JP2001120501A - Solid image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate connecting work of leads and lands, and to prevent the occurrence of short circuit even when a CCD is miniaturized. SOLUTION: The leads 23b, 23c from the CCD 23 are connected to the lands 24g, 24f on a circuit board 24 by solder or the like. The lands 24g, 24f are arranged in a zigzag shape, and a pitch of the mutual lands 24g and a pitch of the mutual lands 24f are wider than when the lands 24g, 24f are arranged in a row. Thus, connecting work is facilitated to reduce the possibility of causing short circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device used for an electronic endoscope.

[0002]

2. Description of the Related Art Conventionally, various devices for electronically capturing a subject image using a solid-state image sensor have been developed. For example, a solid-state imaging device using a CCD (charge coupled device) is also used in an electronic endoscope device and the like.

As a conventional solid-state imaging device applied to an endoscope device, there is one disclosed in Japanese Patent Application Laid-Open No. 9-98944. In this proposal, a light receiving unit of a solid-state imaging device (CCD) is arranged at an image forming position of an objective lens provided at the end of the endoscope. The CCD has leads connected to a circuit board on which electric components are mounted. A land portion is formed on the circuit board, and a lead extending from the CCD is electrically connected by using the land portion by soldering or the like.

A plurality of lands for connecting CCD leads are arranged in a line at a predetermined pitch on a circuit board. The land pitch depends on the size of the CCD. In recent years, miniaturization of endoscope apparatuses has been promoted, and accordingly, CCDs have also been miniaturized. With the miniaturization of the CCD, the pitch of the lead extending from the CCD tends to be narrow. As the pitch of the CCD leads becomes narrower, the land pitch of the circuit board connecting the leads also becomes narrower,
There is a problem that the connection work to the land becomes difficult. Also, the pitch of the lands becomes narrow, and the possibility that adjacent leads are short-circuited increases.

[0005]

As described above, in the above-mentioned conventional solid-state imaging device, the pitch of the lands on the circuit board becomes narrower with the miniaturization of the CCD, and the work of connecting to the lands becomes difficult. In addition, there is a problem that the possibility that adjacent leads are short-circuited increases.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and a solid-state imaging device which can easily and reliably connect a lead of a CCD and a land of a circuit board even if the size of the CCD is reduced. The purpose is to provide.

[0007]

According to a first aspect of the present invention, there is provided a solid-state imaging device having a solid-state imaging device having an external lead extending to a base end side of an endoscope, and a circuit board to which the external lead is connected. And the connection conductors of the external leads formed on the circuit board are arranged in a zigzag pattern.

In the first aspect of the present invention, since the connection conductors of the external leads are arranged in a staggered manner, the intervals between the connection conductors arranged in the same row are wider than when they are not arranged in a row. .

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 3 relate to a first embodiment of the present invention, FIG. 1 is a cross-sectional view showing an imaging apparatus according to the first embodiment, and FIG. 2 is an explanatory view showing an endoscope system. FIG. 3 is a top view showing a land portion on the circuit board in FIG.

First, an endoscope system will be described with reference to FIG. In FIG. 2, an endoscope system 1 includes an electronic endoscope 2, a light source device 3 that supplies illumination light to the electronic endoscope 2, and an electronic endoscope connected to the electronic endoscope 2 via a scope cable 4. CC which is a solid-state image pickup device built in the mirror 2
Video processor 5 that performs signal processing of an image pickup signal from D
And a color monitor 6 that receives a video signal from the video processor 5 via a monitor cable and displays an image.

The electronic endoscope 2 includes an elongated insertion portion 7 inserted into a body cavity or the like, an operation portion 8 provided at a rear end of the insertion portion 7, and a universal cord extending from the operation portion 8. Part 9 and a scope connector part 10 provided at the rear end of the universal cord part 9 and detachably connected to the light source device 3.
And

A contact connector 10a is provided on the side of the scope connector 10. An electric connector 4e provided at one end of the scope cable 4 is detachably connected to the contact connector portion 10a, and an electric connector 4f provided at the other end of the scope cable 4 is connected to the video processor 5, whereby the light source device 3 is connected to the video processor 5. The video processor 5 is connected.

The insertion section 7 is provided with a solid-state imaging device 22 shown in FIG.
, A bendable portion 13 provided at the rear end of the front end portion 12, and a long flexible tube portion 21 extending from the rear end of the bent portion 13 to the front end of the operation portion 8. And is constituted by.

The operating section 8 is provided with a bending operation knob 14, and the bending section 13 can be bent by gripping the grip section 18 and operating the bending operation knob 14.

An air supply / water supply control unit 15 for controlling air supply and water supply and a suction control unit 16 for controlling suction are provided on a side surface of the operation unit 8. Further, a switch section 17 provided with a plurality of switches 17a is provided at the top of the operation section 8.

A light guide (not shown) for transmitting illumination light is inserted into the insertion portion 7, the operation portion 8, and the universal cord portion 9. The light guide has a rear end reaching the scope connector portion 10, and has a light source device 3 inside. Illumination light supplied from a lamp (not shown) is transmitted to the illumination window 2 at the tip 12.
Illumination light is emitted forward from the distal end surface fixed to 0, so that a subject such as an affected part can be illuminated. The reflected light from the illuminated subject passes through the observation window 19 provided adjacent to the illumination window 20 and the distal end 1 of the electronic endoscope 2.
2 is incident.

In FIG. 1, an observation window 19 is attached to an objective optical system unit 37. The objective optical system unit 37 includes first to third objective lens frames 38, 42, 4
1, insulating member 40 and first and second objective lens groups 3
9, 43. An insulating member 40 is fitted on the inner periphery of a third objective lens frame 41 fixed to an endoscope front end frame (not shown), and a first objective lens frame 38 is provided on the inner periphery of the insulating member 40 on the front side. The second objective lens frame 42 is fitted on the rear side. A first objective lens group 39 is accommodated in the first objective lens frame 38, and a second objective lens group 43 accommodated in the second objective lens frame 42 is provided behind the first objective lens group 39. Is arranged.

The outer periphery of the second objective lens frame 42 has a CCD
A holder 34 is attached, and the CCD 23 as a solid-state imaging device is provided supported by the CCD holder 34. The first lens frame 38 and the CCD holder 34 are mutually insulated by an insulating member 40. The CCD 23 is
The imaging surface is arranged at the image forming position of the objective lens system, is positioned so that the optical axis coincides with the objective optical system unit 37, and is adhered and fixed to the CCD holder. The CCD holder 34 and the second objective lens frame 42 are fixed with, for example, an epoxy adhesive in a state where the CCD 23 is focused.

At the base end side of the endoscope of the CCD 23, a cover glass 36 is attached. A light shielding member 35 is attached near the base end side of the cover glass 36. The cover glass 36 is fixed to the CCD holder 34. CCD23 and C
The CD holder 34 is reinforced by the adhesive 31. C
A shield member 28 is provided on the outer periphery of the CD holder 34, and a covering member 29 is covered on the outer periphery. An adhesive 30 is filled inside the shield member 28.
As the adhesive 30 and the adhesive 31, for example, an epoxy-based adhesive is used.

The CCD 23 converts the incident optical image of the subject into an electric signal by a photoelectric conversion process. The electric signal from the CCD 23 is transmitted through leads 23a to 23c. Leads 23a to 23c extend rearward from the rear end of the CCD 23. These leads 23a to 23c
Are connected to a circuit board 24 arranged behind the CCD 23. The circuit board 24 is connected to various signal lines and the like in the cable 25.

An IC 24b and an electronic component 24a are arranged on the circuit board 24, and constitute a circuit for processing signals from the CCD 23. IC 24b is an insulating sealing resin 2
4c.

As described above, the cable 25 connected to the CCD 23 is connected to the scope cable 4 via the noise reducer (not shown) housed in the scope connector 10, and the scope cable 4 is connected to the video processor 5. Is done.

An air supply / water supply conduit (not shown) is also inserted into the insertion portion 7. The air supply / water supply line is connected to the air supply / water supply control unit 15 by the operation unit 8, and the end thereof is connected to the scope connector unit 10 through the air supply / water supply line inserted through the universal cord unit 9. And is connected to the air / water supply mechanism in the light source device 3.

A suction pipe (not shown) is also inserted into the insertion section 7. The suction conduit branches into two near the front end of the operation unit 8, one of which communicates with the forceps port 11b, the other communicates with the suction conduit in the universal cord unit 9 via the suction control unit 16, and the scope connector It reaches the suction base (not shown) of the unit 10.

The suction conduit forms a distal opening 11a opened at the distal end portion 12. The distal opening 11a serves as a suction port for performing suction during a suction operation. It becomes the forceps outlet.

Next, the connection between the CCD 23 and the circuit board 24 will be described in detail with reference to FIG.

On the circuit board 24, mounted are an electronic component 24a composed of an IC 24b for amplifying an output signal from the CCD 23 and a bypass capacitor connected to a drive power supply line of the CCD 23. Also, lands 24d and 24e are formed on the circuit board 24, and these lands 24d and 24e are connected to the signal lines 25d and 25e, respectively.
Are connected by solder or the like.

The CCD 23 has leads 23a, 23b and 23c extending toward the base end of the endoscope apparatus. Lead 23
The lead b and the lead 23c are connected to each other at a land 24g and a land 24f provided on the circuit board 24 by soldering or the like.

In this embodiment, the lands 24g and the lands 24f provided on the circuit board 24 are arranged in two rows. That is, the lands 24g are arranged at a constant pitch 2P along the edge of the circuit board 24. On the other hand, each land 24f is disposed at a pitch of 2P between the lands 24g in the edge direction, and the lands 24f are arranged in the direction perpendicular to the edge.
g. That is, land 2
4g and 24f are arranged in a zigzag pattern at a pitch P on the circuit board 24.

The lengths of the leads 23b and 23c are adjusted according to the positions of the lands 24g and lands 24f arranged in a staggered manner, and are connected by solder or the like. In addition, since the adjacent lands 24g and 24f are spaced apart from each other so as not to overlap in the longitudinal direction of the endoscope, when the leads 23b and 23c are connected, a short circuit of signals is less likely to occur. I have.

The IC 24b is covered with a sealing resin 24c. The outer periphery of the cable 25 is covered with a protection member 26, and a plurality of signal lines 25 a and signal lines 25 b extend from the end surface of the cable 25 on the distal end side to the distal end. These are composed of a coaxial signal line for transmitting input / output signals to and from the CCD 23 and a simple signal line for transmitting power for driving the CCD 23 and the IC 24b.

The coaxial signal line 25a is connected to its internal conductor 25
c is connected to the lead 23a by solder or the like, and transmits a drive signal such as a horizontal transfer pulse or a vertical transfer pulse to the CCD 23. The signal line 25b is connected to its internal conductor 25d.
Is connected to a land 24d provided on the circuit board 24 by soldering or the like, and transmits, for example, an output signal from the CCD 23 to a processor (not shown). The external conductor 25e of the signal line 25b is connected to a land 24e having the same potential as a GND line of the CCD 23 on the circuit board 24 by soldering or the like.

On the other hand, one end of a connection line 25g is connected to the outer conductor of the external conductor 25f of the signal line 25a by soldering or the like. The other end of the connection line 25g is connected to an electrode part (not shown) of the electronic component 24a. This electrode part is CCD2
3 is connected to the GND line.

Next, the operation of the embodiment configured as described above will be described.

A circuit board 24 is arranged at the rear end of the CCD 23 arranged in the insertion section 7. The circuit board 24 has lands 24 for connecting leads 23b and 23c from the CCD 23.
g, 24f. The lands 24g and 24f are arranged at a pitch P in a direction perpendicular to the longitudinal direction of the insertion section 7. Also, the lands 24g are arranged near the ends of the circuit board 24, and the lands 24f are arranged at positions separated from the ends, so that the rows of the lands 24g do not overlap with the rows of the lands 24f. , 24f in a zigzag pattern.

Therefore, the pitch between the lands 24g is 2P.
And the pitch between the lands 24f is also 2P. That is, with the miniaturization of the CCD 23, the leads 23
Even if the pitch of b, 23c becomes narrow, the land interval on the circuit board 24 can be made wider than the lead pitch. This facilitates various operations such as soldering operations, and can improve assembling workability.
The possibility of a short circuit can be suppressed.

In this embodiment, the example in which the lands are arranged in two rows has been described, but it is apparent that the lands may be arranged in three or more rows.

FIGS. 4 to 7 relate to a second embodiment of the present invention. FIG. 4 is an explanatory view showing a solid-state imaging device according to the second embodiment. FIG. 6 is a bottom view of FIG. 4 as viewed from the bottom surface side B. FIG. FIG. 7 is an explanatory diagram viewed from the direction C in FIG.

This embodiment is different from the first embodiment only in the configuration near the CCD 46 and the circuit board.

In FIG. 4, the CCD 46 has a CCD chip 46a. An imaging surface 46b is provided on the CCD chip 46a. A cover glass 46c is attached on the imaging surface 46b so that the optical axes thereof coincide with each other. A bump 46e is provided on the CCD chip 46a. The bump 46e is a connection portion with a circuit board 47 for transmitting input / output signals of the CCD 46.

The circuit board 47 has a polyimide substrate 47a, and copper patterns 47 are formed on both sides of the polyimide substrate 47a.
b, 47c are formed. An inner lead portion 47 is provided at the end of the polyimide substrate 47a on the side of the CCD chip 46a.
d is exposed, and the inner lead portion 47d is disposed on the bump 46e and is thermally welded to the bump 4d.
6e.

An electronic component 49 such as an IC 48 for amplifying an output signal of the CCD 46 and a noise capacitor is mounted on the circuit board 47. IC48 has pattern 4
A bump 48a is provided on the 7b side. Circuit board 47
An opening 50 is provided on the base end side of the endoscope device, and an inner lead portion 47e is formed by the pattern 47b exposed in the opening 50.

An electric connection between the IC 48 and the circuit board 47 is established by disposing a pressing device (not shown) in the opening 50 and thermally welding the bump 48a and the inner lead portion 47e.

After mounting the IC 48 on the circuit board 47, the opening 50 on the circuit board 47 is filled with a filler 51. On the other hand, also near the bump 48a, the filler 52 is filled up to the side surface of the IC 48. These fillers 5
Reference numerals 1 and 52 are, for example, epoxy adhesives. CCD chip 46a, cover glass 46c, and circuit board 47
Is configured such that the outer periphery is sealed by a sealing material 46d. The sealing material 46d is, for example, an epoxy-based adhesive.

Next, the operation of the embodiment constructed as above will be described with reference to the top view of FIG. 5, the bottom view of FIG.
This will be described with reference to the explanatory diagram of FIG.

In FIG. 5, among the input / output signals of the CCD 46, a DC pulse signal is used for the blooming removal signal (ΦAB), the driving power supply (Vdd) of the CCD 46, and the like. An electronic component 49 such as a bypass capacitor for removing noise is provided on a line for transmitting these pulse signals. GND part 5 of electronic component 49 such as a capacitor
3 are arranged on the same side on the circuit board 47. GND
Since the parts 53 are arranged on the same side, the land on which the GND part 53 is mounted can be made common. There is no need to largely arrange the wiring, and the circuit space for the wiring can be reduced. The size of the solid-state imaging device 45 can be reduced.

In FIG. 6, lands 62 to 65 are provided on the bottom surface side (pattern 47c forming side) of the circuit board 47. A signal line for transmitting a signal obtained by amplifying a driving signal of the CCD 46 or an output signal of the CCD by the IC 48 to the processor is electrically connected to these lands. On the pattern 47c constituting the circuit pattern, a covering material (not shown) made of an insulating film is coated so as to cover the pattern 47c.

On the lands 62 to 65, signal lines are arranged and connected by solder or the like, and are not covered with a covering material. The hatched portions in FIG. 6 indicate regions 66 and 67 not covered with the covering material, and lands 62 to 65 are exposed in these regions 66 and 67.

In the vicinity of the lands 62 to 65, another wiring pattern that is not electrically connected to the signal lines connected to the lands 62 to 65 is formed. When coating with an insulating film, the position where the coating is provided fluctuates due to variations. For example, the boundary of the covering material (insulating film) for the lands 62 and 63 is represented by a boundary 69. In terms of design, the outer shape of the land coincides with the covering boundary at the position of the boundary line 69. Accordingly, as shown by the hatched portion, the boundary of the region 66 also coincides with the boundary 69.

However, there is a possibility that the installation range of the covering material may be extended to the position indicated by the boundary line 54 due to the dispersion at the time of installation. In a practical example, this position variation typically has a range of ± 50 μm. That is, even when the covering region is designed within the range of the boundary line 69, the coverage region may extend to the range of the boundary line 54.

Therefore, in the present embodiment, the boundary of the wiring pattern conducting to the land 63 arranged adjacent to the land 62 is set at the position indicated by the boundary line 55. For example, the distance between the boundary lines 55 and 69 is set to 70 μm.
With this setting, the position of the covering material can be up to 5
Even if it varies to 0 μm, there is an interval of 20 μm to the outer shape of the adjacent pattern, and it is possible to prevent the adjacent pattern from being exposed in the region 66.

Therefore, even when a land and a pattern are arranged adjacent to each other, it is possible to reduce the possibility of occurrence of a short circuit between adjacent signal lines in a soldering operation performed by arranging signal lines on the land. Can be.

It should be noted that the above-described configuration is applicable to the lands 65 and 62.
(Between boundaries 56 and 58) and the lands 65 and 67 (between boundaries 59 and 61).
The same applies to (interval).

The covering material on the land 63 is a CCD 4
It is arranged to the position shown by the boundary line 70 on the 6 side,
An area 66 is formed. As described above, due to the variation in the position of the covering material (insulating film), the covering material is 50
The area 66 may reach the position of the boundary line 71 after being enlarged by μm. Therefore, in the present embodiment, by setting the distance between the boundary line 70 and the boundary line 68 to be 70 μm, the end of the land 63 is positioned on the boundary line 68 outside the boundary line 71.

The land 63 is formed with a pattern 72 that is continuous with the land 63. The pattern 72 has a sufficiently smaller width than the land 63, and the adhesion strength between the pattern and the base material tends to be small. Even when the position of the covering material (insulating film) is enlarged by 50 μm at the maximum, the position of the boundary line 68 does not enter the region 66. Therefore, even if the signal line already soldered to the land 62 is removed by repair or the like, the small-width pattern 72 remains in the signal line because the small-width pattern 72 is also contained in the insulating film without entering the region 66. At the same time, peeling can be prevented.

As shown in FIG. 7, the relationship between the width L1 of the tip portion 100 of the circuit board 47 and the horizontal width L2 of the CCD chip 46a is L1 <L2. The corner portion 101 of the sealing resin has a larger R due to the relationship of L1 <L2.
Can be configured by shape. In this way, by making the corner of the bottom surface on the tip side of the solid-state imaging device a large R shape, the occupation area of the solid-state imaging device can be reduced,
The layout of the other components of the endoscope can be easily arranged, and the size can be reduced.

The present embodiment may employ the configuration shown in FIG. FIG. 8 shows a modification of the configuration near the IC 48 in FIG. In the example of FIG. 8, the IC 48 may be mounted on the circuit board 47 by a flip chip method in which the IC 48 is bonded via the bump 48a. Pattern 47b and IC
The space 48 is filled with a sealing resin 52.

By the way, the drive signal for driving the CCD is transmitted through a long cable in the endoscope.
Therefore, it is conceivable that the drive waveform is distorted due to attenuation during transmission by the cable. Therefore, the waveform shaping circuit 77
Is conceivable. FIG. 9 is a block diagram showing the configuration in this case.

The drive signal generated by the processor 75 is transmitted to the CCD 79 by the cable 76. For example, the drive signal from the processor 75 is a substantially pulse signal. The cable 76 is transmitted through a long cable. During the transmission of the cable 76, the drive signal undergoes waveform distortion and changes in a substantially sinusoidal shape.

The signal transmitted by the cable 76 is supplied to a CCD driving circuit 78 via a waveform shaping circuit 77. The waveform shaping circuit 77 returns the waveform of the input signal to the original pulse-like signal and supplies the signal to the CCD drive circuit 78.

As described above, even if the drive signal is transmitted through a long cable, the waveform shaping circuit 77 shapes the original waveform even if the waveform is attenuated due to attenuation.
Thus, a desired drive waveform can be generated.

FIGS. 10 and 11 relate to a third embodiment of the present invention. FIG. 10 is an explanatory view showing a solid-state imaging device according to the third embodiment. FIG. FIG.

This embodiment is different from the second embodiment only in the configuration near the CCD and the circuit board. The solid-state imaging device 80 according to the present embodiment has a CCD 81. C
The CD 81 is mounted on the circuit board 8 by the inner lead portion 82e.
2 is connected. The circuit board 82 has a substrate 82a made of polyimide, and patterns 82b and 82c made of copper are attached to both surfaces of the substrate 82a. CC
The connection configuration between D81 and the circuit board 82 is the same as in the second embodiment. A drive signal, a power supply for driving the CCD, and a DC signal such as a blooming removal signal are transmitted to the CCD 81. On the circuit board 82, electronic components 83a and 83b including a noise removing capacitor and the like are mounted between a line for transmitting an active signal and GND.

Next, the connection configuration of these electronic components 83a and 83b mounted on the pattern 82b will be described.

On the pattern 82b, electronic components 83a,
83b is mounted. Electrode 83e of electronic component 83a
Are connected in parallel to the active line of the driving power supply of the CCD 81. Also, the electrode 83f of the electronic component 83a
Is a GN provided in a circuit (not shown) of the CCD 81.
D.

The GND is connected to the processor via a cable (not shown), and is connected to the GND of the patient side circuit (not shown) in the processor at the same potential. Electronic components 83
On the electrode 83e of a, an insulating member 83d is provided so as to completely cover the electrode 83e. The electrode 83g of the electronic component 83b is provided on the electrode 83e via the insulating member 83d.

On the other hand, the electrode 83h of the electronic component 83b is arranged on the electrode 83f of the electronic component 83a,
83h are electrically connected to each other by, for example, solder 83c. As a result, the electrode 83h is also
Similarly to f, it is connected to GND provided in the circuit of the CCD 81, and is connected to GND of a patient circuit of a processor (not shown).
To be conducted.

One end of a connection line 84 is connected to the electrode 83g, and the other end of the connection line 84 is connected to a land 82d provided on the pattern 82b by soldering or the like.
b is electrically connected to the same potential. An IC 85 for amplifying the CCD output signal is provided near the base end on the pattern 82b.
Is connected. The connection configuration between the IC 85 and the pattern 82b is the same as in the second embodiment.

As described above, in the present embodiment, since the electronic component 83a and the electronic component 83b are arranged so as to overlap each other, the rigid length of the solid-state imaging device can be shortened, and The size can be reduced.

This embodiment can also adopt the configuration shown in FIG.

In FIG. 12, the solid-state imaging device 90 has a C
The circuit board 92 is connected to the leads 91 a of the CD 91. Electronic components 93a and 93b are arranged on the circuit board 92 so as to overlap toward the center of the CCD 91. The connection configuration of the electronic components 93a and 93b is the same as in FIGS. For example, a signal line 94 for transmitting a CCD drive signal is connected to the other lead 91b.

[Supplementary Notes] (1) A solid-state imaging device having an external lead extending toward the base end of the endoscope and a solid-state imaging device having a circuit board to which the external lead is connected are formed on the circuit board. A solid-state imaging device, wherein the connecting conductor portions of the external leads are arranged in a staggered manner.

(2) The connecting conductor portions are arranged in a staggered manner, and adjacent connecting conductor portions are arranged so as to be separated from each other without overlapping in the longitudinal direction of the endoscope. 2. The solid-state imaging device according to 1.

(3) A solid-state imaging device having a plurality of electronic components mounted on a circuit board, and having the GND electrodes of these electronic components arranged in the same direction on the circuit board. .

(4) A solid-state imaging device wherein the GND terminal of the solid-state imaging device is provided at an end of the solid-state imaging device.

(5) In a solid-state imaging device comprising a solid-state imaging device, an electronic component having electrodes, and a circuit board having a pattern for mounting the electronic component, the circuit board has a mounting hole for disposing the electronic component. And a sealing resin is filled around an electronic component joined to the electrode by a pattern and a joint portion so as to cover the mounting hole.

(6) An electronic component mounting area is provided on a flexible circuit board, electronic components are mounted on the circuit board by a flip-chip method, and the periphery of the mounting portion is filled with a sealing resin. Solid-state imaging device.

(7) In a solid-state imaging device in which a land portion for signal line connection provided on a circuit board and a pattern portion other than the land portion are covered with an insulating film, the outer shape of the land portion and the land portion A solid-state imaging device, wherein a distance from an outer shape of a pattern covered with an insulating film close to the pattern is set to 70 μm or more.

(8) In a solid-state imaging device composed of a solid-state imaging device and a cable for transmitting input / output signals of the solid-state imaging device, waveform shaping for shaping a signal transmitted by the cable into an appropriate input signal to the solid-state imaging device. A solid-state imaging device, wherein a circuit is provided in a solid-state imaging device.

(9) In a solid-state image pickup device constituted by laminating a plurality of electronic components on a circuit board, electrodes of the same signal of the electronic components are connected by a conductive material, and electrodes of different signals are connected to each other. Is a solid-state imaging device which is laminated via an insulating member.

(10) A solid-state imaging device characterized in that the circuit board is made of TAB, and the width of the TAB tip is smaller than the width of the solid-state imaging device chip connected thereto.

(11) A solid-state imaging device characterized in that the GND of an electronic component is provided at an end of a circuit board.

[0083]

As described above, according to the present invention, C
Even if the size of the CD is reduced, there is an effect that the connection between the lead of the CCD and the land of the circuit board can be easily and reliably performed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an imaging device according to a first embodiment.

FIG. 2 is an explanatory diagram showing an endoscope system.

FIG. 3 is a top view showing a land portion on the circuit board in FIG. 2;

FIG. 4 is an explanatory diagram illustrating a solid-state imaging device according to a second embodiment;

FIG. 5 is a top view of FIG.

FIG. 6 is a bottom view of FIG. 4 as viewed from a bottom side B;

FIG. 7 is an explanatory diagram viewed from a direction C in FIG. 4;

FIG. 8 is an explanatory diagram showing a modified example of the second embodiment.

FIG. 9 is a block diagram showing a modification of the second embodiment.

FIG. 10 is an explanatory diagram illustrating a solid-state imaging device according to a third embodiment.

FIG. 11 is an explanatory diagram of FIG. 10 viewed from a direction C.

FIG. 12 is an explanatory diagram showing a modification of the third embodiment.

[Explanation of symbols]

23: CCD, 23a to 23c: lead, 24: circuit board, 24g, 24f: land.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/34 501 H01L 27/14 DF Term (Reference) 4C061 AA00 BB00 CC00 DD00 JJ12 LL02 PP20 4M118 AA10 AB01 BA10 FA06 GD02 HA11 HA20 HA22 HA23 HA24 HA29 5C022 AA09 AC42 AC54 AC63 AC65 AC70 AC75 AC78 5E319 AA03 AB01 AC11 CC22 5E336 AA04 BB01 CC02 CC58 EE01

Claims (2)

[Claims] 1. A solid-state imaging device comprising: a solid-state imaging device having an external lead extending to a base end side of an endoscope; and a circuit board to which the external lead is connected. A solid-state imaging device, wherein the connection conductors are arranged in a staggered manner. 2. The connection conductor portions are arranged in a staggered manner, and adjacent connection conductor portions are arranged apart from each other without overlapping in the longitudinal direction of the endoscope. 3. The solid-state imaging device according to item 1.