JP4445604B2 - Solid-state imaging device and method for manufacturing solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a small solid-state imaging device provided in an electronic endoscope or the like.And a method for manufacturing a solid-state imaging device.
[0002]
[Prior art]
Conventionally, by inserting a long and thin insertion portion into a body cavity, the inside of a body cavity can be observed, and various medical treatments can be performed using a treatment instrument inserted into a treatment instrument channel as necessary. Endoscopes are widely used. Also in the industrial field, industrial endoscopes that can observe and inspect internal scratches and corrosion of boilers, turbines, engines, chemical plants, and the like are widely used.
[0003]
As the endoscope, for example, a solid-state imaging device provided with a solid-state imaging device such as a charge-coupled device (abbreviated as CCD) or an electronic component at the distal end of the insertion portion is built-in, and a signal obtained by photoelectric conversion with this solid-state imaging device An electronic endoscope that transmits a signal cable and displays a color on a monitor device through a signal processing means is used.
[0004]
In an endoscope, since it is inserted into a narrow and winding lumen, it is desired to reduce the diameter of the insertion portion. In the electronic endoscope, a small turn and a small diameter of the solid-state imaging device have been desired in order to realize an endoscope having a small turn and good operability.
[0005]
For example, as a solid-state imaging device disposed at the distal end portion of an electronic endoscope, Japanese Patent Laid-Open No. 5-115436 discloses a flexible substrate without increasing the external size in order to achieve high density or miniaturization. A solid-state imaging device capable of expanding the mounting area is shown.
[0006]
[Problems to be solved by the invention]
However, in the solid-state imaging device disclosed in Japanese Patent Application Laid-Open No. 5-115436, a protruding member disposed on a pad portion formed on one side of the light-receiving surface, with a transparent member bonded to the light-receiving surface of the solid-state image sensor. The inner lead of the flexible substrate is connected via the transparent member, and the peripheral portion of the transparent member and the connecting portion of the solid-state imaging device and the inner lead of the flexible substrate are sealed with a sealing resin. For this reason, the range of the sealing fixing portion formed by the sealing resin that covers the connecting portion between the solid-state imaging element and the inner lead of the flexible substrate and the bent portion of the inner lead is widened. Miniaturization was hindered.
[0007]
  The present invention has been made in view of the above circumstances.,Solid-state imaging device with a compact overall structureAnd method for manufacturing the solid-state imaging deviceThe purpose is to provide.
[0008]
[Means for Solving the Problems]
  Of the present inventionAccording to one aspectThe solid-state imaging device has a solid-state imaging device provided with an electrical contact part for transmitting and receiving an electrical signal, and a strip-shaped flexible circuit board in which a foil-like lead connected to the electrical contact part is projected, A solid-state imaging device configured by sealing an electrical connection portion between the lead and the electrical contact portion with a sealing resin,
  A notch is provided for forming a width dimension of at least the lead side of the flexible circuit board smaller than a width dimension of the solid-state imaging device and a base side width dimension of the flexible circuit board.
  According to this configuration, when the electrical connection portion or the like is covered with the sealing resin, the range of the sealing resin provided on the lead side of the flexible circuit board is narrowed. Thereby, the size of the sealing fixing portion formed of the sealing resin is reduced.
[0009]
  According to another aspect of the present invention, a solid-state imaging device includes a solid-state imaging device having an electrical contact portion for transmitting and receiving an electrical signal, and a strip-like flexible body projecting a foil-like lead connected to the electrical contact portion. In a solid-state imaging device configured by sealing a circuit board and an electrical connection portion between the lead and the electrical contact portion with a sealing resin, a substrate on which a lead protruding from the end surface of the flexible circuit board is formed The end face is formed by dropping inward from the peripheral part.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram for explaining one configuration example of a solid-state imaging device according to the first embodiment of the present invention. 1A is a diagram when the solid-state imaging device is viewed from the front, FIG. 1B is a diagram when the solid-state imaging device is viewed from the side, and FIG. 1C is a diagram when the solid-state imaging device is viewed from below. FIG.
[0011]
As shown in FIGS. 1A, 1B, and 1C, the solid-state imaging device 1 of this embodiment includes a light receiving unit 2a on the front surface, and is arranged at a predetermined interval on the lower side of the light receiving unit 2a in the drawing. A solid-state imaging device 2 in which a protruding electrode 2b formed of Au or the like as an electrical contact portion is disposed on the bonded bonding pad, and a transparent adhesive such as an ultraviolet curing type so as to cover the light-receiving portion 2a of the solid-state imaging device 2 A flexible circuit board (hereinafter also abbreviated as FPC) in which a cover glass 3 having a substantially rectangular parallelepiped shape, which is an optical member attached by an agent, and a foil-like connection lead 4a connected to the protruding electrode 2b are protruded from the end. 4 and a sealing fixing portion 6 formed of a sealing resin 5 applied so as to cover an electrical connection portion between the protruding electrode 2b and the connection lead 4a.
[0012]
The FPC 4 is obtained by bonding a metal foil 4c such as a copper foil on a carrier tape base material 4b made of electrically insulating polyimide, and forming the metal foil 4c into a desired lead pattern by a photolithography technique. Connecting leads 4a, lands (not shown), and test pads (not shown) for inspecting the solid-state imaging device are formed. It should be noted that an overcoat for preventing a short circuit is applied to portions other than leads and lands to which electronic components and signal lines to be mounted on the FPC 4 are connected.
[0013]
The connection leads 4a protruding from the front end of the FPC 4 have substantially the same pitch as the protruding electrodes 2b arranged in a row on the solid-state imaging device 2, and the connecting leads 4a are connected to the protruding electrodes 2b by TAB connection. Is electrically connected to the solid-state imaging device 2.
[0014]
The FPC 4 in which the connection lead 4a is connected to the protruding electrode 2b is provided with a bent portion in the connection lead 4a and extends rearward from the base end surface of the solid-state imaging device 2. The front end portion having the carrier tape base material 4b of the FPC 4 extending to the rear side of the solid-state image pickup device 2 has the front-end portion width dimension B, the base end side width size C of the FPC 4 and the solid-state image pickup device 2. A notch portion (hereinafter referred to as a notch portion) 7 that is narrower than the width dimension A is provided.
[0015]
For the purpose of holding and fixing the bent portion of the FPC 4 in a bent state and the purpose of insulating and fixing the electric connection portion between the protruding electrode 2b and the connection lead 4a, the electric connection portion and the bent portion are included. Thus, for example, a black epoxy-based adhesive is applied as the sealing resin 5 from the lower surface of the cover glass 3 to the front end of the FPC 4 provided with the carrier tape base material 4b so that the sealing fixing portion 6 Is formed.
[0016]
When this sealing resin 5 is applied from the lower surface of the cover glass 3 to the tip of the FPC 4, the width dimension of the tip of the FPC 4 from which the connection lead 4a connected to the protruding electrode 2b of the solid-state imaging device 2 protrudes ( (B dimension) is formed smaller than the base end side width dimension (C dimension) of the FPC 4 and the width dimension (A dimension) of the solid-state imaging device 2, so that the application range of the sealing resin 5 applied to this portion is Even if the width is narrow, the FPC 4 can be securely fixed to the solid-state imaging device 2. Therefore, by forming a curved surface portion having a large radius R as shown by a solid line at the corner portion of the sealing fixing portion 6 formed at this time, a broken line is formed at the distal end portion of the wide FPC 4 where the notch portion 7 is not provided. Compared to the sealing and fixing portion provided with the curved surface portion having a small radius r as shown in FIG.
[0017]
As described above, by providing the notch portion that makes the width dimension of the front end portion of the FPC from which the inner lead protrudes smaller than the width dimension of the base end side of the FPC and the width dimension of the solid-state imaging device, When the sealing resin is applied from the lower surface of the cover glass including the bent portion to the front end portion of the FPC to form the sealing fixing portion, the size of the sealing fixing portion is reduced by the amount of the cutout portion and the solid The imaging device can be downsized.
[0018]
In addition, since the bent portion of the lead is firmly fixed by covering the tip portion provided with the carrier tape base material of the FPC with the sealing resin, when a load is applied to the proximal end side of the FPC, It is difficult to apply a load directly to the connecting portion and the inner lead bent portion, and it is possible to provide a solid-state imaging device with little damage and high durability.
[0019]
When the sealing resin 5 is applied from the lower surface of the cover glass 3 to the tip of the FPC 4 so as to include the electrical connection portion and the bent portion, and the sealing fixing portion 6 is provided, the corner portion has a radius R. Instead of forming the curved surface portion, a linear cut surface is formed at the corner portion of the sealing fixing portion 6, or the relief portion 8 as shown in FIG. Can be achieved.
[0020]
Further, in order to form the FPC 4 without bending, as shown in FIGS. 3A and 3B, the FPC 4 is connected so as to extend in parallel to the solid-state image pickup device 2 and is connected to the sealing fixing portion 6. May be provided.
[0021]
FIG. 4 is a diagram for explaining another configuration example of the solid-state imaging device according to the second embodiment of the present invention. 4A is a diagram when the solid-state imaging device is viewed from the front, FIG. 4B is a diagram when the solid-state imaging device is viewed from the side, and FIG. 4C is a diagram when the solid-state imaging device is viewed from below. FIG.
[0022]
In the present embodiment, the front end surface 4d of the front end portion of the FPC 4 from which the connection lead 4a protrudes is not separated from the solid-state image sensor so as to overlap the solid-state image sensor 2 as shown in FIGS. Is arranged.
[0023]
That is, a part of the front end portion on which the carrier tape base material 4b of the FPC 4 is provided is arranged so as to overlap the solid-state image pickup device 2, and in this state, as shown in FIGS. 4 (a), 4 (b), and 4 (c). As shown in the figure, a sealing resin 5 is applied from the base end surface of the cover glass 3 to the base end surface of the solid-state imaging element 2 to provide a sealing fixing portion 6 to constitute the solid-state imaging device 1A. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0024]
In this way, a part of the front end of the carrier tape base material of the FPC is disposed so as to overlap the solid-state image sensor, and in this state, the sealing resin is applied to form the sealing fixing portion, so that the rear of the solid-state image sensor. The overall length of the solid-state imaging device can be shortened by shortening the length dimension of the FPC extending to the side.
[0025]
Further, the front end of the carrier tape base material of the FPC is superposed on the solid-state image sensor, and the front end of the FPC is integrally fixed to the solid-state image sensor with a sealing resin. The range which covers a material with resin becomes large, and the fixing strength of FPC can be improved significantly.
[0026]
As a result, for example, even when a load is applied to the base end side of the FPC 4, the load is not directly applied to the electrical connection portion and the bent portion. A solid-state imaging device is obtained. Other operations and effects are the same as those in the first embodiment.
[0027]
FIG. 5 is a diagram illustrating another configuration example of the solid-state imaging device according to the third embodiment of the present invention.
[0028]
In the present embodiment, as shown in FIG. 5, the FPC 4 </ b> A is provided with metal foils on both the one surface side and the other surface side of the carrier tape substrate 4 b to form leads 11 and leads 12.
[0029]
Electronic components such as an IC 13 and a capacitor 14 are mounted on one side where the lead 11 is provided. The lead 11, the IC 13 and the capacitor 14 are electrically connected to the lead 12 through a through hole or a via hole. It is connected to the. The IC 13 flip-chip mounted on the FPC 4A is sealed and fixed by a sealing resin 15 in an insulating state.
[0030]
In the FPC 4A on which electronic components such as the IC 13 and the capacitor 14 are mounted, the lead 12 protruding from the tip is electrically connected to the solid-state imaging device 2 by TAB connection. And the sealing resin 5 is apply | coated from the base end surface of the cover glass 3 to the base end surface of the solid-state image sensor 2, and the sealing fixing | fixed part 6 which covers an electrical connection part, a bending part, etc. forms, and solid-state imaging device 1B is formed. It is composed. At this time, the sealing fixing portion 6 is provided so that the FPC 4A is inclined by an angle θ. Other configurations are the same as those of the above-described embodiment, and the same reference numerals are given to the same members and the description thereof is omitted.
[0031]
As described above, the FPC that is bent so as to extend to the rear side of the solid-state imaging device is arranged to be inclined by the angle θ, whereby the overall length of the solid-state imaging device can be further shortened. As a result, the space behind the solid-state image sensor can be more effectively used to reduce the size of the solid-state image sensor.
[0032]
In addition, by electrically connecting an FPC pre-mounted with ICs and electronic components to the solid-state image sensor, the solid-state image sensor deteriorates due to heat generated by soldering or reflow when electronic components are mounted on the carrier tape substrate. Can be prevented. As a result, a solid-state imaging device with high durability can be provided.
[0033]
As shown in FIG. 6, the opening 16 is formed in the carrier tape base 4b where the IC 13 is mounted, and the lead 11 is projected as a connection lead into the opening 16 and the TAB is passed through the ball bump 17. The electrical connection part may be sealed with the sealing resin 18 after mounting.
[0034]
Here, with reference to FIGS. 7 and 8, the configuration of the imaging unit 30 in which the solid-state imaging device 1B configured as described above, for example, is actually disposed will be briefly described.
The imaging unit described in the present embodiment is disposed at the distal end portion 22 of the insertion portion 21 of the electronic endoscope 20 constituting the endoscope system shown in FIG.
[0035]
As shown in the figure, the endoscope system includes an electronic endoscope 20, a light source device 91 for supplying illumination light to the electronic endoscope 20, a video processor 92 incorporating a video signal processing circuit and a drive circuit, With a monitor 93 connected to the video processor 92 for displaying an endoscopic image, a VTR deck 94 for recording the endoscopic image, a video printer 95 for printing out the endoscopic image, and a peripheral device such as a video disk 96. It is configured.
[0036]
The electronic endoscope 20 includes an elongated insertion portion 21 to be inserted into a body cavity, an operation portion 25 provided on the proximal end side of the insertion portion 21, and a universal extending from the side portion of the operation portion 25. It is mainly composed of a code 26.
[0037]
The insertion portion 21 includes a distal end portion 22 formed of a hard member located on the distal end side, a bendable bending portion 23 in which a plurality of bending pieces are connected, and an elongated flexible tube portion 24 having flexibility. It is formed with. An illumination connector 97 connected to the light source device 91 is provided at the base end portion of the universal cord 26, and a camera cable 98 detachably attached to the video processor 92 is attached to the illumination connector 97. It can be attached freely.
[0038]
An illumination lens unit and an objective lens unit (not shown) are disposed at the distal end portion 22, and the distal end surface of the light guide fiber that passes through the insertion portion 21 faces the illumination lens unit, and the objective lens unit is exposed to the objective lens unit. The solid-state imaging device 1B is provided with an imaging unit configured as described later.
[0039]
The illumination light emitted from the light source device 91 is transmitted through the light guide fiber and is irradiated toward the observation site through the illumination lens unit. Further, the image signal that has been imaged and photoelectrically converted on the solid-state imaging device 2 of the solid-state imaging device 1 through the objective lens unit is transmitted to the video processor 92 and converted into a video signal. Further, water for cleaning the outer surface of a first lens (not shown) disposed at the forefront of the objective lens unit is fed to the tip portion 22, and the outer surface of the first lens. There is provided a nozzle (not shown) for removing water droplets adhering to the air or supplying air into the body cavity.
[0040]
As shown in FIGS. 8A and 8B, a protective glass 31 is adhered and fixed to the front surface of the cover glass 3 constituting the solid-state imaging device 1B with an adhesive. A solid imaging element frame 33 with an optical aperture 32 interposed is bonded and fixed to the protective glass 31.
[0041]
The lead 12 of the FPC 4A constituting the solid-state imaging device 1B is formed with signal line connection lands (not shown) in two rows in the front and rear, and a plurality of signal cables 40 are formed in each signal line connection land. Signal line 41 is connected.
[0042]
The core portion of the signal line 41 connected to the signal line connection land on the rear side and the vicinity thereof are covered with an insulating tape 46. This prevents a short circuit between the signal line 41 connected to the front signal line connection land and the signal line 41 connected to the rear signal line connection land. Of the signal lines 41, the signal line 41 for driving the solid-state imaging device 1B and the IC 13 is directly connected to an electronic component such as a capacitor.
[0043]
The signal cable 40 is composed of, for example, a coaxial line and a simple line, and the shield line 42 provided on the coaxial line is collectively connected to the GND land 4e of the FPC 4A.
[0044]
Further, the plurality of signal lines 41,..., 41 are bound by a heat-shrinkable binding tube 45 at the outer sheath 43 of the signal cable 40 and the tip of the shield 44. This prevents the signal line 41 from being pulled into the base end side of the signal cable 40 and prevents the image pickup unit from being damaged or causing an image defect. Reference numeral 49 denotes a protective tube for protecting the signal cable 40.
[0045]
In addition, first, second, and third reinforcing resins 51, 52, and 53 are applied so as to cover the solid-state imaging device 1B and the electrical component that is a connection portion of the signal line 41, and the solid-state imaging element frame 33 The image pickup unit 30 is configured by adhering and fixing a reinforcing frame 54 so as to be inscribed in the three outer surfaces, and further covering the reinforcing frame with an insulating tube 55.
[0046]
As shown in FIG. 9, when there is no hindrance to the downsizing of the imaging unit 30, the sealing resin 5 is applied from the lower surface of the cover glass 3 to the tip of the FPC 4 provided with the carrier tape base 4b. In addition to covering the electrical connection portion and the bent portion, the sealing resin 5 is applied to the entire periphery of the side portion of the solid-state image pickup device 2 and the cover glass 3 bonded on the solid-state image pickup device 2 to thereby obtain a solid-state image pickup. It is possible to prevent intrusion of dust, heat, moisture, and the like into the element 2 and the light receiving portion 2a of the solid-state imaging element 2. This provides a solid-state imaging device that is less likely to cause image defects and has excellent durability.
[0047]
By the way, JP-A-8-306898 discloses a solid-state imaging device constituted by attaching a solid-state imaging device and an optical glass to a tape carrier substrate and then cutting and excising the tape carrier substrate at a predetermined position. It is shown. Japanese Patent Application Laid-Open No. 5-115436 discloses a technique for connecting electronic components and lead wires on a tape carrier base material.
[0048]
However, when a solid-state image pickup device obtained by cutting and excising a carrier tape base material disclosed in JP-A-8-306898 in a predetermined position is incorporated in an image pickup unit, there is a reinforcement around the solid-state image pickup device, for example. Members are arranged, and electronic components and signal lines are connected. Further, in this solid-state imaging device, a test terminal to which a probe of an inspection device or the like is connected is provided at the base end portion of the carrier tape base that extends to the opposite side of the solid-state imaging device. This carrier tape base material had substantially the same width as the solid-state imaging device width, and the leads were arranged in one direction on the base material. For this reason, by making the position where the carrier tape base material is cut into an area where no lead exists, the lead was not exposed or projected on the cut end face, but the lead was extended only in one direction. The width dimension of the carrier tape base material has become wider than necessary, thus preventing the solid-state imaging device from being miniaturized.
[0049]
On the other hand, when the flexible substrate on which the electronic component is mounted is bent as shown in the Japanese Patent Laid-Open No. 5-115436, the lead exposed at the end of the flexible substrate contacts the solid-state image sensor, There is a risk of contact with reinforcing members, electronic components, or signal lines arranged around the device.
[0050]
For this reason, the FPC that reliably prevents the leads provided at the end of the substrate from being in electrical contact with the surrounding members and enables the miniaturization can be provided, and the small size can be prevented from causing image defects. A solid-state imaging device has been desired.
[0051]
10 and 11 relate to a configuration example of an FPC, FIG. 10 is an explanatory diagram showing the configuration of leads, lands, and test terminals formed on the carrier tape base material of the FPC, and FIG. 11 is an FPC cut into a predetermined shape. It is a figure which shows the state which has arrange | positioned in an imaging unit.
[0052]
As shown in FIG. 10, a plurality of leads 101 formed on the carrier tape base material 4 b of the FPC 4 </ b> B constituting the solid-state imaging device 100 of the present embodiment protrude from the tip end surface 4 d connected to the solid-state image sensor 2. Connection leads 4a and a plurality of connection land portions 102 formed in, for example, a rectangular shape, to which contact portions of signal lines and electronic components are connected, and further, one direction from each connection land portion 102 to the base end portion. The extension leads 104 are led out toward the test terminals 103,.
[0053]
Further, the carrier tape base material 4b constituting the FPC 4B is formed with a cutting guide groove 105 that allows the carrier tape base material 4b to be easily cut after the inspection is completed. Is cut as indicated by a broken line to obtain the solid-state imaging device 100 including the FPC 4B having a predetermined shape shown in FIG.
[0054]
That is, in this embodiment, in order to reduce the size of the solid-state imaging device 100, the predetermined shape of the FPC 4B is set in advance, and the lead 101 and the connection land portion 102 are formed so as to correspond to this shape, The extension leads 104 led to the test terminals 103 arranged in the one direction are arranged so as to pass through a portion corresponding to the base end surface and a portion corresponding to the side surface when the carrier tape substrate 4b is cut into a desired shape. .
[0055]
And the opening 107 which has the one surface part 106 inside the carrier tape base-material cutting | disconnection end surface shown by the broken line is provided in the part in which the extension lead 104 extended from the part which hits the said side surface is arrange | positioned.
[0056]
For this reason, when the carrier tape substrate 4b of the solid-state imaging device 100 is cut along the broken line and the cutting guide groove 105 to form the FPC 4B having a predetermined shape, the protruding lead 108 protruding from the substrate cutting surface is formed. The Then, the protruding leads 108 are cut and cut along the one surface portion 106 located inside the base material cutting surface of the opening 107. As a result, the end of the extension lead 104 formed on the carrier tape base 4b does not protrude from the end face of the carrier tape base, that is, the carrier tape base is cut without the extension lead 104 formed. Located inside the end face.
[0057]
The solid-state imaging device 100 configured as described above is arranged in an imaging unit 110 provided with a metal reinforcing frame 109 as shown in FIG. At this time, even if the carrier tape base material cutting end surface is arranged so as to be inscribed in the reinforcing frame 109, the base end portion of the extension lead 104 extended to the test terminal 103 side is cut by the carrier tape base material. Since it is located in the one surface part 106 formed in the position recessed from the end surface, it does not contact the reinforcement frame 109 electrically.
[0058]
Thus, by cutting the carrier tape base material constituting the FPC into a predetermined shape, the lead is not exposed or protruded from the end surface of the carrier tape base material. It is possible to prevent electrical contact.
[0059]
As a result, it is possible to provide an imaging unit that is reduced in size and hardly causes image defects by arranging the carrier tape base material constituting the solid-state imaging device in contact with the reinforcing frame.
[0060]
By the way, Japanese Patent Application Laid-Open No. 5-115435 discloses a technique for mounting an electronic component on an FPC extended to the rear side of a solid-state imaging device. However, in this technique, an insulating plate is provided in order to prevent electrical contact between the solid-state imaging device and the lead formed on the FPC. Therefore, there is a problem that the solid-state imaging device becomes larger by the insulating plate.
[0061]
In order to reduce the size of the solid-state imaging device, there is a type in which leads are wired on both sides of the FPC and electronic parts are mounted on both sides. However, forming leads on both sides of the circuit board increases the thickness of the FPC and increases the size of the solid-state imaging device. Since the connection lands for mounting the electronic components are formed on the FPC, it is necessary to provide through holes or the like to electrically connect the leads formed on both sides. Accordingly, there is a problem that the FPC becomes expensive.
For this reason, there has been a demand for an inexpensive solid-state imaging device that is small in size and hardly causes image defects.
[0062]
12 and 13 relate to another configuration of the solid-state imaging device, FIG. 12 is a diagram illustrating a configuration example in which two FPCs are arranged in the solid-state imaging device, and FIG. 13 is a diagram illustrating another configuration example of the imaging unit. is there. 12A is a diagram illustrating the arrangement configuration of two FPCs, FIG. 12B is a diagram illustrating the configuration of the first FPC, and FIG. 12C is a diagram illustrating the configuration of the second FPC.
[0063]
As shown in FIG. 12A, the solid-state imaging device 120 of the present embodiment includes a solid-state imaging device 2, a cover glass 3 that covers the light-receiving unit 2 a formed on the front surface of the solid-state imaging device 2, and the light-receiving unit. The first FPC 121 and the second FPC 122 connected to bonding pads (not shown) formed in a row on the upper and lower sides of 2a, the connecting portion of the solid-state imaging device 2 and the FPCs 121 and 122 from the upper and lower side surfaces of the cover glass 3, and the FPCs 121 and 122 It is comprised with the sealing resin 123 which covers a front-end | tip part.
[0064]
In the first FPC 121 and the second FPC 122, a metal foil 4c such as a copper foil is bonded to one surface side of the carrier tape substrate 4b, and a desired lead pattern is formed by a photolithography technique, so that a large number of leads 124 and lands 125, 126 are formed. And a test terminal (not shown) for inspecting the solid-state imaging device.
[0065]
As shown in FIG. 12B, the lead 124 formed on the first FPC 121 corresponds to the connection electrode of the electronic component to be mounted, and the carrier tape substrate 4b constituting the first FPC 121 has the electronic A substantially rectangular opening 127 is formed to allow the connection electrode of the component to be in electrical contact with the lead 124 from the other side. The lead 124 extending from the base end side of the opening 127 is used as a signal line connection land 125 for connecting a signal line.
[0066]
On the other hand, as shown in FIG. 12C, a plurality of signal line connection lands 126 to which signal lines are connected are formed in the second FPC 122 in the longitudinal direction of the one surface side of the carrier tape substrate 4b.
[0067]
As shown in FIG. 13, a protective glass 128 is bonded to the cover glass 3 of the solid-state imaging device 120 and is bonded and fixed to the solid-state imaging element frame 130 together with the optical aperture 129. A first reinforcing resin 131 is applied from the protective glass 128 to the front ends of the first FPC 121 and the second FPC 122.
[0068]
An electronic component 132 is electrically joined by solder or the like to the lead 124 exposed from the other surface side through the opening 127 of the first FPC 121.
[0069]
In the present embodiment, the electronic component 132 is mounted on a ceramic or glass epoxy circuit board 134 on which the IC 133 is mounted in advance.
[0070]
A plurality of signal lines 135 are connected to the signal line connection land 125 of the first FPC 121, and the signal line 135 is also connected to the signal line connection land 126 of the second FPC 122. The solid-state imaging device 120 to which the signal lines 135 and the circuit board 134 are connected is covered with second and third reinforcing resins 136 and 137, and the periphery thereof is covered with an insulating tube 138.
[0071]
As described above, the lead 124 formed on one surface (front surface) of the carrier tape base material 4b constituting the first FPC 121 is also exposed from the other surface (back surface) by the opening 127 provided on the carrier tape base material 4b. Configured. For this reason, the electronic component 132 can be mounted on the lead 124 formed on one side of the carrier tape base 4b from the other side where the lead 124 is not formed.
[0072]
In addition, a mounting operation can be performed on the electronic component mounted from the other side using a soldering iron or the like from the one side.
[0073]
As shown in FIG. 12B, the lead 124a wired at a position not corresponding to the connection electrode of the electronic component is covered with the carrier tape substrate 4b. That is, by minimizing the opening area of the opening, it is possible to wire the lead on the carrier tape base material in which no opening is formed.
[0074]
As described above, the lead formed on the one surface side of the carrier tape base material constituting the flexible circuit board can be electrically contacted from the other surface side of the carrier tape base material, that is, from the other surface side. By forming the opening in the carrier tape base so as to expose the leads, it is possible to directly mount electronic components and circuit boards on the leads formed on the one side from the other side of the carrier tape base.
[0075]
This eliminates the need to form leads on the other side of the carrier tape base material, so that the flexible circuit board can be formed thin. Therefore, the size of the solid-state imaging device can be reduced. Further, since a through hole for connecting the lead on the one surface side and the lead on the other surface side and the connecting land provided on the other surface side are unnecessary, an inexpensive flexible circuit board is provided to provide a solid-state imaging device. Lower prices can be achieved.
[0076]
In addition, since the mounting work can be performed on the electronic component mounted on the other surface side of the carrier tape substrate using a soldering iron or the like from the one surface side, the assembly workability can be greatly improved.
[0077]
Furthermore, by minimizing the area of the opening, leads can be efficiently wired on the carrier tape substrate other than the opening. This makes it possible to increase the density of the lead wiring and reduce the size of the flexible circuit board.
In addition, it can prevent that the said word short-circuits with the connection electrode of another lead or an electronic component by covering the lead wired by opening with a carrier tape base material.
[0078]
In addition, by disposing the carrier tape base material formed of the insulating member between the solid-state imaging device and the lead, the carrier tape base material becomes an insulating material, so that a new space between the lead and the solid-state imaging device is obtained. Therefore, it is not necessary to provide an insulating member on the solid-state imaging device, and the solid-state imaging device can be reduced in size and image defects can be prevented.
[0079]
By the way, the imaging unit needs to be disassembled and repaired when it fails or is damaged. Most of the failure causes of the imaging unit are signal line breaks, and the solid-state imaging device itself is rarely the main cause of failure.
[0080]
In other words, when disassembling and repairing the imaging unit, parts other than the solid-state imaging device must be replaced. At that time, it is necessary to take out the solid-state imaging device so as not to damage it. It is necessary to work so that
[0081]
For this reason, there has been a demand for a solid-state imaging device that can be worked without damaging the leads of the FPC at the time of disassembly and repair work and that can be downsized.
[0082]
14 to 16 relate to another configuration of the solid-state imaging device, FIG. 14 is a diagram illustrating another configuration example in which two FPCs are arranged in the solid-state imaging device, and FIG. 15 is another configuration example of the solid-state imaging device. FIG. 16 is a diagram illustrating another configuration example of the imaging unit. 14A is a top view, FIG. 14B is a side view, FIG. 15A is a side view, and FIG. 15B is a rear view.
[0083]
As shown in FIGS. 14A and 14B, the solid-state imaging device 140 includes a pair of FPCs 141, and the FPC 141 has an opening 143 that exposes the entire lead 142 from the other surface side.
[0084]
Then, as shown in FIGS. 15A and 15B, the lead 142 of the FPC 141 constituting the solid-state imaging device 140 is cut at the base end side of the opening 143. For this reason, the plurality of leads 142 protrudes one by one. Further, a sealing resin 123 is applied to the front end portion of the FPC 141 and the solid-state imaging device 2, and thereafter, the connection substrate 145 is bonded to the back surface side of the solid-state imaging device 2 by, for example, a silicon-based bonding resin 144.
[0085]
At this time, the leads 142 projecting one by one are joined and fixed by solder in the groove-shaped end surface through-hole 146 formed on the side surface of the connection substrate 145.
[0086]
In addition, a through hole 147 electrically connected to the end face through hole 146 is formed in the connection substrate 145, and a lead pin 148 is disposed in the through hole 147 in advance, and has a melting temperature higher than that of the solder. Joined and fixed by brazing using brazing material.
[0087]
As shown in FIG. 16, each of the lead pins 148 is mounted with an electronic component 151 and an IC 152, and connected to a circuit board 150 or a signal line 154 to which a signal line 153 is connected, and the solid-state imaging device 140, A sealing resin 155 is filled in the reinforcing frame 156 so as to cover the connection board 145 and the circuit board 150, and is covered with an insulating tube 157 to constitute an imaging unit 158.
[0088]
When disassembling and repairing the imaging unit 158 configured as described above, first, the insulating tube 157 and the reinforcing frame 156 are removed. Next, the sealing resin 155 is removed using a blade or a jig. At this time, even if the operator mistakenly adjusts the force, the lead 142 is fixed by soldering in the end surface through hole 146 of the connection board 145, so that the tip of the jig is in direct contact with the lead 142. It is prevented from being damaged.
[0089]
The lead 142 can be easily removed from the connection substrate 145 by removing the sealing resin 155 and then melting the solder in the end face through hole 146. And since the solid-state imaging device 140 and the connection board | substrate 145 are joined by the silicon-type joining resin 144, each can be peeled easily.
[0090]
FIG. 17 is a diagram illustrating still another configuration example of downsizing of the solid-state imaging device with reference to FIGS. 17 to 19, FIG. 17 is a diagram illustrating a configuration example for each imaging unit, and FIG. 18 is a diagram illustrating the solid-state imaging device. 19 and 19 are diagrams for explaining the circuit board unit. 18A is a side view, FIG. 18B is a top view, FIG. 19A is a top view, and FIG. 19B is a side view.
As shown in FIG. 17, the imaging unit 160 of the present embodiment is configured to connect the circuit board unit 170 to the solid-state imaging device 161.
[0091]
As shown in FIGS. 18A and 18B, the solid-state imaging device 161 includes a solid-state imaging device 2 to which a cover glass 3 is bonded, an FPC 163 in which a plurality of leads 162 are arranged connected to the solid-state imaging device 2, It is mainly composed of a sealing resin 166, and an opening 165 is provided in the middle of the carrier tape base material 164 on which the lead 162 is formed so that the lead 162 is exposed from the other end side. .
[0092]
On the other hand, as shown in FIGS. 19A and 19B, the circuit board unit 170 includes a first circuit board 171 on which electronic components such as a capacitor 173 are mounted and a second circuit board 172 on which an IC 174 is mounted. Configured.
[0093]
A plurality of lead pins 175 projecting in the same direction when arranged integrally on one end face of the first circuit board 171 and the second circuit board 172 are arranged. A plurality of end surface through holes 176 are formed on the other end surfaces of the first circuit board 171 and the second circuit board 172. A connection pin 177 is arranged in the end surface through hole 176. By connecting and fixing the connection pin 177 to both the circuit boards 171, 172, both the circuit boards 171 and 172 are within the same projected area. It can be arranged.
[0094]
Connection lands 178 connected to the leads 162 arranged in the opening 165 are arranged in a row on the side opposite to the mounting surface of the first circuit board 171, and the lead pins are connected to the base end side of the connection lands 178. 175 is fixed with brazing.
[0095]
Similarly, the lead pin 175 is fixed to the second circuit board 172 with a brace and protrudes. An insulating tape 179 for preventing electrical contact is disposed on the IC 174 mounted on the second circuit board 172.
[0096]
The first and second circuit boards 171 and 172 are arranged such that mounted electronic components face each other, and a bonding resin 181 is provided between the connection pins 177 and the circuit boards 171 and 172. And a reinforcing resin 180 are filled to form an integrated circuit board unit 170.
[0097]
Further, in order to prevent the reinforcing resin 180 from protruding from the connection pin 177, the side surface of the substrate, or the base end side, the reinforcing resin 180 is filled and formed using a mold or the like. Reference numeral 166 denotes a sealing fixing portion.
As shown in FIG. 17, the solid-state imaging device 161 configured as described above is disposed by bonding and fixing a protective glass 181 bonded to the front surface of the solid-state imaging device 161 in the solid-state imaging element frame 182.
[0098]
On the other hand, the solid-state imaging device 161 and the circuit board unit 170 electrically join the lead 162 and the connection land 178 with solder or the like. In addition, the signal line 183 is electrically connected to the lead pin 175 with solder or the like, and then the solid-state imaging device 161 and the circuit board unit 170 are sealed with the first reinforcing resin 184, and then the first insulation. It is covered with a tube 185, further sealed with a second reinforcing resin 186, and covered with a reinforcing frame 187 and a second insulating tube 188.
[0099]
On the other hand, an objective lens unit 190 is arranged at the front end side of the solid-state image sensor frame 182. The first and second objective lenses 191 and 192 of the objective lens unit 190 absorb and cut off a specific wavelength region spectrum such as a YAG laser. It is constituted by a suction cut filter. As a result, the laser beam is absorbed and the thermal energy is increased, so that the space between the first and second objective lenses 191 and 192 is hardly affected by the temperature change of the objective lens unit external environment, thereby preventing the occurrence of condensation. You can do it. As a result, it is possible to provide the imaging unit 160 in which image defects are unlikely to occur.
[0100]
As described above, by arranging the connection pins in the end surface through holes formed in the end surfaces of the first and second circuit boards, both circuit boards can be easily and accurately positioned, so that the assemblability is greatly improved. The circuit board unit can be reduced in size by ensuring that both circuit boards are securely contained within the approximate projection area of one circuit board.
[0101]
Further, when disassembling and repairing the imaging unit, it is necessary to remove the signal line from the lead pin. At this time, the signal lines are fixed to the lead pins by soldering, whereas the lead pins are fixed to the first and second circuit boards by brazing with a brazing material that melts at a higher temperature than the solder. For this reason, when the lead pin is heated to remove the signal line, it is possible to prevent the solder from melting faster than the brazing material and the lead pin from falling off the first and second circuit boards.
[0102]
As a result, when the failure cause of the imaging unit is a disconnection of the signal line, the imaging unit can be regenerated by reconnecting the signal line without removing the reinforcing resin around the solid-state imaging device and the circuit board unit. Since it becomes possible, an imaging unit excellent in repairability can be provided.
[0103]
As shown in FIG. 20, the circuit board unit 170 is configured so that the first and second circuit boards 171 and 172 are connected substantially parallel to the solid-state image pickup device 2 to form a solid-state image pickup device 161A. Also good. At this time, the lead pin 175 is fixed to the back surface of the first circuit board by brazing.
[0104]
In addition, as shown in FIG. 21, electronic components such as a capacitor 173 and an IC 174 are arranged on both surfaces of the circuit board 201, and lead pins 175 are fixed to the side surfaces of the circuit board 201 with brazing to constitute the solid-state imaging device 200. You may do it. At this time, an insulating tape 202 for preventing a short circuit with the capacitor 173 is attached to the back surface of the solid-state imaging device 2.
[0105]
In this way, by mounting electronic components on both sides of a single circuit board to form a solid-state imaging device, the length of the circuit board unit to be connected can be shortened to reduce the size of the imaging unit. it can.
[0106]
Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.
[0107]
[Appendix]
According to the embodiment of the present invention as described above in detail, the following configuration can be obtained.
[0108]
(1) It has a solid-state imaging device provided with an electrical contact for transmitting and receiving an electrical signal, and a strip-shaped flexible circuit board from which a foil-like lead connected to the electrical contact is projected,
In a solid-state imaging device configured by sealing an electrical connection portion between the lead and the electrical contact portion with a sealing resin,
A notch for forming at least the lead-side width dimension of the flexible circuit board smaller than the width dimension of the solid-state imaging device and the base-end side width dimension of the flexible circuit board when providing the electrical connection portion A solid-state imaging device, comprising:
[0109]
(2) A solid-state imaging device provided with an electrical contact for transmitting and receiving an electrical signal, a flexible circuit board made of a carrier tape base material on which at least one foil-like lead is formed, and a tip of the flexible circuit board In a solid-state imaging device composed of a lead protruding from the portion and a sealing resin covering the electrical contact portion of the solid-state imaging element,
A solid-state imaging device, wherein a width dimension of a distal end portion of the flexible circuit board is narrower than a width dimension of the solid-state imaging element and a base end side width dimension of the flexible circuit board.
[0110]
(3) The notch portion according to the supplementary note 1 or the supplementary note 2, wherein the notch portion narrows a width dimension of a distal end portion of the flexible circuit board positioned in the vicinity of the solid-state imaging device or a distal end portion disposed so as to overlap the solid-state imaging device. Solid-state imaging device.
[0111]
(4) The solid-state imaging device according to appendix 1 or appendix 2, wherein electronic components are mounted in advance on the flexible circuit board.
[0112]
(5) It has a solid-state imaging device provided with an electrical contact part for performing transmission and reception of an electrical signal, and a strip-shaped flexible circuit board projecting a foil-like lead connected to the electrical contact part,
In a solid-state imaging device configured by sealing an electrical connection portion between the lead and the electrical contact portion with a sealing resin,
When preventing the tip of the lead formed on the flexible circuit board from protruding from the end face of the circuit board,
A solid-state imaging device formed by dropping a substrate end surface on which the lead is formed inward from a peripheral substrate end surface.
[0113]
(6) a solid-state imaging device having an electrical contact part for transmitting and receiving an electrical signal, and a strip-shaped flexible circuit board in which a foil-like lead connected to the electrical contact part is projected;
In a solid-state imaging device configured by sealing an electrical connection portion between the lead and the electrical contact portion with a sealing resin,
When preventing the tip of the lead formed on the flexible circuit board from protruding from the end face of the circuit board,
A solid-state imaging device in which a concave portion whose one surface portion is located on the inner side of the peripheral substrate end surface is formed, and an end surface portion of a lead that prevents the concave portion from projecting from the end surface of the circuit board is disposed on the one surface portion of the concave portion.
[0114]
(7) It has a solid-state imaging device provided with an electrical contact part for sending and receiving electrical signals, and a strip-like flexible circuit board that projects a foil-like lead connected to the electrical contact part,
In a solid-state imaging device configured by sealing an electrical connection portion between the lead and the electrical contact portion with a sealing resin,
The foil-shaped lead is formed on one side of the carrier tape base material constituting the flexible circuit board,
A solid-state imaging device provided with an opening that allows the carrier tape base material to be in electrical contact with the lead from the other side.
[0115]
(8) The solid-state imaging device according to appendix 7, wherein the opening is formed so that a position where the opening is formed coincides with a connection electrode portion formed on an electronic component or circuit board to be mounted.
[0116]
(9) The solid-state imaging device according to appendix 7, wherein a carrier tape base material is disposed between the solid-state imaging element and the foil-shaped lead.
[0117]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a solid-state imaging device in which the sealing fixing portion formed of the sealing resin is made as small as possible to reduce the overall configuration.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a configuration example of a solid-state imaging device according to a first embodiment of the invention.
FIG. 2 is a view showing another configuration example of the sealing fixing portion.
FIG. 3 is a diagram illustrating another example of connection between a solid-state imaging device and an FPC;
FIG. 4 is a diagram illustrating another configuration example of the solid-state imaging device according to the second embodiment of the present invention.
FIG. 5 is a diagram illustrating another configuration example of the solid-state imaging device according to the third embodiment of the present invention.
FIG. 6 is a diagram showing a mounting example of an IC and leads formed on a carrier tape base material.
FIG. 7 is a diagram illustrating the configuration of an endoscope system
FIG. 8 is a diagram illustrating a configuration example of an imaging unit
FIG. 9 is a diagram for explaining another configuration example of the solid-state imaging device.
10 and FIG. 11 relate to a configuration example of an FPC, and FIG. 10 is an explanatory diagram showing a configuration of leads, lands, and test terminals formed on a carrier tape base material of the FPC.
FIG. 11 is a diagram illustrating a state in which an FPC cut into a predetermined shape is arranged in an imaging unit.
12 and 13 relate to another configuration of the solid-state imaging device, and FIG. 12 is a diagram illustrating a configuration example in which two FPCs are arranged in the solid-state imaging device.
FIG. 13 is a diagram illustrating another configuration example of the imaging unit.
14 to 16 relate to another configuration of the solid-state imaging device, and FIG. 14 is a diagram for explaining another configuration example in which two FPCs are arranged in the solid-state imaging device.
FIG. 15 is a diagram illustrating still another configuration example of the solid-state imaging device.
FIG. 16 is a diagram illustrating another configuration example of the imaging unit.
17 is a diagram for explaining still another configuration example of downsizing of the solid-state imaging device with reference to FIGS. 17 to 19, and FIG. 17 is a diagram illustrating a configuration example for each imaging unit;
FIG. 18 is a diagram illustrating a solid-state imaging device
FIG. 19 is a diagram illustrating a circuit board unit.
FIG. 20 is a diagram illustrating a configuration example when the positional relationship between the solid-state imaging device and the circuit board unit is different.
FIG. 21 is a diagram illustrating a configuration in which a circuit board unit in which only one circuit board is provided in a solid-state imaging device is provided.
[Explanation of symbols]
1. Solid-state imaging device
2 ... Solid-state imaging device
2b ... Projection electrode
4 ... Flexible circuit board (FPC)
4a ... Connection lead
5 ... Sealing resin
6 ... Sealing fixing part

Claims (5)

A solid-state imaging device having an electrical contact portion for transmitting and receiving an electrical signal, and a connection lead protruding from an end surface of a foil-like lead formed on one surface side of a carrier tape base material, and the electrical contact portion In a solid-state imaging device having a strip-shaped flexible circuit board connected to the sealing resin, and a sealing resin that seals an electrical connection portion between the connection lead and the electrical contact portion,
A solid-state imaging device comprising: an opening provided in the carrier tape base material that enables electrical contact with the lead from the other surface side of the carrier tape base material .   It further has a circuit board on which electronic components are mounted,
  The solid-state imaging device according to claim 1, wherein the lead in the opening provided in the carrier tape base and the connection portion of the circuit board are connected.   The solid-state imaging device according to claim 2, wherein a position of an opening provided in the carrier tape base material coincides with the electronic component mounted on the circuit board or a connection portion of the circuit board.   The end surface of the carrier tape base material on which the lead protruding from the end surface not connected to the electrical contact portion is formed at a position recessed from the peripheral portion, and the connection lead not connected is along the end surface. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is cut out.   A solid-state imaging device having an electrical contact portion for transmitting and receiving an electrical signal, and a connection lead protruding from an end surface of a foil-like lead formed on one surface side of a carrier tape base material, and the electrical contact portion In a manufacturing method of a solid-state imaging device having a strip-shaped flexible circuit board connected to the sealing resin, and a sealing resin that seals an electrical connection portion between the connection lead and the electrical contact portion,
  An inspection apparatus is connected to the test terminal of the flexible circuit board having a test terminal for inspecting the solid-state image sensor formed on a base end side, and the solid-state image sensor is inspected. Inspection process;
  A cutting step of cutting the extended lead at the opening provided in the carrier tape substrate;
  A cutting step of cutting the extended lead protruding from the end face of the opening along the end face.

Images