JP3706324B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging device built in a distal end portion of an endoscope, and more particularly, to an imaging device in which the rigid length of an imaging unit from the distal end of an objective lens of the imaging device to a bundle end portion of a signal cable bundle is shortened.
[0002]
[Prior art]
In recent years, medical endoscopes for observing the inside of body cavities by inserting elongated insertion parts into body cavities, pipes such as machines and chemical plants, or industrial endoscopes used for observation and inspection in machines Mirrors are widely used.
[0003]
Among these endoscopes, there is an electronic endoscope in which an image pickup apparatus including a solid-state image pickup device such as a solid-state image pickup device is disposed at a distal end of an insertion portion. In this endoscope, an elongated endoscope insertion portion has to be inserted into a narrow and winding tube or lumen. For this reason, the outer diameter of the distal end portion of the endoscope and the length of the hard portion are reduced so that the endoscope insertion portion can be inserted smoothly and without causing pain to the patient. Shortening was desired.
[0004]
In general, an objective lens and a solid-state imaging device constituting an imaging device are incorporated as an imaging unit at the distal end portion of the endoscope, and a subject image is placed on the imaging surface of the solid-state imaging device via the objective lens. An image is formed. A circuit board constituting one or two signal processing circuits is disposed in the opposite direction of the objective lens of the solid-state image sensor, and external leads extending from the solid-state image sensor are soldered to the circuit board. Is fixed by bonding. The circuit board is connected to a signal line of a signal cable connected to a camera control unit which is an external device. Further, the signal line of the signal cable is also connected to an external lead extending from the solid-state imaging device.
[0005]
Then, a solid-state image sensor drive signal, a solid-state image sensor output signal, a solid-state image sensor drive power source, etc., which are input / output signals of the solid-state image sensor, are transmitted to the solid-state image sensor via a signal cable and a circuit board. Yes.
[0006]
The plurality of signal lines of the signal cable connected to the external leads and the circuit board are cable stoppers positioned on the base end side opposite to the connection portion to which the external leads extending from the solid-state image sensor are attached. As a result, the individual signal lines that were separated are grouped together to form a cable bundle. For this reason, the bundle end portion of the cable bundle is provided so as to be positioned behind the objective lens, the solid-state imaging device, the circuit board, and the cable stopper when viewed from the distal end side of the endoscope.
[0007]
In general, the rigid length of the imaging unit constituting the imaging apparatus was regarded as the length from the front end surface of the objective lens to the bundle end of the cable bundle, so that the bundle end of the cable bundle is connected to the cable as described above. If the image pickup unit is formed on the rear side of the stop, there is a limit to shortening the rigid length of the image pickup unit.
[0008]
[Problems to be solved by the invention]
However, shortening the rigid length of the imaging unit, that is, the length of the rigid portion of the endoscope, is a factor that greatly improves the curvature of the distal end portion of the endoscope, and the length of the rigid portion is shortened. As a result of the improved curvature, the operator can see the inner wall of the body cavity and the stomach wall from the front and improve the observation performance. For the patient, the body cavity is excessively swollen to ensure bending operability. Pain is reduced by the fact that it is no longer necessary. For this reason, shortening the length of the rigid length of the imaging unit has been desired from both the standpoint of the operator and the standpoint of the patient.
[0009]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an image pickup apparatus that shortens the hard length of an image pickup unit formed by including an objective lens, a solid-state image pickup device, and the like.
[0010]
[Means for Solving the Problems]
An imaging apparatus according to the present invention includes a solid-state imaging device disposed at an imaging position of an objective lens, a peripheral circuit board connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device, and the solid-state imaging device. the camera control unit which controls the imaging element or the peripheral circuit board and the solid element or the peripheral circuit board with electrically connecting fixed relative to a surface of the peripheral circuit board by bundling a plurality of signal lines And a notch portion that is provided on the peripheral circuit board and guides the signal line from one surface side to the other surface side of the peripheral circuit board.
In addition, an imaging apparatus according to the present invention includes a solid-state imaging device disposed at an imaging position of an objective lens, a peripheral circuit board connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device, A plurality of signal lines constituting a signal cable fixed at a predetermined position with respect to the peripheral circuit board, and a plurality of contact portions provided on a predetermined surface of the peripheral circuit board for connecting the signal lines A notch for guiding the signal line provided on the peripheral circuit board and connected to the contact part to the back side with respect to the surface provided with the contact part, and on the back side of the peripheral circuit board induced Rutotomoni, characterized by having a a bundling member bundling the tip side of a position where the signal line the signal cable is fixed.
Furthermore, an imaging apparatus according to the present invention includes a solid-state imaging device disposed at an imaging position of an objective lens, a peripheral circuit board connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device, a plurality of signal lines constituting the peripheral circuit signal cables that are fixed in position with respect to the substrate, wherein the signal cable is arranged in a solid is surface Rutotomoni of the peripheral circuit board, an electrical conductivity A metal binding member for bundling the signal lines on the tip side of the position where the signal cable is fixed, and a plurality of contact portions provided on a surface opposite to the surface on which the binding member is disposed A jumper wire connected to the bundling member or a signal line bundled by the bundling member and connected to the contact portion; and the contact point from the surface on which the bundling member is disposed, provided on the peripheral circuit board A notch portion for guiding the jumper wire on the surface provided with, characterized in that it comprises a.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to a first embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus, FIG. 2 is a sectional view illustrating a schematic configuration of an imaging unit, and FIG. It is a figure explaining the wiring state to the peripheral circuit board shown in FIG.
[0012]
As shown in FIG. 1, an endoscope apparatus 10 includes an imaging unit 1 that can be inserted into a body cavity, for example, and is formed by disposing a solid-state imaging device such as an objective lens or a CCD at the distal end of the insertion portion. 2 and a light source device 3 that supplies illumination light to the endoscope 2 through a light guide fiber or the like, and a solid-state image sensor of the imaging unit 1 disposed at the distal end of the insertion portion of the endoscope 2 A peripheral device 5 having a camera control unit (hereinafter referred to as CCU) 4 that performs supply and control of signal processing of a subject image formed on an imaging surface of a solid-state imaging device, and an image obtained by converting an electrical signal transmitted to the CCU 4 The monitor 6 is configured to receive the signal and display an endoscopic image on the screen.
[0013]
The endoscope 2 includes an insertion portion 21 to be inserted into a body cavity or the like, an operation portion 22 located on the proximal side of the insertion portion 21, a universal cord 23 extending from a side portion of the operation portion 22, A universal connector 24 is provided at the proximal end of the universal cord 23 and is detachably connected to the peripheral device 5.
[0014]
Supply of driving power for driving the solid-state imaging device of the imaging unit 1 and transmission / reception of an electrical signal of a subject image formed on the imaging surface of the solid-state imaging device and subjected to photoelectric conversion are performed by the insertion unit 21, the operation unit 22 and the universal unit. This is performed by the signal cable 7 having a plurality of signal lines inserted through the cord 23.
[0015]
Note that an imaging device 8 is configured by the imaging unit 1, the CCU 4 and the signal cable 7 that connects the imaging unit 1 and the CCU 4.
[0016]
The imaging unit 1 will be described with reference to FIG. The imaging unit 1 is provided with an objective lens group 20 that mainly includes a plurality of lenses and serves as an objective lens, and an optical image formed on the imaging surface that is disposed at the imaging position of the objective lens group 20 as an electrical signal. And an imaging unit 30 that performs photoelectric conversion.
[0017]
First, the objective lens group 20 will be described. The objective lens group 20 includes a first lens group 21 a housed in a first lens frame 21, a second lens group 22 a housed in a second lens frame 22, the first lens frame 21, The insulating frame 24 is fitted on the outer periphery of the second lens frame 22, and the third lens frame 23 is fitted on the outer periphery of the insulating frame 24.
[0018]
The first lens group 21a and the second lens group 22a are bonded and fixed to the first lens frame 21 and the second lens frame 22, respectively, with an adhesive. The first lens frame 21 and the second lens frame 22 are bonded and fixed to the insulating frame 24 and the third lens frame 22 with an adhesive.
[0019]
An imaging unit holder 25 is fitted to the outer periphery of the second lens frame 22 and is fixed integrally to the second lens frame 22 with an adhesive. The second lens frame 22 and the imaging unit holder 25 are integrally bonded and fixed with an adhesive after focus adjustment.
[0020]
Next, the imaging unit 30 will be described. The imaging unit 30 includes an imaging element chip 31 having an imaging surface and a peripheral circuit board 40 on which a signal processing circuit is formed.
[0021]
A package formed of an optical material on the front surface of the image pickup device chip 31 and provided with a chip protection member 32 to which the image pickup unit holder 25 is fitted, and a kovar plate 33a and a chip substrate 33b provided on the rear surface. A portion 33 is disposed.
[0022]
The imaging element chip 31 is disposed so as to be orthogonal to the optical axis of the objective lens group 20, and the sealing resin 35 is placed with the CFA 34 placed on the imaging surface side of the imaging element chip 31. Is sealed by.
[0023]
Further, external leads 36, 36... Protrude from the back surface direction of the image pickup surface of the image pickup device chip 31, and the external leads 36, 36... And the image pickup device chip 31 are connected to the chip substrate 33b and the chip substrate 33b. They are electrically connected by wiring (not shown) and bonding wires (not shown).
[0024]
A peripheral circuit board 40 whose longitudinal direction is arranged parallel to the optical axis direction of the objective lens group is electrically connected to the external lead 36 by soldering or the like.
[0025]
One plane (front side surface) of the peripheral circuit board 40 is a mounting surface, and the IC 41 is sealed with the sealing resin 43 in a state where the IC 41 is electrically wired by the bonding wires 42, and the capacitor 44 is electrically connected by the solder 45. Wired to form a signal processing circuit.
[0026]
A signal cable 7 is arranged on the other end surface (back side surface) which is a non-mounting surface where a circuit such as a signal processing circuit of the peripheral circuit board 40 is not formed. This signal cable 7 is composed of a plurality of signal lines 71, 71..., And is a composite line of a shield line 71 a that is an inner sheath and a single line 71 b that is an inner conductor.
[0027]
The outer conductors of the shield lines 71a of the plurality of signal lines 71, 71... Are bundled together so as to be electrically connected by a cable stopper 72 that is a metal binding member. A bundle end 73 of the signal lines formed by bundling the plurality of signal lines 71, 71... Is provided behind the cable stopper 72 so as to be positioned on the back surface of the peripheral circuit board 40. Yes. On the other hand, the single wires 71b of the plurality of signal lines 71, 71... Are connected and fixed to the external leads 36 and the peripheral circuit board 40 of the imaging unit 30, respectively.
[0028]
A cable protection member 74 is provided on the outer periphery of the signal cable 7. The cable protection member 74 is for reducing damage from other built-in objects arranged in the endoscope or damaging other built-in objects. The member 75 is fixed in the vicinity of the bundle end 73.
[0029]
The bundle end portion 73 of the signal line is an end portion of the outermost covering portion of the signal cable 7, and the bundle end portion 73 may be retracted from an insulating coating described later by performing a bending operation while using the endoscope. In the unlikely event that the bundle end 73 is retracted from the insulation coating, the bending strength in the vicinity of the bundle end sharply decreases, causing disconnection or defective lead. For this reason, the bundle end portion 73 is integrally fixed to the peripheral circuit board 40 by the second binding member 76 so as not to move closer to the proximal side than the insulating coating so as not to cause these problems.
[0030]
By configuring as described above, the optical image of the observation image formed on the imaging surface of the imaging element chip 31 of the imaging unit 30 is output to the peripheral circuit board 40 via the external lead 36 and subjected to signal processing. It is transmitted to the CCU 4 through the signal line 71 and the signal cable 7 and processed into an image signal, which is output to the monitor 6 and an endoscopic image is displayed on the screen.
[0031]
A plurality of sealing resins are used when forming the imaging unit 30. In order to reinforce the external lead 36, the first sealing resin 81 is used. In addition, after the wiring of the IC 41, the capacitor 44, and each signal line 71, 71..., The second sealing resin 82 is used to cover the electrically conductive portions such as the external lead 36 and the single wire 71b. By sealing the electrically conductive portion with the second sealing resin 82, a short circuit with the shield member 91 to be assembled later is prevented. Then, when the shield member 91 is assembled to the imaging unit 30 sealed with the second sealing resin 82, the third sealing resin 83 is filled between the second sealing resin 82 and the shield member 91. To do. Finally, when the insulating coating 92 is coated on the outer periphery of the shield member 91, the fourth sealing resin 84 is filled to seal the electrical component.
[0032]
Further, in order to enhance the shielding effect of the imaging unit 30, the cable stopper 72 and the external lead 36 are electrically connected by a jumper wire 77, and the cable stopper 72 and the shield member 91 are electrically connected by a conductive member 93. The imaging unit holder 25 and the shield member 92 are electrically connected by the conductive member 93.
[0033]
In this way, a bundle of signal lines formed when a plurality of signal lines of a signal cable such as a signal line directly connected to an external lead of the imaging unit and a signal line connected to a peripheral circuit board are gathered together by cable fastening By arranging the part on the back surface of the peripheral circuit board, the imaging unit can be configured from the front end side by the positional relationship of the objective lens, solid-state imaging device, peripheral circuit board, and signal line bundle end to reduce the hard length Can do. As a result, the length of the rigid portion of the endoscope is shortened, so that the curvature of the endoscope distal end is improved, the observation performance is improved, and pain to the patient is reduced.
[0034]
Moreover, assembly workability | operativity can be improved by assembling a cable protection member and a cable stopper partially to a signal cable beforehand.
[0035]
3 shows the peripheral circuit board 40 of FIG. 2 as viewed from the direction A. On the surface of the peripheral circuit board 40, external leads 36, jumper wires 77, shield wires 71a for signal wires 71, single wires 71b, etc. Lands 46, 46... For connecting are formed.
[0036]
These lands 46, 46... And the IC 41 previously die-bonded on the peripheral circuit board 40 are connected via bonding wires 42 and then sealed with a sealing resin 43. A capacitor 44 is mounted on the peripheral circuit board 40 with solder 45. That is, the peripheral circuit board 40 is a single-sided board on which an IC 41, a capacitor 44, and the like are mounted on the front surface side of the board. The lands 46, 46,. A bundle end 73 is provided.
[0037]
For this reason, when the signal lines 71, 71,... Of the signal cable 7 arranged on the back surface side of the peripheral circuit board 40 are connected to the lands 46, 46,. The peripheral circuit board 40 is provided with a notch 47 for guiding the signal line 71 from the back side to the front side so that the line 71 does not protrude from the outer peripheral surface of the peripheral circuit board 40 and increase the diameter of the imaging unit 1. At least one or more are formed.
[0038]
As described above, by forming the notch portion 47 in the peripheral circuit board 40, the signal lines 71, 71... Of the signal cable 7 arranged on the back surface side of the peripheral circuit board 40 are connected through the notch portion 47 to the periphery. Guide to the surface side of the circuit board 40. Then, the signal line guided to the surface side is connected and fixed to a predetermined position on the mounting surface by soldering or the like. For example, the jumper wire 77 is guided from the non-mounting surface on the rear surface of the peripheral circuit board 40 to the mounting surface on the front surface through the notch 47 and soldered to the external lead 36b described later, and the shield member 79a of the shield wire 79 The single wire 79 b is soldered to the land 46, and the single wire 79 c is soldered directly to the electrode of the capacitor 44.
[0039]
Thus, when connecting the signal line of the signal cable disposed on the back surface, which is the non-mounting surface of the peripheral circuit board, to the mounting surface formed on the surface of the peripheral circuit board, the signal line of the signal cable is connected. By guiding to the surface which is the mounting surface through the notch formed in the peripheral circuit board, the signal line is guided from the non-mounting surface side to the mounting surface side without being projected from the outer peripheral surface of the peripheral circuit substrate. be able to. Thus, the size of the imaging unit is not increased by guiding the signal line on the non-mounting surface side to the mounting surface side.
[0040]
Moreover, since a single-sided board can be used for the peripheral circuit board, the imaging unit can be configured at low cost.
[0041]
Reference numerals 36a and 36b are external leads of the same electrode, and are ground in this embodiment. In the present embodiment, the two electrodes are electrically connected to each other in the image pickup device chip 31. However, even if the connection is performed on the substrate 33a, the connection is made to the land 46 of the peripheral circuit board 40 so as to be conductive. Also good.
[0042]
Reference numeral 46a denotes a land to which the external lead 36a and the external lead 36b are connected, and a slit 46b is formed in the land 46a. This slit 46b is applied to cream solder when the external leads 36, 36... Are soldered to the lands 46, 46. This is to keep the coating amount constant.
[0043]
Further, the lands 46, 46... Are plated with a conductor on the peripheral circuit board 40 and then plated with gold. At this time, the IC 41 and the lands 46 are made conductive in advance in order to perform electrolytic treatment. . In order to make this portion non-conductive after gold plating, a land trimming portion 80 is provided in the vicinity of the notch portion 47 of the substrate.
[0044]
By the way, conventionally, a separate cable fixing member is provided on the proximal side of the peripheral circuit board, and this cable is divided into both the front side and the back side of the board on the proximal side of the cable fixing member. The bundle end is located closer to the cable stop member and the cable is divided into the front side and back side of the board, so filling the part with adhesive to reinforce this part only increases the hard length. In addition, the flow of the adhesive became unstable, and as a result, the hard length became unstable. However, by configuring the imaging unit as described above, the bundle end portion 73 is positioned on the back side of the peripheral circuit board 40 and the hard length is shortened, and the cable is divided into a front side and a back side, and an adhesive. It is no longer necessary to pour the cable into the cable bundle, and the rigid length is stabilized.
[0045]
By the way, when soldering the external lead protruding from the imaging unit and the land of the peripheral circuit board, first, the external lead and the land are aligned using a jig (not shown), and cream solder is applied by a dispenser. Then, soldering was performed by applying heat to the cream solder. At this time, the application of the cream solder to the land was automatically performed by a dispenser.
[0046]
However, when cream solder was applied using this dispenser, the amount of solder increased on the soldering amount end portion side, which is the coating start portion and the coating end portion on the substrate, compared with the solder amount of the other soldering portions. For this reason, when soldering, there is a problem that the soldering condition varies greatly depending on whether the soldering conditions are set at both ends or the central part other than both ends, and the fixed state is not stable. . For this reason, it was desired that the soldering conditions be unified.
[0047]
Therefore, in the present embodiment, as shown in FIG. 4, the land width m of the land 46b on both ends of the lands 46, 46... Of the peripheral circuit board 40 soldered to the external leads 36, 36. It is formed wider than the land width n of the lands 46, 46. The land 46a is formed wider than the land width n of the lands 46, 46.
[0048]
Therefore, for example, when the external leads 36, 36... And the lands 46, 46... Are aligned using a jig and the cream solder 85 is automatically applied by the dispenser, the cream solder 85 applied by the dispenser is applied. As shown in the figure, the amount of the land 46a, 46b on both ends is wider than the land width of the land 46, 46 ... on the center side. Therefore, when heat is applied and soldered, the soldering conditions are unified and the solder is fixed.
[0049]
As described above, when the soldering operation is performed in an automatic process by appropriately setting the land width of the lands formed on the peripheral circuit board so that the soldering conditions are substantially unified, the edge of the peripheral circuit board is obtained. The soldering conditions are unified between the part side and the center part side, and soldering can be performed under appropriate soldering conditions. As a result, the soldering strength between the external lead and the land increases and stabilizes, so that the reliability of connection fixing by soldering is greatly improved.
[0050]
Note that, when soldering a heat-sensitive material such as a solid-state imaging device, laser soldering capable of heating the solder by locally irradiating laser light is desirable instead of using a thermal probe.
[0051]
[Appendix]
1. A solid-state imaging device disposed at an imaging position of an objective lens, a peripheral circuit substrate connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device, and the solid-state imaging device or the peripheral circuit substrate. In an imaging apparatus having a camera control unit to be controlled, and a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state imaging device or the peripheral circuit board, in an optical axis direction of the objective lens The peripheral circuit board is arranged in parallel to the peripheral circuit board, and a bundle end portion of the signal lines formed when the plurality of signal lines of the signal cable are collectively arranged on the peripheral circuit board surface. An imaging device.
[0052]
2. A solid-state image sensor disposed at an imaging position of the objective lens at right angles to the optical axis of the objective lens, and a peripheral circuit board connected to the solid-state image sensor and driving or signal processing of the solid-state image sensor And a camera control unit that controls the solid-state image sensor or the peripheral circuit board, and a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state image sensor or the peripheral circuit board. In the apparatus, the signal line formed when the peripheral circuit board is disposed in parallel to the optical axis direction of the objective lens and the signal cables of the signal cable are grouped on the peripheral circuit board surface. An image pickup apparatus for arranging the bundle end portion.
[0053]
3. A solid-state imaging device disposed at an imaging position of an objective lens, a peripheral circuit substrate connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device, and the solid-state imaging device or the peripheral circuit substrate. In an image pickup apparatus having a camera control unit to be controlled and a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state image pickup device or the peripheral circuit board, a notch in the peripheral circuit board A plurality of signal lines of a signal cable arranged on one plane of the peripheral circuit board arranged parallel to the optical axis direction of the objective lens, and a notch portion formed on the peripheral circuit board An imaging apparatus having an imaging unit for wiring to the other plane of the substrate.
[0054]
4). An imaging apparatus comprising: a solid-state imaging device disposed at an imaging position of an objective lens; and a peripheral circuit board connected to the solid-state imaging device and performing driving or signal processing of the solid-state imaging device. Out of a plurality of lands provided on the peripheral circuit board to which the external leads extending from the land are soldered, the land width of the lands located on both ends is larger than the land width of the lands located on the central part side of the peripheral circuit board Wide imaging device.
[0055]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an imaging apparatus that can shorten the rigid length of an imaging unit that includes an objective lens, a solid-state imaging device, and the like .
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus.
FIG. 2 is a cross-sectional view illustrating a schematic configuration of an imaging unit.
3 is a diagram for explaining a wiring state to the peripheral circuit board shown in FIG. 2; FIG.
FIG. 4 is an explanatory diagram showing the structure of a land and the state of solder application to the land.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Imaging unit 7 ... Signal line 20 ... Objective lens group (objective lens)
30 ... Imaging unit (solid-state imaging device)
31 ... Image sensor chip 40 ... Peripheral circuit board 46 ... Land 47 on the surface side ... Notch 71 ... Signal line 73 ... Bundle end

Claims (5)

A solid-state imaging device disposed at the imaging position of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor;
The camera control unit for controlling the solid-state image sensor or the peripheral circuit board is electrically connected to the solid-state image sensor or the peripheral circuit board, and a plurality of signal lines are bundled to one surface of the peripheral circuit board . A fixed signal cable,
A notch provided in the peripheral circuit board and guiding the signal line from one side of the peripheral circuit board to the other side;
An imaging device comprising:   The signal line extends in the distal direction on one surface side of the peripheral circuit board and is guided in the proximal direction through the notch and connected to the other surface side of the peripheral circuit board. The imaging apparatus according to claim 1. A solid-state imaging device disposed at the imaging position of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor;
A plurality of signal lines constituting a signal cable fixed at a predetermined position with respect to the peripheral circuit board ;
A plurality of contact portions provided on a predetermined surface of the peripheral circuit board for connecting the signal lines;
A notch portion that is provided on the peripheral circuit board and that guides the signal line connected to the contact portion to the back side with respect to the surface having the contact portion;
A bundling member bundling the tip side from Rutotomoni induced on the back side of the peripheral circuit board, the signal line is the signal cable is fixed positions,
An imaging device comprising: Extending in the distal direction with respect to the binding member, guided to the surface side of the peripheral circuit board with the contact portion through the notch, and provided on the proximal side with respect to the notch The imaging apparatus according to claim 3, further comprising at least one signal line connected to the contact portion formed. A solid-state imaging device disposed at the imaging position of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor;
A plurality of signal lines constituting a signal cable fixed at a predetermined position with respect to the peripheral circuit board ;
The signal cable of the peripheral circuit board is arranged on the solid to surface Rutotomoni includes electrical conductivity, a metal binding member for bundling the signal lines at the tip end side than the position where the signal cable is fixed ,
A plurality of contact portions provided on a surface opposite to the surface on which the binding member is disposed;
A jumper wire connected to the contact part, connected to the signal wire bundled by the binding member or the binding member;
A notch portion that is provided on the peripheral circuit board and guides the jumper wire from a surface on which the binding member is disposed to a surface having the contact portion;
An imaging apparatus comprising:

Images