JP4512452B2 - The tip of the electronic endoscope - Google Patents

The tip of the electronic endoscope Download PDF

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JP4512452B2
JP4512452B2 JP2004251576A JP2004251576A JP4512452B2 JP 4512452 B2 JP4512452 B2 JP 4512452B2 JP 2004251576 A JP2004251576 A JP 2004251576A JP 2004251576 A JP2004251576 A JP 2004251576A JP 4512452 B2 JP4512452 B2 JP 4512452B2
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circuit board
solid
distal end
electronic endoscope
state imaging
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JP2006068058A (en
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素子 川村
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Hoya Corp
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Hoya Corp
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Description

この発明は電子内視鏡の先端部に関する。   The present invention relates to a distal end portion of an electronic endoscope.

電子内視鏡においては一般に、挿入部の先端に内蔵された固体撮像素子の背面側に回路基板が配置され、その回路基板に、挿入部内に挿通配置された信号ケーブルの先端から引き出された信号線の先端部分が接続されて、回路基板とその前後に隣接する固体撮像素子と信号線とが封止樹脂塊内に封止されている（例えば、特許文献１）。
特開２００２−１１２９５７ In an electronic endoscope, generally, a circuit board is disposed on the back side of a solid-state imaging device built in the distal end of an insertion portion, and a signal drawn from the distal end of a signal cable inserted into the insertion portion on the circuit board. The front end portion of the wire is connected, and the circuit board, the solid-state imaging device adjacent to the front and back, and the signal line are sealed in the sealing resin mass (for example, Patent Document 1).
JP 2002-112957 A

上述のような構成の電子内視鏡の先端部においては、固体撮像素子と回路基板が封止樹脂塊によって信号ケーブルの先端部分と一体化されて、それらが撮像モジュールユニットとして挿入部の先端内に組み込まれている。   In the distal end portion of the electronic endoscope having the above-described configuration, the solid-state imaging device and the circuit board are integrated with the distal end portion of the signal cable by the sealing resin block, and these are integrated as an imaging module unit in the distal end of the insertion portion. Built in.

しかし、回路基板とその前後に隣接する固体撮像素子と信号線とが単に封止樹脂塊内に封止された構成においては、その固体撮像素子がＮＴＳＣ方式用のものであるかＰＡＬ方式用のものであるかや、固体撮像素子の上下の向き等が一目で判別できないため、組み立て工程や部品管理等において誤りが発生しないよう一つ一つ細かい神経を使う必要があった。   However, in the configuration in which the circuit board, the solid-state image sensor adjacent to the front and back, and the signal line are simply sealed in the sealing resin block, the solid-state image sensor is for the NTSC system or for the PAL system. It is necessary to use fine nerves one by one so that no errors occur in the assembly process and component management because the solid-state imaging device cannot be identified at a glance.

そこで本発明は、固体撮像素子と回路基板とが封止樹脂塊によって信号ケーブルの先端部分と一体化された撮像モジュールユニットの方式や向き等を一目で明瞭に判別することができて、組み立て工程や部品管理等において誤りが発生しないように容易かつ確実に管理することができる電子内視鏡の先端部を提供することを目的とする。   Therefore, the present invention can clearly discriminate at a glance the method and orientation of the imaging module unit in which the solid-state imaging device and the circuit board are integrated with the tip portion of the signal cable by the sealing resin block, and the assembly process. Another object of the present invention is to provide a distal end portion of an electronic endoscope that can be easily and reliably managed so as not to cause errors in component management and the like.

上記の目的を達成するため、本発明の電子内視鏡の先端部は、挿入部の先端に内蔵された固体撮像素子の背面側に回路基板が配置され、その回路基板に、挿入部内に挿通配置された信号ケーブルの先端から引き出された信号線の先端部分が接続された電子内視鏡の先端部において、固体撮像素子の特性を表示する指標を回路基板の側面部分に設けて、固体撮像素子と信号線の各々の少なくとも回路基板に隣接する部分と回路基板とを透明な封止樹脂塊内に封止したものである。   In order to achieve the above object, the distal end portion of the electronic endoscope of the present invention has a circuit board disposed on the back side of the solid-state imaging device built in the distal end of the insertion portion, and is inserted into the insertion portion of the circuit board. At the tip of the electronic endoscope to which the tip of the signal line led out from the tip of the arranged signal cable is connected, an indicator for displaying the characteristics of the solid-state image sensor is provided on the side part of the circuit board, and the solid-state imaging At least a portion of each element and signal line adjacent to the circuit board and the circuit board are sealed in a transparent sealing resin block.

なお、指標は、固体撮像素子がＮＴＳＣ方式用であるかＰＡＬ方式用であるかを表示するものであってもよく、或いは、指標が固体撮像素子の向きを表示するものであってもよい。また、指標が、回路基板自体の形状により形成されていてもよい。   The index may indicate whether the solid-state image sensor is for the NTSC system or the PAL system, or the index may indicate the direction of the solid-state image sensor. The indicator may be formed by the shape of the circuit board itself.

本発明によれば、固体撮像素子の特性を表示する指標を回路基板の側面部分に設けて、固体撮像素子と信号線の各々の少なくとも回路基板に隣接する部分と回路基板とを透明な封止樹脂塊内に封止したことにより、透明な封止樹脂塊を通して指標を容易に識別して、撮像モジュールユニットの方式や向き等を一目で明瞭に判別することができ、組み立て工程や部品管理等において誤りが発生しないように容易かつ確実に管理することができる。   According to the present invention, an indicator for displaying the characteristics of the solid-state image sensor is provided on the side surface portion of the circuit board, and at least a portion of each of the solid-state image sensor and the signal line adjacent to the circuit board and the circuit board are sealed By sealing in the resin mass, the index can be easily identified through the transparent resin mass, and the method and orientation of the imaging module unit can be clearly identified at a glance, assembling process, parts management, etc. Can be managed easily and reliably so that no error occurs.

挿入部の先端に内蔵された固体撮像素子の背面側に回路基板が配置され、その回路基板に、挿入部内に挿通配置された信号ケーブルの先端から引き出された信号線の先端部分が接続された電子内視鏡の先端部において、固体撮像素子の特性を表示する指標を回路基板の側面部分に設けて、固体撮像素子と信号線の各々の少なくとも回路基板に隣接する部分と回路基板とを透明な封止樹脂塊内に封止する。   A circuit board is disposed on the back side of the solid-state imaging device built in the distal end of the insertion section, and the distal end portion of the signal line drawn from the distal end of the signal cable inserted and disposed in the insertion section is connected to the circuit board. At the tip of the electronic endoscope, an indicator for displaying the characteristics of the solid-state image sensor is provided on the side surface portion of the circuit board, and at least the part of the solid-state image sensor and the signal line adjacent to the circuit board and the circuit board are transparent Seal in a sealing resin mass.

図面を参照して本発明の実施例を説明する。
図１は電子内視鏡の挿入部１の先端部分を示しており、挿入部１の先端に連結された先端部本体２の先端面に観察窓３や図示されていない照明窓等が配置されている。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a distal end portion of an insertion portion 1 of an electronic endoscope. An observation window 3 and an illumination window (not shown) are arranged on the distal end surface of a distal end main body 2 connected to the distal end of the insertion portion 1. ing.

先端部本体２内には、観察窓３の奥に対物光学系４が配置されている。そして、対物光学系４による被写体の投影位置に、固体撮像素子５の撮像面５ａが配置されていて、固体撮像素子５により内視鏡観察像が光電変換される。   An objective optical system 4 is disposed in the distal end main body 2 behind the observation window 3. The imaging surface 5 a of the solid-state imaging device 5 is disposed at the subject projection position by the objective optical system 4, and the endoscope observation image is photoelectrically converted by the solid-state imaging device 5.

固体撮像素子５の背面壁には、例えばセラミックスブロック体等からなる回路基板６が接合固着されていて、固体撮像素子５の駆動回路等を構成する例えばコンデンサやトランジスタ等の電子部品７が、回路基板６の中間部分に形成された凹部に取り付けられている。   A circuit board 6 made of, for example, a ceramic block body is bonded and fixed to the back wall of the solid-state image pickup device 5, and an electronic component 7 such as a capacitor or a transistor constituting the drive circuit of the solid-state image pickup device 5 is connected to the circuit. It is attached to a recess formed in the middle part of the substrate 6.

挿入部１内には、固体撮像素子５で撮像された内視鏡観察像の撮像信号等を伝送するための信号ケーブル１０が全長にわたって挿通配置されていて、信号ケーブル１０の先端から前方に延出する複数の信号線１１の先端が、回路基板６の後端部分に形成された信号線接続端子１３に半田付けによって各々接続固着されている。   A signal cable 10 for transmitting an imaging signal of an endoscopic observation image captured by the solid-state image sensor 5 is inserted and disposed throughout the insertion portion 1 and extends forward from the distal end of the signal cable 10. The leading ends of the plurality of signal lines 11 are connected and fixed to the signal line connecting terminals 13 formed at the rear end portion of the circuit board 6 by soldering.

固体撮像素子５の上辺部と下辺部から各々後方に延出する複数のインナーリード８の延出端は、回路基板６の表面に信号線接続端子１３と接近して形成されたリード接続端子１２に半田付けにより接続固着されている。９は、複数並んで配置されているインナーリード８の中間位置に横断的に取り付けられた絶縁板である。   The extending ends of the plurality of inner leads 8 extending rearward from the upper and lower sides of the solid-state image sensor 5 are lead connecting terminals 12 formed on the surface of the circuit board 6 close to the signal line connecting terminals 13. The connection is fixed by soldering. Reference numeral 9 denotes an insulating plate attached transversely to an intermediate position of the inner leads 8 arranged in a line.

そのように配置された固体撮像素子５と回路基板６と信号線１１は、インナーリード８部分等も含めて、例えばエポキシ樹脂等からなる透明な封止樹脂塊１５内に一塊に封止されており、それらが信号ケーブル１０の先端部分と一体化された状態で、いわゆる撮像モジュールとしてユニット化されている。   The solid-state imaging device 5, the circuit board 6, and the signal line 11 arranged in such a manner are sealed together in a transparent sealing resin block 15 made of, for example, epoxy resin, including the inner lead 8 portion and the like. In the state where they are integrated with the tip portion of the signal cable 10, they are unitized as a so-called imaging module.

図２〜図４は、そのような信号ケーブル１０の先端に構成された撮像モジュールユニットを示しており、図２はＮＴＳＣ方式用の固体撮像素子５が用いられたユニット、図３はＰＡＬ方式用の固体撮像素子５が用いられたユニットである。   2 to 4 show an imaging module unit configured at the tip of such a signal cable 10, FIG. 2 is a unit using an NTSC solid-state imaging device 5, and FIG. 3 is a PAL system. This is a unit in which the solid-state imaging device 5 is used.

図２に示されるようにＮＴＳＣ方式用の固体撮像素子５が用いられたユニットにおいては、回路基板６の側面部分に例えば矩形状の孔からなる指標１６が形成され、図３に示されるようにＰＡＬ方式用の固体撮像素子５が用いられたユニットにおいては、回路基板６の側面部分に例えば円形状の孔からなる指標１６が形成されている。   As shown in FIG. 2, in the unit using the NTSC solid-state imaging device 5, an index 16 made of, for example, a rectangular hole is formed on the side surface portion of the circuit board 6, as shown in FIG. In a unit in which the PAL type solid-state imaging device 5 is used, an index 16 made of, for example, a circular hole is formed on the side surface portion of the circuit board 6.

したがって、そのような指標１６は透明な封止樹脂塊１５を通して一目で識別することができるので、その撮像モジュールユニットがＮＴＳＣ方式用であるかＰＡＬ方式用であるかを明瞭に判別することができて、組み立て工程や部品管理等において誤りが発生しないように容易かつ確実に管理することができる。   Therefore, since such an index 16 can be identified at a glance through the transparent sealing resin mass 15, it is possible to clearly determine whether the imaging module unit is for the NTSC system or the PAL system. Thus, it can be managed easily and reliably so as not to cause errors in the assembly process, component management, and the like.

また、図４に示されるユニットにおいては、固体撮像素子５の上下方向の向きを矢印の孔で示す指標１６が回路基板６の側面部分に形成されており、そのような指標１６を透明な封止樹脂塊１５を通して一目で識別することができるので、組み立て工程において特別の神経を使うことなく固体撮像素子５の上下方向を誤らずに組み付けることができる。   Further, in the unit shown in FIG. 4, an index 16 indicating the vertical direction of the solid-state imaging device 5 with an arrow hole is formed on the side surface portion of the circuit board 6, and such an index 16 is transparently sealed. Since it can be identified at a glance through the stop resin mass 15, the vertical direction of the solid-state imaging device 5 can be assembled without mistakes without using a special nerve in the assembly process.

なお、本発明は上記実施例に限定されるものではなく、例えば指標１６は記号や文字等であってもよく、また指標１６は上述のように回路基板６自体の形状で形成してもよいが、回路基板６の表面に付したものであっても差し支えない。   The present invention is not limited to the above embodiment. For example, the index 16 may be a symbol or a character, and the index 16 may be formed in the shape of the circuit board 6 itself as described above. However, it may be attached to the surface of the circuit board 6.

また、封止樹脂塊１５は、固体撮像素子５と信号線１１の各々の少なくとも回路基板６に隣接する部分と回路基板６とを囲んで封止するものであればよい。   Further, the sealing resin block 15 may be anything that surrounds and seals at least a portion of each of the solid-state imaging device 5 and the signal line 11 adjacent to the circuit board 6 and the circuit board 6.

本発明の実施例の電子内視鏡の挿入部の先端部分の側面断面図である。It is side surface sectional drawing of the front-end | tip part of the insertion part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の先端部の第１の撮像モジュールユニットの斜視図である。It is a perspective view of the 1st imaging module unit of the front-end | tip part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の先端部の第２の撮像モジュールユニットの斜視図である。It is a perspective view of the 2nd imaging module unit of the front-end | tip part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の先端部の第３の撮像モジュールユニットの斜視図である。It is a perspective view of the 3rd imaging module unit of the front-end | tip part of the electronic endoscope of the Example of this invention.

符号の説明Explanation of symbols

１ 挿入部
５ 固体撮像素子
６ 回路基板
７ 電子部品
１０ 信号ケーブル
１１ 信号線
１５ 封止樹脂塊
１６ 指標 DESCRIPTION OF SYMBOLS 1 Insertion part 5 Solid-state image sensor 6 Circuit board 7 Electronic component 10 Signal cable 11 Signal line 15 Sealing resin lump 16 Index

Claims (2)

挿入部の先端に内蔵された固体撮像素子の背面側に回路基板が配置され、その回路基板に、上記挿入部内に挿通配置された信号ケーブルの先端から引き出された信号線の先端部分が接続された電子内視鏡の先端部において、
上記固体撮像素子がＮＴＳＣ方式用であるかＰＡＬ方式用であるかを表示する指標を上記回路基板の側面部分に設けて、上記固体撮像素子と上記信号線の各々の少なくとも上記回路基板に隣接する部分と上記回路基板とを透明な封止樹脂塊内に封止したことを特徴とする電子内視鏡の先端部。 A circuit board is disposed on the back side of the solid-state imaging device built in the distal end of the insertion portion, and the distal end portion of the signal line drawn from the distal end of the signal cable inserted and disposed in the insertion portion is connected to the circuit board. At the tip of the electronic endoscope
An indicator for indicating whether the solid-state imaging device is for the NTSC system or the PAL system is provided on a side surface portion of the circuit board, and at least each of the solid-state imaging element and the signal line is adjacent to the circuit board. A tip portion of an electronic endoscope, wherein the portion and the circuit board are sealed in a transparent sealing resin mass. 上記指標が、上記回路基板自体の形状により形成されている請求項１記載の電子内視鏡の先端部。 The index is, the distal end portion of an electronic endoscope according to claim 1 Symbol placement is formed by the shape of the circuit board itself.
JP2004251576A 2004-08-31 2004-08-31 The tip of the electronic endoscope Expired - Fee Related JP4512452B2 (en)

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Publication number Priority date Publication date Assignee Title
JP4594703B2 (en) * 2004-11-19 2010-12-08 オリンパス株式会社 Solid-state image sensor unit
JP5926955B2 (en) 2011-12-28 2016-05-25 オリンパス株式会社 Imaging mechanism and endoscope apparatus
JP7427544B2 (en) 2020-06-23 2024-02-05 株式会社フジクラ Imaging module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63273338A (en) * 1987-04-30 1988-11-10 Olympus Optical Co Ltd Semiconductor device
JP2002112957A (en) * 2000-10-12 2002-04-16 Olympus Optical Co Ltd Electronic endoscope system
JP2002136472A (en) * 2000-11-02 2002-05-14 Olympus Optical Co Ltd Endoscope

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63273338A (en) * 1987-04-30 1988-11-10 Olympus Optical Co Ltd Semiconductor device
JP2002112957A (en) * 2000-10-12 2002-04-16 Olympus Optical Co Ltd Electronic endoscope system
JP2002136472A (en) * 2000-11-02 2002-05-14 Olympus Optical Co Ltd Endoscope

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