JP5063834B2 - Electronic endoscope system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic endoscope system, and more particularly to an electronic endoscope system characterized by a conversion portion of an image captured by an imaging apparatus.
[0002]
[Prior art]
As shown in Japanese Examined Patent Publication No. 3-37405, an observation image of an electronic endoscope is obtained by displaying a video signal obtained from a solid-state imaging device arranged at the tip on a monitor TV screen via a control device. Yes. Since each electronic endoscope has a different objective optical system, it is necessary to invert the image depending on the type of the objective optical system, and the image inversion setup means is provided in the connector device of each electronic endoscope. The technology to provide is shown.
[0003]
For example, the scanning direction of the NTSC monitor is unified from left to right in the horizontal direction and from top to bottom in the vertical direction. Therefore, as shown in FIG. 23, when observing a subject using an optical system, in order to align the top, bottom, left, and right of the subject and the top, bottom, left, and right of the monitor display, the horizontal direction of the scanning direction of the solid-state imaging device is from left to right. The vertical direction is from bottom to top.
[0004]
The outer shape of the solid-state imaging device is rectangular according to the number of pixels that each individual solid-state imaging device has, the size of the light receiving unit, the mounting direction of the lead terminals, and the like.
[0005]
[Problems to be solved by the invention]
Conventionally, since the image inverting means is provided in the connector device, a normal image cannot always be displayed on the monitor when the imaging device or the connector device is replaced for repair or the like.
[0006]
In addition, when a solid-state imaging device having a rectangular outer shape is mounted on the distal end portion of an electronic endoscope, the distal end portion outer diameter may have to be increased depending on the arrangement direction of the short side and the long side. Therefore, if the solid-state imaging device is rotated 90 ° in order to reduce the outer diameter of the distal end, the display image on the monitor is also rotated 90 °, and the UP direction of the endoscope distal end and the UP direction of the monitor display image Did not match, making it difficult to operate the endoscope. That is, a normal image may not be displayed on the monitor by changing not only the objective optical system but also the arrangement of the solid-state imaging device.
[0007]
In addition, there is a means to change the outer shape of the solid-state image pickup device and a means to change the scanning direction of the solid-state image pickup device in order to reduce the size of the endoscope distal end described above, but a new solid-state image pickup device has been developed individually. Doing so is very inefficient and increases the cost of the endoscope.
[0008]
The present invention has been made in view of the above circumstances, and an electronic device capable of matching the vertical and horizontal directions of the display image of the monitor with the vertical and horizontal directions of the distal end portion of the endoscope irrespective of the arrangement direction of the solid-state imaging device. An object is to provide an endoscope system.
[0009]
[Means for Solving the Problems]
An electronic endoscope system according to the present invention includes an objective optical system disposed at a distal end portion of an electronic endoscope, and a solid state disposed at a predetermined position at the distal end portion as an imaging position of the objective optical system. An electronic endoscope including an imaging device having at least an imaging device, and a video that is connected to the electronic endoscope via a connector device and processes an imaging signal from the imaging device and displays an endoscope image on a display means In an electronic endoscope system comprising a processor and a light source device that supplies illumination light to the electronic endoscope, the electronic endoscope system is disposed in the imaging device Direction indication means When the vertical scanning direction of the solid-state imaging device is the vertical direction of the solid-state imaging device and the horizontal scanning direction is the horizontal direction of the solid-state imaging device, the solid-state imaging device is disposed at a predetermined position at the tip portion. When the vertical and horizontal arrangement directions of the solid-state imaging device and the predetermined bending operation direction at the tip of the electronic endoscope are defined as the vertical and horizontal directions of the tip In Up / down / left / right bending motion direction of the tip Direction indicating means for outputting positional relationship information indicating a relative positional relationship between the tip and the solid-state imaging device based on And said Output from direction indicator The relative direction of the vertical and horizontal arrangement directions of the solid-state imaging device and the vertical and horizontal bending operation directions of the tip portion The positional relationship information indicating the positional relationship The display direction for converting the display direction of the endoscopic image so that the vertical and horizontal directions related to the bending operation direction of the distal end portion coincide with the vertical and horizontal directions of the image display direction on the display screen of the display means Conversion means.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0011]
1 to 22 relate to an embodiment of the present invention, FIG. 1 is a block diagram showing the configuration of an electronic endoscope system, and FIG. 2 is a cross section in the longitudinal axis direction of the distal end portion of the electronic endoscope of FIG. 3 is a block diagram showing the configuration of the solid-state imaging device of FIG. 2, FIG. 4 is a diagram showing the vertical and horizontal directions of the display image of the monitor of FIG. 1, and FIG. 5 is the arrangement direction of the solid-state imaging device of FIG. FIG. 6 is a diagram showing the configuration of the proximal end side of the signal line in FIG. 2, and FIG. 7 is an AA diagram in FIG. 8 is a cross-sectional view showing a line cross section, FIG. 8 is a view showing an arrangement on the electronic endoscope system of a display direction selecting means constituted by a plurality of electronic components in FIG. 2, and FIG. 9 is constituted by a plurality of electronic components in FIG. FIG. 10 is a diagram showing a modification of the arrangement of the display direction selection means on the electronic endoscope system, and FIG. 10 is a first modification of the circuit board of FIG. Diagram showing, 11 to the video processor of FIG. 1 Blur FIG. 12 is a diagram illustrating an operation when the correction processing function is provided, FIG. 12 is a diagram illustrating a first modification of the solid-state imaging device in FIG. 2, and FIG. 13 is a second modification illustrating the circuit board in FIG. 14 is a second diagram showing a second modification of the circuit board of FIG. 2, FIG. 15 is a diagram showing a third modification of the circuit board of FIG. 2, and FIG. 16 is a circuit of FIG. FIG. 17 is a diagram showing a fourth modification of the substrate, FIG. 17 is a diagram showing a fifth modification of the circuit board in FIG. 2, FIG. 18 is a diagram showing a second modification of the solid-state imaging device in FIG. Is a diagram showing a third modification of the solid-state imaging device of FIG. 2, FIG. 20 is a diagram showing a fourth modification of the solid-state imaging device of FIG. 2, and FIG. 21 is a fifth modification of the solid-state imaging device of FIG. FIG. 22 is a diagram illustrating an example, and FIG. 22 is a diagram illustrating a sixth modification of the solid-state imaging device of FIG.
[0012]
As shown in FIG. 1, an electronic endoscope system 1 includes an electronic endoscope 2 having an imaging unit, and a light guide that is detachably connected to the electronic endoscope 2 and is provided in the electronic endoscope 2. A light source device 3 for supplying illumination light to the video endoscope, and a video processor connected to the electronic endoscope 2 via the connection cable 4 to control the imaging means of the electronic endoscope 2 and to process signals obtained from the imaging means. 5 and a monitor 6 for displaying an image corresponding to the subject image output from the video processor 5. The scanning direction of the monitor 6 is such that the vertical direction is scanned from top to bottom and the horizontal direction is scanned from left to right.
[0013]
The electronic endoscope 2 has a flexible elongated insertion portion 7, an operation portion 8 connected to the proximal end side of the insertion portion 7, and a flexibility extending from a side portion of the operation portion 8. The connecting cord 9, the connector portion 10 detachably connected to the light source device 3 provided at the end of the connecting cord 9, and the video processor 5 provided on the side of the connector portion 10. The connection cable 4 has an electrical connector portion 11 that can be detachably connected.
[0014]
The electrical connector portion 11 is provided with a ventilation portion (not shown) that communicates the inside and outside of the electronic endoscope 2.
[0015]
The connecting portion between the insertion portion 7 and the operation portion 8 is provided with an insertion portion side anti-folding member 12 having an elastic member that prevents a sudden bending of the connection portion. The same operation part side bending prevention member 13 and the connection part of the connecting cord 9 and the connector part 10 are provided with the same connector part side bending prevention member 14.
[0016]
The insertion portion 7 includes a flexible flexible tube portion 15 having flexibility, a bending portion 16 that is provided on the distal end side of the flexible tube portion 15 and can be bent by the operation of the operation portion 8, and the observation optics shown in FIG. The image forming apparatus 18 and the illumination optical system 19 forming the system are composed of a distal end portion 17 provided.
[0017]
As shown in FIG. 1, the connector unit 10 is detachably connected to a gas supply base 21 that is detachably connected to a gas supply source (not shown) built in the light source device 3 and a water supply tank 22 that is a liquid supply source. A water supply tank pressurizing base 23 and a liquid supply base 24 are provided. A suction base 25 connected to a suction source (not shown) for performing suction from the suction port is provided.
[0018]
In addition, when a high frequency leakage current is generated in the endoscope when a high frequency treatment or the like is performed, an earth terminal cap 27 is provided for returning the leakage current to the high frequency treatment device.
[0019]
The operation unit 8 includes an air supply / water supply operation button 28 for operating an air supply operation and a water supply operation, a suction operation button 29 for operating the suction operation, a bending operation knob 30 for performing the bending operation of the bending portion, A plurality of remote switches 31 for remotely operating the video processor 5 and a treatment instrument insertion port 32 which is an opening communicating with the treatment instrument channel are provided.
[0020]
In addition, a waterproof cap (not shown) for sealing the electrical connector portion 11 in a liquid-tight manner can be detachably connected to the electrical connector portion 11 of the electronic endoscope 2.
[0021]
As shown in FIG. 2, the plurality of objective lenses 33 interpose an optical diaphragm 65 for preventing flare and a spacing tube 66 for maintaining a predetermined distance between objective lenses in the first and second objective lens frames 34 and 35. Arranged in a state. A solid-state imaging device 37 bonded to the rearmost lens of the plurality of objective lenses 33 with an ultraviolet curable adhesive or the like is disposed at the image forming positions of the plurality of objective lenses 33.
[0022]
As shown in FIG. 3, the solid-state imaging device 37 includes a cover glass 38, a solid-state imaging device 39, and an external lead 40. cover The glass 38 is bonded and fixed with an ultraviolet curable adhesive so as to cover the light receiving unit 20 of the solid-state imaging device 39. The external lead 40 disposed on the side surface (left and right direction) of the solid-state image sensor 39 is a flexible substrate having a wiring formed of copper foil on a polyimide tape 41 (see FIG. 2), and extends from the polyimide tape 41. Inner leads 42 are bonded to bonding pads 69 formed on the left and right sides of the light receiving unit 20 with gold or the like. ball Connected through bumps (Ball bonding) . The scanning direction of the solid-state imaging device 37 is scanned from bottom to top in the vertical direction and from left to right in the horizontal direction.
[0023]
Returning to FIG. 2, the outer leads 43 of the external leads 40 are arranged in the arrangement direction of the short side and the long side of the solid-state imaging device 37 arranged behind the solid-state imaging device 39, and the upper and lower sides of the display image of the monitor 6 shown in FIG. 4. It is connected by solder or the like to a side through hole formed on the side surface of the circuit board 45 on which a plurality of electronic components 44 that are display direction selection means for associating the left-right direction with the up-down, left-right direction of the tip end portion 17 are mounted. ing. The plurality of signal lines 46 are connected to a side through hole formed on a side surface different from the surface to which the outer lead 43 is connected by solder or the like.
[0024]
Here, as shown in FIG. 5, the display direction selection means associates the arrangement direction of the solid-state imaging device 37, the bending operation direction of the distal end portion 17, and the image display direction on the monitor 6. There is a logic circuit using a plurality of electronic components 44.
[0025]
In FIG. 5, four sets of associations are shown, but the present invention is not limited to this, and a plurality of combinations are possible.
[0026]
As shown in FIG. 6, the plurality of signal lines 46 are bundled around an interposition 36 made of a fiber such as Kevlar, and a tape 47 made of PTFE or the like is spirally coated on the outer periphery thereof. A signal cable 50 is formed on the outer periphery of a shield conductor 48 made of tin-plated copper alloy and covered with an insulator 49 made of PFA. Note that an adhesive 71 is filled around the signal line 46 over at least a range L in FIG. 2 in order to prevent moisture from entering from the base end side of the signal cable 50. Of course, it may be filled over the entire length. The adhesive 71 may be filled with a dispenser from the distal end side or may be sucked and filled from the proximal end side.
[0027]
Returning to FIG. 2, a cable protection 51 for preventing breakage due to interference from the built-in object of the electronic endoscope 2 is bound to the outer periphery of the signal cable 50 by a silk thread 52 so as not to come off.
[0028]
After the solid-state imaging device 37, the circuit board 45, and the signal line 46 are connected, a sealing resin 53 made of an epoxy resin is placed in the shield frame 54 so that moisture or the like does not enter the periphery of the electrical component. The shield frame 54 is filled with a heat shrinkable tube 55.
[0029]
The illumination optical system 19 includes an illumination lens 57 disposed in the illumination lens frame 56, a fixed tube 59 to which a light guide fiber 58 that contacts the illumination lens 57 is fixed, and a light guide fiber on the rear end side of the fixed tube 59. It is constituted by a covering tube 60 made of silicon or the like for covering 58.
[0030]
The imaging device 18 and the illumination optical system 19 are fitted into an imaging device mounting hole 63 and an illumination optical system mounting hole 64 formed in the insulating cover 61 and the distal end rigid member 62 constituting the distal end portion 17 and are used as an adhesive. Is fixed.
[0031]
In addition, the tip portion 17 is not illustrated for being ejected through an air / water supply channel for guiding cleaning liquid or gas to the tip portion toward the optical member on the outer surface of the observation optical system by an air supply operation or a water supply operation. An air supply / water supply nozzle and a suction port that is a distal end side opening of a treatment instrument channel for inserting a treatment instrument arranged in the insertion portion 7 and sucking a liquid in a body cavity are provided.
[0032]
FIG. 7 is a vertical cross-sectional view of the tip end portion 17 shown in FIG. 2 taken along the line AA. As described above, the tip end portion 17 is provided with the imaging device 18 provided with the solid-state imaging device 37 having a rectangular outer shape, and a circular shape. The illumination optical system 19, the air / water channel 67, and the treatment instrument channel 68 are disposed.
[0033]
Thus, in this embodiment, the figure 7 As shown in 9 mechanically A captured image of the solid-state imaging device 37 arranged by being rotated clockwise by 0 °, As shown in FIG. In display direction selection means 44 a configured by a plurality of electronic components 44 provided in the imaging device 18. Electrically By rotating 90 ° in the counterclockwise direction, the display image on the monitor 6 can be made to coincide with the vertical and horizontal directions of the distal end portion 17, so that the electronic endoscope can be easily operated.
[0034]
In addition, as shown in FIG. 90 ° Since it can be rotated and placed vertically, the distal end portion 17 can be made smaller in diameter than the arrangement of the imaging device indicated by the broken line that cannot be rotated, and the display direction can be selected even if the imaging device is replaced due to repair or the like. Since the means 44a is in the imaging device 18, a normal image can be reliably displayed on the monitor.
[0035]
In addition, by providing the display direction selection means 44a in the imaging device 18, the distal end portions of the plurality of electronic endoscopes can be thinned by the imaging device 18 using one solid-state imaging device 37.
[0036]
In the present embodiment, the case of rotating by 90 ° has been described. However, the arrangement direction of the solid-state imaging device is not limited to this, and can be arranged at an arbitrary angle according to the built-in objects of each electronic endoscope. It is.
[0037]
For example, the display direction selection unit 44a is arranged in the direction in which the solid-state imaging device 37 is disposed with respect to the distal end bending operation direction. On the basis of the How to invert / convert the image obtained from the objective optical system Instructions in order to Display direction indication means 201 and its Instructions Accordingly, the display direction conversion means 202 including a video processing circuit that converts the captured image in the solid-state imaging device 37 for matching the bending operation direction of the distal end portion 17 with the display image direction on the monitor 6. By separating, the space for arranging each can be reduced. Specifically, as shown in FIG. Display direction indication means The number 201 and the size of the electronic components 44 in the imaging apparatus when the imaging apparatus 18 is used in the display direction selection unit by disposing 201 in the imaging apparatus 18 and disposing the display direction conversion unit 202 in the video processor 5. Therefore, the imaging device 18 can be downsized. Therefore, it is possible to reduce the diameter of the distal end portion 17 where the imaging device 18 is disposed.
[0038]
As a modified example of the circuit board 45, as shown in FIG. 10, side through holes 74 may be formed at four corners, thereby showing the broken lines without reducing the number of side through holes as connection electrodes. Since the circuit board 45 can be reduced in size, the imaging device 18 can be reduced in size.
[0039]
Further, in the electronic endoscope system 1, when the image captured in the solid-state imaging device 72 is blurred about A on the light receiving unit as shown in FIG. Blur Using the correction processing area 75, the received light image shifted by about A can be transmitted to the video processor 5 and displayed on the monitor. In addition, the video processor 5 Blur Using the image data of the correction area 75 Blur A video processing circuit (not shown) for correction processing may be provided and displayed on a monitor.
[0040]
As a result, even if the tip swings in small increments Blur No observation image can be obtained. This is particularly effective during magnified observation, where the observed image is likely to be blurred due to minute pulsations in the body. Blur It is effective to make corrections.
[0041]
A solid-state imaging device 76 shown in FIG. 12 has a circuit board 79 on which electronic components such as an IC 78 are mounted on the back surface of a solid-state imaging device 77. The IC 78 is flip-chip mounted on the connection substrate 80 in advance, and then connected to the circuit substrate 79 with solder or the like using side through holes formed on the side surface of the connection substrate 80. The periphery of the solid-state imaging device 76 is covered with a sealing resin 81 and covered with a heat-shrinkable tube 82. The outer periphery of the solid-state imaging device 76 is used to dissipate heat generated by the solid-state imaging device 76 and the IC 78 to the distal end hard member 62. A heat radiating frame 83 is attached. The rear end side of the heat dissipating frame 83 opens to the end, and the opening 84 comes into contact with the distal end rigid member 62 when fitted into the distal end rigid member 62. It is fixed to the rigid member 62.
[0042]
Thereby, the heat generated by the solid-state imaging device 76 and the IC 78 can be radiated from the contact portion to the distal end rigid member 62, so that the solid-state imaging device 76 and the IC 78 can be prevented from being deteriorated.
[0043]
FIG. 13 is a top view of the circuit board 79. A plurality of mounting lands 86 for mounting the signal line 46 are formed on the base end side of the circuit board 79, and the mounting lands 86 are masked on the base end side of the mounting land 86. tape The masking member 87 which consists of etc. is attached.
[0044]
As a result, the signal line 46 is attached in front of the mounting land 86 at the time of initial assembly. When the signal line 46 is replaced due to disconnection or the like, the masking member 87 is removed, and the base end side is removed as shown in FIG. Since the signal line 46 can be connected to the mounting land 86, the circuit board can be reused.
[0045]
Further, as shown in FIG. 15, mounting lands 89 are formed on the upper and lower surfaces of the circuit board 88, and both are connected by through holes 90 formed on the board. Therefore, when the signal line 46 or the like is disconnected and an exchange operation occurs, the signal line 46 may be connected to the other mounting land 89, and the circuit board 88 can be reused.
[0046]
Note that the circuit board 88 is not limited to a hard circuit board 88 formed of ceramic or the like, and is also applied to a flexible circuit board 91 in which conductive portions 109 are formed on both sides so as to sandwich a polyimide tape 108 as shown in FIG. The same can be applied.
[0047]
A GND portion 117 is formed on the bottom surface of the circuit board 93 of the solid-state imaging device 92 shown in FIG. 17, and the GND portion 117 is attached to the circuit board 93 so that a part of the heat dissipation frame 94 is in surface contact. ing.
[0048]
Thereby, the heat generated by the solid-state imaging device 92 can be radiated to the heat radiating frame 94. In addition, since the GND portion can be widened, the imaging device is highly resistant to external noise and the like.
[0049]
The solid-state imaging device 95 of FIG. 18 has an inner lead 99 that is bent and connected to the lower end of the solid-state imaging device 96 and extending from the tip of a flexible circuit board 98 on which electronic components 97 and the like are mounted in advance. In this flexible circuit board 98, conductive parts 100 for forming lands, wirings, etc. for attaching the electronic component 97 are formed on both surfaces with an insulating polyimide 101 interposed therebetween.
[0050]
At this time, by forming the conductive portion 100 of the flexible circuit board 98 thick (t1, t3> t2), the heat capacity of the solid-state image pickup device 95 can be increased, so that a solid-state image pickup device having high heat resistance is configured. Can do.
[0051]
In the solid-state imaging device 102 of FIG. 19, the rear end side of the flexible circuit board 103 is bent and attached to the distal end rigid member 62, and the entire solid-state imaging device 102 is sealed with an adhesive 105.
[0052]
Thereby, since the heat generated by the solid-state imaging device can be radiated to the distal end rigid member 62, deterioration of the solid-state imaging device can be prevented.
[0053]
In the solid-state imaging device 106 of FIG. 20, a heat radiating member 108 connected to the tip rigid member 62 is attached to the back surface of the solid-state imaging device 107.
[0054]
Thereby, since the heat generated by the solid-state imaging device 106 can be dissipated to the distal end rigid member 62, deterioration of the solid-state imaging device can be prevented. In addition, when the solid-state imaging device 106 is fitted into the distal end rigid member 62, the mounting work can be performed while holding the heat radiation member 108, so that the assemblability is improved.
[0055]
A connection electrode is formed on the back surface of the flexible circuit board 111 of the solid-state imaging device 110 of FIG. 21, and the connection board 112 having the connection electrode 113 to which the cable 50 is connected and the flexible circuit board 111 are used as a conductive adhesive. By connecting the connection electrodes, the connection electrodes can be connected to each other.
[0056]
As a result, the assemblability is improved, and even when the signal line 46 is disconnected, the connection board 112 to which the new signal cable 50 is connected can be attached to the flexible circuit board 114. Therefore, the flexible circuit board of the solid-state imaging device 110 can be attached. Repair can be performed without damaging 111.
[0057]
The solid-state imaging device 114 shown in FIG. 22 has a plurality of, for example, four output lines 118, and the output lines are formed on the upper side of the solid-state imaging device 114 through the side on one side of the light receiving unit. Bo It is led to the bonding pad 115 and connected to the flexible circuit board 116.
[0058]
As a result, the center of the outer shape of the solid-state imaging device and the center of the light receiving unit can be brought close to each other, so that the tip can be reduced in size.
[0059]
In addition, by disposing the flexible circuit board 116 on the upper side of the solid-state imaging device 114, the center position of the light receiving unit can be moved away from the upper end portion of the solid-state imaging device 114, so that the objective lens unit is placed in the solid-state imaging device 114 and imaging. Since it can arrange | position to the lower side of an apparatus external shape, another built-in thing can be arrange | positioned in the vacant space above an objective-lens part. Therefore, the tip portion can be reduced in diameter.
[0060]
[Appendix]
(Additional Item 1) An electronic endoscope in which an imaging device equipped with a solid-state imaging device having the same number of pixels as or more than the monitor output range is disposed at the tip, and signal processing of an imaging signal from the imaging device In an electronic endoscope system comprising a video processor
The electronic mask formed by the video processing of the video processor forms an endoscopic observation image display range smaller than the entire display range of the display means, and prevents pixels that are not displayed on the display means by the electric mask from shaking. Use for
An electronic endoscope system characterized by that.
[0061]
(Additional Item 2) Pixels that are not displayed on the display means by the electric mask during magnified observation are used to prevent camera shake.
Item 3. The electronic endoscope system according to Item 1, wherein
[0062]
(Additional Item 3) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable are electrically connected,
A through hole was formed at an end of the circuit board connected to the solid-state imaging device.
An imaging apparatus characterized by that.
[0063]
(Additional Item 4) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable are electrically connected,
An adhesive filling range was formed at the solid-state imaging device side end of the signal cable.
An imaging apparatus characterized by that.
[0064]
(Additional Item 5) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable are electrically connected,
Of the plurality of signal cable connection portions formed on the circuit board, a part of the signal cable connection portion is covered with a non-conductive masking material.
An imaging apparatus characterized by that.
[0065]
(Additional Item 6) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable are electrically connected,
The signal cable connecting portion for connecting the signal cable is provided on the front and back surfaces of the circuit board, and each is connected through a through hole.
An imaging apparatus characterized by that.
[0066]
(Additional Item 7) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable arranged in a reinforcing frame are electrically connected,
A notch formed in a divergent shape at the rear end of the reinforcing frame is in contact with the tip
An imaging apparatus characterized by that.
[0067]
(Additional Item 8) In an imaging device in which a solid-state imaging device, a circuit board, and a signal cable are disposed in a reinforcing frame,
A large GND portion was formed on the circuit board, and the GND portion and the reinforcing frame were made conductive.
An imaging apparatus characterized by that.
[0068]
(Additional Item 9) In the solid-state imaging device arranged in the reinforcing frame and the imaging device in which the heat dissipation member is arranged around the solid-state imaging device,
The heat dissipation member was connected to the reinforcement frame
An imaging apparatus characterized by that.
[0069]
(Additional Item 10) In an imaging device in which a solid-state imaging device using a flexible circuit board is arranged,
A flexible board for connection to which a signal cable is connected is connected to the flexible circuit board.
An imaging apparatus characterized by that.
[0070]
(Additional Item 11) In an imaging device in which a solid-state imaging device using a flexible circuit board is arranged,
The GND part formed on the rear side of the flexible circuit board was connected to the tip part.
An imaging apparatus characterized by that.
[0071]
(Additional Item 12) In an imaging device in which a solid-state imaging device using a flexible circuit board is arranged,
The thickness of the conductive part layer of the flexible circuit board was made thicker than the resin layer of the base material
An imaging apparatus characterized by that.
[0072]
(Additional Item 13) In an imaging device in which a solid-state imaging device using a flexible circuit board is arranged,
The flexible circuit board is connected to the upper side of the solid-state imaging device, the flexible circuit board extends rearward, and the frame-transferred electrical signal is transmitted from the horizontal transfer area below the light receiving section to the OB section area of the light receiving section. Wiring from the side to the upper side
An imaging apparatus characterized by that.
[0073]
【The invention's effect】
As described above, according to the present invention, there is an effect that the vertical and horizontal directions of the display image of the monitor can be matched with the vertical and horizontal directions of the distal end portion of the endoscope regardless of the arrangement direction of the solid-state imaging device.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a configuration of an electronic endoscope system according to an embodiment of the present invention.
2 is a cross-sectional view showing a cross section in a longitudinal axis direction of a distal end portion of the electronic endoscope of FIG. 1;
3 is a configuration diagram showing the configuration of the solid-state imaging device of FIG. 2;
4 is a diagram showing the display image on the monitor shown in FIG.
5 is a diagram showing the relationship between the arrangement direction of the solid-state imaging device of FIG. 3, the bending operation direction of the distal end portion of the electronic endoscope, and the display direction of the monitor.
6 is a diagram showing a configuration of a base end side of the signal line in FIG. 2;
7 is a cross-sectional view showing a cross section taken along the line AA in FIG.
FIG. 8 is a diagram showing an arrangement on the electronic endoscope system of display direction selection means constituted by a plurality of electronic components in FIG. 2;
FIG. 9 is a view showing a modification of the arrangement on the electronic endoscope system of the display direction selection means constituted by a plurality of electronic components in FIG. 2;
10 is a diagram showing a first modification of the circuit board of FIG. 2;
FIG. 11 shows a video processor of FIG. Blur The figure explaining the effect at the time of having a correction processing function
FIG. 12 is a diagram showing a first modification of the solid-state imaging device of FIG.
FIG. 13 is a first diagram showing a second modification of the circuit board of FIG. 2;
14 is a second diagram showing a second modification of the circuit board of FIG. 2. FIG.
FIG. 15 is a diagram showing a third modification of the circuit board in FIG. 2;
FIG. 16 is a diagram showing a fourth modification of the circuit board in FIG. 2;
FIG. 17 is a diagram showing a fifth modification of the circuit board in FIG. 2;
FIG. 18 is a diagram showing a second modification of the solid-state imaging device of FIG.
FIG. 19 is a diagram showing a third modification of the solid-state imaging device of FIG.
20 is a diagram illustrating a fourth modification of the solid-state imaging device in FIG. 2;
FIG. 21 is a diagram illustrating a fifth modification of the solid-state imaging device in FIG. 2;
FIG. 22 is a diagram showing a sixth modification of the solid-state imaging device in FIG. 2;
FIG. 23 is a diagram for explaining the relationship between the vertical and horizontal directions of the subject and the vertical and horizontal directions on the monitor display;
[Explanation of symbols]
1 ... Electronic endoscope system
2 ... Electronic endoscope
3. Light source device
5 ... Video processor
6 ... Monitor
37. Solid-state imaging device
38 ... cover Glass
39 ... Solid-state image sensor
40 ... External lead
44 ... Electronic components
44a ... Display direction selection means
45 ... Circuit board
46 ... Signal line

Claims (2)

An electronic device comprising an imaging device having at least a solid-state imaging device arranged at a position determined in advance at an imaging position of the objective optical system, wherein an objective optical system is arranged at a distal end portion of the electronic endoscope An endoscope,
A video processor that is connected to the electronic endoscope via a connector device and that performs signal processing on an imaging signal from the imaging device and displays an endoscopic image on a display unit;
In an electronic endoscope system including a light source device that supplies illumination light to the electronic endoscope,
Direction indicating means disposed in the imaging device, wherein the vertical scanning direction of the solid-state imaging device is the vertical direction in the solid-state imaging device, and the horizontal scanning direction is the horizontal direction in the solid-state imaging device. When the vertical and horizontal arrangement directions of the solid-state imaging device arranged at a predetermined position at the distal end and the predetermined bending operation direction at the distal end of the electronic endoscope are defined as the vertical and horizontal directions of the distal end in a direction instruction means for outputting a positional relationship information indicating a relative positional relationship of the with the tip based on the bending operation directions of up, down, left and right of the front end portion the solid-state imaging device,
Based on the positional relationship information indicating the relative positional relationship between the up / down / left / right arrangement directions of the solid-state imaging device and the up / down / left / right bending operation directions of the distal end portion, which is output from the direction instruction means. Display direction conversion means for converting the display direction of the endoscopic image so as to match the vertical and horizontal directions related to the bending operation direction of the unit and the vertical and horizontal directions of the image display direction on the display screen of the display means;
An electronic endoscope system comprising:   The electronic endoscope system according to claim 1, wherein the display direction conversion unit is provided in the video processor.

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