit board 102 is located on a side surface in the back direction of the solid-state imaging device 101 as shown in FIG. The external terminal 49 connected to the solid-state imaging device 101 is bent along the side surface of the solid-state imaging device 101 toward the rear side (in the direction of the arrow in FIG. 16) of the solid-state imaging device 101 to form a side surface in the back direction of the solid-state imaging device 101. The circuit board 102 is located.

Then, the element mask 39 is joined to the glass lid 37 as described in the first embodiment, and the core 21a of the signal cable 21 is directly connected to the electrodes of the electronic components 43b and 43c as shown in FIG. Connecting. The electronic component 43b is a chip resistor, and the electronic component 43c is a chip capacitor.

In this embodiment, in order to prevent the bent portion of the thin external terminal 49 from being exposed and damaged, a composite film 110 is used to prevent the external terminal 4 from being damaged.
9 is covered, and the bent portion of the external terminal 49 is mechanically reinforced.

As shown in FIG. 18, a composite film 1 formed of a thermoplastic resin film 111 and a thermosetting resin film 112 is formed on the side surface of the bent portion of the external terminal 49.
After attaching the composite film 10, the composite film 110 is heated.

When the composite film 110 is heated, as shown in FIG. 19, the thermoplastic resin film 111 of the inner layer is melted to cover the vicinity of the external terminal 49 and the thermosetting resin film 112 of the outer package is melted. Are hardened along the external terminals 49. Thus, the bent portion of the external terminal 49 is mechanically reinforced, and the joint between the glass lid 37 and the solid-state imaging device 101 is sealed. Further, the surface of the external terminal 49 is electrically insulated from the outside.

After the bent portions of the external terminals 49 are reinforced as described above, the periphery of the solid-state image pickup device 101 and the flexible circuit board 102 is filled with a sealant 46 and molded as described in the first embodiment. After sealing, it is covered with a shield tube 47. After the shield tube 47 is molded and contracted, a metal such as aluminum or gold is vapor-deposited on the outer surface thereof. As a result, in addition to obtaining the same effects as in the first embodiment, it is possible to further reduce the size of the imaging device.

It should be noted that the imaging apparatus of the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

In recent years, the size and the number of pixels of a solid-state image sensor have been reduced, and a high-resolution image can be obtained even in an image pickup apparatus using a very small solid-state image sensor. I have. Since such an imaging device can obtain a high-resolution image image on a full screen without an electric enlargement unit such as a decompression process, it is mounted on an endoscope or the like having an elongated insertion portion. It can be used.

FIG. 20 shows a monitor display example of an observation image obtained by an electronic endoscope equipped with such a conventional imaging device.
Conventionally, a video processor connected to the electronic endoscope conventionally displays, for example, an observation image 151 and character information 152 such as examination date / time and patient name on a monitor 150 as shown in FIGS. 20 (a) and 20 (b). You. However, character information 152 such as examination date / time and patient name may be displayed over the full-screen observation image 151a.

In such a case, the video processor conventionally has a function of outputting only the observed image 151a to the monitor without outputting any character information 152 by the video processor. In this case, for example, when the observation image 151a is output to a video printer or the like and the character information 152 is not displayed at all, it is difficult to identify each output image from the video printer, and the arrangement of the output images is complicated. Was. In addition, when the observation image 151a in the case of the full screen is horizontally long, a difference occurs in the visual field range between the vertical direction and the horizontal direction of the observation image 151a, and the observation image 151a is inserted while observing a lumen such as a colonoscopy. The time required for insertion may increase due to the difference in the visual field range.

Therefore, in the present embodiment, a video processor reads a part of the image output signals obtained from the imaging device mounted on the endoscope, or reads out all the image output signals, and then performs electrical mask processing. Processing such as partially hiding the observation image is performed. As a result, FIG.
As shown in (a) and (b), character information 152 is provided next to the observation image 151b so as not to cover the observation image 151b.
Can be displayed. At this time, since the observation image 151b approaches a square, the observation image
It is possible to display such that there is no difference in the visual field range between the vertical direction and the horizontal direction of 1b.

Alternatively, the image output signal output from the image pickup device is electrically reduced and interpolated by a video processor, so that the observation image 151c is located next to the observation image 151c as shown in FIGS. 22 (a) and 22 (b). A display space for the character information 152 may be ensured so as not to cover.

[Supplementary Notes] (Supplementary Note 1) A solid-state imaging device having an electric connection portion in the periphery of an image area provided on the front surface, a circuit board on which electronic components are mounted, and one end connected to the electric connection portion of the solid-state imaging device And an external terminal capable of inputting and outputting an electric signal between the solid-state imaging device and the circuit board by connecting the other end to the circuit board. Connected to the electrical connection part of the device and extended in the horizontal direction of the image area, connected to the external terminal with the circuit board facing the rear side of the solid-state imaging device, and connected to the external terminal of the solid-state imaging device. An imaging apparatus, wherein the circuit board is bent along a side surface to a rear side of the solid-state imaging device so as to position the circuit board in a rear direction of the solid-state imaging device.

(Additional Item 2) The imaging apparatus according to Additional Item 1, wherein a plurality of the external terminals are collectively connected to the circuit board.

(Supplementary Note 3) The external terminal extends laterally of the image area provided on the front surface of the solid-state imaging device before bending the external terminal to the rear side of the solid-state imaging device. 2. The imaging device according to claim 1, wherein

(Additional Item 4) The imaging device according to Additional Item 1, wherein the circuit board is a hard substrate.

(Supplementary Note 5) When the electronic components mounted on the circuit board are bent so that the external terminals are bent rearward of the solid-state image pickup device and the circuit board is positioned in the rear direction of the solid-state image pickup device. 2. The imaging device according to claim 1, wherein the imaging device is mounted on an opposing surface.

(Additional Item 6) An additional item 1 in which a thin portion is provided on at least a part of the circuit board, and the thin portion is brought into close contact with a side surface of the solid-state imaging device.
An imaging device according to claim 1.

(Additional Item 7) The imaging device according to additional item 1, wherein a positioning index for connecting an external terminal is provided on a part of the circuit board.

(Additional Item 8) The imaging device according to additional item 1, wherein a positioning index for connecting the circuit board is provided to a part of the solid-state imaging device or the external terminal.

(Additional Item 9) A centering member other than a lens element is fixed to the solid-state image pickup device or a glass lid bonded to the solid-state image pickup device, and the solid-state image pickup device is attached to the solid-state image pickup device holding member via the centering member. An imaging device, wherein an element is fixed.

(Additional Item 10) The imaging apparatus according to Additional Item 9, wherein the centering member is formed of a mask member that blocks unnecessary light rays.

[0069]

As described above, according to the present invention, it is easy to handle the solid-state image pickup device at the time of assembling, and the bending operation can be easily performed without damaging the external terminals, and the assembling can be performed simply and reliably. An imaging device can be realized.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an overall configuration of an endoscope apparatus including an imaging device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the distal end side of the insertion portion in FIG. 1;

FIG. 3 is a sectional view showing the imaging device according to the first embodiment of the present invention;

FIG. 4 is a front view showing the vicinity of a solid-state imaging device before assembly.

FIG. 5 is a cross-sectional view around the solid-state imaging device of FIG. 4;

FIG. 6 is a front view of the vicinity of the solid-state image sensor during assembly.

FIG. 7 is a sectional view of the vicinity of the solid-state imaging device in FIG. 6;

FIG. 8 is a cross-sectional view near the solid-state imaging device when the device mask is bonded to the glass lid.

FIG. 9 is a front view of the vicinity of the solid-state imaging device in FIG. 8;

10 is a cross-sectional view of the vicinity of the solid-state imaging device when the device mask is fitted into the device frame from the state of FIG.

FIG. 11 is a cross-sectional view of the vicinity of the solid-state imaging device when the space between the solid-state imaging device and the glass lid is sealed.

12 and FIG. 13 are explanatory views when sealing between a solid-state imaging device different from FIG. 11 and a glass lid, and FIG. 12 is a front view near the solid-state imaging device.

13 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.

FIG. 14 is a sectional view showing an imaging device according to a second embodiment of the present invention;

FIG. 15 is a front view showing the vicinity of a solid-state imaging device before assembly.

16 is a cross-sectional view of the vicinity of the solid-state imaging device in FIG.

FIG. 17 is a cross-sectional view of the vicinity of a solid-state image sensor during assembly.

FIG. 18 is a cross-sectional view of the vicinity of a solid-state imaging device when a composite film is attached to a side surface of a bent portion of an external terminal.

19 is a cross-sectional view of the vicinity of the solid-state imaging device when the composite film is heated from the state of FIG.

FIG. 20 is a monitor display example of an observation image obtained by an electronic endoscope equipped with a conventional imaging device.

FIG. 21 is a monitor display example when character information is displayed beside an observation image.

FIG. 22 is a monitor display example when a display space for character information is secured and displayed beside an observation image.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus 2 ... Endoscope 20 ... Imaging device 37 ... Glass lid 38 ... Element frame 39 ... Element mask 41 ... Image area 42 ... Solid-state imaging elements 43a-43c ... Electronic components 44 ... Circuit board 44a ... Step part 44b: Thin portion 48: Electrical connection portion 49: External terminal 51: Tape carrier 55: Connection land

Continued on the front page F term (reference) 2H040 GA02 GA03 2H100 BB11 CC03 4C061 CC06 JJ06 LL02 PP06 SS01 4M118 AA08 AA10 AB01 GA04 GB01 HA01 HA22 HA23 HA24 HA25 HA29 5C022 AA09 AC42 AC77 AC78

Claims (1)

[Claims] 1. A solid-state imaging device having an electric connection portion in a peripheral portion of an image area provided on a front surface, a circuit board on which electronic components are mounted, and one end connected to the electric connection portion of the solid-state imaging device. An external terminal capable of inputting and outputting an electric signal between the solid-state imaging device and the circuit board by connecting an end to the circuit board, and connecting the external terminal to an electric connection portion of the solid-state imaging device. Connected, extending in the horizontal direction of the image area, connecting the circuit board to the external terminals toward the rear side of the solid-state imaging device, and connecting the external terminals along a side surface of the solid-state imaging device to the solid-state imaging device. An image pickup apparatus, wherein the circuit board is positioned rearward of the solid-state image sensor by bending the circuit board rearward of the image sensor.