JP4589659B2 - Method for assembling the tip of the electronic endoscope - Google Patents

Method for assembling the tip of the electronic endoscope Download PDF

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JP4589659B2
JP4589659B2 JP2004160368A JP2004160368A JP4589659B2 JP 4589659 B2 JP4589659 B2 JP 4589659B2 JP 2004160368 A JP2004160368 A JP 2004160368A JP 2004160368 A JP2004160368 A JP 2004160368A JP 4589659 B2 JP4589659 B2 JP 4589659B2
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lead
inner lead
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soldering
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JP2005334509A (en
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知史 岩川
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Hoya Corp
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Description

この発明は電子内視鏡の先端部の組立方法に関する。   The present invention relates to a method for assembling a distal end portion of an electronic endoscope.

電子内視鏡においては一般に、挿入部の先端に内蔵された固体撮像素子の背面側に隣接して、固体撮像素子の駆動回路等を構成する電子部品が搭載された回路基板が配置され、固体撮像素子から後方に延出するインナーリードと、固体撮像素子で撮像された撮像信号等を伝送するために挿入部内に挿通配置された信号ケーブルとが、互いに近接した位置において回路基板上の接続端子に半田付けにより接続されている（例えば、特許文献１）。
特開平１０−１９２２３５ In an electronic endoscope, generally, a circuit board on which electronic components constituting a drive circuit of a solid-state image sensor are mounted is disposed adjacent to the back side of the solid-state image sensor built in the distal end of the insertion portion. A connection terminal on the circuit board at a position where an inner lead extending rearward from the image sensor and a signal cable inserted in the insertion portion for transmitting an image signal captured by the solid-state image sensor are close to each other (For example, Patent Document 1).
JP-A-10-192235

上述のような従来の電子内視鏡の組立工程においては、回路基板のリード接続端子にインナーリードが半田付け接続されてから信号線接続端子に信号ケーブルが半田付け接続され、その後で、半田付け接続部が封止樹脂によって封止される。   In the assembly process of the conventional electronic endoscope as described above, the inner leads are soldered and connected to the lead connecting terminals of the circuit board, and then the signal cables are soldered and connected to the signal line connecting terminals. The connecting portion is sealed with a sealing resin.

しかし、固体撮像素子の小型化に伴って回路基板が小型化されると、信号線接続端子に信号ケーブルを半田付け接続する際の熱によって、すでにリード接続端子に半田付け接続されているインナーリードの半田付けが溶けて外れ、接続不良になってしまう場合がある。また、固体撮像素子の小型化に伴ってインナーリードが細くなると、半田付け作業の際に誤ってインナーリードを変形させてしまう恐れがある。   However, if the circuit board is downsized with the downsizing of the solid-state image sensor, the inner leads that are already soldered to the lead connection terminals due to the heat generated when the signal cables are soldered to the signal line connection terminals Soldering may melt and come off, resulting in poor connection. In addition, if the inner lead becomes thinner as the solid-state imaging device becomes smaller, the inner lead may be deformed by mistake during the soldering operation.

そこで本発明は、固体撮像素子の背面側に配置された回路基板が小型化されても、回路基板に対するインナーリードと信号ケーブルの接続を良好かつ確実に行うことができる電子内視鏡の先端部の組立方法を提供することを目的とする。   Therefore, the present invention provides a distal end portion of an electronic endoscope that can connect the inner lead and the signal cable to the circuit board satisfactorily and reliably even if the circuit board disposed on the back side of the solid-state imaging device is downsized. It is an object to provide an assembly method.

上記の目的を達成するため、本発明の電子内視鏡の先端部の組立方法は、電子内視鏡の挿入部の先端に内蔵された固体撮像素子の背面側に隣接して、固体撮像素子の駆動回路等を構成する電子部品が搭載された回路基板が配置され、固体撮像素子から延出するインナーリードと、固体撮像素子で撮像された撮像信号等を伝送するために挿入部内に挿通配置された信号ケーブルとが、回路基板に互いに近接して配置されたリード接続端子と信号線接続端子とに半田付けにより接続された電子内視鏡の先端部の組立方法において、リード接続端子にインナーリードを半田付け接続した後であって信号線接続端子に信号ケーブルを半田付け接続する前に、リード接続端子に対するインナーリードの接続部とインナーリードそのものとを、信号線接続端子に信号ケーブルを接続する際の半田付けによりリード接続端子部分に及ぼされる熱に対する耐熱性を有する封止樹脂により封止したものである。   In order to achieve the above object, a method for assembling a distal end portion of an electronic endoscope according to the present invention includes a solid-state imaging device adjacent to a back side of a solid-state imaging device built in a distal end of an insertion portion of the electronic endoscope. A circuit board on which electronic components constituting the drive circuit and the like are mounted is disposed, and an inner lead extending from the solid-state image sensor, and an insertion portion disposed in the insertion portion for transmitting an image signal captured by the solid-state image sensor In the assembling method of the distal end portion of the electronic endoscope in which the connected signal cable is soldered to the lead connection terminal and the signal line connection terminal arranged close to each other on the circuit board, After soldering the lead and before soldering the signal cable to the signal line connection terminal, connect the inner lead connection to the lead connection terminal and the inner lead itself. By soldering for connecting the signal cable to the child in which sealed by the sealing resin having heat resistance against the heat exerted on the lead connecting terminal portion.

なお、リード接続端子に対するインナーリードの接続部とインナーリードそのものとを封止する封止樹脂が電気絶縁性を有しているとよい。
また、封止樹脂により、リード接続端子に対するインナーリードの接続部とインナーリードそのものと共に、電子部品も封止されてもよく、信号線接続端子が、リード接続端子に比べて凹んだ位置に形成されていると、半田付け作業をより容易に行うことができる。 The sealing resin that seals the connection portion of the inner lead to the lead connection terminal and the inner lead itself preferably has electrical insulation.
In addition, the electronic resin may be sealed together with the inner lead connecting portion with respect to the lead connecting terminal and the inner lead itself by the sealing resin, and the signal line connecting terminal is formed at a recessed position compared to the lead connecting terminal. As a result, the soldering operation can be performed more easily.

本発明によれば、リード接続端子にインナーリードを半田付け接続した後であって信号線接続端子に信号ケーブルを半田付け接続する前に、リード接続端子に対するインナーリードの接続部とインナーリードそのものとを、信号線接続端子に信号ケーブルを接続する際の半田付けによりリード接続端子部分に及ぼされる熱に対する耐熱性を有する封止樹脂により封止したことにより、信号ケーブルの半田付け接続作業の際にインナーリードの半田付け部が封止樹脂により保護されるので、回路基板が小型化されても、回路基板に対するインナーリードと信号ケーブルの接続を良好かつ確実に行うことができる。   According to the present invention, after soldering and connecting the inner lead to the lead connecting terminal and before soldering and connecting the signal cable to the signal line connecting terminal, the inner lead connecting portion to the lead connecting terminal and the inner lead itself Is sealed with a sealing resin that is heat resistant to the heat applied to the lead connection terminal portion by soldering when connecting the signal cable to the signal line connection terminal. Since the soldering portion of the inner lead is protected by the sealing resin, the inner lead and the signal cable can be connected to the circuit board satisfactorily and reliably even if the circuit board is downsized.

電子内視鏡の挿入部の先端に内蔵された固体撮像素子の背面側に隣接して、固体撮像素子の駆動回路等を構成する電子部品が搭載された回路基板が配置され、固体撮像素子から延出するインナーリードと、固体撮像素子で撮像された撮像信号等を伝送するために挿入部内に挿通配置された信号ケーブルとが、回路基板に互いに近接して配置されたリード接続端子と信号線接続端子とに半田付けにより接続された電子内視鏡の先端部の組立方法において、リード接続端子にインナーリードを半田付け接続した後であって信号線接続端子に信号ケーブルを半田付け接続する前に、リード接続端子に対するインナーリードの接続部とインナーリードそのものとを、信号線接続端子に信号ケーブルを接続する際の半田付けによりリード接続端子部分に及ぼされる熱に対する耐熱性を有する封止樹脂により封止する。   A circuit board on which electronic components constituting a drive circuit of the solid-state image sensor are mounted is disposed adjacent to the back side of the solid-state image sensor incorporated in the distal end of the insertion portion of the electronic endoscope. A lead connection terminal and a signal line in which an extended inner lead and a signal cable inserted in the insertion portion for transmitting an imaging signal or the like imaged by the solid-state imaging device are arranged close to each other on the circuit board In the method of assembling the distal end portion of the electronic endoscope connected to the connection terminal by soldering, after the inner lead is soldered to the lead connection terminal and before the signal cable is soldered to the signal line connection terminal In addition, the inner lead connection part to the lead connection terminal and the inner lead itself are soldered to the lead connection terminal part by soldering when connecting the signal cable to the signal line connection terminal. Sealed with a sealing resin having heat resistance against heat crucible.

図面を参照して本発明の実施例を説明する。
図１は電子内視鏡の挿入部１の先端部分を示しており、挿入部１の先端に連結された先端部本体２の先端面に観察窓３や図示されていない照明窓等が配置されている。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a distal end portion of an insertion portion 1 of an electronic endoscope. An observation window 3 and an illumination window (not shown) are arranged on the distal end surface of a distal end main body 2 connected to the distal end of the insertion portion 1. ing.

先端部本体２内には、観察窓３の奥に対物光学系４が配置されている。そして、対物光学系４による被写体の投影位置に、固体撮像素子５の撮像面５ａが配置されていて、固体撮像素子５により内視鏡観察像が光電変換される。   An objective optical system 4 is disposed in the distal end main body 2 behind the observation window 3. The imaging surface 5 a of the solid-state imaging device 5 is disposed at the subject projection position by the objective optical system 4, and the endoscope observation image is photoelectrically converted by the solid-state imaging device 5.

固体撮像素子５の背面壁には、例えばセラミックスブロック体等からなる回路基板６が接合固着されていて、固体撮像素子５の駆動回路等を構成する例えばコンデンサやトランジスタ等の電子部品７が、回路基板６の中間部分に形成されている凹部内に取り付けられている。   A circuit board 6 made of, for example, a ceramic block body is bonded and fixed to the back wall of the solid-state image pickup device 5, and an electronic component 7 such as a capacitor or a transistor constituting the drive circuit of the solid-state image pickup device 5 is connected to the circuit. It is attached in a recess formed in the middle part of the substrate 6.

挿入部１内には、固体撮像素子５で撮像された内視鏡観察像の撮像信号等を伝送するための信号ケーブル１０が全長にわたって挿通配置されていて、信号ケーブル１０の先端から前方に延出する複数の信号線１１の先端が、回路基板６の後端部分に凹んで形成された信号線接続端子１３に半田付けによって各々接続固着されている。   A signal cable 10 for transmitting an imaging signal of an endoscopic observation image captured by the solid-state image sensor 5 is inserted and disposed throughout the insertion portion 1 and extends forward from the distal end of the signal cable 10. The leading ends of the plurality of signal lines 11 to be output are connected and fixed to the signal line connecting terminals 13 formed in the rear end portion of the circuit board 6 by being soldered.

図２は、そのような回路基板６を斜め後方から見た状態を示し、図３は、図２から封止樹脂１５を取り除いて示しており、固体撮像素子５の上辺部と下辺部から後方に延出する複数のインナーリード８の延出端が、回路基板６の後端寄りの位置の表面に信号線接続端子１３と接近して形成されたリード接続端子１２に半田付けにより接続固着されている。９は、複数並んで配置されているインナーリード８の内面側に取り付けられた絶縁板である。   FIG. 2 shows a state in which such a circuit board 6 is viewed obliquely from the rear, and FIG. 3 shows the state in which the sealing resin 15 is removed from FIG. The extending ends of the plurality of inner leads 8 extending in the direction are fixedly connected to the lead connecting terminals 12 formed close to the signal line connecting terminals 13 on the surface near the rear end of the circuit board 6 by soldering. ing. Reference numeral 9 denotes an insulating plate attached to the inner surface side of the inner leads 8 arranged in a line.

そして、そのようなリード接続端子１２に対するインナーリード８の接続部の全てと、インナーリード８そのものと、電子部品７が配置されている凹部とが、図１及び図２に示されるように、封止樹脂１５によって封止されている。   All of the connecting portions of the inner leads 8 to the lead connecting terminals 12, the inner leads 8 themselves, and the recesses in which the electronic components 7 are arranged are sealed as shown in FIG. 1 and FIG. Sealed with a stop resin 15.

ただし、そのような封止樹脂１５による封止作業は、リード接続端子１２にインナーリード８を半田付け接続した後であって、信号線接続端子１３に信号ケーブル１０の信号線１１を半田付け接続する前に行われている。   However, the sealing work with such a sealing resin 15 is after the inner lead 8 is soldered and connected to the lead connecting terminal 12 and the signal line 11 of the signal cable 10 is soldered and connected to the signal line connecting terminal 13. Has been done before.

そして、封止樹脂１５としては、信号線接続端子１３に信号ケーブル１０の信号線１１を接続する際の半田付けによりリード接続端子１２部分に及ぼされる熱に対する耐熱性を有する合成樹脂が用いられている。そのような封止樹脂１５としては、例えばエポキシ系、シリコン系、フッ素系又はポリオレフィン系等のような電気絶縁性を有する合成樹脂を用いることができる。   As the sealing resin 15, a synthetic resin having heat resistance against heat exerted on the lead connection terminal 12 portion by soldering when connecting the signal line 11 of the signal cable 10 to the signal line connection terminal 13 is used. Yes. As such a sealing resin 15, for example, a synthetic resin having an electrical insulating property such as epoxy, silicon, fluorine, or polyolefin can be used.

図４ないし図６は、そのような回路基板６に対するインナーリード８と信号ケーブル１０の接続工程を順に示しており、まず、図４に示されるように、各リード接続端子１２に対してインナーリード８の延出端部分を半田付けにより接続固着する。   4 to 6 sequentially show the steps of connecting the inner lead 8 and the signal cable 10 to the circuit board 6 as described above. First, as shown in FIG. The extending end portion of 8 is connected and fixed by soldering.

次いで、図５に示されるように、リード接続端子１２に対するインナーリード８の接続部の全てと、インナーリード８そのものと、電子部品７が配置されている凹部とを封止樹脂１５により封止してから、図６に示されるように、信号線接続端子１３に信号ケーブル１０の信号線１１を半田付けにより接続固着する。   Next, as shown in FIG. 5, all the connecting portions of the inner leads 8 to the lead connecting terminals 12, the inner leads 8 themselves, and the recesses in which the electronic components 7 are arranged are sealed with a sealing resin 15. Then, as shown in FIG. 6, the signal line 11 of the signal cable 10 is connected and fixed to the signal line connection terminal 13 by soldering.

そのような工程順を採ることにより、信号線接続端子１３に信号ケーブル１０の信号線１１を半田付けする際には、その半田付けにより及ぼされる熱に対する耐熱性を有する封止樹脂１５によって、リード接続端子１２に対するインナーリード８の接続部が全て封止されているので、半田がリード接続端子１２側に流れてもその半田がリード接続端子１２と導通せず、またインナーリード８とリード接続端子１２との接続状態が破壊されない。   By adopting such a process order, when the signal line 11 of the signal cable 10 is soldered to the signal line connection terminal 13, the lead is sealed by the sealing resin 15 having heat resistance against the heat exerted by the soldering. Since all the connecting portions of the inner leads 8 to the connection terminals 12 are sealed, even if the solder flows to the lead connection terminals 12 side, the solder does not conduct with the lead connection terminals 12, and the inner leads 8 and the lead connection terminals The connection state with 12 is not destroyed.

また、インナーリード８自体も封止樹脂１５により封止されているので、固体撮像素子５と回路基板６の小型化に伴ってインナーリード８が細く形成されていても、信号線１１を接続するための半田付け作業によりインナーリード８が破損しない。   Further, since the inner lead 8 itself is also sealed with the sealing resin 15, the signal line 11 is connected even if the inner lead 8 is formed thin with the miniaturization of the solid-state imaging device 5 and the circuit board 6. Therefore, the inner lead 8 is not damaged by the soldering operation.

本発明の実施例の電子内視鏡の挿入部の先端部分の側面断面図である。It is side surface sectional drawing of the front-end | tip part of the insertion part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の固体撮像素子と回路基板部分の斜視図である。It is a perspective view of the solid-state image sensor and circuit board part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の固体撮像素子と回路基板部分から封止樹脂を取り除いて示す斜視図である。It is a perspective view which removes sealing resin from the solid-state image sensor and circuit board part of the electronic endoscope of the Example of this invention. 本発明の実施例の電子内視鏡の回路基板に対するインナーリードと信号ケーブルの接続工程を順に示す側面断面図である。It is side surface sectional drawing which shows the connection process of the inner lead with respect to the circuit board of the electronic endoscope of the Example of this invention, and a signal cable in order. 本発明の実施例の電子内視鏡の回路基板に対するインナーリードと信号ケーブルの接続工程を順に示す側面断面図である。It is side surface sectional drawing which shows the connection process of the inner lead with respect to the circuit board of the electronic endoscope of the Example of this invention, and a signal cable in order. 本発明の実施例の電子内視鏡の回路基板に対するインナーリードと信号ケーブルの接続工程を順に示す側面断面図である。It is side surface sectional drawing which shows the connection process of the inner lead with respect to the circuit board of the electronic endoscope of the Example of this invention, and a signal cable in order.

符号の説明Explanation of symbols

１ 挿入部
２ 先端部本体
５ 固体撮像素子
６ 回路基板
７ 電子部品
８ インナーリード
１０ 信号ケーブル
１１ 信号線
１２ リード接続端子
１３ 信号線接続端子
１５ 封止樹脂 DESCRIPTION OF SYMBOLS 1 Insertion part 2 Tip part main body 5 Solid-state image sensor 6 Circuit board 7 Electronic component 8 Inner lead 10 Signal cable 11 Signal line 12 Lead connection terminal 13 Signal line connection terminal 15 Sealing resin

Claims (2)

電子内視鏡の挿入部の先端に内蔵された固体撮像素子の背面側に隣接して、上記固体撮像素子の駆動回路等を構成する電子部品が搭載された回路基板が配置され、上記固体撮像素子から延出するインナーリードと、上記固体撮像素子で撮像された撮像信号等を伝送するために上記挿入部内に挿通配置された信号ケーブルとが、上記回路基板に互いに近接して配置されたリード接続端子と信号線接続端子とに半田付けにより接続された電子内視鏡の先端部の組立方法において、
上記回路基板の上記インナーリードに対向する位置に凹部が形成されて、その凹部内に上記電子部品が配置されると共に、上記インナーリードの上記電子部品に対向する側の面に絶縁板が取り付けられ、
上記リード接続端子に上記インナーリードを半田付け接続した後であって上記信号線接続端子に上記信号ケーブルを半田付け接続する前に、上記リード接続端子に対する上記インナーリードの接続部と上記インナーリードそのものとを、上記信号線接続端子に上記信号ケーブルを接続する際の半田付けにより上記リード接続端子部分に及ぼされる熱に対する耐熱性を有する電気絶縁性の封止樹脂によって、上記絶縁板及び上記電子部品と共に封止したことを特徴とする電子内視鏡の先端部の組立方法。 A circuit board on which electronic components constituting a drive circuit of the solid-state image sensor are mounted is arranged adjacent to the back side of the solid-state image sensor built in the distal end of the insertion portion of the electronic endoscope, and the solid-state image sensor An inner lead extending from the element and a signal cable inserted and disposed in the insertion portion for transmitting an imaging signal or the like imaged by the solid-state imaging element are disposed close to the circuit board. In the assembling method of the distal end portion of the electronic endoscope connected to the connection terminal and the signal line connection terminal by soldering,
A concave portion is formed at a position facing the inner lead of the circuit board, the electronic component is disposed in the concave portion, and an insulating plate is attached to a surface of the inner lead facing the electronic component. ,
After soldering and connecting the inner lead to the lead connecting terminal and before soldering and connecting the signal cable to the signal line connecting terminal, the inner lead connecting portion to the lead connecting terminal and the inner lead itself preparative, I by the electrically insulating sealing resin having heat resistance against the heat exerted on the lead connecting terminal portion by soldering for connecting the signal cable to the signal line connection terminals, the insulating plate and A method for assembling a distal end portion of an electronic endoscope, wherein the electronic component is sealed together with the electronic component . 上記信号線接続端子が、上記リード接続端子に比べて凹んだ位置に形成されている請求項１記載の電子内視鏡の先端部の組立方法。 The signal line connection terminal, the lead connecting claim 1 Symbol placement tip assembly method of the electronic endoscope is formed at a position recessed in comparison with the terminal.
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